TWI480165B - Manufacture of electronic devices - Google Patents

Manufacture of electronic devices Download PDF

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Publication number
TWI480165B
TWI480165B TW099108222A TW99108222A TWI480165B TW I480165 B TWI480165 B TW I480165B TW 099108222 A TW099108222 A TW 099108222A TW 99108222 A TW99108222 A TW 99108222A TW I480165 B TWI480165 B TW I480165B
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Taiwan
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glass substrate
substrate
main surface
resin layer
support
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TW099108222A
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Chinese (zh)
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TW201113155A (en
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Kenichi Ebata
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Asahi Glass Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)

Description

電子裝置之製造方法Electronic device manufacturing method

本發明係關於一種電子裝置之製造方法、及附支持體之電子裝置。The present invention relates to a method of manufacturing an electronic device and an electronic device with a support.

近年來，液晶顯示裝置(LCD，Liquid Crystal Display)、有機EL(Electroluminescence，電致發光)顯示裝置(OLED，Organic Light Emitting Diode，有機發光二極體)係作為顯示裝置而受到廣泛利用。尤其在手機或行動電話等可攜式顯示裝置之領域中，要求顯示裝置輕量化、薄型化。In recent years, a liquid crystal display (LCD) and an organic EL (Electroluminescence) display device (OLED, Organic Light Emitting Diode) have been widely used as display devices. In particular, in the field of portable display devices such as mobile phones and mobile phones, display devices are required to be lighter and thinner.

同樣地，太陽能電池、薄膜二次電池、於表面形成有電路之半導體晶圓等電子裝置亦要求輕量化、薄型化。Similarly, solar cells, thin film secondary batteries, and electronic devices such as semiconductor wafers having circuits formed on the surface are also required to be lighter and thinner.

為因應該等要求，顯示裝置等電子裝置所使用之玻璃、樹脂、金屬等之基板正在向薄板化方向發展。In order to meet the requirements, substrates such as glass, resin, and metal used in electronic devices such as display devices are progressing in the direction of thinning.

於玻璃基板之情形時，作為使板厚變薄之方法，一般使用如下方法：於玻璃基板之表面上形成顯示裝置用構件，在形成顯示裝置用面板後，使用化學蝕刻來對顯示裝置用面板之兩外側表面進行蝕刻處理，使顯示裝置用面板之厚度變薄。In the case of a glass substrate, as a method of thinning the thickness, a method for forming a display device member on a surface of a glass substrate and forming a panel for a display device using chemical etching after a panel for a display device is generally used. The outer side surfaces are etched to make the thickness of the panel for the display device thin.

該使用化學蝕刻進行之基板薄化之方法中，例如，將1張玻璃基板之板厚自0.7 mm薄化加工至0.2 mm或0.1 mm時，會因蝕刻液而削落原先的玻璃基板材料之大半，因此就生產性或原材料之使用效率之觀點而言不佳。相對於此，若最初便採用板厚較薄之玻璃基板而欲製造TFT(Thin Film Transistor，薄膜電晶體)陣列基板或彩色濾光片基板，則製造時玻璃基板之強度不足，彎曲量亦增大。由此而產生無法利用現有之生產線進行處理之問題。In the method of thinning a substrate by chemical etching, for example, when the thickness of one glass substrate is thinned from 0.7 mm to 0.2 mm or 0.1 mm, the original glass substrate material is peeled off by the etching liquid. Most of them are not good in terms of productivity or the efficiency of use of raw materials. On the other hand, when a TFT (Thin Film Transistor) array substrate or a color filter substrate is manufactured by using a glass substrate having a small thickness, the strength of the glass substrate is insufficient and the amount of bending is increased. Big. As a result, there is a problem that it cannot be processed by the existing production line.

又，於上述使用化學蝕刻之基板薄化法中，於玻璃基板之表面上形成顯示裝置用構件後，進行化學蝕刻處理等而使玻璃基板變薄，因此有時會產生形成於玻璃基板表面之微細之傷痕顯在化的問題，即，產生蝕刻斑之問題。Further, in the substrate thinning method using chemical etching, after the member for a display device is formed on the surface of the glass substrate, the glass substrate is thinned by chemical etching treatment or the like, and thus may be formed on the surface of the glass substrate. The problem of microscopic scars is obvious, that is, the problem of etching spots is generated.

因此，為解決上述問題而提出如下方法等：使板厚未滿0.7 mm之較薄的玻璃基板(亦稱為「薄板玻璃基板」)與其他的支持玻璃基板黏合而形成積層體，並於此狀態下實施用以製造顯示裝置之特定之處理，其後，分離薄板玻璃基板與支持玻璃基板。Therefore, in order to solve the above problems, a method of forming a laminate by bonding a thin glass substrate (also referred to as a "thin glass substrate") having a thickness of less than 0.7 mm to another supporting glass substrate is proposed. The specific process for manufacturing the display device is carried out in a state, and thereafter, the thin glass substrate and the supporting glass substrate are separated.

例如，於專利文獻1中記載有一種方法，其係利用玻璃基板彼此之靜電吸附力或真空吸附力將製品用玻璃基板與增強用玻璃基板黏合在一起而實現一體化，製造使用有製品用玻璃基板之顯示裝置。For example, Patent Document 1 discloses a method in which a glass substrate for a product and a glass substrate for reinforcement are bonded together by electrostatic adsorption force or vacuum adsorption force of a glass substrate to form an integrated glass for use. Display device for the substrate.

又，於專利文獻2中，記載有一種液晶顯示裝置之製造方法，其係使用玻璃料系之接著劑將液晶顯示裝置之基板與支持體之端部加以接著，其後形成電極圖案等。Further, Patent Document 2 describes a method of manufacturing a liquid crystal display device in which an end portion of a substrate and a support of a liquid crystal display device is followed by a glass frit-based adhesive, and thereafter an electrode pattern or the like is formed.

於專利文獻3中，記載有一種顯示裝置用基板之製造方法，其係包括以下步驟：對2張玻璃基板之至少周緣部之端面附近照射雷射光，使上述2張玻璃基板融合。Patent Document 3 describes a method of manufacturing a substrate for a display device, which comprises irradiating laser light to the vicinity of an end surface of at least a peripheral portion of two glass substrates to fuse the two glass substrates.

於專利文獻4中，記載有一種液晶顯示裝置之製造方法，其係將基板貼附於在支持體上設置有黏著劑層之基板搬送用治具，並搬送基板搬送用治具，藉此，經由液晶顯示元件之製造步驟來對貼附於基板搬送用治具上之基板依序進行液晶顯示元件形成處理，在完成特定之步驟後，將基板自基板搬送用治具剝離。Patent Document 4 discloses a method of manufacturing a liquid crystal display device in which a substrate is attached to a substrate transporting jig provided with an adhesive layer on a support, and the substrate transporting jig is transported. The liquid crystal display element forming process is sequentially performed on the substrate attached to the substrate transfer jig by the manufacturing process of the liquid crystal display element, and after the specific step is completed, the substrate is peeled off from the substrate transfer jig.

於專利文獻5中，記載有一種液晶顯示元件之製造方法，其特徵在於：使用由紫外線硬化型黏著劑將液晶顯示裝置用電極基板設置於支持體上之治具，對液晶顯示裝置用電極基板實施特定之加工後，對紫外線硬化型黏著劑照射紫外線，藉此使上述紫外線硬化型黏著劑之黏著力下降，從而將上述液晶顯示裝置用電極基板自上述治具剝離。Patent Document 5 describes a method for producing a liquid crystal display device, which comprises using a jig for mounting an electrode substrate for a liquid crystal display device on a support with an ultraviolet curable adhesive, and an electrode substrate for a liquid crystal display device. After the specific processing, the ultraviolet curable adhesive is irradiated with ultraviolet rays, whereby the adhesion of the ultraviolet curable adhesive is lowered, and the electrode substrate for a liquid crystal display device is peeled off from the jig.

於專利文獻6中，記載有一種搬送方法，其係以黏著劑將薄板暫時固定於支持板上，並以密封劑密封上述黏著劑之周緣部而搬送暫時固定有薄板之支持板。Patent Document 6 describes a transfer method in which a thin plate is temporarily fixed to a support plate with an adhesive, and a peripheral portion of the adhesive is sealed with a sealant to transport a support plate on which a thin plate is temporarily fixed.

於專利文獻7中，記載有一種薄板玻璃積層體，其特徵在於：其係使薄板玻璃基板與支持玻璃基板積層而成者，且上述薄板玻璃基板與上述支持玻璃基板係經由具有剝離性及非黏著性之聚矽氧樹脂層而積層。並且，在分離薄板玻璃基板與支持玻璃基板時，只要賦予沿垂直方向將薄板玻璃基板自支持玻璃基板拉開之力即可，利用剃刀之刃等在端部形成剝離起始部，或者向積層界面注入空氣，藉此可更容易地剝離。Patent Document 7 discloses a thin-plate glass laminate in which a thin glass substrate and a supporting glass substrate are laminated, and the thin glass substrate and the supporting glass substrate are detachable and non-transmissive. Adhesive polyoxymethylene resin layer is laminated. Further, when the thin glass substrate and the supporting glass substrate are separated, a force for pulling the thin glass substrate from the supporting glass substrate in the vertical direction may be applied, and a peeling start portion or a laminated layer may be formed at the end portion by a razor blade or the like. The interface injects air, which makes it easier to peel off.

又，於專利文獻8中，記載有一種使用有聚矽氧之半導體製造用之雙面密著片材。Further, Patent Document 8 describes a double-sided adhesive sheet for semiconductor production using polyoxymethylene.

先前技術文獻Prior technical literature 專利文獻Patent literature

專利文獻1：日本專利特開2000-241804號公報Patent Document 1: Japanese Patent Laid-Open Publication No. 2000-241804

專利文獻2：日本專利特開昭58-54316號公報Patent Document 2: Japanese Patent Laid-Open Publication No. SHO 58-54316

專利文獻3：日本專利特開2003-216068號公報Patent Document 3: Japanese Patent Laid-Open Publication No. 2003-216068

專利文獻4：日本專利特開平8-86993號公報Patent Document 4: Japanese Patent Laid-Open No. Hei 8-86993

專利文獻5：日本專利特開平9-105896號公報Patent Document 5: Japanese Patent Laid-Open No. Hei 9-105896

專利文獻6：日本專利特開2000-252342號公報Patent Document 6: Japanese Patent Laid-Open Publication No. 2000-252342

專利文獻7：國際公開第2007/018028號小冊子Patent Document 7: International Publication No. 2007/018028

專利文獻8：日本專利特開2004-26950號公報Patent Document 8: Japanese Patent Laid-Open No. 2004-26950

然而，於專利文獻1所記載之利用靜電吸附力或真空吸附力將玻璃基板彼此固定之方法、專利文獻2所記載之利用玻璃料將玻璃基板之兩端固定之方法、或者專利文獻3所記載之對周緣部之端面附近照射雷射光而使2張玻璃基板融合之方法中，由於並未經由任何中間層而使玻璃基板彼此積層密著，故因混入至玻璃基板間之氣泡或塵芥等異物而會於玻璃基板上產生應變缺陷。因此，難以獲得表面平滑之玻璃基板積層體。However, the method of fixing the glass substrates to each other by the electrostatic adsorption force or the vacuum adsorption force described in Patent Document 1, the method of fixing the both ends of the glass substrate by the glass frit described in Patent Document 2, or the method described in Patent Document 3 In the method of illuminating two glass substrates by irradiating the laser beam in the vicinity of the end surface of the peripheral portion, since the glass substrates are not adhered to each other through any intermediate layer, foreign matter such as bubbles or dust mustard mixed between the glass substrates Strain defects are generated on the glass substrate. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface.

又，於專利文獻4~6所記載之在玻璃基板間配置黏著劑層等之方法中，可避免上述的因混入至玻璃基板間之氣泡等而導致應變缺陷之產生，但難以分離兩玻璃基板，且於分離時有薄板玻璃基板破損之虞。又，於分離後之薄板玻璃基板上殘存有黏著劑亦將成為問題。Further, in the method of disposing an adhesive layer or the like between the glass substrates described in Patent Documents 4 to 6, it is possible to avoid occurrence of strain defects due to bubbles or the like interposed between the glass substrates, but it is difficult to separate the two glass substrates. And there is a flaw in the thin glass substrate at the time of separation. Further, it is also a problem that an adhesive remains on the separated thin glass substrate.

相對於此，根據專利文獻7所記載之薄板玻璃基板積層體，難以產生上述的因混入至玻璃基板間之氣泡等而導致之應變缺陷。又，亦可剝離薄板玻璃基板與支持玻璃基板。進而，可解決於剝離後之薄板玻璃基板上殘存有黏著劑之問題。但是，即便對剝離後之薄板玻璃基板之附樹脂層之面貼附偏光膜或相位差膜等附黏著劑之膜，亦有黏著強度較弱而會剝離之情形。尤其在偏光膜等中之黏著劑為丙烯酸系時容易剝離。本發明者對其原因進行努力研究後，認為其原因在於：對於專利文獻7所記載之積層體，於剝離後之薄板玻璃基板上看起來並未殘存有聚矽氧樹脂層，但源自該樹脂層之任何物質(例如可列舉化合物。又，例如可列舉形成樹脂層之物質的一部分、且於上述樹脂層之表面析出並存在之低分子化合物等。以下亦稱為「轉印物」)、空氣中飛散之塵芥、及因製造步驟而導致之金屬片或機油等之異物會極少地附著於上述薄板玻璃基板之表面。進而，本發明者發現一種可不對薄板玻璃基板及附著於其上之顯示裝置用構件等造成熱、電磁、機械及化學性損傷地去除上述異物之方法。當薄板玻璃基板為顯示裝置用面板之一部分時，在與薄板玻璃基板之分離面為相反側之面會形成薄膜電晶體、有機EL元件、或彩色濾光片等顯示裝置用構件，又，由於必需不會對其等造成如上所述之損傷，故亦有2張薄板玻璃基板藉由密封劑而成為封裝化之狀態之情形。On the other hand, according to the thin-plate glass substrate laminate described in Patent Document 7, it is difficult to cause the above-described strain defects due to bubbles or the like interposed between the glass substrates. Further, the thin glass substrate and the supporting glass substrate can also be peeled off. Further, the problem that the adhesive remains on the thin glass substrate after peeling can be solved. However, even if a film of an adhesive such as a polarizing film or a retardation film is attached to the surface of the resin-attached layer of the thinned glass substrate after peeling, the adhesive strength may be weak and peeled off. In particular, when the adhesive in a polarizing film or the like is acrylic, it is easily peeled off. The inventors of the present invention have made an effort to study the cause of the problem, and it is considered that the laminated body described in Patent Document 7 does not appear to have a polyoxyxene resin layer on the thinned glass substrate after peeling, but Any of the resin layer (for example, a compound which is a part of a substance which forms a resin layer and which is deposited on the surface of the resin layer, etc., etc., hereinafter referred to as "transfer material") The foreign matter such as the dust and the mustard in the air and the metal sheet or the oil due to the manufacturing step are rarely attached to the surface of the thin glass substrate. Further, the inventors of the present invention have found a method for removing the foreign matter without causing thermal, electromagnetic, mechanical or chemical damage to the thin glass substrate and the member for the display device attached thereto. When the thin glass substrate is a part of the panel for a display device, a member for a display device such as a thin film transistor, an organic EL element, or a color filter is formed on the surface opposite to the surface on which the thin glass substrate is separated, and It is necessary that the damage as described above is not caused by the above, and therefore, the two thin glass substrates are in a state of being encapsulated by the sealant.

本發明係鑒於上述問題而完成者。即，本發明之目的在於提供一種電子裝置之製造方法，其係自將含有電子裝置用構件之基板、樹脂層及支持基板積層而成之附支持體之電子裝置，剝離包含上述樹脂層及上述支持基板之支持體而獲得電子裝置後，不對基板及電子裝置用構件等(例如薄膜電晶體、有機EL元件、彩色濾光片)造成熱、電磁、機械及化學性損傷地去除附著於上述電子裝置用之基板主面的異物，其結果可將偏光膜或相位差膜等附黏著劑之膜牢固地貼附於剝離後之基板之附樹脂層的面。The present invention has been accomplished in view of the above problems. In other words, an object of the present invention is to provide a method of manufacturing an electronic device, which comprises peeling a resin layer and the above-mentioned electronic device from an electronic device with a support including a substrate, a resin layer, and a support substrate. After the electronic device is obtained by supporting the support of the substrate, the substrate and the electronic device member (for example, a thin film transistor, an organic EL device, or a color filter) are removed from the above electrons by thermal, electromagnetic, mechanical, and chemical damage. As a result of the foreign matter on the main surface of the substrate for the device, a film of an adhesive such as a polarizing film or a retardation film can be firmly attached to the surface of the resin-attached substrate of the peeled substrate.

本發明者為解決上述課題而進行反覆努力研究，完成本發明。The inventors of the present invention have made intensive studies to solve the above problems, and have completed the present invention.

本發明係關於以下(1)~(8)。The present invention relates to the following (1) to (8).

(1)一種電子裝置之製造方法，其包括：剝離步驟，自附支持體之電子裝置剝離包含支持基板及樹脂層之支持體，獲得包含電子裝置用構件及基板之電子裝置，上述附支持體之電子裝置係：在含有第1主面及第2主面、且於第2主面上含有電子裝置用構件之基板之第1主面密著有樹脂層，該樹脂層含有剝離性表面，其固定於含有第1主面及第2主面之支持基板之第1主面；及去除步驟，去除附著於上述電子裝置中之上述基板第1主面的異物。(1) A method of manufacturing an electronic device, comprising: a peeling step of peeling off a support including a support substrate and a resin layer from an electronic device having a support, and obtaining an electronic device including a member for an electronic device and a substrate, the support In the electronic device, a resin layer is adhered to the first main surface of the substrate including the first main surface and the second main surface and including the electronic device member on the second main surface, and the resin layer contains a peelable surface. The first main surface is fixed to the support substrate including the first main surface and the second main surface; and the removing step removes foreign matter adhering to the first main surface of the substrate in the electronic device.

(2)如上述(1)之電子裝置之製造方法，其中上述樹脂層係聚矽氧樹脂層。(2) The method of producing an electronic device according to (1) above, wherein the resin layer is a polyoxynated resin layer.

(3)如上述(1)或(2)之電子裝置之製造方法，其中令上述樹脂層之剝離性表面密著於上述基板第1主面之前的上述基板第1主面之黏著強度為f0 ，且令上述去除步驟之後獲得之電子裝置中的上述基板第1主面之黏著強度為f時，f≧f0 。(3) The method of manufacturing an electronic device according to the above aspect (1), wherein the adhesive strength of the first main surface of the substrate before the peeling surface of the resin layer is adhered to the first main surface of the substrate is f 0 , and when the adhesion strength of the first main surface of the substrate in the electronic device obtained after the removal step is f, f ≧ f 0 .

(4)如上述(1)~(3)中任一項之電子裝置之製造方法，其中上述去除步驟係對上述基板之第1主面照射電漿而去除上述異物者。(4) The method of manufacturing an electronic device according to any one of (1) to (3), wherein the removing step is to irradiate the first main surface of the substrate with plasma to remove the foreign matter.

(5)如上述(1)~(3)中任一項之電子裝置之製造方法，其中上述去除步驟係使用含有酸或鹼之藥液而去除上述異物者。(5) The method of manufacturing an electronic device according to any one of (1) to (3), wherein the removing step is a method of removing the foreign matter by using a chemical solution containing an acid or an alkali.

(6)如上述(1)~(3)中任一項之電子裝置之製造方法，其中上述去除步驟係使用含有溶解度參數為7~15之溶劑之藥液而去除上述異物者。(6) The method for producing an electronic device according to any one of (1) to (3), wherein the removing step is to remove the foreign matter by using a chemical solution containing a solvent having a solubility parameter of 7 to 15.

(7)如上述(5)或(6)之電子裝置之製造方法，其係以下步驟：進而使用超音波振動而去除上述異物。(7) The method of manufacturing an electronic device according to (5) or (6) above, wherein the foreign matter is removed by ultrasonic vibration.

(8)如上述(1)~(7)中任一項之電子裝置之製造方法，其中包括2個以上的上述去除步驟。(8) The method of manufacturing an electronic device according to any one of (1) to (7) above, wherein the two or more removal steps are included.

根據本發明，可提供一種電子裝置之製造方法，其係自將含有顯示裝置等電子裝置用構件之基板、樹脂層及支持基板積層而成之附支持體之電子裝置，剝離包含上述樹脂層及上述支持基板之支持體而獲得電子裝置後，不對基板及電子裝置用構件等(例如薄膜電晶體、有機EL元件、彩色濾光片)造成熱、電磁、機械及化學性損傷地去除附著於上述電子裝置用之基板主面的異物，其結果可將偏光膜或相位差膜等附黏著劑之膜牢固地貼附於剝離後之基板之附樹脂層的面。According to the present invention, there is provided a method of manufacturing an electronic device, comprising: ejecting the resin layer and the electronic device with a support comprising a substrate including a member for an electronic device such as a display device, a resin layer, and a support substrate; After the electronic device is obtained by the support of the support substrate, the substrate, the electronic device member (for example, a thin film transistor, an organic EL device, or a color filter) are removed from the above by thermal, electromagnetic, mechanical, and chemical damage. As a result of the foreign matter on the main surface of the substrate for the electronic device, a film of an adhesive such as a polarizing film or a retardation film can be firmly adhered to the surface of the resin-attached substrate of the peeled substrate.

對本發明進行說明。The invention will be described.

本發明之電子裝置製造方法(以下亦稱為「本發明之電子裝置製造方法」)係包括：剝離步驟，自附支持體之電子裝置剝離包含支持基板及樹脂層之支持體，獲得包含電子裝置用構件及基板之電子裝置，上述附支持體之電子裝置係：在含有第1主面及第2主面、且於第2主面上含有電子裝置用構件之基板之第1主面密著有樹脂層，該樹脂層含有剝離性表面，其固定於含有第1主面及第2主面之支持基板之第1主面；及去除步驟，去除附著於上述電子裝置中之上述基板第1主面的異物。The electronic device manufacturing method of the present invention (hereinafter also referred to as "the electronic device manufacturing method of the present invention") includes a peeling step of peeling off a support including a support substrate and a resin layer from an electronic device having a support, and obtaining an electronic device. In the electronic device of the member and the substrate, the electronic device with the support is attached to the first main surface of the substrate including the first main surface and the second main surface and including the electronic device member on the second main surface a resin layer comprising a peelable surface fixed to a first main surface of the support substrate including the first main surface and the second main surface; and a removing step of removing the substrate attached to the electronic device Foreign objects on the main side.

又，以下，將供本發明之電子裝置製造方法中之剝離步驟的附支持體之電子裝置亦稱為「本發明之附支持體之電子裝置」，該附支持體之電子裝置即為：在含有第1主面及第2主面之上述基板之第1主面密著有樹脂層，該樹脂層含有剝離性表面，其固定於含有第1主面及第2主面之支持基板之第1主面。In the following, the electronic device with the support for the peeling step in the method for manufacturing an electronic device of the present invention is also referred to as "the electronic device with the support of the present invention", and the electronic device with the support is: a resin layer is adhered to the first main surface of the substrate including the first main surface and the second main surface, and the resin layer contains a peelable surface, and is fixed to a support substrate including the first main surface and the second main surface. 1 main face.

再者，關於詳細情形將於以下敍述，本發明中所使用之附支持體之電子裝置係：在含有第1主面及第2主面、且於第2主面上含有電子裝置用構件之基板之第1主面密著有樹脂層，該樹脂層含有剝離性表面，其固定於含有第1主面及第2主面之支持基板之第1主面。Further, as will be described in detail below, the electronic device with a support used in the present invention includes a first main surface and a second main surface, and includes a member for an electronic device on the second main surface. A resin layer is adhered to the first main surface of the substrate, and the resin layer contains a peelable surface which is fixed to the first main surface of the support substrate including the first main surface and the second main surface.

即，附支持體之電子裝置含有電子裝置用構件、基板、樹脂層及支持基板，且該等係依此順序而積層。又，電子裝置含有電子裝置用構件及基板，且電子裝置用構件係形成於基板之第2主面上。That is, the electronic device with a support includes a member for an electronic device, a substrate, a resin layer, and a support substrate, and these layers are laminated in this order. Further, the electronic device includes a member for an electronic device and a substrate, and the member for the electronic device is formed on the second main surface of the substrate.

又，附支持體之電子裝置亦可係將由基板、樹脂層及支持基板依此順序積層後之積層體經由電子裝置用構件而積層2個所成者，即，將支持基板、樹脂層、基板、電子裝置用構件、基板、樹脂層及支持基板依此順序積層而成者。In addition, the electronic device with the support may be formed by laminating two or more layers of the substrate, the resin layer, and the support substrate in this order, that is, the support substrate, the resin layer, and the substrate. The member for an electronic device, the substrate, the resin layer, and the support substrate are laminated in this order.

此處，所謂電子裝置，係指顯示裝置用面板、太陽電池、薄膜二次電池、於表面形成有電路之半導體晶圓等電子零件。所謂顯示裝置用面板，係包括液晶面板、有機EL面板、電漿顯示面板、場發射面板等。Here, the electronic device refers to an electronic component such as a panel for a display device, a solar cell, a thin film secondary battery, or a semiconductor wafer on which a circuit is formed. The panel for a display device includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like.

以下，將基板及支持基板包含玻璃之顯示裝置用面板作為本發明中之電子裝置之一進行詳細敍述。以下，將顯示裝置用面板之製造方法稱為「本發明之面板製造方法」，將附支持體之顯示裝置用面板稱為「本發明之附支持體之面板」。Hereinafter, a panel for a display device including a substrate and a support substrate including glass will be described in detail as one of the electronic devices in the present invention. Hereinafter, the method of manufacturing the panel for a display device is referred to as "the panel manufacturing method of the present invention", and the panel for the display device with the support is referred to as "the panel of the support of the present invention".

首先，對本發明之附支持體之面板中之薄板玻璃基板進行說明。First, the thin glass substrate in the panel of the support of the present invention will be described.

對薄板玻璃基板而言，其厚度、形狀、大小、物性(熱收縮率、表面形狀、耐化學品性等)、組成等並無特別限定，例如，可與先前之LCD、OLED等顯示裝置用之玻璃基板相同。The thickness, shape, size, physical properties (heat shrinkage, surface shape, chemical resistance, etc.), composition, and the like of the thin glass substrate are not particularly limited. For example, it can be used with display devices such as LCDs and OLEDs. The glass substrates are the same.

薄板玻璃基板之厚度以未滿0.7 mm為宜，較佳者為0.5 mm以下，更佳者為0.4 mm以下。又，薄板玻璃基板之厚度以0.05 mm以上為宜，較佳者為0.07 mm以上，更佳者為0.1 mm以上。The thickness of the thin glass substrate is preferably less than 0.7 mm, preferably 0.5 mm or less, and more preferably 0.4 mm or less. Further, the thickness of the thin glass substrate is preferably 0.05 mm or more, preferably 0.07 mm or more, and more preferably 0.1 mm or more.

薄板玻璃基板之形狀並無限定，但以矩形為宜。此處，所謂矩形，係指實質上為大致矩形，亦包括切除周邊部之角後(切角後)所成之形狀。The shape of the thin glass substrate is not limited, but a rectangular shape is preferred. Here, the term "rectangular" means a substantially rectangular shape, and includes a shape formed by cutting the corner of the peripheral portion (after the chamfering angle).

薄板玻璃基板之大小並無限定，例如，當矩形時可為100~2000 mm×100~2000 mm，較佳者為500~1000 mm×500~1000 mm。The size of the thin glass substrate is not limited, for example, it may be 100 to 2000 mm × 100 to 2000 mm when rectangular, and preferably 500 to 1000 mm × 500 to 1000 mm.

本發明中，即便為上述厚度及大小時，亦可容易剝離薄板玻璃基板與支持體。In the present invention, even in the case of the above thickness and size, the thin glass substrate and the support can be easily peeled off.

薄板玻璃基板之熱收縮率、表面形狀、耐化學品性等特性亦無特別限定，其根據所製造之顯示裝置之種類而不同。The characteristics such as the heat shrinkage ratio, the surface shape, and the chemical resistance of the thin glass substrate are not particularly limited, and are different depending on the type of display device to be manufactured.

熱收縮率較小時為宜。具體而言，作為熱收縮率指標之線膨脹係數以500×10-7 /℃以下為宜，較佳者為300×10-7 /℃以下，進而較佳者為200×10-7 /℃以下，更佳者為100×10-7 /℃以下，進而更佳者為45×10-7 /℃以下。When the heat shrinkage rate is small, it is preferable. Specifically, the linear expansion coefficient as the index of heat shrinkage is preferably 500 × 10 -7 / ° C or less, preferably 300 × 10 -7 / ° C or less, and more preferably 200 × 10 -7 / ° C. Hereinafter, it is more preferably 100 × 10 -7 / ° C or less, and still more preferably 45 × 10 -7 / ° C or less.

再者，於本發明中，線膨脹係數係指JIS R3102(1995年)中所規定者。Further, in the present invention, the coefficient of linear expansion refers to those specified in JIS R3102 (1995).

薄板玻璃基板之玻璃材料之組成例如亦可與先前已知的含有鹼金屬氧化物之鹼玻璃或無鹼玻璃相同。其中，自熱收縮率較小之觀點而言尤以無鹼玻璃為佳。The composition of the glass material of the thin glass substrate may be, for example, the same as the previously known alkali metal oxide-containing alkali glass or alkali-free glass. Among them, from the viewpoint of a small heat shrinkage ratio, an alkali-free glass is particularly preferable.

本發明之附支持體之面板中，於上述薄板玻璃基板之第2主面含有顯示裝置用構件。In the panel according to the present invention, the member for a display device is provided on the second main surface of the thin glass substrate.

所謂顯示裝置用構件，係指先前的LCD、OLED等顯示裝置用之玻璃基板於其表面上所含有之發光層、保護層、TFT陣列(以下稱為陣列)、彩色濾光片、液晶、含有ITO(Indium Tin Oxide，氧化銦錫)之透明電極等、各種電路圖案等。上述薄板玻璃基板之第2主面上之顯示裝置用構件的種類並無特別限定。The member for a display device refers to a light-emitting layer, a protective layer, a TFT array (hereinafter referred to as an array), a color filter, a liquid crystal, and a photoreceiving layer on a surface of a glass substrate for a display device such as an LCD or an OLED. A transparent electrode such as ITO (Indium Tin Oxide), various circuit patterns, and the like. The type of the member for the display device on the second main surface of the thin glass substrate is not particularly limited.

由上述顯示裝置用構件與上述薄板玻璃基板而形成顯示裝置用面板。A panel for a display device is formed by the member for a display device and the thin glass substrate.

其次，對本發明之附支持體之面板中之支持玻璃基板進行說明。Next, the supporting glass substrate in the panel of the support of the present invention will be described.

本發明之附支持體之面板係在上述薄板玻璃基板之第1主面含有固定有樹脂層的支持玻璃基板作為支持體。支持玻璃基板係經由樹脂層而與薄板玻璃基板密著，以增強薄板玻璃基板之強度。In the panel with a support of the present invention, a support glass substrate to which a resin layer is fixed is provided as a support on the first main surface of the thin glass substrate. The supporting glass substrate is adhered to the thin glass substrate via the resin layer to enhance the strength of the thin glass substrate.

支持玻璃基板之厚度、形狀、大小、物性(熱收縮率、表面形狀、耐化學品性等)、組成等並無特別限定。The thickness, shape, size, physical properties (heat shrinkage ratio, surface shape, chemical resistance, etc.), composition, and the like of the glass substrate are not particularly limited.

支持玻璃基板之厚度並無特別限定，但本發明之附支持體之面板必需為以現行的生產線可處理之厚度。The thickness of the supporting glass substrate is not particularly limited, but the panel of the support of the present invention must be a thickness that can be processed by the current production line.

例如，厚度宜為0.1~1.1 mm，較佳者為0.3~0.8 mm，更佳者為0.4~0.7 mm。For example, the thickness is preferably 0.1 to 1.1 mm, preferably 0.3 to 0.8 mm, and more preferably 0.4 to 0.7 mm.

例如，現行的生產線係設計成可對厚度0.5 mm之基板進行處理者，故當薄板玻璃基板之厚度為0.1 mm時，使支持玻璃基板之厚度與樹脂層之厚度相加為0.4 mm。又，現行的生產線最普遍的是設計成可對厚度0.7 mm之玻璃基板進行處理者，故例如在薄板玻璃基板之厚度為0.4 mm時，使支持玻璃基板之厚度與樹脂層之厚度相加為0.3 mm。For example, the current production line is designed to handle a substrate having a thickness of 0.5 mm, so that when the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate is added to the thickness of the resin layer to be 0.4 mm. Moreover, the current production line is most commonly designed to handle a glass substrate having a thickness of 0.7 mm. Therefore, for example, when the thickness of the thin glass substrate is 0.4 mm, the thickness of the supporting glass substrate is added to the thickness of the resin layer. 0.3 mm.

支持玻璃基板之厚度與上述薄板玻璃基板之相對厚度之關係並無限定，支持玻璃基板之厚度可厚於薄板玻璃基板之厚度，支持玻璃基板之厚度亦可薄於薄板玻璃基板之厚度。The relationship between the thickness of the supporting glass substrate and the relative thickness of the thin glass substrate is not limited, and the thickness of the supporting glass substrate may be thicker than the thickness of the thin glass substrate, and the thickness of the supporting glass substrate may be thinner than the thickness of the thin glass substrate.

支持玻璃基板之形狀並無限定，但以矩形為宜。此處，所謂矩形，係指實質上為大致矩形，亦包括切除周邊部之角後(切角後)所成之形狀。The shape of the supporting glass substrate is not limited, but a rectangular shape is preferred. Here, the term "rectangular" means a substantially rectangular shape, and includes a shape formed by cutting the corner of the peripheral portion (after the chamfering angle).

支持玻璃基板之大小並無限定，但以與上述薄板玻璃基板相同程度為宜，較佳者為稍大於上述薄板玻璃基板。具體而言，例如縱向或橫向之大小分別為0.05~10 mm左右時為佳。其理由為：在顯示裝置用面板製造時，可容易保護上述薄板玻璃基板之端部，不讓其不與定位銷等對準裝置接觸，以及可更容易地進行薄板玻璃基板與支持玻璃基板之剝離。The size of the supporting glass substrate is not limited, but is preferably the same as that of the above-mentioned thin glass substrate, and preferably slightly larger than the thin glass substrate. Specifically, for example, the longitudinal or lateral direction is preferably about 0.05 to 10 mm. The reason is that when the panel for a display device is manufactured, the end portion of the thin glass substrate can be easily protected from contact with an alignment device such as a positioning pin, and the thin glass substrate and the supporting glass substrate can be more easily performed. Stripped.

支持玻璃基板之線膨脹係數可與上述薄板玻璃基板實質上相同，亦可不同。若實質上相同，則在以本發明之面板製造方法進行處理時，在薄板玻璃基板或支持玻璃基板上難以產生翹曲，此點較佳。The linear expansion coefficient of the supporting glass substrate may be substantially the same as or different from the above-described thin glass substrate. If they are substantially the same, it is preferable that warpage is less likely to occur on the thin glass substrate or the supporting glass substrate when the film is produced by the panel manufacturing method of the present invention.

薄板玻璃基板與支持玻璃基板之線膨脹係數之差宜為300×10-7 /℃以下，較佳者為100×10-7 /℃以下，更佳者為50×10-7 /℃以下。The difference in linear expansion coefficient between the thin glass substrate and the supporting glass substrate is preferably 300 × 10 -7 / ° C or less, preferably 100 × 10 -7 / ° C or less, more preferably 50 × 10 -7 / ° C or less.

支持玻璃基板之玻璃材料之組成例如可與鹼玻璃、無鹼玻璃相同。其中，自熱收縮率較小之觀點而言尤以無鹼玻璃為佳。The composition of the glass material supporting the glass substrate can be, for example, the same as that of alkali glass or alkali-free glass. Among them, from the viewpoint of a small heat shrinkage ratio, an alkali-free glass is particularly preferable.

於本發明之實施形態中，基板設為薄板玻璃基板，但本發明並不限定於此。就工業上之易取得性之觀點而言，可將玻璃板、矽晶圓、金屬板、塑膠板等作為較佳之例而呈現。In the embodiment of the present invention, the substrate is a thin glass substrate, but the present invention is not limited thereto. From the viewpoint of industrial availability, a glass plate, a tantalum wafer, a metal plate, a plastic plate, or the like can be presented as a preferred example.

在採用板厚較薄之玻璃板(薄板玻璃基板)作為基板時，薄板玻璃基板之組成例如可與鹼玻璃或無鹼玻璃相同。其中，自熱收縮率較小之觀點而言尤以無鹼玻璃為佳。When a glass plate (thin glass substrate) having a small thickness is used as the substrate, the composition of the thin glass substrate can be the same as that of alkali glass or alkali-free glass, for example. Among them, from the viewpoint of a small heat shrinkage ratio, an alkali-free glass is particularly preferable.

在採用塑膠板作為基板時，其種類並無特別限制，例如，於透明基板之情形時，可例示：聚對苯二甲酸乙二酯樹脂、聚碳酸酯樹脂、聚醚碸樹脂、聚萘二甲酸乙二酯樹脂、聚丙烯酸樹脂、聚聚矽氧樹脂、透明氟樹脂等。於不透明基板之情形時，可例示：聚醯亞胺樹脂、氟樹脂、聚醯胺樹脂、芳族聚醯胺樹脂、聚醚酮樹脂、聚醚醚酮樹脂、各種液晶聚合物樹脂等。When a plastic plate is used as the substrate, the kind thereof is not particularly limited. For example, in the case of a transparent substrate, polyethylene terephthalate resin, polycarbonate resin, polyether oxime resin, polynaphthalene resin can be exemplified. Ethylene formate resin, polyacrylic resin, polyoxymethylene resin, transparent fluororesin, and the like. In the case of an opaque substrate, a polyimine resin, a fluororesin, a polyamide resin, an aromatic polyamide resin, a polyether ketone resin, a polyether ether ketone resin, various liquid crystal polymer resins, and the like can be exemplified.

在採用金屬板作為基板時，其種類並無特別限制，例如可例示不鏽鋼板、銅板等。When a metal plate is used as the substrate, the type thereof is not particularly limited, and examples thereof include a stainless steel plate and a copper plate.

基板之耐熱性並無特別限制，但在形成顯示裝置用構件之TFT陣列等時，耐熱性宜較高。具體而言，上述5%加熱重量損失溫度宜為300℃以上。較佳者為350℃以上。The heat resistance of the substrate is not particularly limited. However, when forming a TFT array or the like for a member for a display device, heat resistance is preferably high. Specifically, the 5% heating weight loss temperature is preferably 300 ° C or higher. Preferably it is 350 ° C or more.

於此情形時，就耐熱性之觀點而言，上述玻璃板之任一者皆適合。In this case, any of the above glass sheets is suitable from the viewpoint of heat resistance.

就耐熱性之觀點而言，作為較佳之塑膠板，可例示：聚醯亞胺樹脂、氟樹脂、聚醯胺樹脂、芳族聚醯胺樹脂、聚醚碸樹脂、聚醚酮樹脂、聚醚醚酮樹脂、聚萘二甲酸乙二酯樹脂、各種液晶聚合物樹脂等。From the viewpoint of heat resistance, as a preferred plastic sheet, a polyimine resin, a fluororesin, a polyamide resin, an aromatic polyamide resin, a polyether oxime resin, a polyether ketone resin, a polyether can be exemplified. An ether ketone resin, a polyethylene naphthalate resin, various liquid crystal polymer resins, and the like.

又，基板亦可為將玻璃板、矽晶圓、金屬板、塑膠板等不同材質積層而成之積層體。例如可列舉：將玻璃板、樹脂層、塑膠板依此順序積層而成之積層體之類的將不同種類之基板經由樹脂層積層而成之積層體；或者將玻璃板、塑膠、玻璃板依此順序積層而成者用作基板之類的將由不同種類之板複層化而成者用作基板之積層體。Further, the substrate may be a laminate in which different materials such as a glass plate, a ruthenium wafer, a metal plate, and a plastic plate are laminated. For example, a laminate in which a different type of substrate is laminated via a resin layer, such as a laminate in which a glass plate, a resin layer, and a plastic plate are laminated in this order, or a glass plate, a plastic, or a glass plate is used. This sequential layer is used as a laminate of a substrate which is formed by laminating different types of sheets.

進而，亦可為將2張以上之玻璃板彼此用作基板、或者將2張以上之塑膠板彼此用作基板之類的將由同一種類之板複層化而成者用作基板之積層體等。Further, a laminate of two or more glass sheets may be used as a substrate, or two or more plastic sheets may be used as a substrate, and a laminate of the same type of sheet may be used as a laminate of the substrate. .

又，於本發明之實施形態中，支持基板設為使用有玻璃板之支持玻璃基板，但本發明並不限定於此。就工業上之易取得性之觀點而言，可將玻璃板、矽晶圓、金屬板、塑膠板等作為較佳之例而呈現。Further, in the embodiment of the present invention, the support substrate is a support glass substrate using a glass plate, but the present invention is not limited thereto. From the viewpoint of industrial availability, a glass plate, a tantalum wafer, a metal plate, a plastic plate, or the like can be presented as a preferred example.

在採用玻璃板作為支持基板時，支持玻璃基板之厚度、形狀、大小、物性(熱收縮率、表面形狀、耐化學品性等)、組成等並無特別限定。When a glass plate is used as the support substrate, the thickness, shape, size, physical properties (heat shrinkage ratio, surface shape, chemical resistance, etc.), composition, and the like of the support glass substrate are not particularly limited.

支持玻璃基板之厚度並無特別限定，但附支持體之顯示裝置用面板必需為以現行的生產線可處理之厚度。The thickness of the supporting glass substrate is not particularly limited, but the panel for the display device with the support must be a thickness that can be handled by the current production line.

例如厚度宜為0.1~1.1 mm，較佳者為0.3~0.8 mm，更佳者為0.4~0.7 mm。For example, the thickness is preferably 0.1 to 1.1 mm, preferably 0.3 to 0.8 mm, and more preferably 0.4 to 0.7 mm.

例如，現行的生產線係設計成可對厚度0.5 mm之基板進行處理者，故當薄板玻璃基板之厚度為0.1 mm時，使支持玻璃基板之厚度與樹脂層之厚度相加為0.4 mm。又，現行的生產線最普遍的是設計成可對厚度0.7 mm之玻璃基板進行處理者，故例如在薄板玻璃基板之厚度為0.4 mm時，使支持玻璃基板之厚度與樹脂層之厚度相加為0.3 mm。For example, the current production line is designed to handle a substrate having a thickness of 0.5 mm, so that when the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate is added to the thickness of the resin layer to be 0.4 mm. Moreover, the current production line is most commonly designed to handle a glass substrate having a thickness of 0.7 mm. Therefore, for example, when the thickness of the thin glass substrate is 0.4 mm, the thickness of the supporting glass substrate is added to the thickness of the resin layer. 0.3 mm.

支持玻璃基板之厚度宜厚於上述薄板玻璃基板。The thickness of the supporting glass substrate is preferably thicker than the above-mentioned thin glass substrate.

其次，對本發明之附支持體之面板中之樹脂層進行說明。Next, the resin layer in the panel of the support of the present invention will be described.

樹脂層固定於上述支持玻璃基板之第1主面。並且，樹脂層密著於上述薄板玻璃基板之第1主面，但可容易地剝離。即，樹脂層對上述薄板玻璃基板之第1主面而以某種程度之結合力結合，且以剝離時不會破壞薄板玻璃基板而可容易剝離之程度之結合力結合。本發明中，將樹脂層表面的可容易剝離之性質稱為剝離性。The resin layer is fixed to the first main surface of the support glass substrate. Further, the resin layer is adhered to the first main surface of the thin glass substrate, but can be easily peeled off. In other words, the resin layer is bonded to the first main surface of the thin glass substrate by a certain degree of bonding force, and the bonding force is bonded to the extent that the thin glass substrate can be easily peeled off at the time of peeling. In the present invention, the property of easily peeling off the surface of the resin layer is referred to as peelability.

於本發明之附支持體之面板中，較佳為：樹脂層與薄板玻璃基板之第1主面並非藉由含有黏著劑之類的黏著力而附著，而是藉由固體分子間之凡得瓦力所引起之力、即密著力而附著。In the panel of the support of the present invention, it is preferable that the first main surface of the resin layer and the thin glass substrate are not adhered by an adhesive force such as an adhesive, but by solid molecules. The force caused by the tile force, that is, the adhesion is attached.

另一方面，樹脂層對上述支持玻璃基板之第1主面之結合力，相對地高於對上述薄板玻璃基板之第1主面之結合力。本發明中，將對薄板玻璃基板之第1主面之結合稱為密著，將對支持玻璃基板之第1主面之結合稱為固定。On the other hand, the bonding strength of the resin layer to the first main surface of the supporting glass substrate is relatively higher than the bonding force to the first main surface of the thin glass substrate. In the present invention, the bonding of the first main surface of the thin glass substrate is referred to as adhesion, and the bonding of the first main surface of the supporting glass substrate is referred to as fixing.

樹脂層之厚度並無特別限定，以1~100 μm為宜，較佳者為5~30 μm，更佳者為7~20 μm。其原因在於：在樹脂層之厚度為上述範圍時，薄板玻璃基板之第1主面與樹脂層之密著將會充分。The thickness of the resin layer is not particularly limited, and is preferably 1 to 100 μm, more preferably 5 to 30 μm, and still more preferably 7 to 20 μm. This is because when the thickness of the resin layer is within the above range, the adhesion between the first main surface of the thin glass substrate and the resin layer is sufficient.

又，其原因在於，即便介入有氣泡或異物，亦可抑制薄板玻璃基板產生應變缺陷。又，若樹脂層之厚度過厚，則形成時需要花費時間及材料而不經濟。Moreover, this is because the occurrence of strain defects in the thin glass substrate can be suppressed even if air bubbles or foreign matter are interposed. Further, if the thickness of the resin layer is too thick, it takes time and material to be formed, which is uneconomical.

另外，樹脂層可包含2層以上。於此情形時，「樹脂層之厚度」係指所有層之總計厚度。Further, the resin layer may contain two or more layers. In this case, "thickness of the resin layer" means the total thickness of all the layers.

又，當樹脂層包含2層以上時，形成各個層之樹脂的種類可不同。Further, when the resin layer contains two or more layers, the types of the resins forming the respective layers may be different.

對樹脂層而言，相對於上述薄板玻璃基板之第1主面的樹脂層之剝離性表面之表面張力宜為30 mN/m以下，較佳者為25 mN/m以下，更佳者為22 mN/m以下。其原因在於，當為上述表面張力時，可更容易地與薄板玻璃基板之第1主面剝離，同時與薄板玻璃基板之第1主面之密著亦會充分。The surface tension of the repellent surface of the resin layer with respect to the first main surface of the thin glass substrate is preferably 30 mN/m or less, preferably 25 mN/m or less, and more preferably 22 for the resin layer. Below mN/m. The reason for this is that when the surface tension is the above, it is more easily peeled off from the first main surface of the thin glass substrate, and the adhesion to the first main surface of the thin glass substrate is also sufficient.

又，樹脂層宜包含玻璃轉移點低於室溫(25℃左右)或者不具有玻璃轉移點之材料。其原因在於，可成為非黏著性之樹脂層，且具有更高之剝離性，更容易與薄板玻璃基板之第1主面剝離，同時與薄板玻璃基板之第1主面之密著亦會充分。Further, the resin layer preferably contains a material having a glass transition point lower than room temperature (about 25 ° C) or having no glass transition point. The reason for this is that it can be a non-adhesive resin layer and has higher peelability, and is more likely to be peeled off from the first main surface of the thin glass substrate, and is also sufficiently adhered to the first main surface of the thin glass substrate. .

又，樹脂層宜具有耐熱性。其原因在於，於本發明之面板製造方法中，例如於上述薄板玻璃基板之第2主面上形成顯示裝置用構件時，可將由薄板玻璃基板、樹脂層及支持玻璃基板積層而成之玻璃積層體供熱處理。Further, the resin layer preferably has heat resistance. In the panel manufacturing method of the present invention, for example, when a member for a display device is formed on the second main surface of the thin glass substrate, a glass laminate formed by laminating a thin glass substrate, a resin layer, and a supporting glass substrate can be used. The body is heat treated.

又，若樹脂層之彈性模數過高，則與薄板玻璃基板之第1主面之密著性將會降低而不佳。另外，若彈性模數過低，則剝離性將會降低而不佳。Moreover, if the elastic modulus of the resin layer is too high, the adhesion to the first main surface of the thin glass substrate will be lowered. Further, if the modulus of elasticity is too low, the peelability will be lowered.

形成樹脂層之樹脂之種類並無特別限定。例如可列舉：丙烯酸樹脂、聚烯烴系樹脂、聚胺基甲酸酯樹脂及聚矽氧樹脂。可混合若干種類之樹脂而使用。於上述樹脂之群中，聚矽氧樹脂為宜。其原因在於，聚矽氧樹脂之耐熱性優異，且對薄板玻璃基板之剝離性之程度較佳。又，其原因在於，於支持玻璃基板之第1主面使硬化性聚矽氧樹脂硬化而形成聚矽氧樹脂層時，藉由與支持玻璃基板之第1主面之矽烷醇基之縮合反應而容易固定於支持玻璃基板上。聚矽氧樹脂層例如即便於300~400℃左右進行1小時左右之處理，剝離性仍大致不會劣化，此點亦較佳。The kind of the resin forming the resin layer is not particularly limited. For example, an acrylic resin, a polyolefin resin, a polyurethane resin, and a polyoxyl resin can be mentioned. It can be used by mixing several types of resins. Among the above-mentioned groups of resins, a polyoxyxylene resin is preferred. The reason for this is that the polyoxynoxy resin is excellent in heat resistance and is excellent in the peeling property to the thin glass substrate. Further, the reason is that when the first main surface of the supporting glass substrate is cured to form a polyoxyxylene resin layer, the condensation reaction with the decyl alcohol group of the first main surface of the supporting glass substrate is performed. It is easy to fix on a supporting glass substrate. For example, even if the polyoxyxene resin layer is treated at about 300 to 400 ° C for about 1 hour, the peeling property is not substantially deteriorated.

又，樹脂層在聚矽氧樹脂中尤以剝離紙用之硬化性聚矽氧之硬化物為佳。剝離紙用聚矽氧係以於分子內含有直鏈狀的二甲基聚矽氧烷之聚矽氧作為主劑者。使用觸媒、光聚合起始劑等而使含有該主劑與交聯劑之組合物於上述支持玻璃基板之表面(第1主面)硬化所形成之樹脂層具有優異的剝離性，故較佳。又，上述樹脂層之柔軟性較高，因此即便氣泡或塵芥等異物混入至薄板玻璃基板與樹脂層之間，亦可抑制薄板玻璃基板產生應變缺陷。Further, the resin layer is preferably a hardened polyoxyl cured product for release paper in the polyoxymethylene resin. The polydecene oxide for release paper is mainly composed of polyfluorene oxygen having a linear dimethyl polyoxyalkylene in its molecule. By using a catalyst, a photopolymerization initiator, or the like, the resin layer formed by curing the composition containing the main component and the crosslinking agent on the surface (first main surface) of the supporting glass substrate has excellent releasability. good. Further, since the resin layer has high flexibility, even if foreign matter such as bubbles or dust mustard is mixed between the thin glass substrate and the resin layer, strain defects in the thin glass substrate can be suppressed.

該種剝離紙用聚矽氧根據其硬化機構而分類為縮合反應型聚矽氧、加成反應型聚矽氧、紫外線硬化型聚矽氧或電子束硬化型聚矽氧，但皆可使用。該等中尤以加成反應型聚矽氧為佳。其原因在於，硬化反應之難易度、形成樹脂層時剝離性之程度為良好，且耐熱性亦較高。Such a release paper is classified into a condensation reaction type polyoxane, an addition reaction type polyoxane, an ultraviolet curing type polyoxynium or an electron beam hardening type polyfluorene according to a curing mechanism thereof, but may be used. Among these, an addition reaction type polyoxane is preferred. The reason for this is that the ease of the hardening reaction, the degree of peeling property when the resin layer is formed are good, and the heat resistance is also high.

又，剝離紙用聚矽氧在形態上有溶劑型、乳液型及無溶劑型，任一類型皆可使用。該等中尤以無溶劑型為佳。其原因在於，在生產性、安全性、環境特性之方面優異。又，其原因在於，形成樹脂層時在進行硬化時，即，在加熱硬化、紫外線硬化或電子束硬化時，不含有會產生發泡之溶劑，故樹脂層中難以殘留氣泡。Further, the polyfluorinated oxygen for the release paper may be in the form of a solvent type, an emulsion type or a solventless type, and any type may be used. Among these, a solventless type is preferred. This is because it is excellent in terms of productivity, safety, and environmental characteristics. Further, the reason for this is that when the resin layer is formed, when curing is performed, that is, when heat curing, ultraviolet curing, or electron beam curing is performed, a solvent that causes foaming is not contained, so that it is difficult to leave bubbles in the resin layer.

又，作為剝離紙用聚矽氧，具體而言，作為一般市售之商品名或型號，可列舉：KNS-320A、KS-847(皆為信越聚矽氧(Shin-Etsu Silicones)公司製造)、TPR6700(GE東芝(GE Toshiba Silicones)聚矽氧公司製造)、乙烯基聚矽氧「8500」(荒川化學工業股份有限公司製造)、與甲基氫化聚矽氧烷「12031」(荒川化學工業股份有限公司製造)之組合；乙烯基聚矽氧「11364」(荒川化學工業股份有限公司製造)與甲基氫化聚矽氧烷「12031」(荒川化學工業股份有限公司製造)之組合；乙烯基聚矽氧「11365」(荒川化學工業股份有限公司製造)與甲基氫化聚矽氧烷「12031」(荒川化學工業股份有限公司製造)之組合等。再者，KNS-320A、KS-847及TPR6700係預先含有主劑與交聯劑之聚矽氧。In addition, as a commercially available brand name or model, KNS-320A and KS-847 (all manufactured by Shin-Etsu Silicones Co., Ltd.) are mentioned as a general-purpose brand name or a model. , TPR6700 (produced by GE Toshiba Silicones Polyoxane Co., Ltd.), vinyl polyoxylium "8500" (manufactured by Arakawa Chemical Industries Co., Ltd.), and methyl hydrogenated polyoxyalkylene "12031" (Arakawa Chemical Industry) a combination of vinyl polyoxylium "11364" (manufactured by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogenated polyoxyalkylene "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.); vinyl A combination of polyoxylium "11365" (manufactured by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogenated polyoxyalkylene "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.). Further, KNS-320A, KS-847, and TPR6700 are preliminarily containing polyfluorene oxide of a main component and a crosslinking agent.

又，形成樹脂層之聚矽氧樹脂宜具有聚矽氧樹脂中之成分難以轉移至薄板玻璃基板的性質，即，宜具有低聚矽氧轉移性。Further, the polyfluorene oxide resin forming the resin layer preferably has a property that the components in the polyxanthene resin are difficult to transfer to the thin glass substrate, that is, it is preferable to have an oligomeric oxygen transfer property.

其次，利用圖式來說明本發明之附支持體之面板。Next, the panel of the attached support of the present invention will be described using a drawing.

圖1係表示本發明之附支持體之面板之一態樣的概略剖面圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an aspect of a panel of a support according to the present invention.

於圖1中，顯示裝置用面板16包含層狀之顯示裝置用構件14及薄板玻璃基板12，該等被積層。此處，顯示裝置用構件14係形成於薄板玻璃基板12之第2主面上。並且，薄板玻璃基板12之第1主面與固定於支持玻璃基板19之第1主面之樹脂層18的表面密著而附著，形成本發明之附支持體之面板10。In FIG. 1, the display device panel 16 includes a layered display device member 14 and a thin glass substrate 12, which are laminated. Here, the display device member 14 is formed on the second main surface of the thin glass substrate 12. Further, the first main surface of the thin glass substrate 12 is adhered to the surface of the resin layer 18 fixed to the first main surface of the supporting glass substrate 19, and the panel 10 with the support of the present invention is formed.

圖1所示之態樣之本發明之附支持體之面板10中，薄板玻璃基板12、樹脂層18、及支持玻璃基板19在面方向上為大致相同之大小。In the panel 10 with a support of the present invention as shown in Fig. 1, the thin glass substrate 12, the resin layer 18, and the supporting glass substrate 19 are substantially the same size in the plane direction.

圖2係表示本發明之附支持體之面板之另一態樣的概略正視圖，圖3係其A-A'剖面圖(概略剖面圖)。Fig. 2 is a schematic front view showing another aspect of the panel of the support of the present invention, and Fig. 3 is a cross-sectional view (a schematic cross-sectional view) taken along line A-A'.

於圖2及圖3中，顯示裝置用面板26包含層狀之顯示裝置用構件24及薄板玻璃基板22，該等被積層。此處，顯示裝置用構件24係形成於薄板玻璃基板22之第2主面上。並且，薄板玻璃基板22之第1主面與固定於支持玻璃基板29之第1主面的樹脂層28密著而附著，形成本發明之附支持體之面板20。In FIGS. 2 and 3, the display device panel 26 includes a layered display device member 24 and a thin glass substrate 22, and these layers are laminated. Here, the display device member 24 is formed on the second main surface of the thin glass substrate 22. Further, the first main surface of the thin glass substrate 22 is adhered to the resin layer 28 fixed to the first main surface of the supporting glass substrate 29, and the panel 20 with the support of the present invention is formed.

圖2及圖3所示之態樣之本發明之附支持體之面板20中，較薄板玻璃基板22而言，支持玻璃基板29之主面面積更大，且薄板玻璃基板22之面方向之外緣並未自支持玻璃基板29之外緣伸出。In the panel 20 with the support of the present invention as shown in FIG. 2 and FIG. 3, the thinner glass substrate 22 has a larger main surface area of the supporting glass substrate 29, and the surface of the thin glass substrate 22 is oriented. The outer edge does not protrude from the outer edge of the supporting glass substrate 29.

又，圖2及圖3所示之態樣之本發明之附支持體之面板20中，較樹脂層28之表面(與薄板玻璃基板22之第1主面相接之面)之面積(以下，亦稱為樹脂層中之「表面面積」)而言，薄板玻璃基板22之第1主面之面積更大。樹脂層28之表面面積較薄板玻璃基板22之第一主面之面積小了相當於形成後述間隙部25之部分。並且，薄板玻璃基板22之第1主面中之未與樹脂層28相接之部分α、及與其對向之支持玻璃基板29之一部分β，形成連接本發明之附支持體之面板20之端面(γ1、γ2)的間隙部25。Further, in the panel 20 with a support of the present invention as shown in Figs. 2 and 3, the area of the surface of the resin layer 28 (the surface in contact with the first main surface of the thin glass substrate 22) (below) The "surface area" in the resin layer is also referred to as a larger area of the first main surface of the thin glass substrate 22. The surface area of the resin layer 28 is smaller than the area of the first main surface of the thin glass substrate 22, and corresponds to a portion where the gap portion 25 to be described later is formed. Further, a portion α of the first main surface of the thin glass substrate 22 that is not in contact with the resin layer 28, and a portion β of the supporting glass substrate 29 opposed thereto form an end face of the panel 20 to which the support of the present invention is attached. The gap portion 25 of (γ1, γ2).

在形成上述間隙部25後，於後述之本發明之面板製造方法之剝離步驟中，可更容易地剝離薄板玻璃基板與樹脂層，因而較佳。After the gap portion 25 is formed, the thin plate glass substrate and the resin layer can be more easily peeled off in the peeling step of the panel manufacturing method of the present invention to be described later, which is preferable.

又，間隙部25之深度宜為1 mm以上，較佳者為3 mm以上，更佳者為5 mm以上。又，宜為15 mm以下，較佳者為10 mm以下。其原因在於，於後述之本發明之面板製造方法之剝離步驟中，可更容易地剝離薄板玻璃基板與樹脂層。Further, the depth of the gap portion 25 is preferably 1 mm or more, preferably 3 mm or more, and more preferably 5 mm or more. Further, it is preferably 15 mm or less, preferably 10 mm or less. This is because the thin-plate glass substrate and the resin layer can be more easily peeled off in the peeling step of the panel manufacturing method of the present invention to be described later.

再者，所謂「間隙部之深度」，係指自薄板玻璃基板之端面(γ2)起沿該端面之垂直方向直至樹脂層之端面為止的長度。於圖2、圖3所示之情形下，係指由α所表示之部分的長度。再者，如後述之圖5所示之態樣，當自薄板玻璃基板之端面起沿該端面之垂直方向直至樹脂層之端面為止的之長度係根據作為起點之薄板玻璃基板之端面之部位而不同時，使最大長度為「間隙部之深度」。In addition, the "depth of the gap portion" means the length from the end surface (γ2) of the thin glass substrate along the vertical direction of the end surface to the end surface of the resin layer. In the case of Figs. 2 and 3, it means the length of the portion indicated by α. Further, as shown in FIG. 5, which will be described later, the length from the end face of the thin glass substrate along the vertical direction of the end face to the end face of the resin layer is based on the end face of the thin glass substrate as the starting point. When not in the case, the maximum length is "depth of the gap portion".

又，間隙部25之位置可為如圖2所示之矩形的薄板玻璃基板22之一邊之中心部分，亦可為如圖4所示之矩形的薄板玻璃基板22之一邊之全部。又，亦可為將如圖5所示之矩形的薄板玻璃基板22含有之角中之一個角大幅切角後所成者。再者，圖4、圖5分別係表示本發明之附支持體之面板之又一態樣的概略正視圖。Further, the position of the gap portion 25 may be a central portion of one side of the rectangular thin glass substrate 22 as shown in FIG. 2, or may be one of the sides of the rectangular thin glass substrate 22 as shown in FIG. Further, it may be formed by sharply cutting one of the corners of the rectangular thin glass substrate 22 shown in FIG. Further, Fig. 4 and Fig. 5 are schematic front views showing still another aspect of the panel with the support of the present invention.

又，如圖6之概略剖面圖所示，本發明之附支持體之面板亦可為如下態樣：將顯示裝置用構件34之兩主面夾入至薄板玻璃基板(32a、32b)、樹脂層(38a、38b)及支持玻璃基板(39a、39b)之積層體中。該種態樣亦為可利用本發明的面板製造方法進行處理之本發明之附支持體之面板。Further, as shown in the schematic cross-sectional view of Fig. 6, the panel of the support according to the present invention may be such that the main faces of the member 34 for display device are sandwiched between the thin glass substrates (32a, 32b) and the resin. The layers (38a, 38b) and the laminated body supporting the glass substrates (39a, 39b). This aspect is also a panel of the support of the present invention which can be treated by the panel manufacturing method of the present invention.

其次，說明本發明之附支持體之面板之製造方法。Next, a method of manufacturing the panel with the support of the present invention will be described.

本發明之附支持體之面板之製造方法並無特別限定，但宜包括如下步驟：樹脂層形成步驟，於上述支持玻璃基板之第1主面形成含有剝離性表面之樹脂層；密著步驟，積層上述薄板玻璃基板與上述支持玻璃基板，使上述樹脂層之剝離性表面密著於上述薄板玻璃基板之第1主面；及顯示裝置用構件形成步驟，於上述薄板玻璃基板之第2主面上形成顯示裝置用構件。The method for producing the panel of the support according to the present invention is not particularly limited, but preferably includes the step of forming a resin layer on the first main surface of the supporting glass substrate to form a resin layer containing a releasable surface, and a step of adhering, Laminating the thin glass substrate and the supporting glass substrate, the peeling surface of the resin layer is adhered to the first main surface of the thin glass substrate; and the member for forming the display device is formed on the second main surface of the thin glass substrate A member for a display device is formed thereon.

本發明之附支持體之面板之製造方法中的薄板玻璃基板及支持玻璃基板之製造方法並無特別限定。例如可利用先前公知之方法來製造。例如，在將先前公知之玻璃原料熔解而形成熔融玻璃後，可藉由浮式法、熔融法、流孔法(slot method)、再曳引法(redraw method)等成形為板狀而獲得。The method for producing the thin glass substrate and the supporting glass substrate in the method for producing a panel with a support according to the present invention is not particularly limited. For example, it can be manufactured by a previously known method. For example, after melting a previously known glass raw material to form molten glass, it can be obtained by forming into a plate shape by a float method, a melting method, a slot method, a redraw method, or the like.

對本發明之附支持體之面板之製造方法中的樹脂層形成步驟進行說明。The resin layer forming step in the method for producing a panel with a support of the present invention will be described.

於支持玻璃基板之表面(第1主面)上形成樹脂層之方法並無特別限定。The method of forming the resin layer on the surface (first main surface) of the supporting glass substrate is not particularly limited.

例如可列舉將膜狀之樹脂接著於支持玻璃基板之表面的方法。具體而言可列舉如下方法：為了對膜之表面賦予較高之接著力而進行表面改質處理，將其接著於支持玻璃基板之第1主面。作為表面改質之處理方法，可例示：如矽烷偶合劑之類的使密著力化學性地提高之化學方法(底塗處理)；或如火焰(flame)處理之類的使表面活性基增加之物理方法；如噴砂處理之類的藉由增加表面粗糙度而使捕獲力增加之機械方法等。For example, a method of adhering a film-form resin to the surface of a supporting glass substrate is mentioned. Specifically, a method of modifying the surface to impart a high adhesion to the surface of the film and adhering it to the first main surface of the supporting glass substrate is exemplified. As a treatment method of the surface modification, a chemical method (primer treatment) which chemically enhances the adhesion force such as a decane coupling agent, or an increase in surface active group such as a flame treatment can be exemplified. Physical method; mechanical method such as sandblasting to increase the trapping force by increasing the surface roughness.

又，例如可列舉以公知之方法將形成樹脂層之樹脂組合物塗佈於支持玻璃基板之第1主面上的方法。作為公知之方法，可列舉：噴塗法、模塗法、旋塗法、浸塗法、輥塗法、棒塗法、絲網印刷法、凹版印刷塗佈法。可根據樹脂組合物之種類而自上述方法中適當選擇。Further, for example, a method of applying a resin composition forming a resin layer to the first main surface of the supporting glass substrate by a known method can be mentioned. As a known method, a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, and a gravure coating method can be mentioned. It can be suitably selected from the above methods depending on the kind of the resin composition.

例如，在使用無溶劑型之剝離紙用聚矽氧作為樹脂組合物時，宜採用模塗法、旋塗法或絲網印刷法。For example, when a polyacetal using a solventless release paper is used as the resin composition, a die coating method, a spin coating method or a screen printing method is preferably employed.

再者，在製造含有如使用圖2~5所說明之間隙部的本發明之附支持體之面板時，宜對形成間隙部之部位預先進行遮蔽，然後塗佈樹脂組合物。所謂遮蔽，係指如下方法：在塗佈樹脂組合物時，對形成間隙部之部位預先貼附可再剝離之膜等，使樹脂組合物不塗佈於該部位，其後剝離上述膜。Further, in the case of manufacturing a panel comprising the support of the present invention as described with reference to Figs. 2 to 5, it is preferable to mask the portion where the gap portion is formed, and then apply the resin composition. In the case of applying the resin composition, a film which can be peeled off is attached to a portion where the gap portion is formed, and the resin composition is not applied to the portion, and then the film is peeled off.

又，在將樹脂組合物塗佈於支持玻璃基板之第1主面上時，其塗佈量宜為1~100 g/m2 ，較佳者為5~20 g/m2 。Further, when the resin composition is applied to the first main surface of the supporting glass substrate, the coating amount thereof is preferably from 1 to 100 g/m 2 , preferably from 5 to 20 g/m 2 .

又，作為其他方法，例如在由加成反應型聚矽氧而形成樹脂層時，藉由上述之噴塗法等公知之方法，將包含：於分子內含有直鏈狀之二甲基聚矽氧烷之聚矽氧(主劑)、交聯劑及觸媒之樹脂組合物塗佈於支持玻璃基板之第1主面上，其後使其加熱硬化。加熱硬化條件係根據觸媒之調配量而不同，例如在相對於主劑及交聯劑之總計量100重量份而調配鉑系觸媒2重量份時，使其在大氣中於50℃~250℃下進行反應，較佳者為100℃~200℃下進行反應。又，此時之反應時間為5~60分鐘，較佳者為10~30分鐘。由於形成為具有低聚矽氧轉移性之聚矽氧樹脂層，因此使硬化反應儘可能地進行以便聚矽氧樹脂層中不殘留有未反應之聚矽氧成分為宜，若為上述的反應溫度及反應時間，則可使聚矽氧樹脂層中不會殘留有未反應之聚矽氧成分，因而較佳。當反應時間較上述反應時間而言過長時、或反應溫度過高時，會同時引起聚矽氧樹脂之氧化分解，生成低分子量之聚矽氧成分，因此聚矽氧轉移性有可能變高。使硬化反應儘可能地進行以便聚矽氧樹脂層中不會殘留有未反應之聚矽氧成分，由此亦可使加熱處理後之剝離性良好，故較佳。Further, as another method, for example, when a resin layer is formed by addition reaction type polyfluorene, a known method such as the above-described spraying method includes containing a linear dimethyl polyoxyl group in the molecule. The resin composition of the polysiloxane (main agent), the crosslinking agent, and the catalyst of the alkane is applied onto the first main surface of the supporting glass substrate, and then heat-hardened. The heat-hardening conditions differ depending on the amount of the catalyst to be mixed. For example, when 2 parts by weight of the platinum-based catalyst is blended with respect to 100 parts by weight of the total amount of the main agent and the crosslinking agent, it is allowed to be in the atmosphere at 50 ° C to 250 ° C. The reaction is carried out at ° C, preferably at 100 ° C to 200 ° C. Further, the reaction time at this time is 5 to 60 minutes, preferably 10 to 30 minutes. Since it is formed into a polyoxynoxy resin layer having an oligomeric oxime oxygen transfer property, the hardening reaction is carried out as much as possible so that no unreacted polyfluorene oxide component remains in the polyoxynoxy resin layer, and the above reaction is preferred. The temperature and the reaction time are preferred because the unreacted polyfluorene oxide component does not remain in the polyoxynated resin layer. When the reaction time is too long compared to the above reaction time, or the reaction temperature is too high, the oxidative decomposition of the polyfluorene oxide resin is simultaneously caused to form a low molecular weight polyoxon component, and thus the polyoxane transfer property may become high. . The hardening reaction is carried out as much as possible so that the unreacted polyfluorene oxide component does not remain in the polyoxymethylene resin layer, and thus the peeling property after the heat treatment can be improved, which is preferable.

利用上述方法於支持玻璃基板之第1主面上形成樹脂層之後，於樹脂層之表面積層薄板玻璃基板。After the resin layer is formed on the first main surface of the supporting glass substrate by the above method, the glass substrate is thinned on the surface layer of the resin layer.

又，例如，在使用剝離紙用聚矽氧而製造樹脂層時，將塗佈於支持玻璃基板之第1主面上之剝離紙用聚矽氧加熱硬化而形成聚矽氧樹脂層之後，於密著步驟中使薄板玻璃基板積層於支持玻璃基板之聚矽氧樹脂形成面。藉由使剝離紙用聚矽氧加熱硬化而使聚矽氧樹脂硬化物與支持玻璃基板化學性結合。又，根據效果，聚矽氧樹脂層會與支持玻璃基板結合。於該等之作用下，聚矽氧樹脂層被牢固地固定於支持玻璃基板之第1主面。Further, for example, when a resin layer is produced by using polyfluorene oxide for a release paper, the release paper applied to the first main surface of the support glass substrate is heat-cured by polyfluorene to form a polyoxyn resin layer, and then In the adhesion step, the thin glass substrate is laminated on the polyoxyl resin forming surface of the supporting glass substrate. The cured epoxy resin is chemically bonded to the supporting glass substrate by heat-hardening the release paper with polyoxymethylene. Further, depending on the effect, the polyoxyxene resin layer is bonded to the supporting glass substrate. Under these actions, the polyoxyxene resin layer is firmly fixed to the first main surface of the supporting glass substrate.

對本發明之附支持體之面板之製造方法中的密著步驟進行說明。The adhesion step in the method of manufacturing the panel with the support of the present invention will be described.

密著步驟係將上述薄板玻璃基板之第1主面、與在第1主面形成有上述樹脂層之上述支持玻璃基板進行積層，並使上述樹脂層之剝離性表面密著於上述薄板玻璃基板之第1主面的步驟。In the adhesion step, the first main surface of the thin glass substrate is laminated with the supporting glass substrate on which the resin layer is formed on the first main surface, and the peeling surface of the resin layer is adhered to the thin glass substrate. The first main surface step.

薄板玻璃基板之第1主面與樹脂層之剝離性表面宜藉由非常接近之相對的固體分子間之凡得瓦力所引起之力、即密著力而結合。此時，可保持為使支持玻璃基板與薄板玻璃基板積層之狀態。The peeling surface of the first main surface of the thin glass substrate and the resin layer is preferably combined by a force, that is, a sealing force, which is caused by the van der Waals force between the opposing solid molecules. In this case, the state in which the supporting glass substrate and the thin glass substrate are laminated can be maintained.

使上述薄板玻璃基板與在第1主面固定有上述樹脂層之上述支持玻璃基板積層之方法並無特別限定。例如可使用公知之方法而實施。例如可列舉如下方法：在常壓環境下將薄板玻璃基板疊合於樹脂層之表面後，使用輥或衝壓機使樹脂層與薄板玻璃基板壓接。使用輥或衝壓機進行壓接，藉此樹脂層與薄板玻璃基板將進一步密著，故較佳。又，使用輥或衝壓機之壓接，藉此可容易地去除混入至樹脂層與薄板玻璃基板之間的氣泡，故較佳。The method of laminating the thin glass substrate with the supporting glass substrate on which the resin layer is fixed on the first main surface is not particularly limited. For example, it can be implemented using a well-known method. For example, a method in which a thin plate glass substrate is superposed on the surface of a resin layer under a normal pressure environment, and a resin layer and a thin glass substrate are pressure-bonded using a roll or a press machine. It is preferable to use a roll or a press to press-bond, whereby the resin layer and the thin glass substrate are further adhered. Further, it is preferable to use a pressure bonding of a roll or a press to easily remove air bubbles mixed between the resin layer and the thin glass substrate.

若藉由真空層壓法或真空加壓法進行壓接，則可更好地抑制氣泡之混入及確保良好的密著，故更佳。於真空下進行壓接，藉此亦存在以下優點：即便在殘存有微量氣泡之情形時，氣泡亦不會因加熱而成長，從而難以導致薄板玻璃基板之應變缺陷。When the pressure bonding is carried out by a vacuum lamination method or a vacuum press method, it is preferable to suppress the incorporation of air bubbles and ensure good adhesion. The pressure bonding is performed under vacuum, whereby there is also an advantage that even in the case where a small amount of air bubbles remain, the bubbles do not grow by heating, and it is difficult to cause strain defects of the thin glass substrate.

於密著步驟中，在使薄板玻璃基板積層於支持玻璃基板之樹脂層之剝離性表面時，宜充分地清洗薄板玻璃基板之表面，於潔淨度高的環境下進行積層。即便在樹脂層與薄板玻璃基板之間混入有異物，亦不會因樹脂層變形而對薄板玻璃基板之表面之平坦性造成影響，但潔淨度越高，其平坦性越好，故潔淨度高為佳。In the adhesion step, when the thin glass substrate is laminated on the peeling surface of the resin layer supporting the glass substrate, it is preferable to sufficiently clean the surface of the thin glass substrate and laminate the layer in a highly clean environment. Even if foreign matter is mixed between the resin layer and the thin glass substrate, the flatness of the surface of the thin glass substrate is not affected by the deformation of the resin layer, but the higher the cleanliness, the better the flatness, so the cleanliness is high. It is better.

以此方式獲得積層有薄板玻璃基板、樹脂層及支持玻璃基板之玻璃積層體(以下，亦稱為「薄板玻璃積層體」)之後，於該薄板玻璃積層體中之薄板玻璃基板之第2主面上形成顯示裝置用構件。In this way, a glass laminate (hereinafter also referred to as a "thin glass laminate") in which a thin glass substrate, a resin layer, and a support glass substrate are laminated is obtained, and then the second main sheet of the thin glass substrate in the thin glass laminate is obtained. A member for a display device is formed on the surface.

當形成顯示裝置用構件時，視需要亦宜對薄板玻璃基板之第2主面進行研磨以提高其平坦度。When forming a member for a display device, it is also desirable to polish the second main surface of the thin glass substrate as needed to improve the flatness thereof.

顯示裝置用構件並無特別限定。例如可列舉含有LCD之陣列或彩色濾光片。又，例如可列舉：含有OLED之透明電極、電洞注入層、電洞傳輸層、發光層、電子傳輸層。The member for the display device is not particularly limited. For example, an array containing an LCD or a color filter can be cited. Further, for example, a transparent electrode including an OLED, a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are mentioned.

對本發明之附支持體之面板之製造方法中的顯示裝置用構件形成步驟進行說明。The member forming step for the display device in the method of manufacturing the panel with the support of the present invention will be described.

顯示裝置用構件形成步驟係於上述薄板玻璃積層體之上述薄板玻璃基板之第2主面上形成顯示裝置用構件的步驟。The member forming step for the display device is a step of forming a member for a display device on the second main surface of the thin glass substrate of the thin plate glass laminate.

於上述薄板玻璃積層體之上述薄板玻璃基板之第2主面上形成上述顯示裝置用構件之方法並無特別限定，可與先前公知之方法相同。The method for forming the member for a display device on the second main surface of the thin glass substrate of the thin plate glass laminate is not particularly limited, and may be the same as the conventionally known method.

例如，在製造LCD作為顯示裝置時，可與先前公知之於玻璃基板上形成陣列之步驟、形成彩色濾光片之步驟、經由密封劑而使形成有陣列之玻璃基板與形成有彩色濾光片之玻璃基板黏合之步驟(陣列‧彩色濾光片黏合步驟)等的各種步驟相同。更具體而言，作為該等步驟中實施之處理，例如可列舉：純水清洗、乾燥、成膜、抗蝕劑塗佈、曝光、顯影、蝕刻及抗蝕劑去除。進而，作為在實施陣列‧彩色濾光片黏合步驟後所要進行之步驟，有液晶注入步驟、及實施該處理後進行之注入口之密封步驟，可列舉該等步驟中實施之處理。For example, when manufacturing an LCD as a display device, a step of forming an array on a glass substrate, a step of forming a color filter, a glass substrate on which an array is formed, and a color filter are formed via a sealant. The steps of the step of bonding the glass substrate (array ‧ color filter bonding step) are the same. More specifically, examples of the treatment carried out in the steps include pure water washing, drying, film formation, resist coating, exposure, development, etching, and resist removal. Further, as a step to be performed after the step of performing the array ‧ color filter bonding, there are a liquid crystal injection step and a sealing step of the injection port performed after the treatment, and the processes performed in the steps may be mentioned.

又，以製造OLED之情形為，作為用以於薄板玻璃基板之第2主面上形成有機EL結構體之步驟，其包括：形成透明電極之步驟、蒸鍍電洞注入層‧電洞傳輸層‧發光層‧電子傳輸層等之步驟、及密封步驟等的各種步驟，作為該等步驟中所實施之處理，具體而言例如可列舉：成膜處理、蒸鍍處理、密封板之接著處理等。Further, in the case of manufacturing an OLED, the step of forming an organic EL structure on the second main surface of the thin glass substrate includes the steps of forming a transparent electrode, the vapor deposition hole injection layer, and the hole transport layer. ‧ various steps of the steps of the light-emitting layer, the electron-transport layer, and the sealing step, and the like, as a process performed in the steps, specifically, for example, a film forming process, a vapor deposition process, a sealing process, and the like .

如此一來，可製造本發明之附支持體之面板。In this way, the panel of the support of the present invention can be manufactured.

其次，對本發明之面板製造方法進行說明。Next, the method of manufacturing the panel of the present invention will be described.

本發明之面板製造方法並無特別限定，但宜包括：剝離步驟，其係自上述附支持體之面板剝離包含上述支持玻璃基板及上述樹脂層之支持體；及去除步驟，其係去除附著於經該剝離步驟而獲得之顯示裝置用面板中之薄板玻璃基板第1主面的來源於上述樹脂層之轉印物等的異物。The method for producing a panel of the present invention is not particularly limited, but preferably includes a peeling step of peeling a support including the support glass substrate and the resin layer from the panel of the support; and a removing step of removing and adhering to the panel The foreign material derived from the transfer material of the resin layer on the first main surface of the thin glass substrate in the panel for a display device obtained by the peeling step.

對本發明之面板製造方法中之剝離步驟進行說明。The peeling step in the panel manufacturing method of the present invention will be described.

剝離步驟係自上述附支持體之顯示裝置用面板剝離包含上述支持玻璃基板及上述樹脂層之支持體的步驟。The peeling step is a step of peeling off the support including the support glass substrate and the resin layer from the panel for a display device with the support.

剝離方法只要係可不對薄板玻璃基板、形成於其第2主面上之顯示裝置用構件及密封劑造成熱、電磁、機械及化學性損傷地進行剝離之方法，則無特別限制。而且，較佳者為支持玻璃基板無損傷之方法，進而，更佳者為固定於支持玻璃基板之第1主面之具有剝離性的樹脂層無損傷之方法。The peeling method is not particularly limited as long as it can be peeled off without causing thermal, electromagnetic, mechanical or chemical damage to the thin glass substrate or the member for a display device formed on the second main surface thereof and the sealant. Further, a method of supporting the glass substrate without damage is preferable, and a method of fixing the resin layer having releasability to the first main surface of the supporting glass substrate without damage is more preferable.

作為具體的剝離方法，例如，可於薄板玻璃基板與樹脂層之界面中***鋒利的刃具狀物或噴射水與壓縮空氣之混合流體而進行剝離。較佳者為，以上述附支持體之面板之支持玻璃基板側為上側、顯示裝置用面板側為下側之方式設置於壓盤上，將顯示裝置用面板側基板真空吸附於壓盤上(於雙面積層有支持玻璃基板時，依序進行)，並於該狀態下對附支持體之面板之薄板玻璃基板與樹脂層之邊界噴射水與壓縮空氣之混合流體，朝垂直上方上拉支持玻璃基板之端部。如此一來，於上述邊界依序形成空氣層，該空氣層擴展至上述邊界之整個面，可容易地剝離支持體(於附支持體之面板之兩主面積層有支持玻璃基板時，逐一單面地反覆進行上述剝離步驟)。As a specific peeling method, for example, a sharp blade or a mixed fluid of sprayed water and compressed air may be inserted into the interface between the thin glass substrate and the resin layer to perform peeling. Preferably, the support glass substrate side of the panel with the support is provided on the upper side, and the display device panel side is provided on the pressure plate, and the panel side substrate for the display device is vacuum-adsorbed to the pressure plate ( When the double-layer layer has a supporting glass substrate, it is sequentially performed, and in this state, a mixed fluid of water and compressed air is sprayed on the boundary between the thin glass substrate and the resin layer of the panel with the support, and is pulled up vertically upward. The end of the glass substrate. In this way, an air layer is sequentially formed on the boundary, and the air layer is extended to the entire surface of the boundary, and the support can be easily peeled off (when the two main area layers of the panel with the support are supported by the glass substrate, one by one The above peeling step is repeated in the surface.

經上述剝離步驟所剝離之支持體可再利用。例如，當上述樹脂層為聚矽氧樹脂層之情形時，剝離後之支持體中之聚矽氧樹脂層越具有低聚矽氧轉移性，則越會有可抑制上述玻璃積層體由於經加熱步驟時之剝離強度上升而導致的剝離不良之傾向。因此，可更好地再利用。The support stripped by the above peeling step can be reused. For example, when the above resin layer is a polyoxyxylene resin layer, the more the polyoxynoxy resin layer in the support after peeling has the oligomeric oxime oxygen transfer property, the more the glass laminated body can be suppressed from being heated. The tendency of peeling failure due to an increase in peel strength at the time of the step. Therefore, it can be reused better.

對本發明之面板製造方法中之去除步驟進行說明。The removal step in the panel manufacturing method of the present invention will be described.

去除步驟係去除附著於上述顯示裝置用面板中之上述薄板玻璃基板之第1主面之異物的步驟。The removing step is a step of removing foreign matter adhering to the first main surface of the thin glass substrate in the panel for a display device.

如上所述，即便供上述剝離步驟後所獲得之顯示裝置用面板中之薄板玻璃基板之第1主面(與樹脂層密著之面)貼附偏光膜或相位差膜等附黏著劑之膜，亦有黏著強度較弱而會剝離之情形。本發明者對其原因進行研究後，認為其原因在於：源自樹脂層之轉印物、空氣中飛散之塵芥、及因製造步驟而導致之金屬片或機油等異物會極少地附著於該第1主面。並且，本發明者發現一種可不對薄板玻璃基板及形成於該薄板玻璃基板之第2主面的顯示裝置用構件等造成熱、電磁、機械及化學性損傷地去除上述異物之方法。As described above, even if the first main surface (the surface adhered to the resin layer) of the thin glass substrate in the panel for a display device obtained after the peeling step is attached, a film of an adhesive such as a polarizing film or a retardation film is attached. There are also cases where the adhesion strength is weak and peeling off. The inventors of the present invention have studied the cause of the problem, and the reason is that the transfer material derived from the resin layer, the dust mustard scattered in the air, and the foreign matter such as a metal piece or an oil due to the manufacturing process are rarely attached to the first 1 main face. In addition, the inventors of the present invention have found a method for removing the foreign matter without causing thermal, electromagnetic, mechanical, or chemical damage to the thin plate glass substrate and the member for the display device formed on the second main surface of the thin glass substrate.

如上所述，所謂異物，係指包含源自上述樹脂層之任何物質(即轉印物)、空氣中飛散之塵芥、及因製造步驟而導致之金屬片或機油等在內的除附著於薄板玻璃基板第1主面之薄板玻璃基板以外之物。作為上述轉印物，例如可列舉形成樹脂層之化合物，其係藉由與薄板玻璃基板之第1主面密著而附著於該第1主面者。又，例如可列舉形成樹脂層之物質之一部分、且於上述樹脂層之表面析出並存在之低分子化合物等。As described above, the term "foreign matter" means any substance (ie, a transfer material) derived from the above resin layer, dust mustard scattered in the air, and metal sheets or oil due to a manufacturing step, and the like, in addition to adhering to the sheet. A material other than the thin glass substrate of the first main surface of the glass substrate. The transfer product may, for example, be a compound that forms a resin layer, and adheres to the first main surface by adhering to the first main surface of the thin glass substrate. Further, for example, a low molecular compound in which a part of a substance forming a resin layer is formed and deposited on the surface of the resin layer is present.

對上述轉印物進行具體說明。例如，當樹脂層包含聚矽氧時，由於薄板玻璃基板之第1主面與固定於支持玻璃基板之第1主面的聚矽氧樹脂層之密著，故可認為較低分子量之聚矽氧化合物會藉由樹脂層內之擴散效應而附著於薄板玻璃基板之第1主面上。此處，當玻璃積層體經過加熱步驟時，使用溶解聚矽氧化合物所得之溶劑等而自薄板玻璃基板之第1主面去除聚矽氧化合物較為困難。另一方面，當基板並非為薄板玻璃基板而是包含聚醯亞胺等樹脂之基板(以下，亦稱為樹脂基板)時，在自支持體剝離樹脂基板後，可使用溶解聚矽氧化合物所得之溶劑等來去除附著於樹脂基板之第1主面的聚矽氧化合物。一般而言，偏光膜等中之黏著劑係使用丙烯酸系，並被調整為可獲得對親水性之玻璃基板表面之適度的黏著強度。相對於此，若斥水性之聚矽氧化合物附著於玻璃基板表面，則丙烯酸系黏著劑對玻璃基板表面之黏著強度將降低，二次加工(rework)性增加，另一方面，偏光板會藉由外力而剝離。The above transfer product will be specifically described. For example, when the resin layer contains polyfluorene oxide, since the first main surface of the thin glass substrate is adhered to the polyoxyn resin layer fixed to the first main surface of the supporting glass substrate, it is considered that the lower molecular weight polyfluorene The oxygen compound adheres to the first main surface of the thin glass substrate by the diffusion effect in the resin layer. Here, when the glass laminate is subjected to the heating step, it is difficult to remove the polyoxygen compound from the first main surface of the thin glass substrate by using a solvent or the like obtained by dissolving the polyoxo compound. On the other hand, when the substrate is not a thin glass substrate but a substrate containing a resin such as polyimide or the like (hereinafter also referred to as a resin substrate), after the resin substrate is peeled off from the support, the polyoxyxene compound can be used. The solvent or the like removes the polyfluorene oxide compound adhering to the first main surface of the resin substrate. In general, an adhesive in a polarizing film or the like is made of acrylic, and is adjusted so as to obtain an appropriate adhesive strength to the surface of the hydrophilic glass substrate. On the other hand, if the water-repellent polyoxymethylene compound adheres to the surface of the glass substrate, the adhesion strength of the acrylic adhesive to the surface of the glass substrate is lowered, and the rework property is increased. On the other hand, the polarizing plate is borrowed. Stripped by external force.

再者，作為決定偏光膜對玻璃基板表面之黏著強度之因素，除玻璃基板表面之親水性、即水接觸角以外，還可列舉膜之彈性、黏著劑之黏性等，本發明中，黏著強度係指利用將25 mm寬度之偏光膜、或者將附黏著劑之膜貼附於玻璃基板表面之後實施90°剝離之方法進行測定所取得之值。Further, as a factor for determining the adhesion strength of the polarizing film to the surface of the glass substrate, in addition to the hydrophilicity of the surface of the glass substrate, that is, the water contact angle, the elasticity of the film, the viscosity of the adhesive, and the like are also exemplified. The strength is a value obtained by measuring a polarizing film of 25 mm width or a method of attaching a film of an adhesive to a surface of a glass substrate and then performing 90° peeling.

附著於上述顯示裝置用面板等電子裝置中之上述薄板玻璃基板等基板之第1主面之上述異物的去除方法並無特別限定，但如上所述，即便根據樹脂層或基板之種類而使用溶劑，亦難以去除，宜使用將異物進行熱或化學性分解之方法。例如，當樹脂層為聚矽氧樹脂層，且基板為薄板玻璃基板時，可認為異物中聚矽氧化合物為主成分，可列舉：使附著於薄板玻璃基板之第1主面的聚矽氧化合物熱分解成二氧化矽、水及二氧化碳之方法；或使用酸或鹼來進行化學性分解之方法。另一方面，當樹脂層為聚矽氧樹脂層，且基板為樹脂基板時，除將附著於樹脂基板之聚矽氧化合物進行熱或化學性分解以外，亦可藉由溶劑之溶解而去除。The method of removing the foreign matter attached to the first main surface of the substrate such as the thin glass substrate in the electronic device such as the display device panel is not particularly limited. However, as described above, the solvent is used depending on the type of the resin layer or the substrate. It is also difficult to remove, and it is preferable to use a method of thermally or chemically decomposing foreign matter. For example, when the resin layer is a polyoxyxylene resin layer and the substrate is a thin glass substrate, it is considered that the polyoxo compound in the foreign matter is a main component, and the polyfluorene which adheres to the first main surface of the thin glass substrate is exemplified. A method of thermally decomposing a compound into ceria, water, and carbon dioxide; or a method of chemically decomposing using an acid or a base. On the other hand, when the resin layer is a polyoxynitride resin layer and the substrate is a resin substrate, the polyoxynitride adhered to the resin substrate may be thermally or chemically decomposed, and may be removed by dissolution of a solvent.

又，供去除步驟的顯示裝置用面板之態樣為：於薄板玻璃基板之第2主面上形成有陣列、有機EL元件或彩色濾光片等電子裝置用構件；或者利用密封劑而黏合二張薄板玻璃基板，進而於所黏合之二張薄板玻璃基板之間注入有液晶；因此於任一態樣中，皆可無損傷地去除上述異物。即，較好的是，去除步驟係可不對上述薄板玻璃基板、上述顯示裝置用構件及密封劑造成熱、電磁、機械及化學性損傷地去除上述異物之步驟。Further, in the panel for a display device to be removed, a member for an electronic device such as an array, an organic EL element, or a color filter is formed on the second main surface of the thin glass substrate; or a bonding agent is used to bond the second member. The thin glass substrate is further filled with liquid crystal between the two thin glass substrates to be bonded; therefore, in any of the aspects, the foreign matter can be removed without damage. That is, it is preferable that the removing step is a step of removing the foreign matter without causing thermal, electromagnetic, mechanical, or chemical damage to the thin glass substrate, the display device member, and the sealant.

又，較好的是，令密著上述樹脂層之前的上述薄板玻璃基板之第1主面之黏著強度為f0 ，且令上述去除步驟之後獲得之顯示裝置用面板中的上述薄板玻璃基板之第1主面之黏著強度為f時，f≧f0 。此黏著強度之關係藉由最恰當地進行剝離步驟及去除步驟中之處理而可實現。Moreover, it is preferable that the adhesion strength of the first main surface of the thin glass substrate before the resin layer is adhered is f 0 , and the thin glass substrate in the panel for a display device obtained after the removal step is used. When the adhesion strength of the first main surface is f, f ≧ f 0 . This relationship of adhesive strength can be achieved by performing the processing in the stripping step and the removing step most appropriately.

作為附著於上述薄板玻璃基板之第1主面之聚矽氧化合物等異物的去除方法，可列舉電漿照射處理作為較佳例。其中，尤以具備電場屏蔽之方式為佳，其係利用所謂的遠距電漿(Remote Plasma)法而不會對顯示裝置用面板造成熱或電磁性影響者。又，與電漿灰化法等需要高真空之方式相比，常壓遠距電漿法為宜，且能夠以較低成本去除異物，因而較佳。A method of removing foreign matter such as a polyoxygen oxide attached to the first main surface of the thin glass substrate is exemplified by a plasma irradiation treatment. Among them, a method in which an electric field shielding is particularly preferable is used, and a so-called remote plasma method is used without causing thermal or electromagnetic influence on a panel for a display device. Further, the atmospheric pressure remote plasma method is preferable to a method requiring a high vacuum such as a plasma ashing method, and it is preferable to remove foreign matter at a low cost.

藉由該種電漿照射處理，可使偏光板等附黏著劑之膜對該薄板玻璃基板之第1主面的黏著強度較與樹脂層密著之前為相同或更高(即，黏著強度f≧黏著強度f0 )，因而較佳。According to the plasma irradiation treatment, the adhesion of the film of the adhesive such as the polarizing plate to the first main surface of the thin glass substrate is the same as or higher than that before the resin layer is adhered (that is, the adhesion strength f). The adhesive strength f 0 ) is preferred.

對上述薄板玻璃基板之第1主面進行電漿照射之次數並無特別限定，只要該薄板玻璃基板之第1主面可獲得所需之黏著強度即可，可照射1次或複數次電漿。The number of times of plasma irradiation of the first main surface of the thin glass substrate is not particularly limited as long as the first main surface of the thin glass substrate can obtain a desired adhesive strength, and the plasma can be irradiated once or in multiple times. .

又，電漿照射時之上述薄板玻璃基板表面溫度宜為100℃以下。其理由為：不會導致顯示裝置用面板之密封劑或液晶等構件產生劣化或損傷等，可維持顯示性能。Further, the surface temperature of the above-mentioned thin glass substrate at the time of plasma irradiation is preferably 100 ° C or lower. The reason for this is that deterioration or damage of a member such as a sealant or a liquid crystal of a panel for a display device is not caused, and display performance can be maintained.

以下顯示常壓遠距電漿法之具體例。Specific examples of the atmospheric pressure remote plasma method are shown below.

使用圖7來說明可用以實施常壓遠距電漿法之裝置。A device that can be used to implement the atmospheric pressure remote plasma method will be described using FIG.

圖7係本發明之面板製造方法之去除步驟中可用以藉由遠距電漿法而去除上述異物之電漿放電裝置的模式性裝置圖。Fig. 7 is a schematic view of a plasma discharge device which can be used in the removal step of the panel manufacturing method of the present invention to remove the foreign matter by the remote plasma method.

於圖7中，電壓施加電極42與接地電極43係對向設置，且與基材對向之面分別由固體電介質46被覆。處理氣體沿箭頭方向被導入至由電壓施加電極42與接地電極43所形成之放電空間44，並被電漿化後，自電漿噴出口45向顯示裝置用面板50噴出。In FIG. 7, the voltage application electrode 42 and the ground electrode 43 are opposed to each other, and the surfaces facing the substrate are covered by the solid dielectric 46, respectively. The processing gas is introduced into the discharge space 44 formed by the voltage application electrode 42 and the ground electrode 43 in the direction of the arrow, and is plasma-formed, and then ejected from the plasma ejection port 45 to the display device panel 50.

此處，顯示裝置用面板50之搬送速度宜為0.1~5 m/min，較佳者為0.5~2 m/min，其中以1 m/min左右為佳。Here, the conveying speed of the display device panel 50 is preferably 0.1 to 5 m/min, preferably 0.5 to 2 m/min, and preferably about 1 m/min.

作為附著於上述顯示裝置用面板中之上述薄板玻璃基板之第1主面之聚矽氧化合物等異物的去除方法，宜使用含有酸或鹼之藥液而去除上述異物。自防止處理裝置腐蝕等保全之觀點而言，較佳者為使用含有鹼之藥液進行處理。又，於使用含有酸或鹼之藥液之處理中，由於接液之關係，浸槽清洗(vat soaking washing)比噴淋清洗更理想，藉由選定適切之濃度、溫度、處理時間，可尤其不對密封劑造成影響地去除聚矽氧化合物等異物。可例示如下方法：例如，使用已調整為30~70℃(較佳者為40~60℃)之10~30質量%(較佳者為15~25質量%)之含有酸或鹼之藥液進行1~20分鐘(較佳者為5~15分鐘)的處理。又，在將顯示裝置用面板浸漬於酸或鹼之藥液中時，最好不與顯示裝置用構件中之藥液接觸之構件宜適當地進行密封或遮蔽處理。例如，若顯示裝置用構件上有液晶注入孔，則藥液有可能進入至顯示裝置內，故適當地實施密封或遮蔽處理為宜。As a method of removing foreign matter such as a polyoxygen compound attached to the first main surface of the thin glass substrate in the panel for a display device, it is preferable to remove the foreign matter by using a chemical solution containing an acid or an alkali. From the viewpoint of preventing the corrosion of the treatment device and the like, it is preferred to carry out the treatment using a chemical solution containing a base. Moreover, in the treatment using a chemical solution containing an acid or a base, vat soaking washing is more desirable than spray cleaning due to the liquid contact relationship, and it is particularly preferable to select a suitable concentration, temperature, and treatment time. Foreign matter such as polyoxane is removed without affecting the sealant. The following method can be exemplified: for example, 10 to 30% by mass (preferably 15 to 25% by mass) of an acid or alkali-containing chemical solution adjusted to 30 to 70 ° C (preferably 40 to 60 ° C) is used. The treatment is carried out for 1 to 20 minutes (preferably 5 to 15 minutes). Further, when the panel for a display device is immersed in a chemical solution of an acid or an alkali, it is preferable that the member that does not come into contact with the chemical solution in the member for a display device is appropriately sealed or shielded. For example, if a liquid crystal injection hole is formed in the member for a display device, the chemical liquid may enter the display device, and it is preferable to appropriately perform sealing or shielding treatment.

作為附著於上述薄板玻璃基板之第1主面之聚矽氧化合物等異物的去除方法，在不會對上述薄板玻璃基板、上述顯示裝置用構件及密封劑造成熱、電磁、機械及化學性損傷之處理條件之範圍內，可列舉電暈放電、或火焰(即火焰處理)。The method of removing a foreign material such as a polyoxygen oxide attached to the first main surface of the thin glass substrate does not cause thermal, electromagnetic, mechanical, or chemical damage to the thin glass substrate, the display device member, and the sealant. Within the scope of the treatment conditions, corona discharge or flame (ie, flame treatment) may be mentioned.

作為上述處理條件，例如，電暈放電時或火焰處理時之上述薄板玻璃基板表面溫度宜為100℃以下。其理由為：不會導致顯示裝置用面板之密封劑或液晶等構件劣化或損傷等，可維持顯示性能。As the above processing conditions, for example, the surface temperature of the thin glass substrate at the time of corona discharge or flame treatment is preferably 100 ° C or lower. The reason for this is that the sealing performance of the panel for the display device or the member such as the liquid crystal is not deteriorated or damaged, and the display performance can be maintained.

作為附著於上述薄板玻璃基板之第1主面之聚矽氧化合物等異物的去除方法，在不對上述薄板玻璃基板、上述顯示裝置用構件及密封劑造成熱、電磁、機械或化學性損傷之處理條件之範圍內，宜使用含有sp(solubility parameter)值、即溶解度參數為7~15(單位：cal1/2 cm-3/2 )之溶劑之藥液來去除異物。若溶解度參數為7~15之範圍外，則液體與樹脂層之親和性較低，因此液體難以濡濕樹脂層。例如，宜使用含有甲醇、乙醇、丙醇、丙酮、二甲苯、己烷等之藥液去除上述異物。進而，自環境負載之觀點而言，宜使用醇系清洗液，例如使用含有甲醇、乙醇、丙醇等之清洗液。選定清洗液之適切之濃度、溫度、處理時間，藉此可尤其抑制對密封劑之損傷地去除附著於基板表面的聚矽氧化合物等異物。該等溶劑可單獨、或組合使用。又，關於將顯示裝置用面板與含有上述溶劑之藥液接液時，最好不與藥液相接觸之顯示裝置用構件宜適當地進行密封或遮蔽處理。例如，當顯示裝置用面板上有液晶注入孔時，有可能會使藥液自液晶注入孔進入至顯示裝置用面板內部，因此對液晶注入孔實施密封或遮蔽處理為宜。The method of removing a foreign material such as a polyoxo compound attached to the first main surface of the thin glass substrate does not cause thermal, electromagnetic, mechanical or chemical damage to the thin glass substrate, the display device member, or the sealant. Within the scope of the conditions, it is preferable to use a chemical solution containing a sp (solubility parameter) value, that is, a solvent having a solubility parameter of 7 to 15 (unit: cal 1/2 cm -3 / 2 ) to remove foreign matter. If the solubility parameter is in the range of 7 to 15, the affinity between the liquid and the resin layer is low, so that it is difficult for the liquid to wet the resin layer. For example, it is preferred to remove the foreign matter by using a chemical solution containing methanol, ethanol, propanol, acetone, xylene, hexane or the like. Further, from the viewpoint of environmental load, an alcohol-based cleaning liquid is preferably used, and for example, a cleaning liquid containing methanol, ethanol, or propanol is used. By selecting the appropriate concentration, temperature, and treatment time of the cleaning liquid, it is possible to particularly remove foreign matter such as a polyoxane adhered to the surface of the substrate by damage to the sealant. These solvents may be used singly or in combination. Further, when the panel for a display device is liquid-contacted with the chemical solution containing the solvent, it is preferable that the member for the display device that is not in contact with the drug solution is appropriately sealed or shielded. For example, when a liquid crystal injection hole is formed in the panel for a display device, the chemical liquid may enter the inside of the panel for a display device from the liquid crystal injection hole. Therefore, it is preferable to perform sealing or shielding treatment on the liquid crystal injection hole.

於本發明之面板製造方法中，包括2個以上的上述去除步驟。In the panel manufacturing method of the present invention, two or more of the above removal steps are included.

即，較好的是，複數次地實施單一種類之去除步驟而去除上述異物，或者將複數種類之去除步驟加以組合而去除上述異物。例如可列舉：將如上所述使用有電漿之方法與使用有酸等藥液之方法加以組合而去除上述異物。又，於去除步驟中，較好的是進而使用超音波振動而去除上述異物。That is, it is preferred to carry out the single type of removal step to remove the foreign matter, or to combine the plurality of types of removal steps to remove the foreign matter. For example, the above-mentioned foreign matter can be removed by combining the method using a plasma as described above and a method using a chemical solution such as an acid. Further, in the removing step, it is preferred to further remove the foreign matter by using ultrasonic vibration.

如此一來，於本發明之面板製造方法中，藉由進一步供所需之步驟而可獲得顯示裝置用面板。所謂所需之步驟，例如於LCD之情形時，可列舉如下步驟：將存在複數塊晶胞之大型晶胞分割為所需大小之晶胞；對上述分割後之晶胞注入液晶，其後密封注入口；對上述注入口密封後之晶胞貼附偏光板；及形成模組。又，例如於OLED之情形，除上述步驟以外，還可列舉如下步取：將形成有機EL結構體之薄板玻璃基板與對向基板進行組裝。再者，自不會因切割處理而導致薄板玻璃基板之強度下降、且亦不會產生玻璃屑(cullet)之觀點考慮，分割為所需大小之晶胞之步驟宜為利用雷射裁刀進行之切割。As a result, in the panel manufacturing method of the present invention, the panel for a display device can be obtained by further supplying the required steps. The steps required, for example, in the case of an LCD, may be exemplified by dividing a large unit cell having a plurality of unit cells into a unit cell of a desired size; injecting liquid crystal into the divided unit cell, and thereafter sealing Injection port; attaching a polarizing plate to the cell after the injection port is sealed; and forming a module. Further, for example, in the case of an OLED, in addition to the above steps, a step of assembling a thin glass substrate on which an organic EL structure is formed and a counter substrate may be mentioned. Further, since the strength of the thin glass substrate is not lowered by the dicing process, and the cullet is not generated, the step of dividing into a unit cell of a desired size is preferably performed by using a laser cutter. Cutting.

對本發明之面板製造方法之具體例進行說明。A specific example of the panel manufacturing method of the present invention will be described.

首先，說明本發明之面板製造方法中的本發明之附支持體之面板之製造方法。First, a method of manufacturing a panel with a support of the present invention in the panel manufacturing method of the present invention will be described.

首先，準備薄板玻璃基板及支持玻璃基板，清洗其等之表面。作為清洗，例如可列舉純水清洗、UV(ultraviolet，紫外線)清洗。First, a thin glass substrate and a supporting glass substrate are prepared, and the surface thereof is cleaned. Examples of the washing include pure water washing and UV (ultraviolet) washing.

其次，於支持玻璃基板之第1主面上形成樹脂層。例如，使用絲網印刷機於支持玻璃基板之第1主面上塗佈聚矽氧樹脂。然後進行加熱硬化，於支持玻璃基板之第1主面上形成樹脂層，獲得固定有樹脂層之支持玻璃基板。Next, a resin layer is formed on the first main surface of the supporting glass substrate. For example, a polyoxyxylene resin is applied to the first main surface of the supporting glass substrate using a screen printer. Then, heat curing is performed to form a resin layer on the first main surface of the supporting glass substrate, and a supporting glass substrate to which the resin layer is fixed is obtained.

接著，使樹脂層之剝離性表面與薄板玻璃基板之第1主面附著並黏合。例如，可於室溫下對樹脂層與薄板玻璃基板進行真空加壓而黏合。並且，可獲得作為支持玻璃基板、樹脂層及薄板玻璃基板之積層體的薄板玻璃積層體。Next, the peeling surface of the resin layer is adhered to and adhered to the first main surface of the thin glass substrate. For example, the resin layer and the thin glass substrate can be vacuum-bonded and bonded at room temperature. Further, a thin-plate glass laminate which is a laminate supporting the glass substrate, the resin layer, and the thin glass substrate can be obtained.

接下來，視需要，可研磨亦可清洗薄板玻璃積層體中之薄板玻璃基板之第2主面。作為清洗，例如可列舉純水清洗、UV清洗。Next, if necessary, the second main surface of the thin glass substrate in the thin glass laminate can be polished. Examples of the washing include pure water washing and UV washing.

利用上述方法而製造2個薄板玻璃積層體後，於各薄板玻璃積層體中的薄板玻璃基板之第2主面上形成顯示裝置用構件。其中1個薄板玻璃積層體係供公知之彩色濾光片形成步驟，藉此而於該薄板玻璃基板之第2主面形成彩色濾光片。又，另1個薄板玻璃積層體係供公知之陣列形成步驟，藉此而於該薄板玻璃基板之第2主面形成陣列。After the two thin plate glass laminates are produced by the above method, members for the display device are formed on the second main surface of the thin glass substrate in each of the thin glass laminates. One of the thin glass laminated systems is provided with a known color filter forming step, whereby a color filter is formed on the second main surface of the thin glass substrate. Further, another thin plate glass laminate system is provided with a known array forming step, whereby an array is formed on the second main surface of the thin glass substrate.

以上述方法可製造2個本發明之附支持體之面板。Two panels of the support of the present invention can be produced by the above method.

再者，以下，亦將此處獲得的含有彩色濾光片之本發明之附支持體之面板稱為「附支持體之面板x」，且將含有陣列之本發明之附支持體之面板稱為「附支持體之面板y」。In addition, hereinafter, the panel with the support of the present invention containing the color filter obtained herein is also referred to as "the panel x with the support", and the panel with the support of the present invention containing the array is called It is "the panel y with the support".

於本發明之面板製造方法中，例如利用以下所示之實例1~實例4之方法進一步處理以上所製造之附支持體之面板x、及附支持體之面板y，製造出顯示裝置用面板。In the panel manufacturing method of the present invention, for example, the panel x with the support and the panel y with the support described above are further processed by the methods of Examples 1 to 4 shown below to produce a panel for a display device.

(實例1)(Example 1)

於實例1中，以上述方式，使附支持體之面板x及附支持體之面板y各自中的彩色濾光片形成面與陣列形成面對向，並使用晶胞形成用紫外線硬化型密封劑等密封劑進行黏合。以下，將此處獲得的本發明之附支持體之面板亦稱為「附支持體之面板z1」。附支持體之面板z1係尚未被液晶填充之狀態者，為所謂之空晶胞狀態。In the first embodiment, the color filter forming surface in each of the panel x of the support and the panel y with the support is formed to face the array, and the ultraviolet curing type sealant for forming a cell is used. The sealant is bonded. Hereinafter, the panel of the support of the present invention obtained herein is also referred to as "the panel z1 with a support". The panel z1 with the support is not in the state of being filled with the liquid crystal, and is a so-called empty cell state.

其次，在利用藥液實施去除步驟時，暫時密封附支持體之面板z1之液晶注入孔。例如，亦可使用紫外線硬化型密封劑等來進一步密封該注入口之外側。Next, when the removal step is performed by the chemical solution, the liquid crystal injection hole of the panel z1 of the support is temporarily sealed. For example, an ultraviolet curable sealant or the like may be used to further seal the outer side of the injection port.

然後，將密封後之附支持體之面板z1之2個支持體供上述本發明之面板製造方法中的剝離步驟進行剝離。並且，供本發明之面板製造方法中的去除步驟。以下，將如此獲得之面板亦稱為「面板w1」。剝離後之2個支持體可於其他的支持體付面板之製造中再利用。Then, the two supports of the panel z1 with the support after sealing are peeled off by the peeling step in the panel manufacturing method of the present invention described above. Further, it is a removal step in the panel manufacturing method of the present invention. Hereinafter, the panel thus obtained is also referred to as "panel w1". The two supports after peeling can be reused in the manufacture of other support panels.

其次，去除面板w1之液晶注入孔之暫時密封後，將該面板w1切割為各別晶胞。Next, after the temporary sealing of the liquid crystal injection hole of the panel w1 is removed, the panel w1 is cut into individual cells.

其次，自上述注入孔對切割後之各別晶胞注入液晶，其後，密封該注入孔而形成液晶晶胞。Next, liquid crystals are injected into the respective unit cells after the dicing from the injection holes, and thereafter, the injection holes are sealed to form a liquid crystal cell.

然後，進而於上述液晶晶胞上貼附偏光板，形成背光等，由此可獲得LCD1。Then, a polarizing plate is attached to the liquid crystal cell to form a backlight or the like, whereby the LCD 1 can be obtained.

再者，該實例中的本發明之面板製造方法中之去除步驟，可在自附支持體之面板剝離支持體後、或者切割為各別晶胞而形成液晶晶胞後之任一情況下進行。其中，於支持體剝離後之藥液處理時，為了防止藥液向空晶胞內滲透，較理想的是對上述注入孔實施暫時密封。Furthermore, the removal step in the panel manufacturing method of the present invention in this example may be performed after the support of the panel of the self-supporting body is peeled off, or after cutting into individual cells to form a liquid crystal cell. . Among them, in order to prevent the chemical solution from penetrating into the empty cell during the chemical treatment after the support is peeled off, it is preferable to temporarily seal the injection hole.

(實例2)(Example 2)

於實例2中，使用先前已知之液晶滴下式注入法(ODF，One Drop Filling)而製造液晶晶胞。使液晶垂滴至附支持體之面板x及附支持體之面板y各自中的彩色濾光片形成面與陣列形成面中之任一方，且使另一方之形成面與垂滴有該液晶之形成面對向，並使用晶胞形成用紫外線硬化型密封劑等密封劑進行黏合。以下，將此處獲得之本發明之附支持體之面板亦稱為「附支持體之面板z2」。In Example 2, a liquid crystal cell was fabricated using a previously known liquid drop dropping method (ODF, One Drop Filling). Dropping the liquid crystal to one of the color filter forming surface and the array forming surface of each of the panel x of the support and the panel y with the support, and forming the liquid crystal by the other forming surface and the dripping droplet The surface is formed to face and is bonded using a sealing agent such as an ultraviolet curable sealant for forming a unit cell. Hereinafter, the panel of the attached support of the present invention obtained herein is also referred to as "the panel z2 with a support".

其次，將附支持體之面板z2之2個支持體供上述本發明之面板製造方法中的剝離步驟進行剝離。並且，供本發明之面板製造方法中的去除步驟。以下，將如此獲得之面板亦稱為「面板w2」。剝離後之2個支持體可於其他的支持體付面板之製造中再利用。Next, the two supports of the panel z2 with the support are peeled off by the peeling step in the panel manufacturing method of the present invention described above. Further, it is a removal step in the panel manufacturing method of the present invention. Hereinafter, the panel thus obtained is also referred to as "panel w2". The two supports after peeling can be reused in the manufacture of other support panels.

其次，將面板w2切割為各別晶胞。Next, the panel w2 is cut into individual cells.

然後，進而於切割為各別晶胞之面板w2上貼附偏光板，形成背光等，由此可獲得LCD2。Then, a polarizing plate is attached to the panel w2 cut into individual cells to form a backlight or the like, whereby the LCD 2 can be obtained.

再者，該實例中的本發明之去除步驟可在剝離支持玻璃基板後、或者切割為各別晶胞而形成液晶晶胞後之任一情況下進行。其中，於支持體剝離後之藥液處理時，為了防止藥液向空晶胞內滲透，較理想的是對上述注入孔實施暫時密封。Furthermore, the removal step of the present invention in this example can be carried out either after peeling off the supporting glass substrate or after cutting into individual cells to form a liquid crystal cell. Among them, in order to prevent the chemical solution from penetrating into the empty cell during the chemical treatment after the support is peeled off, it is preferable to temporarily seal the injection hole.

(實例3)(Example 3)

於實例3中，使用ODF製造液晶晶胞。使液晶垂滴至附支持體之面板x及附支持體之面板y各自中的彩色濾光片形成面與陣列形成面中之任一方，使另一方之形成面與垂滴有該液晶之形成面對向，並使用晶胞形成用紫外線硬化型密封劑等密封劑進行黏合。然後，上述黏合後之附支持體之面板x及附支持體之面板y係與支持體一併被切割為各別晶胞。以下，將此處經切割而獲得之本發明之附支持體之面板亦稱為「附支持體之面板z3」。In Example 3, a liquid crystal cell was fabricated using ODF. The liquid crystal is dripped onto one of the color filter forming surface and the array forming surface of each of the panel x of the support and the panel y with the support, so that the other forming surface and the drip are formed by the liquid crystal. The surface is oriented and bonded using a sealing agent such as an ultraviolet curable sealant. Then, the panel x of the attached support and the panel y with the support are cut into individual cells together with the support. Hereinafter, the panel of the support of the present invention obtained by cutting here is also referred to as "the panel z3 with a support".

接下來，將附支持體之面板z3之2個支持體供上述本發明之面板製造方法中的剝離步驟進行剝離。並且，供本發明之面板製造方法中的去除步驟。以下，將如此獲得之面板亦稱為「面板w3」。Next, the two supports of the panel z3 with the support are peeled off by the peeling step in the panel manufacturing method of the present invention described above. Further, it is a removal step in the panel manufacturing method of the present invention. Hereinafter, the panel thus obtained is also referred to as "panel w3".

然後，於面板w3貼附偏光板，形成背光等，由此可獲得LCD3。Then, a polarizing plate is attached to the panel w3 to form a backlight or the like, whereby the LCD 3 can be obtained.

(實例4)(Example 4)

於實例4中，以上述方式，使附支持體之面板x及附支持體之面板y各自中的彩色濾光片形成面與陣列形成面對向，並使用晶胞形成用紫外線硬化型密封劑等密封劑進行黏合。然後，與支持體一併被切割為各別晶胞。以下，將此處經切割而獲得之本發明之附支持體之面板亦稱為「附支持體之面板z4」。附支持體之面板z4係尚未被液晶填充之狀態者，為所謂之空晶胞狀態。In the above-described manner, in the above manner, the color filter forming surface in each of the panel x of the support and the panel y with the support is formed to face the array, and the ultraviolet curing type sealant for forming a cell is used. The sealant is bonded. Then, it is cut into individual cells together with the support. Hereinafter, the panel of the support of the present invention obtained by cutting here is also referred to as "the panel z4 with a support". The panel z4 with the support is not in the state of being filled with the liquid crystal, and is a so-called empty cell state.

其次，在利用藥液實施去除步驟時，暫時密封附支持體之面板z4之液晶注入孔。Next, when the removal step is performed by the chemical solution, the liquid crystal injection hole of the panel z4 of the support is temporarily sealed.

然後，將附支持體之面板z4之2個支持體供上述本發明之面板製造方法中的剝離步驟進行剝離。並且，供本發明之面板製造方法中的去除步驟。以下，將如此獲得之面板亦稱為「面板w4」。Then, the two supports of the panel z4 with the support are peeled off by the peeling step in the panel manufacturing method of the present invention described above. Further, it is a removal step in the panel manufacturing method of the present invention. Hereinafter, the panel thus obtained is also referred to as "panel w4".

其次，去除面板w4之液晶注入孔之暫時密封後，對該面板w4之晶胞注入液晶，其後進行密封。Next, after the temporary sealing of the liquid crystal injection hole of the panel w4 is removed, the liquid crystal of the panel w4 is injected with liquid crystal, and then sealed.

然後，進而貼附偏光板，形成背光等，由此可獲得LCD4。Then, a polarizing plate is attached to form a backlight or the like, whereby the LCD 4 can be obtained.

其中，於支持體剝離後之藥液處理時，為了防止藥液向空晶胞內滲透，較理想的是對上述注入孔實施暫時密封。Among them, in order to prevent the chemical solution from penetrating into the empty cell during the chemical treatment after the support is peeled off, it is preferable to temporarily seal the injection hole.

根據本發明之面板製造方法，在薄板玻璃基板較大時，例如為730×920 mm時，亦可容易地剝離上述薄板玻璃基板。According to the panel manufacturing method of the present invention, when the thin glass substrate is large, for example, at 730 × 920 mm, the thin glass substrate can be easily peeled off.

其次，對本發明之顯示裝置之製造方法進行說明。Next, a method of manufacturing the display device of the present invention will be described.

本發明之顯示裝置之製造方法係包含本發明之面板製造方法者。The method of manufacturing the display device of the present invention includes the panel manufacturing method of the present invention.

於以本發明之面板製造方法獲得顯示裝置用面板後，將其進而供先前公知之步驟，藉此可獲得顯示裝置。After the panel for a display device is obtained by the panel manufacturing method of the present invention, it is further subjected to a previously known step, whereby a display device can be obtained.

本發明之顯示裝置之製造方法適合於行動電話或PDA(Personal Digital Assistant，個人數位助理)之類的手機終端所使用之小型顯示裝置之製造。顯示裝置主要為LCD或OLED，作為LCD，包括：TN(Twisted Nematic，扭轉向列)型、STN(Super Twisted Nematic，超扭轉向列)型、FE(Field Effect，場效應)型、TFT型、MIM(Metal Insulator Metal，金屬-絕緣體-金屬)型、IPS(In-Plane Switching，橫向電場切換)型、VA(Vertical Aligned，垂直配向)型等。基本上，本發明對於被動驅動型、主動驅動型之任一類型之顯示裝置亦可適用。The manufacturing method of the display device of the present invention is suitable for the manufacture of a small display device used in a mobile phone terminal such as a mobile phone or a PDA (Personal Digital Assistant). The display device is mainly LCD or OLED, and as the LCD, including: TN (Twisted Nematic) type, STN (Super Twisted Nematic) type, FE (Field Effect) type, TFT type, MIM (Metal Insulator Metal) type, IPS (In-Plane Switching) type, VA (Vertical Aligned) type, and the like. Basically, the present invention is also applicable to any type of display device of a passive drive type or an active drive type.

以上，作為本發明之電子裝置，以於基板之表面(第2主面)含有顯示裝置用構件之顯示裝置用面板為代表例進行了說明，但如上所述，本發明並不限定於此，當然亦可為：代替顯示裝置用構件而於基板之表面(第2主面)分別含有太陽電池用構件、薄膜二次電池用構件、及電子零件用電路等電子裝置用構件的太陽電池、薄膜二次電池、及電子零件等的電子裝置。As described above, the electronic device of the present invention has been described as a representative example of a display device panel including a member for a display device on the surface (second main surface) of the substrate. However, as described above, the present invention is not limited thereto. In other words, the solar cell or the film of the electronic device member such as the solar cell member, the thin film secondary battery member, and the electronic component circuit may be contained on the surface (second main surface) of the substrate instead of the member for the display device. Electronic devices such as secondary batteries and electronic components.

例如，作為太陽電池用構件，矽型中可列舉：正極之氧化錫等透明電極、由p層/i層/n層所表示之矽層、及負極之金屬等，其他可列舉：與化合物型、色素增感型、量子點型等對應之各種構件等。For example, as a member for a solar cell, a transparent electrode such as tin oxide of a positive electrode, a tantalum layer represented by a p layer/i layer/n layer, and a metal of a negative electrode may be mentioned, and other examples include a compound type. Various components such as dye-sensitized type and quantum dot type.

又，作為薄膜二次電池用構件，鋰離子型中可列舉：正極及負極之金屬或金屬氧化物等透明電極、電解質層之鋰化合物、集電層之金屬、作為密封層之樹脂等，其他可列舉：與氫化鎳型、聚合物型、陶瓷電解質型等對應之各種構件等。In addition, examples of the lithium ion type include a transparent electrode such as a metal or a metal oxide of a positive electrode and a negative electrode, a lithium compound of an electrolyte layer, a metal of a collector layer, a resin as a sealing layer, and the like. Examples thereof include various members corresponding to a nickel hydride type, a polymer type, a ceramic electrolyte type, and the like.

又，作為電子零件用電路，CCD(Charge Coupled Device，電荷耦合元件)或CMOS(Complementary Metal Oxide Semiconductor，互補金屬氧化物半導體)中可列舉：導電部之金屬、絕緣部之氧化矽或氮化矽等，其他可列舉：與壓力感測器‧加速度感測器等各種感測器或硬式印刷基板、軟式印刷基板、軟-硬式印刷基板等對應之各種構件等。Further, as a circuit for an electronic component, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) may be a metal of a conductive portion or a tantalum oxide or tantalum nitride of an insulating portion. Other examples include various types of sensors such as a pressure sensor, an acceleration sensor, and a hard printed circuit board, a flexible printed circuit board, and a soft-hard printed circuit board.

實施例Example (實施例1a)(Example 1a)

首先，對縱720 mm、橫600 mm、板厚0.4 mm、線膨脹係數38×10-7 /℃之支持玻璃基板(旭硝子股份有限公司製，AN100，無鹼玻璃)進行純水清洗、UV清洗，使其淨化。First, pure water cleaning and UV cleaning are performed on a supporting glass substrate (AN100, alkali-free glass, manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 -7 /°C. To make it clean.

其次，利用絲網印刷機，將無溶劑加成反應型剝離紙用聚矽氧(信越聚矽氧公司製，KNS-320A，黏度為0.40 Pa‧s，溶解參數(SP值)=7.3)100重量份與鉑系觸媒(信越聚矽氧公司製，CAT-PL-56)2重量份之混合物於支持玻璃基板之第1主面上塗佈成縱705 mm、橫595 mm大小之長方形(塗佈量為30 g/m2 )。Next, using a screen printing machine, a solvent-free addition reaction type release paper was used for polyfluorene (manufactured by Shin-Etsu Chemical Co., Ltd., KNS-320A, viscosity: 0.40 Pa‧s, dissolution parameter (SP value) = 7.3) 100 A mixture of 2 parts by weight of a platinum-based catalyst (CAT-PL-56, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied to a first main surface of the supporting glass substrate to have a rectangular shape of 705 mm in length and 595 mm in width. The coating amount was 30 g/m 2 ).

接著，使其在大氣中於180℃下加熱硬化30分鐘，於支持玻璃基板之第1主面形成厚度為20 μm之聚矽氧樹脂層。Then, it was heat-hardened at 180 ° C for 30 minutes in the air to form a polyoxyxylene resin layer having a thickness of 20 μm on the first main surface of the supporting glass substrate.

其次，對與縱720 mm、橫600 mm、板厚0.3 mm、線膨脹係數38×10-7 /℃之薄板玻璃基板(旭硝子股份有限公司製，AN100，無鹼玻璃)之聚矽氧樹脂層相接觸之側的面進行純水清洗、UV清洗，使其淨化後，於室溫下對聚矽氧樹脂層與薄板玻璃基板以真空加壓而黏合，從而獲得薄板玻璃積層體(以下，亦稱為「薄板玻璃積層體A1」)。Next, a polycrystalline epoxy resin layer of a thin glass substrate (AN100, alkali-free glass, manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 -7 /°C The surface on the side in contact with the surface is cleaned by pure water and UV-cleaned, and after purification, the polyoxynoxy resin layer and the thin glass substrate are bonded by vacuum pressure at room temperature to obtain a thin-plate glass laminate (hereinafter, also It is called "thin-glass laminated body A1").

再者，樹脂層之形成及薄板玻璃基板之積層係以於薄板玻璃積層體A1之端部形成有深度為15 mm之間隙部之方式而進行。Further, the formation of the resin layer and the lamination of the thin glass substrate were carried out so that the end portion of the thin glass-clad laminate A1 was formed with a gap portion having a depth of 15 mm.

於所獲得之薄板玻璃積層體A1中，兩玻璃基板係與聚矽氧樹脂層不產生氣泡地密著，亦無變形狀缺陷，平滑性亦良好。In the obtained thin plate glass laminate A1, the two glass substrates and the polyoxymethylene resin layer were not adhered to each other, and there was no shape defect, and the smoothness was also good.

其次，使薄板玻璃積層體A1在大氣中於250℃下進行2小時加熱處理。可確認：薄板玻璃積層體A1之樹脂層不會因熱而導致劣化，耐熱性良好。Next, the thin plate glass laminate A1 was subjected to heat treatment at 250 ° C for 2 hours in the atmosphere. It was confirmed that the resin layer of the thin plate glass laminate A1 was not deteriorated by heat, and the heat resistance was good.

接下來，將薄板玻璃積層體A1中之薄板玻璃基板之第2主面固定於固定台上。又，以吸附墊吸附支持玻璃基板之第2主面。然後，向薄板玻璃積層體A1所具有之4個角部中之1個中、且薄板玻璃基板與樹脂層之界面中，***厚度為0.4 mm之小刀稍加剝離，繼而使吸附墊向遠離固定台之方向移動，從而剝離薄板玻璃基板與支持體(含有樹脂層之支持玻璃基板)。剝離所得之薄板玻璃基板亦稱為「薄板玻璃基板a1」。Next, the second main surface of the thin glass substrate in the thin plate glass laminate A1 is fixed to the fixing table. Further, the second main surface of the supporting glass substrate is adsorbed by the adsorption pad. Then, in one of the four corner portions of the thin plate glass laminate A1, and at the interface between the thin glass substrate and the resin layer, a knives having a thickness of 0.4 mm is inserted and slightly peeled off, and then the adsorption pad is fixed away from the hole. The direction of the stage is moved to peel off the thin glass substrate and the support (support glass substrate containing the resin layer). The thin glass substrate obtained by the peeling is also referred to as "thin glass substrate a1".

接下來，於薄板玻璃基板a1中之第1主面(密著有樹脂層之面)上貼附偏光膜(日東電工公司製，丙烯酸系黏著劑)。然後，測定該偏光膜之黏著強度。測定方法為：將25 mm寬之偏光膜、或附黏著劑之膜貼附於玻璃基板表面之後，對膜端部進行90°剝離。其結果，黏著強度為0.20 N/25 mm。Next, a polarizing film (acrylic adhesive made by Nitto Denko Corporation) was attached to the first main surface (the surface on which the resin layer was adhered) in the thin glass substrate a1. Then, the adhesion strength of the polarizing film was measured. The measurement method was such that a film of a polarizing film of 25 mm width or a film with an adhesive was attached to the surface of the glass substrate, and the film end portion was peeled off by 90°. As a result, the adhesion strength was 0.20 N/25 mm.

其次，暫時剝離偏光膜後，使用常壓遠距電漿裝置(積水化學公司製造)對薄板玻璃基板a1之第1主面照射電漿。此處，處理條件為：輸出為3 kw，氮氣與空氣流量之比=600 slm/750 sccm，搬送速度為1 m/min。電漿照射時之薄板玻璃基板a之表面溫度為50℃以下。Next, after the polarizing film was temporarily peeled off, the first main surface of the thin glass substrate a1 was irradiated with plasma using a normal pressure remote plasma device (manufactured by Sekisui Chemical Co., Ltd.). Here, the processing conditions are as follows: the output is 3 kw, the ratio of nitrogen to air flow = 600 slm / 750 sccm, and the transport speed is 1 m / min. The surface temperature of the thin glass substrate a at the time of plasma irradiation is 50 ° C or less.

其次，與照射電漿之前同樣地，對照射電漿後之薄板玻璃基板a1中之第1主面貼附偏光膜，並以相同方法測定偏光膜之黏著強度。Next, a polarizing film was attached to the first main surface of the thin glass substrate a1 after the plasma was irradiated, and the adhesion strength of the polarizing film was measured in the same manner as in the case of irradiating the plasma.

其結果為，90°剝離時之黏著強度為4.7 N/25 mm。又，利用光學顯微鏡觀察薄板玻璃基板a1之第1主面後，並未觀察到異物附著或破裂、缺損。As a result, the adhesion strength at 90° peeling was 4.7 N/25 mm. Further, after observing the first main surface of the thin glass substrate a1 with an optical microscope, no foreign matter adhered, cracked, or damaged was observed.

再者，形成薄板玻璃積層體A1之前的薄板玻璃基板之第1主面中的黏著強度為3.9 N/25 mm。Further, the adhesion strength in the first main surface of the thin glass substrate before the formation of the thin glass laminate A1 was 3.9 N/25 mm.

(實施例1b)(Example 1b)

於支持玻璃基板之第1主面上，使用：在兩末端具有乙烯基之直鏈狀聚有機矽氧烷(荒川化學工業股份有限公司製，商品名「8500」)、在分子內具有氫矽烷基之甲基氫化聚矽氧烷(荒川化學工業股份有限公司製，商品名「12031」)、及鉑系觸媒(荒川化學工業股份有限公司製，商品名「CAT12070」)之混合物，除此之外，以與實施例1a相同之方法獲得薄型玻璃積層體(以下，亦稱為「薄板玻璃積層體A2」)後，於大氣中進行加熱處理。On the first main surface of the supporting glass substrate, a linear polyorganosiloxane having a vinyl group at both ends (manufactured by Arakawa Chemical Co., Ltd., trade name "8500") is used, and hydroquinone is contained in the molecule. A mixture of a methyl hydrogenated polyoxane (manufactured by Arakawa Chemical Industries Co., Ltd., trade name "12031") and a platinum-based catalyst (manufactured by Arakawa Chemical Industries, Ltd., trade name "CAT12070") In addition, a thin glass laminate (hereinafter also referred to as "thin glass laminate A2") was obtained in the same manner as in Example 1a, and then heat-treated in the air.

其次，以與實施例1a相同之方法，剝離薄板玻璃基板與支持體(含有樹脂層之支持玻璃基板)。剝離後所得之薄板玻璃基板亦稱為「薄板玻璃基板a2」。Next, the thin glass substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example 1a. The thin glass substrate obtained after the peeling is also referred to as "thin glass substrate a2".

其次，以與實施例1a相同之方法測定薄板玻璃基板a2之第1主面中之偏光膜的黏著強度，其結果為0.60 N/25 mm。Next, the adhesion strength of the polarizing film in the first main surface of the thin glass substrate a2 was measured in the same manner as in Example 1a, and as a result, it was 0.60 N/25 mm.

其次，暫時剝離偏光膜，使該薄型玻璃基板a2於50℃下於已稀釋成20重量%之抗蝕劑剝離液(Parker Corporation公司製，含有作為主成分之氫氧化鉀20質量%)中浸漬10分鐘，進行水洗及送風。Then, the polarizing film was temporarily peeled off, and the thin glass substrate a2 was immersed in a 20% by weight of a resist stripper (manufactured by Parker Corporation, containing 20% by mass of potassium hydroxide as a main component) at 50 °C. 10 minutes, wash and air supply.

其次，測定該薄板玻璃基板a2之第1主面中之偏光膜的黏著強度，其結果為4.5 N/25 mm。Next, the adhesion strength of the polarizing film in the first main surface of the thin glass substrate a2 was measured, and as a result, it was 4.5 N/25 mm.

(實施例1c)(Example 1c)

以與實施例1b相同之方法獲得薄型玻璃積層體(以下，亦稱為「薄板玻璃積層體A3」)後，於大氣中進行加熱處理。A thin glass laminate (hereinafter also referred to as "thin glass laminate A3") was obtained in the same manner as in Example 1b, and then heat-treated in the air.

其次，以與實施例1b相同之方法，剝離薄板玻璃基板與支持體(含有樹脂層之支持玻璃基板)。剝離後所得之薄板玻璃基板亦稱為「薄板玻璃基板a3」。Next, the thin glass substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example 1b. The thin glass substrate obtained after the peeling is also referred to as "thin glass substrate a3".

然後，將該薄板玻璃基板a3浸漬於抗蝕劑剝離液中。此處，剝離液之溫度為50℃，浸漬5分鐘。又，使用設置於液槽內之超音波振動板，對薄板玻璃基板a3施加超音波振動。Then, the thin glass substrate a3 is immersed in a resist stripper. Here, the temperature of the peeling liquid was 50 ° C, and it was immersed for 5 minutes. Further, ultrasonic vibration is applied to the thin glass substrate a3 by using an ultrasonic vibration plate provided in the liquid tank.

然後，測定該薄板玻璃基板a3之第1主面中之偏光膜之黏著強度，其結果為4.0 N/25 mm。Then, the adhesion strength of the polarizing film in the first main surface of the thin glass substrate a3 was measured, and as a result, it was 4.0 N/25 mm.

(實施例1d)(Example 1d)

以與實施例1b相同之方法獲得薄型玻璃積層體(以下，亦稱為「薄板玻璃積層體A4」)後，於大氣中進行加熱處理。A thin glass laminate (hereinafter also referred to as "thin glass laminate A4") was obtained in the same manner as in Example 1b, and then heat-treated in the air.

其次，以與實施例1b相同之方法，剝離薄板玻璃基板與支持體(含有樹脂層之支持玻璃基板)。剝離後所得之薄板玻璃基板亦稱為「薄板玻璃基板a4」。Next, the thin glass substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example 1b. The thin glass substrate obtained after the peeling is also referred to as "thin glass substrate a4".

其次，於薄板玻璃基板之表面溫度為100℃以下之條件下，利用火焰處理機(Arcotec公司製造)對該薄板玻璃基板a4之第1主面以氧氣燃燒器火焰之緣部10 m/min之掃描速度進行4次處理。Next, under the condition that the surface temperature of the thin glass substrate is 100 ° C or less, the first main surface of the thin glass substrate a4 is 10 m/min of the edge of the oxygen burner flame by a flame treatment machine (manufactured by Arcotec Co., Ltd.). The scanning speed was processed 4 times.

其次，測定該薄板玻璃基板a4之第1主面中之偏光膜之黏著強度，其結果為4.0 N/25 mm。Next, the adhesion strength of the polarizing film in the first main surface of the thin glass substrate a4 was measured, and as a result, it was 4.0 N/25 mm.

(實施例1e)(Example 1e)

於實施例1e中，將薄板玻璃基板變更為厚度0.05 mm之聚醯亞胺樹脂基板(東麗‧杜邦公司製，Kapton 200HV)，除此之外，以與實施例1a相同之方法獲得裝置用基板積層體(以下，亦稱為「裝置用基板積層體A5」)。聚醯亞胺樹脂基板之兩主面中，將與樹脂層之剝離性表面密著之面作為第1主面，將形成有電子裝置用構件之主面作為第2主面。以與實施例1a相同之方法對裝置用基板積層體A5之樹脂層之耐熱性進行評估後，可確認：不會因熱而導致劣化，耐熱性良好。In the same manner as in Example 1a, the apparatus was used in the same manner as in Example 1a except that the thin-plate glass substrate was changed to a polyimide substrate of 0.05 mm in thickness (Kapton 200HV, manufactured by Toray Industries, Inc.). The substrate laminate (hereinafter also referred to as "device substrate laminate A5"). In the two main faces of the polyimide film substrate, the surface which is adhered to the peeling surface of the resin layer is referred to as a first main surface, and the main surface on which the electronic device member is formed is referred to as a second main surface. When the heat resistance of the resin layer of the substrate laminate A5 for a device was evaluated in the same manner as in the example 1a, it was confirmed that the heat resistance was not deteriorated and the heat resistance was good.

其次，以與實施例1a相同之方法剝離聚醯亞胺樹脂基板與支持體(含有樹脂層之支持玻璃基板)。剝離後所得之聚醯亞胺樹脂基板亦稱為「聚醯亞胺樹脂基板a5」。Next, the polyimide film substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example 1a. The polyimide film substrate obtained after the peeling is also referred to as "polyimine resin substrate a5".

其次，以與實施例1a相同之方法，對聚醯亞胺樹脂基板a5之第1主面貼附偏光膜。然後，測定聚醯亞胺樹脂基板a5之第1主面中之偏光膜之黏著強度。偏光膜之黏著強度為0.50 N/25 mm。Next, a polarizing film was attached to the first main surface of the polyimide resin substrate a5 in the same manner as in Example 1a. Then, the adhesion strength of the polarizing film in the first main surface of the polyimide film substrate a5 was measured. The adhesion strength of the polarizing film is 0.50 N/25 mm.

然後，以與實施例1a相同之方法，使用常壓遠距電漿裝置，對聚醯亞胺樹脂基板a5之第1主面照射電漿，並貼附偏光膜。測定聚醯亞胺樹脂基板a5之第1主面中之偏光膜之黏著強度，其結果為3.0 N/25 mm。Then, in the same manner as in Example 1a, the first main surface of the polyimide resin substrate a5 was irradiated with a plasma using a normal pressure remote plasma device, and a polarizing film was attached thereto. The adhesion strength of the polarizing film in the first main surface of the polyimine resin substrate a5 was measured, and as a result, it was 3.0 N/25 mm.

再者，裝置用基板積層體A5形成前之聚醯亞胺樹脂基板之第1主面中的黏著強度為1.5 N/25 mm。Further, the adhesive strength in the first main surface of the polyimide substrate substrate before the formation of the substrate laminate A5 for the apparatus was 1.5 N/25 mm.

(實施例1f)(Example 1f)

於實施例1f中，將薄板玻璃基板變更為厚度0.1 mm之已實施鏡面處理之不鏽鋼(SUS304)基板，除此之外，以與實施例1a相同之方法獲得裝置用基板積層體(以下，亦稱為「裝置用基板積層體A6」)。不鏽鋼基板之兩主面中，將與樹脂層之剝離性表面密著之面作為第1主面，將形成電子裝置用構件之主面作為第2主面。以與實施例1a相同之方法對裝置用基板積層體A6之樹脂層之耐熱性進行評估後，可確認：不會因熱而導致劣化，耐熱性良好。In the same manner as in Example 1a, a substrate laminate for a device was obtained in the same manner as in Example 1a except that the thin-plate glass substrate was changed to a mirror-treated stainless steel (SUS304) substrate having a thickness of 0.1 mm. This is called "device substrate laminate A6"). In the main surfaces of the stainless steel substrate, the surface which is adhered to the peeling surface of the resin layer is referred to as a first main surface, and the main surface on which the electronic device member is formed is referred to as a second main surface. When the heat resistance of the resin layer of the substrate laminate A6 for a device was evaluated in the same manner as in the example 1a, it was confirmed that the heat resistance was not deteriorated and the heat resistance was good.

其次，以與實施例1a相同之方法剝離不鏽鋼基板與支持體(含有樹脂層之支持玻璃基板)。剝離後所得之不鏽鋼基板亦稱為「不鏽鋼基板a6」。Next, the stainless steel substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example 1a. The stainless steel substrate obtained after the peeling is also referred to as "stainless steel substrate a6".

其次，以與實施例1a相同之方法，對不鏽鋼基板a6之第1主面貼附偏光膜。然後，測定不鏽鋼基板a6之第1主面中之偏光膜之黏著強度。偏光膜之黏著強度為0.40 N/25 mm。Next, a polarizing film was attached to the first main surface of the stainless steel substrate a6 in the same manner as in Example 1a. Then, the adhesion strength of the polarizing film in the first main surface of the stainless steel substrate a6 was measured. The adhesion strength of the polarizing film was 0.40 N/25 mm.

接下來，以與實施例1a相同之方法，使用常壓遠距電漿裝置，對不鏽鋼基板a6之第1主面照射電漿，並貼附偏光膜。測定不鏽鋼基板a6之第1主面中之偏光膜之黏著強度，其結果為1.5 N/25 mm。Next, in the same manner as in Example 1a, the first main surface of the stainless steel substrate a6 was irradiated with a plasma using a normal pressure remote plasma device, and a polarizing film was attached thereto. The adhesion strength of the polarizing film in the first main surface of the stainless steel substrate a6 was measured, and as a result, it was 1.5 N/25 mm.

再者，裝置用基板積層體A6形成前之不鏽鋼基板之第1主面中之黏著強度為1.0 N/25 mm。Further, the adhesive strength in the first main surface of the stainless steel substrate before the formation of the substrate laminate A6 for the apparatus was 1.0 N/25 mm.

(實施例1g)(Example 1g)

首先，利用鹼性洗劑對縱350 mm、橫300 mm、板厚0.08 mm、線膨脹係數38×10-7 /℃之玻璃膜(旭硝子股份有限公司製，AN100，無鹼玻璃)進行清洗，使玻璃膜之表面淨化。進而，以γ-巰丙基三甲氧基矽烷之0.1%甲醇溶液對玻璃膜之表面進行噴霧，並於80℃下乾燥3分鐘。另一方面，對縱350 mm、橫300 mm、板厚0.05 mm之聚醯亞胺樹脂基板(東麗‧杜邦公司製，Kapton 200HV)之表面進行電漿處理。然後，將玻璃膜與聚醯亞胺樹脂基板疊合，使用加熱至320℃之加壓裝置而形成玻璃/樹脂積層基板。玻璃/樹脂積層基板之兩主面中，將與樹脂層之剝離性表面密著之聚醯亞胺樹脂基板側之主面作為第1主面，將對向之玻璃膜側之主面作為第2主面。First, the glass film (AN100, alkali-free glass, manufactured by Asahi Glass Co., Ltd.) having a length of 350 mm, a width of 300 mm, a thickness of 0.08 mm, and a coefficient of linear expansion of 38 × 10 -7 /°C is cleaned by using an alkaline detergent. The surface of the glass film is purified. Further, the surface of the glass film was sprayed with a 0.1% methanol solution of γ-mercaptopropyltrimethoxydecane, and dried at 80 ° C for 3 minutes. On the other hand, the surface of a polyimine resin substrate (Kapton 200HV manufactured by Toray DuPont Co., Ltd.) having a length of 350 mm, a width of 300 mm, and a thickness of 0.05 mm was subjected to plasma treatment. Then, the glass film and the polyimide film substrate were laminated, and a glass/resin laminated substrate was formed using a press device heated to 320 °C. In the main surfaces of the glass/resin laminated substrate, the main surface of the polyimide film substrate side which is adhered to the peeling surface of the resin layer is the first main surface, and the main surface of the glass film side facing the opposite side is used as the first surface. 2 main faces.

於實施例1g中，將薄板玻璃基板變更為上述玻璃/樹脂積層基板，除此之外，以與實施例1a相同之方法獲得裝置用基板積層體(以下，亦稱為「裝置用基板積層體A7」)。以與實施例1a相同之方法對裝置用基板積層體A7之樹脂層之耐熱性進行評估後，可確認：不會因熱而導致劣化，耐熱性良好。In the same manner as in Example 1a, a substrate laminate for a device was obtained in the same manner as in Example 1a, except that the glass substrate was replaced with the device substrate laminate (hereinafter also referred to as "device substrate laminate". A7"). When the heat resistance of the resin layer of the substrate laminate A7 for a device was evaluated in the same manner as in Example 1a, it was confirmed that the heat resistance was not deteriorated and the heat resistance was good.

其次，以與實施例1a相同之方法剝離玻璃/樹脂積層基板與支持體(含有樹脂層之支持玻璃基板)。剝離後所得之玻璃/樹脂積層基板亦稱為「玻璃/樹脂積層基板a7」。Next, the glass/resin laminate substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example 1a. The glass/resin laminated substrate obtained after the peeling is also referred to as "glass/resin laminated substrate a7".

其次，以與實施例1a相同之方法，對玻璃/樹脂積層基板a7之第1主面貼附偏光膜。然後，測定玻璃/樹脂積層基板a7之第1主面中之偏光膜之黏著強度。偏光膜之黏著強度為0.40 N/25 mm。Next, a polarizing film was attached to the first main surface of the glass/resin laminated substrate a7 in the same manner as in Example 1a. Then, the adhesion strength of the polarizing film in the first main surface of the glass/resin laminated substrate a7 was measured. The adhesion strength of the polarizing film was 0.40 N/25 mm.

其次，以與實施例1a相同之方法，使用常壓遠距電漿裝置，對玻璃/樹脂積層基板a7之第1主面照射電漿，並貼附偏光膜。測定玻璃/樹脂積層基板a7之第1主面中之偏光膜之黏著強度，其結果為3.0 N/25 mm。Next, in the same manner as in Example 1a, the first main surface of the glass/resin laminated substrate a7 was irradiated with a plasma using a normal pressure remote plasma device, and a polarizing film was attached thereto. The adhesion strength of the polarizing film in the first main surface of the glass/resin laminated substrate a7 was measured, and as a result, it was 3.0 N/25 mm.

再者，裝置用基板積層體A7形成前之玻璃/樹脂積層基板之第1主面中之黏著強度為1.5 N/25 mm。Further, the adhesive strength in the first main surface of the glass/resin laminate substrate before the formation of the substrate laminate A7 for the apparatus was 1.5 N/25 mm.

(實施例1h)(Example 1h)

於實施例1h中，以與實施例1e相同之方法獲得裝置用基板積層體A51。In the example 1h, the substrate laminate A51 for a device was obtained in the same manner as in the example 1e.

其次，以與實施例1e相同之方法剝離聚醯亞胺樹脂基板與支持體(含有樹脂層之支持玻璃基板)。Next, the polyimide film substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example 1e.

其次，以與實施例1a相同之方法，對裝置用基板積層體A51中的聚醯亞胺樹脂基板之第1主面貼附偏光膜。並且，測定聚醯亞胺樹脂基板之第1主面中之偏光膜之黏著強度。偏光膜之黏著強度為0.40 N/25 mm。Then, a polarizing film was attached to the first main surface of the polyimide substrate resin substrate in the device substrate laminate A51 in the same manner as in Example 1a. Then, the adhesion strength of the polarizing film in the first main surface of the polyimide film substrate was measured. The adhesion strength of the polarizing film was 0.40 N/25 mm.

其次，一邊對聚醯亞胺樹脂基板之第1主面噴射醇系清洗劑(Neocoal R7，Japan Alcohol Trading公司製)一邊進行刷洗。藉由送風而自聚醯亞胺樹脂基板之第1主面去除清洗劑後，以與實施例1a相同之方法貼附偏光膜。測定聚醯亞胺樹脂基板之第1主面中之偏光膜之黏著強度，其結果為2.8 N/25 mm。Next, the alcohol-based cleaning agent (Neocoal R7, manufactured by Japan Alcohol Trading Co., Ltd.) was sprayed on the first main surface of the polyimide film. After the cleaning agent was removed from the first main surface of the polyimide film substrate by air blowing, a polarizing film was attached in the same manner as in Example 1a. The adhesion strength of the polarizing film in the first main surface of the polyimide film was measured, and as a result, it was 2.8 N/25 mm.

(實施例2)(Example 2)

首先，對縱720 mm、橫600 mm、板厚0.6 mm、線膨脹係數38×10-7 /℃之支持玻璃基板(旭硝子股份有限公司製，AN100，無鹼玻璃)進行純水清洗、UV清洗，使其淨化。First, pure water cleaning and UV cleaning are performed on a supporting glass substrate (AN100, alkali-free glass, manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.6 mm, and a linear expansion coefficient of 38 × 10 -7 /°C. To make it clean.

其次，利用絲網印刷機，將在兩末端具有乙烯基之直鏈狀聚有機矽氧烷(荒川化學工業股份有限公司製，商品名「8500」)、在分子內具有氫矽烷基之甲基氫化聚矽氧烷(荒川化學工業股份有限公司製，商品名「12031」)、及鉑系觸媒(荒川化學工業股份有限公司製，商品名「CAT12070」)之混合物於支持玻璃基板之第1主面上塗佈成縱705 mm、橫595 mm之大小(塗佈量為20 g/m2 )。此處，調整直鏈狀聚有機矽氧烷與甲基氫化聚矽氧烷之混合比，以使氫矽烷基與乙烯基之莫耳比達到1/1。相對於直鏈狀聚有機矽氧烷與甲基氫化聚矽氧烷之總計100重量份，鉑系觸媒為5重量份。Next, a linear polyorganosiloxane having a vinyl group at both ends (manufactured by Arakawa Chemical Co., Ltd., trade name "8500") and a methyl group having a hydroalkylalkyl group in the molecule are used by a screen printing machine. A mixture of a hydrogenated polyoxyalkylene (product name "12031" manufactured by Arakawa Chemical Co., Ltd.) and a platinum-based catalyst (manufactured by Arakawa Chemical Industries, Ltd., trade name "CAT12070") is the first support glass substrate. The main surface was coated to a length of 705 mm and a width of 595 mm (coating amount was 20 g/m 2 ). Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogenated polyoxyalkylene was adjusted so that the molar ratio of the hydroquinone group to the vinyl group was 1/1. The platinum-based catalyst was 5 parts by weight based on 100 parts by weight of the total of the linear polyorganosiloxane and the methylhydrogenated polyoxyalkylene.

其次，使其在大氣中於180℃下加熱硬化30分鐘，於支持玻璃基板之第1主面形成厚度為20 μm之聚矽氧樹脂層。Next, it was heat-hardened at 180 ° C for 30 minutes in the atmosphere to form a polyoxyxylene resin layer having a thickness of 20 μm on the first main surface of the supporting glass substrate.

其次，對與縱720 mm、橫600 mm、厚度0.1 mm、線膨脹係數50×10-7 /℃之薄板玻璃基板(旭硝子股份有限公司製，AN100，無鹼玻璃)之聚矽氧樹脂層相接觸之側之面進行純水清洗、UV清洗而使其淨化後，於室溫下對聚矽氧樹脂層與薄板玻璃基板以真空加壓而黏合，從而獲得薄板玻璃積層體(以下亦稱為「薄板玻璃積層體B」)。Next, a polycrystalline epoxy resin layer of a thin glass substrate (AN100, alkali-free glass, manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.1 mm, and a linear expansion coefficient of 50 × 10 -7 /°C After the surface of the contact side is cleaned by pure water and cleaned by UV cleaning, the polysiloxane resin layer and the thin glass substrate are bonded by vacuum pressure at room temperature to obtain a thin-plate glass laminate (hereinafter also referred to as "Thin-glass laminated body B").

再者，樹脂層之形成及薄板玻璃基板之積層係以於薄板玻璃積層體B之端部形成有深度為15 mm之間隙部之方式而進行。Further, the formation of the resin layer and the lamination of the thin glass substrate are performed such that a gap portion having a depth of 15 mm is formed at the end portion of the thin plate glass laminate B.

於所獲得之薄板玻璃積層體B中，兩玻璃基板係與聚矽氧樹脂層不產生氣泡地密著，亦無變形狀缺陷，平滑性亦良好。In the obtained thin plate glass laminate B, the two glass substrates and the polyoxymethylene resin layer were not adhered to each other, and there was no shape defect, and the smoothness was also good.

其次，準備2個薄板玻璃積層體B。並且，於其中的一個薄板玻璃積層體B(稱為「薄板玻璃積層體B1」)之薄板玻璃基板之第2主面形成陣列。具體而言，絕緣層及非晶矽層係利用CVD(Chemical Vapor Deposition，化學氣相沈積)法而形成，電極層係利用濺鍍法而形成，且各自之圖案係利用光微影之方法而形成陣列。Next, two thin-plate glass laminates B are prepared. Further, an array is formed on the second main surface of the thin glass substrate of one of the thin glass laminated bodies B (referred to as "thin glass laminated body B1"). Specifically, the insulating layer and the amorphous germanium layer are formed by a CVD (Chemical Vapor Deposition) method, and the electrode layers are formed by a sputtering method, and the respective patterns are formed by photolithography. Form an array.

又，於其中的另一個薄板玻璃積層體B(稱為「薄板玻璃積層體B2」)之薄板玻璃基板之第2主面形成彩色濾光片。具體而言，黑色矩陣及RGB像素係利用塗佈及烘烤法而形成，電極層係利用濺鍍法而形成，且各自之圖案係利用光微影之方法而形成彩色濾光片。Further, a color filter is formed on the second main surface of the thin glass substrate of the other thin glass laminated body B (referred to as "thin glass laminated body B2"). Specifically, the black matrix and the RGB pixel are formed by a coating and baking method, and the electrode layers are formed by a sputtering method, and each of the patterns is formed by a method of photolithography to form a color filter.

然後，使薄板玻璃積層體B1中之陣列形成面與薄板玻璃積層體B2中之彩色濾光片形成面相對向，使用晶胞形成用紫外線硬化型密封劑進行黏合，從而獲得附支持體之顯示裝置用面板(以下，亦稱為「附支持體之面板C」)。Then, the array forming surface in the thin plate glass laminate B1 is opposed to the color filter forming surface in the thin glass laminated body B2, and bonded by the ultraviolet curing type sealing agent for cell formation, thereby obtaining the display of the support. A panel for a device (hereinafter also referred to as "panel C with a support").

其次，將作為附支持體之面板C中之薄板玻璃積層體B1之一部分的支持玻璃基板之第2主面固定於固定台上。又，以吸附墊吸附作為附支持體之面板C中之薄板玻璃積層體B2之一部分的支持玻璃基板之第2主面。並且，向附支持體之面板C所具有之4個角部中之1個中、且作為薄板玻璃積層體B2之一部分的薄板玻璃基板與樹脂層的界面中，***厚度為0.1 mm之小刀，將薄板玻璃基板與支持體(含有樹脂層之支持玻璃基板)稍加剝離，繼而使吸附墊向遠離固定台之方向移動，從而剝離薄板玻璃基板之第1主面與支持體。自附支持體之面板C剝離薄板玻璃積層體B2之支持體後所獲得者亦稱為「附支持體之面板Cx」。Next, the second main surface of the supporting glass substrate which is a part of the thin plate glass laminate B1 in the panel C with the support is fixed to the fixing table. Moreover, the second main surface of the supporting glass substrate which is a part of the thin glass laminated body B2 in the panel C which is a support is adsorbed by the adsorption pad. Further, a knife having a thickness of 0.1 mm is inserted into the interface between the thin glass substrate and the resin layer which is one of the four corner portions of the panel C of the support, and is a part of the thin glass laminate B2. The thin glass substrate and the support (support glass substrate containing the resin layer) are slightly peeled off, and then the adsorption pad is moved away from the fixing table to peel off the first main surface of the thin glass substrate and the support. The panel obtained by attaching the support panel C to the support of the thin-plate glass laminate B2 is also referred to as "the panel Cx with the support".

接下來，將作為附支持體之面板Cx中之薄板玻璃積層體B2之一部分的薄板玻璃基板之第1主面固定於固定台上。又，以吸附墊吸附作為附支持體之面板Cx中之薄板玻璃積層體B1之一部分的支持玻璃基板之第2主面。並且，向附支持體之面板Cx所具有之4個角部中之1個中、且作為薄板玻璃積層體B1之一部分的薄板玻璃基板與樹脂層之界面中，***厚度為0.1 mm之小刀，將薄板玻璃基板與支持體(含有樹脂層之支持玻璃基板)稍加剝離，繼而使吸附墊向遠離固定台之方向移動，從而剝離薄板玻璃基板與支持體。將此處所獲得者、即將自附支持體之面板C剝離2個支持體後所獲得者作為「面板C」。Next, the first main surface of the thin glass substrate which is one of the thin plate glass laminates B2 in the panel Cx with the support is fixed to the fixing table. Moreover, the second main surface of the supporting glass substrate which is a part of the thin plate glass laminate B1 in the panel Cx as a support is adsorbed by the adsorption pad. Further, a knife having a thickness of 0.1 mm is inserted into the interface between the thin glass substrate and the resin layer which is one of the four corner portions of the panel Cx of the support, and is a part of the thin glass laminate B1. The thin glass substrate and the support (support glass substrate containing the resin layer) are slightly peeled off, and then the adsorption pad is moved away from the fixing table to peel off the thin glass substrate and the support. The person obtained here, the panel C to which the support is to be attached is peeled off from the two supports, is referred to as "panel C".

其次，於面板C所具有之2個薄板玻璃基板各自之第1主面貼附偏光膜(日東電工公司製，丙烯酸系黏著劑)。然後，測定該偏光膜之黏著強度。測定方法係與實施例1a相同。其結果為，90°剝離時之黏著強度為0.78 N/25 mm及0.59 N/25 mm。Next, a polarizing film (acrylic adhesive made by Nitto Denko Corporation) was attached to the first main surface of each of the two thin glass substrates of the panel C. Then, the adhesion strength of the polarizing film was measured. The measurement method was the same as in Example 1a. As a result, the adhesion strength at 90° peeling was 0.78 N/25 mm and 0.59 N/25 mm.

其次，暫時剝離上述膜，切割面板C，獲得縱51 mm×橫38 mm之168個晶胞。並且，向各晶胞中注入液晶並密封注入孔，形成液晶晶胞。其後，使液晶晶胞於50℃下於已稀釋成20重量%之抗蝕劑剝離液(Parker Corporation公司製，含有作為主成分之氫氧化鉀20質量%)中浸漬10分鐘，進行水洗及送風。其後，將形成有液晶晶胞陣列之薄板玻璃基板之第1主面固定於固定台上，以吸附墊吸附形成有彩色濾光片之薄板玻璃基板之第1主面，向遠離固定台之方向以20 N/25 mm拉伸後，並無密封劑之剝離及晶胞之破壞。Next, the film was temporarily peeled off, and the panel C was cut to obtain 168 cells of a length of 51 mm × a width of 38 mm. Further, liquid crystal is injected into each unit cell and the injection hole is sealed to form a liquid crystal cell. Then, the liquid crystal cell was immersed in a 20% by weight of a resist stripper (manufactured by Parker Corporation, containing 20% by mass of potassium hydroxide as a main component) at 50 ° C for 10 minutes, and washed with water. Air supply. Thereafter, the first main surface of the thin glass substrate on which the liquid crystal cell array is formed is fixed to the fixed stage, and the first main surface of the thin glass substrate on which the color filter is formed is adsorbed by the adsorption pad, and is moved away from the fixed stage. After the direction was stretched at 20 N/25 mm, there was no peeling of the sealant and destruction of the unit cell.

其次，與浸漬於抗蝕劑剝離液之前相同，對浸漬於抗蝕劑剝離液之後的液晶晶胞中之薄板玻璃基板之第1主面貼附偏光膜，並以相同之方法測定偏光膜之黏著強度。其結果為，90°剝離時之黏著強度為4.4 N/25 mm。Then, a polarizing film is attached to the first main surface of the thin glass substrate in the liquid crystal cell immersed in the liquid crystal cell after the immersion in the resist stripping liquid, and the polarizing film is measured in the same manner. Adhesion strength. As a result, the adhesion strength at 90° peeling was 4.4 N/25 mm.

然後，實施模組形成步驟，可獲得LCD。如此獲得之LCD不會產生特性上之問題，即不會產生陣列性能或彩色濾光片之色度之劣化等。其結果可獲得上述LCD之對向之2個薄板玻璃基板各自之外表面之間的總厚度約為0.2 mm之液晶顯示裝置。Then, a module forming step is performed to obtain an LCD. The LCD thus obtained does not cause a problem in characteristics, that is, it does not cause deterioration in the performance of the array or the chromaticity of the color filter. As a result, a liquid crystal display device having a total thickness of about 0.2 mm between the outer surfaces of the two thin glass substrates opposed to the above LCD can be obtained.

(實施例3)(Example 3)

準備實施例2中已形成之薄板玻璃積層體B、及厚度為0.7 mm之無鹼玻璃基板(旭硝子股份有限公司製，AN100，無鹼玻璃)(將此處使用之薄板玻璃積層體B作為「薄板玻璃積層體B3」)。並且，以與實施例2相同之方法，於薄板玻璃積層體B3之薄板玻璃基板之第2主面形成彩色濾光片，於無鹼玻璃基板之一個主面形成陣列。The thin-plate glass laminate B which has been formed in the second embodiment and the alkali-free glass substrate (manufactured by Asahi Glass Co., Ltd., AN100, alkali-free glass) having a thickness of 0.7 mm are prepared (the thin-plate glass laminate B used herein is referred to as " Thin plate glass laminate B3"). Further, in the same manner as in the second embodiment, a color filter was formed on the second main surface of the thin glass substrate of the thin plate glass laminate B3, and an array was formed on one main surface of the alkali-free glass substrate.

並且，與實施例2之情形相同，使無鹼玻璃基板之陣列形成面與薄板玻璃積層體B3之彩色濾光片形成面相對向，填充液晶，使用晶胞形成用紫外線硬化型密封劑進行黏合，從而獲得附支持體之顯示裝置用面板(以下，亦稱為「附支持體之面板D」)。此處，將液晶注入孔密封。Further, in the same manner as in the case of the second embodiment, the array forming surface of the alkali-free glass substrate is opposed to the color filter forming surface of the thin glass-clad laminate B3, and the liquid crystal is filled and bonded using an ultraviolet curing type sealant for cell formation. In order to obtain a panel for a display device with a support (hereinafter also referred to as "panel D with a support"). Here, the liquid crystal injection hole is sealed.

其次，以與實施例2相同之方法，可剝離薄板玻璃積層體B3之支持體。將此處所獲得者、即將自附支持體之面板D剝離支持體後所獲得者作為「面板D」。Next, the support of the thin plate glass laminate B3 can be peeled off in the same manner as in the second embodiment. The person obtained here, the panel D to which the support is attached is peeled off from the support, is referred to as "panel D".

然後，以與實施例2相同之方法切割面板D而獲得168個晶胞後，形成液晶晶胞。Then, the panel D was cut in the same manner as in Example 2 to obtain 168 cells, and a liquid crystal cell was formed.

並且，將所獲得之液晶晶胞浸漬於與實施例2相同之抗蝕劑剝離液中。此處，剝離液之溫度為50℃，並浸漬5分鐘。又，使用設置於液槽內之超音波振動板，對液晶晶胞施加超音波振動。Further, the obtained liquid crystal cell was immersed in the same resist stripping liquid as in Example 2. Here, the temperature of the stripping solution was 50 ° C and immersed for 5 minutes. Further, ultrasonic vibration is applied to the liquid crystal cell by using an ultrasonic vibration plate provided in the liquid tank.

其次，對浸漬於抗蝕劑剝離液之後的液晶晶胞之薄板玻璃基板之第1主面貼附偏光膜，測定該偏光膜之黏著強度。所使用之偏光膜之種類及黏著強度之測定方法與實施例1同樣。其結果為，90°剝離時之黏著強度為4.3 N/25 mm。Next, a polarizing film was attached to the first main surface of the thin glass substrate of the liquid crystal cell immersed in the resist stripping solution, and the adhesion strength of the polarizing film was measured. The type of the polarizing film to be used and the method of measuring the adhesive strength were the same as in the first embodiment. As a result, the adhesion strength at the 90° peeling was 4.3 N/25 mm.

然後，實施模組形成步驟而可獲得LCD。如此獲得之LCD不會產生特性上之問題，即不會產生陣列性能或彩色濾光片之色度之劣化等。其結果可獲得上述LCD之對向之2個薄板玻璃基板各自之外表面之間的總厚度約為0.8 mm之液晶顯示裝置。Then, the module forming step is performed to obtain an LCD. The LCD thus obtained does not cause a problem in characteristics, that is, it does not cause deterioration in the performance of the array or the chromaticity of the color filter. As a result, a liquid crystal display device having a total thickness of about 0.8 mm between the outer surfaces of the two thin glass substrates opposed to the above LCD can be obtained.

(實施例4)(Example 4)

準備2個已於實施例2中形成之薄板玻璃積層體B。並且，以與實施例2相同之方法，於其中的一個薄板玻璃積層體B(稱為「薄板玻璃積層體B4」)之薄板玻璃基板之第2主面形成陣列。又，於另一個薄板玻璃積層體B(稱為「薄板玻璃積層體B5」)之薄板玻璃基板之第2主面形成有機EL結構體。具體而言，實施形成透明電極之步驟、形成輔助電極之步驟、蒸鍍電洞注入層‧電洞傳輸層‧發光層‧電子傳輸層等之步驟、及密封該等之步驟，於薄板玻璃積層體B5之薄板玻璃基板上形成有機EL結構體。Two thin-plate glass laminates B which were formed in Example 2 were prepared. Further, in the same manner as in the second embodiment, an array is formed on the second main surface of the thin glass substrate of one of the thin glass laminated bodies B (referred to as "thin glass laminated body B4"). Further, an organic EL structure is formed on the second main surface of the thin glass substrate of the other thin glass laminated body B (referred to as "thin glass laminated body B5"). Specifically, a step of forming a transparent electrode, a step of forming an auxiliary electrode, a step of depositing a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like, and sealing the steps are performed on a thin plate glass layer An organic EL structure is formed on the thin glass substrate of the body B5.

並且，將薄板玻璃積層體B4及薄板玻璃積層體B5組合而獲得附支持體之面板E。Then, the thin plate glass laminate B4 and the thin glass laminate B5 are combined to obtain a panel E with a support.

其次，以與實施例2相同之方法，可剝離薄板玻璃積層體B4及薄板玻璃積層體B5之支持體。將此處所獲得者，即將自附支持體之面板E剝離支持體後所獲得者作為「面板E」。於面板E中之薄板玻璃基板之表面，並未發現會導致強度降低之傷痕。Next, in the same manner as in the second embodiment, the support of the thin plate glass laminate B4 and the thin glass laminate B5 can be peeled off. The person obtained here will be referred to as "panel E" after the panel E of the support is peeled off from the support. On the surface of the thin glass substrate in the panel E, no scratches were found which would cause a decrease in strength.

其次，使用常壓遠距電漿裝置(積水化學公司製)，對已形成有機EL結構體之薄板玻璃基板之第1主面照射電漿。此處，處理條件為：輸出為3 kw，氮氣與空氣流量之比=600 slm/750 sccm，搬送速度為1 m/min。電漿照射時之薄板玻璃基板之表面溫度為50℃以下。Next, the first main surface of the thin glass substrate on which the organic EL structure has been formed is irradiated with plasma using a normal pressure remote plasma device (manufactured by Sekisui Chemical Co., Ltd.). Here, the processing conditions are as follows: the output is 3 kw, the ratio of nitrogen to air flow = 600 slm / 750 sccm, and the transport speed is 1 m / min. The surface temperature of the thin glass substrate at the time of plasma irradiation is 50 ° C or less.

其次，使用雷射刀或切割-斷裂法來切割面板E，分割為縱41 mm×橫30 mm之288個晶胞後，於晶胞表面貼附作為保護膜之PET(polyethylene terephthalate，聚對苯二甲酸乙二酯)膜(日東電工公司製，丙烯酸系黏著劑)。此時之黏著強度為3.9 N/25 mm。其後，實施模組形成步驟而製作OLED。Next, using a laser knife or a cutting-fracture method to cut the panel E, and dividing it into 288 cells of 41 mm in length × 30 mm in width, and attaching PET (polyethylene terephthalate) as a protective film on the surface of the unit cell. Ethylene dicarboxylate) film (made by Nitto Denko Corporation, an acrylic adhesive). The adhesive strength at this time was 3.9 N/25 mm. Thereafter, a module forming step is performed to fabricate an OLED.

如此獲得之OLED不會產生特性上問題。The OLED thus obtained does not cause a problem in characteristics.

上述例中，於分割為顯示之面板單位之前剝離支持體，但亦可將複數個面板彼此連接而成之結構作為單位進行處理。In the above example, the support is peeled off before being divided into panel units for display, but the structure in which a plurality of panels are connected to each other may be treated as a unit.

除上述例以外，亦可於分割為顯示之面板單位之後剝離支持體。In addition to the above examples, the support may be peeled off after being divided into panel units for display.

已參照特別指定之實施態樣詳細地說明了本發明，但本領域技術人員明白，在不脫離本發明之精神與範圍內，可進行各種變更或修正。The present invention has been described in detail with reference to the preferred embodiments of the invention, and various modifications and changes can be made without departing from the spirit and scope of the invention.

本申請案係基於2009年3月24日提出申請之日本專利申請2009-072282者，其內容以參照的形式併入於此。The present application is based on Japanese Patent Application No. 2009-072282, filed on Jan.

產業上之可利用性Industrial availability

根據本發明，可提供一種電子裝置之製造方法，其係自積層有含有顯示裝置等電子裝置用構件之基板、樹脂層及支持基板的附支持體之電子裝置，剝離包含上述樹脂層及上述支持基板之支持體而獲得電子裝置後，不對基板及電子裝置用構件等(例如薄膜電晶體、有機EL元件、彩色濾光片)造成熱、電磁、機械及化學性損傷地去除附著於上述電子裝置用之基板主面的異物，其結果可將偏光膜或相位差膜等附黏著劑之膜牢固地貼附於剝離後之基板中之附樹脂層的面。According to the present invention, there is provided a method of manufacturing an electronic device comprising an electronic device having a substrate including a member for an electronic device such as a display device, a resin layer, and a support substrate, and the resin layer and the support are peeled off. After the electronic device is obtained by the support of the substrate, the substrate and the electronic device member (for example, the thin film transistor, the organic EL element, and the color filter) are removed from the electronic device by thermal, electromagnetic, mechanical, and chemical damage. As a result of the foreign matter on the main surface of the substrate, a film of an adhesive such as a polarizing film or a retardation film can be firmly attached to the surface of the resin-attached layer in the peeled substrate.

10、20、30．．．本發明之附支持體之面板10, 20, 30. . . Support panel of the invention

12、22、32．．．薄板玻璃基板12, 22, 32. . . Thin glass substrate

14、24、34．．．顯示裝置用構件14, 24, 34. . . Display device component

16、26．．．顯示裝置用面板16, 26. . . Display panel

18、28、38．．．樹脂層18, 28, 38. . . Resin layer

19、29、39．．．支持玻璃基板19, 29, 39. . . Support glass substrate

25．．．間隙部25. . . Gap

41．．．電源(高壓脈衝電源)41. . . Power supply (high voltage pulse power supply)

42．．．電壓施加電極42. . . Voltage application electrode

43．．．設置電極43. . . Setting electrode

44．．．放電空間44. . . Discharge space

45．．．電漿噴出口45. . . Plasma spray outlet

46．．．固體電介質46. . . Solid dielectric

50．．．剝離步驟後之顯示裝置用面板50. . . Panel for display device after peeling step

圖1係表示本發明之附支持體之面板之一態樣的概略剖面圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an aspect of a panel of a support according to the present invention.

圖2係表示本發明之附支持體之面板之另一態樣的概略正視圖。Fig. 2 is a schematic front view showing another aspect of the panel of the support of the present invention.

圖3係表示本發明之附支持體之面板之另一態樣的概略剖面圖。Fig. 3 is a schematic cross-sectional view showing another aspect of the panel of the support of the present invention.

圖4係表示本發明之附支持體之面板之另一態樣的概略正視圖。Fig. 4 is a schematic front view showing another aspect of the panel of the support of the present invention.

圖5係表示本發明之附支持體之面板之另一態樣的概略正視圖。Fig. 5 is a schematic front view showing another aspect of the panel of the support of the present invention.

圖6係表示本發明之附支持體之面板之另一態樣的概略剖面圖。Fig. 6 is a schematic cross-sectional view showing another aspect of the panel with a support of the present invention.

圖7係說明可用於本發明之面板製造方法之去除步驟中的常壓遠距電漿裝置之例的模式圖。Fig. 7 is a schematic view showing an example of an atmospheric pressure remote plasma device which can be used in the removal step of the panel manufacturing method of the present invention.

10．．．本發明之附支持體之面板10. . . Support panel of the invention

12．．．薄板玻璃基板12. . . Thin glass substrate

14．．．顯示裝置用構件14. . . Display device component

16．．．顯示裝置用面板16. . . Display panel

18．．．樹脂層18. . . Resin layer

19．．．支持玻璃基板19. . . Support glass substrate

Claims (8)

一種電子裝置之製造方法，其包括：剝離步驟，自附支持體之電子裝置剝離包含支持基板及樹脂層之支持體，獲得包含電子裝置用構件及基板之電子裝置，上述附支持體之電子裝置係：在含有第1主面及第2主面、且於第2主面上含有電子裝置用構件之基板之第1主面密著有樹脂層，該樹脂層含有剝離性表面，其固定於含有第1主面及第2主面之支持基板之第1主面；及去除步驟，去除附著於上述電子裝置中之上述基板第1主面的異物，其中上述樹脂層係聚矽氧樹脂層。 A method of manufacturing an electronic device, comprising: a peeling step of peeling off a support including a support substrate and a resin layer from an electronic device with a support, obtaining an electronic device including a member for an electronic device and a substrate, and the electronic device with the support A resin layer is adhered to the first main surface of the substrate including the first main surface and the second main surface and including the electronic device member on the second main surface, and the resin layer contains a peelable surface and is fixed to the resin layer. a first main surface including a support substrate of the first main surface and the second main surface; and a removing step of removing foreign matter adhering to the first main surface of the substrate in the electronic device, wherein the resin layer is a polyoxyalkylene resin layer . 如請求項1之電子裝置之製造方法，其中令上述樹脂層之剝離性表面密著於上述基板第1主面之前的上述基板第1主面之黏著強度為f0 ，且令上述去除步驟之後獲得之電子裝置中的上述基板第1主面之黏著強度為f時，f≧f0 。The method of manufacturing an electronic device according to claim 1, wherein the adhesive strength of the first main surface of the substrate before the peeling surface of the resin layer is adhered to the first main surface of the substrate is f 0 , and after the removing step When the adhesion strength of the first main surface of the substrate in the obtained electronic device is f, f ≧ f 0 . 如請求項1或2之電子裝置之製造方法，其中上述去除步驟係對上述基板之第1主面照射電漿而去除上述異物者。 The method of manufacturing an electronic device according to claim 1 or 2, wherein the removing step is to irradiate the first main surface of the substrate with plasma to remove the foreign matter. 如請求項1或2之電子裝置之製造方法，其中上述去除步驟係使用含有酸或鹼之藥液而去除上述異物者。 The method of manufacturing an electronic device according to claim 1 or 2, wherein the removing step is a method of removing the foreign matter by using a chemical solution containing an acid or a base. 如請求項1或2之電子裝置之製造方法，其中上述去除步驟係使用含有溶解度參數為7~15之溶劑之藥液而去除上 述異物者。 The method of manufacturing an electronic device according to claim 1 or 2, wherein the removing step is performed by using a chemical solution containing a solvent having a solubility parameter of 7 to 15 Foreigners. 如請求項4之電子裝置之製造方法，其中上述去除步驟係進而使用超音波振動而去除上述異物者。 The method of manufacturing an electronic device according to claim 4, wherein the removing step further removes the foreign object by using ultrasonic vibration. 如請求項5之電子裝置之製造方法，其中上述去除步驟係進而使用超音波振動而去除上述異物者。 The method of manufacturing an electronic device according to claim 5, wherein the removing step further removes the foreign object by using ultrasonic vibration. 如請求項1或2之電子裝置之製造方法，其中包括2個以上的上述去除步驟。 A method of manufacturing an electronic device according to claim 1 or 2, comprising two or more of the above removing steps.
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