TWI513295B - Image capturing module and actuator structure thereof - Google Patents
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本發明係有關於一種影像擷取模組及其致動器結構，尤指一種用於提升影像擷取品質的影像擷取模組及其致動器結構。The invention relates to an image capturing module and an actuator structure thereof, and more particularly to an image capturing module and an actuator structure thereof for improving image capturing quality.
近幾年來，如行動電話、PDA等手持式裝置具有取像模組配備的趨勢已日益普遍，並伴隨著產品市場對手持式裝置功能要求更好及體積更小的市場需求下，取像模組已面臨到更高畫質與小型化的雙重要求。針對取像模組畫質的提昇，一方面是提高畫素，市場的趨勢是由原VGA等級的30畫素，已進步到目前市面上所常見的兩百萬畫素、三百萬畫素，更甚者已推出更高等級的八百萬畫素以上之級別。除了畫素的提昇外，另一方面是關切取像的清晰度，因此手持式裝置的取像模組也由定焦取像功能朝向類似照相機的光學自動對焦功能、甚或是光學變焦功能發展。In recent years, the trend of handheld devices such as mobile phones and PDAs has become increasingly popular, and with the market demand for better handheld devices and smaller size, The group has faced the dual requirements of higher image quality and miniaturization. In view of the improvement of the image quality of the image capture module, on the one hand, the pixel is improved. The market trend is from the original VGA level of 30 pixels, which has progressed to the current two million pixels and three million pixels commonly used in the market. Even worse, it has introduced a higher level of more than eight million pixels. In addition to the improvement of pixels, on the other hand, the resolution of the image is taken care of. Therefore, the image capturing module of the handheld device is also developed by the fixed focus image capturing function toward the camera-like optical autofocus function or even the optical zoom function.
光學自動對焦功能的作動原理是依照標的物的不同遠、近距離，以適當地移動取像模組中的鏡頭，進而使得取像標的物體的光學影像得以準確地聚焦在影像感測器上，以產生清晰的影像。以目前一般常見到在取像模組中帶動鏡頭移動的致動方式，其包括有步進馬達致動、壓電致動以及音圈馬達(Voice Coil Motor，VCM)致動等方式。然而，在光源不足的情況下，會降低習知取像模組所擷取到的影像品質。The optical autofocus function is operated according to different distances and close distances of the target object to appropriately move the lens in the image capturing module, so that the optical image of the image capturing object can be accurately focused on the image sensor. To produce a clear image. At present, it is common to activate the lens movement in the image capturing module, which includes stepping motor actuation, piezoelectric actuation, and voice coil motor (VCM) actuation. However, in the case of insufficient light source, the image quality captured by the conventional image capturing module is lowered.
本發明實施例在於提供一種影像擷取模組及其致動器結構， 其用於有效提升整體的影像擷取品質。An embodiment of the present invention provides an image capturing module and an actuator structure thereof. It is used to effectively improve the overall image capture quality.
本發明其中一實施例所提供的一種影像擷取模組，其包括：一影像感測單元及一致動器結構。所述影像感測單元包括一承載基板及一設置在所述承載基板上且電性連接於所述承載基板的影像感測晶片。所述致動器結構包括一第一致動器單元及一與所述第一致動器單元相互配合的第二致動器單元。其中，所述第一致動器單元包括一第一框架殼體及一可活動地設置在所述第一框架殼體內且位於所述影像感測單元上方的第一可移動組件，且所述第一可移動組件包括一可活動地設置在所述第一框架殼體內的第一可移動殼體及至少一設置在所述第一可移動殼體內的光學透鏡組。其中，所述第二致動器單元包括一第二框架殼體及一可活動地設置在所述第二框架殼體內且位於所述影像感測單元上方的第二可移動組件，且所述第二可移動組件包括一可活動地設置在所述第二框架殼體內的第二可移動殼體、一設置在所述第二可移動殼體內的微透鏡陣列基板、及一設置在所述微透鏡陣列基板上以用於提升光吸收能力的非導電感光薄膜層。An image capturing module according to an embodiment of the present invention includes: an image sensing unit and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The actuator structure includes a first actuator unit and a second actuator unit that cooperates with the first actuator unit. The first actuator unit includes a first frame housing and a first movable component movably disposed in the first frame housing and above the image sensing unit, and the The first movable assembly includes a first movable housing movably disposed within the first frame housing and at least one optical lens assembly disposed within the first movable housing. The second actuator unit includes a second frame housing and a second movable component movably disposed in the second frame housing and located above the image sensing unit, and the The second movable component includes a second movable housing movably disposed in the second frame housing, a microlens array substrate disposed in the second movable housing, and a A non-conductive photosensitive film layer for enhancing light absorbing ability is provided on the microlens array substrate.
本發明另外一實施例所提供的一種致動器結構，所述致動器結構應用於一影像感測單元，且所述致動器結構包括：一第一致動器單元及一第二致動器單元。所述第一致動器單元包括一第一框架殼體及一可活動地設置在所述第一框架殼體內且位於所述影像感測單元上方的第一可移動組件，其中所述第一可移動組件包括一可活動地設置在所述第一框架殼體內的第一可移動殼體及至少一設置在所述第一可移動殼體內的光學透鏡組。所述第二致動器單元與所述第一致動器單元相互配合，所述第二致動器單元包括一第二框架殼體及一可活動地設置在所述第二框架殼體內且位於所述影像感測單元上方的第二可移動組件，其中所述第二可移動組件包括一可活動地設置在所述第二框架殼體內的第二可移動殼體、一設置在所述第二可移動殼體內的微透鏡陣列基板、及一 設置在所述微透鏡陣列基板上以用於提升光吸收能力的非導電感光薄膜層。According to another embodiment of the present invention, an actuator structure is applied to an image sensing unit, and the actuator structure includes: a first actuator unit and a second Actuator unit. The first actuator unit includes a first frame housing and a first movable component movably disposed in the first frame housing and above the image sensing unit, wherein the first The movable assembly includes a first movable housing movably disposed within the first frame housing and at least one optical lens assembly disposed within the first movable housing. The second actuator unit cooperates with the first actuator unit, the second actuator unit includes a second frame housing and a movable frame disposed in the second frame housing a second movable component located above the image sensing unit, wherein the second movable component includes a second movable housing movably disposed within the second frame housing, a microlens array substrate in the second movable housing, and a A non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability.
本發明的有益效果可以在於，本發明實施例所提供的影像擷取模組及其致動器結構，其可透過“一設置在所述第二可移動殼體內的微透鏡陣列基板”及“一設置在所述微透鏡陣列基板上以用於提升光吸收能力的非導電感光薄膜層”的設計，以有效提升本發明影像擷取模組的影像感測單元所擷取到的影像品質。The image capturing module and the actuator structure thereof provided by the embodiments of the present invention are permeable to "a microlens array substrate disposed in the second movable housing" and " A non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability is designed to effectively improve image quality captured by the image sensing unit of the image capturing module of the present invention.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
M‧‧‧影像擷取模組M‧‧‧Image Capture Module
1‧‧‧影像感測單元1‧‧‧Image sensing unit
10‧‧‧承載基板10‧‧‧Loading substrate
11‧‧‧影像感測晶片11‧‧‧Image sensing wafer
110‧‧‧影像感測區域110‧‧‧Image sensing area
2‧‧‧第一致動器單元2‧‧‧First actuator unit
20‧‧‧第一框架殼體20‧‧‧First frame housing
21‧‧‧第一可移動組件21‧‧‧First movable component
210‧‧‧第一可移動殼體210‧‧‧First movable housing
211‧‧‧光學透鏡組211‧‧‧ optical lens unit
3‧‧‧第二致動器單元3‧‧‧Second actuator unit
30‧‧‧第二框架殼體30‧‧‧Second frame housing
31‧‧‧第二可移動組件31‧‧‧Second movable component
310‧‧‧第二可移動殼體310‧‧‧Second movable housing
311‧‧‧微透鏡陣列基板311‧‧‧Microlens array substrate
3110‧‧‧透光基板3110‧‧‧Transparent substrate
3111‧‧‧微透鏡陣列3111‧‧‧Microlens array
31110‧‧‧微透鏡31110‧‧‧Microlens
312‧‧‧非導電感光薄膜層312‧‧‧Non-conductive photosensitive film layer
4‧‧‧致動器結構4‧‧‧Activity structure
40‧‧‧單件式框架殼體40‧‧‧One-piece frame housing
41‧‧‧第一可移動組件41‧‧‧First movable component
410‧‧‧第一可移動殼體410‧‧‧First movable housing
411‧‧‧光學透鏡組411‧‧‧Optical lens unit
42‧‧‧第二可移動組件42‧‧‧Second movable component
420‧‧‧第二可移動殼體420‧‧‧Second movable housing
421‧‧‧微透鏡陣列基板421‧‧‧Microlens array substrate
4210‧‧‧透光基板4210‧‧‧Transparent substrate
4211‧‧‧微透鏡陣列4211‧‧‧Microlens array
42110‧‧‧微透鏡42110‧‧‧Microlens
422‧‧‧非導電感光薄膜層422‧‧‧Non-conductive photosensitive film layer
W‧‧‧導電線W‧‧‧Flexible wire
圖1為本發明第一實施例的影像擷取模組的側視剖面示意圖。1 is a side cross-sectional view of an image capturing module according to a first embodiment of the present invention.
圖2為本發明第一實施例的影像擷取模組使用音圈致動器的側視剖面示意圖。2 is a side cross-sectional view showing the image capturing module of the first embodiment of the present invention using a voice coil actuator.
圖3為本發明第二實施例的影像擷取模組的側視剖面示意圖。3 is a side cross-sectional view of an image capturing module according to a second embodiment of the present invention.
圖4為本發明第三實施例的影像擷取模組的側視剖面示意圖。4 is a side cross-sectional view of an image capturing module according to a third embodiment of the present invention.
圖5為本發明第四實施例的影像擷取模組的側視剖面示意圖。FIG. 5 is a side cross-sectional view of an image capturing module according to a fourth embodiment of the present invention.
〔第一實施例〕[First Embodiment]
請參閱圖1及圖2所示，本發明第一實施例提供一種影像擷取模組M，其包括：一影像感測單元1及一致動器結構。Referring to FIG. 1 and FIG. 2, a first embodiment of the present invention provides an image capturing module M, which includes an image sensing unit 1 and an actuator structure.
首先，影像感測單元1包括一承載基板10及一設置在承載基板10上且電性連接於承載基板10的影像感測晶片11，其中影像感測晶片11的頂端具有一用於感測或擷取影像的影像感測區域110。舉例來說，影像感測晶片11可通過黏著膠體(未標號，例如UV黏著膠、熱硬化膠、或爐內硬化膠等等)以設置在承載基板10上。此外，承載基板10可為一上表面具有多個導電焊墊(未標號)的電路基板，影像感測晶片11的上表面也是具有多個導電焊墊(未 標號)，並且影像感測晶片11的每一個導電焊墊可通過一導電線W以電性連接於承載基板10的導電焊墊，以達成影像感測晶片11及承載基板10之間的電性導通。First, the image sensing unit 1 includes a carrier substrate 10 and an image sensing wafer 11 disposed on the carrier substrate 10 and electrically connected to the carrier substrate 10. The top surface of the image sensing wafer 11 has a sensing or The image sensing area 110 of the image is captured. For example, the image sensing wafer 11 may be disposed on the carrier substrate 10 by an adhesive (not labeled, such as a UV adhesive, a thermosetting adhesive, or an in-furnace hardening adhesive, etc.). In addition, the carrier substrate 10 can be a circuit substrate having a plurality of conductive pads (not labeled) on the upper surface, and the upper surface of the image sensing wafer 11 also has a plurality of conductive pads (not Each of the conductive pads of the image sensing wafer 11 can be electrically connected to the conductive pads of the carrier substrate 10 through a conductive line W to achieve electrical properties between the image sensing wafer 11 and the carrier substrate 10. Turn on.
再者，致動器結構包括一第一致動器單元2及一與第一致動器單元2相互配合的第二致動器單元3。其中，第一致動器單元2包括一第一框架殼體20及一可活動地設置在第一框架殼體20內且位於影像感測單元1上方的第一可移動組件21(亦即可移動鏡頭組件)，並且第一可移動組件21包括一可活動地設置在第一框架殼體20內的第一可移動殼體210及至少一設置在第一可移動殼體210內的光學透鏡組211。另外，第二致動器單元3包括一第二框架殼體30及一可活動地設置在第二框架殼體30內且位於影像感測單元1上方的第二可移動組件31，並且第二可移動組件31包括一可活動地設置在第二框架殼體30內的第二可移動殼體310、一設置在第二可移動殼體310內的微透鏡陣列基板311、及一設置在微透鏡陣列基板311上以用於提升光吸收能力的非導電感光薄膜層312。Furthermore, the actuator structure includes a first actuator unit 2 and a second actuator unit 3 that cooperates with the first actuator unit 2. The first actuator unit 2 includes a first frame housing 20 and a first movable component 21 movably disposed in the first frame housing 20 and located above the image sensing unit 1 (ie, Moving the lens assembly), and the first movable assembly 21 includes a first movable housing 210 movably disposed within the first frame housing 20 and at least one optical lens disposed within the first movable housing 210 Group 211. In addition, the second actuator unit 3 includes a second frame housing 30 and a second movable component 31 movably disposed in the second frame housing 30 and located above the image sensing unit 1, and second The movable component 31 includes a second movable housing 310 movably disposed in the second frame housing 30, a microlens array substrate 311 disposed in the second movable housing 310, and a micro-mirror array substrate 311. A non-conductive photosensitive film layer 312 for enhancing light absorption capability is mounted on the lens array substrate 311.
更進一步來說，第二框架殼體30設置在承載基板10上以覆蓋影像感測晶片11，並且第一框架殼體20設置在第二框架殼體30上。另外，微透鏡陣列基板311包括一設置在第二可移動殼體310內的透光基板3110及一設置在透光基板3110的下表面上且面向影像感測單元1的微透鏡陣列3111。微透鏡陣列3111可由多個彼此分離一預定距離的微透鏡31110所組成，並且非導電感光薄膜層312設置在透光基板3110的上表面上且面向第一可移動組件21的光學透鏡組311。Furthermore, the second frame housing 30 is disposed on the carrier substrate 10 to cover the image sensing wafer 11, and the first frame housing 20 is disposed on the second frame housing 30. In addition, the microlens array substrate 311 includes a transparent substrate 3110 disposed in the second movable housing 310 and a microlens array 3111 disposed on the lower surface of the transparent substrate 3110 and facing the image sensing unit 1. The microlens array 3111 may be composed of a plurality of microlenses 31110 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 312 is disposed on the upper surface of the light transmissive substrate 3110 and facing the optical lens group 311 of the first movable component 21.
藉此，本發明可通過具有提升光吸收能力的非導電感光薄膜層312的使用，以將更多的光源導引至微透鏡陣列基板311的微透鏡陣列3111的多個微透鏡31110。因此，本發明可通過微透鏡陣列基板311及非導電感光薄膜層312的相互配合，以有效提升 影像擷取模組M的影像感測單元1所擷取到的影像品質(例如提升色彩銳利度(sharpness)及影像解析度(resolution))。Thereby, the present invention can guide more light sources to the plurality of microlenses 31110 of the microlens array 3111 of the microlens array substrate 311 by using the non-conductive photosensitive film layer 312 having the light absorbing ability. Therefore, the present invention can effectively improve the mutual cooperation of the microlens array substrate 311 and the non-conductive photosensitive film layer 312. The image quality captured by the image sensing unit 1 of the image capturing module M (for example, improving color sharpness and image resolution).
舉例來說，第二框架殼體30可通過黏著膠體(例如UV黏著膠、熱硬化膠、或爐內硬化膠等等)以設置在承載基板10上，並且第一框架殼體20亦可通過黏著膠體(例如UV黏著膠、熱硬化膠、或爐內硬化膠等等)以設置在第二框架殼體30上。光學透鏡組211及微透鏡陣列基板311的透光基板3111可分別固定在第一可移動殼體210及第二可移動殼體310內，並且光學透鏡組211可由多個光學透鏡所組成，其中圖1所顯示的光學透鏡組211以使用2個光學透鏡為例來作說明。另外，非導電感光薄膜層312可由具有提升光吸收能力的奈米材料所製成，並且非導電感光薄膜層312可通過疊層貼合、塗佈、噴塗、濺鍍或任何的成形方式以設置在微透鏡陣列基板311上。另外，如圖2所示，第一致動器單元2及第二致動器單元3皆可為音圈致動器(voice coil actuator)，但本發明不以此為限。For example, the second frame housing 30 may be disposed on the carrier substrate 10 by an adhesive (for example, a UV adhesive, a thermosetting adhesive, or an in-furnace hardener, etc.), and the first frame housing 20 may also pass An adhesive (for example, a UV adhesive, a thermosetting adhesive, or an in-furnace hardener or the like) is provided on the second frame housing 30. The optical lens group 211 and the transparent substrate 3111 of the microlens array substrate 311 can be respectively fixed in the first movable housing 210 and the second movable housing 310, and the optical lens group 211 can be composed of a plurality of optical lenses, wherein The optical lens group 211 shown in Fig. 1 is exemplified by using two optical lenses. In addition, the non-conductive photosensitive film layer 312 may be made of a nano material having a light absorbing ability, and the non-conductive photosensitive film layer 312 may be laminated by lamination, coating, spraying, sputtering, or any forming means. On the microlens array substrate 311. In addition, as shown in FIG. 2, both the first actuator unit 2 and the second actuator unit 3 may be voice coil actuators, but the invention is not limited thereto.
〔第二實施例〕[Second embodiment]
請參閱圖3所示，本發明第二實施例提供一種影像擷取模組M，其包括：一影像感測單元1及一致動器結構4。由圖3與圖1的比較可知，本發明第二實施例與第一實施例最大的差別在於：第一實施例的第一框架殼體20及第二框架殼體30可一體成型結合成一可應用在第二實施例中的單件式框架殼體40，並且致動器結構4的第一可移動組件41及第二可移動組件42皆可活動地設置在單件式框架殼體40內。再者，第一可移動組件41包括一可活動地設置在單件式框架殼體40內的第一可移動殼體410及至少一設置在第一可移動殼體410內的光學透鏡組411。另外，第二可移動組件42包括一可活動地設置在單件式框架殼體40內的第二可移動殼體420、一設置在第二可移動殼體420內的微透鏡陣列基板421、及一設置在微透鏡陣列基板421上以用於提升光吸收能力 的非導電感光薄膜層422。The image capture module M includes an image sensing unit 1 and an actuator structure 4 . It can be seen from the comparison between FIG. 3 and FIG. 1 that the greatest difference between the second embodiment of the present invention and the first embodiment is that the first frame housing 20 and the second frame housing 30 of the first embodiment can be integrally formed into one. The one-piece frame housing 40 is applied in the second embodiment, and the first movable component 41 and the second movable component 42 of the actuator structure 4 are movably disposed in the one-piece frame housing 40 . Moreover, the first movable component 41 includes a first movable housing 410 movably disposed in the one-piece frame housing 40 and at least one optical lens group 411 disposed in the first movable housing 410. . In addition, the second movable component 42 includes a second movable housing 420 movably disposed in the one-piece frame housing 40, a microlens array substrate 421 disposed in the second movable housing 420, And being disposed on the microlens array substrate 421 for improving light absorption capability A non-conductive photosensitive film layer 422.
更進一步來說，單件式框架殼體40設置在承載基板10上以覆蓋影像感測晶片11，並且微透鏡陣列基板421包括一設置在第二可移動殼體420內的透光基板4210及一設置在透光基板4210的下表面上且面向影像感測單元1的微透鏡陣列4211。另外，微透鏡陣列4211可由多個彼此分離一預定距離的微透鏡42110所組成，並且非導電感光薄膜層422設置在透光基板4210的上表面上且面向第一可移動組件41的光學透鏡組411。換言之，本發明可依據不同的設計需求，使用由第一框架殼體20及第二框架殼體30相互配合所組成一兩件式框架殼體(如圖1所揭示的第一實施例)，或者是使用由第一框架殼體20及第二框架殼體30一體成型結合而成的單件式框架殼體40(如圖3所揭示的第二實施例)。Furthermore, the one-piece frame housing 40 is disposed on the carrier substrate 10 to cover the image sensing wafer 11 , and the microlens array substrate 421 includes a transparent substrate 4210 disposed in the second movable housing 420 and A microlens array 4211 disposed on the lower surface of the light transmissive substrate 4210 and facing the image sensing unit 1. In addition, the microlens array 4211 may be composed of a plurality of microlenses 42110 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 422 is disposed on the upper surface of the light transmissive substrate 4210 and faces the optical lens group of the first movable component 41. 411. In other words, the present invention can be used to form a two-piece frame housing (such as the first embodiment disclosed in FIG. 1) by using the first frame housing 20 and the second frame housing 30 to cooperate with each other according to different design requirements. Alternatively, a one-piece frame housing 40 (such as the second embodiment disclosed in FIG. 3) formed by integrally joining the first frame housing 20 and the second frame housing 30 is used.
〔第三實施例〕[Third embodiment]
請參閱圖4所示，本發明第三實施例提供一種影像擷取模組M，其包括：一影像感測單元1及一致動器結構。由圖4與圖1的比較可知，本發明第三實施例與第一實施例最大的差別在於：在第三實施例中，第一框架殼體20設置在承載基板10上以覆蓋影像感測晶片11，並且第二框架殼體30設置在第一框架殼體20上。另外，微透鏡陣列基板311包括一設置在第二可移動殼體310內的透光基板3110及一設置在透光基板3110的下表面上且面向光學透鏡組211的微透鏡陣列3111，並且非導電感光薄膜層312設置在透光基板3111的上表面上且背對第一可移動組件21的光學透鏡組211。換言之，本發明可依據不同的設計需求，將第二框架殼體30及第一框架殼體20依序堆疊在影像感測單元1上(如圖1所揭示的第一實施例)，或者是將第一框架殼體20及第二框架殼體30依序堆疊在影像感測單元1上(如圖4所揭示的第三實施例)。Referring to FIG. 4, a third embodiment of the present invention provides an image capturing module M, which includes an image sensing unit 1 and an actuator structure. It can be seen from the comparison between FIG. 4 and FIG. 1 that the greatest difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the first frame housing 20 is disposed on the carrier substrate 10 to cover the image sensing. The wafer 11 and the second frame housing 30 are disposed on the first frame housing 20. In addition, the microlens array substrate 311 includes a transparent substrate 3110 disposed in the second movable housing 310 and a microlens array 3111 disposed on the lower surface of the transparent substrate 3110 and facing the optical lens group 211, and The conductive photosensitive film layer 312 is disposed on the upper surface of the light-transmitting substrate 3111 and facing away from the optical lens group 211 of the first movable member 21. In other words, the second frame housing 30 and the first frame housing 20 can be sequentially stacked on the image sensing unit 1 according to different design requirements (such as the first embodiment disclosed in FIG. 1), or The first frame housing 20 and the second frame housing 30 are sequentially stacked on the image sensing unit 1 (as shown in the third embodiment disclosed in FIG. 4).
〔第四實施例〕[Fourth embodiment]
請參閱圖5所示，本發明第四實施例提供一種影像擷取模組 M，其包括：一影像感測單元1及一致動器結構4。由圖5與圖4的比較可知，本發明第四實施例與第三實施例最大的差別在於：第三實施例的第一框架殼體20及第二框架殼體30可一體成型結合成一可應用在第四實施例中的單件式框架殼體40，並且致動器結構4的第一可移動組件41及第二可移動組件42皆可活動地設置在單件式框架殼體40內。再者，第一可移動組件41包括一可活動地設置在單件式框架殼體40內的第一可移動殼體410及至少一設置在第一可移動殼體410內的光學透鏡組411。另外，第二可移動組件42包括一可活動地設置在單件式框架殼體40內的第二可移動殼體420、一設置在第二可移動殼體420內的微透鏡陣列基板421、及一設置在微透鏡陣列基板421上以用於提升光吸收能力的非導電感光薄膜層422。Referring to FIG. 5, a fourth embodiment of the present invention provides an image capturing module. M, comprising: an image sensing unit 1 and an actuator structure 4. It can be seen from the comparison between FIG. 5 and FIG. 4 that the greatest difference between the fourth embodiment of the present invention and the third embodiment is that the first frame housing 20 and the second frame housing 30 of the third embodiment can be integrally formed into one. The one-piece frame housing 40 of the fourth embodiment is applied, and the first movable component 41 and the second movable component 42 of the actuator structure 4 are movably disposed within the one-piece frame housing 40 . Moreover, the first movable component 41 includes a first movable housing 410 movably disposed in the one-piece frame housing 40 and at least one optical lens group 411 disposed in the first movable housing 410. . In addition, the second movable component 42 includes a second movable housing 420 movably disposed in the one-piece frame housing 40, a microlens array substrate 421 disposed in the second movable housing 420, And a non-conductive photosensitive film layer 422 disposed on the microlens array substrate 421 for enhancing light absorption capability.
更進一步來說，單件式框架殼體40設置在承載基板10上以覆蓋影像感測晶片11，並且微透鏡陣列基板421包括一設置在第二可移動殼體420內的透光基板4210及一設置在透光基板4210的下表面上且面向光學透鏡組411的微透鏡陣列4211。另外，微透鏡陣列4211可由多個彼此分離一預定距離的微透鏡42110所組成，並且非導電感光薄膜層422設置在透光基板4210的上表面上且背對第一可移動組件41的光學透鏡組411。換言之，本發明可依據不同的設計需求，使用由第一框架殼體20及第二框架殼體30相互配合所組成一兩件式框架殼體(如圖4所揭示的第三實施例)，或者是使用由第一框架殼體20及第二框架殼體30一體成型結合而成的單件式框架殼體40(如圖5所揭示的第四實施例)。Furthermore, the one-piece frame housing 40 is disposed on the carrier substrate 10 to cover the image sensing wafer 11 , and the microlens array substrate 421 includes a transparent substrate 4210 disposed in the second movable housing 420 and A microlens array 4211 disposed on the lower surface of the light transmissive substrate 4210 and facing the optical lens group 411. In addition, the microlens array 4211 may be composed of a plurality of microlenses 42110 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 422 is disposed on the upper surface of the light transmissive substrate 4210 and opposed to the optical lens of the first movable component 41. Group 411. In other words, the present invention can be used to form a two-piece frame housing (such as the third embodiment disclosed in FIG. 4) by using the first frame housing 20 and the second frame housing 30 to cooperate with each other according to different design requirements. Alternatively, a one-piece frame housing 40 (such as the fourth embodiment disclosed in FIG. 5) formed by integrally joining the first frame housing 20 and the second frame housing 30 is used.
〔實施例的可能功效〕[Possible effects of the examples]
綜上所述，本發明的有益效果可以在於，本發明實施例所提供的影像擷取模組M及其致動器結構1，其可透過“一設置在第二可移動殼體(310或420)內的微透鏡陣列基板(311或421)”及“一設置在微透鏡陣列基板(311或421)上以用於提升光吸收能力 的非導電感光薄膜層(312或422)”的設計，以有效提升本發明影像擷取模組M的影像感測單元1所擷取到的影像品質。In summary, the image capturing module M and the actuator structure 1 thereof are provided by the embodiment of the present invention, and are permeable to a second movable housing (310 or 420) a microlens array substrate (311 or 421)" and "one disposed on the microlens array substrate (311 or 421) for enhancing light absorption capability The non-conductive photosensitive film layer (312 or 422) is designed to effectively improve the image quality captured by the image sensing unit 1 of the image capturing module M of the present invention.
以上所述僅為本發明的較佳可行實施例，非因此侷限本發明的專利範圍，故舉凡運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by the present invention and the contents of the drawings are included in the scope of the present invention.
M‧‧‧影像擷取模組M‧‧‧Image Capture Module
1‧‧‧影像感測單元1‧‧‧Image sensing unit
10‧‧‧承載基板10‧‧‧Loading substrate
11‧‧‧影像感測晶片11‧‧‧Image sensing wafer
110‧‧‧影像感測區域110‧‧‧Image sensing area
2‧‧‧第一致動器單元2‧‧‧First actuator unit
20‧‧‧第一框架殼體20‧‧‧First frame housing
21‧‧‧第一可移動組件21‧‧‧First movable component
210‧‧‧第一可移動殼體210‧‧‧First movable housing
211‧‧‧光學透鏡組211‧‧‧ optical lens unit
3‧‧‧第二致動器單元3‧‧‧Second actuator unit
30‧‧‧第二框架殼體30‧‧‧Second frame housing
31‧‧‧第二可移動組件31‧‧‧Second movable component
310‧‧‧第二可移動殼體310‧‧‧Second movable housing
311‧‧‧微透鏡陣列基板311‧‧‧Microlens array substrate
3110‧‧‧透光基板3110‧‧‧Transparent substrate
3111‧‧‧微透鏡陣列3111‧‧‧Microlens array
31110‧‧‧微透鏡31110‧‧‧Microlens
312‧‧‧非導電感光薄膜層312‧‧‧Non-conductive photosensitive film layer
W‧‧‧導電線W‧‧‧Flexible wire
Claims (6)
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| TW102124719A TWI513295B (en) | 2013-07-10 | 2013-07-10 | Image capturing module and actuator structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102124719A TWI513295B (en) | 2013-07-10 | 2013-07-10 | Image capturing module and actuator structure thereof |
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| TW201503680A TW201503680A (en) | 2015-01-16 |
| TWI513295B true TWI513295B (en) | 2015-12-11 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020140835A1 (en) * | 2001-03-27 | 2002-10-03 | Silverstein D. Amnon | Single sensor chip digital stereo camera |
| US20050128308A1 (en) * | 2003-12-06 | 2005-06-16 | Tholl Hans D. | Imaging device for the stabilized imaging of an object onto a detector |
| TW200730878A (en) * | 2005-12-14 | 2007-08-16 | Eastman Kodak Co | Stereoscopic display apparatus using LCD panel |
| US20090066917A1 (en) * | 2007-09-12 | 2009-03-12 | Hon Hai Precision Industry Co., Ltd. | Micro lens array unit and liquid crystal display projection device using same |
| US20090185801A1 (en) * | 2008-01-23 | 2009-07-23 | Georgiev Todor G | Methods and Apparatus for Full-Resolution Light-Field Capture and Rendering |
| TW201316757A (en) * | 2011-09-30 | 2013-04-16 | Omnivision Tech Inc | EMI shield for camera module |
-
2013
- 2013-07-10 TW TW102124719A patent/TWI513295B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020140835A1 (en) * | 2001-03-27 | 2002-10-03 | Silverstein D. Amnon | Single sensor chip digital stereo camera |
| US20050128308A1 (en) * | 2003-12-06 | 2005-06-16 | Tholl Hans D. | Imaging device for the stabilized imaging of an object onto a detector |
| TW200730878A (en) * | 2005-12-14 | 2007-08-16 | Eastman Kodak Co | Stereoscopic display apparatus using LCD panel |
| US20090066917A1 (en) * | 2007-09-12 | 2009-03-12 | Hon Hai Precision Industry Co., Ltd. | Micro lens array unit and liquid crystal display projection device using same |
| US20090185801A1 (en) * | 2008-01-23 | 2009-07-23 | Georgiev Todor G | Methods and Apparatus for Full-Resolution Light-Field Capture and Rendering |
| TW201316757A (en) * | 2011-09-30 | 2013-04-16 | Omnivision Tech Inc | EMI shield for camera module |
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