TWI534523B - Image-capturing module having a built-in topmost dustproof structure - Google Patents
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本發明係有關於一種影像擷取模組，尤指一種具有內建式最頂端防塵結構的影像擷取模組。 The invention relates to an image capturing module, in particular to an image capturing module with a built-in topmost dustproof structure.
近幾年來，如行動電話、PDA等手持式裝置具有取像模組配備的趨勢已日益普遍，並伴隨著產品市場對手持式裝置功能要求更好及體積更小的市場需求下，取像模組已面臨到更高畫質與小型化的雙重要求。針對取像模組畫質的提昇，一方面是提高畫素，市場的趨勢是由原VGA等級的30畫素，已進步到目前市面上所常見的兩百萬畫素、五百萬畫素、一千參百萬畫素，更甚者已推出更高等級的四千一百萬畫素以上之級別。除了畫素的提昇外，另一方面是關切取像的清晰度，因此手持式裝置的取像模組也由定焦取像功能朝向類似照相機的光學自動對焦功能、甚或是光學變焦功能發展。光學自動對焦功能的作動原理是依照標的物的不同遠、近距離，以適當地移動取像模組中的鏡頭，進而使得取像標的物體的光學影像得以準確地聚焦在影像感測器上，以產生清晰的影像。以目前一般常見到在取像模組中帶動鏡頭移動的致動方式，其包括有步進馬達致動、壓電致動及音圈馬達(Voice Coil Motor，VCM)致動等方式。然而，習知的取像模組並沒有設計出較佳的防塵結構。 In recent years, the trend of handheld devices such as mobile phones and PDAs has become increasingly popular, and with the market demand for better handheld devices and smaller size, The group has faced the dual requirements of higher image quality and miniaturization. In view of the improvement of the image quality of the image capture module, on the one hand, the pixel is improved. The market trend is from the original VGA level of 30 pixels, which has progressed to the current two million pixels and five million pixels commonly available on the market. One thousand is a million pixels, and even more has been introduced to a higher level of more than 41 million pixels. In addition to the improvement of pixels, on the other hand, the resolution of the image is taken care of. Therefore, the image capturing module of the handheld device is also developed by the fixed focus image capturing function toward the camera-like optical autofocus function or even the optical zoom function. The optical autofocus function is operated according to different distances and close distances of the target object to appropriately move the lens in the image capturing module, so that the optical image of the image capturing object can be accurately focused on the image sensor. To produce a clear image. At present, the actuation mode that drives the lens movement in the image capturing module is generally common, including stepping motor actuation, piezoelectric actuation, and voice coil motor (VCM) actuation. However, the conventional image capturing module does not design a better dustproof structure.
本發明實施例在於提供一種具有內建式最頂端防塵結構的影像擷取模組。 The embodiment of the invention provides an image capturing module with a built-in topmost dustproof structure.
本發明其中一實施例所提供的一種具有內建式最頂端防塵結構的影像擷取模組，其包括：一影像感測單元、一框架殼體及一致動器結構。所述影像感測單元包括一承載基板及一設置在所述承載基板上且電性連接於所述承載基板的影像感測晶片。所述框架殼體設置在所述承載基板上且包圍所述影像感測晶片。所述致動器結構設置在所述框架殼體上且位於所述影像感測晶片的上方，其中所述致動器結構包括一設置在所述框架殼體上的鏡頭承載座及一可活動地設置在所述鏡頭承載座內的可移動鏡頭組件。其中，所述鏡頭承載座的內圍繞表面上且最頂端處具有一第一最頂端圍繞狀結構，所述可移動鏡頭組件的外周圍表面上且最頂端處具有一設置在所述第一最頂端圍繞狀結構的上方的第二最頂端圍繞狀結構，所述鏡頭承載座的所述第一最頂端圍繞狀結構與所述可移動鏡頭組件的所述第二最頂端圍繞狀結構相互配合，以構成所述內建式最頂端防塵結構。 An image capturing module having a built-in topmost dustproof structure includes an image sensing unit, a frame housing and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The frame housing is disposed on the carrier substrate and surrounds the image sensing wafer. The actuator structure is disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a lens carrier disposed on the frame housing and an movable A movable lens assembly disposed within the lens holder. Wherein, the inner peripheral surface of the lens carrier has a first topmost surrounding structure at the top end, and the outermost surface of the movable lens assembly has a first and most topmost a second topmost surrounding structure above the top surrounding structure, the first topmost surrounding structure of the lens carrier mating with the second topmost surrounding structure of the movable lens assembly, To constitute the built-in topmost dustproof structure.
本發明的有益效果可以在於，本發明實施例所提供的影像擷取模組，其可透過“所述鏡頭承載座的內圍繞表面上且最頂端處具有一第一最頂端圍繞狀結構，所述可移動鏡頭組件的外周圍表面上且最頂端處具有一設置在所述第一最頂端圍繞狀結構的上方的第二最頂端圍繞狀結構，所述鏡頭承載座的所述第一最頂端圍繞狀結構與所述可移動鏡頭組件的所述第二最頂端圍繞狀結構相互配合”的設計，以構成所述內建式最頂端防塵結構。藉此，當外界的灰塵從所述鏡頭承載座的外殼體與所述可移動鏡頭組件的所述第二圍繞狀延伸部之間的間隙進入由所述第一最頂端圍繞狀結構與所述第二最頂端圍繞狀結構所組成的內建式最頂端防塵結構時，外界的灰塵會受到所述第一圍繞狀阻擋部的阻擋而被收集在所述第一圍繞狀容置空間內，以達到防塵的目的。 The image capturing module provided by the embodiment of the present invention can be permeable to the inner circumferential surface of the lens carrier and has a first topmost surrounding structure at the top end. a second topmost surrounding structure disposed on an outer peripheral surface of the movable lens assembly and at a top end thereof, disposed above the first topmost surrounding structure, the first topmost end of the lens carrier A design in which the surrounding structure and the second topmost surrounding structure of the movable lens assembly cooperate to form the built-in topmost dustproof structure. Thereby, when the external dust enters from the gap between the outer casing of the lens carrier and the second surrounding extension of the movable lens assembly, the first topmost surrounding structure and the When the second topmost surrounding structure is composed of the built-in topmost dustproof structure, external dust is trapped by the first surrounding blocking portion and collected in the first surrounding accommodation space, To achieve the purpose of dust prevention.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
M‧‧‧影像擷取模組 M‧‧‧Image Capture Module
1‧‧‧影像感測單元 1‧‧‧Image sensing unit
10‧‧‧承載基板 10‧‧‧Loading substrate
11‧‧‧影像感測晶片 11‧‧‧Image sensing wafer
111‧‧‧導電焊墊 111‧‧‧Electrical pads
2‧‧‧框架殼體 2‧‧‧Frame housing
200‧‧‧頂端開口 200‧‧‧ top opening
3‧‧‧致動器結構 3‧‧‧Activity structure
30‧‧‧鏡頭承載座 30‧‧‧Lens carrier
3000‧‧‧內圍繞表面 3000‧‧‧ inner surrounding surface
3001‧‧‧最頂端處 3001‧‧‧At the top
300‧‧‧第一最頂端圍繞狀結構 300‧‧‧First topmost surrounding structure
300A‧‧‧第一圍繞狀延伸部 300A‧‧‧First surrounding extension
300B‧‧‧第一圍繞狀阻擋部 300B‧‧‧First surrounding barrier
300C‧‧‧第一圍繞狀容置空間 300C‧‧‧First surrounding space
30M‧‧‧圍繞狀可動件 30M‧‧‧around movable parts
31‧‧‧可移動鏡頭組件 31‧‧‧Removable lens assembly
3100‧‧‧外周圍表面 3100‧‧‧ outer peripheral surface
3101‧‧‧最頂端處 3101‧‧‧At the top
310‧‧‧第二最頂端圍繞狀結構 310‧‧‧Second topmost surrounding structure
310A‧‧‧第二圍繞狀延伸部 310A‧‧‧Second revolving extension
310B‧‧‧第二圍繞狀阻擋部 310B‧‧‧Second surrounding blocking
310C‧‧‧第二圍繞狀容置空間 310C‧‧‧Second surrounding space
4‧‧‧濾光元件 4‧‧‧ Filter elements
W‧‧‧導電線 W‧‧‧Flexible wire
H‧‧‧固定膠體 H‧‧‧Fixed colloid
圖1為本發明第一實施例所揭示具有內建式最頂端防塵結構的影像擷取模組的側視剖面示意圖。 1 is a side cross-sectional view of an image capturing module having a built-in topmost dustproof structure according to a first embodiment of the present invention.
圖2為圖1的A部分的放大示意圖。 Fig. 2 is an enlarged schematic view showing a portion A of Fig. 1.
圖3為本發明第一實施例所揭示具有內建式最頂端防塵結構的影像擷取模組使用另一種致動器結構的側視剖面示意圖。 3 is a side cross-sectional view showing the structure of an image capturing module having a built-in topmost dustproof structure using another actuator according to the first embodiment of the present invention.
圖4為本發明第二實施例所揭示具有內建式最頂端防塵結構的影像擷取模組的側視剖面示意圖。 4 is a side cross-sectional view of an image capturing module having a built-in topmost dustproof structure according to a second embodiment of the present invention.
圖5為圖4的B部分的放大示意圖。 Fig. 5 is an enlarged schematic view showing a portion B of Fig. 4.
以下係藉由特定的具體實例說明本發明所揭露“具有內建式最頂端防塵結構的影像擷取模組”的實施方式，熟悉此技藝之人士可由本說明書所揭示的內容輕易瞭解本發明的其他優點與功效。本發明亦可藉由其他不同的具體實施例加以施行或應用，本說明書中的各項細節亦可基於不同觀點與應用，在不悖離本發明的精神下進行各種修飾與變更。又本發明的圖式僅為簡單說明，並非依實際尺寸描繪，亦即未反應出相關構成的實際尺寸，先予敘明。以下的實施方式係進一步詳細說明本發明的相關技術內容，但並非用以限制本發明的技術範疇。 The following is a specific embodiment to illustrate an embodiment of the "image capturing module having a built-in top-most dustproof structure" disclosed by the present invention. Those skilled in the art can easily understand the present invention by the contents disclosed in the present specification. Other advantages and effects. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. Further, the drawings of the present invention are merely illustrative, and are not depicted in actual dimensions, that is, the actual dimensions of the related structures are not reflected, which will be described first. The following embodiments are intended to further explain the related art of the present invention, but are not intended to limit the technical scope of the present invention.
請參閱圖1及圖2所示，其中圖2為圖1的A部分的放大示意圖。本發明提供一種具有內建式最頂端防塵結構的影像擷取模組M，其包括：一影像感測單元1、一框架殼體2及一致動器結構3。 Please refer to FIG. 1 and FIG. 2 , wherein FIG. 2 is an enlarged schematic view of a portion A of FIG. 1 . The invention provides an image capturing module M having a built-in topmost dustproof structure, comprising: an image sensing unit 1, a frame housing 2 and an actuator structure 3.
首先，如圖1所示，影像感測單元1包括一承載基板10及一 設置在承載基板10上且電性連接於承載基板10的影像感測晶片11。舉例來說，影像感測晶片11可為CMOS影像感測晶片，並且影像感測晶片11可通過黏著膠體(未標號，例如UV黏著膠、熱硬化膠、或爐內硬化膠等等)以設置在承載基板10上。此外，承載基板10可為一上表面具有多個導電焊墊(未標號)的電路基板，影像感測晶片11的上表面具有多個導電焊墊111，並且影像感測晶片11的每一個導電焊墊111可通過一導電線W，以電性連接於承載基板10的導電焊墊，藉此以達成影像感測晶片11及承載基板10之間的電性導通。 First, as shown in FIG. 1 , the image sensing unit 1 includes a carrier substrate 10 and a The image sensing wafer 11 is disposed on the carrier substrate 10 and electrically connected to the carrier substrate 10. For example, the image sensing wafer 11 can be a CMOS image sensing wafer, and the image sensing wafer 11 can be set by an adhesive (not labeled, such as UV adhesive, thermosetting adhesive, or in-furnace hardening glue, etc.). On the carrier substrate 10. In addition, the carrier substrate 10 can be a circuit substrate having a plurality of conductive pads (not labeled) on the upper surface thereof. The upper surface of the image sensing wafer 11 has a plurality of conductive pads 111, and each of the image sensing wafers 11 is electrically conductive. The pad 111 can be electrically connected to the conductive pad of the carrier substrate 10 through a conductive wire W, thereby achieving electrical conduction between the image sensing wafer 11 and the carrier substrate 10.
再者，如圖1所示，框架殼體2設置在承載基板10上且包圍影像感測晶片11，致動器結構3設置在框架殼體2上且位於影像感測晶片11的上方，並且致動器結構3包括一設置在框架殼體2上的鏡頭承載座30(lens holder)及一可活動地設置在鏡頭承載座30內的可移動鏡頭組件31。舉例來說，框架殼體2可通過黏著膠體(例如UV黏著膠、熱硬化膠、或爐內硬化膠等等)以設置在承載基板10上，鏡頭承載座30也是可以通過黏著膠體(例如UV黏著膠、熱硬化膠、或爐內硬化膠等等)以設置在框架殼體2上，並且可移動鏡頭組件31可由多個光學透鏡所組成。另外，值得一提的是，如圖1所示，致動器結構3可為一音圈致動器(voice coil actuator)，但本發明不以此為限(如圖3所示)。 Furthermore, as shown in FIG. 1 , the frame housing 2 is disposed on the carrier substrate 10 and surrounds the image sensing wafer 11 , and the actuator structure 3 is disposed on the frame housing 2 and located above the image sensing wafer 11 , and The actuator structure 3 includes a lens holder 30 disposed on the frame housing 2 and a movable lens assembly 31 movably disposed within the lens holder 30. For example, the frame housing 2 can be disposed on the carrier substrate 10 by an adhesive (for example, a UV adhesive, a thermosetting adhesive, or an in-furnace hardener, etc.), and the lens holder 30 can also be adhered to the lens (for example, UV). An adhesive, a thermosetting glue, or an in-furnace hardening glue or the like is provided to be disposed on the frame housing 2, and the movable lens assembly 31 may be composed of a plurality of optical lenses. In addition, it is worth mentioning that, as shown in FIG. 1, the actuator structure 3 can be a voice coil actuator, but the invention is not limited thereto (as shown in FIG. 3).
更進一步來說，如圖1所示，本發明具有內建式最頂端防塵結構的影像擷取模組M還更進一步包括：一濾光元件4，其中濾光元件4設置在框架殼體2上且位於影像感測晶片11與可移動鏡頭組件31之間。另外，框架殼體2的頂端具有一頂端開口200，並且框架殼體2的頂端開口200被濾光元件4所封閉。 Furthermore, as shown in FIG. 1 , the image capturing module M of the present invention having a built-in topmost dustproof structure further includes: a filter element 4, wherein the filter element 4 is disposed in the frame housing 2 It is located between the image sensing wafer 11 and the movable lens assembly 31. Further, the top end of the frame housing 2 has a top end opening 200, and the top end opening 200 of the frame housing 2 is closed by the filter element 4.
更進一步來說，配合圖1及圖2所示，鏡頭承載座30的內圍繞表面3000上且最頂端處3001具有一第一最頂端圍繞狀結構300，可移動鏡頭組件31的外周圍表面3100上且最頂端處3101 具有一設置在第一最頂端圍繞狀結構300的上方的第二最頂端圍繞狀結構310，並且鏡頭承載座30的第一最頂端圍繞狀結構300與可移動鏡頭組件31的第二最頂端圍繞狀結構310會彼此分離一預定微間距且相互配合，以構成內建式最頂端防塵結構。 Furthermore, as shown in FIG. 1 and FIG. 2, the inner peripheral surface 3000 of the lens carrier 30 and the topmost end 3001 have a first topmost surrounding structure 300, and the outer peripheral surface 3100 of the movable lens assembly 31. Up and top 3101 There is a second topmost surrounding structure 310 disposed above the first topmost surrounding structure 300, and the first topmost surrounding structure 300 of the lens carrier 30 and the second topmost end of the movable lens assembly 31 surround The structures 310 are separated from one another by a predetermined micro-pitch and cooperate to form a built-in topmost dust-proof structure.
舉例來說，如圖2所示，第一最頂端圍繞狀結構300具有一從鏡頭承載座30的內圍繞表面3000且最頂端處3001朝向可移動鏡頭組件31的方向進行水平延伸的第一圍繞狀延伸部300A及一從第一圍繞狀延伸部300A向上垂直延伸的第一圍繞狀阻擋部300B，並且鏡頭承載座30的第一圍繞狀延伸部300A及第一圍繞狀阻擋部300B兩者會依序相連以形成一第一圍繞狀容置空間300C。另外，第二最頂端圍繞狀結構310具有一從可移動鏡頭組件31的外周圍表面3100且最頂端處3101朝向垂直於鏡頭承載座30的內圍繞表面3000的方向進行水平延伸的第二圍繞狀延伸部310A，並且第二圍繞狀延伸部310A鄰近第一圍繞狀阻擋部300B且設置在第一圍繞狀阻擋部300B的上方。此外，鏡頭承載座30的內圍繞表面3000及可移動鏡頭組件31的外周圍表面3100都是“無螺牙表面”或“有螺牙表面”。 For example, as shown in FIG. 2, the first topmost surrounding structure 300 has a first surrounding horizontally extending from the inner surrounding surface 3000 of the lens carrier 30 and the most distal end 3001 toward the movable lens assembly 31. The extending portion 300A and the first surrounding blocking portion 300B extending vertically upward from the first surrounding extending portion 300A, and the first surrounding extending portion 300A and the first surrounding blocking portion 300B of the lens carrier 30 will They are sequentially connected to form a first surrounding accommodation space 300C. In addition, the second topmost surrounding structure 310 has a second surrounding extending horizontally from the outer peripheral surface 3100 of the movable lens assembly 31 and the most distal end 3101 toward the direction perpendicular to the inner surrounding surface 3000 of the lens holder 30. The extension portion 310A, and the second surrounding extension portion 310A is adjacent to the first surrounding shape blocking portion 300B and disposed above the first surrounding shape blocking portion 300B. Further, the inner surrounding surface 3000 of the lens holder 30 and the outer peripheral surface 3100 of the movable lens assembly 31 are both "no screw surfaces" or "threaded surfaces".
更進一步來說，配合圖1及圖2所示，鏡頭承載座30的內部具有一圍繞狀可動件30M。可移動鏡頭組件31只要通過至少2個或3個固定膠體H，即可以固定在圍繞狀可動件30M內，所以可移動鏡頭組件31不需要通過整圈的環繞固定膠體來固定在圍繞狀可動件30M內，以達到節省製作時間與製作成本的目的。另外，由於可移動鏡頭組件31通過固定膠體H以固定在圍繞狀可動件30M內，所以可移動鏡頭組件31就可通過圍繞狀可動件30M，以可活動地設置在鏡頭承載座30內。此外，圍繞狀可動件30M的內圍繞表面3000及可移動鏡頭組件31的外周圍表面3100都是“無螺牙表面”或“有螺牙表面”。再者，第一最頂端圍繞狀結構300具有一從圍繞狀可動件30M的內圍繞表面3000且最頂端處3001 朝向可移動鏡頭組件31的方向進行水平延伸的第一圍繞狀延伸部300A及一從第一圍繞狀延伸部300A向上垂直延伸的第一圍繞狀阻擋部300B，並且圍繞狀可動件30M的第一圍繞狀延伸部300A及第一圍繞狀阻擋部300B兩者依序相連以形成一第一圍繞狀容置空間300C。第二最頂端圍繞狀結構310具有一從可移動鏡頭組件31的外周圍表面3100且最頂端處3101朝向垂直於圍繞狀可動件30M的內圍繞表面3000的方向進行水平延伸的第二圍繞狀延伸部310A，並且第二圍繞狀延伸部310A鄰近第一圍繞狀阻擋部300B且設置在第一圍繞狀阻擋部300B的上方。 Furthermore, as shown in FIG. 1 and FIG. 2, the inside of the lens holder 30 has a surrounding movable member 30M. The movable lens assembly 31 can be fixed in the surrounding movable member 30M by passing at least two or three fixing colloids H, so that the movable lens assembly 31 does not need to be fixed to the surrounding movable member by a full-circle surrounding fixing colloid. Within 30M, to save production time and production costs. In addition, since the movable lens assembly 31 is fixed in the surrounding movable member 30M by the fixing colloid H, the movable lens assembly 31 can be movably disposed in the lens holder 30 by the surrounding movable member 30M. Further, the inner surrounding surface 3000 of the surrounding movable member 30M and the outer peripheral surface 3100 of the movable lens assembly 31 are both "no screw surfaces" or "threaded surfaces". Furthermore, the first topmost surrounding structure 300 has an inner surrounding surface 3000 from the surrounding movable member 30M and the topmost end 3001 a first surrounding extension 300A extending horizontally in a direction toward the movable lens assembly 31 and a first surrounding blocking portion 300B extending vertically upward from the first surrounding extension 300A, and a first surrounding the movable member 30M Both the surrounding extension 300A and the first surrounding barrier 300B are sequentially connected to form a first surrounding accommodation space 300C. The second topmost surrounding structure 310 has a second surrounding extension extending horizontally from the outer peripheral surface 3100 of the movable lens assembly 31 and the most distal end 3101 toward a direction perpendicular to the inner surrounding surface 3000 of the surrounding movable member 30M. The portion 310A, and the second surrounding extension 310A is adjacent to the first surrounding blocking portion 300B and disposed above the first surrounding blocking portion 300B.
藉此，當外界的灰塵從鏡頭承載座30的外殼體(不可動件，未標號)與可移動鏡頭組件31的第二圍繞狀延伸部310A之間的間隙進入由第一最頂端圍繞狀結構300與第二最頂端圍繞狀結構310所組成的內建式最頂端防塵結構時，外界的灰塵會受到第一圍繞狀阻擋部300B的阻擋而被收集在第一圍繞狀容置空間300C內，以達到防塵的目的。 Thereby, when the external dust enters the gap between the outer casing (non-movable member, unlabeled) of the lens mount 30 and the second surrounding extension 310A of the movable lens assembly 31, the first topmost surrounding structure is entered. When the built-in topmost dustproof structure composed of the second topmost surrounding structure 310 is 300, the external dust is collected by the first surrounding blocking portion 300B and collected in the first surrounding accommodation space 300C. To achieve the purpose of dust prevention.
值得一提的是，在以下幾個狀態下，圍繞狀可動件30M可以通過固定膠體H，以固定在圍繞狀可動件30M內。圍繞狀可動件30M可以的狀態包括：(1)圍繞狀可動件30M的底端直接接觸濾光元件4的上表面；(2)圍繞狀可動件30M的底端直接接觸框架殼體2的頂端；(3)第二圍繞狀結構310直接接觸第一圍繞狀結構300。然而，本發明不以上述所舉的例子為限。 It is worth mentioning that in the following states, the surrounding movable member 30M can be fixed in the surrounding movable member 30M by fixing the colloid H. The state in which the surrounding movable member 30M can include: (1) the bottom end of the surrounding movable member 30M directly contacts the upper surface of the filter element 4; (2) the bottom end of the surrounding movable member 30M directly contacts the top end of the frame housing 2 (3) The second surrounding structure 310 directly contacts the first surrounding structure 300. However, the invention is not limited to the examples set forth above.
〔第二實施例〕 [Second embodiment]
請參閱圖4及圖5所示，其中圖5為圖4的B部分的放大示意圖。本發明提供一種具有內建式最頂端防塵結構的影像擷取模組M，其包括：一影像感測單元1、一框架殼體2及一致動器結構3。由圖4與圖1的比較，及圖5與圖2的比較可知，本發明第二實施例與第一實施例最大的差別在於：在第二實施例中，第二最頂端圍繞狀結構310具有一從可移動鏡頭組件31的外周圍表面 3100且最頂端處3101朝向垂直於鏡頭承載座30的內圍繞表面3000的方向進行水平延伸的第二圍繞狀延伸部310A及一從第二圍繞狀延伸部310A向下垂直延伸的第二圍繞狀阻擋部310B，第二圍繞狀延伸部310A鄰近第一圍繞狀阻擋部300B且設置在第一圍繞狀阻擋部300B的上方，並且第一圍繞狀延伸部300A鄰近第二圍繞狀阻擋部310B且設置在第二圍繞狀阻擋部310B的下方。換言之，第二最頂端圍繞狀結構310具有一從可移動鏡頭組件31的外周圍表面3100且最頂端處3101朝向垂直於圍繞狀可動件30M的內圍繞表面3000的方向進行水平延伸的第二圍繞狀延伸部310A及一從第二圍繞狀延伸部310A向下垂直延伸的第二圍繞狀阻擋部310B。 Please refer to FIG. 4 and FIG. 5 , wherein FIG. 5 is an enlarged schematic view of a portion B of FIG. 4 . The invention provides an image capturing module M having a built-in topmost dustproof structure, comprising: an image sensing unit 1, a frame housing 2 and an actuator structure 3. From the comparison of FIG. 4 with FIG. 1 and the comparison between FIG. 5 and FIG. 2, the greatest difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, the second topmost surrounding structure 310 Having an outer peripheral surface from the movable lens assembly 31 3100 and the topmost portion 3101 is a second surrounding extension 310A extending horizontally in a direction perpendicular to the inner surrounding surface 3000 of the lens holder 30 and a second surrounding extending vertically downward from the second surrounding extension 310A The blocking portion 310B, the second surrounding extending portion 310A is adjacent to the first surrounding shaped blocking portion 300B and disposed above the first surrounding shaped blocking portion 300B, and the first surrounding extended portion 300A is adjacent to the second surrounding shaped blocking portion 310B and is disposed Below the second surrounding blocking portion 310B. In other words, the second topmost surrounding structure 310 has a second surrounding extending horizontally from the outer peripheral surface 3100 of the movable lens assembly 31 and at the topmost end 3101 toward the direction perpendicular to the inner surrounding surface 3000 of the surrounding movable member 30M. The extended portion 310A and a second surrounding blocking portion 310B extending vertically downward from the second surrounding extending portion 310A.
更進一步來說，如圖5所示，可移動鏡頭組件31的外周圍表面3100、第二圍繞狀延伸部310A及第二圍繞狀阻擋部310B三者依序相連以形成一第二圍繞狀容置空間310C，第一圍繞狀阻擋部300B的一部分容置於第二圍繞狀容置空間310C內，並且第二圍繞狀阻擋部310B的一部分容置於第一圍繞狀容置空間300C內。藉此，當外界的灰塵從鏡頭承載座30的外殼體(不可動件，未標號)與可移動鏡頭組件31的第二圍繞狀延伸部310A之間的間隙進入由第一最頂端圍繞狀結構300與第二最頂端圍繞狀結構310所組成的內建式最頂端防塵結構時，外界的灰塵會受到第一圍繞狀阻擋部300B及第二圍繞狀阻擋部310B的阻擋而被收集在第一圍繞狀容置空間300C內，以達到防塵的目的。 Furthermore, as shown in FIG. 5, the outer peripheral surface 3100, the second surrounding extension 310A and the second surrounding blocking portion 310B of the movable lens assembly 31 are sequentially connected to form a second surrounding shape. The space 310C, a portion of the first surrounding blocking portion 300B is received in the second surrounding receiving space 310C, and a portion of the second surrounding blocking portion 310B is received in the first surrounding receiving space 300C. Thereby, when the external dust enters the gap between the outer casing (non-movable member, unlabeled) of the lens mount 30 and the second surrounding extension 310A of the movable lens assembly 31, the first topmost surrounding structure is entered. When the built-in topmost dustproof structure composed of the second topmost surrounding structure 310 is 300, the external dust is blocked by the first surrounding blocking portion 300B and the second surrounding blocking portion 310B, and is collected first. The space is accommodated in the surrounding space 300C to achieve the purpose of dust prevention.
值得一提的是，在以下幾個狀態下，圍繞狀可動件30M可以通過固定膠體H，以固定在圍繞狀可動件30M內。圍繞狀可動件30M可以的狀態包括：(1)圍繞狀可動件30M的底端直接接觸濾光元件4的上表面；(2)圍繞狀可動件30M的底端直接接觸框架殼體2的頂端；(3)第二圍繞狀結構310直接接觸第一圍繞狀結構300。然而，本發明不以上述所舉的例子為限。 It is worth mentioning that in the following states, the surrounding movable member 30M can be fixed in the surrounding movable member 30M by fixing the colloid H. The state in which the surrounding movable member 30M can include: (1) the bottom end of the surrounding movable member 30M directly contacts the upper surface of the filter element 4; (2) the bottom end of the surrounding movable member 30M directly contacts the top end of the frame housing 2 (3) The second surrounding structure 310 directly contacts the first surrounding structure 300. However, the invention is not limited to the examples set forth above.
綜上所述，本發明實施例所提供的影像擷取模組M，其可透過“鏡頭承載座30的內圍繞表面3000上且最頂端處3001具有一第一最頂端圍繞狀結構300，可移動鏡頭組件31的外周圍表面3100上且最頂端處3101具有一設置在第一最頂端圍繞狀結構300的上方的第二最頂端圍繞狀結構310，且鏡頭承載座30的第一最頂端圍繞狀結構300與可移動鏡頭組件31的第二最頂端圍繞狀結構310相互配合”的設計，以構成內建式最頂端防塵結構。藉此，當外界的灰塵從鏡頭承載座30的外殼體與可移動鏡頭組件31的第二圍繞狀延伸部310A之間的間隙進入由第一最頂端圍繞狀結構300與第二最頂端圍繞狀結構310所組成的內建式最頂端防塵結構時，外界的灰塵會受到第一圍繞狀阻擋部300B的阻擋而被收集在第一圍繞狀容置空間300C內，以達到防塵的目的。 In summary, the image capturing module M provided by the embodiment of the present invention is permeable to the inner circumferential surface 3000 of the lens carrier 30 and has a first topmost surrounding structure 300 at the top end 3001. The outer peripheral surface 3100 of the moving lens assembly 31 and the topmost end 3101 has a second topmost surrounding structure 310 disposed above the first topmost surrounding structure 300, and the first topmost end of the lens carrier 30 surrounds The structure 300 cooperates with the second topmost surrounding structure 310 of the movable lens assembly 31 to form a built-in topmost dustproof structure. Thereby, when the external dust enters from the gap between the outer casing of the lens mount 30 and the second surrounding extension 310A of the movable lens assembly 31, the first topmost surrounding structure 300 and the second topmost surrounding shape When the built-in topmost dustproof structure of the structure 310 is formed, the external dust is blocked by the first surrounding blocking portion 300B and collected in the first surrounding accommodating space 300C for dustproof purposes.
以上所述僅為本發明的較佳可行實施例，非因此侷限本發明的專利範圍，故舉凡運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的保護範圍內。 The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .
3‧‧‧致動器結構 3‧‧‧Activity structure
30‧‧‧鏡頭承載座 30‧‧‧Lens carrier
3000‧‧‧內圍繞表面 3000‧‧‧ inner surrounding surface
3001‧‧‧最頂端處 3001‧‧‧At the top
300‧‧‧第一最頂端圍繞狀結構 300‧‧‧First topmost surrounding structure
300A‧‧‧第一圍繞狀延伸部 300A‧‧‧First surrounding extension
300B‧‧‧第一圍繞狀阻擋部 300B‧‧‧First surrounding barrier
300C‧‧‧第一圍繞狀容置空間 300C‧‧‧First surrounding space
30M‧‧‧圍繞狀可動件 30M‧‧‧around movable parts
31‧‧‧可移動鏡頭組件 31‧‧‧Removable lens assembly
3100‧‧‧外周圍表面 3100‧‧‧ outer peripheral surface
3101‧‧‧最頂端處 3101‧‧‧At the top
310‧‧‧第二最頂端圍繞狀結構 310‧‧‧Second topmost surrounding structure
310A‧‧‧第二圍繞狀延伸部 310A‧‧‧Second revolving extension
310B‧‧‧第二圍繞狀阻擋部 310B‧‧‧Second surrounding blocking
310C‧‧‧第二圍繞狀容置空間 310C‧‧‧Second surrounding space
H‧‧‧固定膠體 H‧‧‧Fixed colloid
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