TWI536485B - 基板處理設備及基板處理方法 - Google Patents

基板處理設備及基板處理方法 Download PDF

Info

Publication number
TWI536485B
TWI536485B TW103139611A TW103139611A TWI536485B TW I536485 B TWI536485 B TW I536485B TW 103139611 A TW103139611 A TW 103139611A TW 103139611 A TW103139611 A TW 103139611A TW I536485 B TWI536485 B TW I536485B
Authority
TW
Taiwan
Prior art keywords
ring
substrate processing
wafer
processing apparatus
mounting tape
Prior art date
Application number
TW103139611A
Other languages
English (en)
Chinese (zh)
Other versions
TW201532170A (zh
Inventor
朴鍾範
Original Assignee
Psk有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psk有限公司 filed Critical Psk有限公司
Publication of TW201532170A publication Critical patent/TW201532170A/zh
Application granted granted Critical
Publication of TWI536485B publication Critical patent/TWI536485B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW103139611A 2014-02-14 2014-11-14 基板處理設備及基板處理方法 TWI536485B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140017377A KR101552663B1 (ko) 2014-02-14 2014-02-14 기판 처리 장치 및 방법

Publications (2)

Publication Number Publication Date
TW201532170A TW201532170A (zh) 2015-08-16
TWI536485B true TWI536485B (zh) 2016-06-01

Family

ID=53851369

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103139611A TWI536485B (zh) 2014-02-14 2014-11-14 基板處理設備及基板處理方法

Country Status (3)

Country Link
KR (1) KR101552663B1 (ko)
CN (1) CN104851824B (ko)
TW (1) TWI536485B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101987576B1 (ko) * 2018-01-24 2019-06-10 주식회사 기가레인 승강하는 유도부와 연동하는 연동부를 포함하는 기판 처리 장치
KR102139934B1 (ko) * 2018-02-21 2020-08-03 피에스케이홀딩스 (주) 기판 처리 장치, 및 이를 이용하는 기판 처리 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5558717A (en) * 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
CN101111121B (zh) * 2007-08-07 2011-07-06 友达光电股份有限公司 蚀刻机台电极结构及其制作方法

Also Published As

Publication number Publication date
CN104851824B (zh) 2018-01-02
KR101552663B1 (ko) 2015-09-11
CN104851824A (zh) 2015-08-19
TW201532170A (zh) 2015-08-16
KR20150096213A (ko) 2015-08-24

Similar Documents

Publication Publication Date Title
KR102003108B1 (ko) 기판 처리 장치
JP5886821B2 (ja) 基板処理装置及び方法
TWI573218B (zh) Reaction chamber and semiconductor processing device
US9401286B2 (en) Plasma processing apparatus
TWI520251B (zh) 處理室
CN106684016B (zh) 层叠装置和制造半导体器件的***
TWI555076B (zh) 基板處理設備及方法
CN111684580B (zh) 用于选择性预清洁的快速响应基座组件
TW201715605A (zh) 用於斜邊聚合物減少的邊緣環
WO2015156968A1 (en) Methods and apparatus for rapidly cooling a substrate
TWI536485B (zh) 基板處理設備及基板處理方法
JP2014220410A (ja) プラズマ処理装置及びプラズマ処理方法
JP6270912B2 (ja) 不活性ガス雰囲気を有したダイボンディング装置
KR102058034B1 (ko) 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛
JP2008066339A (ja) 半導体装置の製造装置
TWI555075B (zh) 基板處理設備及基板處理方法
KR102261974B1 (ko) 기판 처리 방법
TWI545644B (zh) 基板處理設備及方法
JP7045635B2 (ja) プラズマ処理装置及び方法
US20140264954A1 (en) Passivation and warpage correction by nitride film for molded wafers
KR101461060B1 (ko) 기판 처리 장치 및 방법
CN105225908B (zh) 托盘组件和刻蚀设备
KR20160054153A (ko) 레이저 어닐링 장비
KR101431083B1 (ko) 웨이퍼 레벨 패키지용 기판을 처리하는 장치 및 방법
JP2016129200A (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体