TW201132503A - Method for manufacturing laminate, and laminate - Google Patents

Method for manufacturing laminate, and laminate Download PDF

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Publication number
TW201132503A
TW201132503A TW100102691A TW100102691A TW201132503A TW 201132503 A TW201132503 A TW 201132503A TW 100102691 A TW100102691 A TW 100102691A TW 100102691 A TW100102691 A TW 100102691A TW 201132503 A TW201132503 A TW 201132503A
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TW
Taiwan
Prior art keywords
resin layer
laminated body
device substrate
body block
substrate
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Application number
TW100102691A
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Chinese (zh)
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TWI508863B (en
Inventor
Satoshi Kondo
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Asahi Glass Co Ltd
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Publication of TW201132503A publication Critical patent/TW201132503A/en
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Publication of TWI508863B publication Critical patent/TWI508863B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10743—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing acrylate (co)polymers or salts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10128—Treatment of at least one glass sheet
    • B32B17/10155—Edge treatment or chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10293—Edge features, e.g. inserts or holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/1077—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyurethane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10798—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing silicone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Disclosed is a method for manufacturing a laminate, which includes a step wherein a resin layer is disposed between a device board and a supporting board, the resin layer is peelably adhered on the first main surface of the device board, a laminate block fixed on the supporting board is cut into a predetermined size, and at least a laminate block outer circumferential surface part in the circumferential direction is planarized.

Description

201132503 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種積層體之製造方法及積層體。 【先前技術】 近年來，太陽能電池（PV，Photo Voltaic，光伏）、液晶 面板（LCD，Liquid Crystal Display，液晶顯示器）、有機 EL 面板（〇LED ’ Organic Light Emitting Display，有機發 光顯示器）等器件（電子機器）之薄型化、輕量化正在推進， 該等器件所使用之基板（以下，稱為「器件基板」）之薄板 化正進行。若藉由薄板化，器件基板之強度不足，則於器 件之製造步驟中’器件基板之操作性會下降。 因此，自先前以來，廣泛採用在較最終厚度更厚之器件 基板上形成器件用構件，其後藉由化學蝕刻處理使器件基 板薄板化之方法。然而，該方法中，例如於將1塊器件基 板之厚度薄板化為0.7 mm至〇·2 mm或〇丨mm之情形時將 原本之器件基板之材料之大半以㈣液_，因此就生產 性或原材料之使用效率之觀點而言欠佳。 又，上述利用化學蚀刻處理之器件基板之薄板化方法 中，於器件基板表面存在微細傷痕之情形時，有藉由敍刻 處理而以傷痕為起點形成微細的凹處(敍刻斑)，成為光學 缺陷之情況。 最近，為對應上述問題，提出右 扠出有如下方法：準備於器件 基板之第1主面以可剝離之古斗 聊之方式密著有固定於支樓板上之 樹脂層之積層體，於積層體 、盗件基板之第2主面上形成 153708.doc 201132503 器件用構件後，自器件基板上剝離附樹脂層之支撐板（例 如參照專利文獻1) » 先前技術文獻 專利文獻 專利文獻1 ··國際公開第07/01 8028號小冊子 【發明内容】 發明所欲解決之問題 然而，上述先前之積層體中有於積層體之外周面形成凹 槽之情況。例如於器件基板或支撐板為經倒角加工者之情 形時，或於樹脂層係將液狀之樹脂組成物塗佈於支撐板上 並加熱硬化而成者之情形時，由於器件基板或支撐板之外 周面或樹脂層之外周面帶有圓形，故於積層體之外周面形 成凹槽。 於器件之製造步驟中，有對形成於器件基板之表面之導 電膜進行噴砂、蝕刻等處理而形成配線或元件等圖案形成 步驟。於該圖案形成步驟之前，有為保護導電膜之表面之 一部分而於導電膜之表面塗佈抗蝕液等塗佈液之塗佈步 驟。 器件之製造步驟之塗佈步驟中，塗佈液由於毛細管現象 而浸入凹槽中，容易積存。積存於凹槽内之塗佈液，即便 凊洗亦難以去除，乾燥後容易殘留殘渣。該殘渣於器件製 造步驟之加熱處理步驟中成為發塵源，因此發塵污染加熱 處理步驟内，使作為製品之器件之良率下降。 本發明係繁於上述課題而形成者，主要目的在於提供一 153708.doc 201132503 種在器件之製造步驟中可抑制發塵之積層體之製造方法及 積層體。 解決問題之技術手段 為了解決上述目的’本發明之積層體之製造方法係包括 如下步驟之方法： 於器件基板與支擇板之間***樹脂層，該樹脂層係以可 剝離之方式密著於上述器件基板之第1主面，並且將固定 於上述支撐板上之積層體塊切斷為預定尺寸，使上述積層 體塊之外周面之至少圓周方向一部分平面化。 進而，本發明之積層體之製造方法較佳為包括如下步 驟：將上述積層體塊之外周面之經平面化之部分之角部倒 角。 又，較佳為上述樹脂層之外周面之經平面化之部分與上 述樹脂層之厚度方向大致平行。 又，較佳為，上述器件基板係利用浮式法製造之玻璃基 板，且包括如下步驟：將上述角部倒角後，研磨上述器件 基板之第2主面。 上述器件基板較佳為厚度0 03 mm以上且小於〇 8 之 玻璃基板。 上述樹脂層較佳為包含選自由丙烯酸系樹脂層、聚烯烴 樹脂層、聚胺基甲酸醋樹脂層、及聚石夕氧樹脂層所組成之 群中之至少一種。 上述樹脂層之厚度較佳為5〜5〇 。 又’本發明之積層體係 153708.doc 201132503 於器件基板與支撐板之間***樹脂層，該樹脂層係以可 剝離之方式在、著於上述器件基板之第1主面’並且將固定 於上述支撐板上之積層體塊切斷為預定尺寸，使上述積層 體塊之外周面之至少圓周方向一部分平面化而成者。 發明之效果 依據本發明，可提供一種於器件之製造步驟中可抑制發 塵之積層體之製造方法及積層體。 【實施方式】 以下，參照圖式，對用以實施本發明之形態進行說明。 各圖中，同一構成係附同一符號，省略說明。 (第1實施形態） 圖1係本發明之第1實施形態中之積層體之製造方法之步 驟圖。如圖1所示，積層體之製造方法包括如下步驟：於 器件基板與支撐板之間***樹脂層，該樹脂層係以可剝離 之方式密著於器件基板之第1主面，並且將固定於支撐板 上之積層體塊切割為預定尺寸，使積層體塊之外周面之至 少圓周方向一部分平面化（步驟S11)。 平面化後之積層體詳細如後述，用於器件之製造。平面 化後之積層體中之附樹脂層之支撐板係使用至器件之製造 步驟之中途為止（直至器件基板與樹脂層藉由剝離操作而 剝離為止）β器件基板與樹脂層剝離後，附樹脂層之支撐 板係自器件之製造步驟中去除，不成為構成器件之構件。 自器件基板剝離之附樹脂層之支撐板可於積層體之製造步 驟中再利用。即，於附樹脂層之支撐板之樹脂層上積層新 153708.doc • 6 · 201132503 的器件基板，可獲得新的積層體塊。 首先’對平面化前之積層體塊進行說明，繼而，對平面 化後之積層體塊進行說明，最後對器件之製造步驟進行說 明。 圖2係本發明之第1實施形態中之平面化前之積層體塊之 部分侧面圖《如圖2所示’平面化前之積層體塊1 〇係於器 件基板11與支撐板12之間***有樹脂層13者。樹脂層13係 以可剝離之方式密著於器件基板11之第1主面m，並且固 定於支撐板12上。 (器件基板） 器件基板1 1係於第2主面112上形成器件用構件而構成器 件。此處，所謂器件用構件，係指構成器件（電子機器）之 至少一部分之構件。具體例可列舉薄膜電晶體（Thin_Film201132503 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of manufacturing a laminate and a laminate. [Prior Art] In recent years, solar cells (PV, Photo Voltaic, photovoltaic), liquid crystal display (LCD), organic EL panels (〇LED 'Organic Light Emitting Display, etc.) The thinning and lightening of the electronic device are progressing, and the thinning of the substrate (hereinafter referred to as "device substrate") used in these devices is progressing. If the strength of the device substrate is insufficient by thinning, the operability of the device substrate is lowered in the manufacturing process of the device. Therefore, a method of forming a device member on a device substrate thicker than the final thickness and then thinning the device substrate by a chemical etching treatment has been widely used. However, in this method, for example, when the thickness of one device substrate is thinned to 0.7 mm to 〇·2 mm or 〇丨mm, most of the material of the original device substrate is (four) liquid _, thus productivity Or the use efficiency of raw materials is not good. Further, in the thinning method of the device substrate by the chemical etching treatment, when there is a fine flaw on the surface of the device substrate, a fine recess (spotted spot) is formed from the scratch as a starting point by the etching process. The case of optical defects. Recently, in order to cope with the above problems, it has been proposed that the right fork has a method in which the first main surface of the device substrate is prepared in a peelable manner, and a laminate of a resin layer fixed on the branch floor is adhered to the laminate. After the 153708.doc 201132503 device member is formed on the second main surface of the body or the thimble substrate, the support plate with the resin layer is peeled off from the device substrate (for example, refer to Patent Document 1) » PRIOR ART DOCUMENT Patent Document Patent Document 1 International Publication No. 07/018028 [Explanation] The problem to be solved by the invention However, the above-mentioned laminated body has a case where a groove is formed on the outer peripheral surface of the laminated body. For example, when the device substrate or the support plate is chamfered, or when the resin layer is applied to the support plate by heating and hardening, the device substrate or the support is used. The outer peripheral surface of the plate or the outer peripheral surface of the resin layer has a circular shape, so that a groove is formed on the outer peripheral surface of the laminated body. In the manufacturing process of the device, a pattern forming step of forming a wiring or an element is performed by subjecting the conductive film formed on the surface of the device substrate to sandblasting, etching, or the like. Before the pattern forming step, there is a coating step of applying a coating liquid such as a resist liquid to the surface of the conductive film to protect a part of the surface of the conductive film. In the coating step of the manufacturing step of the device, the coating liquid is immersed in the groove due to the capillary phenomenon, and is easily accumulated. The coating liquid accumulated in the grooves is difficult to remove even after washing, and the residue is likely to remain after drying. This residue becomes a dust source in the heat treatment step of the device manufacturing step, so that the dust-contaminated heat treatment step lowers the yield of the device as a product. The present invention has been made in view of the above problems, and a main object of the present invention is to provide a method and a laminated body for a laminated body capable of suppressing dust generation in a manufacturing process of a device. Means for Solving the Problems In order to solve the above object, the manufacturing method of the laminated body of the present invention comprises the following steps: a resin layer is interposed between the device substrate and the cut-off plate, and the resin layer is detachably adhered to The first main surface of the device substrate is cut into a predetermined size by a laminated body block fixed to the support plate, and at least a part of the outer circumferential surface of the laminated body block is planarized. Further, the method for producing a laminated body according to the present invention preferably includes the step of chamfering a corner portion of the planarized portion of the outer peripheral surface of the laminated body block. Further, it is preferable that the planarized portion of the outer peripheral surface of the resin layer is substantially parallel to the thickness direction of the resin layer. Further, preferably, the device substrate is a glass substrate manufactured by a floating method, and includes a step of chamfering the corner portion and polishing the second main surface of the device substrate. The above device substrate is preferably a glass substrate having a thickness of 0 03 mm or more and less than 〇 8. The resin layer preferably contains at least one selected from the group consisting of an acrylic resin layer, a polyolefin resin layer, a polyurethane film layer, and a polyoxo resin layer. The thickness of the above resin layer is preferably 5 to 5 Å. Further, the laminated system of the present invention 153708.doc 201132503 inserts a resin layer between the device substrate and the support plate, and the resin layer is detachably attached to the first main surface of the device substrate and is fixed to the above The laminated body block on the support plate is cut into a predetermined size, and at least a part of the outer circumferential surface of the laminated body block is planarized. Advantageous Effects of Invention According to the present invention, it is possible to provide a method for producing a laminate which can suppress dust generation in a manufacturing step of a device, and a laminate. [Embodiment] Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the respective drawings, the same components are denoted by the same reference numerals, and their description will be omitted. (First Embodiment) Fig. 1 is a step chart showing a method of manufacturing a laminated body according to a first embodiment of the present invention. As shown in FIG. 1, the method for manufacturing a laminated body includes the steps of inserting a resin layer between the device substrate and the support plate, the resin layer being detachably adhered to the first main surface of the device substrate, and fixed The laminated body block on the support plate is cut into a predetermined size, and at least a part of the circumferential direction of the outer peripheral surface of the laminated body block is planarized (step S11). The layered body after planarization is used in detail for the manufacture of the device as will be described later. The supporting plate with the resin layer in the planarized laminated body is used until the middle of the manufacturing process of the device (until the device substrate and the resin layer are peeled off by the peeling operation), and the β device substrate is peeled off from the resin layer, and the resin is attached. The support plate of the layer is removed from the manufacturing steps of the device and does not become a component constituting the device. The support plate with the resin layer peeled off from the device substrate can be reused in the manufacturing step of the laminate. That is, a new laminated body block can be obtained by laminating a device substrate of a new 153708.doc • 6 · 201132503 on the resin layer of the support plate with the resin layer. First, the laminated body block before planarization will be described. Next, the planarized bulk block will be described. Finally, the manufacturing steps of the device will be described. 2 is a partial side view of the laminated body block before planarization in the first embodiment of the present invention. As shown in FIG. 2, the laminated body block 1 before the planarization is tied between the device substrate 11 and the support plate 12. The resin layer 13 is inserted. The resin layer 13 is detachably adhered to the first main surface m of the device substrate 11, and is fixed to the support plate 12. (Device Substrate) The device substrate 11 is formed on the second main surface 112 to form a device member. Here, the member for a device means a member constituting at least a part of a device (electronic device). Specific examples include thin film transistors (Thin_Film)

Transistor，TFT)、彩色滤光片（Color Filter，CF)。作為器 件，可例示太陽電池（PV)、液晶面板（LCD)、有機EL面板 (OLED)等。器件用構件係於使積層體塊1 〇之外周面平面 化後，形成於器件基板11之第2主面112。 器件基板11之種類可為一般者，例如可為玻璃基板、樹 脂基板、或者SUS(Special Use Stainless，特殊用途不錄 鋼）基板等金屬基板。該等基板中，較佳為玻璃基板。其 原因在於，玻璃基板之耐化學品性、咐透濕性優異，且熱 收縮率低。作為熱收縮率之指標，係使用JIS r 3丨〇2_丨995 中規定之線膨脹係數。 若器件基板11之線膨脹係數大，器件之製造步驟多伴有 153708.doc 201132503 加熱處理，因此容易產生各種不良情況。例如，於在器件 基板11上形成TFT之情形時，若於加熱下將形成有τρτ之 器件基板11冷卻，則由於器件基板丨丨之熱收縮，而有TFT 之位置偏移變得過大之虞。 玻璃基板係將玻璃原料熔融，使熔融玻璃成形為板狀而 獲得。此種成形方法可為一般者，例如使用浮式法、熔合 法、流孔下引法、富可法（Fourcault method)、反向法等。 又，厚度特別薄之玻璃基板是利用將暫時成形為板狀之玻 璃加熱至可成形之溫度，利用延伸等方法拉伸而變薄之方 法（再拉法）進行成形而獲得。 玻璃基板之玻璃並無特別限定，較佳為無鹼玻璃、硼矽 酸玻璃、鈉鈣玻璃、高二氧化矽玻璃、其他以氧化矽為主 要成分之氧化物系玻璃。作為氧化物系玻璃，較佳為藉由 氧化物換算之氧化矽之含量為4〇〜9〇質量％之玻璃。 作為玻璃基板之玻璃，較佳為採用適合於器件之種類或 其製造步驟之玻璃。例如，由於驗金屬成分之溶出容易對 液晶造成影響，故液晶面板用之玻璃基板較佳為包含實質 上不含鹼金屬成分之玻璃（無鹼玻璃p如此，玻璃基板之 玻璃係基於所應用之器件之種類及其製造步驟而適當選 擇。 器件基板之厚度並無特別限定，通常小於〇 8 ，較佳 為0.3 mm以下，進而較佳為〇15爪出以下。又較佳為 0.03 mm以上。尤其於器件基板為玻璃基板之情形時，就 玻璃基板之薄型化及/或輕量化之觀點而t，通常為小於 153708.doc 201132503 0.8 mm，較佳為〇·3 mm以下，進而較佳為0·15 mm以下。 於〇·8 mm以上之情形時，不滿足玻璃基板之薄型化及/或 輕量化之要求。於0.3 mm以下之情形時’可對玻璃基板賦 予良好之可撓性。於〇.〗5 mm以下之情形時，可將玻璃基 板捲取為輥狀。又，由於玻璃基板之製造容易，玻璃基板 之操作容易等原因，玻璃基板之厚度較佳為〇.〇3 min以 上。 樹脂基板之樹脂之種類並無特別限定。作為透明之樹 脂’可例示：聚對苯二甲酸乙二酯樹脂、聚碳酸酯樹脂、 透明氟樹脂、透明聚醯亞胺樹脂、聚醚砜樹脂、聚萘二曱 酸乙二酯樹脂、聚丙烯酸系樹脂、環烯烴樹脂、聚矽氧樹 脂、聚矽氧系有機無機混成樹脂、有機聚合物/生物奈米 纖維混成樹脂等。又，作為不透明之樹脂，可例示：聚醯 亞胺樹脂、氟樹脂、聚醯胺樹脂、芳族聚醯胺樹脂 '聚醚 趟酮樹脂、聚醚酮樹脂、各種液晶聚合物樹脂等。再者， 樹脂基板可為於表面形成保護層等功能層而成者。 (支撐板） 支撐板12係支撐並補強器件基板丨丨，於器件之製造步驟 中防止器件基板11之變形、損傷、破損等。又，於使用較 先則厚度更薄之器件基板11之情形時，藉由形成與先前之 器件基板相同厚度之積層體塊10，可於器件之製造步驟中 使用適合於先前厚度之器件基板之製造技術或製造設備， 亦為使用支撐板12之目的之一。 支撐板12之厚度可較器件基板u更厚，亦可更薄。較佳 153708.doc 201132503 為基1件基板11之厚度、樹脂層13之厚度、及積層體塊 Γ厚度而選擇切板12之厚度。例如，於現有器件之製 &步驟係m丨為對厚度Μ麵之基板進行處理者且器 件基板η之厚度與樹脂層】3之厚度之和為〇1麵之情形 時將支標板12之厚度設為〇 4 mm。於支撐板似玻璃板 之情形時，就容易操作、難以斷裂等原因而言，玻璃板之 厚度較佳為〇.〇8 mm以上。 支樓板12之種類可為一般者，例如可為玻璃板、樹脂 板、金屬板等。於器件之製造步驟伴隨熱處理之情形時， 支撐板12較佳為以與器件基板n之線膨服係數之差小之材 料形成，更佳為以與器件基板〗〗相同之材料形成。 器件基板η與 (以下僅稱為「平均線膨脹係數」）之錄佳為·1〇.7/^以 下，更佳為50〇xl〇-VC以下，進而較佳為3〇〇χΐ〇-7/ΐ以 下。若差過大，則於器件之製造步驟之加熱冷卻時，有積 層體塊10激烈翹曲，或器件基板u與支撐板12剝離之可能 性。於器件基板11之材料與支撐板12之材料相同之情形 時’無產生上述問題之虞。 (樹脂層） 樹脂層13係固定於支撐板12上’又，以可剝離之方式密 著於器件基板11之第1主面111。樹脂層13不僅防止器件基 板11之位置偏移直至進行剝離操作為止，並且藉由剝離操 作而自器件基板11上容易剝離，防止器件基板丨丨等由於剝 離操作而破損。 153708.doc •10· 201132503 樹脂層13之表面較佳為利用並非由一般之黏著劑所具有 之黏著力’而是由固體分子間之凡得瓦力引起之力，而貼 附於器件基板11之第1主面Π1。其原因在於容易剝離。本 發明中，將該樹脂層表面之可容易剝離之性質稱為剝離 性。 .另一方面，樹脂層13對支撐板12之表面之結合力較樹脂 層13對器件基板η之第丨主面ln之結合力相對更高。本發 明中，將樹脂層13表面對器件基板丨丨表面之結合稱為密 著’且將對支撐板32表面之結合稱為固定。 樹脂層13之厚度並無特別限定，較佳為5〜5〇 μιη，更佳 為5〜30 μηι，進而較佳為7〜2〇 μπι。其原因在於，若樹脂層 13之厚度為上述範圍，則樹脂層13與器件基板丨丨之密著變 付充分。又，原因在於，即便樹脂層13與器件基板η之間 介隔存在氣泡或異物，亦可抑制器件基板η之應變缺陷之 產生。又，若樹脂層13之厚度過厚，則形成需要時間及材 料，因此並不經濟。 再者，祕脂層13可包含2層以上。此時「樹脂層之厚 度」係表示所有樹脂層之合計厚度。 又於樹脂層13包含2層以上之情形時，形成各層之樹 脂之種類可不同。 曰層丨3之表面張力較佳為3〇 mN/m以下更佳為25 x下，進而較佳為22 mN/m以下。又，較佳為15 應以上。其原因在於，若為上述範圍之表面張力，則 可更容易與器件基板η剝離，同時與器件基板"之密著亦 153708.doc -11- 201132503 變得充分。 表面張力係以如下方式測定，首先，對樹脂層13使用表 面張力已知之複數種液體，測定20t下之各液體之接觸 角。繼而，將各液體之表面張力與接觸角（c〇s0)繪圖，近 似直線，外推出cose=1之表面張力值，求出樹脂層13之臨 界表面張力。將該臨界表面張力作為樹脂層13之表面張 力。 樹脂層13較佳為包含玻璃轉移點較室溫（25t左右）更低 或者不具有玻璃轉移點之材料。成為非黏著性之樹脂層， 可容易與器件基板11剝離，同時與器件基板U之密著亦變 得充分。 又，樹脂層13由於在器件之製造步驟中經加熱處理之情 況多’故較佳為具有耐熱性。 又’若樹脂層U之料難過高，㈣在件基板u 之密著性變低之傾向。另一方面，若樹脂層13之彈性模數 過低’則存在剝離性變低之傾向。 形成樹脂層13之樹脂之種類並無特別限定。例如可列舉 丙烯酸系樹脂、聚婦烴樹脂、聚胺基甲酸醋樹脂及聚石夕氧 樹脂。該等樹脂可單獨使用，亦可將若干種類之樹脂混合 使用。其中較佳為聚石夕氧樹脂。其原因在於，聚石夕氧樹脂 之耐熱性或剝離性優異。又’原因在於，於支樓板12為玻 璃板之情形時，藉由與表面之石夕院醇基之縮合反應，容易 固疋於支撐板12上。聚矽氧樹脂層就例如於3〇〇〜4〇〇艺左 右下處理1小時左右’剝離性亦基本不劣化之方面而言亦 153708.doc -12- 201132503 較佳》 松t月曰層13較佳為包含聚矽氧樹脂中用於剝離紙用途之聚 ^氧樹脂（硬化物）。使成為剝離紙用聚矽氧樹脂之硬化性 樹月日、、且成物於支撐板12之表面硬化而形成之樹脂層13由於 具有優異之剝離性而較佳。x ’由於柔軟性高，故即便在 樹脂層13與器件基板11之間混入氣泡或塵埃等異物，亦可 抑制器件基板11之應變缺陷之產生。 此種成為剝離紙用聚0氧樹脂之硬化性聚⑦氧係根據其 硬化機制而分類為縮合反應型聚矽A、加成反應型聚矽 氧焦外線硬化型聚矽氧及電子束硬化型聚矽氧，均可使 用。該等之中較佳為加成反應型聚矽氧。其原因在於，硬 反應之谷易度，形成樹脂層丨3時剝離性之程度良好，而才 熱性亦高。 加成反應型聚♦氧係由具有乙稀基等不飽和基之有機稀 基聚石夕氧烧、具有鍵結於石夕原子之氫原子的有機氫化聚石夕 氧烧與㈣觸媒等觸媒之組合而獲得之硬化性樹脂組成 物，係於常溫下或者藉由加熱而硬化成為經硬化之聚石夕氧 樹脂者。 成為剝離紙用聚石夕氧樹脂之硬化性聚石夕氧就形態方 面而言具有溶劑型、乳液型及無溶劑型，任一種類型均可 使用。該等之"交佳為無溶劑型。其原因在於，生產性、 安全性、環境特性之方面優異。x，由於不包含形成樹脂 層13時之硬化時，即加熱硬化、紫外線硬化或者電子束硬 化時產生發泡之溶劑，故樹脂層〗3中不易殘留氣泡。 153708.doc 201132503 又，作為成為剝離紙用聚石夕氧樹脂之硬化性聚石夕氧，具 體而δ，作為市售之商品名或者型號，可列舉kns-320A、 KS-847(均為 Shin-Etsu Silicone 公司製造）、tpr67〇〇(geTransistor, TFT), color filter (CF). As the device, a solar cell (PV), a liquid crystal panel (LCD), an organic EL panel (OLED), or the like can be exemplified. The device member is formed on the second main surface 112 of the device substrate 11 after the peripheral surface of the laminated body block 1 is planarized. The type of the device substrate 11 may be a metal substrate such as a glass substrate, a resin substrate, or a SUS (Special Use Stainless) substrate. Among these substrates, a glass substrate is preferred. The reason for this is that the glass substrate is excellent in chemical resistance and moisture permeability, and has a low heat shrinkage rate. As an index of the heat shrinkage rate, the linear expansion coefficient specified in JIS r 3丨〇2_丨995 is used. If the linear expansion coefficient of the device substrate 11 is large, the manufacturing steps of the device are often accompanied by heat treatment of 153708.doc 201132503, so that various disadvantages are likely to occur. For example, in the case where a TFT is formed on the device substrate 11, if the device substrate 11 on which τρτ is formed is cooled under heating, the positional shift of the TFT becomes excessive due to heat shrinkage of the device substrate. . The glass substrate is obtained by melting a glass raw material and forming the molten glass into a plate shape. Such a forming method may be a general one, for example, a floating method, a fusion method, a flow down method, a Fourcault method, a reverse method, or the like. Further, a glass substrate having a particularly small thickness is obtained by heating a glass which has been temporarily formed into a plate shape to a temperature at which it can be formed, and stretching it by a method such as stretching and thinning (re-drawing). The glass of the glass substrate is not particularly limited, and is preferably an alkali-free glass, a borosilicate glass, a soda-lime glass, a high-cerium oxide glass, or another oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide in an amount of from 4 to 9% by mass in terms of oxide. As the glass of the glass substrate, it is preferred to use a glass suitable for the kind of the device or the manufacturing steps thereof. For example, since the elution of the metal component is likely to affect the liquid crystal, the glass substrate for the liquid crystal panel preferably contains a glass substantially free of an alkali metal component (the alkali-free glass p is such that the glass substrate of the glass substrate is based on the application. The thickness of the device substrate is not particularly limited, and is usually less than 〇8, preferably 0.3 mm or less, more preferably 〇15 claws or less, and more preferably 0.03 mm or more. In particular, when the device substrate is a glass substrate, t is usually less than 153708.doc 201132503 0.8 mm, preferably 〇·3 mm or less, and more preferably from the viewpoint of thinning and/or weight reduction of the glass substrate. 0. 15 mm or less. When the thickness is 8 mm or more, the glass substrate is not required to be thinner and/or lighter. When it is 0.3 mm or less, it can provide good flexibility to the glass substrate.于〇.〗: 5 mm or less, the glass substrate can be wound into a roll. Moreover, the thickness of the glass substrate is better because of the ease of manufacture of the glass substrate, the ease of operation of the glass substrate, and the like. The type of the resin of the resin substrate is not particularly limited. As the transparent resin, polyethylene terephthalate resin, polycarbonate resin, transparent fluororesin, and transparent polysiloxane can be exemplified. Amine resin, polyether sulfone resin, polyethylene naphthalate resin, polyacrylic resin, cycloolefin resin, polyoxynoxy resin, polyfluorene-based organic-inorganic hybrid resin, organic polymer/bio-nano fiber blend Resin, etc. Further, as the opaque resin, polyimine resin, fluororesin, polyamide resin, aromatic polyamide resin, polyether ketone resin, polyether ketone resin, various liquid crystal polymer resins can be exemplified. Further, the resin substrate may be formed by forming a functional layer such as a protective layer on the surface. (Supporting plate) The supporting plate 12 supports and reinforces the device substrate 丨丨 to prevent deformation of the device substrate 11 in the manufacturing process of the device, Damage, breakage, etc. Further, in the case of using the device substrate 11 which is thinner than the previous one, by forming the laminated body block 10 having the same thickness as the previous device substrate, the manufacturing process of the device can be performed. The use of a manufacturing technique or manufacturing apparatus suitable for a device substrate of a previous thickness is also one of the purposes of using the support board 12. The thickness of the support board 12 may be thicker or thinner than the device substrate u. Preferably, 153708.doc 201132503 selects the thickness of the cutting board 12 for the thickness of the base substrate 11, the thickness of the resin layer 13, and the thickness of the laminated body block. For example, in the prior art device, the step is a substrate having a thickness of the surface. When the processor is used and the sum of the thickness of the device substrate η and the thickness of the resin layer 3 is 〇1, the thickness of the support plate 12 is set to 〇4 mm. When the support plate is like a glass plate, it is easy. The thickness of the glass plate is preferably 〇.〇 8 mm or more for reasons of handling, difficulty in breaking, and the like. The type of the floor panel 12 may be a general one, and may be, for example, a glass plate, a resin plate, a metal plate or the like. In the case where the manufacturing step of the device is accompanied by heat treatment, the support plate 12 is preferably formed of a material having a small difference from the linear expansion coefficient of the device substrate n, and more preferably formed of the same material as the device substrate. The recording of the device substrate η and (hereinafter simply referred to as "average linear expansion coefficient") is preferably 1 〇.7/^ or less, more preferably 50 〇 xl 〇 -VC or less, and further preferably 3 〇〇χΐ〇 - 7/ΐ below. If the difference is too large, there is a possibility that the laminated body block 10 is warped sharply or the device substrate u is peeled off from the support plate 12 during the heating and cooling of the manufacturing steps of the device. In the case where the material of the device substrate 11 is the same as that of the support plate 12, there is no such problem. (Resin Layer) The resin layer 13 is fixed to the support plate 12, and is detachably adhered to the first main surface 111 of the device substrate 11. The resin layer 13 not only prevents the position of the device substrate 11 from being displaced until the peeling operation is performed, but also is easily peeled off from the device substrate 11 by the peeling operation, thereby preventing the device substrate flaw or the like from being damaged by the peeling operation. 153708.doc •10· 201132503 The surface of the resin layer 13 is preferably attached to the device substrate 11 by the force which is not caused by the adhesive force of the general adhesive but by the van der Waals force between the solid molecules. The first main face is Π1. The reason is that it is easy to peel off. In the present invention, the property of easily peeling off the surface of the resin layer is referred to as releasability. On the other hand, the bonding force of the resin layer 13 to the surface of the support plate 12 is relatively higher than the bonding force of the resin layer 13 to the second major surface ln of the device substrate η. In the present invention, the bonding of the surface of the resin layer 13 to the surface of the device substrate is referred to as "here" and the bonding to the surface of the support plate 32 is referred to as fixing. The thickness of the resin layer 13 is not particularly limited, but is preferably 5 to 5 μm, more preferably 5 to 30 μm, and still more preferably 7 to 2 μm. The reason for this is that if the thickness of the resin layer 13 is within the above range, the adhesion between the resin layer 13 and the device substrate is sufficient. Further, the reason is that even if bubbles or foreign matter are interposed between the resin layer 13 and the device substrate η, the occurrence of strain defects of the device substrate η can be suppressed. Further, if the thickness of the resin layer 13 is too thick, it takes time and material to form, which is not economical. Further, the secret lipid layer 13 may contain two or more layers. The "thickness of the resin layer" at this time means the total thickness of all the resin layers. Further, when the resin layer 13 contains two or more layers, the types of the resins forming the respective layers may be different. The surface tension of the ruthenium layer 3 is preferably 3 〇 mN/m or less, more preferably 25 x, and still more preferably 22 mN/m or less. Further, it is preferably 15 or more. The reason for this is that if the surface tension is in the above range, the device substrate η can be more easily peeled off, and the adhesion to the device substrate is also 153708.doc -11-201132503. The surface tension was measured in the following manner. First, a plurality of liquids having a known surface tension were used for the resin layer 13, and the contact angle of each liquid at 20 t was measured. Then, the surface tension of each liquid and the contact angle (c 〇 s0) were plotted, and the surface tension value was approximated by a straight line, and the surface tension of the resin layer 13 was determined. This critical surface tension is taken as the surface tension of the resin layer 13. The resin layer 13 preferably contains a material having a glass transition point lower than room temperature (about 25 t) or having no glass transition point. The non-adhesive resin layer can be easily peeled off from the device substrate 11, and the adhesion to the device substrate U is also sufficient. Further, the resin layer 13 is preferably heat-resistant because it is subjected to heat treatment in the manufacturing process of the device. Further, if the material of the resin layer U is too high, (4) the adhesion to the substrate u tends to be low. On the other hand, if the elastic modulus of the resin layer 13 is too low, the peeling property tends to be low. The type of the resin forming the resin layer 13 is not particularly limited. For example, an acrylic resin, a polysulfide resin, a polyurethane vinegar resin, and a polyoxin resin can be mentioned. These resins may be used singly or in combination of several types of resins. Among them, polystone oxide resin is preferred. The reason for this is that the polysulfide resin is excellent in heat resistance or peelability. Further, the reason is that, in the case where the branch floor panel 12 is a glass plate, it is easily fixed to the support plate 12 by a condensation reaction with the surface of the stone base. The polyoxyxene resin layer is treated, for example, at about 3 〇〇 4 〇〇 1 1 1 ' ' ' ' ' ' 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 153 It is preferably a polyoxyl resin (hardened product) for use in a release paper in a polyoxyxylene resin. The resin layer 13 which is formed by curing the surface of the support sheet 12 with the curable property of the polyoxymethylene resin for release paper is excellent in peelability. Since x' is high in flexibility, even if foreign matter such as bubbles or dust is mixed between the resin layer 13 and the device substrate 11, the occurrence of strain defects of the device substrate 11 can be suppressed. The curable poly 7-oxygen which is a polyoxo resin for release paper is classified into a condensation reaction type polyfluorene A according to the curing mechanism thereof, an addition reaction type polyxylene oxygen external line hardening type polyfluorene oxygen, and an electron beam curing type. Polyoxane can be used. Among these, an addition reaction type polyoxane is preferred. The reason for this is that the hardness of the hard reaction is good, and the degree of peeling property is good when the resin layer 丨3 is formed, and the heat is also high. The addition reaction type polyoxo is an organic hydrogenated polyoxo-oxygenated gas having an unsaturated group such as an ethylene group, an organic hydrogenated polyoxo-oxygen atom having a hydrogen atom bonded to a stone atom, and a (four) catalyst. The curable resin composition obtained by the combination of the catalysts is cured at room temperature or by heating to form a hardened polyoxin. The curable polyglycol in the form of a polysulfide resin for a release paper has a solvent type, an emulsion type, and a solventless type, and any of them can be used. These are preferred to be solvent-free. The reason is that it is excellent in terms of productivity, safety, and environmental characteristics. x does not contain a solvent which is foamed when the resin layer 13 is formed, that is, heat-hardening, ultraviolet curing, or electron beam hardening. Therefore, bubbles are less likely to remain in the resin layer 3. 153708.doc 201132503 In addition, as a commercially available product name or model, krs-320A and KS-847 (both Shin) are used as the curable polysulfide of the polysulfide resin for the release paper. -Etsu Silicone company), tpr67〇〇(ge

Toshiba Silicone公司製造）、乙烯基聚矽氧「85〇〇」（荒川 化學工業股份有限公司製造）與曱基氫化聚矽氧烷 「12031」（荒川化學工業股份有限公司製造）之組合、乙烯 基聚矽氧「1 1364」（荒川化學工業股份有限公司製造）與甲 基氫化聚矽氧烷「12031」（荒川化學工業股份有限公司製 造）之組合、乙烯基聚矽氧「1 1365」（荒川化學工業股份有 限公司製造）與曱基氫化聚矽氧烷r 12〇31」（荒川化學工業 股份有限公司製造）之組合等。 再者，KNS-320A、KS-847及TPR6700係預先含有主劑 及交聯劑之硬化性聚矽氧。 又’形成樹脂層13之聚矽氧樹脂較佳為具有聚矽氧樹脂 層中之成分難以轉移至器件基板丨丨之性質，即低聚矽氧轉 移性。 (固定方法） 將樹脂層13固定於支撐板12上之方法並無特別限定，例 如可列舉將膜狀之樹脂固定於支撐板丨2之表面之方法。具 體而言可列舉如下方法：為了對支撐板12之表面賦予對膜 表面之高固定力（高剝離強度），而對支撐板12之表面進行 表面改質處理（底塗處理），以固定於支撐板12上。例如可 例不.使如石夕烧偶合劑般以化學方式提高固定力之化學方 法（底塗處理）、如火焰（flame)處理般使表面活性基增加之 153708.doc 14 201132503 物理方法、如喷砂處理船藉ώ 月精由使表面之粗糙度增加而增加 勾掛之機械性處理方法等。 又例如可列舉將成為樹脂層j 3之硬化性樹脂組成物塗 佈於支樓板12上之方法。作為塗佈之方法，可列舉喷塗 法、模塗法、旋塗法、浸塗法、輥塗法、棒塗法絲網印 刷法、凹版塗佈法犛。自μ、+、+丄 寺自上述方法之中，可根據樹脂組成 物之種類而適當選擇。 又，於將成為樹脂層13之硬化性樹脂組成物塗佈於支撐 板12上之情形時，其塗佈量較佳為1〜100 g/m2，更佳為 5〜20 g/m2。 例如於由加成反應型聚矽氧之硬化性樹脂組成物形成樹 脂層13之情形時，係將包含烯基聚矽氧烷、有機氫化聚矽 氧烷與觸媒之混合物的硬化性樹脂組成物，利用上述喷塗 法等公知之方法塗佈於支撐板12上，其後使其加熱硬化。 加熱硬化條件根據觸媒之調配量而有所不同，例如於相對 於烯基聚石夕氧烧與有機氫化聚石夕氧烧之合計量質量 份’調配翻系觸媒2質量份之情形時，係於大氣中5〇〇c〜 250°C、較佳為i00°c 〜2〇(rc下反應。又，此時之反應時間 為5〜60分鐘，較佳為1〇〜3〇分鐘。為形成具有低聚矽氧轉 移性之聚矽氧樹脂層，較佳為儘可能進行硬化反應，以使 聚矽氧樹脂層中不殘留未反應之聚矽氧成分。若為如上所 述之反應溫度及反應時間’則可使聚矽氧樹脂層中基本不 殘留未反應之聚矽氧成分，故較佳。於較上述反應時間過 長’或反應溫度過高之情形時’有同時產生聚矽氧樹脂之 153708.doc 15 201132503 氧化分解，生成低分子量之聚矽氧成分，聚矽氧轉移性變 高之可能性。為使加熱處理後之剝離性良好，亦較佳為儘 可能進行硬化反應’以使聚矽氧樹脂層中不殘留未反應之 聚矽氧成分。 又，例如於使用成為剝離紙用聚石夕氧樹脂之硬化性樹脂 組成物製造樹脂層13之情形時，將塗佈於支撐板12上之硬 化性樹脂組成物加熱硬化而形成聚矽氧樹脂層。藉由使硬 化性樹脂組成物加熱硬化，則於硬化反應時聚矽氧樹脂與 支撐板12化學性結合。又，藉由增黏效果，聚矽氧樹脂層 與支撐板12結合。藉由該等作用，聚矽氧樹脂層牢固地固 定於支撐板12上》 (密著方法） 使形成於支撐體上之樹脂層13以可剝離之方式密著於器 件基板11上之方法可為公知之方法。例如可列舉如下方 法·於常壓環境下在樹脂層丨3之剝離性表面重疊器件基板 11後，使用輥或加壓機使樹脂層13與器件基板u壓接。藉 由以輥或加壓機進行壓接，樹脂層13與器件基板u進一步 密著，故較佳。又，藉由輥或加壓機之壓接，混入至樹脂 層13與器件基板11之間的氣泡比較容易去除，故較佳。 若將形成於支撐體上之樹脂層13與器件基板丨丨利用真空 層壓法或真空加壓法進行壓接，則更佳地抑制氣泡之混入 或續保良好之密著，故更佳。藉由在真空下壓接，即便於 微小氣泡殘存之情形時’巾無藉由加熱而氣泡成長之情 況，具有難以牽涉到器件基板u之應變缺陷的優點。 I53708.doc -16- 201132503 當使樹脂層13以可剝離之方式密著於器件基板丨丨上哼， 較佳為將樹脂層13及器件基板11之相互接觸之側之面充分 清洗，於潔淨度高之環境中積層。即便在樹脂層丨3與器件 基板11之間混入異物，亦無由於樹脂層丨3變形而對器件基 板11之表面之平坦性造成影響之情況，潔淨度越高，其平 坦性越變得良好，故較佳。 再者，對將樹脂層1 3固定於支撐板1 2上之步驟、使樹脂 層13以可剝離之方式密著於器件基板n上之步驟之順序並 無限制，例如可為大致同時.。 (積層體塊之切斷） 於以上述方式獲得之積層體塊1〇之外周面14，有形成凹 槽1 5之情況。例如’如圖2所示，於器件基板丨〖或支撐板 12為經倒角加工者之情形時，或於樹脂層13係將液狀之樹 脂組成物塗佈於支撐板12上並加熱硬化而成者之情形時， 由於器件基板11或支撑板12、樹脂層13之外周面帶有圓 形’故導致於積層體塊10之外周面14形成凹槽15。 本實施形態中’如圖1所示’積層體之製造方法包括如 下步驟：將積層體塊切斷為預定尺寸，使積層體塊之外周 面之至少圓周方向一部分平面化（步驟SU)。更詳細而 言’將積層體塊切斷為預定尺寸’去除積層體塊之外周部 之至少圓周方向一部分（較佳為圓周方向全周），使積層體 塊之外周面之至少圓周方向一部分（較佳為圓周方向全周） 平面化。 將積層體塊10切斷之方法可為一般方法。例如可列舉. 153708.doc 17 201132503 以刃具切斷之方法；以雷射等高能量線熔斷之法；使用刀 具或雷射等於器件基板及支撐板中之至少一板狀物之主面 形成劃線’沿劃線割斷之方法等。該等切斷方法可單獨或 組合使用。如上所述，所謂切斷，包括熔斷或割斷。 切斷方法可根據器件基板u、支撐板12、樹脂層13之種 類或厚度等而適當選擇。例如，於器件基板u或支撐板以 包含玻璃之情形時，較佳為於玻璃之主面形成劃線，其 後，將積層體塊ίο彎曲變形而沿劃線割斷之方法。又，^ 器件基板11及支撐板12包含玻璃之情形時，較佳為於兩者 之玻璃之主面形成劃線，其後，將積層體塊1〇彎曲變形而 沿兩者之劃線割斷之方法。於割斷之情形時，較佳為樹脂 層13之厚度為50 μηι以下。若樹脂層13過厚，則割斷變得 困難。 切斷方向可為自器件基板u朝向支撐板12之方向，亦可 為自支撐板12朝向器件基板U之方向。又，切斷方向可為 -方向’亦可為兩方向。進而’切斷方向較佳為與積層體 塊之厚度方向（即樹脂層之厚度方向）大致平行。其原因在 於’可減小樹脂層13之露出面積，可抑制器件製造步驟中 之加熱處理所引起之樹脂層丨3之劣化。 圖3係本發明之第!實施形態中之外周面平面化後之積/ 體塊之部分側面圖。圖3之積層體塊1〇A係沿圖2之心 將積層體塊1G切斷而成者。平面化後之器件基板n A、^ 撐板12A、樹脂層13A分別對應於平面化前之器件基未 11、支撐板12、樹脂層13 » 153708.doc 201132503 平面化後之積層體塊10A係於器件基板11A與支撐板12A 之間***有樹脂層】3 A者。樹脂層1 3 A係以可剝離之方式 密著於器件基板11A之第1主面111A’並且固定於支禮板 12A上。再者，於器件基板11A之第2主面112A形成器件用 構件’詳情如後述。 平面化後之積層體塊1 〇A之外周面14A係如圖3所示，成 為平面，凹槽15(參照圖2)經去除。 但，若存在上述凹槽1 5，則於器件之製造步驟中，抗蝕 液等塗佈液藉由毛細管現象而浸入，容易積存。積存於凹 槽15内之塗佈液即便藉由清洗亦難以去除，乾燥後容易殘 留H該殘:¾於器件製造步驟之加熱處理步驟中成為發 塵源，因此發塵污染加熱處理步驟内，使作為製品之器件 之良率下降。 本實施形態中，由於 p/)播1 ^ λ 、凹槽15經去除，故於器件之製造步 驟中，塗佈液之殘渣難以藉左 '旦難U積存。因此，可於加熱處理步驟 中抑制發塵，可抑制作為 σ 兩I 〇 口之态件之良率之下降。 (積層體塊之倒角） 肢乏製造方法更包括如下步 π固1尸η· w , ^ ^ 層體塊之外周面之經平而 化之up分之角部倒角（步驟 SU)。藉由倒角，可提高耐衝擊性、安全性。 但，於使積層體塊之外R二τ 卜周面平面化之前將積層體塊之角 部倒角之情形時’若積層許 鬼之外周面存在凹槽，則有器 件基板之端部或支樓板之端Α ~ °卩撓曲而破損之情況。 本實施形態中，由於在4 使積層體塊之外周面平面化之後 I53708.doc •19· 201132503 將積層體塊之角部倒角，故凹槽經預先去除。因此，倒角 時，可抑制器件基板之端部或支樓板之端部撓曲而破損。 倒角方法可為—般方法。例如可列舉❹研磨機等倒角 機之方法。㈣之種類可為如圖4所示將平面化後之角部 110、120加工為平面之倒角，亦可為如圓5所示將平面化 後之角部11 〇、12 0加工為圓抓仙二> η / 一 馮圓弧狀面之R倒角，亦可為如圖ό 所示將平面化後之角部110、120加工為平面與圓弧狀面之 組合之倒角，並無特別限定。又，可為削除樹脂層之倒 角’亦可為不削除樹脂層之倒角。 倒角尺寸係根據器件基板、支樓板、樹脂層之種類或厚 度等而適當選擇。於尺倒角之情形時，器件基板側之曲率 半徑R1與支撐板側之曲率半徑R2可相同，亦可不同。於 將角部加工為平面之情形時，器件基板側之倒角角度_ 支撐板側之倒角角度Θ2可相同，亦可不同。 倒角後，較佳為樹脂層之外周面之經平面化之部分變得 與樹脂層之厚度方向大致平行。藉此，可減小樹脂層之露 出面積。 若樹脂層之露出面積大，則藉由器件之製造步驟中之加 熱處理’樹脂層變得容易劣化。 本實施形態中，由於可減小樹脂層之露出面積，故於器 件之製造步驟中，可抑制樹脂層之劣化。 圖7係本發明之第1實施形態中之倒角後之積層體塊之部 分側面圖。圖7中，將倒角前之積層體塊之形狀以虛線表 示。圖7之積層體塊10B係將圖3之積層體塊1〇A之切斷面 153708.doc •20· 201132503 之兩角部進行R倒角而成者。倒角後之器件基板UB、支 撐板12B '樹脂層13B分別對應於倒角前之器件基板丨丨八、 支撐板12A、樹脂層13A。 倒角後之積層體塊10 B係於器件基板丨丨B與支撐板丨2 B之 間***有樹脂層138者樹脂層13B係以可剝離之方式密A combination of vinyl polyoxylium "85〇〇" (manufactured by Arakawa Chemical Industries Co., Ltd.) and sulfhydryl hydrogenated polyoxane "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.), vinyl Polyoxylium "1 1364" (manufactured by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogenated polyoxyalkylene "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.), vinyl polyoxylium "1 1365" (Arakawa) Chemical Industry Co., Ltd. is manufactured in combination with mercaptohydrogenated polyoxane r 12〇31" (manufactured by Arakawa Chemical Industries Co., Ltd.). Further, KNS-320A, KS-847 and TPR6700 are preliminarily containing a hardening polysiloxane of a main component and a crosslinking agent. Further, the polyoxyxene resin forming the resin layer 13 preferably has a property that it is difficult to transfer the components in the polyoxyxylene resin layer to the device substrate, i.e., oligomeric oxygen transfer property. (Fixing method) The method of fixing the resin layer 13 to the support plate 12 is not particularly limited, and for example, a method of fixing the film-like resin to the surface of the support plate 2 can be mentioned. Specifically, in order to impart a high fixing force (high peel strength) to the surface of the support plate 12 to the surface of the support plate 12, the surface of the support plate 12 is subjected to surface modification treatment (primer treatment) to be fixed to Support plate 12 is provided. For example, a chemical method (primer treatment) which chemically increases the fixing force like a sulphur coupling agent, and a surface active group may be added as in a flame treatment, 153708.doc 14 201132503 physical method, such as The blasting treatment boat borrows 机械 精 由 by the mechanical treatment of the hook to increase the roughness of the surface. Further, for example, a method of coating the curable resin composition which is the resin layer j 3 on the floor panel 12 can be mentioned. Examples of the coating method include a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a gravure coating method, and a gravure coating method. From the above methods, the μ, +, and + 寺 temples can be appropriately selected depending on the kind of the resin composition. In the case where the curable resin composition to be the resin layer 13 is applied to the support sheet 12, the coating amount thereof is preferably from 1 to 100 g/m2, more preferably from 5 to 20 g/m2. For example, in the case where the resin layer 13 is formed of a curable resin composition of an addition reaction type polyoxymethylene, a curable resin comprising a mixture of an alkenyl polysiloxane, an organic hydrogenated polyoxyalkylene and a catalyst is used. The object is applied onto the support plate 12 by a known method such as the above-described spraying method, and then heat-hardened. The heat-hardening condition varies depending on the amount of the catalyst to be mixed, for example, when the amount of the catalyst is 2 parts by mass based on the total mass parts of the alkenyl polyoxo-oxygen and the organic hydrogenated polyoxo-oxygen. , in the atmosphere 5 〇〇 c ~ 250 ° C, preferably i00 ° c ~ 2 〇 (reaction under rc. Also, the reaction time is 5 to 60 minutes, preferably 1 〇 ~ 3 〇 minutes In order to form a polyoxynoxy resin layer having an oligomeric oxime oxygen transfer property, it is preferred to carry out a hardening reaction as much as possible so that no unreacted polyfluorene oxide component remains in the polyoxynoxy resin layer. The reaction temperature and the reaction time are such that substantially no unreacted polyfluorene oxide component remains in the polyoxyxene resin layer, and it is preferred to be produced at the same time when the reaction time is too long or the reaction temperature is too high. Polyoxygenated resin 153708.doc 15 201132503 Oxidative decomposition, the formation of a low molecular weight polyfluorene oxygen component, the possibility of high metastatic oxygen transferability. In order to improve the peelability after heat treatment, it is preferred to carry out as much as possible. Hardening reaction 'so that no residue remains in the polyoxynated resin layer In the case where the resin layer 13 is produced by using a curable resin composition which is a polysulfide resin for a release paper, the curable resin composition applied to the support plate 12 is heated. The polyoxynoxy resin layer is formed by hardening, and the curable resin composition is heat-hardened to chemically bond the polyoxyl resin to the support plate 12 during the hardening reaction. Further, the polyoxyphthalocene resin layer is formed by the adhesion-increasing effect. Combined with the support plate 12. By these actions, the polyoxyxylene resin layer is firmly fixed to the support plate 12" (adhesive method), the resin layer 13 formed on the support is detachably adhered to the device The method of the substrate 11 can be a well-known method, for example, a method in which the resin layer 13 and the device substrate are bonded using a roll or a press machine after the device substrate 11 is superposed on the peeling surface of the resin layer 3 in a normal pressure environment. It is preferable that the resin layer 13 is further adhered to the device substrate u by pressure bonding by a roll or a press machine, and is further mixed into the resin layer 13 by pressure bonding by a roll or a press machine. Air bubbles between the device substrates 11 It is preferable to remove the resin layer 13 formed on the support and the device substrate by vacuum lamination or vacuum pressurization, thereby more preferably suppressing the incorporation or renewal of bubbles. The adhesion is better, and it is better to pressurize under vacuum, even if the microbubbles remain, the bubble does not grow by heating, and there is an advantage that it is difficult to involve the strain defect of the device substrate u. .doc -16- 201132503 When the resin layer 13 is detachably adhered to the device substrate, it is preferable to sufficiently clean the side of the resin layer 13 and the device substrate 11 which are in contact with each other. In a high-environment environment, even if foreign matter is mixed between the resin layer 丨3 and the device substrate 11, the flatness of the surface of the device substrate 11 is not affected by the deformation of the resin layer ,3, and the cleanliness is higher. The flatness becomes better, so it is preferable. Further, the order of fixing the resin layer 13 to the support plate 12 and the step of adhering the resin layer 13 to the device substrate n in a peelable manner are not limited, and may be, for example, substantially simultaneous. (Cutting of the laminated body block) In the outer peripheral surface 14 of the laminated body block 1 obtained in the above manner, the groove 15 is formed. For example, as shown in FIG. 2, when the device substrate 或 or the support plate 12 is a chamfered processor, or the resin layer 13 is applied to the support plate 12 and heat-hardened. In the case of the original case, since the peripheral surface of the device substrate 11 or the support plate 12 and the resin layer 13 has a circular shape, the groove 15 is formed on the outer peripheral surface 14 of the laminated body block 10. In the present embodiment, the manufacturing method of the laminated body as shown in Fig. 1 includes the steps of: cutting the laminated body block into a predetermined size, and planarizing at least a part of the circumferential direction of the outer peripheral surface of the laminated body block (step SU). More specifically, 'cutting the laminated body block to a predetermined size', removing at least a part of the circumferential direction of the outer peripheral portion of the laminated body block (preferably, the entire circumference in the circumferential direction) so that at least a part of the circumferential direction of the outer peripheral surface of the laminated body block is It is preferably planarized in the circumferential direction. The method of cutting the laminated body block 10 can be a general method. For example, 153708.doc 17 201132503 cutting method with a cutting tool; melting with a high energy line such as a laser; forming a stroke using a tool or a laser equal to the main surface of at least one of the device substrate and the support plate The line 'cuts along the line, etc. These cutting methods can be used singly or in combination. As described above, the cutting, including blowing or cutting. The cutting method can be appropriately selected depending on the type, thickness, and the like of the device substrate u, the support plate 12, and the resin layer 13. For example, when the device substrate u or the support plate contains glass, it is preferable to form a scribe line on the main surface of the glass, and thereafter, the laminated body block is bent and deformed to be cut along the scribe line. Further, when the device substrate 11 and the support plate 12 include glass, it is preferable to form a scribe line on the main surface of both of the glass, and thereafter, the laminated body block 1 is bent and deformed, and the scribe lines are cut along the two lines. The method. In the case of cutting, the thickness of the resin layer 13 is preferably 50 μη or less. If the resin layer 13 is too thick, cutting becomes difficult. The cutting direction may be from the direction in which the device substrate u faces the support plate 12 or in the direction from the support plate 12 toward the device substrate U. Further, the cutting direction may be - direction ' or both directions. Further, the cutting direction is preferably substantially parallel to the thickness direction of the laminated body (i.e., the thickness direction of the resin layer). The reason for this is that the exposed area of the resin layer 13 can be reduced, and the deterioration of the resin layer 丨3 caused by the heat treatment in the device manufacturing step can be suppressed. Fig. 3 is a partial side elevational view of the product/body block after the outer peripheral surface is planarized in the embodiment of the present invention. The laminated body block 1A of Fig. 3 is obtained by cutting the laminated body block 1G along the center of Fig. 2 . The planarized device substrate n A, the support 12A, and the resin layer 13A correspond to the device substrate 11 before the planarization, the support plate 12, and the resin layer 13 » 153708.doc 201132503 The planarized bulk block 10A after planarization A resin layer 3 A is inserted between the device substrate 11A and the support plate 12A. The resin layer 13 3A is detachably adhered to the first main surface 111A' of the device substrate 11A and fixed to the cover sheet 12A. Further, the device member is formed on the second principal surface 112A of the device substrate 11A, and the details will be described later. The outer peripheral surface 14A of the laminated body block 1 〇A after planarization is formed into a plane as shown in Fig. 3, and the groove 15 (refer to Fig. 2) is removed. However, in the case where the groove 15 is present, the coating liquid such as a resist liquid is immersed in a capillary phenomenon in the manufacturing process of the device, and is easily accumulated. The coating liquid accumulated in the groove 15 is difficult to remove even by washing, and it is easy to remain after drying. This residue is a source of dust in the heat treatment step of the device manufacturing step, so that the dust is contaminated in the heat treatment step. The yield of the device as a product is lowered. In the present embodiment, since p/) is broadcast 1 ^ λ and the groove 15 is removed, it is difficult for the residue of the coating liquid to accumulate in the manufacturing step of the device. Therefore, it is possible to suppress dust generation in the heat treatment step, and it is possible to suppress a decrease in the yield of the state which is a σ two I port. (Chamfering of the laminated body block) The method of manufacturing the limbs further includes the following steps: π solid 1 nt· w , ^ ^ The corner of the upper part of the outer layer of the layer block is chamfered (step SU). By chamfering, impact resistance and safety can be improved. However, when the corners of the laminated body block are chamfered before the R 2 τ surrounding surface of the laminated body block is planarized, if there is a groove on the peripheral surface other than the laminated layer, there is an end portion of the device substrate or The end of the slab is 卩 卩 卩 deflection and damage. In the present embodiment, since the peripheral surface of the laminated body block is planarized by 4, I53708.doc • 19·201132503 chamfers the corner portion of the laminated body block, so that the groove is removed in advance. Therefore, at the time of chamfering, it is possible to suppress the end portion of the device substrate or the end portion of the branch floor from being bent and broken. The chamfering method can be a general method. For example, a method of a chamfering machine such as a grinder can be cited. (4) The type may be that the planarized corner portions 110, 120 are processed into a plane chamfer as shown in FIG. 4, or the flattened corner portions 11 〇, 120 may be processed into a circle as shown by the circle 5.抓仙二> η / A von arc-shaped R-chamfering, can also be used as shown in Figure 将 to form the chamfered corners 110, 120 into a combination of plane and arc-shaped surface chamfer, There is no particular limitation. Further, the chamfering of the resin layer may be removed or the chamfering of the resin layer may not be removed. The chamfer size is appropriately selected depending on the type of the device substrate, the floor panel, the resin layer, or the thickness. In the case of chamfering, the radius of curvature R1 on the side of the device substrate may be the same as or different from the radius of curvature R2 on the side of the support plate. When the corner portion is processed into a flat surface, the chamfer angle _2 on the side of the device substrate _ on the side of the support plate may be the same or different. After chamfering, it is preferred that the planarized portion of the outer peripheral surface of the resin layer is substantially parallel to the thickness direction of the resin layer. Thereby, the exposed area of the resin layer can be reduced. If the exposed area of the resin layer is large, the resin layer is easily deteriorated by the heat treatment in the manufacturing process of the device. In the present embodiment, since the exposed area of the resin layer can be made small, deterioration of the resin layer can be suppressed in the manufacturing step of the device. Fig. 7 is a side elevational view showing a portion of the laminated body block after chamfering in the first embodiment of the present invention. In Fig. 7, the shape of the laminated body block before chamfering is indicated by a broken line. The laminated body block 10B of Fig. 7 is obtained by chamfering the two corners of the cut surface 153708.doc • 20· 201132503 of the laminated body block 1A of Fig. 3 . The chamfered device substrate UB and the support plate 12B' resin layer 13B correspond to the device substrate 28 before the chamfering, the support plate 12A, and the resin layer 13A, respectively. The laminated body block 10B after chamfering is inserted between the device substrate 丨丨B and the support plate 丨2B, and the resin layer 13B is detachably sealed.

者於器件基板11B之第1主面111B，並且固定於支撐板12B 上。 倒角後之積層體塊10B係如圖7所示，外周面14B帶有圓 形，因此耐衝擊性或安全性優異。 倒角後之積層體塊10B如圖7所示，樹脂層13B之外周面 134B變得與樹脂層13B之厚度方向（圖7中箭頭a方向）大 致平行，因此樹脂層13B之露出面積減小。因此，藉由器 件之製造步驟中之加熱處理，可抑制樹脂層13B劣化。 (積層體塊之研磨） 如圖1所示，於器件基板為利用浮式法製造之玻璃基板 之情形時，積層體之製造方法可更包括於倒角後（即平面 化後）’研磨器件基板之第2主面之研磨步驟（步驟sn)。此 處，利用浮式法製造之玻璃基板中包括利用再拉法，將利 用浮式法製造之玻璃基板拉伸而使厚度進一步變薄之玻璃 基板。 浮式法係於浮浴内之熔融錫上流出熔融玻璃，使其於下 向μ方向流動而成形為帶板狀玻璃之方法。將帶板狀玻璃 切斷而製造玻璃基板，但於玻璃基板表面產生微小之凹凸 或起伏。 153708.doc -21 · 201132503 藉由上述研磨步驟中之研磨’可去除玻璃基板表面之微 小凹凸或起伏，可提高形成器件用構件之面之平坦性。因 此，可提高作為製品之器件之可靠性。該效果於玻璃基板 之厚度為0.03〜〇_3 mm之情形時較為顯著。其原因在於， 厚度0.03〜0.3 mm之玻璃基板難以單獨研磨，難以於形成 積層體塊之前預先研磨。 但’於平面化前研磨器件基板之第2主面之情形時，若 於積層體塊之外周面存在凹槽’則有研磨劑進入凹槽中而 未去除’或器件基板撓曲而破損之情況。又，即便在平面 化後’於倒角前研磨器件基板之第2主面之情形時，器件 基板之銳利角部亦容易破損。 本實施形態中，於倒角後（即平面化後）研磨器件基板之 第2主面，因此器件基板之角部經預先倒角，且凹槽經預 先去除。因此，研磨時可抑制研磨劑對凹槽之附著或器件 基板破損。 研磨方法可為一般方法。例如可列舉使用氧化鈽等研磨 粒之研磨方法。 研磨裕度係根據器件基板之厚度或所使用之器件而適當 設定，例如為0.05〜10 μηι。 圖8係本發明之第丨實施形態中之研磨後之積層體塊之部 分側面圖。圖8中，將研磨前之積層體塊之形狀以虛線表 示。圖8之積層體塊10C係對圖7之積層體塊1〇Β之器件基 板11Β之第2主面U2B進行研磨而成者。研磨後之器件^ 板lie對應於研磨前之器件基板11Β。 153708.doc •22· 201132503 研磨後之積層體塊10C係於器件基板π c與支撐板12B之 間***有樹脂層13B者。樹脂層13B係以可剝離之方式密 著於器件基板11C之第1主面iiic，並且固定於支撐板ι2Β 上。 研磨後之積層體塊10C與研磨前之積層體塊1〇B相比， 形成器件用構件之第2主面112C之平坦性、清潔度變高。 (器件之製造方法） 圖9係表示本發明之第1實施形態中之器件之製造方法之 步驟圖。 盗件之製造方法包括如下步驟：··於平面化後之積層體 塊（積層體）之器件基板之第2主面上使用塗佈液而形成器件 用構件（步驟S61);及將器件基板與樹脂層剝離（步驟 S62)。此處，平面化後之積層體塊（積層體）當然包括倒角 後之積層體塊（積層體）、研磨後之積層體塊（積層體）。 器件用構件係形成於器件基板之第2主面而構成器件之 )卩刀之構件。器件用構件並非最終形成於器件基板 之第2主面的構件之全部（以下稱為「全構件」），亦可為全 構件之—部分（以下稱為「部分構件」）。其原因在於，可 將自樹脂㈣離之附部分構件之器件基板，於其後之步驟 :製成附全構件之器件基板。進而其後，使用附全構件之 斋件基板製造器件。又，於自樹脂層剝離之附全構件之器 件基板上’亦可於其剝離面（第1主面）上形成其他器件用構 =。又，可使用附全構件之積層體組裝器件，其後，自附 王構件之積層體上剝離附樹脂層之支樓板，以製造器件。 153708.doc •23- 201132503 進而’亦可使用2塊附全構件之積層體組裝器件，其後， 自附全構件之積層體上剝離2塊附樹脂層之支撐板，以 造器件。 將器件基板與樹脂層剝離之方法可為公知之方法。例 如’於器件基板與樹脂層之間刺入剝離刃，其後，向剝離 刀之刺入位置吹附混合有壓縮空氣與水之流體。於該狀態 下，將積層體之一主面保持平坦，且使另一主面自刺入位 置附近起依序撓曲變形。如此’可將器件基板與樹脂層剝 離。 圖10係本發明之第1實施形態中之LCD之製造方法之步 驟圖。本實施形態中，對TFT_LCD之製造方法進行說明， 亦可將本發明應用於STN(Super Twisted Neumatic，超扭 轉相列）-LCD之製造方法，對液晶面板之種類或方式並無 限制。 TFT-LCD之製造方法包括如下步驟：於平面化後之積層 體塊（積層體）之器件基板之第2主面上，使用抗钮液，於利 用CVD(Chemical Vapor Deposition，化學氣相沈積）法及滅 鍍法等一般成膜法所形成之金屬膜及金屬氧化膜等上形成 圖案而形成薄膜電晶體（TFT)(步驟S71);於另一平面化後 之積層體塊（積層體）之器件基板之第2主面上，將抗蝕液用 於圖案形成而形成彩色濾光片（CF)(步驟S72);將附TFT之 器件基板、與附CF之器件基板積層（步驟S73);以及將兩 者器件基板與樹脂層剝離（步驟S74)。再者，對TFT形成步 驟（步驟S71)、與CF形成步驟（步驟S72)之順序並無限制， 153708.doc -24- 201132503 可為大致同時。又，剝離步驟（步驟S74)可為積層步驟（步 驟S73)之前，亦可*TFTB成步驟aCF形成步驟之中途/ 於TFT形成步驟或CF形成步驟中，使用取所周知之光微 影技術或蝕刻技術等，於器件基板之第2主面上形成TFT或 CF。此時，使用抗蝕液作為圖案形成用之塗佈液。 再者，於形成TFT或CF之前，視需要，可清洗器件基板 之第2主面。作為清洗方法，可使用眾所周知之乾式清洗 或濕式清洗。 積層步驟中，於附TFT之積層體、與附CF之積層體之間 注入液晶材料而積層。作為注入液晶材料之方法，例如有 減壓注入法、滴加注入法。 減壓注入法中，例如，首先使用密封材料及間隔材料， 將兩積層體以存在TFT之面與存在CF之面相對向之方式貼 合。繼而，自兩積層體上剝離2塊附樹脂層之支撐板。其 後，將貼合之兩器件基板切斷為複數個單元。使所切斷之 各單元之内部成為減壓環境後，自注入孔向各單元之内部 注入液晶材料，密封注入孔 '繼而’於各單元上貼附偏光 板’組入背光源等，以製造液晶面板。 再者，本實施形態t，自_積層體上剝離2塊附樹脂層 之支撐板，其後將貼合之兩器件基板切斷為複數個單元， 但本發明並不限定於此。例如可於使用密封材料及間隔材 料來貼合兩積層體之前’自各積層體上剝離附樹脂層之 撐板。 滴加注入法中，例如首先於兩積層體中之任一者上滴加 153708.doc -25· 201132503 液晶材料，使用密封材料及間隔材料，將兩積層體以存在 TFT之面與存在CF之面相對向之方式積層。繼而，自兩積 層體上剝離2塊附樹脂層之支撐板。其後，將所積層之兩 器件基板切斷為複數個單元。繼而，於各單元上貼附偏光 板’組入背光源等，以製造液晶面板。 液晶面板之製造方法除包括上述步驟之外，亦可更包括 如下步驟：自作為器件基板之玻璃基板上剝離附樹脂層之 支樓板後’藉由化合蝕刻處理將玻璃基板薄板化（步驟 S75)❹玻璃基板之第i主面係由支撐板保護，故即便進行 钮刻處理，亦難以產生触刻斑。 再者，圖10所示之例中，於附TFT之器件基板、附CF之 器件基板之製造時分別逐個使用積層體，但本發明並不限 定於此。例如’可於附TFT之器件基板、附CF之器件基板 中僅任一基板之製造時使用積層體。 圖11係本發明之第1實施形態中之有機EL面板（〇LED)之 製造方法之步驟圖。 有機EL面板之製造方法包括如下步驟：使用圖案形成用 之抗蝕液於平面化後之積層體之器件基板之第2主面上形 成有機EL元件（步驟S81);於有機EL元件上積層對向基板 (步驟S82);以及將器件基板與樹脂層剝離（步驟S83)。再 者，剝離步驟（步驟S83)可為積層步驟（步驟S82)之前，亦 可為有機EL元件形成步驟（步驟S81)之中途。 有機EL元件形成步驟中，使用眾所周知之光微影技術或 蒸鍍技術等，於器件基板之第2主面上形成有機EL元件。 153708.doc •26· 201132503 此時，於器件基板之第2主面上塗佈抗*液作_案形成 用之塗佈液。有機EL元件例如包含透明電極層、電洞傳輸 層、發光層、電子傳輸層等。 再者，於形成有機EL元件之前，視需要，可清洗器件基 板之第2主面。作為清洗方法，例如可使用乾式清洗或濕 式清洗。 積層步驟中，例如，首先自附有機EL元件之器件基板上 剝離附樹脂層之支撐板。其後，將附有機EL元件之器件基 板切斷為複數個單元。繼而，以有機EL元件與對向基板接 觸之方式使各單元與對向基板貼合。如此，製造有機El顯 示器。 ‘ 如此，對所製造之LCD或OLED等顯示面板的用途並無 特別限制，例如適宜用於行動電話、PDA(Pers〇nalThe first main surface 111B of the device substrate 11B is fixed to the support plate 12B. As shown in Fig. 7, the laminated body block 10B after chamfering has a circular outer peripheral surface 14B, and therefore is excellent in impact resistance or safety. As shown in Fig. 7, the outer peripheral surface 134B of the resin layer 13B becomes substantially parallel to the thickness direction of the resin layer 13B (the direction of the arrow a in Fig. 7), so that the exposed area of the resin layer 13B is reduced. . Therefore, deterioration of the resin layer 13B can be suppressed by the heat treatment in the manufacturing steps of the device. (Grinding of laminated body block) As shown in FIG. 1, when the device substrate is a glass substrate manufactured by a floating method, the manufacturing method of the laminated body may further include a grinding device after chamfering (ie, after planarization). a polishing step of the second main surface of the substrate (step sn). Here, the glass substrate produced by the floating method includes a glass substrate which is stretched by a floating method to further reduce the thickness by a re-drawing method. The floating method is a method in which molten glass is discharged from molten tin in a floating bath and flows in the downward direction in the direction of the μ to form a plate-shaped glass. The glass substrate was produced by cutting the plate-shaped glass, but minute irregularities or undulations were generated on the surface of the glass substrate. 153708.doc -21 · 201132503 By the polishing in the above-mentioned polishing step, the unevenness or undulation of the surface of the glass substrate can be removed, and the flatness of the surface of the member for forming a device can be improved. Therefore, the reliability of the device as a product can be improved. This effect is remarkable when the thickness of the glass substrate is 0.03 to 〇 3 mm. This is because the glass substrate having a thickness of 0.03 to 0.3 mm is difficult to be polished alone, and it is difficult to perform pre-polishing before forming the layered body block. However, when the second main surface of the device substrate is polished before planarization, if there is a groove on the peripheral surface of the laminated body block, the abrasive enters the groove without being removed or the device substrate is deflected and broken. Happening. Further, even when the second main surface of the device substrate is polished before the chamfering after the planarization, the sharp corners of the device substrate are easily broken. In the present embodiment, after the chamfering (i.e., after planarization), the second main surface of the device substrate is polished, so that the corner portions of the device substrate are chamfered in advance, and the grooves are removed in advance. Therefore, adhesion of the abrasive to the groove or breakage of the device substrate can be suppressed during polishing. The grinding method can be a general method. For example, a polishing method using abrasive grains such as cerium oxide can be cited. The polishing margin is appropriately set depending on the thickness of the device substrate or the device to be used, and is, for example, 0.05 to 10 μm. Fig. 8 is a side elevational view showing a portion of the laminated body block after polishing in the third embodiment of the present invention. In Fig. 8, the shape of the laminated body block before polishing is indicated by a broken line. The laminated body block 10C of Fig. 8 is obtained by polishing the second main surface U2B of the device substrate 11A of the laminated body block 1 of Fig. 7. The ground device lie corresponds to the device substrate 11A before polishing. 153708.doc •22· 201132503 The laminated body block 10C after polishing is a resin layer 13B interposed between the device substrate π c and the support plate 12B. The resin layer 13B is detachably adhered to the first main surface iiic of the device substrate 11C, and is fixed to the support plate ι2 。. The laminated body block 10C after the polishing has higher flatness and cleanliness of the second main surface 112C forming the device member than the laminated body block 1B before polishing. (Manufacturing Method of Device) Fig. 9 is a view showing a step of a method of manufacturing a device according to the first embodiment of the present invention. The method for manufacturing a thief includes the steps of: forming a device member using a coating liquid on a second main surface of a device substrate of a laminated body block (layered body) after planarization (step S61); and The resin layer is peeled off (step S62). Here, the laminated body block (layered body) after planarization naturally includes a laminated body block (layered body) after chamfering, and a laminated body block (layered body) after polishing. The device member is formed on the second main surface of the device substrate to constitute a member of the device. The device member is not the entire member (hereinafter referred to as "all members") which is finally formed on the second main surface of the device substrate, and may be a part of the entire member (hereinafter referred to as "partial member"). The reason for this is that the device substrate from which the resin (4) is attached may be attached to the device substrate with the full member in the subsequent steps. Further, the device was fabricated using a substrate of the full member. Further, on the device substrate with the entire member peeled off from the resin layer, other device structures may be formed on the peeling surface (first main surface). Further, it is possible to assemble the device using the laminated body with the full member, and thereafter, the branch plate with the resin layer is peeled off from the laminated body of the king member to fabricate the device. 153708.doc •23- 201132503 Further, it is also possible to use two laminated body assembly members with full members, and thereafter, two support plates with resin layers are peeled off from the laminated body of the entire member to fabricate the device. The method of peeling off the device substrate from the resin layer can be a well-known method. For example, a peeling blade is pierced between the device substrate and the resin layer, and thereafter, a fluid mixed with compressed air and water is blown to the piercing position of the peeling blade. In this state, one main surface of the laminated body is kept flat, and the other main surface is sequentially flexed and deformed from the vicinity of the piercing position. Thus, the device substrate can be peeled off from the resin layer. Fig. 10 is a view showing the steps of the method of manufacturing the LCD in the first embodiment of the present invention. In the present embodiment, a method of manufacturing the TFT_LCD will be described, and the present invention can also be applied to a method of manufacturing an STN (Super Twisted Neumatic)-LCD, and the type or mode of the liquid crystal panel is not limited. The manufacturing method of the TFT-LCD includes the steps of using a CVD (Chemical Vapor Deposition) on the second main surface of the device substrate of the laminated body block (layered body) after planarization. A thin film transistor (TFT) is formed by forming a pattern on a metal film or a metal oxide film formed by a general film formation method such as a method and a plating method (step S71); and a layered body block (layered body) after another planarization On the second main surface of the device substrate, a resist liquid is used for pattern formation to form a color filter (CF) (step S72); and a TFT-attached device substrate is laminated with a CF-attached device substrate (step S73) And peeling off both of the device substrate and the resin layer (step S74). Further, there is no limitation on the order of the TFT forming step (step S71) and the CF forming step (step S72), and 153708.doc -24 - 201132503 may be substantially simultaneous. Moreover, the stripping step (step S74) may be before the laminating step (step S73), or *TFTB may be used in the middle of the step aCF forming step/the TFT forming step or the CF forming step, using well-known photolithography or An etching technique or the like forms a TFT or a CF on the second main surface of the device substrate. At this time, a resist liquid is used as a coating liquid for pattern formation. Further, before forming the TFT or CF, the second main surface of the device substrate can be cleaned as needed. As the cleaning method, a well-known dry cleaning or wet cleaning can be used. In the lamination step, a liquid crystal material is injected between the laminated body with the TFT and the laminated body with CF to laminate. As a method of injecting the liquid crystal material, for example, a pressure reduction injection method or a dropping injection method is available. In the pressure reduction injection method, for example, first, a sealing material and a spacer material are used, and the two laminated bodies are bonded to each other so that the surface of the TFT is opposed to the surface on which the CF exists. Then, two support plates with resin layers were peeled off from the two laminated bodies. Thereafter, the bonded two device substrates are cut into a plurality of units. After the inside of each unit to be cut is a reduced pressure environment, a liquid crystal material is injected into the inside of each unit from the injection hole, and the injection hole is sealed, and then a polarizing plate is attached to each unit to form a backlight or the like to be manufactured. LCD panel. Further, in the present embodiment t, two support plates with a resin layer are peeled off from the laminated body, and thereafter, the two device substrates to be bonded are cut into a plurality of units, but the present invention is not limited thereto. For example, the gusset with the resin layer may be peeled off from each of the laminates before the two laminates are bonded together using the sealing material and the spacer. In the drop-injection method, for example, firstly, 153708.doc -25·201132503 liquid crystal material is dropped on one of the two laminated bodies, and the two laminated bodies are deposited on the surface of the TFT and in the presence of CF using a sealing material and a spacer material. The faces are stacked in a relative manner. Then, two support plates with resin layers were peeled off from the two laminated bodies. Thereafter, the two device substrates of the stacked layers are cut into a plurality of cells. Then, a polarizing plate is attached to each unit to incorporate a backlight or the like to manufacture a liquid crystal panel. In addition to the above steps, the method of manufacturing the liquid crystal panel may further include the steps of: thinning the glass substrate by a compound etching process after peeling off the floor plate with the resin layer on the glass substrate as the device substrate (step S75) Since the i-th main surface of the bismuth glass substrate is protected by the support plate, it is difficult to generate a smear even if the button processing is performed. Further, in the example shown in Fig. 10, the laminated body is used one by one in the manufacture of the TFT-attached device substrate and the CF-attached device substrate, but the present invention is not limited thereto. For example, a laminate can be used in the production of only one of the TFT-attached device substrate and the CF-attached device substrate. Fig. 11 is a flow chart showing a method of manufacturing an organic EL panel (〇LED) according to the first embodiment of the present invention. The method for producing an organic EL panel includes the steps of: forming an organic EL element on a second main surface of a device substrate on which a planarized layered body is formed using a resist liquid for pattern formation (step S81); and stacking layers on the organic EL element The substrate is pressed (step S82); and the device substrate is peeled off from the resin layer (step S83). Further, the peeling step (step S83) may be before the step of laminating (step S82), or may be in the middle of the organic EL element forming step (step S81). In the organic EL element forming step, an organic EL element is formed on the second main surface of the device substrate by using a well-known photolithography technique or a vapor deposition technique. 153708.doc •26· 201132503 At this time, a coating liquid for forming an anti-liquid solution was applied to the second main surface of the device substrate. The organic EL element includes, for example, a transparent electrode layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like. Further, before forming the organic EL element, the second main surface of the device substrate can be cleaned as needed. As the cleaning method, for example, dry cleaning or wet cleaning can be used. In the lamination step, for example, the support plate with the resin layer is peeled off from the device substrate to which the organic EL element is attached first. Thereafter, the device substrate with the organic EL element is cut into a plurality of cells. Then, each unit is bonded to the counter substrate so that the organic EL element is in contact with the counter substrate. Thus, an organic El display is manufactured. ‘ As such, there is no particular restriction on the use of display panels such as LCDs or OLEDs, such as mobile phones and PDAs (Pers〇nal).

Assistant ’個人數位助理）、數位相機、遊戲機等行動電子 機器。 (第2實施形態） 第2實施形態係關於平面化前之積層體塊者。 圖12係本發明之第2實施形態中之平面化前之積層體塊 之部分側面圖。如圖12所示，平面化前之積層體塊2〇係於 器件基板21與支撐板22之間***有樹脂層23者。樹脂層23 係以可剝離之方式密著於器件基板21之第1主面2U，並且 固定於支撐板22上。 支撐板22可變得較樹脂層23更大，樹脂層23可變得較器 件基板21更大。於上述情形時，如圖12所示，若器件基板 153708.doc •27· 201132503 21為經倒角加工者，則由於器件基板21之外周面帶有圓 形’而導致於積層體塊20之外周面24形成凹槽25。 此時，藉由沿圖12之A-A·線切斷積層體塊20，可使積層 體塊20之外周面24平面化，可去除凹槽25。 但，於沿圖12之B-B1線或C-C，線切斷積層體塊20之情形 時’由於無法使積層體塊20之外周面24平面化，故凹槽25 殘存。 於上述情形時，由於凹槽25殘存，因此於器件之製造步 驟中容易殘留塗佈液之殘渣。該殘渣於器件製造步驟中之 加熱處理步驟中成為發塵源’因此發塵污染加熱處理步驟 内’使作為製品之器件之良率下降。 本實施形態中’由於可去除凹槽25，故於器件之製造步 驟中’可抑制發塵，可抑制作為製品之器件之良率之下 降。 (第3貫施形態） 圖13係本發明之第3實施形態中之平面化前之積層體塊 之部分側面圖》如圖13所示，平面化前之積層體塊3〇係於 器件基板31與支撐板32之間***有樹脂層33者。樹脂層33 係以可剝離之方式密著於器件基板31之第1主面3n，並且 固定於支撐板32上。 树月曰層33變得較器件基板31或支撐板32更小。因此，如 圖13所示’導致於積層體塊30之外周面34形成凹槽35。 此時’藉由沿圖13之A-A，線切斷積層體塊30，可使積層 體塊30之外周面34平面化，可去除凹槽35。 153708.doc -28- 201132503 但，於沿圖13之B-B，線讳r r丨姑1 ' _C線切斷積層體塊3〇之情形 時，無法使積層體塊3〇之外用而） 您外周面34平面化，因此凹槽35之 一部分或者全部殘存。 於上述情形時，由於揭2 + 凹槽35之—部分或者全部殘存，故 於器件之製造步驟中容易殘存涂 子塗佈液之殘渣。該殘渣於器 件製造步驟中之加熱處理步驟中成 /神Τ战為發塵源，因此發塵污 染加熱處理㈣内’使作為製品之器件之良率下降。 本實施形態中，可去除凹槽35’因此於器件之製造步驟 中可抑制發塵’可抑制作為製品之器件之良率之下降。 [實施例] 以下’藉由實施例等，對本發明進行具體說明，但本發 明不受該等實施例之限定。 (實施例1) 支撐板係使用利用浮式法獲得之縱370mmx 厚0.6 mm之玻璃板（旭硝子公司製造，ANl〇〇，無鹼玻 璃）。該玻璃板之平均線膨脹係數為38xl〇-7/<>c。 將該玻璃板進行純水清洗、UV清洗，使玻璃板之表面 清潔化。其後’於玻璃板之表面’利用旋塗機塗佈無溶劑 加成反應型聚石夕氧（Shin-Etsu Silicone公司製造，KNS· 320A)100質量份與鉑系觸媒（Shin-Etsu Silicone公司製造， CAT-PL-56)5質量份之混合物（塗佈量20 g/m2)。 上述無溶劑加成反應型聚矽氧係包含具有鍵結於矽原子 之乙烯基與曱基之直鏈狀有機烯基聚矽氧烷（主劑）、及具 有鍵結於矽原子之氫原子與甲基之直鏈狀有機氫化聚矽氧 153708,doc -29- 201132503 烷（交聯劑）者》 使塗佈於玻璃板上之混合物於大氣中、丨8〇它下加熱硬 化10刀鐘，於玻璃板上形成縱366 mmx橫310 mm之樹脂 層’並固定。 另方面，器件基板係使用包含聚醚砜之縱370 mmx橫 32〇 mmx厚（M mm之樹脂基板（住友電木公司製造，Mobile electronic devices such as Assistant 'personal digital assistants', digital cameras, and game consoles. (Second Embodiment) The second embodiment relates to a laminated body block before planarization. Fig. 12 is a partial side elevational view showing the laminated body block before planarization in the second embodiment of the present invention. As shown in Fig. 12, the laminated body block 2 before the planarization is attached to the resin layer 23 between the device substrate 21 and the support plate 22. The resin layer 23 is detachably adhered to the first main surface 2U of the device substrate 21, and is fixed to the support plate 22. The support plate 22 can become larger than the resin layer 23, and the resin layer 23 can become larger than the device substrate 21. In the above case, as shown in FIG. 12, if the device substrate 153708.doc • 27· 201132503 21 is a chamfered processor, the peripheral surface of the device substrate 21 has a circular shape, which results in the laminated body block 20. The outer peripheral surface 24 forms a groove 25. At this time, by cutting the laminated body block 20 along the line A-A of Fig. 12, the outer peripheral surface 24 of the laminated body block 20 can be planarized, and the groove 25 can be removed. However, when the laminated body block 20 is cut along the line B-B1 or C-C of Fig. 12, since the outer peripheral surface 24 of the laminated body block 20 cannot be planarized, the groove 25 remains. In the above case, since the groove 25 remains, the residue of the coating liquid is likely to remain in the manufacturing steps of the device. This residue becomes a dust generating source in the heat treatment step in the device manufacturing step. Therefore, the dust contamination heat treatment step is performed to lower the yield of the device as a product. In the present embodiment, since the groove 25 can be removed, dust generation can be suppressed in the manufacturing step of the device, and the drop in yield of the device as a product can be suppressed. (Third Aspect) FIG. 13 is a partial side view of the laminated body block before planarization in the third embodiment of the present invention. As shown in FIG. 13, the laminated body block 3 before planarization is attached to the device substrate. The resin layer 33 is inserted between the 31 and the support plate 32. The resin layer 33 is detachably adhered to the first main surface 3n of the device substrate 31, and is fixed to the support plate 32. The tree moon layer 33 becomes smaller than the device substrate 31 or the support plate 32. Therefore, as shown in Fig. 13, the groove 35 is formed on the outer peripheral surface 34 of the laminated body block 30. At this time, by cutting the laminated body block 30 along the line A-A of Fig. 13, the outer peripheral surface 34 of the laminated body block 30 can be planarized, and the groove 35 can be removed. 153708.doc -28- 201132503 However, in the case of the BB along the line 讳rr 丨 丨 丨 1 ' ' ' ' 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 切断 您 您 您 您 您 您 您 您 您 您 您 您 您 您 您 您 您 您34 is planarized so that some or all of the recess 35 remains. In the above case, since part or all of the recess 2 + is left, the residue of the coating liquid is liable to remain in the manufacturing steps of the device. This residue is used as a dust source in the heat treatment step in the manufacturing process of the device, so that the dust-and-stain heat treatment (4) reduces the yield of the device as a product. In the present embodiment, the recess 35' can be removed, so that the dust generation can be suppressed in the manufacturing process of the device, and the deterioration of the yield of the device as the product can be suppressed. [Examples] Hereinafter, the present invention will be specifically described by way of Examples and the like, but the present invention is not limited by the Examples. (Example 1) A support plate was a glass plate (manufactured by Asahi Glass Co., Ltd., ANl〇〇, alkali-free glass) which was obtained by a floating method and was longitudinally 370 mmx and 0.6 mm thick. The glass plate has an average coefficient of linear expansion of 38 x 1 〇 -7 / <> c. The glass plate was subjected to pure water washing and UV cleaning to clean the surface of the glass plate. Thereafter, 'on the surface of the glass plate' was applied by a spin coater to 100 parts by mass of a solvent-free addition-reaction type polyoxo (manufactured by Shin-Etsu Silicone Co., Ltd., KNS·320A) and a platinum-based catalyst (Shin-Etsu Silicone). The company manufactures, CAT-PL-56) a mixture of 5 parts by mass (coating amount 20 g/m2). The solventless addition reaction type polyoxo oxygen group includes a linear organic alkenyl polyoxyalkylene (main component) having a vinyl group and a fluorenyl group bonded to a ruthenium atom, and a hydrogen atom having a bond to a ruthenium atom. Linear organic hydrogenated polyoxyl oxy group 153708 with methyl group, doc -29- 201132503 Alkane (crosslinking agent) The mixture coated on the glass plate is heated in the atmosphere, 丨8〇, and it is cured by heating for 10 knives. A resin layer of 366 mm x 310 mm in width is formed on the glass plate and fixed. On the other hand, the device substrate is made of a resin substrate (Sumitomo Bakelite Co., Ltd.) containing a polyethersulfone having a longitudinal length of 370 mm x 32 μm x mm (m mm).

SumiUte FS-5300)。該樹脂基板之平均線膨脹係數為 54〇xlO_7/〇C。 將該樹脂基板進行純水清洗、uv清洗，使樹脂基板之 表面清潔化。其後’將樹脂基板與玻璃板對準後，使用真 空加壓裝置，於室溫下使固定於玻璃板上之樹脂層密著於 樹脂基板之第1主面。 以上述方式，獲得與圖2所示之積層體塊大致相同之積 層體塊。將所得之積層體塊於厚度方向切斷，將積層體塊 之外周部遍及圓周方向全周而以10 min之寬度去除。具體 而5 ’使用截切刀將樹脂基板及樹脂層於厚度方向切斷， 並且使用玻璃切割機於玻璃板之主面形成劃線後，使積層 體塊撓曲變形而沿劃線割斷，將積層體塊之外周部遍及圓 周方向全周而去除。 於該狀態下，樹脂基板、玻璃板、及樹脂層之外周面遍 及圓周方向全周而一致，積層體塊之外周面遍及圓周方向 全周而平面化。又，積層體塊之外周面未看到凹槽。 繼而，將平面化後之積層體塊浸潰於CF用之黑色矩陣用 抗蝕液（旭硝子公司製造，PMA-ST)中後，以丙二醇單甲 153708.doc •30· 201132503 醚乙酸酯（抗蝕液之主溶劑）清洗。其後，於熱風烘箱中以 120°C乾燥30分鐘，以顯微鏡觀察積層體之外周面，結果 未看到抗姓液之殘渣。 (實施例2) 實施例2中，除支撐板係使用利用浮式法獲得之縱37〇 mnixi只320 mmx厚0.4 mm之玻璃板（旭石肖子公司製造， AN 1 00，無鹼玻璃）以外，以與實施例1相同之方式，於玻 璃板上形成樹脂層，並固定。 又’實施例2中，除器件基板係使用利用浮式法獲得之 縱370 mmx橫3 20 mmx厚0.3 mm之玻璃基板（旭硝子公司製 造，AN 1 00，無鹼玻璃）以外，以與實施例1相同之方式， 使固定於玻璃板上之樹脂層密著於玻璃基板之第1主面。 以上述方式，獲得與圖2所示之積層體塊大致相同之積 層體塊。將所得之積層體塊於厚度方向切斷，將積層體塊 之外周部遍及圓周方向全周而以1〇 mm之寬度去除》具體 而言’使用玻璃切割機於玻璃基板之第2主面形成劃線， 並且使用玻璃切割機於玻璃板之主面形成劃線後，使積層 體塊撓曲變形而沿劃線割斷，將積層體塊之外周部遍及圓 周方向全周而去除。 於該狀態下，於玻璃基板、玻璃板、及樹脂層之外周面 遍及圓周方向全周而一致，積層體塊之外周面係遍及圓周 方向全周而平面化。又，積層體塊之外周面未看到凹槽。 使用磨石’將該積層體塊之外周面之角部遍及圓周方向 全周而倒角。倒角尺寸係設為曲率半徑R=〇.4(單位： 153708. •31 - 201132503 mm)。 繼而’以與實施例1相同之方式，將倒角後之積層體塊 次潰於抗蝕液中，清洗、乾燥後，以顯微鏡觀察積層體之 外周面。其結果，未看到抗蝕液之殘渣。 (比較例1) 比較例1中，以與實施例丨相同之方式，將以與實施例2 相同之方式獲得之切斷前之積層體塊浸潰於抗蝕液中，清 洗、乾燥後，以顯微鏡觀察積層體之外周面。其結果，看 到抗钮液之殘潰。 已詳細地且參照特定之實施態樣對本發明進行說明，業 者明白’可於不脫離本發明之精神及範圍之情況下加以各 種變更或修正。 本申請案係基於2010年1月25曰申請之曰本專利申請 2010-012785者’其内容係作為參照而併入本文中。 【圖式簡單說明】 圖1係本發明之第1實施形態中之積層體之製造方法之步 驟圖。 圖2係本發明之第1實施形態中之平面化前之積層體塊之 部分側面圖。 圖3係本發明之第1實施形態中之平面化後之積層體塊之 部分側面圖。 圖4係本發明之第1實施形態中之倒角方法之說明圖 ⑴。 圖5係本發明之第1實施形態中之倒角方法之說明圖 153708.doc • 32- 201132503 (2)。 圖6係本發明之第1實施形態中之倒角方法之說明圖 (3)。 圖7係本發明之第1實施形態中之倒角後之積層體塊之部 分侧面圖。 圖8係本發明之第1實施形態中之研磨後之積層體塊之部 分側面圖。 圖9係本發明之第1實施形態中之器件之製造方法之步驟 圖。 圖10係本發明之第丨實施形態中之LCD之製造方法之步 驟圖。 圖11係本發明之第1實施形態中之OLED之製造方法之步 驟圖。 圖12係本發明之第2實施形態中之平面化前之積層體塊 之部分側面圖。 圖13係本發明之第3實施形態中之平面化前之積層體塊 之部分側面圖。 【主要元件符號說明】 10、 10A、10B、10C、20、 積層體塊 30 11、 11A、11B、11C、21、 器件基板 31 12、 12A、12B、22、32 支撐板 13、 13A、13B、23、33 樹脂層 153708.doc •33· 201132503 14、 24、 15、 110 ' 111' 211 ' 112， A A-A' B-B' C-C， R1 R2 Θ1 Θ2 14A、14B、134B、 外周面 34 25、35 凹槽 120 角部 .111A、111B、111C、 第 1主面 '311 ‘ 1 12A、112B、112C 第 2主面 箭頭 線 線 線 器件基板側之曲率半徑 支撐板側之曲率半徑 器件基板側之倒角角度 支撐板側之倒角角度 153708.doc • 34·SumiUte FS-5300). The average linear expansion coefficient of the resin substrate was 54 〇 xlO_7 / 〇C. The resin substrate was subjected to pure water washing and uv cleaning to clean the surface of the resin substrate. Thereafter, the resin substrate and the glass plate were aligned, and the resin layer fixed to the glass plate was adhered to the first main surface of the resin substrate at room temperature using a vacuum press. In the above manner, a laminated body block substantially the same as the laminated body block shown in Fig. 2 was obtained. The obtained laminated body block was cut in the thickness direction, and the outer peripheral portion of the laminated body block was removed over the entire circumference in the circumferential direction by a width of 10 min. Specifically, the resin substrate and the resin layer are cut in the thickness direction by using a cutting blade, and a scribe line is formed on the main surface of the glass plate using a glass cutter, and the laminated body block is flexibly deformed and cut along the scribe line. The outer peripheral portion of the laminated body block is removed over the entire circumference in the circumferential direction. In this state, the outer peripheral surfaces of the resin substrate, the glass plate, and the resin layer are aligned over the entire circumference in the circumferential direction, and the outer peripheral surface of the laminated body block is planarized over the entire circumference in the circumferential direction. Further, no groove was observed on the outer peripheral surface of the laminated body block. Then, the planarized bulk block was immersed in a black matrix resist for CF (manufactured by Asahi Glass Co., Ltd., PMA-ST), and then propylene glycol monomethyl 153708.doc • 30· 201132503 ether acetate ( The main solvent of the resist liquid is cleaned. Thereafter, it was dried at 120 ° C for 30 minutes in a hot air oven, and the outer peripheral surface of the laminate was observed under a microscope, and as a result, no residue of the anti-surname liquid was observed. (Example 2) In Example 2, except for the support plate, a glass plate (only manufactured by Asahi Shoji Co., Ltd., AN 1 00, alkali-free glass) having a length of 37 〇mnixi obtained by a floating method was used. A resin layer was formed on the glass plate in the same manner as in Example 1 and fixed. In addition, in the second embodiment, except for the device substrate, a glass substrate (manufactured by Asahi Glass Co., Ltd., AN 1 00, alkali-free glass) having a length of 370 mm x 3 20 mm x 0.3 mm thick obtained by a floating method was used. In the same manner, the resin layer fixed to the glass plate is adhered to the first main surface of the glass substrate. In the above manner, a laminated body block substantially the same as the laminated body block shown in Fig. 2 was obtained. The obtained laminated body block is cut in the thickness direction, and the outer peripheral portion of the laminated body block is removed over the entire circumference in the circumferential direction by a width of 1 mm. Specifically, the glass cutting machine is used to form the second main surface of the glass substrate. After scribing, a scribing line is formed on the main surface of the glass plate using a glass cutter, and the laminated body block is flexibly deformed and cut along the scribe line, and the outer peripheral portion of the laminated body block is removed over the entire circumference in the circumferential direction. In this state, the peripheral surfaces of the glass substrate, the glass plate, and the resin layer are aligned over the entire circumference in the circumferential direction, and the outer peripheral surface of the laminated body block is planarized over the entire circumference in the circumferential direction. Further, no groove was observed on the outer peripheral surface of the laminated body block. The corner portion of the outer peripheral surface of the laminated body block is chamfered over the entire circumference in the circumferential direction using a grindstone. The chamfer size is set to a radius of curvature R = 〇.4 (unit: 153708. • 31 - 201132503 mm). Then, in the same manner as in the first embodiment, the laminated body after the chamfering was crushed in the resist liquid, washed, dried, and the outer peripheral surface of the laminated body was observed under a microscope. As a result, no residue of the resist liquid was observed. (Comparative Example 1) In the same manner as in Example 1, the laminated body block before the cutting obtained in the same manner as in Example 2 was immersed in the resist liquid, and after washing and drying, The outer surface of the laminate was observed with a microscope. As a result, it was seen that the anti-button fluid was broken. The present invention has been described in detail with reference to the preferred embodiments of the invention. The present application is based on Japanese Patent Application No. 2010-012785, filed Jan. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a method of manufacturing a laminated body in a first embodiment of the present invention. Fig. 2 is a partial side elevational view showing the laminated body block before planarization in the first embodiment of the present invention. Fig. 3 is a partial side elevational view showing the laminated body block after planarization in the first embodiment of the present invention. Fig. 4 is an explanatory view (1) of a chamfering method in the first embodiment of the present invention. Fig. 5 is an explanatory view of a chamfering method in the first embodiment of the present invention 153708.doc • 32-201132503 (2). Fig. 6 is an explanatory view (3) of a chamfering method in the first embodiment of the present invention. Fig. 7 is a side elevational view showing a portion of the laminated body block after chamfering in the first embodiment of the present invention. Fig. 8 is a side elevational view showing a portion of the laminated body block after polishing in the first embodiment of the present invention. Fig. 9 is a view showing the steps of a method of manufacturing the device in the first embodiment of the present invention. Fig. 10 is a view showing the steps of a method of manufacturing an LCD in a third embodiment of the present invention. Fig. 11 is a view showing the steps of a method of manufacturing an OLED according to the first embodiment of the present invention. Fig. 12 is a partial side elevational view showing the laminated body block before planarization in the second embodiment of the present invention. Fig. 13 is a partial side elevational view showing the laminated body block before planarization in the third embodiment of the present invention. [Description of main component symbols] 10, 10A, 10B, 10C, 20, laminated body blocks 30 11, 11A, 11B, 11C, 21, device substrates 31 12, 12A, 12B, 22, 32 support plates 13, 13A, 13B, 23, 33 Resin layer 153708.doc •33· 201132503 14, 24, 15, 110 ' 111' 211 ' 112, A AA' BB' CC, R1 R2 Θ1 Θ 2 14A, 14B, 134B, outer peripheral surface 34 25, 35 concave Groove 120 corners. 111A, 111B, 111C, first main surface '311' 1 12A, 112B, 112C 2nd main surface arrow line line Curvature radius on the device substrate side Curvature radius on the support plate side Chamfer on the device substrate side Angle of chamfer on the side of the angle support plate 153708.doc • 34·

Claims (1)

201132503 七、申請專利範圍： 1. 一種積層體之製造方法，其包括 具匕括如下步驟·於器件基板 板1***樹脂層，該樹脂層係以可剝離之方式 密著於上述器件基板之第,主面，並且將固定於上述支 樓板上之積層體塊切斷為預定尺寸，使上述積層體塊之 外周面之至少圓周方向一部分平面化。 2. 如請求項1之積層體之製造方法，其更包括如下步驟·· 將上迹積層體塊之外周面之經平面化之部分之角部倒 角。 3. 如請求項!或2之積層體之製造方法，其中上述樹脂層之 外周面之經平面化之部分與上述樹脂層之厚度方向大致 平行。 4.如請求項2或3之積層體之製造方法，其中 上述器件基板係利用浮式法製造之玻璃基板，且 包括如下步驟：將上述角部倒角後，研磨上述器件基 板之第2主面。 5. [至4中任一項之積層體之製造方法，其中上述 器件基板係厚度0.03 mm以上且小於〇8隨之玻璃基 板。 6.::求項1至5中任一項之積層體之製造方法，其中上述 樹脂層包含選自由丙稀酸系樹脂、聚稀煙樹脂 '聚胺基 曱酉夂酉曰秘月3、及聚石夕氧樹脂所組成之群中之至少一種。 7·如求項1至6中任一項之積層體之製造方法，其中上述 樹脂層之厚度為5〜50 μπι。 ” 153708.doc 201132503 8· 一種積層體’其係於器件基板與支撐板之間***樹脂 層’該樹脂層係以可剝離之方式密著於上述器件基板之 第1主面，並且將固定於上述支撐板上之積層體塊切斷 為預定尺寸，使上述積層體塊之外周面之至少圓周方向 一部分平面化而成。 153708.doc201132503 VII. Patent application scope: 1. A method for manufacturing a laminated body, comprising the steps of: inserting a resin layer on the device substrate board 1 and adhering the resin layer to the device substrate in a peelable manner And a main surface, and the laminated body block fixed to the above-mentioned support floor is cut into a predetermined size, and at least a part of the circumferential surface of the outer peripheral surface of the laminated body block is planarized. 2. The method of manufacturing a laminated body according to claim 1, further comprising the step of: chamfering a corner portion of the planarized portion of the outer peripheral surface of the upper laminated body block. 3. The method of producing a laminate according to claim 2 or 2, wherein the planarized portion of the outer peripheral surface of the resin layer is substantially parallel to the thickness direction of the resin layer. 4. The method of manufacturing a laminate according to claim 2, wherein the device substrate is a glass substrate manufactured by a floating method, and includes the steps of: chamfering the corner portion to polish the second main body of the device substrate. surface. 5. The method of manufacturing a laminate according to any one of the preceding claims, wherein the device substrate has a thickness of 0.03 mm or more and less than 〇8 followed by a glass substrate. 6. The method for producing a laminate according to any one of the items 1 to 5, wherein the resin layer comprises a polymer selected from the group consisting of an acrylic resin and a polystyrene resin. And at least one of the group consisting of polysulfide resins. The method for producing a laminate according to any one of the items 1 to 6, wherein the resin layer has a thickness of 5 to 50 μm. 153708.doc 201132503 8 A laminated body 'inserted between a device substrate and a support plate. The resin layer is detachably adhered to the first main surface of the device substrate, and is fixed to The laminated body block on the support plate is cut into a predetermined size, and at least a part of the circumferential surface of the outer peripheral surface of the laminated body block is planarized. 153708.doc
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