TWI518340B - 半導體晶片測試插座 - Google Patents

半導體晶片測試插座 Download PDF

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Publication number
TWI518340B
TWI518340B TW102121261A TW102121261A TWI518340B TW I518340 B TWI518340 B TW I518340B TW 102121261 A TW102121261 A TW 102121261A TW 102121261 A TW102121261 A TW 102121261A TW I518340 B TWI518340 B TW I518340B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
plunger
conductive sheet
conductive
bottom cover
Prior art date
Application number
TW102121261A
Other languages
English (en)
Chinese (zh)
Other versions
TW201344212A (zh
Inventor
李彩允
Original Assignee
李諾工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 李諾工業股份有限公司 filed Critical 李諾工業股份有限公司
Publication of TW201344212A publication Critical patent/TW201344212A/zh
Application granted granted Critical
Publication of TWI518340B publication Critical patent/TWI518340B/zh

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
TW102121261A 2009-08-27 2010-02-05 半導體晶片測試插座 TWI518340B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20090080029 2009-08-27

Publications (2)

Publication Number Publication Date
TW201344212A TW201344212A (zh) 2013-11-01
TWI518340B true TWI518340B (zh) 2016-01-21

Family

ID=43834375

Family Applications (2)

Application Number Title Priority Date Filing Date
TW99103410A TWI420120B (zh) 2009-08-27 2010-02-05 半導體晶片測試插座
TW102121261A TWI518340B (zh) 2009-08-27 2010-02-05 半導體晶片測試插座

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW99103410A TWI420120B (zh) 2009-08-27 2010-02-05 半導體晶片測試插座

Country Status (2)

Country Link
JP (2) JP5064522B2 (ja)
TW (2) TWI420120B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101179545B1 (ko) * 2011-09-23 2012-09-05 하동호 반도체 검사 소켓
KR101552552B1 (ko) * 2014-08-22 2015-09-14 리노공업주식회사 테스트 소켓
JP6626254B2 (ja) * 2015-02-03 2019-12-25 株式会社テセック 半導体デバイス測定方法
JP6872943B2 (ja) * 2017-03-24 2021-05-19 株式会社日本マイクロニクス 電気的接続装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09304472A (ja) * 1996-05-10 1997-11-28 Hitachi Ltd 接続装置
JPH10302924A (ja) * 1997-04-28 1998-11-13 Sony Corp 電子素子用コネクタ及び電子部品
DE19983903T1 (de) * 1999-11-17 2002-02-28 Advantest Corp IC-Sockel und IC-Testgerät
JP2002367748A (ja) * 2001-06-11 2002-12-20 Hitachi Ltd ソケット
JP2004053409A (ja) * 2002-07-19 2004-02-19 Matsushita Electric Ind Co Ltd プローブカード
JP2006084252A (ja) * 2004-09-15 2006-03-30 Matsushita Electric Ind Co Ltd 半導体装置の検査装置とこの製造方法
KR100640626B1 (ko) * 2005-01-05 2006-10-31 삼성전자주식회사 포고 핀 및 이를 포함하는 테스트 소켓
JP4722715B2 (ja) * 2006-01-30 2011-07-13 日本モレックス株式会社 ソケット
JP2007242438A (ja) * 2006-03-09 2007-09-20 Tokyo Eletec Kk Ｉｃソケット
JP2008008726A (ja) * 2006-06-29 2008-01-17 Matsushita Electric Ind Co Ltd 半導体装置の検査装置
JP2008078055A (ja) * 2006-09-23 2008-04-03 Sumitomo Electric Ind Ltd 異方導電性シート、検査装置および実装半導体製品
JP5104265B2 (ja) * 2007-12-07 2012-12-19 Ｊｓｒ株式会社 プローブ部材およびその製造方法ならびにその応用
KR101032721B1 (ko) * 2008-01-03 2011-05-06 (주)제이티 반도체칩검사장치 및 그 방법

Also Published As

Publication number Publication date
JP5491581B2 (ja) 2014-05-14
TWI420120B (zh) 2013-12-21
JP5064522B2 (ja) 2012-10-31
TW201107765A (en) 2011-03-01
JP2012181218A (ja) 2012-09-20
JP2011047917A (ja) 2011-03-10
TW201344212A (zh) 2013-11-01

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