TWI735386B - Imaging apparatus and method for assembling the same - Google Patents
Imaging apparatus and method for assembling the same Download PDFInfo
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- TWI735386B TWI735386B TW109141457A TW109141457A TWI735386B TW I735386 B TWI735386 B TW I735386B TW 109141457 A TW109141457 A TW 109141457A TW 109141457 A TW109141457 A TW 109141457A TW I735386 B TWI735386 B TW I735386B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B5/02—Lateral adjustment of lens
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0007—Movement of one or more optical elements for control of motion blur
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0007—Movement of one or more optical elements for control of motion blur
- G03B2205/0038—Movement of one or more optical elements for control of motion blur by displacing the image plane with respect to the optical axis
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0053—Driving means for the movement of one or more optical element
- G03B2205/0069—Driving means for the movement of one or more optical element using electromagnetic actuators, e.g. voice coils
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
- H02K41/0356—Lorentz force motors, e.g. voice coil motors moving along a straight path
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Abstract
Description
本發明有關於光學成像,特別是關於一種影像擷取模組。The present invention relates to optical imaging, in particular to an image capturing module.
現有設計中傳感器移位影像穩定(Sensor Shift OIS)鏡頭模組的組裝方法,是先在影像感測器基板上水平焊接軟排線(FPC,Flexible Printed Circuit)之後,再依序組裝影像感測器總成、光學防手震作動器以及鏡頭總成,最後進行外殼封裝。In the existing design, the assembly method of Sensor Shift OIS (Sensor Shift OIS) lens module is to first horizontally solder the flexible printed circuit (FPC) on the image sensor substrate, and then sequentially assemble the image sensor The assembly, the optical anti-shake actuator, and the lens assembly are finally packaged.
FPC事先被彎折成適當型態,其一端的FPC焊腳部分彎折成水平,而水平焊接於影像感測器基板。影像感測器總成以及鏡頭總成由上往下組裝在影像感測器基板上,最後再進行外殼封裝,以外殼固定鏡頭總成。影像感測器基板可以透過光學防手震作動器帶動,而相對於鏡頭總成進行水平位移以達成光學影像穩定功能。The FPC is bent into a proper shape in advance, and the FPC soldering foot part at one end is bent to be horizontal, and the FPC is horizontally soldered to the image sensor substrate. The image sensor assembly and the lens assembly are assembled on the image sensor substrate from top to bottom, and finally the housing is packaged to fix the lens assembly with the housing. The image sensor substrate can be driven by the optical anti-shake actuator, and is horizontally displaced relative to the lens assembly to achieve the optical image stabilization function.
然而,FPC並無足夠剛性維持其型態,在向下放置並組裝各元件時,FPC容易擺動而影響組裝,且彎折成水平的部份容易碰觸其他元件而無法順利放置,並且容易焊接失效。However, the FPC is not rigid enough to maintain its shape. When placing the components downward and assembling the components, the FPC is easy to swing and affect the assembly, and the horizontally bent part is easy to touch other components and cannot be placed smoothly, and it is easy to weld. Invalidate.
基於上述問題,本發明提出一種影像擷取模組及其組裝方法,藉以改善軟排線的配置。Based on the above-mentioned problems, the present invention provides an image capture module and an assembly method thereof, so as to improve the configuration of the flexible flat cable.
本發明一或多個實施例提出一種影像擷取模組,包含影像感測器總成以及至少一軟排線。影像感測器總成至少包含可動基板、影像感測晶片以及承載框架;可動基板上配置有多個電連接墊;影像感測晶片設置於可動基板的上表面,且電性連接於該些電連接墊;承載框架設置於上表面,且環繞影像感測晶片。軟排線具有固定端、浮動連接段以及電連接端;其中,固定端對應於可動基板的側邊緣配置;浮動連接段的一端連接於固定端,且浮動連接段浮動地配置於上表面上;電連接端延伸於浮動連接段的另一端;其中,電連接端是垂直於可動基板的上表面配置,且電連接端邊緣的多個接腳電連接於可動基板的該些電連接墊。One or more embodiments of the present invention provide an image capture module including an image sensor assembly and at least one flexible cable. The image sensor assembly at least includes a movable substrate, an image sensor chip, and a carrier frame; the movable substrate is provided with a plurality of electrical connection pads; the image sensor chip is disposed on the upper surface of the movable substrate and is electrically connected to the electrical Connecting pad; the carrying frame is arranged on the upper surface and surrounds the image sensor chip. The flexible flat cable has a fixed end, a floating connection section and an electrical connection end; wherein the fixed end corresponds to the side edge configuration of the movable substrate; one end of the floating connection section is connected to the fixed end, and the floating connection section is floatingly arranged on the upper surface; The electrical connection end extends at the other end of the floating connection section; wherein the electrical connection end is arranged perpendicular to the upper surface of the movable substrate, and a plurality of pins on the edge of the electrical connection end are electrically connected to the electrical connection pads of the movable substrate.
本發明一或多個實施例更提出一種影像擷取模組的組裝方法,包含:One or more embodiments of the present invention further provide an assembling method of an image capture module, including:
提供影像感測器總成;其中,影像感測器總成至少包含可動基板、影像感測晶片以及承載框架,可動基板上配置有多個電連接墊;影像感測晶片設置於可動基板的上表面,且電性連接於該些電連接墊;承載框架設置於上表面,且環繞影像感測晶片;An image sensor assembly is provided; wherein the image sensor assembly at least includes a movable substrate, an image sensor chip, and a carrying frame, and a plurality of electrical connection pads are arranged on the movable substrate; the image sensor chip is arranged on the movable substrate The surface is electrically connected to the electrical connection pads; the carrier frame is arranged on the upper surface and surrounds the image sensor chip;
提供軟排線;其中,軟排線具有固定端、浮動連接段以及電連接端,浮動連接段的一端連接於固定端,電連接端延伸於浮動連接段的另一端,且電連接端具有多個接腳;A flexible flat cable is provided; wherein the flexible flat cable has a fixed end, a floating connection section, and an electrical connection end. Pins
使電連接端垂直於可動基板的上表面配置並接觸可動基板的多個電連接墊,使浮動連接段浮動地配置於上表面上,並且使固定端對應於可動基板的側邊緣配置;以及Arranging the electrical connection end perpendicular to the upper surface of the movable substrate and contacting the plurality of electrical connection pads of the movable substrate, making the floating connection section floatingly arranged on the upper surface, and arranging the fixed end corresponding to the side edge of the movable substrate; and
將電連接端的該些接腳電連接於可動基板的多個電連接墊。The pins of the electrical connection terminal are electrically connected to the multiple electrical connection pads of the movable substrate.
於本發明一或多個實施例中,電連接端垂直於可動基板的上表面配置,以直接電連接於可動基板的線路;因此,安裝軟排線的過程可以避免碰觸其他元件。在一或多個實施例中,軟排線預先結合於固定框架或是影像感測器總成的承載框架,有利於軟排線的安裝。本發明一或多個實施例更進一步設置多個訊號饋入接點於影像感測器總成的可動基板,有利於在組裝過程中點亮影像感測晶片,以利進行主動對位製程。In one or more embodiments of the present invention, the electrical connection ends are arranged perpendicular to the upper surface of the movable substrate to be directly electrically connected to the lines of the movable substrate; therefore, the process of installing the flexible flat cable can avoid touching other components. In one or more embodiments, the flexible flat cable is pre-combined with the fixed frame or the carrier frame of the image sensor assembly, which facilitates the installation of the flexible flat cable. One or more embodiments of the present invention further provide a plurality of signal feed-in contacts on the movable substrate of the image sensor assembly, which facilitates the lighting of the image sensor chip during the assembly process and facilitates the active alignment process.
請參閱圖1、圖2以及圖3所示,為本發明第一實施例所揭露的一種影像擷取模組100,用於設置於電子裝置中;前述電子裝置包含但不限於智慧型手機、平板電腦、筆記型電腦、顯示器、獨立攝影機以及空拍機。Please refer to FIG. 1, FIG. 2 and FIG. 3, which are an image capturing
如圖1、圖2以及圖3所示,影像擷取模組100包含有固定框架110、基座120、一或多個軟排線130、鏡頭總成140、光學防手震作動器150(Optical Image Stabilizer Actuator)以及一影像感測器總成160。As shown in FIGS. 1, 2 and 3, the
如圖4以及圖5所示,固定框架110具有頂面側110a、底面側110b以及側向壁110c。頂面側110a以及底面側110b為連通,且頂面側110a以及底面側110b之間形成容置空間。側向壁110c連接頂面側110a以及底面側110b並圍繞容置空間。影像擷取模組100更包含延伸部112以及固定部114。延伸部112延伸於底面側110b的邊緣的局部。固定部114連接於延伸部112,使得固定部114間接地設置於固定框架110,固定部114大致平行於底面側110b,且固定部114與底面側110b之間具有高度差。在不同實施例中,延伸部112以及固定部114是一體成型於固定框架110。在不同實施例中,該高度差亦可省略,並省略延伸部112的配置,使固定部114直接地連接或延伸於底面側110b的邊緣。在不同實施例中,固定部114直接地連接或延伸於固定框架110的任意部位,不限定直接地連接或延伸於頂面側110a或底面側110b的邊緣。在不同實施例中,上述固定框架110的頂面側110a亦可改為側面側,側面側與底面側110b為連通以形成所述容置空間。As shown in FIGS. 4 and 5, the
如圖1所示,基座120可為板體或是框體。在不同實施例中,基座120可具有複雜結構,以配合影像擷取模組100的組裝需求。在不同實施中,基座120可為電子裝置的殼體的一部分。固定部114固定於基座120,使得固定框架110的底面側110b與基座120之間形成間隔距離。前述固定部114與底面側110b之間的高度差主要是用於形成該間隔距離,使得固定框架110的側向壁110c與基座120之間至少局部為開放狀態,以使影像感測器總成160的側面以及其他的元件局部外露;不排除固定部114設置於其他位置,或是直接挖空固定框架110的側面側,只要使得影像感測器總成160的側面以及其他的元件局部外露,確保影像感測器總成160在進行光學防手震補償時具有足夠的作動空間,與使軟排線130等元件外露以執行電連接作業(如焊接)即可。As shown in FIG. 1, the
如圖1、圖2以及圖3所示,鏡頭總成140設置於容置空間中,且固定於固定框架110。在一具體實施例中,鏡頭總成140至少包含光學鏡片組142以及對焦機構144。As shown in FIGS. 1, 2 and 3, the
如圖1所示,光學鏡片組142的光軸通過頂面側110a以及底面側110b,使光學鏡片組142的入光面對應於頂面側110a,而光學鏡片組142的出光面對應於底面側110b。在不同實施例中,上述固定框架110的頂面側110a可改為側面側,且鏡頭總成140還包含一個光路改變元件,此時光學鏡片組142的入光面對應於側面側,而光路改變元件對應於底面側110b;前述光路改變元件可為但不限定於稜鏡、反射鏡。As shown in FIG. 1, the optical axis of the
如圖1所示,對焦機構144連接於光學鏡片組142,且固定於固定框架110。對焦機構144通常配置為環繞光學鏡片組142,並且具有音圈馬達、壓電元件或記憶金屬(Shape Memory Alloys, SMA)等致動器。對焦機構144用於驅動光學鏡片組142沿著光軸移動以進行對焦。As shown in FIG. 1, the
如圖1、圖3以及圖6所示,影像感測器總成160穿過該底面側110b連接於鏡頭總成140。影像感測器總成160包含一可動基板162、一影像感測晶片164、一承載框架166以及一光學玻璃板168。如圖6所示,可動基板162的一上表面朝向底面側110b,並且可動基板162的上表面配置有多個電連接墊162a。影像感測晶片164設置於可動基板162的上表面,且透過線路電性連接於該些電連接墊162a。承載框架166設置於可動基板162的上表面,且環繞影像感測晶片164。光學玻璃板168設置於承載框架166,且對應於影像感測晶片164。可動基板162、承載框架166以及光學玻璃板168定義一封閉空間,且影像感測晶片164位於封閉空間中,以對影像感測晶片164提供防塵保護。As shown in FIGS. 1, 3 and 6, the
如圖1、圖3、圖6以及圖7所示,光學防手震作動器150連接該影像感測器總成160至該鏡頭總成140。As shown in FIGS. 1, 3, 6 and 7, the optical
如圖6、圖7以及圖8所示,光學防手震作動器150具有上作動件151以及下作動件152。該上作動件151透過黏膠或其他固定手段連接於對焦機構144,使上作動件151連接於鏡頭總成140。光學防手震作動器150還具有一中空區域,且光學鏡片組142是對應於中空區域配置。可動基板162或承載框架166透過黏膠或其他固定手段連接於下作動件152,使影像感測器總成160連接於下作動件152,且與基座120保持間隔距離。下作動件152可相對於上作動件151於垂直於光軸的一平面上位移。透過下作動件152的連接,可動基板162浮動地設置於基座120上,而可被下作動件152帶動。因此,下作動件152相對於上作動件151的位移,可以使得影像感測晶片164相對於光軸垂直移動,而達成光學防手震功能。As shown in FIGS. 6, 7 and 8, the optical
在一些實施例中,光學防手震作動器150可不有具有上作動件151以及下作動件152,而光學防手震作動器150是設置於鏡頭總成140與影像感測器總成160的周圍,並通過驅動件連接至鏡頭總成140及/或影像感測器總成160,以帶動鏡頭總成140及/或影像感測器總成160相對於光軸平移/轉動/傾斜來補償震動。例如,鏡頭總成140與影像感測器總成160被組裝為一個影像模組,而光學防手震作動器150是設置於基座120上或電子裝置內部並鄰近所述影像模組,且通過驅動件帶動所述影像模組平移/轉動/傾斜來補償震動。所述驅動件例如是馬達與連接桿,連接桿的一端連接所述馬達而另一端連接至鏡頭總成140及/或影像感測器總成160。In some embodiments, the optical
如圖2、圖3、圖4以及圖5所示,軟排線130具有一固定端132、一浮動連接段134以及一電連接端136。在本實施例中,軟排線130可以是可撓性印刷電路板(FPC,Flexible Printed Circuit)。在一些實施例中,軟排線130是在現有任一種可撓性基材上,如高分子聚合物薄板或金屬薄板,以現有任一種設置方式使電路形成在此可撓性基材上。As shown in FIGS. 2, 3, 4 and 5, the flexible
如圖2、圖3、圖4以及圖5所示,固定端132對應於可動基板162的一側邊緣配置且位於固定框架110之外,使得固定端132可以被電連接(如焊接)於電子裝置的訊號線路。訊號線路可以是設置在基座120上的電路或是不設置在基座120上的訊號排線180,本實施例中以訊號排線180設置在基座120上的為例進行說明。As shown in FIGS. 2, 3, 4, and 5, the
如圖2、圖3、圖4以及圖5所示,在一具體實施例中,固定端132固定於固定部114,特別是固定於固定部114朝向基座120的一面,使得固定端132位於固定框架110之外,並且間接地透過固定部114連接於固定框架110。固定端132可以局部地突出於固定部114之外,或不突出而隱藏於固定部114之底面;因此,於固定部114固定於基座120時,固定端132可以暫時地或永久地被固定於訊號排線180,以利後續的電連接作業。As shown in FIGS. 2, 3, 4, and 5, in a specific embodiment, the
在不同實施例中,固定端132垂直地固定於固定部114,而以垂直的方式被電連接於前述訊號線路或訊號排線180。訊號線路或訊號排線180用於電性連接至電子裝置如智慧型手機的控制模組,訊號排線180可為FPC接頭(FPC connector)。在一實施例中,固定端132與訊號排線180用於連接固定端132的一端,可以是設置在固定框架110的固定部114或基座120上,且訊號排線180的另一端連接至所述電子裝置的控制模組。In different embodiments, the
如圖2、圖3、圖4以及圖5所示,浮動連接段134的一端連接於固定端132,且浮動連接段134浮動地配置於可動基板162的上表面上,並延伸於固定框架110的容置空間中。浮動連接段134不直接固定於影像感測器總成160、鏡頭總成140及/或固定框架110。具體而言,鏡頭總成140與固定框架110之間保持間隙,浮動連接段134通過此一間隙,以使得浮動連接段134是於容置空間浮動設置。浮動連接段134的扁平部分平行光學鏡片組142的光軸,也就是浮動連接段134的厚度方向垂直所述光軸,且浮動連接段134的厚度小於鏡頭總成140與固定框架110之間的間隙,使浮動連接段134在此間隙中是可浮動的。As shown in FIGS. 2, 3, 4, and 5, one end of the floating connecting
如圖2、圖3、圖4以及圖5所示,電連接端136延伸於浮動連接段134的另一端,且電連接端136突出於固定框架110的底面側110b以方便電連接作業(如焊接、黏接、壓接或卡接)。As shown in Figures 2, 3, 4 and 5, the
如圖3以及圖6所示,軟排線130的電連接端136是垂直於可動基板162的上表面配置,並保持在電連接端136與可動基板162的上表面互相垂直的狀態下,使電連接端136邊緣的多個接腳136a電連接於可動基板162的電連接墊162a。舉例來說,透過融解錫球或其他焊料,使得電連接端136邊緣的多個接腳136a焊接於可動基板162的電連接墊162a,藉以將電連接端136以垂直於上表面的態樣電連接於可動基板162。在本實施例中,電連接墊162a是位在可動基板162的上表面而平行於可動基板162的上表面,使得接腳136a與電連接墊162a是在彼此垂直的狀態下被焊接在一起。As shown in FIGS. 3 and 6, the electrical connection end 136 of the flexible
如圖6所示,在本實施例中,可動基板162的電連接墊162a位在可動基板162的上表面,且上表面垂直於光學鏡片組142的光軸。電連接端136無須被彎折為平行所述上表面,電連接端136是在垂直所述上表面的狀態下連接可動基板162的電連接墊162a。As shown in FIG. 6, in this embodiment, the
如圖9所示,在一些實施例中,可動基板162的電連接墊162a位在可動基板162的側表面,且側表面平行於光學鏡片組142的光軸;電連接端136與可動基板162的電連接墊162a是彼此平行而互相連接,且電連接端136平行於側表面而垂直於上表面。在本實施例中,電連接墊162a是位在可動基板162的側表面而垂直於可動基板162的上表面,使得接腳136a與電連接墊162a是在彼此平行的狀態下被焊接在一起。As shown in FIG. 9, in some embodiments, the
在一些實施例中,固定端132可沿垂直方向(平行光軸的方向)被電連接於所述訊號線路或訊號排線180。連接結構可參照圖3、圖4與前述說明。舉例來說,訊號排線180設置有一排電連接墊180a(如圖3所示),而固定端132可沿垂直方向被焊接至訊號排線180的此排電連接墊180a;或者,訊號排線180可設置有兩排或兩排以上的電連接墊180a,浮動連接段134的一端對應延伸有兩排或兩排以上的固定端132,所述兩排或兩排以上的固定端132可分別沿垂直方向被焊接至訊號排線180的兩排或兩排以上的電連接墊180a。在一些實施例中,軟排線130的固定端132垂直於訊號排線180設有電連接墊180a的表面,固定端132的接腳與電連接墊180a是在彼此垂直的狀態下被焊接在一起(圖未示),其連接結構可參照前述實施例關於接腳136a與電連接墊162a的相關說明。在一些實施例中,上述垂直電連接的加工程序可通過雷射焊接設備實現。In some embodiments, the
以下進一步說明影像擷取模組100的組裝方法。組裝過程細分為數道次流程,分別製作半成品後,再結合多件半成品以組成該影像擷取模組100。The method of assembling the
如圖10以及圖11所示,首先提供一影像感測器總成160,如步驟S110所示。影像感測器總成160包含可動基板162、影像感測晶片164、承載框架166以及光學玻璃板168。As shown in FIGS. 10 and 11, an
提供影像感測器總成160的步驟具體包含提供可動基板162,可動基板162的上表面設置有電連接墊162a以及必要的訊號線路。接著,設置影像感測晶片164於可動基板162的上表面,並且電性連接於可動基板162的訊號線路。設置承載框架166於可動基板162並環繞影像感測晶片164。最後設置光學玻璃板168於承載框架166上,使得承載框架166以及光學玻璃板168形成一封裝結構,覆蓋影像感測晶片164。影像感測晶片164會被承載框架166與光學玻璃板168的封裝結構覆蓋,在後續組裝階段與對位程序中,可避免微粒沾染影像感測晶片164。The step of providing the
如圖10所示,提供軟排線130,使電連接端136垂直於可動基板162的上表面配置並接觸可動基板162的多個電連接墊162a,如步驟S120所示。於此同時,浮動連接段134是浮動地配置於可動基板162的上表面上,且固定端132位於可動基板162的上表面,並且對應於可動基板162的一側邊緣配置。As shown in FIG. 10, the flexible
如圖10所示,設置鏡頭總成140於影像感測器總成160之上,並連接影像感測器總成160至鏡頭總成140,如步驟S130所示。前述步驟S120以及步驟S130的執行次序可以互換,或者是同時執行。As shown in FIG. 10, the
具體而言,影像感測器總成160與鏡頭總成140之間是透過光學防手震作動器150連接。因此,步驟S140的細節更包含提供光學防手震作動器150;其中,光學防手震作動器150具有上作動件151以及下作動件152,且下作動件152可相對於上作動件151於垂直於光軸的一平面上位移;連接上作動件151至鏡頭總成140,連接影像感測器總成160於下作動件152。Specifically, the
在一些實施例中,影像感測器總成160與鏡頭總成140之間不是透過光學防手震作動器150可連接。例如,在連接影像感測器總成160至鏡頭總成140後,進一步設置光學防手震作動器150於鏡頭總成140與影像感測器總成160的周圍,連接光學防手震作動器150的驅動件至鏡頭總成140及/或影像感測器總成160,以帶動鏡頭總成140及/或影像感測器總成160相對於光軸平移/轉動/傾斜來補償震動。In some embodiments, the
如圖11所示,步驟S120以及步驟S130可整合為步驟S120a。如圖2、圖4以及圖5所示,組裝階段的固定框架110、軟排線130、鏡頭總成140以及光學防手震作動器150可先構成一個半成品。首先,固定軟排線130的固定端132於固定部114,使得固定端132位於固定框架110之外,並且間接地透過固定部114連接於固定框架110,如步驟S121所示。此時,配置浮動連接段134延伸於固定框架110的容置空間中,如步驟S122。配置電連接端136延伸於浮動連接段134的另一端,且突出於固定框架110的底面側110b,如步驟S123。接著,固定鏡頭總成140於固定框架110的容置空間中,如步驟S124所示,且連接光學防手震作動器150的上作動件151於鏡頭總成140,如步驟S125所示。As shown in FIG. 11, step S120 and step S130 can be integrated into step S120a. As shown in FIGS. 2, 4 and 5, the fixed
如圖2以及圖11所示,此時,固定框架110、軟排線130、鏡頭總成140以及光學防手震作動器150形成一個可以單獨移動的半成品。最後,連接光學防手震作動器150的下作動件152於承載框架166(如圖6或圖9所示),以連接影像感測器總成160至鏡頭總成140,並使電連接端136垂直於可動基板162的上表面配置以接近或接觸可動基板162的多個電連接墊162a,如步驟S126所示。此時,執行步驟S120a,亦即執行步驟S121~步驟S126,即為同時執行步驟S120以及步驟S130。As shown in FIGS. 2 and 11, at this time, the fixed
參閱圖12所示,於步驟S130或步驟S126中,連接影像感測器總成160至鏡頭總成140的步驟更包含進行主動對位(Active Alignment)製程,細節說明如下。Referring to FIG. 12, in step S130 or step S126, the step of connecting the
首先,利用探針、針板等訊號連接裝置傳送啟動訊號至影像感測晶片164,以點亮(啟用)影像感測晶片164,如步驟S141所示。其中,啟動訊號包括影像感測晶片164運作所需的電力,或啟動訊號即為影像感測晶片164運作所需的電力。接著依據影像感測晶片164連續產生的測試圖像,調整鏡頭總成140及其光軸與影像感測晶片164的相對位置,以進行光軸的校正,如步驟S142。最後,透過點膠等方式將光學防手震作動器150的下作動件152與影像感測器總成160的承載框架166結合,以透過光學防手震作動器150連接鏡頭總成140至影像感測器總成160,如步驟S143所示。First, signal connection devices such as probes and needle boards are used to transmit an activation signal to the
在一些實施例中,進行主動對位製程時,也可透過點膠將下作動件152固定於影像感測器總成160,特別是影像感測器總成160的承載框架166;或者,在一些實施例中,參照圖25、圖26所示,於組裝過程中,亦可先將輔助框架167連接於光學防手震作動器150的下作動件152,再利用輔助框架167連接於可動基板162的上表面,以結合兩個半成品。例如,影像感測器總成160為一個半成品,而輔助框架167、光學防手震作動器150與鏡頭總成140等其他元件為另一個半成品,光學防手震作動器150與鏡頭總成140是通過輔助框架167連接於影像感測器總成160的可動基板162。In some embodiments, when the active alignment process is performed, the
如圖1、圖2、圖6以及圖10所示,對電連接端136進行電連接,將電連接端136邊緣的多個接腳136a電連接(如焊接)於可動基板162的多個電連接墊162a,如步驟S140所示。步驟S140也可以於步驟S120或步驟S126之後進行。最後將固定框架110的固定部114固定於基座120上,並且使固定端132連接基座120上的訊號線路或訊號排線180,即完成影像擷取模組100的組裝,如步驟S150以及步驟S160所示。如圖10至圖12所示,在本實施例中,在進行影像感測器總成160與鏡頭總成140的主動對位製程後,再將影像感測器總成160與鏡頭總成140連同固定框架110組裝到基座120上。在一些實施例中,也可在影像感測器總成160、鏡頭總成140與固定框架110組裝到基座120後,再進行影像感測器總成160與鏡頭總成140的主動對位製程,在此情況下,影像感測器總成160與鏡頭總成140在尚未完成主動對位之前,其在光軸方向的相對位置並未固定(例如預先塗膠但尚未使膠固化)。As shown in Figure 1, Figure 2, Figure 6 and Figure 10, the
參閱圖13、圖14以及圖15所示,為本發明第二實施例所揭露的一種影像擷取模組100。第二實施例的影像擷取模組100大致與第一實施例所揭露者相同,差異在於第二實施例的影像擷取模組100更包含多個訊號饋入接點170,設置於可動基板162。訊號饋入接點170可以設置於可動基板162的上表面、下表面、邊緣,或是延伸突出部分,該些訊號饋入接點170會由影像感測器總成160外露出來而不被該影像感測器總成160的元件與結構遮蔽。訊號饋入接點170透過設置或不設置於可動基板162上的線路電性連接於影像感測晶片164,以傳送啟動(點亮)影像感測晶片164的啟動訊號,進行主動對位(Active Alignment)製程以校正鏡頭總成140及其光軸與影像感測晶片164的相對位置。Referring to FIG. 13, FIG. 14, and FIG. 15, there is an
如圖13、圖14以及圖15所示,在第二實施例中,在組裝階段的影像感測器總成160具有一訊號饋入部169。訊號饋入部169延伸於可動基板162的一邊緣。訊號饋入部169是可以由可動基板162一體延伸的硬板,或是連接於可動基板162的軟板。訊號饋入接點170設置在訊號饋入部169上。訊號饋入接點170可以供探針、針板等訊號連接裝置接觸,或是訊號饋入部169可作為一電接頭,此電接頭可以拆接於一電連接器,以在組裝訊號排線180(例如FPC接頭)之前,用於傳送啟動影像感測晶片164以將影像感測晶片164點亮(啟用)。As shown in FIG. 13, FIG. 14, and FIG. 15, in the second embodiment, the
如圖15所示,在完成影像擷取模組100的全部或部分組裝作業後,影像擷取模組100可通過軟排線130與所述訊號線路或訊號排線180傳輸訊號,訊號饋入部169不再具備功能。因此可進一步移除訊號饋入部169以節省空間,移除方式例如是以雷射、CNC設備或刀片等裁切工具切除訊號饋入部169。前述移除訊號饋入部169的步驟,可於影像擷取模組100的全部組裝作業後進行,或是在進行主動對位(Active Alignment)製程之後進行。As shown in FIG. 15, after all or part of the assembling operation of the
參閱圖16以及圖17所示,為本發明第三實施例所揭露的一種可動基板162,用於置換本發明一或多個實施例中的可動基板162。在第三實施例中,訊號饋入接點170是設置在可動基板162的下表面,如圖16所示,或是訊號饋入接點170是設置在可動基板162的一邊緣,如圖17所示。Referring to FIG. 16 and FIG. 17, there is a
如圖16以及圖17所示,可動基板162的一下表面或是邊緣的訊號饋入接點170不被該影像感測器總成160遮蔽,而可以被探針、針板等訊號連接裝置接觸,以傳送啟動影像感測晶片164的啟動訊號,使影像感測晶片164點亮進行主動對位(Active Alignment)。因此,應用第三實施例的可動基板162,在組裝過程中就不需再切除訊號饋入部169。As shown in Figures 16 and 17, the signal feed-in
如圖15至圖17所示,訊號饋入部169或訊號饋入接點170可應用於任何影像擷取模組100須點亮影像感測晶片164的製程作業,不限於前述實施例的影像擷取模組100的軟排線130的設置。例如在影像感測晶片164被電性連接到影像擷取模組100的其他訊號傳輸或控制元件之前,如需要進行主動對位時,皆可通過訊號饋入部169或訊號饋入接點170的設置,點亮影像感測晶片164,以進行主動對位。As shown in FIGS. 15-17, the
如圖18以及圖19所示,為本發明第四實施例所提出的一種底殼200以及承靠治具300,用於在組裝過程中承載影像感測器總成160,以利鏡頭總成140以及影像感測器總成160的結合。As shown in FIGS. 18 and 19, a
如圖18所示,底殼200包含一承載板210以及環繞承載板210的定位側壁220,且承載板210上具有開孔210a。影像感測器總成160放置於承載板210上方並覆蓋開孔210a。承靠治具300用於供底殼200的放置於其上,並以承靠凸部310穿過開孔210a以抬升影像感測器總成160的可動基板162,使影像感測器總成160與承載板210之間須維持預定間距,以利影像感測器總成160在進行防手震補償時的作動。在組裝過程中,可先進行主動對位,調整固定框架110(固定有鏡頭總成140)與影像感測器總成160的相對位置以校正光軸。As shown in FIG. 18, the
參閱圖20所示,為底殼200以及承靠治具300應用時,組裝方法的修改,連接影像感測器總成160至鏡頭總成140的步驟(步驟S130或步驟S126)細節說明如下。Referring to FIG. 20, when the
如圖18以及圖20所示,首先,放置影像感測器總成160於底殼200的承載板210上方並覆蓋開孔210a,如步驟S141a所示,接著執行步驟S141以及步驟S142以完成光軸校正。在前述步驟中,底殼200放置在承靠治具300上。As shown in FIGS. 18 and 20, first, place the
如圖19以及圖20所示,承靠治具300的承靠凸部310穿過承載板210的開孔210a。以承靠治具300承托底殼200的承載板210,並以承靠凸部310承托影像感測器總成160,藉以朝向固定框架110的底面側110b移動承載板210以及影像感測器總成160,如步驟S143a所示。使定位側壁220與固定框架110的側向壁110c在底面側110b互相套接,如步驟S143b所示。As shown in FIGS. 19 and 20, the supporting
如圖19所示,在定位側壁220與固定框架110的側向壁110c在底面側110b互相套接並且定位之後,承靠凸部310使影像感測器總成160被抬升至可以連接鏡頭總成140;例如使承載框架166接觸光學防手震作動器150的下作動件152,使得事先塗佈的黏膠可以將光學防手震作動器150的下作動件152連接至影像感測器總成160的承載框架166,如步驟S143所示。承靠凸部310抬升影像感測器總成160,在光軸方向Z對影像感測器總成160的位置做第二階段調整,也就是上述底殼200與影像感測器總成160之間的間距調整,以保留底殼200的承載板210與影像感測器總成160的間距,確保影像感測器總成160進行防手震補償時的作動空間。As shown in FIG. 19, after the
如圖18以及圖19所示,在第四實施例中,定位側壁220匹配固定框架110的底面側110b,固定框架110的側向壁110c在底面側110b套接於定位側壁220。此外,固定框架110的側向壁110c的內側面設置止擋結構116。定位側壁220被固定框架110的側向壁110c套接後,可被止擋結構116止擋,而限制底殼200至鏡頭總成140之間的最小距離。由於定位側壁220與固定框架110的側向壁110c是互相匹配但並未互相卡合,因此定位側壁220與固定框架110的側向壁110c具有在光軸方向Z上相對位移的能力。透過黏膠或其他固定手段結合鏡頭總成140以及影像感測器總成160時,可調整底殼200與影像感測器總成160之間的間距,補償鏡頭總成140與影像感測器總成160在組裝過程或元件本身所產生的公差。As shown in FIGS. 18 and 19, in the fourth embodiment, the
接著,可在定位側壁220與固定框架110的側向壁110c或底面側110b的交界處塗布膠水並加以固化,使底殼200與影像感測器總成160的相對位置固定。此時,底殼200可用於取代前述一或多個實施例中的基座120。在一些實施例中,在定位側壁220與固定框架110的組裝前或調整前,定位側壁220與固定框架110的交界處也可先塗布膠水,待組裝後或調整後再使膠水固化。Then, glue can be applied and cured at the junction of the
如圖21以及圖22所示,在一些實施例中,定位側壁220與固定框架110的側向壁110c的相對位置也可互換,也就是定位側壁220在底面側110b套接於固定框架110的側向壁110c。此時,固定框架110的側向壁110c的外側面設置止擋結構116,固定框架110的側向壁110c被定位側壁220套接後,定位側壁220可被止擋結構116止擋。As shown in Figures 21 and 22, in some embodiments, the relative positions of the
在一實施例中,如圖23以及圖24所示,固定框架110的止擋結構116穿透設置有開窗116a,定位側壁220設置有凸包220a。凸包220a可延伸至開窗116a。開窗116a在垂直於影像感測晶片164的一光軸方向Z的寬度大於凸包220a在光軸方向Z的寬度,因此凸包220a可在開窗116a的寬度範圍中移動,定位側壁220與固定框架110可通過凸包220a與開窗116a彼此配合而在光軸方向Z上有限度的相對移動。相應地,藉由上述承靠治具300也可以在光軸方向Z對影像感測器總成160的位置做第二階段調整。調整完成後,定位側壁220與固定框架110的交界處也可塗布膠水並加以固化,使底殼200替代一或多個實施的基座120。在本實施例中,止擋結構116實質上是讓定位側壁220與固定框架110可互相嵌合且在光軸方向Z上做有限度的相對移動的互嵌結構。在一些實施例中,在定位側壁220與固定框架110的組裝前或調整前,定位側壁220與固定框架110的交界處也可先塗布膠水,待組裝後或調整後再使膠水固化。In one embodiment, as shown in FIGS. 23 and 24, the
定位側壁220接觸止擋結構116時,承載板210相對於底面側110b的高度,小於固定部114相對於底面側110b的高度。因此,當移除底殼200並將固定部114固定於基座120時,可以確保可動基板162與基座120之間保持間隔距離。在一些實施例中,固定部114也可不固定於基座120或底殼200,而是由固定框架110的一側向外延伸,以配合軟排線130與所述電子裝置的訊號排線180的配置。When the
如圖25所示,為本發明第五實施例所提出的一種影像擷取模組100,此影像擷取模組100更包含一輔助框架167。於組裝過程中,亦可先將輔助框架167連接於光學防手震作動器150的下作動件152,再利用輔助框架167連接於可動基板162的上表面。As shown in FIG. 25, it is an
如圖26以及圖27所示,光學防手震作動器150的中空區域加大,並以輔助框架167作為對焦機構144的底座。上作動件151與鏡頭總成140的連接處,向外移動至對焦機構144的外緣,讓中空區域可以避讓以供鏡頭承載治具400的凸台410通過,承載光學鏡片組142,以進行光學鏡片組142墊高組裝, 來確保光學鏡片組142於對焦機構144中的相對位置。As shown in FIGS. 26 and 27, the hollow area of the optical
如圖25以及圖26所示,承載框架166以及光學玻璃板168用於封裝影像感測晶片164以防止粉塵,且承載框架166尺寸小於輔助框架167,而被輔助框架167環繞。進行主動對位(Active Alignment)製程後,將輔助框架167固定於可動基板162即可完成鏡頭總成140、光學防手震作動器150與影像感測器總成160的連接。在此實施例中,承載框架166是固定於可動基板162的獨立框架,其可在組裝與對位過程中保護影像感測晶片164。As shown in FIGS. 25 and 26, the
參閱圖28、圖29以及圖30所示,為本發明第六實施例所提出的一種軟排線130的變化例。此一軟排線130可先結合於影像感測器總成160,並與影像感測晶片164電性連接,之後再進行主動對位(Active Alignment)製程。於第六實施例中,軟排線130更包含一或多個水平定位片137,延伸於電連接端136的上側邊緣。承載框架166的頂面更包含一或多個定位缺口166a,對應於水平定位片137。在一些實施例中,軟排線130的電連接端136可直接貼附於承載框架166的側壁,而無須水平定位片137與定位缺口166a的配置。Referring to FIG. 28, FIG. 29, and FIG. 30, it is a variation of the flexible
如圖30所示,於影像感測器總成160的半成品完成後,可先將電連接端136電連接於可動基板162。此時,水平定位片137可用於嵌入定位缺口166a,輔助軟排線130的電連接端136的垂直放置以及定位。As shown in FIG. 30, after the semi-finished product of the
基於第六實施例的軟排線130,圖10中的步驟S120大致修正為,以水平定位片137嵌入定位缺口166a,使電連接端136垂直於可動基板162的上表面配置,並接觸可動基板162的多個電連接墊162a。在應用第六實施例的軟排線130時,步驟S110以及S120需要連續完成,以組成包含影像感測器總成160以及軟排線130的半成品,之後再進行鏡頭總成140或固定框架110的結合。Based on the flexible
參閱圖31所示,為本發明第七實施例所提出的一種軟排線130的變化例。在先前的實施例中,圖3的固定端132是分成兩排的雙片結構,且固定端132的雙片結構是被分別焊接在兩條的訊號排線180上。在本實施例中,如圖31所示,固定端132為合成一排的單片結構,且單片的固定端132可以被焊接至單條的訊號排線180上。在一些實施例中,單片結構的固定端132可以被焊接在兩條訊號排線180的電連接墊180a上;在一些實施例中,雙片結構的固定端132可以被焊接在單條訊號排線180的電連接墊180a上。Refer to FIG. 31, which is a variation of the flexible
在一些實施例中,軟排線130與訊號排線180可以整合為一體,例如圖31的軟排線130的固定端132與訊號排線180是一體成型,也就是說,固定端132與訊號排線180之間不需要經過焊接,訊號排線180是直接由固定端132一體延伸。In some embodiments, the flexible
於本發明一或多個實施例中,電連接端136垂直於可動基板162的上表面配置,以直接電連接(如焊接)於可動基板162的線路;電連接端136無須彎折成平行於可動基板162的上表面的狀態,因此,安裝軟排線130的過程可以避免碰觸其他元件。在一或多個實施例中,軟排線130預先結合於固定框架110或是影像感測器總成160的承載框架166,有利於軟排線130的安裝。本發明一或多個實施例更進一步設置多個訊號饋入接點170於影像感測器總成160的可動基板162,有利於在組裝過程中點亮影像感測晶片162,以利進行主動對位製程。In one or more embodiments of the present invention, the
100:影像擷取模組
110:固定框架
110a:頂面側
110b:底面側
110c:側向壁
112:延伸部
114:固定部
116:止擋結構
116a:開窗
120:基座
130:軟排線
132:固定端
134:浮動連接段
136:電連接端
136a:接腳
137:水平定位片
140:鏡頭總成
142:光學鏡片組
144:對焦機構
150:光學防手震作動器
151:上作動件
152:下作動件
160:影像感測器總成
162:可動基板
162a:電連接墊
164:影像感測晶片
166:承載框架
166a:定位缺口
167:輔助框架
168:光學玻璃板
169:訊號饋入部
170:訊號饋入接點
180:訊號排線
180a:電連接墊
200:底殼
210:承載板
210a:開孔
220:定位側壁
220a:凸包
300:承靠治具
310:承靠凸部
400:鏡頭承載治具
410:凸台
Z:光軸方向
S110~S160:步驟100: Image capture module
110: fixed
圖1是本發明第一實施例中,影像擷取模組的剖視圖。 圖2是本發明第一實施例中,影像擷取模組的立體圖。 圖3是本發明第一實施例中,影像擷取模組的部分元件立體圖。 圖4是本發明第一實施例中,固定框架以及軟排線的立體圖。 圖5是本發明第一實施例中,固定框架以及軟排線的另一立體圖。 圖6是本發明第一實施例中,部分元件的局部立體圖。 圖7是本發明第一實施例中,光學防手震作動器的立體圖。 圖8是本發明第一實施例中,光學防手震作動器以及鏡頭總成的立體圖。 圖9是本發明第一實施例中,部分元件的局部立體圖。 圖10是本發明實施例中,影像擷取模組的組裝方法的流程圖。 圖11是本發明實施例中,影像擷取模組的組裝方法的部分流程圖。 圖12是本發明實施例中,影像擷取模組的組裝方法的部分流程圖。 圖13是本發明第二實施例中,影像擷取模組的部分元件立體圖。 圖14是本發明第二實施例中,影像感測器總成的立體圖。 圖15是本發明第二實施例中,影像擷取模組的部分元件立體圖。 圖16是本發明第三實施例中,可動基板的底視圖。 圖17是本發明第三實施例中,可動基板的立體圖。 圖18是本發明第三實施例中,底殼、承靠治具以及影像擷取模組的剖視圖。 圖19是本發明第三實施例中,底殼、承靠治具以及影像擷取模組的另一剖視圖。 圖20是本發明實施例中,影像擷取模組的組裝方法的部分流程圖。 圖21是本發明第四實施例中,底殼、承靠治具以及影像擷取模組的又一剖視圖。 圖22是本發明第四實施例中,底殼、承靠治具以及影像擷取模組的又一剖視圖。 圖23是本發明第四實施例中,底殼、承靠治具以及影像擷取模組的局部剖視圖。 圖24是本發明第四實施例中,底殼、承靠治具以及影像擷取模組的另一局部剖視圖。 圖25是本發明第五實施例中,影像擷取模組的剖視圖。 圖26是本發明第五實施例中,光學鏡片組、固定框架以及光學防手震作動器的底視圖。 圖27是本發明第五實施例中,固定框架、鏡頭總成、光學防手震作動器以及鏡頭承載治具的底視圖。 圖28是本發明第六實施例中,軟排線的立體圖。 圖29是本發明第六實施例中,影像感測器總成的立體圖。 圖30是本發明第六實施例中,軟排線以及影像感測器總成的立體圖。 圖31是本發明第七實施例中,影像擷取模組的部分元件立體圖。FIG. 1 is a cross-sectional view of the image capturing module in the first embodiment of the present invention. FIG. 2 is a three-dimensional view of the image capturing module in the first embodiment of the present invention. 3 is a perspective view of some components of the image capturing module in the first embodiment of the present invention. Fig. 4 is a perspective view of a fixed frame and a flexible flat cable in the first embodiment of the present invention. Fig. 5 is another perspective view of the fixed frame and the flexible flat cable in the first embodiment of the present invention. Fig. 6 is a partial perspective view of some elements in the first embodiment of the present invention. Fig. 7 is a perspective view of the optical anti-shake actuator in the first embodiment of the present invention. Fig. 8 is a perspective view of the optical anti-shake actuator and the lens assembly in the first embodiment of the present invention. Fig. 9 is a partial perspective view of some elements in the first embodiment of the present invention. FIG. 10 is a flowchart of an assembling method of an image capture module in an embodiment of the present invention. FIG. 11 is a partial flowchart of an assembling method of an image capture module in an embodiment of the present invention. FIG. 12 is a partial flowchart of an assembling method of an image capture module in an embodiment of the present invention. FIG. 13 is a perspective view of some components of the image capturing module in the second embodiment of the present invention. Fig. 14 is a perspective view of the image sensor assembly in the second embodiment of the present invention. 15 is a perspective view of some components of the image capturing module in the second embodiment of the present invention. Fig. 16 is a bottom view of the movable substrate in the third embodiment of the present invention. Fig. 17 is a perspective view of a movable substrate in the third embodiment of the present invention. 18 is a cross-sectional view of the bottom case, the supporting fixture and the image capturing module in the third embodiment of the present invention. 19 is another cross-sectional view of the bottom case, the supporting fixture and the image capturing module in the third embodiment of the present invention. FIG. 20 is a partial flowchart of an assembling method of an image capture module in an embodiment of the present invention. 21 is another cross-sectional view of the bottom case, the supporting fixture and the image capturing module in the fourth embodiment of the present invention. 22 is another cross-sectional view of the bottom case, the supporting fixture and the image capturing module in the fourth embodiment of the present invention. FIG. 23 is a partial cross-sectional view of the bottom case, the supporting fixture and the image capturing module in the fourth embodiment of the present invention. 24 is another partial cross-sectional view of the bottom case, the supporting fixture and the image capturing module in the fourth embodiment of the present invention. 25 is a cross-sectional view of the image capturing module in the fifth embodiment of the present invention. Fig. 26 is a bottom view of the optical lens group, the fixed frame and the optical anti-shake actuator in the fifth embodiment of the present invention. Fig. 27 is a bottom view of the fixed frame, the lens assembly, the optical anti-shake actuator and the lens bearing fixture in the fifth embodiment of the present invention. Fig. 28 is a perspective view of a flexible flat cable in the sixth embodiment of the present invention. Fig. 29 is a perspective view of the image sensor assembly in the sixth embodiment of the present invention. FIG. 30 is a perspective view of a flexible flat cable and an image sensor assembly in the sixth embodiment of the present invention. FIG. 31 is a perspective view of some components of the image capturing module in the seventh embodiment of the present invention.
100:影像擷取模組 100: Image capture module
110:固定框架 110: fixed frame
110a:頂面側 110a: Top side
110b:底面側 110b: bottom side
110c:側向壁 110c: lateral wall
112:延伸部 112: Extension
114:固定部 114: fixed part
130:軟排線 130: Flexible cable
132:固定端 132: fixed end
134:浮動連接段 134: Floating connection segment
136:電連接端 136: Electrical connection terminal
140:鏡頭總成 140: lens assembly
142:光學鏡片組 142: Optical lens group
160:影像感測器總成 160: image sensor assembly
162:可動基板 162: movable substrate
166:承載框架 166: Carrying Frame
Claims (15)
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI804052B (en) * | 2021-06-04 | 2023-06-01 | 同欣電子工業股份有限公司 | Non-soldering type sensor lens |
CN114257725A (en) * | 2021-11-22 | 2022-03-29 | 昆山联滔电子有限公司 | Camera shooting structure |
TWI793978B (en) * | 2021-12-02 | 2023-02-21 | 大陽科技股份有限公司 | Photographing module and electronic device |
JP2023088710A (en) * | 2021-12-15 | 2023-06-27 | 維沃移動通信有限公司 | Optical stage compensation actuator and assembly method and assembly device thereof |
TWI796995B (en) * | 2022-03-04 | 2023-03-21 | 大立光電股份有限公司 | Optical image stabilization driver device, camera module and electronic device |
CN117692745A (en) * | 2022-08-31 | 2024-03-12 | 信扬科技(佛山)有限公司 | Lens module and electronic device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7613390B2 (en) * | 2005-06-30 | 2009-11-03 | Hoya Corporation | Flexible printed wiring board arrangement of an imaging device |
US7986873B2 (en) * | 2008-10-20 | 2011-07-26 | Nidec Sankyo Corporation | Optical unit with shake correcting function and shake correction control method therefor |
TW201541176A (en) * | 2014-04-21 | 2015-11-01 | Lite On Technology Corp | Image-capturing module having a built-in topmost dustproof structure |
US9319574B2 (en) * | 2013-06-10 | 2016-04-19 | Samsung Electronics Co., Ltd. | Camera lens assembly |
CN107688268A (en) * | 2016-08-05 | 2018-02-13 | 赫克斯冈技术中心 | Camera arrangement |
CN109164432A (en) * | 2018-09-14 | 2019-01-08 | Oppo广东移动通信有限公司 | Depth obtaining module and electronic device |
WO2020034826A1 (en) * | 2018-08-15 | 2020-02-20 | 宁波舜宇光电信息有限公司 | Anti-shake camera module, anti-shake light-sensing assembly, fabrication method therefor and electronic device |
CN110908066A (en) * | 2019-12-12 | 2020-03-24 | 东莞市亚登电子有限公司 | Multi-axis optical anti-shake and focusing device, camera module, and electronic apparatus |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6646316B2 (en) * | 2001-01-24 | 2003-11-11 | Kingpak Technology, Inc. | Package structure of an image sensor and packaging |
CN1926422A (en) * | 2004-03-31 | 2007-03-07 | 株式会社爱德万测试 | Testing facilities for image sensor |
CN100561282C (en) * | 2005-09-09 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | Numerical camera mould |
TW200717833A (en) * | 2005-10-20 | 2007-05-01 | Advanced Semiconductor Eng | Image sensor |
CN100523981C (en) * | 2005-12-26 | 2009-08-05 | 鑫视科技股份有限公司 | Image acquisition system and focusing device therefor |
CN101035199A (en) * | 2007-03-30 | 2007-09-12 | 昆山钜亮光电科技有限公司 | Making method for the image module with the sensor directly connected and encapsulated together with the soft board |
CN101866934B (en) * | 2009-04-20 | 2013-04-10 | 鸿富锦精密工业(深圳)有限公司 | Lens module |
KR101573073B1 (en) * | 2009-06-03 | 2015-12-01 | 삼성전자주식회사 | Optical image stabilizer for camera lens module |
TWI459802B (en) * | 2009-10-12 | 2014-11-01 | Hon Hai Prec Ind Co Ltd | Image stabilizing module and image capturing device |
TW201210326A (en) * | 2010-08-19 | 2012-03-01 | Hon Hai Prec Ind Co Ltd | Camera module and manufacturing method of the same |
CN104995541B (en) | 2012-12-20 | 2018-10-16 | 苹果公司 | Voice coil motor optical image stabilization |
US9204025B1 (en) * | 2013-08-30 | 2015-12-01 | Amazon Technologies, Inc. | Camera module with a molded enclosure contained in a flexible substrate |
GB201412848D0 (en) | 2014-07-18 | 2014-09-03 | Cambridge Mechatronics Ltd | Suspension system for a camera lens element |
KR20160103437A (en) * | 2015-02-24 | 2016-09-01 | 삼성전기주식회사 | Actuator and camera module including the same |
US9525832B1 (en) * | 2015-06-16 | 2016-12-20 | Stmicroelectronics Pte Ltd | Image sensor device with an electromagnetic compatibility shield (EMC) and associated methods |
TWM520206U (en) * | 2015-07-30 | 2016-04-11 | 台灣東電化股份有限公司 | Driving assembly and electronic device and electromagnetic driving module using the driving assembly |
JP6710775B2 (en) * | 2016-03-11 | 2020-06-17 | アップル インコーポレイテッドApple Inc. | Optical image stabilization with voice coil motor to move image sensor |
US11261081B2 (en) * | 2016-09-12 | 2022-03-01 | MEMS Drive (Nanjing) Co., Ltd. | MEMS actuation systems and methods |
CN107331676A (en) * | 2017-06-30 | 2017-11-07 | 信利光电股份有限公司 | Chip package camera module, camera and chip package camera module method |
TWI734028B (en) * | 2017-09-28 | 2021-07-21 | 大陸商寧波舜宇光電信息有限公司 | Camera module, photosensitive component, penalization of photosensitive component, mold of the penalization and manufacturing method |
US11297212B2 (en) * | 2018-04-05 | 2022-04-05 | Canon Kabushiki Kaisha | Imaging apparatus |
TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
US11483461B2 (en) * | 2020-08-12 | 2022-10-25 | Apple Inc. | Techniques for forming suspension assemblies for a camera |
-
2020
- 2020-11-25 CN CN202011342753.2A patent/CN112600993B/en active Active
- 2020-11-25 TW TW109141457A patent/TWI735386B/en active
- 2020-11-25 CN CN202011338024.XA patent/CN112600992B/en active Active
- 2020-11-25 TW TW109141458A patent/TWI766450B/en active
- 2020-12-03 CN CN202022869443.8U patent/CN213585969U/en active Active
-
2021
- 2021-04-26 US US17/240,038 patent/US11435548B2/en active Active
- 2021-04-29 US US17/244,380 patent/US11525977B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7613390B2 (en) * | 2005-06-30 | 2009-11-03 | Hoya Corporation | Flexible printed wiring board arrangement of an imaging device |
US7986873B2 (en) * | 2008-10-20 | 2011-07-26 | Nidec Sankyo Corporation | Optical unit with shake correcting function and shake correction control method therefor |
US9319574B2 (en) * | 2013-06-10 | 2016-04-19 | Samsung Electronics Co., Ltd. | Camera lens assembly |
EP2813880B1 (en) * | 2013-06-10 | 2016-07-13 | Samsung Electronics Co., Ltd. | Camera lens assembly |
TW201541176A (en) * | 2014-04-21 | 2015-11-01 | Lite On Technology Corp | Image-capturing module having a built-in topmost dustproof structure |
CN107688268A (en) * | 2016-08-05 | 2018-02-13 | 赫克斯冈技术中心 | Camera arrangement |
WO2020034826A1 (en) * | 2018-08-15 | 2020-02-20 | 宁波舜宇光电信息有限公司 | Anti-shake camera module, anti-shake light-sensing assembly, fabrication method therefor and electronic device |
CN109164432A (en) * | 2018-09-14 | 2019-01-08 | Oppo广东移动通信有限公司 | Depth obtaining module and electronic device |
CN110908066A (en) * | 2019-12-12 | 2020-03-24 | 东莞市亚登电子有限公司 | Multi-axis optical anti-shake and focusing device, camera module, and electronic apparatus |
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US11435548B2 (en) | 2022-09-06 |
CN112600993B (en) | 2022-07-05 |
US11525977B2 (en) | 2022-12-13 |
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US20210247622A1 (en) | 2021-08-12 |
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TW202111367A (en) | 2021-03-16 |
TW202111366A (en) | 2021-03-16 |
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TWI766450B (en) | 2022-06-01 |
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