TWI508863B - The manufacturing method and the layered body of the layered body - Google Patents

The manufacturing method and the layered body of the layered body Download PDF

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Publication number
TWI508863B
TWI508863B TW100102691A TW100102691A TWI508863B TW I508863 B TWI508863 B TW I508863B TW 100102691 A TW100102691 A TW 100102691A TW 100102691 A TW100102691 A TW 100102691A TW I508863 B TWI508863 B TW I508863B
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Taiwan
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resin layer
laminated body
device substrate
body block
support plate
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TW100102691A
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Chinese (zh)
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TW201132503A (en
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Satoshi Kondo
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Asahi Glass Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10743—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing acrylate (co)polymers or salts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10128—Treatment of at least one glass sheet
    • B32B17/10155—Edge treatment or chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10293—Edge features, e.g. inserts or holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/1077—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyurethane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10798—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing silicone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

積層體之製造方法及積層體Method for manufacturing laminated body and laminated body

本發明係關於一種積層體之製造方法及積層體。The present invention relates to a method for producing a laminate and a laminate.

近年來，太陽能電池(PV，Photo Voltaic，光伏)、液晶面板(LCD，Liquid Crystal Display，液晶顯示器)、有機EL面板(OLED，Organic Light Emitting Display，有機發光顯示器)等器件(電子機器)之薄型化、輕量化正在推進，該等器件所使用之基板(以下，稱為「器件基板」)之薄板化正進行。若藉由薄板化，器件基板之強度不足，則於器件之製造步驟中，器件基板之操作性會下降。In recent years, thin devices such as solar cells (PV, Photo Voltaic, photovoltaic), liquid crystal display (LCD), organic EL panels (OLED, Organic Light Emitting Display, etc.) The thinning of the substrate (hereinafter referred to as "device substrate") used in these devices is progressing. If the strength of the device substrate is insufficient by thinning, the operability of the device substrate is lowered in the manufacturing process of the device.

因此，自先前以來，廣泛採用在較最終厚度更厚之器件基板上形成器件用構件，其後藉由化學蝕刻處理使器件基板薄板化之方法。然而，該方法中，例如於將1塊器件基板之厚度薄板化為0.7 mm至0.2 mm或0.1 mm之情形時，將原本之器件基板之材料之大半以蝕刻液削除，因此就生產性或原材料之使用效率之觀點而言欠佳。Therefore, a method of forming a device member on a device substrate thicker than the final thickness and then thinning the device substrate by chemical etching treatment has been widely used. However, in this method, for example, when the thickness of one device substrate is thinned to 0.7 mm to 0.2 mm or 0.1 mm, most of the material of the original device substrate is removed by etching liquid, so that productivity or raw materials are used. The use efficiency is not good.

又，上述利用化學蝕刻處理之器件基板之薄板化方法中，於器件基板表面存在微細傷痕之情形時，有藉由蝕刻處理而以傷痕為起點形成微細的凹處(蝕刻斑)，成為光學缺陷之情況。Further, in the thinning method of the device substrate by the chemical etching treatment, when there is a fine flaw on the surface of the device substrate, a fine recess (etching spot) is formed as a starting point from the scratch by the etching treatment, and the optical defect is obtained. The situation.

最近，為對應上述問題，提出有如下方法：準備於器件基板之第1主面以可剝離之方式密著有固定於支撐板上之樹脂層之積層體，於積層體之器件基板之第2主面上形成器件用構件後，自器件基板上剝離附樹脂層之支撐板(例如參照專利文獻1)。Recently, in order to cope with the above problems, there has been proposed a method in which a laminate of a resin layer fixed to a support plate is detachably adhered to a first main surface of a device substrate, and a second layer of a device substrate of the laminate is prepared. After the device member is formed on the main surface, the support plate with the resin layer is peeled off from the device substrate (see, for example, Patent Document 1).

先前技術文獻Prior technical literature 專利文獻Patent literature

專利文獻1：國際公開第07/018028號小冊子Patent Document 1: International Publication No. 07/018028

然而，上述先前之積層體中有於積層體之外周面形成凹槽之情況。例如於器件基板或支撐板為經倒角加工者之情形時，或於樹脂層係將液狀之樹脂組成物塗佈於支撐板上並加熱硬化而成者之情形時，由於器件基板或支撐板之外周面或樹脂層之外周面帶有圓形，故於積層體之外周面形成凹槽。However, in the above-mentioned prior laminated body, there is a case where a groove is formed on the outer peripheral surface of the laminated body. For example, when the device substrate or the support plate is chamfered, or when the resin layer is applied to the support plate by heating and hardening, the device substrate or the support is used. The outer peripheral surface of the plate or the outer peripheral surface of the resin layer has a circular shape, so that a groove is formed on the outer peripheral surface of the laminated body.

於器件之製造步驟中，有對形成於器件基板之表面之導電膜進行噴砂、蝕刻等處理而形成配線或元件等圖案形成步驟。於該圖案形成步驟之前，有為保護導電膜之表面之一部分而於導電膜之表面塗佈抗蝕液等塗佈液之塗佈步驟。In the manufacturing process of the device, a pattern forming step of forming a wiring or an element by performing a process such as sand blasting or etching on the conductive film formed on the surface of the device substrate. Before the pattern forming step, there is a coating step of applying a coating liquid such as a resist liquid to the surface of the conductive film to protect a part of the surface of the conductive film.

器件之製造步驟之塗佈步驟中，塗佈液由於毛細管現象而浸入凹槽中，容易積存。積存於凹槽內之塗佈液，即便清洗亦難以去除，乾燥後容易殘留殘渣。該殘渣於器件製造步驟之加熱處理步驟中成為發塵源，因此發塵污染加熱處理步驟內，使作為製品之器件之良率下降。In the coating step of the manufacturing step of the device, the coating liquid is immersed in the groove due to the capillary phenomenon, and is easily accumulated. The coating liquid accumulated in the grooves is difficult to remove even after washing, and residues are likely to remain after drying. This residue becomes a dust source in the heat treatment step of the device manufacturing step, so that the dust-contaminated heat treatment step lowers the yield of the device as a product.

本發明係鑒於上述課題而形成者，主要目的在於提供一種在器件之製造步驟中可抑制發塵之積層體之製造方法及積層體。The present invention has been made in view of the above problems, and a main object of the invention is to provide a method for producing a laminated body capable of suppressing dust generation in a manufacturing step of a device, and a laminated body.

為了解決上述目的，本發明之積層體之製造方法係包括如下步驟之方法：於器件基板與支撐板之間***樹脂層，該樹脂層係以可剝離之方式密著於上述器件基板之第1主面，並且將固定於上述支撐板上之積層體塊切斷為預定尺寸，使上述積層體塊之外周面之至少圓周方向一部分平面化。In order to achieve the above object, a method for producing a laminate according to the present invention includes a method of inserting a resin layer between a device substrate and a support plate, the resin layer being detachably adhered to the first of the device substrates. The main surface is cut into a predetermined size by the laminated body block fixed to the support plate, and at least a part of the outer circumferential surface of the laminated body block is planarized.

進而，本發明之積層體之製造方法較佳為包括如下步驟：將上述積層體塊之外周面之經平面化之部分之角部倒角。Further, the method for producing a laminated body according to the present invention preferably includes the step of chamfering a corner portion of the planarized portion of the outer peripheral surface of the laminated body block.

又，較佳為上述樹脂層之外周面之經平面化之部分與上述樹脂層之厚度方向大致平行。Moreover, it is preferable that the planarized portion of the outer peripheral surface of the resin layer is substantially parallel to the thickness direction of the resin layer.

又，較佳為，上述器件基板係利用浮式法製造之玻璃基板，且包括如下步驟：將上述角部倒角後，研磨上述器件基板之第2主面。Further, preferably, the device substrate is a glass substrate manufactured by a floating method, and includes a step of chamfering the corner portion and polishing the second main surface of the device substrate.

上述器件基板較佳為厚度0.03 mm以上且小於0.8 mm之玻璃基板。The above device substrate is preferably a glass substrate having a thickness of 0.03 mm or more and less than 0.8 mm.

上述樹脂層較佳為包含選自由丙烯酸系樹脂層、聚烯烴樹脂層、聚胺基甲酸酯樹脂層、及聚矽氧樹脂層所組成之群中之至少一種。The resin layer preferably contains at least one selected from the group consisting of an acrylic resin layer, a polyolefin resin layer, a polyurethane resin layer, and a polyoxymethylene resin layer.

上述樹脂層之厚度較佳為5~50 μm。The thickness of the above resin layer is preferably 5 to 50 μm.

又，本發明之積層體係於器件基板與支撐板之間***樹脂層，該樹脂層係以可剝離之方式密著於上述器件基板之第1主面，並且將固定於上述支撐板上之積層體塊切斷為預定尺寸，使上述積層體塊之外周面之至少圓周方向一部分平面化而成者。Further, in the laminated system of the present invention, a resin layer is interposed between the device substrate and the support plate, and the resin layer is detachably adhered to the first main surface of the device substrate, and is laminated on the support plate. The body block is cut into a predetermined size, and at least a part of the outer circumferential surface of the laminated body block is planarized.

依據本發明，可提供一種於器件之製造步驟中可抑制發塵之積層體之製造方法及積層體。According to the present invention, it is possible to provide a method for producing a laminate which can suppress dust generation in a manufacturing step of a device, and a laminate.

以下，參照圖式，對用以實施本發明之形態進行說明。各圖中，同一構成係附同一符號，省略說明。Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the respective drawings, the same components are denoted by the same reference numerals, and their description will be omitted.

(第1實施形態)(First embodiment)

圖1係本發明之第1實施形態中之積層體之製造方法之步驟圖。如圖1所示，積層體之製造方法包括如下步驟：於器件基板與支撐板之間***樹脂層，該樹脂層係以可剝離之方式密著於器件基板之第1主面，並且將固定於支撐板上之積層體塊切割為預定尺寸，使積層體塊之外周面之至少圓周方向一部分平面化(步驟S11)。Fig. 1 is a flow chart showing a method of manufacturing a laminated body in a first embodiment of the present invention. As shown in FIG. 1, the method for manufacturing a laminated body includes the steps of inserting a resin layer between the device substrate and the support plate, the resin layer being detachably adhered to the first main surface of the device substrate, and fixed The laminated body block on the support plate is cut into a predetermined size, and at least a part of the circumferential direction of the outer peripheral surface of the laminated body block is planarized (step S11).

平面化後之積層體詳細如後述，用於器件之製造。平面化後之積層體中之附樹脂層之支撐板係使用至器件之製造步驟之中途為止(直至器件基板與樹脂層藉由剝離操作而剝離為止)。器件基板與樹脂層剝離後，附樹脂層之支撐板係自器件之製造步驟中去除，不成為構成器件之構件。自器件基板剝離之附樹脂層之支撐板可於積層體之製造步驟中再利用。即，於附樹脂層之支撐板之樹脂層上積層新的器件基板，可獲得新的積層體塊。The layered body after planarization is used in detail for the manufacture of the device as will be described later. The support plate with the resin layer in the planarized laminated body is used until the middle of the manufacturing process of the device (until the device substrate and the resin layer are peeled off by the peeling operation). After the device substrate and the resin layer are peeled off, the support plate with the resin layer is removed from the manufacturing steps of the device, and does not become a member constituting the device. The support plate with the resin layer peeled off from the device substrate can be reused in the manufacturing steps of the laminate. That is, a new device substrate is laminated on the resin layer of the support plate with the resin layer, and a new laminated body block can be obtained.

首先，對平面化前之積層體塊進行說明，繼而，對平面化後之積層體塊進行說明，最後對器件之製造步驟進行說明。First, the laminated body block before planarization will be described. Next, the planarized bulk block will be described. Finally, the manufacturing steps of the device will be described.

圖2係本發明之第1實施形態中之平面化前之積層體塊之部分側面圖。如圖2所示，平面化前之積層體塊10係於器件基板11與支撐板12之間***有樹脂層13者。樹脂層13係以可剝離之方式密著於器件基板11之第1主面111，並且固定於支撐板12上。Fig. 2 is a partial side elevational view showing a laminated body block before planarization in the first embodiment of the present invention. As shown in FIG. 2, the laminated body block 10 before planarization is a resin layer 13 interposed between the device substrate 11 and the support plate 12. The resin layer 13 is detachably adhered to the first main surface 111 of the device substrate 11, and is fixed to the support plate 12.

(器件基板)(device substrate)

器件基板11係於第2主面112上形成器件用構件而構成器件。此處，所謂器件用構件，係指構成器件(電子機器)之至少一部分之構件。具體例可列舉薄膜電晶體(Thin-Film Transistor，TFT)、彩色濾光片(Color Filter，CF)。作為器件，可例示太陽電池(PV)、液晶面板(LCD)、有機EL面板(OLED)等。器件用構件係於使積層體塊10之外周面平面化後，形成於器件基板11之第2主面112。The device substrate 11 is formed on the second main surface 112 to form a device member. Here, the member for a device means a member constituting at least a part of a device (electronic device). Specific examples thereof include a thin film transistor (TFT) and a color filter (CF). As the device, a solar cell (PV), a liquid crystal panel (LCD), an organic EL panel (OLED), or the like can be exemplified. The device member is formed on the second main surface 112 of the device substrate 11 after planarizing the outer peripheral surface of the laminated body block 10.

器件基板11之種類可為一般者，例如可為玻璃基板、樹脂基板、或者SUS(Special Use Stainless，特殊用途不鏽鋼)基板等金屬基板。該等基板中，較佳為玻璃基板。其原因在於，玻璃基板之耐化學品性、耐透濕性優異，且熱收縮率低。作為熱收縮率之指標，係使用JIS R 3102-1995中規定之線膨脹係數。The type of the device substrate 11 may be a metal substrate such as a glass substrate, a resin substrate, or a SUS (Special Use Stainless) substrate. Among these substrates, a glass substrate is preferred. This is because the glass substrate is excellent in chemical resistance and moisture permeability, and has a low heat shrinkage rate. As an index of the heat shrinkage rate, the coefficient of linear expansion specified in JIS R 3102-1995 was used.

若器件基板11之線膨脹係數大，器件之製造步驟多伴有加熱處理，因此容易產生各種不良情況。例如，於在器件基板11上形成TFT之情形時，若於加熱下將形成有TFT之器件基板11冷卻，則由於器件基板11之熱收縮，而有TFT之位置偏移變得過大之虞。If the linear expansion coefficient of the device substrate 11 is large, the manufacturing steps of the device are often accompanied by heat treatment, and thus various disadvantages are likely to occur. For example, when a TFT is formed on the device substrate 11, if the device substrate 11 on which the TFT is formed is cooled by heating, the positional shift of the TFT becomes excessive due to thermal contraction of the device substrate 11.

玻璃基板係將玻璃原料熔融，使熔融玻璃成形為板狀而獲得。此種成形方法可為一般者，例如使用浮式法、熔合法、流孔下引法、富可法(Fourcault method)、反向法等。又，厚度特別薄之玻璃基板是利用將暫時成形為板狀之玻璃加熱至可成形之溫度，利用延伸等方法拉伸而變薄之方法(再拉法)進行成形而獲得。The glass substrate is obtained by melting a glass raw material and forming the molten glass into a plate shape. Such a forming method may be a general one, for example, a floating method, a melting method, a flow hole down method, a Fourcault method, a reverse method, or the like. Further, the glass substrate having a particularly small thickness is obtained by heating (temporing) a glass which has been temporarily formed into a plate shape to a temperature at which it can be formed, and stretching and thinning by a method such as stretching.

玻璃基板之玻璃並無特別限定，較佳為無鹼玻璃、硼矽酸玻璃、鈉鈣玻璃、高二氧化矽玻璃、其他以氧化矽為主要成分之氧化物系玻璃。作為氧化物系玻璃，較佳為藉由氧化物換算之氧化矽之含量為40~90質量%之玻璃。The glass of the glass substrate is not particularly limited, and is preferably an alkali-free glass, a borosilicate glass, a soda lime glass, a high-cerium oxide glass, or another oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide in an amount of 40 to 90% by mass in terms of oxide.

作為玻璃基板之玻璃，較佳為採用適合於器件之種類或其製造步驟之玻璃。例如，由於鹼金屬成分之溶出容易對液晶造成影響，故液晶面板用之玻璃基板較佳為包含實質上不含鹼金屬成分之玻璃(無鹼玻璃)。如此，玻璃基板之玻璃係基於所應用之器件之種類及其製造步驟而適當選擇。As the glass of the glass substrate, it is preferred to use a glass suitable for the kind of the device or the manufacturing steps thereof. For example, since the elution of the alkali metal component is likely to affect the liquid crystal, the glass substrate for the liquid crystal panel preferably contains glass (alkali-free glass) which does not substantially contain an alkali metal component. As such, the glass of the glass substrate is appropriately selected depending on the type of the device to be applied and the manufacturing steps thereof.

器件基板之厚度並無特別限定，通常小於0.8 mm，較佳為0.3 mm以下，進而較佳為0.15 mm以下。又，較佳為0.03 mm以上。尤其於器件基板為玻璃基板之情形時，就玻璃基板之薄型化及/或輕量化之觀點而言，通常為小於0.8 mm，較佳為0.3 mm以下，進而較佳為0.15 mm以下。於0.8 mm以上之情形時，不滿足玻璃基板之薄型化及/或輕量化之要求。於0.3 mm以下之情形時，可對玻璃基板賦予良好之可撓性。於0.15 mm以下之情形時，可將玻璃基板捲取為輥狀。又，由於玻璃基板之製造容易，玻璃基板之操作容易等原因，玻璃基板之厚度較佳為0.03 mm以上。The thickness of the device substrate is not particularly limited and is usually less than 0.8 mm, preferably 0.3 mm or less, and further preferably 0.15 mm or less. Further, it is preferably 0.03 mm or more. In particular, when the device substrate is a glass substrate, the glass substrate is usually less than 0.8 mm, preferably 0.3 mm or less, and more preferably 0.15 mm or less from the viewpoint of thickness reduction and/or weight reduction. When it is 0.8 mm or more, the requirements for thinning and/or weight reduction of the glass substrate are not satisfied. When it is 0.3 mm or less, good flexibility can be imparted to the glass substrate. When the thickness is 0.15 mm or less, the glass substrate can be wound into a roll shape. Moreover, the thickness of the glass substrate is preferably 0.03 mm or more because the glass substrate is easily manufactured, the operation of the glass substrate is easy, and the like.

樹脂基板之樹脂之種類並無特別限定。作為透明之樹脂，可例示：聚對苯二甲酸乙二酯樹脂、聚碳酸酯樹脂、透明氟樹脂、透明聚醯亞胺樹脂、聚醚碸樹脂、聚萘二甲酸乙二酯樹脂、聚丙烯酸系樹脂、環烯烴樹脂、聚矽氧樹脂、聚矽氧系有機無機混成樹脂、有機聚合物/生物奈米纖維混成樹脂等。又，作為不透明之樹脂，可例示：聚醯亞胺樹脂、氟樹脂、聚醯胺樹脂、芳族聚醯胺樹脂、聚醚醚酮樹脂、聚醚酮樹脂、各種液晶聚合物樹脂等。再者，樹脂基板可為於表面形成保護層等功能層而成者。The type of the resin of the resin substrate is not particularly limited. As the transparent resin, polyethylene terephthalate resin, polycarbonate resin, transparent fluororesin, transparent polyimide resin, polyether oxime resin, polyethylene naphthalate resin, polyacrylic acid can be exemplified A resin, a cycloolefin resin, a polyfluorene oxide resin, a polyfluorene-based organic-inorganic hybrid resin, an organic polymer/bio-nanofiber blend resin, or the like. Further, examples of the opaque resin include a polyimide resin, a fluororesin, a polyamide resin, an aromatic polyamide resin, a polyether ether ketone resin, a polyether ketone resin, and various liquid crystal polymer resins. Further, the resin substrate may be formed by forming a functional layer such as a protective layer on the surface.

(支撐板)(support plate)

支撐板12係支撐並補強器件基板11，於器件之製造步驟中防止器件基板11之變形、損傷、破損等。又，於使用較先前厚度更薄之器件基板11之情形時，藉由形成與先前之器件基板相同厚度之積層體塊10，可於器件之製造步驟中使用適合於先前厚度之器件基板之製造技術或製造設備，亦為使用支撐板12之目的之一。The support plate 12 supports and reinforces the device substrate 11, and prevents deformation, damage, breakage, and the like of the device substrate 11 in the manufacturing process of the device. Moreover, in the case of using the device substrate 11 which is thinner than the previous thickness, by forming the laminated body block 10 having the same thickness as the previous device substrate, the fabrication of the device substrate suitable for the previous thickness can be used in the manufacturing steps of the device. Technical or manufacturing equipment is also one of the purposes of using the support plate 12.

支撐板12之厚度可較器件基板11更厚，亦可更薄。較佳為基於器件基板11之厚度、樹脂層13之厚度、及積層體塊10之厚度而選擇支撐板12之厚度。例如，於現有器件之製造步驟係經設計為對厚度0.5 mm之基板進行處理者，且器件基板11之厚度與樹脂層13之厚度之和為0.1 mm之情形時，將支撐板12之厚度設為0.4 mm。於支撐板12為玻璃板之情形時，就容易操作、難以斷裂等原因而言，玻璃板之厚度較佳為0.08 mm以上。The thickness of the support plate 12 can be thicker than the device substrate 11, or can be thinner. The thickness of the support plate 12 is preferably selected based on the thickness of the device substrate 11, the thickness of the resin layer 13, and the thickness of the laminated body block 10. For example, when the manufacturing process of the prior art device is designed to process a substrate having a thickness of 0.5 mm, and the sum of the thickness of the device substrate 11 and the thickness of the resin layer 13 is 0.1 mm, the thickness of the support plate 12 is set. It is 0.4 mm. In the case where the support plate 12 is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more for reasons of easy handling, difficulty in breaking, and the like.

支撐板12之種類可為一般者，例如可為玻璃板、樹脂板、金屬板等。於器件之製造步驟伴隨熱處理之情形時，支撐板12較佳為以與器件基板11之線膨脹係數之差小之材料形成，更佳為以與器件基板11相同之材料形成。The type of the support plate 12 may be a general one, and may be, for example, a glass plate, a resin plate, a metal plate, or the like. In the case where the manufacturing steps of the device are accompanied by heat treatment, the support plate 12 is preferably formed of a material having a small difference in linear expansion coefficient from the device substrate 11, and more preferably formed of the same material as the device substrate 11.

器件基板11與支撐板12之25~300℃下之平均線膨脹係數(以下僅稱為「平均線膨脹係數」)之差較佳為700×10-7 /℃以下，更佳為500×10-7 /℃以下，進而較佳為300×10-7 /℃以下。若差過大，則於器件之製造步驟之加熱冷卻時，有積層體塊10激烈翹曲，或器件基板11與支撐板12剝離之可能性。於器件基板11之材料與支撐板12之材料相同之情形時，無產生上述問題之虞。The difference between the average linear expansion coefficient (hereinafter simply referred to as "average linear expansion coefficient") of the device substrate 11 and the support plate 12 at 25 to 300 ° C is preferably 700 × 10 -7 / ° C or less, more preferably 500 × 10 -7 / ° C or less, further preferably 300 × 10 -7 / ° C or less. If the difference is too large, there is a possibility that the laminated body block 10 is warped or the device substrate 11 is peeled off from the support plate 12 during heating and cooling of the manufacturing steps of the device. When the material of the device substrate 11 is the same as the material of the support plate 12, there is no such problem.

(樹脂層)(resin layer)

樹脂層13係固定於支撐板12上，又，以可剝離之方式密著於器件基板11之第1主面111。樹脂層13不僅防止器件基板11之位置偏移直至進行剝離操作為止，並且藉由剝離操作而自器件基板11上容易剝離，防止器件基板11等由於剝離操作而破損。The resin layer 13 is fixed to the support plate 12, and is detachably adhered to the first main surface 111 of the device substrate 11. The resin layer 13 not only prevents the position of the device substrate 11 from shifting until the peeling operation is performed, but also easily peels off from the device substrate 11 by the peeling operation, thereby preventing the device substrate 11 and the like from being damaged by the peeling operation.

樹脂層13之表面較佳為利用並非由一般之黏著劑所具有之黏著力，而是由固體分子間之凡得瓦力引起之力，而貼附於器件基板11之第1主面111。其原因在於容易剝離。本發明中，將該樹脂層表面之可容易剝離之性質稱為剝離性。The surface of the resin layer 13 is preferably attached to the first main surface 111 of the device substrate 11 by a force which is not caused by a general adhesive, but is caused by a vanaural force between solid molecules. The reason is that it is easy to peel off. In the present invention, the property of easily peeling off the surface of the resin layer is referred to as peelability.

另一方面，樹脂層13對支撐板12之表面之結合力較樹脂層13對器件基板11之第1主面111之結合力相對更高。本發明中，將樹脂層13表面對器件基板11表面之結合稱為密著，且將對支撐板12表面之結合稱為固定。On the other hand, the bonding force of the resin layer 13 to the surface of the support plate 12 is relatively higher than the bonding force of the resin layer 13 to the first main surface 111 of the device substrate 11. In the present invention, the bonding of the surface of the resin layer 13 to the surface of the device substrate 11 is referred to as adhesion, and the bonding to the surface of the support plate 12 is referred to as fixation.

樹脂層13之厚度並無特別限定，較佳為5~50μm，更佳為5~30μm，進而較佳為7~20μm。其原因在於，若樹脂層13之厚度為上述範圍，則樹脂層13與器件基板11之密著變得充分。又，原因在於，即便樹脂層13與器件基板11之間介隔存在氣泡或異物，亦可抑制器件基板11之應變缺陷之產生。又，若樹脂層13之厚度過厚，則形成需要時間及材料，因此並不經濟。The thickness of the resin layer 13 is not particularly limited, but is preferably 5 to 50 μm, more preferably 5 to 30 μm, still more preferably 7 to 20 μm. The reason for this is that when the thickness of the resin layer 13 is in the above range, the adhesion between the resin layer 13 and the device substrate 11 is sufficient. Moreover, even if air bubbles or foreign matter are interposed between the resin layer 13 and the device substrate 11, the occurrence of strain defects of the device substrate 11 can be suppressed. Further, if the thickness of the resin layer 13 is too thick, it takes time and material to form, which is not economical.

再者，樹脂層13可包含2層以上。此時「樹脂層之厚度」係表示所有樹脂層之合計厚度。Further, the resin layer 13 may include two or more layers. The "thickness of the resin layer" at this time means the total thickness of all the resin layers.

又，於樹脂層13包含2層以上之情形時，形成各層之樹脂之種類可不同。Moreover, when the resin layer 13 contains two or more layers, the kind of the resin which forms each layer may differ.

樹脂層13之表面張力較佳為30mN/m以下，更佳為25mN/m以下，進而較佳為22mN/m以下。又，較佳為15mN/m以上。其原因在於，若為上述範圍之表面張力，則可更容易與器件基板11剝離，同時與器件基板11之密著亦 變得充分。The surface tension of the resin layer 13 is preferably 30 mN/m or less, more preferably 25 mN/m or less, still more preferably 22 mN/m or less. Further, it is preferably 15 mN/m or more. The reason for this is that if the surface tension is in the above range, the device substrate 11 can be more easily peeled off, and the device substrate 11 is also closely adhered thereto. Become full.

表面張力係以如下方式測定。首先，對樹脂層13使用表面張力已知之複數種液體，測定20℃下之各液體之接觸角。繼而，將各液體之表面張力與接觸角(cosθ)繪圖，近似直線，外推出cosθ=1之表面張力值，求出樹脂層13之臨界表面張力。將該臨界表面張力作為樹脂層13之表面張力。The surface tension was measured in the following manner. First, a plurality of liquids having a known surface tension were used for the resin layer 13, and the contact angle of each liquid at 20 ° C was measured. Then, the surface tension of each liquid and the contact angle (cos θ) were plotted to approximate a straight line, and the surface tension value of cos θ = 1 was pushed out to determine the critical surface tension of the resin layer 13. This critical surface tension is taken as the surface tension of the resin layer 13.

樹脂層13較佳為包含玻璃轉移點較室溫(25℃左右)更低或者不具有玻璃轉移點之材料。成為非黏著性之樹脂層，可容易與器件基板11剝離，同時與器件基板11之密著亦變得充分。The resin layer 13 preferably contains a material having a glass transition point lower than room temperature (about 25 ° C) or having no glass transition point. The non-adhesive resin layer can be easily peeled off from the device substrate 11, and the adhesion to the device substrate 11 is also sufficient.

又，樹脂層13由於在器件之製造步驟中經加熱處理之情況多，故較佳為具有耐熱性。Further, since the resin layer 13 is often subjected to heat treatment in the manufacturing process of the device, it is preferably heat-resistant.

又，若樹脂層13之彈性模數過高，則存在與器件基板11之密著性變低之傾向。另一方面，若樹脂層13之彈性模數過低，則存在剝離性變低之傾向。Moreover, when the elastic modulus of the resin layer 13 is too high, the adhesion to the device substrate 11 tends to be low. On the other hand, when the elastic modulus of the resin layer 13 is too low, the peeling property tends to be low.

形成樹脂層13之樹脂之種類並無特別限定。例如可列舉丙烯酸系樹脂、聚烯烴樹脂、聚胺基甲酸酯樹脂及聚矽氧樹脂。該等樹脂可單獨使用，亦可將若干種類之樹脂混合使用。其中較佳為聚矽氧樹脂。其原因在於，聚矽氧樹脂之耐熱性或剝離性優異。又，原因在於，於支撐板12為玻璃板之情形時，藉由與表面之矽烷醇基之縮合反應，容易固定於支撐板12上。聚矽氧樹脂層就例如於300~400℃左右下處理1小時左右，剝離性亦基本不劣化之方面而言亦較佳。The type of the resin forming the resin layer 13 is not particularly limited. For example, an acrylic resin, a polyolefin resin, a polyurethane resin, and a polyoxyl resin can be mentioned. These resins may be used singly or in combination of several types of resins. Among them, a polyoxyxylene resin is preferred. The reason for this is that the polyoxymethylene resin is excellent in heat resistance or peelability. Further, the reason is that when the support plate 12 is a glass plate, it is easily fixed to the support plate 12 by a condensation reaction with a stanol group on the surface. The polyoxyxene resin layer is preferably treated at about 300 to 400 ° C for about 1 hour, and is also preferably not deteriorated in terms of peelability.

樹脂層13較佳為包含聚矽氧樹脂中用於剝離紙用途之聚矽氧樹脂(硬化物)。使成為剝離紙用聚矽氧樹脂之硬化性樹脂組成物於支撐板12之表面硬化而形成之樹脂層13由於具有優異之剝離性而較佳。又，由於柔軟性高，故即便在樹脂層13與器件基板11之間混入氣泡或塵埃等異物，亦可抑制器件基板11之應變缺陷之產生。The resin layer 13 is preferably a polyoxyxylene resin (hardened product) for use in a release paper in a polyoxyxylene resin. The resin layer 13 which is formed by curing the surface of the support sheet 12 as a curable resin composition of a polyoxyl resin for release paper is preferable because it has excellent releasability. Moreover, since the flexibility is high, even if foreign matter such as bubbles or dust is mixed between the resin layer 13 and the device substrate 11, the occurrence of strain defects of the device substrate 11 can be suppressed.

此種成為剝離紙用聚矽氧樹脂之硬化性聚矽氧係根據其硬化機制而分類為縮合反應型聚矽氧、加成反應型聚矽氧、紫外線硬化型聚矽氧及電子束硬化型聚矽氧，均可使用。該等之中較佳為加成反應型聚矽氧。其原因在於，硬化反應之容易度，形成樹脂層13時剝離性之程度良好，耐熱性亦高。The curable polyanthracene which is a polyoxyxylene resin for release paper is classified into a condensation reaction type polyoxane, an addition reaction type polyoxane, an ultraviolet curing type polyfluorene oxygen, and an electron beam curing type according to the curing mechanism. Polyoxane can be used. Among these, an addition reaction type polyoxane is preferred. The reason for this is that the ease of the curing reaction is good when the resin layer 13 is formed, and the heat resistance is also high.

加成反應型聚矽氧係由具有乙烯基等不飽和基之有機烯基聚矽氧烷、具有鍵結於矽原子之氫原子的有機氫化聚矽氧烷與鉑系觸媒等觸媒之組合而獲得之硬化性樹脂組成物，係於常溫下或者藉由加熱而硬化成為經硬化之聚矽氧樹脂者。The addition reaction type polyoxo group is an organic alkenyl polyoxyalkylene having an unsaturated group such as a vinyl group, an organic hydrogenated polyoxyalkylene having a hydrogen atom bonded to a halogen atom, and a catalyst such as a platinum-based catalyst. The curable resin composition obtained by combination is cured at room temperature or by heating to a hardened polyoxynene resin.

又，成為剝離紙用聚矽氧樹脂之硬化性聚矽氧就形態方面而言具有溶劑型、乳液型及無溶劑型，任一種類型均可使用。該等之中較佳為無溶劑型。其原因在於，生產性、安全性、環境特性之方面優異。又，由於不包含形成樹脂層13時之硬化時，即加熱硬化、紫外線硬化或者電子束硬化時產生發泡之溶劑，故樹脂層13中不易殘留氣泡。Further, the curable polyfluorene which is a polyoxyxylene resin for release paper has a solvent type, an emulsion type, and a solventless type in terms of form, and any of them can be used. Among these, it is preferably a solventless type. The reason is that it is excellent in terms of productivity, safety, and environmental characteristics. Further, since the solvent which is formed when the resin layer 13 is formed, that is, the heat curing, the ultraviolet curing, or the electron beam curing, is not included, bubbles are less likely to remain in the resin layer 13.

又，作為成為剝離紙用聚矽氧樹脂之硬化性聚矽氧，具體而言，作為市售之商品名或者型號，可列舉KNS-320A、KS-847(均為Shin-Etsu Silicone公司製造)、TPR6700(GE Toshiba Silicone公司製造)、乙烯基聚矽氧「8500」(荒川化學工業股份有限公司製造)與甲基氫化聚矽氧烷「12031」(荒川化學工業股份有限公司製造)之組合、乙烯基聚矽氧「11364」(荒川化學工業股份有限公司製造)與甲基氫化聚矽氧烷「12031」(荒川化學工業股份有限公司製造)之組合、乙烯基聚矽氧「11365」(荒川化學工業股份有限公司製造)與甲基氫化聚矽氧烷「12031」(荒川化學工業股份有限公司製造)之組合等。In addition, as a commercially available product name or model, KNS-320A and KS-847 (all manufactured by Shin-Etsu Silicone Co., Ltd.) are exemplified as the curable polyfluorene oxide which is a polyoxyl resin for a release paper. a combination of TPR6700 (manufactured by GE Toshiba Silicone Co., Ltd.), vinyl polyoxylium "8500" (manufactured by Arakawa Chemical Industries Co., Ltd.), and methyl hydrogenated polyoxyalkylene "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.). Vinyl polyoxylium "11364" (manufactured by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogenated polyoxyalkylene "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.), vinyl polyoxylium "11365" (Arakawa) A combination of methyl hydride polyoxane "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.) and the like.

再者，KNS-320A、KS-847及TPR6700係預先含有主劑及交聯劑之硬化性聚矽氧。Further, KNS-320A, KS-847, and TPR6700 are hardened polyfluorene oxygen containing a main component and a crosslinking agent in advance.

又，形成樹脂層13之聚矽氧樹脂較佳為具有聚矽氧樹脂層中之成分難以轉移至器件基板11之性質，即低聚矽氧轉移性。Further, the polyfluorene oxide resin forming the resin layer 13 preferably has a property that it is difficult to transfer the components in the polyoxynitride resin layer to the device substrate 11, that is, oligomeric oxygen transfer property.

(固定方法)(fixed method)

將樹脂層13固定於支撐板12上之方法並無特別限定，例如可列舉將膜狀之樹脂固定於支撐板12之表面之方法。具體而言可列舉如下方法：為了對支撐板12之表面賦予對膜表面之高固定力(高剝離強度)，而對支撐板12之表面進行表面改質處理(底塗處理)，以固定於支撐板12上。例如可例示：使如矽烷偶合劑般以化學方式提高固定力之化學方法(底塗處理)、如火焰(flame)處理般使表面活性基增加之物理方法、如噴砂處理般藉由使表面之粗糙度增加而增加勾掛之機械性處理方法等。The method of fixing the resin layer 13 to the support plate 12 is not particularly limited, and for example, a method of fixing the film-like resin to the surface of the support plate 12 is exemplified. Specifically, in order to impart a high fixing force (high peel strength) to the surface of the support plate 12 to the surface of the support plate 12, the surface of the support plate 12 is subjected to surface modification treatment (primer treatment) to be fixed to Support plate 12 is provided. For example, a chemical method (primer treatment) which chemically increases the fixing force like a decane coupling agent, a physical method of increasing a surface active group such as a flame treatment, such as a sandblasting treatment can be exemplified by a surface treatment The roughness is increased to increase the mechanical treatment method of the hooking.

又，例如可列舉將成為樹脂層13之硬化性樹脂組成物塗佈於支撐板12上之方法。作為塗佈之方法，可列舉噴塗法、模塗法、旋塗法、浸塗法、輥塗法、棒塗法、絲網印刷法、凹版塗佈法等。自上述方法之中，可根據樹脂組成物之種類而適當選擇。Moreover, the method of apply|coating the hardening resin composition which becomes the resin layer 13 on the support board 12 is mentioned, for example. Examples of the coating method include a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, and a gravure coating method. Among the above methods, it can be appropriately selected depending on the kind of the resin composition.

又，於將成為樹脂層13之硬化性樹脂組成物塗佈於支撐板12上之情形時，其塗佈量較佳為1~100 g/m2 ，更佳為5~20 g/m2 。Further, when the curable resin composition which is the resin layer 13 is applied onto the support plate 12, the coating amount thereof is preferably from 1 to 100 g/m 2 , more preferably from 5 to 20 g/m 2 . .

例如於由加成反應型聚矽氧之硬化性樹脂組成物形成樹脂層13之情形時，係將包含烯基聚矽氧烷、有機氫化聚矽氧烷與觸媒之混合物的硬化性樹脂組成物，利用上述噴塗法等公知之方法塗佈於支撐板12上，其後使其加熱硬化。加熱硬化條件根據觸媒之調配量而有所不同，例如於相對於烯基聚矽氧烷與有機氫化聚矽氧烷之合計量100質量份，調配鉑系觸媒2質量份之情形時，係於大氣中50℃~250℃、較佳為100℃~200℃下反應。又，此時之反應時間為5~60分鐘，較佳為10~30分鐘。為形成具有低聚矽氧轉移性之聚矽氧樹脂層，較佳為儘可能進行硬化反應，以使聚矽氧樹脂層中不殘留未反應之聚矽氧成分。若為如上所述之反應溫度及反應時間，則可使聚矽氧樹脂層中基本不殘留未反應之聚矽氧成分，故較佳。於較上述反應時間過長，或反應溫度過高之情形時，有同時產生聚矽氧樹脂之氧化分解，生成低分子量之聚矽氧成分，聚矽氧轉移性變高之可能性。為使加熱處理後之剝離性良好，亦較佳為儘可能進行硬化反應，以使聚矽氧樹脂層中不殘留未反應之聚矽氧成分。For example, in the case where the resin layer 13 is formed of a curable resin composition of an addition reaction type polyoxymethylene, a curable resin comprising a mixture of an alkenyl polysiloxane, an organic hydrogenated polyoxyalkylene and a catalyst is used. The object is applied onto the support plate 12 by a known method such as the above-described spraying method, and then heat-hardened. The heat-hardening condition is different depending on the amount of the catalyst to be mixed. For example, when the platinum-based catalyst is blended in an amount of 2 parts by mass based on 100 parts by mass of the total of the alkenyl polysiloxane and the organic hydrogenated polyoxyalkylene, It is reacted in the atmosphere at 50 ° C to 250 ° C, preferably at 100 ° C to 200 ° C. Further, the reaction time at this time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to form the polyoxynoxy resin layer having an oligomeric oxime oxygen transfer property, it is preferred to carry out a hardening reaction as much as possible so that no unreacted polyfluorene oxide component remains in the polyoxynoxy resin layer. If the reaction temperature and the reaction time are as described above, it is preferable that substantially no unreacted polyfluorene oxide component remains in the polyoxynated resin layer. When the reaction time is too long or the reaction temperature is too high, oxidative decomposition of the polyfluorene oxide resin is simultaneously generated to form a low molecular weight polyfluorene oxygen component, and the polyoxane oxygen transfer property is likely to be high. In order to improve the peeling property after the heat treatment, it is also preferred to carry out the hardening reaction as much as possible so that the unreacted polyfluorene oxide component does not remain in the polyoxynitride resin layer.

又，例如於使用成為剝離紙用聚矽氧樹脂之硬化性樹脂組成物製造樹脂層13之情形時，將塗佈於支撐板12上之硬化性樹脂組成物加熱硬化而形成聚矽氧樹脂層。藉由使硬化性樹脂組成物加熱硬化，則於硬化反應時聚矽氧樹脂與支撐板12化學性結合。又，藉由增黏效果，聚矽氧樹脂層與支撐板12結合。藉由該等作用，聚矽氧樹脂層牢固地固定於支撐板12上。In the case where the resin layer 13 is produced by using a curable resin composition which is a polyoxyxylene resin for release paper, the curable resin composition applied to the support sheet 12 is heat-cured to form a polyoxymethylene resin layer. . By heat-hardening the curable resin composition, the polyoxymethylene resin is chemically bonded to the support plate 12 at the time of the hardening reaction. Further, the polyoxyphthalocene resin layer is bonded to the support plate 12 by the tackifying effect. By these effects, the polyoxyphthalide resin layer is firmly fixed to the support plate 12.

(密著方法)(closed method)

使形成於支撐體上之樹脂層13以可剝離之方式密著於器件基板11上之方法可為公知之方法。例如可列舉如下方法：於常壓環境下在樹脂層13之剝離性表面重疊器件基板11後，使用輥或加壓機使樹脂層13與器件基板11壓接。藉由以輥或加壓機進行壓接，樹脂層13與器件基板11進一步密著，故較佳。又，藉由輥或加壓機之壓接，混入至樹脂層13與器件基板11之間的氣泡比較容易去除，故較佳。The method of adhering the resin layer 13 formed on the support to the device substrate 11 in a peelable manner can be a known method. For example, a method in which the resin substrate 13 and the device substrate 11 are pressure-bonded by a roll or a press machine after the device substrate 11 is superposed on the peeling surface of the resin layer 13 in a normal pressure environment may be mentioned. The resin layer 13 is further adhered to the device substrate 11 by pressure bonding by a roll or a press, which is preferable. Further, it is preferable that the air bubbles mixed between the resin layer 13 and the device substrate 11 are relatively easily removed by pressure bonding by a roll or a press machine.

若將形成於支撐體上之樹脂層13與器件基板11利用真空層壓法或真空加壓法進行壓接，則更佳地抑制氣泡之混入或確保良好之密著，故更佳。藉由在真空下壓接，即便於微小氣泡殘存之情形時，亦無藉由加熱而氣泡成長之情況，具有難以牽涉到器件基板11之應變缺陷的優點。When the resin layer 13 formed on the support and the device substrate 11 are pressure-bonded by a vacuum lamination method or a vacuum press method, it is more preferable to suppress the incorporation of air bubbles or to ensure good adhesion. By crimping under vacuum, even when fine bubbles remain, there is no case where bubbles grow by heating, and there is an advantage that it is difficult to involve strain defects of the device substrate 11.

當使樹脂層13以可剝離之方式密著於器件基板11上時，較佳為將樹脂層13及器件基板11之相互接觸之側之面充分清洗，於潔淨度高之環境中積層。即便在樹脂層13與器件基板11之間混入異物，亦無由於樹脂層13變形而對器件基板11之表面之平坦性造成影響之情況，潔淨度越高，其平坦性越變得良好，故較佳。When the resin layer 13 is detachably adhered to the device substrate 11, it is preferable to sufficiently clean the surface of the resin layer 13 and the device substrate 11 on the side in contact with each other, and to laminate the layer in an environment having high cleanliness. Even if foreign matter is mixed between the resin layer 13 and the device substrate 11, the flatness of the surface of the device substrate 11 is not affected by the deformation of the resin layer 13, and the higher the cleanliness, the better the flatness is. Preferably.

再者，對將樹脂層13固定於支撐板12上之步驟、使樹脂層13以可剝離之方式密著於器件基板11上之步驟之順序並無限制，例如可為大致同時。Further, the order of the step of fixing the resin layer 13 to the support plate 12 and the step of adhering the resin layer 13 to the device substrate 11 in a peelable manner is not limited, and may be, for example, substantially simultaneous.

(積層體塊之切斷)(cutting of laminated body blocks)

於以上述方式獲得之積層體塊10之外周面14，有形成凹槽15之情況。例如，如圖2所示，於器件基板11或支撐板12為經倒角加工者之情形時，或於樹脂層13係將液狀之樹脂組成物塗佈於支撐板12上並加熱硬化而成者之情形時，由於器件基板11或支撐板12、樹脂層13之外周面帶有圓形，故導致於積層體塊10之外周面14形成凹槽15。In the outer peripheral surface 14 of the laminated body block 10 obtained in the above manner, there is a case where the groove 15 is formed. For example, as shown in FIG. 2, when the device substrate 11 or the support plate 12 is a chamfered processor, or the resin layer 13 is applied with a liquid resin composition on the support plate 12 and heat-hardened. In the case of the case, since the peripheral surface of the device substrate 11 or the support plate 12 and the resin layer 13 has a circular shape, the groove 15 is formed on the outer peripheral surface 14 of the laminated body block 10.

本實施形態中，如圖1所示，積層體之製造方法包括如下步驟：將積層體塊切斷為預定尺寸，使積層體塊之外周面之至少圓周方向一部分平面化(步驟S11)。更詳細而言，將積層體塊切斷為預定尺寸，去除積層體塊之外周部之至少圓周方向一部分(較佳為圓周方向全周)，使積層體塊之外周面之至少圓周方向一部分(較佳為圓周方向全周)平面化。In the present embodiment, as shown in FIG. 1, the method for manufacturing a laminated body includes the steps of cutting a laminated body block into a predetermined size, and planarizing at least a part of the circumferential direction of the outer peripheral surface of the laminated body block (step S11). More specifically, the laminated body block is cut into a predetermined size, and at least a part of the circumferential direction of the outer peripheral portion of the laminated body block (preferably, the entire circumference in the circumferential direction) is removed, so that at least a part of the circumferential direction of the outer peripheral surface of the laminated body block is made ( It is preferably planarized in the circumferential direction.

將積層體塊10切斷之方法可為一般方法。例如可列舉：以刃具切斷之方法；以雷射等高能量線熔斷之法；使用刃具或雷射等於器件基板及支撐板中之至少一板狀物之主面形成劃線，沿劃線割斷之方法等。該等切斷方法可單獨或組合使用。如上所述，所謂切斷，包括熔斷或割斷。The method of cutting the laminated body block 10 can be a general method. For example, a method of cutting with a cutting tool; a method of fusing a high energy line such as a laser; and using a cutting tool or a laser equal to a main surface of at least one of the device substrate and the support plate to form a scribe line, along the scribe line The method of cutting, etc. These cutting methods can be used singly or in combination. As described above, the cutting, including blowing or cutting.

切斷方法可根據器件基板11、支撐板12、樹脂層13之種類或厚度等而適當選擇。例如，於器件基板11或支撐板12包含玻璃之情形時，較佳為於玻璃之主面形成劃線，其後，將積層體塊10彎曲變形而沿劃線割斷之方法。又，於器件基板11及支撐板12包含玻璃之情形時，較佳為於兩者之玻璃之主面形成劃線，其後，將積層體塊10彎曲變形而沿兩者之劃線割斷之方法。於割斷之情形時，較佳為樹脂層13之厚度為50 μm以下。若樹脂層13過厚，則割斷變得困難。The cutting method can be appropriately selected depending on the type, thickness, and the like of the device substrate 11, the support plate 12, and the resin layer 13. For example, when the device substrate 11 or the support plate 12 contains glass, it is preferable to form a scribe line on the main surface of the glass, and thereafter, the laminated body block 10 is bent and deformed to be cut along the scribe line. Further, in the case where the device substrate 11 and the support plate 12 include glass, it is preferable to form a scribe line on the main surface of both of the glass, and thereafter, the laminated body block 10 is bent and deformed, and the scribe line is cut along the two lines. method. In the case of cutting, the thickness of the resin layer 13 is preferably 50 μm or less. If the resin layer 13 is too thick, cutting becomes difficult.

切斷方向可為自器件基板11朝向支撐板12之方向，亦可為自支撐板12朝向器件基板11之方向。又，切斷方向可為一方向，亦可為兩方向。進而，切斷方向較佳為與積層體塊之厚度方向(即樹脂層之厚度方向)大致平行。其原因在於，可減小樹脂層13之露出面積，可抑制器件製造步驟中之加熱處理所引起之樹脂層13之劣化。The cutting direction may be from the direction of the device substrate 11 toward the support plate 12 or the direction from the support plate 12 toward the device substrate 11. Moreover, the cutting direction may be one direction or two directions. Further, the cutting direction is preferably substantially parallel to the thickness direction of the laminated body block (that is, the thickness direction of the resin layer). This is because the exposed area of the resin layer 13 can be made small, and deterioration of the resin layer 13 caused by the heat treatment in the device manufacturing step can be suppressed.

圖3係本發明之第1實施形態中之外周面平面化後之積層體塊之部分側面圖。圖3之積層體塊10A係沿圖2之A-A'線將積層體塊10切斷而成者。平面化後之器件基板11A、支撐板12A、樹脂層13A分別對應於平面化前之器件基板11、支撐板12、樹脂層13。Fig. 3 is a partial side elevational view showing a laminated body block in which the outer peripheral surface is planarized in the first embodiment of the present invention. The laminated body block 10A of Fig. 3 is obtained by cutting the laminated body block 10 along the line A-A' of Fig. 2 . The planarized device substrate 11A, the support plate 12A, and the resin layer 13A correspond to the device substrate 11, the support plate 12, and the resin layer 13 before planarization, respectively.

平面化後之積層體塊10A係於器件基板11A與支撐板12A之間***有樹脂層13A者。樹脂層13A係以可剝離之方式密著於器件基板11A之第1主面111A，並且固定於支撐板12A上。再者，於器件基板11A之第2主面112A形成器件用構件，詳情如後述。The laminated body block 10A after planarization is a resin layer 13A interposed between the device substrate 11A and the support plate 12A. The resin layer 13A is detachably adhered to the first main surface 111A of the device substrate 11A, and is fixed to the support plate 12A. Further, a device member is formed on the second main surface 112A of the device substrate 11A, and details will be described later.

平面化後之積層體塊10A之外周面14A係如圖3所示，成為平面，凹槽15(參照圖2)經去除。The outer peripheral surface 14A of the laminated body block 10A after planarization is a flat surface as shown in FIG. 3, and the groove 15 (refer to FIG. 2) is removed.

但，若存在上述凹槽15，則於器件之製造步驟中，抗蝕液等塗佈液藉由毛細管現象而浸入，容易積存。積存於凹槽15內之塗佈液即便藉由清洗亦難以去除，乾燥後容易殘留殘渣。該殘渣於器件製造步驟之加熱處理步驟中成為發塵源，因此發塵污染加熱處理步驟內，使作為製品之器件之良率下降。However, when the groove 15 is present, in the manufacturing process of the device, the coating liquid such as the resist liquid is immersed by the capillary phenomenon and is easily accumulated. The coating liquid accumulated in the groove 15 is difficult to remove even by washing, and the residue is likely to remain after drying. This residue becomes a dust source in the heat treatment step of the device manufacturing step, so that the dust-contaminated heat treatment step lowers the yield of the device as a product.

本實施形態中，由於凹槽15經去除，故於器件之製造步驟中，塗佈液之殘渣難以積存。因此，可於加熱處理步驟中抑制發塵，可抑制作為製品之器件之良率之下降。In the present embodiment, since the groove 15 is removed, it is difficult to accumulate the residue of the coating liquid in the manufacturing process of the device. Therefore, it is possible to suppress dust generation in the heat treatment step, and it is possible to suppress a decrease in the yield of the device as a product.

(積層體塊之倒角)(chamfer of laminated body block)

如圖1所示，積層體之製造方法更包括如下步驟：將積層體塊之外周面之經平面化之部分之角部倒角(步驟S12)。藉由倒角，可提高耐衝擊性、安全性。As shown in Fig. 1, the method of manufacturing a laminated body further includes the step of chamfering a corner portion of a flattened portion of the outer peripheral surface of the laminated body block (step S12). By chamfering, impact resistance and safety can be improved.

但，於使積層體塊之外周面平面化之前將積層體塊之角部倒角之情形時，若積層體塊之外周面存在凹槽，則有器件基板之端部或支撐板之端部撓曲而破損之情況。However, when the corner portion of the laminated body block is chamfered before the outer peripheral surface of the laminated body block is planarized, if there is a groove on the outer peripheral surface of the laminated body block, the end portion of the device substrate or the end portion of the support plate is present. Deflection and damage.

本實施形態中，由於在使積層體塊之外周面平面化之後將積層體塊之角部倒角，故凹槽經預先去除。因此，倒角時，可抑制器件基板之端部或支撐板之端部撓曲而破損。In the present embodiment, since the corners of the laminated body block are chamfered after the outer peripheral surface of the laminated body block is planarized, the grooves are removed in advance. Therefore, at the time of chamfering, it is possible to suppress the end portion of the device substrate or the end portion of the support plate from being bent and broken.

倒角方法可為一般方法。例如可列舉使用研磨機等倒角機之方法。倒角之種類可為如圖4所示將平面化後之角部110、120加工為平面之倒角，亦可為如圖5所示將平面化後之角部110、120加工為圓弧狀面之R倒角，亦可為如圖6所示將平面化後之角部110、120加工為平面與圓弧狀面之組合之倒角，並無特別限定。又，可為削除樹脂層之倒角，亦可為不削除樹脂層之倒角。The chamfering method can be a general method. For example, a method of using a chamfering machine such as a grinder can be cited. The type of the chamfer may be a chamfer of the planarized corner portions 110, 120 as shown in FIG. 4, or the planarized corner portions 110, 120 may be processed into an arc as shown in FIG. 5. The R chamfer of the surface may be a chamfer which is formed by processing the planarized corner portions 110 and 120 into a combination of a flat surface and an arcuate surface as shown in FIG. 6 , and is not particularly limited. Further, the chamfering of the resin layer may be removed, or the chamfering of the resin layer may not be removed.

倒角尺寸係根據器件基板、支撐板、樹脂層之種類或厚度等而適當選擇。於R倒角之情形時，器件基板側之曲率半徑R1與支撐板側之曲率半徑R2可相同，亦可不同。於將角部加工為平面之情形時，器件基板側之倒角角度θ1與支撐板側之倒角角度θ2可相同，亦可不同。The chamfer size is appropriately selected depending on the type, thickness, and the like of the device substrate, the support plate, and the resin layer. In the case of R chamfering, the radius of curvature R1 on the device substrate side and the radius of curvature R2 on the support plate side may be the same or different. When the corner portion is processed into a flat surface, the chamfer angle θ1 on the device substrate side and the chamfer angle θ2 on the support plate side may be the same or different.

倒角後，較佳為樹脂層之外周面之經平面化之部分變得與樹脂層之厚度方向大致平行。藉此，可減小樹脂層之露出面積。After chamfering, it is preferred that the planarized portion of the outer peripheral surface of the resin layer is substantially parallel to the thickness direction of the resin layer. Thereby, the exposed area of the resin layer can be reduced.

若樹脂層之露出面積大，則藉由器件之製造步驟中之加熱處理，樹脂層變得容易劣化。When the exposed area of the resin layer is large, the resin layer is easily deteriorated by the heat treatment in the manufacturing process of the device.

本實施形態中，由於可減小樹脂層之露出面積，故於器件之製造步驟中，可抑制樹脂層之劣化。In the present embodiment, since the exposed area of the resin layer can be made small, deterioration of the resin layer can be suppressed in the manufacturing process of the device.

圖7係本發明之第1實施形態中之倒角後之積層體塊之部分側面圖。圖7中，將倒角前之積層體塊之形狀以虛線表示。圖7之積層體塊10B係將圖3之積層體塊10A之切斷面之兩角部進行R倒角而成者。倒角後之器件基板11B、支撐板12B、樹脂層13B分別對應於倒角前之器件基板11A、支撐板12A、樹脂層13A。Fig. 7 is a partial side elevational view showing the laminated body block after chamfering in the first embodiment of the present invention. In Fig. 7, the shape of the laminated body block before chamfering is indicated by a broken line. The laminated body block 10B of Fig. 7 is obtained by chamfering the two corners of the cut surface of the laminated body block 10A of Fig. 3 by R. The chamfered device substrate 11B, the support plate 12B, and the resin layer 13B correspond to the device substrate 11A, the support plate 12A, and the resin layer 13A before chamfering, respectively.

倒角後之積層體塊10B係於器件基板11B與支撐板12B之間***有樹脂層13B者。樹脂層13B係以可剝離之方式密著於器件基板11B之第1主面111B，並且固定於支撐板12B上。The laminated body block 10B after chamfering is a resin layer 13B interposed between the device substrate 11B and the support plate 12B. The resin layer 13B is detachably adhered to the first main surface 111B of the device substrate 11B, and is fixed to the support plate 12B.

倒角後之積層體塊10B係如圖7所示，外周面14B帶有圓形，因此耐衝擊性或安全性優異。As shown in FIG. 7, the laminated body block 10B after chamfering has a circular shape on the outer peripheral surface 14B, and therefore is excellent in impact resistance and safety.

倒角後之積層體塊10B如圖7所示，樹脂層13B之外周面134B變得與樹脂層13B之厚度方向(圖7中，箭頭A方向)大致平行，因此樹脂層13B之露出面積減小。因此，藉由器件之製造步驟中之加熱處理，可抑制樹脂層13B劣化。As shown in Fig. 7, the outer peripheral surface 134B of the resin layer 13B is substantially parallel to the thickness direction of the resin layer 13B (the direction of the arrow A in Fig. 7), so that the exposed area of the resin layer 13B is reduced. small. Therefore, deterioration of the resin layer 13B can be suppressed by the heat treatment in the manufacturing steps of the device.

(積層體塊之研磨)(grinding of laminated blocks)

如圖1所示，於器件基板為利用浮式法製造之玻璃基板之情形時，積層體之製造方法可更包括於倒角後(即平面化後)，研磨器件基板之第2主面之研磨步驟(步驟S13)。此處，利用浮式法製造之玻璃基板中包括利用再拉法，將利用浮式法製造之玻璃基板拉伸而使厚度進一步變薄之玻璃基板。As shown in FIG. 1 , when the device substrate is a glass substrate manufactured by a floating method, the method of manufacturing the laminated body may further include after the chamfering (ie, after planarization), polishing the second main surface of the device substrate. The grinding step (step S13). Here, the glass substrate manufactured by the floating method includes a glass substrate which is stretched by a floating method to further reduce the thickness by a re-drawing method.

浮式法係於浮浴內之熔融錫上流出熔融玻璃，使其於下向流方向流動而成形為帶板狀玻璃之方法。將帶板狀玻璃切斷而製造玻璃基板，但於玻璃基板表面產生微小之凹凸或起伏。The floating method is a method in which molten glass is discharged from molten tin in a floating bath to flow in a downward flow direction to form a plate-shaped glass. The glass substrate was produced by cutting the plate-shaped glass, but minute irregularities or undulations were generated on the surface of the glass substrate.

藉由上述研磨步驟中之研磨，可去除玻璃基板表面之微小凹凸或起伏，可提高形成器件用構件之面之平坦性。因此，可提高作為製品之器件之可靠性。該效果於玻璃基板之厚度為0.03~0.3 mm之情形時較為顯著。其原因在於，厚度0.03~0.3 mm之玻璃基板難以單獨研磨，難以於形成積層體塊之前預先研磨。By the polishing in the above polishing step, minute irregularities or undulations on the surface of the glass substrate can be removed, and the flatness of the surface on which the device member is formed can be improved. Therefore, the reliability of the device as a product can be improved. This effect is remarkable when the thickness of the glass substrate is 0.03 to 0.3 mm. This is because the glass substrate having a thickness of 0.03 to 0.3 mm is difficult to be polished alone, and it is difficult to perform pre-polishing before forming the laminated body block.

但，於平面化前研磨器件基板之第2主面之情形時，若於積層體塊之外周面存在凹槽，則有研磨劑進入凹槽中而未去除，或器件基板撓曲而破損之情況。又，即便在平面化後，於倒角前研磨器件基板之第2主面之情形時，器件基板之銳利角部亦容易破損。However, in the case where the second main surface of the device substrate is polished before planarization, if there is a groove on the peripheral surface of the laminated body block, the abrasive enters the groove without being removed, or the device substrate is deflected and broken. Happening. Further, even in the case where the second main surface of the device substrate is polished before chamfering after planarization, the sharp corners of the device substrate are easily broken.

本實施形態中，於倒角後(即平面化後)研磨器件基板之第2主面，因此器件基板之角部經預先倒角，且凹槽經預先去除。因此，研磨時可抑制研磨劑對凹槽之附著或器件基板破損。In the present embodiment, after the chamfering (that is, after planarization), the second main surface of the device substrate is polished, so that the corner portions of the device substrate are chamfered in advance, and the grooves are removed in advance. Therefore, adhesion of the abrasive to the groove or breakage of the device substrate can be suppressed during polishing.

研磨方法可為一般方法。例如可列舉使用氧化鈰等研磨粒之研磨方法。The grinding method can be a general method. For example, a polishing method using abrasive grains such as cerium oxide can be mentioned.

研磨裕度係根據器件基板之厚度或所使用之器件而適當設定，例如為0.05~10 μm。The polishing margin is appropriately set depending on the thickness of the device substrate or the device to be used, and is, for example, 0.05 to 10 μm.

圖8係本發明之第1實施形態中之研磨後之積層體塊之部分側面圖。圖8中，將研磨前之積層體塊之形狀以虛線表示。圖8之積層體塊10C係對圖7之積層體塊10B之器件基板11B之第2主面112B進行研磨而成者。研磨後之器件基板11C對應於研磨前之器件基板11B。Fig. 8 is a partial side elevational view showing the laminated body block after polishing in the first embodiment of the present invention. In Fig. 8, the shape of the laminated body block before polishing is indicated by a broken line. The laminated body block 10C of Fig. 8 is obtained by polishing the second main surface 112B of the device substrate 11B of the laminated body block 10B of Fig. 7 . The polished device substrate 11C corresponds to the device substrate 11B before polishing.

研磨後之積層體塊10C係於器件基板11C與支撐板12B之間***有樹脂層13B者。樹脂層13B係以可剝離之方式密著於器件基板11C之第1主面111C，並且固定於支撐板12B上。The laminated body block 10C after polishing is a resin layer 13B interposed between the device substrate 11C and the support plate 12B. The resin layer 13B is detachably adhered to the first main surface 111C of the device substrate 11C, and is fixed to the support plate 12B.

研磨後之積層體塊10C與研磨前之積層體塊10B相比，形成器件用構件之第2主面112C之平坦性、清潔度變高。The laminated body block 10C after polishing has higher flatness and cleanliness than the second main surface 112C of the device member than the laminated body block 10B before polishing.

(器件之製造方法)(Method of manufacturing the device)

圖9係表示本發明之第1實施形態中之器件之製造方法之步驟圖。Fig. 9 is a flow chart showing a method of manufacturing the device in the first embodiment of the present invention.

器件之製造方法包括如下步驟：：於平面化後之積層體塊(積層體)之器件基板之第2主面上使用塗佈液而形成器件用構件(步驟S61)；及將器件基板與樹脂層剝離(步驟S62)。此處，平面化後之積層體塊(積層體)當然包括倒角後之積層體塊(積層體)、研磨後之積層體塊(積層體)。The manufacturing method of the device includes the steps of: forming a device member using a coating liquid on a second main surface of a device substrate of a laminated body block (layered body) after planarization (step S61); and using the device substrate and the resin The layer is peeled off (step S62). Here, the laminated body block (layered body) after planarization naturally includes a laminated body block (layered body) after chamfering, and a laminated body block (stacked body) after polishing.

器件用構件係形成於器件基板之第2主面而構成器件之至少一部分之構件。器件用構件並非最終形成於器件基板之第2主面的構件之全部(以下稱為「全構件」)，亦可為全構件之一部分(以下稱為「部分構件」)。其原因在於，可將自樹脂層剝離之附部分構件之器件基板，於其後之步驟中製成附全構件之器件基板。進而其後，使用附全構件之器件基板製造器件。又，於自樹脂層剝離之附全構件之器件基板上，亦可於其剝離面(第1主面)上形成其他器件用構件。又，可使用附全構件之積層體組裝器件，其後，自附全構件之積層體上剝離附樹脂層之支撐板，以製造器件。進而，亦可使用2塊附全構件之積層體組裝器件，其後，自附全構件之積層體上剝離2塊附樹脂層之支撐板，以製造器件。The device component is formed on the second main surface of the device substrate to constitute at least a part of the device. The device member is not the entire member (hereinafter referred to as "all members") that is finally formed on the second main surface of the device substrate, and may be one part of the entire member (hereinafter referred to as "partial member"). The reason for this is that the device substrate with the part of the member peeled off from the resin layer can be formed into the device substrate with the full member in the subsequent step. Thereafter, the device is fabricated using a device substrate with all of the components. Further, on the device substrate with the entire member peeled off from the resin layer, other device members may be formed on the peeling surface (first main surface). Further, a laminated body assembly device with a full member may be used, and thereafter, a support plate with a resin layer is peeled off from the laminated body of the entire member to fabricate a device. Further, it is also possible to use two laminated body assembly members with full members, and thereafter, two support plates with resin layers are peeled off from the laminated body of the entire member to fabricate a device.

將器件基板與樹脂層剝離之方法可為公知之方法。例如，於器件基板與樹脂層之間刺入剝離刃，其後，向剝離刃之刺入位置吹附混合有壓縮空氣與水之流體。於該狀態下，將積層體之一主面保持平坦，且使另一主面自刺入位置附近起依序撓曲變形。如此，可將器件基板與樹脂層剝離。The method of peeling off the device substrate from the resin layer can be a well-known method. For example, a peeling blade is pierced between the device substrate and the resin layer, and thereafter, a fluid mixed with compressed air and water is blown to the piercing position of the peeling blade. In this state, one main surface of the laminated body is kept flat, and the other main surface is sequentially flexed and deformed from the vicinity of the piercing position. Thus, the device substrate can be peeled off from the resin layer.

圖10係本發明之第1實施形態中之LCD之製造方法之步驟圖。本實施形態中，對TFT-LCD之製造方法進行說明，亦可將本發明應用於STN(Super Twisted Neumatic，超扭轉相列)-LCD之製造方法，對液晶面板之種類或方式並無限制。Fig. 10 is a flow chart showing a method of manufacturing the LCD in the first embodiment of the present invention. In the present embodiment, a method of manufacturing a TFT-LCD will be described, and the present invention can also be applied to a method of manufacturing an STN (Super Twisted Neumatic)-LCD, and the type or manner of the liquid crystal panel is not limited.

TFT-LCD之製造方法包括如下步驟：於平面化後之積層體塊(積層體)之器件基板之第2主面上，使用抗蝕液，於利用CVD(Chemical Vapor Deposition，化學氣相沈積)法及濺鍍法等一般成膜法所形成之金屬膜及金屬氧化膜等上形成圖案而形成薄膜電晶體(TFT)(步驟S71)；於另一平面化後之積層體塊(積層體)之器件基板之第2主面上，將抗蝕液用於圖案形成而形成彩色濾光片(CF)(步驟S72)；將附TFT之器件基板、與附CF之器件基板積層(步驟S73)；以及將兩者器件基板與樹脂層剝離(步驟S74)。再者，對TFT形成步驟(步驟S71)、與CF形成步驟(步驟S72)之順序並無限制，可為大致同時。又，剝離步驟(步驟S74)可為積層步驟(步驟S73)之前，亦可為TFT形成步驟或CF形成步驟之中途。The manufacturing method of the TFT-LCD includes the steps of using a CVD (Chemical Vapor Deposition) on the second main surface of the device substrate of the laminated body block (layered body) after planarization. A thin film transistor (TFT) is formed by forming a pattern on a metal film or a metal oxide film formed by a general film formation method such as a sputtering method (step S71); and a layered body block (layered body) after another planarization On the second main surface of the device substrate, a resist liquid is used for pattern formation to form a color filter (CF) (step S72); and a TFT-attached device substrate is laminated with a CF-attached device substrate (step S73) And peeling off both of the device substrate and the resin layer (step S74). Further, the order of the TFT forming step (step S71) and the CF forming step (step S72) is not limited, and may be substantially simultaneous. Further, the peeling step (step S74) may be before the step of laminating (step S73), or may be halfway through the TFT forming step or the CF forming step.

於TFT形成步驟或CF形成步驟中，使用眾所周知之光微影技術或蝕刻技術等，於器件基板之第2主面上形成TFT或CF。此時，使用抗蝕液作為圖案形成用之塗佈液。In the TFT forming step or the CF forming step, TFT or CF is formed on the second main surface of the device substrate by using a well-known photolithography technique or etching technique. At this time, a resist liquid is used as a coating liquid for pattern formation.

再者，於形成TFT或CF之前，視需要，可清洗器件基板之第2主面。作為清洗方法，可使用眾所周知之乾式清洗或濕式清洗。Further, before forming the TFT or CF, the second main surface of the device substrate can be cleaned as needed. As the cleaning method, a well-known dry cleaning or wet cleaning can be used.

積層步驟中，於附TFT之積層體、與附CF之積層體之間注入液晶材料而積層。作為注入液晶材料之方法，例如有減壓注入法、滴加注入法。In the lamination step, a liquid crystal material is injected between the laminated body with the TFT and the laminated body with CF to laminate. As a method of injecting a liquid crystal material, for example, a pressure reduction injection method or a dropping injection method is available.

減壓注入法中，例如，首先使用密封材料及間隔材料，將兩積層體以存在TFT之面與存在CF之面相對向之方式貼合。繼而，自兩積層體上剝離2塊附樹脂層之支撐板。其後，將貼合之兩器件基板切斷為複數個單元。使所切斷之各單元之內部成為減壓環境後，自注入孔向各單元之內部注入液晶材料，密封注入孔。繼而，於各單元上貼附偏光板，組入背光源等，以製造液晶面板。In the vacuum injection method, for example, first, a sealing material and a spacer material are used, and the two laminated bodies are bonded to each other so that the surface on the surface of the TFT faces the surface on which CF exists. Then, two support plates with resin layers were peeled off from the two laminated bodies. Thereafter, the bonded two device substrates are cut into a plurality of units. After the inside of each unit to be cut is brought into a reduced pressure environment, a liquid crystal material is injected into the inside of each unit from the injection hole, and the injection hole is sealed. Then, a polarizing plate is attached to each unit, and a backlight or the like is incorporated to manufacture a liquid crystal panel.

再者，本實施形態中，自兩積層體上剝離2塊附樹脂層之支撐板，其後將貼合之兩器件基板切斷為複數個單元，但本發明並不限定於此。例如可於使用密封材料及間隔材料來貼合兩積層體之前，自各積層體上剝離附樹脂層之支撐板。Further, in the present embodiment, two support plates with resin layers are peeled off from the two laminated bodies, and then the two device substrates bonded together are cut into a plurality of units, but the present invention is not limited thereto. For example, the support plate with the resin layer may be peeled off from each of the laminates before the two laminates are bonded together using the sealing material and the spacer material.

滴加注入法中，例如首先於兩積層體中之任一者上滴加液晶材料，使用密封材料及間隔材料，將兩積層體以存在TFT之面與存在CF之面相對向之方式積層。繼而，自兩積層體上剝離2塊附樹脂層之支撐板。其後，將所積層之兩器件基板切斷為複數個單元。繼而，於各單元上貼附偏光板，組入背光源等，以製造液晶面板。In the dropwise addition method, for example, a liquid crystal material is first dropped on one of the two laminates, and the two laminates are laminated so that the surface of the TFT is opposed to the surface on which CF exists, using a sealing material and a spacer. Then, two support plates with resin layers were peeled off from the two laminated bodies. Thereafter, the two device substrates of the stacked layers are cut into a plurality of cells. Then, a polarizing plate is attached to each unit, and a backlight or the like is incorporated to manufacture a liquid crystal panel.

液晶面板之製造方法除包括上述步驟之外，亦可更包括如下步驟：自作為器件基板之玻璃基板上剝離附樹脂層之支撐板後，藉由化合蝕刻處理將玻璃基板薄板化(步驟S75)。玻璃基板之第1主面係由支撐板保護，故即便進行蝕刻處理，亦難以產生蝕刻斑。In addition to the above steps, the method of manufacturing a liquid crystal panel may further include the steps of: thinning the glass substrate by a compound etching process after peeling off the support plate with the resin layer from the glass substrate as the device substrate (step S75) . Since the first main surface of the glass substrate is protected by the support plate, it is difficult to generate an etching spot even if the etching process is performed.

再者，圖10所示之例中，於附TFT之器件基板、附CF之器件基板之製造時分別逐個使用積層體，但本發明並不限定於此。例如，可於附TFT之器件基板、附CF之器件基板中僅任一基板之製造時使用積層體。Further, in the example shown in FIG. 10, the laminated body is used one by one in the manufacture of the TFT-attached device substrate and the CF-attached device substrate, but the present invention is not limited thereto. For example, a laminate may be used in the production of only one of the TFT-attached device substrate and the CF-attached device substrate.

圖11係本發明之第1實施形態中之有機EL面板(OLED)之製造方法之步驟圖。Fig. 11 is a flow chart showing a method of manufacturing an organic EL panel (OLED) according to the first embodiment of the present invention.

有機EL面板之製造方法包括如下步驟：使用圖案形成用之抗蝕液於平面化後之積層體之器件基板之第2主面上形成有機EL元件(步驟S81)；於有機EL元件上積層對向基板(步驟S82)；以及將器件基板與樹脂層剝離(步驟S83)。再者，剝離步驟(步驟S83)可為積層步驟(步驟S82)之前，亦可為有機EL元件形成步驟(步驟S81)之中途。The method for producing an organic EL panel includes the steps of: forming an organic EL element on a second main surface of a device substrate on which a planarized layered body is formed using a resist liquid for pattern formation (step S81); and stacking layers on the organic EL element The substrate is pressed (step S82); and the device substrate is peeled off from the resin layer (step S83). Further, the peeling step (step S83) may be before the step of laminating (step S82), or may be in the middle of the organic EL element forming step (step S81).

有機EL元件形成步驟中，使用眾所周知之光微影技術或蒸鍍技術等，於器件基板之第2主面上形成有機EL元件。此時，於器件基板之第2主面上塗佈抗蝕液作為圖案形成用之塗佈液。有機EL元件例如包含透明電極層、電洞傳輸層、發光層、電子傳輸層等。In the organic EL element forming step, an organic EL element is formed on the second main surface of the device substrate by using a well-known photolithography technique or a vapor deposition technique. At this time, a resist liquid is applied as a coating liquid for pattern formation on the second main surface of the device substrate. The organic EL element includes, for example, a transparent electrode layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like.

再者，於形成有機EL元件之前，視需要，可清洗器件基板之第2主面。作為清洗方法，例如可使用乾式清洗或濕式清洗。Further, before forming the organic EL element, the second main surface of the device substrate can be cleaned as needed. As the cleaning method, for example, dry cleaning or wet cleaning can be used.

積層步驟中，例如，首先自附有機EL元件之器件基板上剝離附樹脂層之支撐板。其後，將附有機EL元件之器件基板切斷為複數個單元。繼而，以有機EL元件與對向基板接觸之方式使各單元與對向基板貼合。如此，製造有機EL顯示器。In the lamination step, for example, the support plate with the resin layer is peeled off from the device substrate to which the organic EL element is attached first. Thereafter, the device substrate with the organic EL element is cut into a plurality of cells. Then, each unit is bonded to the counter substrate so that the organic EL element is in contact with the counter substrate. Thus, an organic EL display is manufactured.

如此，對所製造之LCD或OLED等顯示面板的用途並無特別限制，例如適宜用於行動電話、PDA(Personal Digital Assistant，個人數位助理)、數位相機、遊戲機等行動電子機器。Thus, the use of the display panel such as the manufactured LCD or OLED is not particularly limited, and is suitable, for example, for use in mobile electronic devices such as mobile phones, PDAs (Personal Digital Assistants), digital cameras, and game machines.

(第2實施形態)(Second embodiment)

第2實施形態係關於平面化前之積層體塊者。The second embodiment relates to a laminated body block before planarization.

圖12係本發明之第2實施形態中之平面化前之積層體塊之部分側面圖。如圖12所示，平面化前之積層體塊20係於器件基板21與支撐板22之間***有樹脂層23者。樹脂層23係以可剝離之方式密著於器件基板21之第1主面211，並且固定於支撐板22上。Fig. 12 is a partial side elevational view showing the laminated body block before planarization in the second embodiment of the present invention. As shown in FIG. 12, the laminated body block 20 before planarization is a resin layer 23 interposed between the device substrate 21 and the support plate 22. The resin layer 23 is detachably adhered to the first main surface 211 of the device substrate 21 and fixed to the support plate 22.

支撐板22可變得較樹脂層23更大，樹脂層23可變得較器件基板21更大。於上述情形時，如圖12所示，若器件基板21為經倒角加工者，則由於器件基板21之外周面帶有圓形，而導致於積層體塊20之外周面24形成凹槽25。The support plate 22 may become larger than the resin layer 23, and the resin layer 23 may become larger than the device substrate 21. In the above case, as shown in FIG. 12, if the device substrate 21 is a chamfered processor, since the peripheral surface of the device substrate 21 has a circular shape, a groove 25 is formed on the outer peripheral surface 24 of the laminated body block 20. .

此時，藉由沿圖12之A-A'線切斷積層體塊20，可使積層體塊20之外周面24平面化，可去除凹槽25。At this time, by cutting the laminated body block 20 along the line AA' of FIG. 12, the outer peripheral surface 24 of the laminated body block 20 can be planarized, and the groove 25 can be removed.

但，於沿圖12之B-B'線或C-C'線切斷積層體塊20之情形時，由於無法使積層體塊20之外周面24平面化，故凹槽25殘存。However, when the laminated body block 20 is cut along the line BB' or C-C' of Fig. 12, since the outer peripheral surface 24 of the laminated body block 20 cannot be planarized, the groove 25 remains.

於上述情形時，由於凹槽25殘存，因此於器件之製造步驟中容易殘留塗佈液之殘渣。該殘渣於器件製造步驟中之加熱處理步驟中成為發塵源，因此發塵污染加熱處理步驟內，使作為製品之器件之良率下降。In the above case, since the groove 25 remains, the residue of the coating liquid is likely to remain in the manufacturing process of the device. Since the residue becomes a dust source in the heat treatment step in the device manufacturing step, the dust is contaminated in the heat treatment step, and the yield of the device as a product is lowered.

本實施形態中，由於可去除凹槽25，故於器件之製造步驟中，可抑制發塵，可抑制作為製品之器件之良率之下降。In the present embodiment, since the recess 25 can be removed, dust generation can be suppressed in the manufacturing process of the device, and the deterioration of the yield of the device as a product can be suppressed.

(第3實施形態)(Third embodiment)

圖13係本發明之第3實施形態中之平面化前之積層體塊之部分側面圖。如圖13所示，平面化前之積層體塊30係於器件基板31與支撐板32之間***有樹脂層33者。樹脂層33係以可剝離之方式密著於器件基板31之第1主面311，並且固定於支撐板32上。Fig. 13 is a partial side elevational view showing the laminated body block before planarization in the third embodiment of the present invention. As shown in FIG. 13, the laminated body block 30 before planarization is a resin layer 33 interposed between the device substrate 31 and the support plate 32. The resin layer 33 is detachably adhered to the first main surface 311 of the device substrate 31, and is fixed to the support plate 32.

樹脂層33變得較器件基板31或支撐板32更小。因此，如圖13所示，導致於積層體塊30之外周面34形成凹槽35。The resin layer 33 becomes smaller than the device substrate 31 or the support plate 32. Therefore, as shown in FIG. 13, the groove 35 is formed on the outer peripheral surface 34 of the laminated body block 30.

此時，藉由沿圖13之A-A'線切斷積層體塊30，可使積層體塊30之外周面34平面化，可去除凹槽35。At this time, by cutting the laminated body block 30 along the line AA' of FIG. 13, the outer peripheral surface 34 of the laminated body block 30 can be planarized, and the groove 35 can be removed.

但，於沿圖13之B-B'線或C-C'線切斷積層體塊30之情形時，無法使積層體塊30之外周面34平面化，因此凹槽35之一部分或者全部殘存。However, when the laminated body block 30 is cut along the line BB' or C-C' of Fig. 13, the outer peripheral surface 34 of the laminated body block 30 cannot be planarized, so that part or all of the groove 35 remains. .

於上述情形時，由於凹槽35之一部分或者全部殘存，故於器件之製造步驟中容易殘存塗佈液之殘渣。該殘渣於器件製造步驟中之加熱處理步驟中成為發塵源，因此發塵污染加熱處理步驟內，使作為製品之器件之良率下降。In the above case, since part or all of the recess 35 remains, the residue of the coating liquid tends to remain in the manufacturing process of the device. Since the residue becomes a dust source in the heat treatment step in the device manufacturing step, the dust is contaminated in the heat treatment step, and the yield of the device as a product is lowered.

本實施形態中，可去除凹槽35，因此於器件之製造步驟中可抑制發塵，可抑制作為製品之器件之良率之下降。In the present embodiment, since the groove 35 can be removed, dust generation can be suppressed in the manufacturing process of the device, and the deterioration of the yield of the device as a product can be suppressed.

[實施例][Examples]

以下，藉由實施例等，對本發明進行具體說明，但本發明不受該等實施例之限定。Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by the examples.

(實施例1)(Example 1)

支撐板係使用利用浮式法獲得之縱370 mm×橫320 mm×厚0.6 mm之玻璃板(旭硝子公司製造，AN100，無鹼玻璃)。該玻璃板之平均線膨脹係數為38×10-7 /℃。The support plate was a glass plate (manufactured by Asahi Glass Co., Ltd., AN100, alkali-free glass) obtained by a floating method and having a length of 370 mm × a width of 320 mm × a thickness of 0.6 mm. The average expansion coefficient of the glass plate was 38 × 10 -7 / ° C.

將該玻璃板進行純水清洗、UV清洗，使玻璃板之表面清潔化。其後，於玻璃板之表面，利用旋塗機塗佈無溶劑加成反應型聚矽氧(Shin-Etsu Silicone公司製造，KNS-320A)100質量份與鉑系觸媒(Shin-Etsu Silicone公司製造，CAT-PL-56)5質量份之混合物(塗佈量20 g/m2 )。The glass plate was subjected to pure water washing and UV cleaning to clean the surface of the glass plate. Thereafter, 100 parts by mass of a solvent-free addition-reactive polyfluorene (KNS-320A, manufactured by Shin-Etsu Silicone Co., Ltd.) and a platinum-based catalyst (Shin-Etsu Silicone Co., Ltd.) were coated on the surface of the glass plate by a spin coater. Manufactured, CAT-PL-56) a mixture of 5 parts by mass (coating amount 20 g/m 2 ).

上述無溶劑加成反應型聚矽氧係包含具有鍵結於矽原子之乙烯基與甲基之直鏈狀有機烯基聚矽氧烷(主劑)、及具有鍵結於矽原子之氫原子與甲基之直鏈狀有機氫化聚矽氧烷(交聯劑)者。The solventless addition reaction type polyoxo oxygen group includes a linear organic alkenyl polyoxyalkylene (main component) having a vinyl group and a methyl group bonded to a ruthenium atom, and a hydrogen atom having a bond to a ruthenium atom. A linear organic hydrogenated polyoxyalkylene (crosslinking agent) with a methyl group.

使塗佈於玻璃板上之混合物於大氣中、180℃下加熱硬化10分鐘，於玻璃板上形成縱366 mm×橫316 mm之樹脂層，並固定。The mixture applied to the glass plate was heat-hardened at 180 ° C for 10 minutes in the atmosphere, and a resin layer of 366 mm × 316 mm in width was formed on the glass plate and fixed.

另一方面，器件基板係使用包含聚醚碸之縱370 mm×橫320 mm×厚0.1 mm之樹脂基板(住友電木公司製造，Sumilite FS-5300)。該樹脂基板之平均線膨脹係數為540×10-7 /℃。On the other hand, the device substrate was a resin substrate (Sumilite FS-5300, manufactured by Sumitomo Bakelite Co., Ltd.) containing a polyether yttrium having a length of 370 mm × a width of 320 mm × a thickness of 0.1 mm. The average linear expansion coefficient of the resin substrate was 540 × 10 -7 /°C.

將該樹脂基板進行純水清洗、UV清洗，使樹脂基板之表面清潔化。其後，將樹脂基板與玻璃板對準後，使用真空加壓裝置，於室溫下使固定於玻璃板上之樹脂層密著於樹脂基板之第1主面。The resin substrate was subjected to pure water washing and UV cleaning to clean the surface of the resin substrate. Thereafter, after the resin substrate and the glass plate were aligned, the resin layer fixed to the glass plate was adhered to the first main surface of the resin substrate at room temperature using a vacuum press device.

以上述方式，獲得與圖2所示之積層體塊大致相同之積層體塊。將所得之積層體塊於厚度方向切斷，將積層體塊之外周部遍及圓周方向全周而以10 mm之寬度去除。具體而言，使用截切刀將樹脂基板及樹脂層於厚度方向切斷，並且使用玻璃切割機於玻璃板之主面形成劃線後，使積層體塊撓曲變形而沿劃線割斷，將積層體塊之外周部遍及圓周方向全周而去除。In the above manner, a laminated body block substantially the same as the laminated body block shown in Fig. 2 was obtained. The obtained laminated body block was cut in the thickness direction, and the outer peripheral portion of the laminated body block was removed over the entire circumference in the circumferential direction by a width of 10 mm. Specifically, the resin substrate and the resin layer are cut in the thickness direction by using a cutting blade, and after the scribe line is formed on the main surface of the glass plate using a glass cutter, the laminated body block is flexibly deformed and cut along the scribe line, and The outer peripheral portion of the laminated body block is removed over the entire circumference in the circumferential direction.

於該狀態下，樹脂基板、玻璃板、及樹脂層之外周面遍及圓周方向全周而一致，積層體塊之外周面遍及圓周方向全周而平面化。又，積層體塊之外周面未看到凹槽。In this state, the outer peripheral surfaces of the resin substrate, the glass plate, and the resin layer are aligned over the entire circumference in the circumferential direction, and the outer peripheral surface of the laminated body block is planarized over the entire circumference in the circumferential direction. Further, no groove was observed on the outer peripheral surface of the laminated body block.

繼而，將平面化後之積層體塊浸漬於CF用之黑色矩陣用抗蝕液(旭硝子公司製造，PMA-ST)中後，以丙二醇單甲醚乙酸酯(抗蝕液之主溶劑)清洗。其後，於熱風烘箱中以120℃乾燥30分鐘，以顯微鏡觀察積層體之外周面，結果未看到抗蝕液之殘渣。Then, the planarized bulk block is immersed in a black matrix resist liquid for CF (Purastron Industries, PMA-ST), and then washed with propylene glycol monomethyl ether acetate (the main solvent of the resist liquid). . Thereafter, the film was dried at 120 ° C for 30 minutes in a hot air oven, and the outer peripheral surface of the laminate was observed under a microscope, and as a result, no residue of the resist liquid was observed.

(實施例2)(Example 2)

實施例2中，除支撐板係使用利用浮式法獲得之縱370 mm×橫320 mm×厚0.4 mm之玻璃板(旭硝子公司製造，AN100，無鹼玻璃)以外，以與實施例1相同之方式，於玻璃板上形成樹脂層，並固定。In the second embodiment, the same as in the first embodiment except that a glass plate (manufactured by Asahi Glass Co., Ltd., AN100, alkali-free glass) having a length of 370 mm × a width of 320 mm × a thickness of 0.4 mm obtained by a floating method was used. In the manner, a resin layer is formed on the glass plate and fixed.

又，實施例2中，除器件基板係使用利用浮式法獲得之縱370 mm×橫320 mm×厚0.3 mm之玻璃基板(旭硝子公司製造，AN100，無鹼玻璃)以外，以與實施例1相同之方式，使固定於玻璃板上之樹脂層密著於玻璃基板之第1主面。Further, in the second embodiment, except that a glass substrate (manufactured by Asahi Glass Co., Ltd., AN100, alkali-free glass) having a length of 370 mm × a width of 320 mm × a thickness of 0.3 mm obtained by a floating method was used, and Example 1 was used. In the same manner, the resin layer fixed to the glass plate is adhered to the first main surface of the glass substrate.

以上述方式，獲得與圖2所示之積層體塊大致相同之積層體塊。將所得之積層體塊於厚度方向切斷，將積層體塊之外周部遍及圓周方向全周而以10 mm之寬度去除。具體而言，使用玻璃切割機於玻璃基板之第2主面形成劃線，並且使用玻璃切割機於玻璃板之主面形成劃線後，使積層體塊撓曲變形而沿劃線割斷，將積層體塊之外周部遍及圓周方向全周而去除。In the above manner, a laminated body block substantially the same as the laminated body block shown in Fig. 2 was obtained. The obtained laminated body block was cut in the thickness direction, and the outer peripheral portion of the laminated body block was removed over the entire circumference in the circumferential direction by a width of 10 mm. Specifically, a scribe line is formed on the second main surface of the glass substrate using a glass cutter, and a scribe line is formed on the main surface of the glass sheet using a glass cutter, and the laminated body block is flexibly deformed and cut along the scribe line, and The outer peripheral portion of the laminated body block is removed over the entire circumference in the circumferential direction.

於該狀態下，於玻璃基板、玻璃板、及樹脂層之外周面遍及圓周方向全周而一致，積層體塊之外周面係遍及圓周方向全周而平面化。又，積層體塊之外周面未看到凹槽。In this state, the peripheral surfaces of the glass substrate, the glass plate, and the resin layer are aligned over the entire circumference in the circumferential direction, and the outer peripheral surface of the laminated body block is planarized over the entire circumference in the circumferential direction. Further, no groove was observed on the outer peripheral surface of the laminated body block.

使用磨石，將該積層體塊之外周面之角部遍及圓周方向全周而倒角。倒角尺寸係設為曲率半徑R=0.4(單位：mm)。The corner portion of the outer peripheral surface of the laminated body block is chamfered over the entire circumference in the circumferential direction using a grindstone. The chamfer size is set to a radius of curvature R = 0.4 (unit: mm).

繼而，以與實施例1相同之方式，將倒角後之積層體塊浸漬於抗蝕液中，清洗、乾燥後，以顯微鏡觀察積層體之外周面。其結果，未看到抗蝕液之殘渣。Then, in the same manner as in Example 1, the laminated body block after the chamfering was immersed in the resist liquid, washed, and dried, and the outer peripheral surface of the laminated body was observed under a microscope. As a result, no residue of the resist liquid was observed.

(比較例1)(Comparative Example 1)

比較例1中，以與實施例1相同之方式，將以與實施例2相同之方式獲得之切斷前之積層體塊浸漬於抗蝕液中，清洗、乾燥後，以顯微鏡觀察積層體之外周面。其結果，看到抗蝕液之殘渣。In Comparative Example 1, the laminate block before the cutting obtained in the same manner as in Example 2 was immersed in the resist liquid in the same manner as in Example 1, and after washing and drying, the laminate was observed under a microscope. The outer perimeter. As a result, the residue of the resist liquid was observed.

已詳細地且參照特定之實施態樣對本發明進行說明，業者明白，可於不脫離本發明之精神及範圍之情況下加以各種變更或修正。The present invention has been described in detail with reference to the specific embodiments thereof.

本申請案係基於2010年1月25日申請之日本專利申請2010-012785者，其內容係作為參照而併入本文中。The present application is based on Japanese Patent Application No. 2010-012785, filed Jan.

10、10A、10B、10C、20、30．．．積層體塊10, 10A, 10B, 10C, 20, 30. . . Laminated block

11、11A、11B、11C、21、31．．．器件基板11, 11A, 11B, 11C, 21, 31. . . Device substrate

12、12A、12B、22、32．．．支撐板12, 12A, 12B, 22, 32. . . Support plate

13、13A、13B、23、33．．．樹脂層13, 13A, 13B, 23, 33. . . Resin layer

14、14A、14B、134B、24、34．．．外周面14, 14A, 14B, 134B, 24, 34. . . Peripheral surface

15、25、35．．．凹槽15, 25, 35. . . Groove

110、120．．．角部110, 120. . . Corner

111、111A、111B、111C、211、311．．．第1主面111, 111A, 111B, 111C, 211, 311. . . First main face

112、112A、112B、112C．．．第2主面112, 112A, 112B, 112C. . . Second main face

A．．．箭頭A. . . arrow

A-A'．．．線A-A'. . . line

B-B'．．．線B-B'. . . line

C-C'．．．線C-C'. . . line

R1．．．器件基板側之曲率半徑R1. . . Radius of curvature on the side of the device substrate

R2．．．支撐板側之曲率半徑R2. . . Radius of curvature on the side of the support plate

θ1．．．器件基板側之倒角角度Θ1. . . Chamfer angle on the substrate side of the device

θ2．．．支撐板側之倒角角度Θ2. . . Chamfer angle on the side of the support plate

圖1係本發明之第1實施形態中之積層體之製造方法之步驟圖。Fig. 1 is a flow chart showing a method of manufacturing a laminated body in a first embodiment of the present invention.

圖2係本發明之第1實施形態中之平面化前之積層體塊之部分側面圖。Fig. 2 is a partial side elevational view showing a laminated body block before planarization in the first embodiment of the present invention.

圖3係本發明之第1實施形態中之平面化後之積層體塊之部分側面圖。Fig. 3 is a partial side elevational view showing the laminated body block after planarization in the first embodiment of the present invention.

圖4係本發明之第1實施形態中之倒角方法之說明圖(1)。Fig. 4 is an explanatory view (1) of a chamfering method in the first embodiment of the present invention.

圖5係本發明之第1實施形態中之倒角方法之說明圖(2)。Fig. 5 is an explanatory view (2) of a chamfering method in the first embodiment of the present invention.

圖6係本發明之第1實施形態中之倒角方法之說明圖(3)。Fig. 6 is an explanatory diagram (3) of a chamfering method in the first embodiment of the present invention.

圖7係本發明之第1實施形態中之倒角後之積層體塊之部分側面圖。Fig. 7 is a partial side elevational view showing the laminated body block after chamfering in the first embodiment of the present invention.

圖8係本發明之第1實施形態中之研磨後之積層體塊之部分側面圖。Fig. 8 is a partial side elevational view showing the laminated body block after polishing in the first embodiment of the present invention.

圖9係本發明之第1實施形態中之器件之製造方法之步驟圖。Fig. 9 is a flow chart showing a method of manufacturing the device in the first embodiment of the present invention.

圖10係本發明之第1實施形態中之LCD之製造方法之步驟圖。Fig. 10 is a flow chart showing a method of manufacturing the LCD in the first embodiment of the present invention.

圖11係本發明之第1實施形態中之OLED之製造方法之步驟圖。Fig. 11 is a flow chart showing a method of manufacturing an OLED according to the first embodiment of the present invention.

圖12係本發明之第2實施形態中之平面化前之積層體塊之部分側面圖。Fig. 12 is a partial side elevational view showing the laminated body block before planarization in the second embodiment of the present invention.

圖13係本發明之第3實施形態中之平面化前之積層體塊之部分側面圖。Fig. 13 is a partial side elevational view showing the laminated body block before planarization in the third embodiment of the present invention.

(無元件符號說明)(no component symbol description)

Claims (8)

一種積層體之製造方法，該積層體用於器件之製造，其中該製造方法包括如下步驟：於玻璃製之器件基板與玻璃製之支撐板之間***有樹脂層，該樹脂層係以可剝離之方式密著於上述器件基板之第1主面，並且將固定於上述支撐板上之積層體塊切斷為預定尺寸，使上述積層體塊之外周面之至少圓周方向一部分平面化，且藉由該步驟，去除存在於上述積層體塊外周之凹槽。 A method of manufacturing a laminate for use in the manufacture of a device, wherein the method comprises the steps of: inserting a resin layer between the device substrate made of glass and the support plate made of glass, the resin layer being peelable Adhering to the first main surface of the device substrate, and cutting the laminated body block fixed to the support plate to a predetermined size, and planarizing at least a part of the circumferential surface of the outer peripheral surface of the laminated body block, and borrowing By this step, the grooves existing on the outer periphery of the above-mentioned laminated body block are removed. 如請求項1之積層體之製造方法，其更包括如下步驟：將上述積層體塊之外周面之經平面化之部分之角部倒角。 The method of manufacturing a laminated body according to claim 1, further comprising the step of chamfering a corner portion of the planarized portion of the outer peripheral surface of the laminated body block. 如請求項2之積層體之製造方法，其中上述器件基板係利用浮式法製造之玻璃基板，且包括如下步驟：將上述角部倒角後，研磨上述器件基板之第2主面。 The method of manufacturing a laminate according to claim 2, wherein the device substrate is a glass substrate produced by a floating method, and includes the step of chamfering the corner portion and polishing the second main surface of the device substrate. 如請求項1至3中任一項之積層體之製造方法，其中上述樹脂層之外周面之經平面化之部分與上述樹脂層之厚度方向大致平行。 The method for producing a laminate according to any one of claims 1 to 3, wherein the planarized portion of the outer peripheral surface of the resin layer is substantially parallel to the thickness direction of the resin layer. 如請求項1至3中任一項之積層體之製造方法，其中上述器件基板係厚度0.03mm以上且小於0.8mm之玻璃基板。 The method for producing a laminate according to any one of claims 1 to 3, wherein the device substrate is a glass substrate having a thickness of 0.03 mm or more and less than 0.8 mm. 如請求項1至3中任一項之積層體之製造方法，其中上述樹脂層包含選自由丙烯酸系樹脂、聚烯烴樹脂、聚胺基 甲酸酯樹脂、及聚矽氧樹脂所組成之群中之至少一種。 The method for producing a laminate according to any one of claims 1 to 3, wherein the resin layer comprises an acrylic resin, a polyolefin resin, a polyamine group. At least one of a group consisting of a formate resin and a polyoxyxylene resin. 如請求項1至3中任一項之積層體之製造方法，其中上述樹脂層之厚度為5~50μm。 The method for producing a laminate according to any one of claims 1 to 3, wherein the resin layer has a thickness of 5 to 50 μm. 一種積層體，該積層體用於器件之製造，其中於玻璃製之器件基板與玻璃製之支撐板之間***有樹脂層，該樹脂層係以可剝離之方式密著於上述器件基板之第1主面，並且將固定於上述支撐板上之積層體塊切斷為預定尺寸，使上述積層體塊之外周面之至少圓周方向一部分平面化，藉此去除存在於上述積層體塊外周之凹槽。 A laminate body for manufacturing a device in which a resin layer is interposed between a glass device substrate and a glass support plate, and the resin layer is detachably adhered to the device substrate a main surface, wherein the laminated body block fixed to the support plate is cut into a predetermined size, and at least a part of the outer circumferential surface of the laminated body block is planarized, thereby removing the concave existing on the outer periphery of the laminated body block. groove.
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