TWI506358B - And a method for producing the printed circuit board of the first liquid and the second liquid - Google Patents
And a method for producing the printed circuit board of the first liquid and the second liquid Download PDFInfo
- Publication number
- TWI506358B TWI506358B TW101100839A TW101100839A TWI506358B TW I506358 B TWI506358 B TW I506358B TW 101100839 A TW101100839 A TW 101100839A TW 101100839 A TW101100839 A TW 101100839A TW I506358 B TWI506358 B TW I506358B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- boiling point
- group
- organic solvent
- weight
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims description 340
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 238000009835 boiling Methods 0.000 claims description 159
- 239000000203 mixture Substances 0.000 claims description 152
- 239000003960 organic solvent Substances 0.000 claims description 109
- 238000002156 mixing Methods 0.000 claims description 96
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 75
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 74
- 238000004821 distillation Methods 0.000 claims description 72
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims description 66
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 59
- 239000003999 initiator Substances 0.000 claims description 55
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 47
- 229920000642 polymer Polymers 0.000 claims description 39
- 150000001875 compounds Chemical class 0.000 claims description 38
- 229910000679 solder Inorganic materials 0.000 claims description 27
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 24
- 239000002904 solvent Substances 0.000 claims description 23
- 150000004292 cyclic ethers Chemical class 0.000 claims description 22
- 239000000178 monomer Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 12
- KVXNKFYSHAUJIA-UHFFFAOYSA-N acetic acid;ethoxyethane Chemical compound CC(O)=O.CCOCC KVXNKFYSHAUJIA-UHFFFAOYSA-N 0.000 claims description 9
- 229920000058 polyacrylate Polymers 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 7
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 3
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003209 petroleum derivative Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 210000004556 brain Anatomy 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 67
- 239000000463 material Substances 0.000 description 34
- 239000003822 epoxy resin Substances 0.000 description 24
- 229920000647 polyepoxide Polymers 0.000 description 24
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 16
- 239000003963 antioxidant agent Substances 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- -1 cyclic ether group compound Chemical class 0.000 description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 12
- 230000003078 antioxidant effect Effects 0.000 description 12
- 238000003756 stirring Methods 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 7
- 238000004383 yellowing Methods 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- 150000007519 polyprotic acids Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910000420 cerium oxide Inorganic materials 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000002530 phenolic antioxidant Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 3
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- QRZABZWAOIVVCS-UHFFFAOYSA-N 10,12-dihydrobenzo[a]xanthen-9-one Chemical compound C1=CC2=CC=CC=C2C2=C1OC1=CC(=O)CC=C1C2 QRZABZWAOIVVCS-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- SHJIJMBTDZCOFE-UHFFFAOYSA-N 2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]-1-methoxyethanol Chemical compound COC(O)COCCOCCOCCO SHJIJMBTDZCOFE-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- STLLXWLDRUVCHL-UHFFFAOYSA-N [2-[1-[2-hydroxy-3,5-bis(2-methylbutan-2-yl)phenyl]ethyl]-4,6-bis(2-methylbutan-2-yl)phenyl] prop-2-enoate Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(C(C)C=2C(=C(C=C(C=2)C(C)(C)CC)C(C)(C)CC)OC(=O)C=C)=C1O STLLXWLDRUVCHL-UHFFFAOYSA-N 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- IORUEKDKNHHQAL-UHFFFAOYSA-N [2-tert-butyl-6-[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenyl] prop-2-enoate Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)OC(=O)C=C)=C1O IORUEKDKNHHQAL-UHFFFAOYSA-N 0.000 description 1
- BEIOEBMXPVYLRY-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=CC(=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C BEIOEBMXPVYLRY-UHFFFAOYSA-N 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- ZBCKWHYWPLHBOK-UHFFFAOYSA-N cyclohexylphosphane Chemical compound PC1CCCCC1 ZBCKWHYWPLHBOK-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- WSFJFIDCQBAQQZ-UHFFFAOYSA-N hydroxy(sulfido)phosphanium Chemical compound S[PH2]=O WSFJFIDCQBAQQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- PEEVQGIAFQUGBV-UHFFFAOYSA-N methyl prop-2-enoate 1,3,5-triazine-2,4,6-triamine Chemical compound C(C=C)(=O)OC.N1=C(N)N=C(N)N=C1N PEEVQGIAFQUGBV-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- MBAUOPQYSQVYJV-UHFFFAOYSA-N octyl 3-[4-hydroxy-3,5-di(propan-2-yl)phenyl]propanoate Chemical compound OC1=C(C=C(C=C1C(C)C)CCC(=O)OCCCCCCCC)C(C)C MBAUOPQYSQVYJV-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
Description
本發明係關於一種用以獲得作為混合物之感光性組合物的二液混合型之第一、第二液。更詳細而言,本發明係關於一種能夠較佳地用於在基板上形成阻焊劑膜、或在搭載有發光二極體晶片之基板上形成反射光之光阻膜的二液混合型之第一、第二液,以及使用該二液混合型之第一、第二液之印刷佈線板之製造方法。The present invention relates to a first liquid and a second liquid for obtaining a two-liquid mixing type as a photosensitive composition of a mixture. More specifically, the present invention relates to a two-liquid mixing type which can be preferably used for forming a solder resist film on a substrate or forming a photoresist film for reflecting light on a substrate on which a light-emitting diode wafer is mounted. A second liquid, and a method of producing a printed wiring board using the first and second liquids of the two-liquid mixing type.
作為用以保護印刷佈線板以免受高溫焊錫損傷之保護膜,廣泛使用有阻焊劑膜。As a protective film for protecting a printed wiring board from high-temperature solder damage, a solder resist film is widely used.
又,於各種電子機器用途中,在印刷佈線板之上表面搭載有發光二極體(以下簡稱為LED,Light Emitting Diode)晶片。為使自LED發出之光中,到達上述印刷佈線板之上表面側之光亦得以利用,有時於印刷佈線板之上表面形成白色阻焊劑膜。於該情形時,不僅可利用自LED晶片之表面直接照射至與印刷佈線板相反之側之光,亦可利用到達印刷佈線板之上表面側,藉由白色阻焊劑膜而反射之反射光。因此,可提高自LED產生之光之利用效率。Further, in various electronic device applications, a light-emitting diode (hereinafter abbreviated as an LED, Light Emitting Diode) wafer is mounted on the upper surface of the printed wiring board. In order to obtain light from the LED, light reaching the upper surface side of the printed wiring board is also utilized, and a white solder resist film may be formed on the upper surface of the printed wiring board. In this case, not only light that is directly irradiated from the surface of the LED chip to the side opposite to the printed wiring board but also reflected light that is reflected by the white solder resist film may be used to reach the upper surface side of the printed wiring board. Therefore, the utilization efficiency of light generated from the LED can be improved.
作為用以形成上述白色阻焊劑膜之材料之一例,下述專利文獻1中揭示有如下光阻材料,其含有藉由環氧樹脂與水解性烷氧矽烷之脫醇化反應而獲得的含烷氧基之矽烷改質環氧樹脂,且進而含有含不飽和基之聚羧酸樹脂、稀釋劑、光聚合起始劑及硬化密接性賦予劑。As an example of a material for forming the white solder resist film, Patent Document 1 below discloses a photoresist material containing an alkoxy group obtained by a dealcoholization reaction of an epoxy resin and a hydrolyzable alkane. The base decane-modified epoxy resin further contains a polycarboxylic acid resin containing an unsaturated group, a diluent, a photopolymerization initiator, and a hardening adhesion imparting agent.
下述專利文獻2揭示有如下白色阻焊劑材料,其含有不具有芳香環之含羧基樹脂、光聚合起始劑、環氧化合物、金紅石型氧化鈦及稀釋劑。Patent Document 2 listed below discloses a white solder resist material containing a carboxyl group-containing resin having no aromatic ring, a photopolymerization initiator, an epoxy compound, a rutile-type titanium oxide, and a diluent.
[專利文獻1]日本專利特開2007-249148號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-249148
[專利文獻2]日本專利特開2007-322546號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-322546
為於基板上形成光阻膜,於將如專利文獻1~2中記載之先前之光阻材料塗敷於基板上之情形時,有時無法均勻塗敷光阻材料而產生塗敷不均。於例如藉由絲網印刷於基板上塗敷先前之光阻材料之情形時,在所塗敷之光阻材料層中,有時能看到條狀之不均。When a photoresist film is formed on a substrate, when the prior photoresist material described in Patent Documents 1 to 2 is applied to the substrate, the photoresist may not be uniformly applied to cause coating unevenness. In the case where the previous photoresist material is applied to the substrate by screen printing, for example, unevenness in the strip shape can be seen in the applied photoresist material layer.
本發明之目的在於提供一種二液混合型之第一、第二液,以及使用該二液混合型之第一、第二液的印刷佈線板之製造方法,該第一、第二液之混合性優異,且於將由第一、第二液混合而成之混合物即感光性組合物塗敷於塗敷對象構件上時,可抑制不均而均勻地塗敷。An object of the present invention is to provide a two-liquid mixing type first and second liquid, and a method of manufacturing a printed wiring board using the two-liquid mixing type first and second liquids, the first and second liquid mixing When the photosensitive composition which is a mixture which is a mixture of the first and second liquids is applied to the member to be coated, the coating can be uniformly applied to suppress unevenness.
根據本發明之廣泛態樣,可以提供如下二液混合型之第一、第二液,其係用以獲得作為混合物之感光性組合物者,該二液混合型之第一、第二液為混合該第一、第二液之前之液體,由上述第一、第二液混合而成之混合物即感光性 組合物整體含有具有羧基之聚合性聚合物、光聚合起始劑、具有環狀醚基之化合物、氧化鈦及有機溶劑,上述感光性組合物含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑,上述第一液含有上述聚合性聚合物,且含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑之一部分,上述第二液含有上述具有環狀醚基之化合物,且含有選自由二乙二醇單***乙酸酯、二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑之一部分,上述第一液含有上述光聚合起始劑或含有上述氧化鈦,或者含有上述光聚合起始劑與上述氧化鈦兩者,於上述第一液不含上述光聚合起始劑之情形時上述第二液含有上述光聚合起始劑,於上述第一液不含上述氧化鈦之情形時,上述第二液含有上述氧化鈦。According to a broad aspect of the present invention, the first and second liquids of the two-liquid mixing type may be provided, which are used to obtain a photosensitive composition as a mixture, and the first and second liquids of the two-liquid mixing type are Mixing the liquid before the first and second liquids, and the mixture of the first and second liquids is photosensitive The composition as a whole contains a polymerizable polymer having a carboxyl group, a photopolymerization initiator, a compound having a cyclic ether group, titanium oxide, and an organic solvent, and the photosensitive composition contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol. At least two of the group consisting of monoethyl ether acetate and a group of naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or less as the above-mentioned organic solvent, the first liquid The polymerizable polymer is contained and is selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and an initial boiling point of 150 ° C or higher in a distillation property and a final boiling point of 290 ° C or lower in a distillation property. At least one of the group consisting of naphtha as part of the organic solvent, the second liquid containing the above compound having a cyclic ether group, and containing a monomer selected from the group consisting of diethylene glycol monoethyl ether acetate and dipropylene glycol At least one of a group consisting of an ether and a naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or less at the beginning of the distillation property is used as the organic In one part of the agent, the first liquid contains the photopolymerization initiator or contains the titanium oxide, or both the photopolymerization initiator and the titanium oxide, and the first liquid does not contain the photopolymerization initiator. In the case where the second liquid contains the photopolymerization initiator, the second liquid contains the titanium oxide when the first liquid does not contain the titanium oxide.
本發明之印刷佈線板之製造方法係製造包含於表面具有電路之印刷佈線板本體、及積層於該印刷佈線板本體之設置有電路之表面的阻焊劑膜之印刷佈線板之方法,該製造方法包括下述步驟:混合第一、第二液,獲得由上述第一、第二液混合而成之阻焊劑組合物即感光性組合物;在於表 面具有電路之印刷佈線板本體之設置有電路的表面上塗敷由上述第一、第二液混合而成之阻焊劑組合物即感光性組合物,形成積層於上述印刷佈線板本體之設置有上述電路之表面的阻焊劑膜,由上述第一、第二液混合而成之阻焊劑組合物即感光性組合物整體包含具有羧基之聚合性聚合物、光聚合起始劑、具有環狀醚基之化合物、氧化鈦及有機溶劑,上述感光性組合物含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑,上述第一液含有上述聚合性聚合物,且含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑之一部分,上述第二液含有上述具有環狀醚基之化合物,且含有選自由二乙二醇單***乙酸酯、二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑之一部分,上述第一液含有上述光聚合起始劑或含有上述氧化鈦,或者含有上述光聚合起始劑與上述氧化鈦兩者,於上述第一液不含上述光聚合起始劑之情形時上述第二液含有上述光聚合起始劑,於上述第一液不含上述氧化鈦之情形時,上述第二液含有上述氧化鈦。A method of manufacturing a printed wiring board according to the present invention is a method of manufacturing a printed wiring board including a circuit board having a circuit on a surface thereof and a solder resist film laminated on a surface of the printed wiring board body provided with a circuit, the manufacturing method The method includes the steps of: mixing the first and second liquids, and obtaining a solder resist composition which is a mixture of the first and second liquids; that is, a photosensitive composition; a photosensitive composition which is a solder resist composition obtained by mixing the first and second liquids on a surface of a circuit board having a circuit having a circuit, and a layer formed on the printed wiring board body The solder resist film on the surface of the circuit, the photosensitive composition which is a solder resist composition obtained by mixing the first and second liquids as a whole contains a polymerizable polymer having a carboxyl group, a photopolymerization initiator, and a cyclic ether group. a compound, titanium oxide, and an organic solvent, wherein the photosensitive composition contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and a boiling point of 150 ° C or higher at the beginning of the distillation property, and is at the end of the distillation property. At least two of the group consisting of naphtha having a boiling point of 290 ° C or less are used as the organic solvent, and the first liquid contains the polymerizable polymer and contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol monoethyl ether. At least one of a group consisting of an acetate and a naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or less; a part of the organic solvent, wherein the second liquid contains the compound having a cyclic ether group, and is selected from the group consisting of diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, and an initial boiling point of 150 ° C or higher in a distillation property. And at least one of the group consisting of naphtha having a boiling point of 220 ° C or less as a part of the organic solvent, wherein the first liquid contains the photopolymerization initiator or contains the titanium oxide or contains the above a photopolymerization initiator and the titanium oxide, wherein the second liquid contains the photopolymerization initiator when the first liquid does not contain the photopolymerization initiator, and the first liquid does not contain the titanium oxide In the case of the above, the second liquid contains the titanium oxide.
於本發明之二液混合型之第一、第二液及本發明之印刷 佈線板之製造方法的某特定態樣中,上述第一液含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑之一部分。The first and second liquids of the two-liquid mixing type of the present invention and the printing of the present invention In a specific aspect of the method for producing a wiring board, the first liquid contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and a boiling point of 150 ° C or higher and a distillation property. At least two of the group consisting of naphtha having a final boiling point of 290 ° C or less are part of the above organic solvent.
於本發明之二液混合型之第一、第二液及本發明之印刷佈線板之製造方法的其他特定態樣中,上述第一液至少含有二丙二醇單甲醚與二乙二醇單***乙酸酯,或者至少含有二乙二醇單***乙酸酯與處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油作為上述有機溶劑之一部分。In other specific aspects of the first and second liquids of the two-liquid mixing type of the present invention and the method for producing a printed wiring board of the present invention, the first liquid contains at least dipropylene glycol monomethyl ether and diethylene glycol monoethyl ether. The acetate, or at least diethylene glycol monoethyl ether acetate, and naphtha having a boiling point of 150 ° C or higher and a distillation boiling point of 290 ° C or less are included as part of the organic solvent.
於本發明之二液混合型之第一、第二液及本發明之印刷佈線板之製造方法的其他特定態樣中,上述第一液至少含有二丙二醇單甲醚與處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油作為上述有機溶劑之一部分。In other specific aspects of the first and second liquids of the two-liquid mixing type of the present invention and the method for producing a printed wiring board of the present invention, the first liquid contains at least dipropylene glycol monomethyl ether and an initial boiling point in a distillation property. A naphtha having a boiling point of 290 ° C or lower at 150 ° C or higher is used as a part of the above organic solvent.
於本發明之二液混合型之第一、第二液及本發明之印刷佈線板之製造方法的其他特定態樣中,上述感光性組合物含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑,上述第一液中之上述處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油為處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之 終沸點為220℃以下之石腦油。In another specific aspect of the method for producing a first liquid and a second liquid of the present invention, and the method for producing a printed wiring board of the present invention, the photosensitive composition contains a monomer selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol. At least two of the group consisting of monoethyl ether acetate and a group of naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or lower, wherein the first liquid is the organic solvent, the first liquid Among the above, the naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or lower is a boiling point of 150 ° C or higher and a distillation property. A naphtha with a final boiling point of 220 ° C or less.
於本發明之二液混合型之第一、第二液及本發明之印刷佈線板之製造方法的其他特定態樣中,上述第一液含有上述光聚合起始劑。In another specific aspect of the first and second liquids of the two-liquid mixing type of the present invention and the method of producing a printed wiring board of the present invention, the first liquid contains the photopolymerization initiator.
於本發明之二液混合型之第一、第二液及本發明之印刷佈線板之製造方法的其他特定態樣中,上述第一液含有上述氧化鈦。In another specific aspect of the first and second liquids of the two-liquid mixing type of the present invention and the method of producing a printed wiring board of the present invention, the first liquid contains the titanium oxide.
於本發明之二液混合型之第一、第二液及本發明之印刷佈線板之製造方法的進而其他之特定態樣中,上述第一液含有上述光聚合起始劑與上述氧化鈦兩者。In still another specific aspect of the first and second liquids of the two-liquid mixing type of the present invention and the method for producing a printed wiring board of the present invention, the first liquid contains the photopolymerization initiator and the titanium oxide. By.
於本發明之二液混合型之第一、第二液中,由上述第一、第二液混合而成之感光性組合物可較佳地用作阻焊劑組合物。於本發明之二液混合型之第一、第二液中,較佳為由上述第一、第二液混合而成之感光性組合物為阻焊劑組合物。In the first and second liquids of the two-liquid mixing type of the present invention, the photosensitive composition obtained by mixing the first and second liquids can be preferably used as a solder resist composition. In the first and second liquids of the two-liquid mixing type of the present invention, it is preferred that the photosensitive composition obtained by mixing the first and second liquids is a solder resist composition.
本發明之二液混合型之第一、第二液係用以獲得作為混合物之感光性組合物的二液混合型之第一、第二液,該二液混合型之第一、第二液係混合該第一、第二液之前之液體,由上述第一、第二液混合而成之混合物即感光性組合物整體包含具有羧基之聚合性聚合物、光聚合起始劑、具有環狀醚基之化合物、氧化鈦及有機溶劑,上述感光性組合物含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀 之終沸點為290℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑,上述第一液含有上述聚合性聚合物,且含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑之一部分,上述第二液含有上述具有環狀醚基之化合物,且含有選自由二乙二醇單***乙酸酯、二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑之一部分,上述第一液含有上述光聚合起始劑或含有上述氧化鈦,或者含有上述光聚合起始劑與上述氧化鈦兩者,因此上述第一、第二液之混合性優異,且於將混合後之感光性組合物塗敷於塗敷對象構件上時,可抑制不均而均勻地塗敷。The first liquid and the second liquid of the two-liquid mixing type of the present invention are used to obtain a first liquid and a second liquid of a two-liquid mixing type as a photosensitive composition of a mixture, and the first liquid and the second liquid of the two liquid mixing type. a liquid before mixing the first and second liquids, wherein the photosensitive composition having a mixture of the first and second liquids as a whole comprises a polymerizable polymer having a carboxyl group, a photopolymerization initiator, and a ring The ether group-containing compound, titanium oxide, and an organic solvent, wherein the photosensitive composition contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol monoethyl ether acetate, and has a boiling point of 150 ° C or higher and a distillation property. At least two of the group consisting of naphtha having a final boiling point of 290 ° C or less are used as the organic solvent, and the first liquid contains the polymerizable polymer and contains a solvent selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol. At least one of a group consisting of monoethyl ether acetate and a naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or less as a part of the organic solvent, the second The liquid contains the above-mentioned compound having a cyclic ether group, and contains a terminal boiling point selected from the group consisting of diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, and the boiling point of the distillation property of 150 ° C or more and the distillation property. At least one of the group consisting of naphtha below 220 ° C as part of the organic solvent, the first liquid containing the photopolymerization initiator or containing the titanium oxide, or containing the photopolymerization initiator and the oxidation In the case of the titanium, the first and second liquids are excellent in the miscibility, and when the photosensitive composition after the application is applied to the member to be coated, the unevenness can be suppressed. Coated.
以下對本發明進行詳細說明。The invention is described in detail below.
本發明之二液混合型之第一、第二液可用於獲得作為混合物之感光性組合物。本發明之二液混合型之第一、第二液係用於獲得作為混合物之感光性組合物之套組。本發明之二液混合型之第一、第二液係混合而使用。本發明之二液混合型之第一、第二液為混合該第一、第二液之前之液體。混合之前之第一、第二液為混合前之感光性組合物。由本發明之二液混合型之第一、第二液混合而成的混合物即感光性組合物整體包含具有羧基之聚合性聚合物(A)、光 聚合起始劑(B)、具有環狀醚基之化合物(C)、氧化鈦(D)及有機溶劑(E)(以下有時將感光性組合物整體包含之有機溶劑記作有機溶劑(E))。上述由第一、第二液混合而成之混合物為感光性組合物,所混合之該感光性組合物整體包含具有羧基之聚合性聚合物(A)、光聚合起始劑(B)、具有環狀醚基之化合物(C)、氧化鈦(D)及有機溶劑(E)。The first and second liquids of the two-liquid mixing type of the present invention can be used to obtain a photosensitive composition as a mixture. The first and second liquids of the two-liquid mixing type of the present invention are used to obtain a kit of photosensitive compositions as a mixture. The first liquid and the second liquid of the two-liquid mixing type of the present invention are used in combination. The first liquid and the second liquid of the two-liquid mixing type of the present invention are liquids before the first and second liquids are mixed. The first and second liquids before mixing are photosensitive compositions before mixing. The photosensitive composition which is a mixture of the first and second liquids of the two-liquid mixing type of the present invention as a whole contains a polymerizable polymer (A) having a carboxyl group, and light. The polymerization initiator (B), the compound (C) having a cyclic ether group, the titanium oxide (D), and the organic solvent (E) (hereinafter, the organic solvent contained in the entire photosensitive composition may be referred to as an organic solvent (E) )). The mixture obtained by mixing the first and second liquids is a photosensitive composition, and the photosensitive composition as a whole comprises a polymerizable polymer (A) having a carboxyl group and a photopolymerization initiator (B). a cyclic ether group compound (C), titanium oxide (D), and an organic solvent (E).
上述感光性組合物含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑(E)。The photosensitive composition contains naphtha selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and a boiling point of 150 ° C or higher and a distillation boiling point of 290 ° C or lower. At least two of the group consisting of are the above-mentioned organic solvent (E).
上述第一液含有上述聚合性聚合物(A),且含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑(E)之一部分。上述第二液含有上述具有環狀醚基之化合物(C),且含有選自由二乙二醇單***乙酸酯、二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑(E)之一部分。The first liquid contains the polymerizable polymer (A) and is selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and a boiling point of 150 ° C or higher in a distillation property, and is in a distillation property. At least one of the group consisting of naphtha having a final boiling point of 290 ° C or less is part of the above organic solvent (E). The second liquid contains the compound (C) having a cyclic ether group, and is selected from the group consisting of diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, and an initial boiling point of 150 ° C or higher in a distillation property. At least one of the group consisting of naphtha having a boiling point of 220 ° C or less has a part of the organic solvent (E).
上述第一液含有上述光聚合起始劑(B)或含有上述氧化鈦(D),或者含有上述光聚合起始劑(B)與上述氧化鈦(D)兩者。於上述第一液不含上述光聚合起始劑(B)之情形時,上述第二液含有上述光聚合起始劑(B)。於上述第一液不含上述氧化鈦(D)之情形時,上述第二液含有上述氧化鈦(D)。 上述光聚合起始劑(B)及上述氧化鈦(D)分別可包含於第一液,亦可包含於第二液,亦可包含於第一液與第二液兩者之中。The first liquid contains the photopolymerization initiator (B) or the titanium oxide (D), or both the photopolymerization initiator (B) and the titanium oxide (D). In the case where the first liquid does not contain the photopolymerization initiator (B), the second liquid contains the photopolymerization initiator (B). In the case where the first liquid does not contain the titanium oxide (D), the second liquid contains the titanium oxide (D). The photopolymerization initiator (B) and the titanium oxide (D) may be contained in the first liquid, or may be included in the second liquid, or may be included in both the first liquid and the second liquid.
又,於本發明之二液混合型之第一、第二液含有下述聚合性單體、或者含有下述抗氧化劑之情形時,聚合性單體及抗氧化劑分別可包含於第一液,亦可包含於第二液,亦可包含於第一液與第二液兩者之中。Further, when the first liquid and the second liquid of the two-liquid mixing type of the present invention contain the following polymerizable monomer or contain the following antioxidant, the polymerizable monomer and the antioxidant may be contained in the first liquid, respectively. It may also be included in the second liquid, or may be included in both the first liquid and the second liquid.
藉由採用本發明之二液混合型之第一、第二液之上述構成,可提高上述第一、第二液之混合性。進而,於基板等塗敷對象構件上塗敷混合後之感光性組合物時,可抑制主要由於氧化鈦而產生之不均,從而可均勻地塗敷。尤其是藉由絲網印刷塗敷混合後之感光性組合物時,可抑制條狀之不均。本發明之二液混合型之第一、第二液較佳為藉由絲網印刷所塗敷之二液混合型之第一、第二液。By using the above-described configuration of the first and second liquids of the two-liquid mixing type of the present invention, the mixing property of the first and second liquids can be improved. Further, when the photosensitive composition after the application is applied to a member to be coated such as a substrate, unevenness mainly due to titanium oxide can be suppressed, and uniform coating can be performed. In particular, when the photosensitive composition after mixing is applied by screen printing, unevenness in strip shape can be suppressed. Preferably, the first and second liquids of the two-liquid mixing type of the present invention are the first and second liquids of the two-liquid mixing type applied by screen printing.
上述光聚合起始劑(B)較佳為包含於第一液中而非包含於第二液中。此時,上述第一、第二液之混合性變得更高,且可更加均勻地塗敷感光性組合物。The photopolymerization initiator (B) is preferably contained in the first liquid and not included in the second liquid. At this time, the miscibility of the first and second liquids described above becomes higher, and the photosensitive composition can be applied more uniformly.
上述氧化鈦(D)較佳為包含於第一液中而非包含於第二液中。此時,氧化鈦(D)之分散性變高,進而上述第一、第二液之混合性變得更高,且可更加均勻地塗敷感光性組合物。The above titanium oxide (D) is preferably contained in the first liquid and not included in the second liquid. At this time, the dispersibility of the titanium oxide (D) is increased, and the miscibility of the first and second liquids is further increased, and the photosensitive composition can be applied more uniformly.
較佳為上述光聚合起始劑(B)與上述氧化鈦(D)之兩者包含於第一液中而非包含於第二液中。此時,氧化鈦(D)之分散性變得更高,進而上述第一、第二液之混合性變得更高, 且可更加均勻地塗敷感光性組合物。It is preferred that both the photopolymerization initiator (B) and the titanium oxide (D) described above are contained in the first liquid instead of being contained in the second liquid. At this time, the dispersibility of the titanium oxide (D) becomes higher, and the miscibility of the first and second liquids becomes higher. Further, the photosensitive composition can be applied more uniformly.
以下,對本發明之二液混合型之第一、第二液、以及包含於混合後之感光性組合物中之各成分進行詳細說明。Hereinafter, the first and second liquids of the two-liquid mixing type of the present invention and the respective components contained in the photosensitive composition after mixing will be described in detail.
上述聚合性聚合物(A)具有羧基。具有羧基之聚合性聚合物(A)具有聚合性,可進行聚合。藉由使上述聚合性聚合物(A)具有羧基,可使感光性組合物之顯影性變得良好。作為上述聚合性聚合物(A),例如可列舉具有羧基之丙烯酸系樹脂、具有羧基之環氧樹脂及具有羧基之烯烴樹脂。再者,「樹脂」並不限定於固形樹脂,亦包括液狀樹脂及低聚物。The polymerizable polymer (A) has a carboxyl group. The polymerizable polymer (A) having a carboxyl group has polymerizability and can be polymerized. When the polymerizable polymer (A) has a carboxyl group, the developability of the photosensitive composition can be improved. Examples of the polymerizable polymer (A) include an acrylic resin having a carboxyl group, an epoxy resin having a carboxyl group, and an olefin resin having a carboxyl group. Further, the "resin" is not limited to a solid resin, and includes a liquid resin and an oligomer.
上述聚合性聚合物(A)較佳為下述含羧基樹脂(a)~(e):(a)由不飽和羧酸與具有聚合性不飽和雙鍵之化合物進行共聚合所得之含羧基樹脂;(b)由含羧基之(甲酸)丙烯酸系共聚樹脂(b1)與1分子中具有環氧乙烷環及乙烯性聚合性不飽和雙鍵之化合物(b2)反應所得之含羧基樹脂;(c)使不飽和一元羧酸、和1分子中分別具有1個環氧基及聚合性不飽和雙鍵之化合物與具有聚合性不飽和雙鍵之化合物的共聚物反應之後,使飽和或不飽和多元酸酐與所生成之反應物的二級羥基反應所得之含羧基樹脂;(d)使飽和或不飽和多元酸酐與含羥基聚合物反應後,使1分子中分別具有1個環氧基及聚合性不飽和雙鍵之化合物與所生成之具有羧基之聚合物反應而得的含羥基及羧基之樹脂; (e)使具有芳香環之環氧化合物與飽和多元酸酐或不飽和多元酸酐反應所得之樹脂,或使具有芳香環之環氧化合物與具有至少一個不飽和雙鍵之含羧基化合物反應之後,進而與飽和多元酸酐或不飽和多元酸酐反應而得之樹脂。The polymerizable polymer (A) is preferably a carboxyl group-containing resin (a) to (e): (a) a carboxyl group-containing resin obtained by copolymerizing an unsaturated carboxylic acid with a compound having a polymerizable unsaturated double bond. (b) a carboxyl group-containing resin obtained by reacting a carboxyl group-containing (formic acid) acrylic copolymer resin (b1) with a compound (b2) having an oxirane ring and an ethylenically polymerizable unsaturated double bond in one molecule; c) saturating or unsaturated after reacting an unsaturated monocarboxylic acid and a compound having one epoxy group and a polymerizable unsaturated double bond in one molecule with a copolymer having a polymerizable unsaturated double bond a carboxyl group-containing resin obtained by reacting a polybasic acid anhydride with a secondary hydroxyl group of the resulting reactant; (d) reacting a saturated or unsaturated polybasic acid anhydride with a hydroxyl group-containing polymer to have one epoxy group and polymerization in one molecule a hydroxyl group-containing and carboxyl group-containing resin obtained by reacting a compound of an unsaturated double bond with a polymer having a carboxyl group; (e) reacting a resin obtained by reacting an epoxy compound having an aromatic ring with a saturated polybasic acid anhydride or an unsaturated polybasic acid anhydride, or reacting an epoxy compound having an aromatic ring with a carboxyl group-containing compound having at least one unsaturated double bond, and further A resin obtained by reacting with a saturated polybasic acid anhydride or an unsaturated polybasic acid anhydride.
上述感光性組合物100重量%中,上述具有羧基之聚合性聚合物(A)之含量較佳為3重量%以上,更佳為5重量%以上,較佳為50重量%以下,更佳為40重量%以下。若上述具有羧基之聚合性聚合物(A)之含量為上述下限以上及上述上限以下,則感光性組合物之硬化性良好。In 100% by weight of the photosensitive composition, the content of the polymerizable polymer (A) having a carboxyl group is preferably 3% by weight or more, more preferably 5% by weight or more, and most preferably 50% by weight or less, more preferably 40% by weight or less. When the content of the polymerizable polymer (A) having a carboxyl group is at least the above lower limit and not more than the above upper limit, the curability of the photosensitive composition is good.
由於上述感光性組合物含有光聚合起始劑(B),因此可藉由光之照射使感光性組合物硬化。光聚合起始劑(B)並無特別限定。光聚合起始劑(B)可僅使用一種,亦可併用兩種以上。Since the photosensitive composition contains the photopolymerization initiator (B), the photosensitive composition can be cured by irradiation of light. The photopolymerization initiator (B) is not particularly limited. The photopolymerization initiator (B) may be used alone or in combination of two or more.
作為上述光聚合起始劑(B),例如可列舉:醯基膦氧化物、鹵甲基化三、鹵甲基化二唑、咪唑、安息香、安息香烷基醚、蒽醌、苯并蒽酮、二苯甲酮、苯乙酮、9-氧硫、苯甲酸酯、吖啶、啡、二茂鈦、α-胺烷基苯酮、肟以及該等之衍生物。上述光聚合起始劑(B)可僅使用一種,亦可併用兩種以上。Examples of the photopolymerization initiator (B) include mercaptophosphine oxide and halomethylation III. Halomethylation Diazole, imidazole, benzoin, benzoin alkyl ether, hydrazine, benzoxanthone, benzophenone, acetophenone, 9-oxosulfur Benzoate, acridine, brown , ferrocene, alpha-aminoalkyl benzophenone, hydrazine and derivatives thereof. The photopolymerization initiator (B) may be used alone or in combination of two or more.
相對於上述具有羧基之聚合性聚合物(A)100重量份,上述光聚合起始劑(B)之含量較佳為0.1重量份以上,更佳為1重量份以上,較佳為30重量份以下,更佳為15重量份以下。若上述光聚合起始劑(B)之含量為上述下限以上及上述上 限以下,則可進一步提高感光性組合物之感光性。The content of the photopolymerization initiator (B) is preferably 0.1 part by weight or more, more preferably 1 part by weight or more, and preferably 30 parts by weight, based on 100 parts by weight of the polymerizable polymer (A) having a carboxyl group. Hereinafter, it is more preferably 15 parts by weight or less. When the content of the photopolymerization initiator (B) is at least the above lower limit and above Below the limit, the photosensitivity of the photosensitive composition can be further improved.
以提高光阻膜之切割加工性等為目的,上述感光性組合物含有具有環狀醚骨架之化合物(C)。又,藉由使用上述具有環狀醚骨架之化合物(C),亦可使感光性組合物之硬化性良好。The photosensitive composition contains a compound (C) having a cyclic ether skeleton for the purpose of improving the cutting processability of the photoresist film. Further, by using the above compound (C) having a cyclic ether skeleton, the curability of the photosensitive composition can be improved.
作為上述具有環狀醚骨架之化合物(C),例如可列舉:雙酚S型環氧樹脂、鄰苯二甲酸二縮水甘油酯樹脂、異氰尿酸三縮水甘油酯等雜環式環氧樹脂、聯二甲苯酚型環氧樹脂、聯苯酚型環氧樹脂、四縮水甘油基二甲苯醯基乙烷樹脂、雙酚A型環氧樹脂、氫化雙酚A型環氧樹脂、雙酚F型環氧樹脂、溴化雙酚A型環氧樹脂、苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、脂環式環氧樹脂、雙酚A之酚醛清漆型環氧樹脂、螯合型環氧樹脂、乙二醛型環氧樹脂、含胺基環氧樹脂、橡膠改質環氧樹脂、雙環戊二烯酚型環氧樹脂、聚矽氧改質環氧樹脂及ε-己內酯改質環氧樹脂。上述具有環狀醚骨架之化合物(C)可僅使用一種,亦可併用兩種以上。Examples of the compound (C) having a cyclic ether skeleton include a heterocyclic epoxy resin such as a bisphenol S-type epoxy resin, a diglycidyl phthalate resin, or a triglycidyl isocyanurate. Dixylenol type epoxy resin, biphenol type epoxy resin, tetraglycidyl xylene decyl ethane resin, bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type ring Oxygen resin, brominated bisphenol A epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, alicyclic epoxy resin, phenolic phenolic epoxy resin of bisphenol A, chelation Epoxy resin, glyoxal epoxy resin, amine-based epoxy resin, rubber modified epoxy resin, dicyclopentadiene phenol epoxy resin, polyfluorene modified epoxy resin and ε- Ester modified epoxy resin. The compound (C) having a cyclic ether skeleton may be used alone or in combination of two or more.
上述具有環狀醚骨架之化合物(C)以如下方式發揮作用:與上述具有羧基之聚合性聚合物(A)所具有之羧基進行反應,使感光性組合物硬化。The compound (C) having a cyclic ether skeleton functions by reacting with a carboxyl group of the carboxyl group-containing polymerizable polymer (A) to cure the photosensitive composition.
相對於上述具有羧基之聚合性聚合物(A)100重量份,上述具有環狀醚骨架之化合物(C)之含量較佳為0.1重量份以上,更佳為1重量份以上,較佳為50重量份以下,更佳為30 重量份以下。若上述具有環狀醚骨架之化合物(C)之含量為上述下限以上及上述上限以下,則可進一步提高光阻膜之電氣絕緣性。The content of the compound (C) having a cyclic ether skeleton is preferably 0.1 part by weight or more, more preferably 1 part by weight or more, and more preferably 50% by weight based on 100 parts by weight of the polymerizable polymer (A) having a carboxyl group. Below the weight, more preferably 30 Parts by weight or less. When the content of the compound (C) having a cyclic ether skeleton is at least the above lower limit and not more than the above upper limit, the electrical insulating properties of the resist film can be further improved.
由於上述感光性組合物含有氧化鈦(D),因此可形成反射率較高之光阻膜等硬化物膜。上述感光性組合物中所含之氧化鈦(D)並無特別限定。氧化鈦(D)可僅使用一種,亦可併用兩種以上。Since the photosensitive composition contains titanium oxide (D), a cured film such as a photoresist film having a high reflectance can be formed. The titanium oxide (D) contained in the photosensitive composition is not particularly limited. The titanium oxide (D) may be used alone or in combination of two or more.
與使用氧化鈦(D)以外之其他無機填充劑之情形相比,藉由使用上述氧化鈦(D),可形成反射率較高之光阻膜。A photoresist film having a high reflectance can be formed by using the above titanium oxide (D) as compared with the case of using an inorganic filler other than titanium oxide (D).
上述氧化鈦(D)較佳為金紅石型氧化鈦或銳鈦礦型氧化鈦。藉由使用金紅石型氧化鈦,可形成耐熱黃變性更加優異之光阻膜。與金紅石型氧化鈦相比,上述銳鈦礦型氧化鈦之硬度較低。因此,藉由使用銳鈦礦型氧化鈦,可提高光阻膜之加工性。The titanium oxide (D) is preferably rutile-type titanium oxide or anatase-type titanium oxide. By using rutile-type titanium oxide, a photoresist film which is more excellent in heat-resistant yellowing can be formed. The anatase type titanium oxide has a lower hardness than the rutile type titanium oxide. Therefore, the workability of the photoresist film can be improved by using anatase type titanium oxide.
上述氧化鈦(D)較佳為含有利用矽氧化物或矽酮化合物進行表面處理之金紅石型氧化鈦。上述氧化鈦(D)100重量%中,上述利用矽氧化物或矽酮化合物進行表面處理之金紅石型氧化鈦之含量較佳為10重量%以上,更佳為30重量%以上,且為100重量%以下。上述氧化鈦(D)亦可全部為上述利用矽氧化物或矽酮化合物進行表面處理之金紅石型氧化鈦。藉由使用上述利用矽氧化物或矽酮化合物進行表面處理之金紅石型氧化鈦,可進一步提高光阻膜之耐熱黃變性。The titanium oxide (D) is preferably a rutile-type titanium oxide which is surface-treated with a cerium oxide or an anthrone compound. The content of the rutile-type titanium oxide surface-treated with the cerium oxide or the fluorenone compound in 100% by weight of the titanium oxide (D) is preferably 10% by weight or more, more preferably 30% by weight or more, and 100% by weight. Below weight%. The titanium oxide (D) may be all rutile-type titanium oxide surface-treated with a cerium oxide or an anthrone compound. The heat-resistant yellowing of the photoresist film can be further improved by using the above-described rutile-type titanium oxide surface-treated with a cerium oxide or an anthrone compound.
作為利用矽氧化物或矽酮化合物進行表面處理之金紅石 型氧化鈦,例如可列舉氯化法金紅石型氧化鈦即石原產業公司製造之產品編號:CR-90,或硫酸法金紅石型氧化鈦即石原產業公司製造之產品編號:R-550等。Rutile as a surface treatment using cerium oxide or an oxime compound Examples of the titanium oxides include chlorinated rutile-type titanium oxide, product number: CR-90 manufactured by Ishihara Sangyo Co., Ltd., or rutile-type titanium oxide, which is manufactured by Ishihara Sangyo Co., Ltd., product number: R-550.
上述感光性組合物100重量%中,氧化鈦(D)之含量較佳為3重量%以上,更佳為10重量%以上,進而更佳為15重量%以上,較佳為80重量%以下,更佳為75重量%以下,進而更佳為70重量%以下。若氧化鈦(D)之含量為上述下限以上及上述上限以下,則當光阻膜曝露於高溫下時難以發生黃變。進而,可容易地製備具有適於塗敷之黏度的感光性組合物。The content of the titanium oxide (D) in 100% by weight of the photosensitive composition is preferably 3% by weight or more, more preferably 10% by weight or more, still more preferably 15% by weight or more, and most preferably 80% by weight or less. More preferably, it is 75% by weight or less, and still more preferably 70% by weight or less. When the content of the titanium oxide (D) is at least the above lower limit and not more than the above upper limit, yellowing is less likely to occur when the photoresist film is exposed to a high temperature. Further, a photosensitive composition having a viscosity suitable for coating can be easily prepared.
上述感光性組合物含有有機溶劑(E)。由上述第一、第二液混合而成之感光性組合物含有有機溶劑(E)。上述感光性組合物含有至少兩種有機溶劑。較佳為上述第一液中所含之有機溶劑(E1)(以下有時將第一液中所含之有機溶劑記為有機溶劑(E1))與上述第二液中所含之有機溶劑(E2)(以下有時將第二液中所含之有機溶劑記為有機溶劑(E2))不同。The photosensitive composition contains an organic solvent (E). The photosensitive composition obtained by mixing the above first and second liquids contains an organic solvent (E). The above photosensitive composition contains at least two organic solvents. It is preferable that the organic solvent (E1) contained in the first liquid (hereinafter, the organic solvent contained in the first liquid is referred to as an organic solvent (E1)) and the organic solvent contained in the second liquid (hereinafter) E2) (hereinafter, the organic solvent contained in the second liquid may be referred to as an organic solvent (E2)).
作為眾所周知之有機溶劑,可列舉:甲基乙基酮、環己酮等酮類,甲苯、二甲苯、四甲基苯等芳香族烴類,溶纖劑、甲基溶纖劑、丁基溶纖劑、卡必醇、甲基卡必醇、丁基卡必醇、丙二醇單甲醚、二丙二醇單甲醚、二丙二醇二***、三丙二醇單甲醚等二醇醚類,乙酸乙酯、乙酸丁酯、乳酸丁酯、溶纖劑乙酸酯、丁基溶纖劑乙酸酯、卡必醇乙酸酯、丁基卡必醇乙酸酯、丙二醇單甲醚乙酸酯、二乙二醇單***乙酸酯、二丙二醇單甲醚乙酸酯、碳酸丙二酯等 酯類,辛烷、癸烷等脂肪族烴類,以及石油醚、石腦油等石油系溶劑等。Examples of the known organic solvent include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; cellosolve, methyl cellosolve, and butyl cellosolve. , carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether and other glycol ethers, ethyl acetate, acetic acid Ester, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether Acetate, dipropylene glycol monomethyl ether acetate, propylene carbonate, etc. An ester, an aliphatic hydrocarbon such as octane or decane, or a petroleum solvent such as petroleum ether or naphtha.
上述有機溶劑中,上述第一液必需含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑(E)之一部分。二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油中之至少一種為有機溶劑(E1)。In the above organic solvent, the first liquid must contain a solvent selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol monoethyl ether acetate, and has a boiling point of 150 ° C or higher and a distillation boiling point of 290 ° C. At least one of the group consisting of the following naphtha is part of the above organic solvent (E). At least one of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and naphtha having a boiling point of 150 ° C or higher and a distillation boiling point of 290 ° C or less is an organic solvent ( E1).
又,上述有機溶劑中,上述第二液含有選自由二乙二醇單***乙酸酯、二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少一種作為上述有機溶劑(E)之一部分。選自由二乙二醇單***乙酸酯、二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少一種為有機溶劑(E2)。Further, in the organic solvent, the second liquid contains a solvent selected from the group consisting of diethylene glycol monoethyl ether acetate and dipropylene glycol monomethyl ether, and has a boiling point of 150 ° C or higher and a distillation boiling point of 220. At least one of the group consisting of naphtha below °C is part of the above organic solvent (E). It is selected from the group consisting of diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, and naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or less. At least one is an organic solvent (E2).
藉由使上述有機溶劑(E1)、(E2)分別含於第一、第二液中,可使上述第一、第二液之混合性明顯變得良好。使用特定之上述有機溶劑(E1)、(E2),進而使特定之上述有機溶劑(E1)、(E2)分別含於第一液與第二液中非常有助於提高上述第一、第二液之混合性,抑制所混合之感光性組合物塗敷後之不均。By allowing the organic solvents (E1) and (E2) to be contained in the first and second liquids, respectively, the mixing property of the first and second liquids can be remarkably improved. The use of the specific organic solvents (E1) and (E2), and the specific use of the specific organic solvents (E1) and (E2) in the first liquid and the second liquid, respectively, contributes greatly to the improvement of the first and second The miscibility of the liquid suppresses unevenness after application of the photosensitive composition to be mixed.
上述「處於蒸餾性狀之初沸點」及上述「處於蒸餾性狀 之終沸點」係指藉由JIS K2254「石油製品-蒸餾試驗方法」測定所得之值。The above "in the initial boiling point of the distillation property" and the above "in the distillation property" The final boiling point refers to a value measured by JIS K2254 "Petroleum Products - Distillation Test Method".
上述第一液亦較佳為含有二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油中之至少一種作為上述有機溶劑(E)之一部分。於上述第一液含有二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油兩者作為上述有機溶劑(E)之一部分之情形時,上述第一液可含有氧化鈦,亦可不含有氧化鈦。The first liquid is preferably at least one of dipropylene glycol monomethyl ether and naphtha having a boiling point of 150 ° C or higher and a distillation boiling point of 220 ° C or lower as the organic solvent ( E) One part. The first liquid contains dipropylene glycol monomethyl ether, and naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or less as a part of the organic solvent (E). In this case, the first liquid may contain titanium oxide or may not contain titanium oxide.
上述第一液可含有二丙二醇單甲醚,亦可含有二乙二醇單***乙酸酯,亦可含有處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油,亦可含有處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油作為上述有機溶劑(E)之一部分。The first liquid may contain dipropylene glycol monomethyl ether, may also contain diethylene glycol monoethyl ether acetate, or may have a boiling point of 150 ° C or higher in the distillation property and a final boiling point of 290 ° C or less in the distillation property. The naphtha may also contain, as a part of the organic solvent (E), a naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or lower.
又,上述第二液可含有二乙二醇單***乙酸酯,亦可含有二丙二醇單甲醚,亦可含有處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油作為上述有機溶劑(E)之一部分。Further, the second liquid may contain diethylene glycol monoethyl ether acetate, may also contain dipropylene glycol monomethyl ether, or may have a boiling point of 150 ° C or higher in the distillation property and a boiling point of 220 ° C in the distillation property. The following naphtha is part of the above organic solvent (E).
上述感光性組合物含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少兩種。The photosensitive composition contains naphtha selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and a boiling point of 150 ° C or higher and a distillation boiling point of 290 ° C or lower. At least two of the group formed.
上述感光性組合物亦可含有二丙二醇單甲醚、二乙二醇 單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油三種。The above photosensitive composition may also contain dipropylene glycol monomethyl ether, diethylene glycol Monoethyl ether acetate and naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or lower.
就更加均勻地塗敷感光性組合物之觀點而言,上述感光性組合物較佳為至少含有二丙二醇單甲醚、及二乙二醇單***乙酸酯,或者至少含有二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油。The photosensitive composition preferably contains at least dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, or at least diethylene glycol alone, from the viewpoint of more uniformly applying the photosensitive composition. Ethyl acetate and naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or lower.
就更加均勻地塗敷感光性組合物之觀點而言,上述感光性組合物較佳為至少含有二丙二醇單甲醚、及二乙二醇單***乙酸酯。此時,上述感光性組合物亦可含有處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油。The photosensitive composition preferably contains at least dipropylene glycol monomethyl ether and diethylene glycol monoethyl ether acetate from the viewpoint of more uniformly applying the photosensitive composition. In this case, the photosensitive composition may contain naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or lower.
就更加均勻地塗敷感光性組合物之觀點而言,上述感光性組合物較佳為至少含有二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油。此時,上述第一液較佳為含有二丙二醇單甲醚。From the viewpoint of applying the photosensitive composition more uniformly, the photosensitive composition preferably contains at least diethylene glycol monoethyl ether acetate, and has a boiling point of 150 ° C or higher and a distillation property. The naphtha with a final boiling point of 290 ° C or less. In this case, the first liquid preferably contains dipropylene glycol monomethyl ether.
就更加均勻地塗敷感光性組合物之觀點而言,上述感光性組合物較佳為至少含有二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油。此時,上述第一液亦可含有二乙二醇單***乙酸酯。In view of applying the photosensitive composition more uniformly, the photosensitive composition preferably contains at least dipropylene glycol monomethyl ether, and has a boiling point of 150 ° C or higher at the initial boiling point and a final boiling point of the distillation property. Naphtha below 290 °C. In this case, the first liquid may also contain diethylene glycol monoethyl ether acetate.
就更加均勻地塗敷感光性組合物之觀點而言,上述感光性組合物中之處於蒸餾性狀之初沸點為150℃以上、處於蒸 餾性狀之終沸點為290℃以下的石腦油較佳為處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油。From the viewpoint of applying the photosensitive composition more uniformly, the photosensitive composition has a boiling point of at least 150 ° C in the form of a distillation property and is steamed. The naphtha having a final boiling point of 290 ° C or less is preferably a naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or lower.
上述第一液較佳為含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑(E)之一部分。此時,可進一步提高上述第一、第二液之混合性,且可更加均勻地塗敷感光性組合物。Preferably, the first liquid contains a stone selected from the group consisting of dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and a boiling point of 150 ° C or higher and a distillation boiling point of 290 ° C or lower. At least two of the groups consisting of brain oil are part of the above organic solvent (E). In this case, the miscibility of the first and second liquids can be further improved, and the photosensitive composition can be applied more uniformly.
上述第一液亦可含有二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油三種作為上述有機溶劑(E)之一部分。The first liquid may further contain dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, and naphtha having a boiling point of 150 ° C or higher and a distillation boiling point of 290 ° C or lower. As a part of the above organic solvent (E).
上述第一液較佳為至少含有二丙二醇單甲醚、及二乙二醇單***乙酸酯,或至少含有二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油作為上述有機溶劑(E)之一部分。此時,可進一步提高上述第一、第二液之混合性,且可更加均勻地塗敷感光性組合物。Preferably, the first liquid contains at least dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetate, or at least diethylene glycol monoethyl ether acetate, and has a boiling point of 150 ° C or higher. The naphtha having a boiling point of 290 ° C or less at the end of the distillation property is a part of the organic solvent (E). In this case, the miscibility of the first and second liquids can be further improved, and the photosensitive composition can be applied more uniformly.
就進一步提高上述第一、第二液之混合性,且更加均勻地塗敷感光性組合物之觀點而言,上述第一液較佳為至少含有二丙二醇單甲醚、二乙二醇單***乙酸酯作為上述有機溶劑(E)之一部分。此時,上述第一液亦可含有處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為 290℃以下的石腦油。The first liquid preferably contains at least dipropylene glycol monomethyl ether and diethylene glycol monoethyl ether from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. Acetate is part of the above organic solvent (E). In this case, the first liquid may also contain a boiling point of 150 ° C or higher at the beginning of the distillation property, and the final boiling point of the distillation property is Naphtha below 290 °C.
就進一步提高上述第一、第二液之混合性,且更加均勻地塗敷感光性組合物之觀點而言,上述第一液較佳為至少含有二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油作為上述有機溶劑(E)之一部分。此時,上述第一液較佳為含有二丙二醇單甲醚。The first liquid preferably contains at least diethylene glycol monoethyl ether acetate from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. The naphtha having an initial boiling point of the distillation property of 150 ° C or higher and a boiling point of 290 ° C or less is a part of the organic solvent (E). In this case, the first liquid preferably contains dipropylene glycol monomethyl ether.
就進一步提高上述第一、第二液之混合性,且更加均勻地塗敷感光性組合物之觀點而言,上述第一液較佳為至少含有二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油作為上述有機溶劑(E)之一部分。此時,上述第一液亦可含有二乙二醇單***乙酸酯。The first liquid preferably contains at least dipropylene glycol monomethyl ether and is at the beginning of distillation characteristics from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. The naphtha having a boiling point of 150 ° C or higher and a boiling point of 290 ° C or lower is a part of the organic solvent (E). In this case, the first liquid may also contain diethylene glycol monoethyl ether acetate.
就進一步提高上述第一、第二液之混合性,且更加均勻地塗敷感光性組合物之觀點而言,上述感光性組合物較佳為含有選自由二丙二醇單甲醚、二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑,且上述第一液中之處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為290℃以下的石腦油較佳為處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油。The photosensitive composition preferably contains a selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol, from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. At least two of the group consisting of monoethyl ether acetate and a group of naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or less at the end of the distillation property are used as the organic solvent, and the first The naphtha in the liquid having a boiling point of 150 ° C or higher and having a boiling point of 290 ° C or less is preferably at a boiling point of 150 ° C or higher at the beginning of the distillation property and 220 at a final boiling point of the distillation property. Naphtha below °C.
上述第一液亦可不含二乙二醇單***乙酸酯。The first liquid may also be free of diethylene glycol monoethyl ether acetate.
上述第二液亦可含有選自由二丙二醇單甲醚、二乙二醇 單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油所組成之群中之至少兩種作為上述有機溶劑(E)之一部分。The second liquid may also contain a solvent selected from the group consisting of dipropylene glycol monomethyl ether and diethylene glycol. At least two of the group consisting of monoethyl ether acetate and naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or less at the end of the distillation property are part of the organic solvent (E). .
上述第二液亦可含有二乙二醇單***乙酸酯、二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油三種作為上述有機溶劑(E)之一部分。The second liquid may further comprise diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, and naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or less. As a part of the above organic solvent (E).
就進一步提高上述第一、第二液之混合性,且更加均勻地塗敷感光性組合物之觀點而言,上述第二液較佳為至少含有二乙二醇單***乙酸酯、及二丙二醇單甲醚作為上述有機溶劑(E)之一部分。此時,上述第二液亦可含有處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油。In view of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly, the second liquid preferably contains at least diethylene glycol monoethyl ether acetate, and Propylene glycol monomethyl ether is part of the above organic solvent (E). In this case, the second liquid may contain naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or lower.
就進一步提高上述第一、第二液之混合性,且更加均勻地塗敷感光性組合物之觀點而言,上述第二液較佳為至少含有二乙二醇單***乙酸酯、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油作為上述有機溶劑(E)之一部分。此時,上述第二液較佳為含有二丙二醇單甲醚。The second liquid preferably contains at least diethylene glycol monoethyl ether acetate from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. The naphtha having an initial boiling point of the distillation property of 150 ° C or higher and a boiling point of 220 ° C or less is a part of the organic solvent (E). In this case, the second liquid preferably contains dipropylene glycol monomethyl ether.
就進一步提高上述第一、第二液之混合性,且更加均勻地塗敷感光性組合物之觀點而言,上述第二液較佳為至少含有二丙二醇單甲醚、及處於蒸餾性狀之初沸點為150℃以上、處於蒸餾性狀之終沸點為220℃以下的石腦油作為上述有機溶劑(E)之一部分。此時,上述第二液亦可含有二乙二 醇單***乙酸酯。The second liquid preferably contains at least dipropylene glycol monomethyl ether and is at the beginning of distillation characteristics from the viewpoint of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly. A naphtha having a boiling point of 150 ° C or higher and a boiling point of 220 ° C or lower is a part of the organic solvent (E). At this time, the second liquid may also contain diethyl Alcohol monoethyl ether acetate.
上述第二液亦可不含二乙二醇單***乙酸酯。The second liquid may also be free of diethylene glycol monoethyl ether acetate.
有機溶劑(E)之含量並無特別限定。考慮到感光性組合物之塗敷性,有機溶劑(E)可以適當之含量使用。混合後之感光性組合物100重量%中,上述有機溶劑(E)之總含量(上述有機溶劑(E1)與上述有機溶劑(E2)之合計含量)較佳為10重量%以上,更佳為15重量%以上,較佳為60重量%以下,更佳為50重量%以下。The content of the organic solvent (E) is not particularly limited. The organic solvent (E) can be used in an appropriate amount in view of the coatability of the photosensitive composition. In 100% by weight of the photosensitive composition after mixing, the total content of the organic solvent (E) (the total content of the organic solvent (E1) and the organic solvent (E2)) is preferably 10% by weight or more, and more preferably 15% by weight or more, preferably 60% by weight or less, more preferably 50% by weight or less.
就使上述第一、第二液之混合性更加良好,且更加均勻地塗敷感光性組合物之觀點而言,在二液混合型之第一、第二液整體中,包含於上述第一液中之有機溶劑(E1)之含量與包含於上述第二液中之有機溶劑(E2)之含量以重量比計較佳為1:99~99:1,更佳為1:9~9:1,進而更佳為2:8~8:2,特佳為3:7~7:3。換言之,於混合後之感光性組合物中,包含於該感光性組合物中之上述有機溶劑(E)之總含量100重量%中,包含於上述第一液中之有機溶劑(E1)之含量與包含於上述第二液中之上述有機溶劑(E2)之含量以重量比計較佳為1:99~99:1,更佳為1:9~9:1,進而更佳為2:8~8:2,特佳為3:7~7:3。In view of further improving the miscibility of the first and second liquids and applying the photosensitive composition more uniformly, the first and second liquids of the two-liquid mixing type are included in the first The content of the organic solvent (E1) in the liquid and the content of the organic solvent (E2) contained in the second liquid are preferably from 1:99 to 99:1, more preferably from 1:9 to 9:1 by weight. More preferably, it is 2:8~8:2, and the best is 3:7~7:3. In other words, in the photosensitive composition after mixing, the content of the organic solvent (E1) contained in the first liquid is 100% by weight based on the total content of the organic solvent (E) contained in the photosensitive composition. The content of the organic solvent (E2) contained in the second liquid is preferably 1:99 to 99:1, more preferably 1:9 to 9:1, and still more preferably 2:8 by weight. 8:2, especially good for 3:7~7:3.
二液混合型之第一、第二液整體100重量%中及混合後之感光性組合物100重量%中,二乙二醇單***乙酸酯之含量亦可為30重量%以上。上述第一液100重量%中,二乙二醇單***乙酸酯之含量可為50重量%以下,亦可為55重量%以上。The content of diethylene glycol monoethyl ether acetate may be 30% by weight or more in 100% by weight of the first and second liquids of the two-liquid mixing type and 100% by weight of the photosensitive composition after mixing. The content of diethylene glycol monoethyl ether acetate in 100% by weight of the first liquid may be 50% by weight or less, or may be 55% by weight or more.
於上述第一液含有兩種有機溶劑之情形、以及上述第二液含有兩種有機溶劑之情形時,在上述第一液及上述第二液中,含量較多一方之有機溶劑之含量與含量較少一方之有機溶劑之含量以重量比計較佳為1:99~99:1,更佳為1:9~9:1,進而更佳為2:8~8:2,特佳為3:7~7:3。In the case where the first liquid contains two kinds of organic solvents, and when the second liquid contains two organic solvents, the content and content of the organic solvent having a larger content in the first liquid and the second liquid The content of the organic solvent of the lesser side is preferably from 1:99 to 99:1, more preferably from 1:9 to 9:1, still more preferably from 2:8 to 8:2, and particularly preferably from 3: 7~7:3.
於上述第一液含有三種有機溶劑之情形、以及上述第二液含有三種有機溶劑之情形時,在上述第一液及上述第二液中,含量最多之有機溶劑之含量與含量其次之有機溶劑之含量以重量比計較佳為1:99~99:1,更佳為1:9~9:1,進而更佳為2:8~8:2,特佳為3:7~7:3。此時,含量最少之有機溶劑之含量的下限並無特別限定。In the case where the first liquid contains three kinds of organic solvents, and the second liquid contains three kinds of organic solvents, the content of the organic solvent having the highest content in the first liquid and the second liquid is the next organic solvent. The content is preferably from 1:99 to 99:1, more preferably from 1:9 to 9:1, more preferably from 2:8 to 8:2, and particularly preferably from 3:7 to 7:3. At this time, the lower limit of the content of the organic solvent having the lowest content is not particularly limited.
為進一步提高硬化性,上述感光性組合物較佳為含有聚合性單體作為與具有羧基之聚合性聚合物(A)不同之成分。上述感光性組合物較佳為含有具有羧基之聚合性聚合物(A)與聚合性單體兩者。上述聚合性單體具有聚合性,可進行聚合。上述聚合性單體並無特別限定。上述聚合性單體可僅使用一種,亦可併用兩種以上。In order to further improve the curability, the photosensitive composition preferably contains a polymerizable monomer as a component different from the polymerizable polymer (A) having a carboxyl group. The photosensitive composition preferably contains both a polymerizable polymer (A) having a carboxyl group and a polymerizable monomer. The above polymerizable monomer has polymerizability and can be polymerized. The polymerizable monomer is not particularly limited. These polymerizable monomers may be used alone or in combination of two or more.
上述聚合性單體較佳為含聚合性不飽和基之單體。作為上述聚合性單體中之聚合性不飽和基,例如可列舉(甲基)丙烯醯基及乙烯醚基等具有聚合性不飽和雙鍵之官能基。其中,為了能夠提高光阻膜之交聯密度,較佳為(甲基)丙烯醯基。The polymerizable monomer is preferably a monomer having a polymerizable unsaturated group. The polymerizable unsaturated group in the above-mentioned polymerizable monomer is, for example, a functional group having a polymerizable unsaturated double bond such as a (meth)acryl fluorenyl group or a vinyl ether group. Among them, in order to increase the crosslinking density of the photoresist film, a (meth)acryl fluorenyl group is preferred.
上述含有聚合性不飽和基之單體較佳為具有(甲基)丙烯 醯基之化合物。作為上述具有(甲基)丙烯醯基之化合物,可列舉:乙二醇、甲氧基四乙二醇、聚乙二醇或丙二醇等二醇之二(甲基)丙烯酸酯改質物,或者多元醇、多元醇之環氧乙烷加成物或多元醇之環氧丙烷加成物的多元(甲基)丙烯酸酯改質物,或者苯酚、苯酚之環氧乙烷加成物或苯酚之環氧丙烷加成物的(甲基)丙烯酸酯改質物,或者甘油二縮水甘油醚或三羥甲基丙烷三縮水甘油醚等縮水甘油醚之(甲基)丙烯酸酯改質物,或者三聚氰胺(甲基)丙烯酸酯。The above monomer having a polymerizable unsaturated group preferably has (meth) propylene. a compound of thiol. Examples of the compound having a (meth)acryl fluorenyl group include a di(meth)acrylate modified product of a glycol such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol or propylene glycol, or a plurality of compounds. a poly (meth) acrylate modification of an oxirane adduct of an alcohol, a polyol, or a propylene oxide adduct of a polyol, or an oxirane of phenol, phenol, or an epoxy of phenol a (meth) acrylate modification of a propane adduct, or a (meth) acrylate modification of a glycidyl ether such as glycerol diglycidyl ether or trimethylolpropane triglycidyl ether, or melamine (methyl) Acrylate.
作為上述多元醇,例如可列舉:己二醇、三羥甲基丙烷、季戊四醇、二季戊四醇及三-羥乙基異氰尿酸酯。作為上述苯酚之(甲基)丙烯酸酯,例如可列舉苯氧基(甲基)丙烯酸酯及雙酚A之二(甲基)丙烯酸酯改質物。Examples of the polyhydric alcohol include hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, and tris-hydroxyethyl isocyanurate. Examples of the (meth) acrylate of the phenol include a phenoxy (meth) acrylate and a bisphenol A bis(meth) acrylate modified product.
「(甲基)丙烯醯基」係指丙烯醯基與甲基丙烯醯基。「(甲基)丙烯酸」係指丙烯酸與甲基丙烯酸。「(甲基)丙烯酸酯」係指丙烯酸酯與甲基丙烯酸酯。"(Meth)acryloyl fluorenyl" means propylene fluorenyl and methacryl fluorenyl. "(Meth)acrylic acid" means acrylic acid and methacrylic acid. "(Meth)acrylate" means acrylate and methacrylate.
於含有上述聚合性單體之情形時,該聚合性單體與上述具有羧基之聚合性聚合物(A)之合計100重量%中,上述聚合性單體之含量較佳為5重量%以上,較佳為50重量%以下。若上述聚合性單體之含量為上述下限以上及上述上限以下,則可使感光性組合物充分硬化。進而,光阻膜之交聯密度達到適度,可獲得充分之解析度,且光阻膜變得難以發生黃變。In the case where the polymerizable monomer is contained, the content of the polymerizable monomer is preferably 5% by weight or more based on 100% by weight of the total of the polymerizable polymer (A) having a carboxyl group. It is preferably 50% by weight or less. When the content of the polymerizable monomer is at least the above lower limit and not more than the above upper limit, the photosensitive composition can be sufficiently cured. Further, the crosslinking density of the photoresist film is moderate, and sufficient resolution can be obtained, and the photoresist film becomes less likely to yellow.
為降低曝露於高溫時阻焊劑膜發生黃變之虞,上述感光性組合物較佳為含有抗氧化劑。上述抗氧化劑較佳為具有 路易斯鹼性部位。就進一步抑制光阻膜之黃變之觀點而言,上述抗氧化劑較佳為選自由酚系抗氧化劑、磷系抗氧化劑及胺系抗氧化劑所組成之群中之至少一種。就進一步抑制光阻膜之黃變之觀點而言,上述抗氧化劑較佳為酚系抗氧化劑。即,上述感光性組合物較佳為含有酚系抗氧化劑。In order to reduce yellowing of the solder resist film when exposed to high temperatures, the photosensitive composition preferably contains an antioxidant. The above antioxidant preferably has Lewis alkaline part. The antioxidant is preferably at least one selected from the group consisting of a phenolic antioxidant, a phosphorus antioxidant, and an amine antioxidant, from the viewpoint of further suppressing yellowing of the photoresist film. The antioxidant is preferably a phenolic antioxidant from the viewpoint of further suppressing yellowing of the photoresist film. That is, the photosensitive composition preferably contains a phenolic antioxidant.
作為上述酚系抗氧化劑之市售品,可列舉:IRGANOX 1010、IRGANOX 1035、IRGANOX 1076、IRGANOX 1135、IRGANOX 245、IRGANOX 259、及IRGANOX 295(以上均為Ciba Japan公司製造)、Adekastab AO-30、Adekastab AO 40、Adekastab AO-50、Adekastab AO-60、Adekastab AO-70、Adekastab AO-80、Adekastab AO-90、及Adekastab AO-330(以上均為ADEKA公司製造)、Sumilizer GA-80、Sumilizer MDP-S、Sumilizer BBM-S、Sumilizer GM、Sumilizer GS(F)、及Sumilizer GP(以上均為住友化學工業公司製造)、HOSTANOX O10、HOSTANOX O16、HOSTANOX O14、及HOSTANOX O3(以上均為Clariant公司製造)、Antage BHT、Antage W-300、Antage W-400、及Antage W-500(以上均為川口化學工業公司製造)、以及SEENOX 224M、及SEENOX 326M(以上均為Shipro Kasei公司製造)等。As a commercial item of the phenolic antioxidant, IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135, IRGANOX 245, IRGANOX 259, and IRGANOX 295 (all of which are manufactured by Ciba Japan Co., Ltd.), Adekastab AO-30, Adekastab AO 40, Adekastab AO-50, Adekastab AO-60, Adekastab AO-70, Adekastab AO-80, Adekastab AO-90, and Adekastab AO-330 (all manufactured by ADEKA), Sumilizer GA-80, Sumilizer MDP -S, Sumilizer BBM-S, Sumilizer GM, Sumilizer GS (F), and Sumilizer GP (all manufactured by Sumitomo Chemical Industries, Ltd.), HOSTANOX O10, HOSTANOX O16, HOSTANOX O14, and HOSTANOX O3 (all of which are manufactured by Clariant) ), Antage BHT, Antage W-300, Antage W-400, and Antage W-500 (all of which are manufactured by Kawaguchi Chemical Industry Co., Ltd.), and SEENOX 224M and SEENOX 326M (all of which are manufactured by Shipro Kasei Co., Ltd.).
作為上述磷系抗氧化劑,可列舉環己基膦及三苯基膦等。作為上述磷系抗氧化劑之市售品,可列舉:Adekastab PEP-4C、Adekastab PEP-8、Adekastab PEP-24G、Adekastab PEP-36、Adekastab HP-10、Adekastab 2112、Adekastab 260、Adekastab 522A、Adekastab 1178、Adekastab 1500、Adekastab C、Adekastab 135A、Adekastab 3010、及Adekastab TPP(以上均為ADEKA公司製造)、Sandostab P-EPQ、及Hostanox PAR24(以上均為Clariant公司製造)、以及JP-312L、JP-318-0、JPM-308、JPM-313、JPP-613M、JPP-31、JPP-2000PT、及JPH-3800(以上均為城北化學工業公司製造)等。Examples of the phosphorus-based antioxidant include cyclohexylphosphine and triphenylphosphine. Commercial products of the above phosphorus-based antioxidants include Adekastab PEP-4C, Adekastab PEP-8, Adekastab PEP-24G, and Adekastab. PEP-36, Adekastab HP-10, Adekastab 2112, Adekastab 260, Adekastab 522A, Adekastab 1178, Adekastab 1500, Adekastab C, Adekastab 135A, Adekastab 3010, and Adekastab TPP (all manufactured by ADEKA), Sandostab P-EPQ, And Hostanox PAR24 (all of which are manufactured by Clariant), and JP-312L, JP-318-0, JPM-308, JPM-313, JPP-613M, JPP-31, JPP-2000PT, and JPH-3800 (all of the above) For the manufacture of Chengbei Chemical Industry Co., Ltd.).
作為上述胺系抗氧化劑,可列舉:三乙胺、雙氰胺、三聚氰胺、乙基二胺基-均三、2,4-二胺基-均三、2,4-二胺基-6-甲苯基-均三、2,4-二胺基-6-二甲苯基-均三及四級銨鹽衍生物等。Examples of the amine-based antioxidant include triethylamine, dicyandiamide, melamine, and ethyldiamine-all three. 2,4-diamino--three , 2,4-diamino-6-tolyl-all three 2,4-diamino-6-dimethylphenyl-all three And quaternary ammonium salt derivatives and the like.
相對於上述具有羧基之聚合性聚合物(A)100重量份,上述抗氧化劑之含量較佳為0.1重量份以上,更佳為5重量份以上,較佳為30重量份以下,更佳為15重量份以下。若上述抗氧化劑之含量為上述下限以上及上限以下,則可形成耐熱黃變性更加優異之光阻膜。The content of the antioxidant is preferably 0.1 part by weight or more, more preferably 5 parts by weight or more, more preferably 30 parts by weight or less, and even more preferably 15 parts by weight based on 100 parts by weight of the polymerizable polymer (A) having a carboxyl group. Parts by weight or less. When the content of the antioxidant is not less than the above lower limit and not more than the upper limit, a photoresist film having more excellent heat yellowing resistance can be formed.
又,上述感光性組合物亦可含有著色劑、填充劑、消泡劑、硬化劑、硬化加速劑、脫模劑、表面處理劑、阻燃劑、黏度調節劑、分散劑、分散助劑、表面改質劑、塑化劑、抗菌劑、防黴劑、調平劑、穩定劑、偶合劑、防流掛劑或螢光體等。Further, the photosensitive composition may further contain a coloring agent, a filler, an antifoaming agent, a hardening agent, a hardening accelerator, a releasing agent, a surface treating agent, a flame retardant, a viscosity adjusting agent, a dispersing agent, a dispersing aid, Surface modifiers, plasticizers, antibacterial agents, antifungal agents, leveling agents, stabilizers, coupling agents, anti-sagging agents or phosphors.
上述感光性組合物例如可藉由在攪拌混合各調配成分之後,利用三輥研磨機均勻地混合而製備。The photosensitive composition can be prepared, for example, by uniformly mixing the respective components after stirring and mixing, and then uniformly mixing them by a three-roll mill.
作為用以使上述感光性組合物硬化之光源,可列舉發出紫外線或可見光線等活性能量射線之照射裝置。作為上述光源,例如可列舉:超高壓水銀燈、Deep UV燈(Deep Ultraviolet lamp,深紫外線燈)、高壓水銀燈、低壓水銀燈、金屬鹵化物燈及準分子雷射器。該等光源可根據感光性組合物之構成成分的感光波長進行適當選擇。光之照射能量可根據所需膜厚或感光性組合物之構成成分進行適當選擇。光之照射能量一般在10~3000 mJ/cm2 之範圍內。Examples of the light source for curing the photosensitive composition include an irradiation device that emits an active energy ray such as ultraviolet rays or visible rays. Examples of the light source include an ultrahigh pressure mercury lamp, a Deep UV lamp (Deep Ultraviolet lamp), a high pressure mercury lamp, a low pressure mercury lamp, a metal halide lamp, and an excimer laser. These light sources can be appropriately selected depending on the light-sensing wavelength of the constituent components of the photosensitive composition. The irradiation energy of light can be appropriately selected depending on the desired film thickness or the constituent components of the photosensitive composition. The light irradiation energy is generally in the range of 10 to 3000 mJ/cm 2 .
本發明之二液混合型之第一、第二液適宜用於形成LED裝置之光阻膜,更適宜用於形成阻焊劑膜。本發明之二液混合型之第一、第二液較佳為光阻組合物,更佳為阻焊劑組合物。The first liquid and the second liquid of the two-liquid mixing type of the present invention are suitably used for forming a photoresist film of an LED device, and are more suitable for forming a solder resist film. The first and second liquids of the two-liquid mixing type of the present invention are preferably a photoresist composition, more preferably a solder resist composition.
本發明之印刷佈線板之製造方法係如下印刷佈線板之製造方法,該印刷佈線板包含表面具有電路之印刷佈線板本體、及積層於該印刷佈線板本體之設置有上述電路之表面的光阻膜。該光阻膜係藉由本發明之二液混合型之第一、第二液所形成。A method of manufacturing a printed wiring board according to the present invention is a method of manufacturing a printed wiring board comprising a printed wiring board body having a circuit on a surface thereof, and a photoresist laminated on a surface of the printed wiring board main body on which the circuit is provided membrane. The photoresist film is formed by the first liquid and the second liquid of the two-liquid mixing type of the present invention.
圖1係模式地表示包含阻焊劑膜之LED裝置之一例的部分切缺正面剖面圖,該阻焊劑膜係使用本發明之一實施形態的二液混合型之第一、第二液而形成。Fig. 1 is a partially cutaway front cross-sectional view schematically showing an example of an LED device including a solder resist film formed by using a two-liquid mixing type first and second liquid according to an embodiment of the present invention.
於如圖1所示之LED裝置1中,於基板2之上表面2a積層有光阻膜3,該光阻膜3係藉由二液混合型之第一、第二液所形成。光阻膜3為圖案膜。因此,基板2之上表面2a之一部 分區域中未形成有光阻膜3。於未形成有光阻膜3之部分的基板2之上表面2a上設置有電極4a、4b。基板2較佳為印刷佈線板本體。In the LED device 1 shown in FIG. 1, a photoresist film 3 is formed on the upper surface 2a of the substrate 2, and the photoresist film 3 is formed by a first liquid and a second liquid of a two-liquid mixing type. The photoresist film 3 is a pattern film. Therefore, one part of the upper surface 2a of the substrate 2 The photoresist film 3 is not formed in the sub-region. Electrodes 4a, 4b are provided on the upper surface 2a of the substrate 2 where the photoresist film 3 is not formed. The substrate 2 is preferably a printed wiring board body.
於光阻膜3之上表面3a上積層有LED晶片7。LED晶片7介隔光阻膜3而積層於基板2上。於LED晶片7之下表面7a之外周緣設置有端子8a、8b。藉由焊錫9a、9b,使端子8a、8b電性連接於電極4a、4b。藉由該電性連接,可向LED晶片7供給電力。An LED wafer 7 is laminated on the upper surface 3a of the photoresist film 3. The LED chip 7 is laminated on the substrate 2 via the photoresist film 3. Terminals 8a, 8b are provided on the outer periphery of the lower surface 7a of the LED wafer 7. The terminals 8a and 8b are electrically connected to the electrodes 4a and 4b by the solders 9a and 9b. By this electrical connection, electric power can be supplied to the LED chip 7.
以下藉由列舉本發明之具體的實施例及比較例,令本發明簡明易懂。本發明不限定於以下實施例。The invention will be readily understood by the following detailed description of the preferred embodiments and comparative examples. The invention is not limited to the following examples.
1)丙烯酸系聚合物1(具有羧基之聚合性聚合物,藉由下述合成例1所得之丙烯酸系聚合物1)1) Acrylic polymer 1 (polymerizable polymer having a carboxyl group, the acrylic polymer 1 obtained in Synthesis Example 1 below)
向具有溫度計、攪拌機、滴液漏斗及回流冷凝器之燒瓶內加入作為溶劑之乙基卡必醇乙酸酯、及作為觸媒之偶氮二異丁腈,於氮氣環境下加熱至80℃,花兩小時滴加以莫耳比30:70混合甲基丙烯酸與甲基丙烯酸甲酯所得之單體。滴加之後,攪拌一小時,升溫至120℃。其後,將其冷卻。以相對於所得樹脂之全部單體單元之總莫耳量之莫耳比成為10的量添加丙烯酸縮水甘油酯,使用溴化四丁基銨作為觸媒,於100℃下加熱30小時,使丙烯酸縮水甘油酯與羧基進行加成反應。冷卻後,自燒瓶取出,得到含有固形物成分酸值為60 mg KOH/g、重量平均分子量為15000、雙 鍵當量為1000之含羧基樹脂50重量%(不揮發分)之溶液。以下將該溶液稱作丙烯酸系聚合物1。To a flask equipped with a thermometer, a stirrer, a dropping funnel and a reflux condenser, ethyl carbitol acetate as a solvent and azobisisobutyronitrile as a catalyst were heated and heated to 80 ° C under a nitrogen atmosphere. The monomer obtained by mixing methacrylic acid with methyl methacrylate at a molar ratio of 30:70 was added over two hours. After the dropwise addition, the mixture was stirred for one hour and heated to 120 °C. Thereafter, it is cooled. Glycidyl acrylate was added in an amount of 10 with respect to the total molar amount of all the monomer units of the obtained resin, and tetrabutylammonium bromide was used as a catalyst, and heated at 100 ° C for 30 hours to obtain acrylic acid. The glycidyl ester is subjected to an addition reaction with a carboxyl group. After cooling, it was taken out from the flask to obtain an acid value of 60 mg KOH/g and a weight average molecular weight of 15,000. A solution of 50% by weight (nonvolatile) of a carboxyl group-containing resin having a bond equivalent of 1000. Hereinafter, this solution is referred to as an acrylic polymer 1.
2)丙烯酸系聚合物2(具有羧基之聚合性聚合物,藉由下述合成例2所得之丙烯酸系聚合物2)2) Acrylic polymer 2 (polymerizable polymer having a carboxyl group, the acrylic polymer 2 obtained in Synthesis Example 2 below)
於乙基卡必醇乙酸酯139重量份中,使用作為觸媒之二甲基苄胺0.5重量份、及作為聚合抑制劑之對苯二酚0.1重量份,使環氧當量為210、軟化點為80℃之甲酚酚醛清漆型環氧樹脂(「Epotohto YDCN-704」,新日鐵化學公司製造)210重量份與丙烯酸50重量份及乙酸18重量份反應,獲得環氧丙烯酸酯。使所得之環氧丙烯酸酯278重量份與四氫鄰苯二甲酸酐46重量份(相對於環氧丙烯酸酯之羥基1.0莫耳,為0.3莫耳)反應,得到含有固形物成分酸值為52 mg KOH/g之具有芳香環之含羧基樹脂65重量%(不揮發分)的溶液。以下將該溶液稱作丙烯酸系聚合物2。In 139 parts by weight of ethyl carbitol acetate, 0.5 parts by weight of dimethylbenzylamine as a catalyst and 0.1 parts by weight of hydroquinone as a polymerization inhibitor were used to have an epoxy equivalent of 210 and softened. 210 parts by weight of a cresol novolac type epoxy resin ("Epotohto YDCN-704", manufactured by Nippon Steel Chemical Co., Ltd.) at 80 ° C was reacted with 50 parts by weight of acrylic acid and 18 parts by weight of acetic acid to obtain an epoxy acrylate. 278 parts by weight of the obtained epoxy acrylate was reacted with 46 parts by weight of tetrahydrophthalic anhydride (1.0 mol per hydroxy group of epoxy acrylate) to obtain an acid value of 52 containing a solid component. A solution of 65 wt% (nonvolatile) of a carboxyl group-containing resin having an aromatic ring of mg KOH/g. Hereinafter, this solution is referred to as an acrylic polymer 2.
3)DPHA(丙烯酸系單體,二季戊四醇六丙烯酸酯,比重1.1)3) DPHA (acrylic monomer, dipentaerythritol hexaacrylate, specific gravity 1.1)
4)TMPTA(丙烯酸系單體,三羥甲基丙烷三丙烯酸酯,比重1.1)4) TMPTA (acrylic monomer, trimethylolpropane triacrylate, specific gravity 1.1)
5)TPO(光自由基產生劑即光聚合起始劑,BASF Japan公司製造)5) TPO (photopolymerization initiator, photopolymerization initiator, manufactured by BASF Japan)
6)Irgacure 819(光自由基產生劑即光聚合起始劑,BASF Japan公司製造)6) Irgacure 819 (photopolymerization initiator, photopolymerization initiator, manufactured by BASF Japan)
7)828(雙酚A型環氧樹脂,三菱化學公司製造,比重1.2)7) 828 (bisphenol A type epoxy resin, manufactured by Mitsubishi Chemical Corporation, specific gravity 1.2)
8)806(雙酚F型環氧樹脂,三菱化學公司製造,比重1.2)8) 806 (bisphenol F type epoxy resin, manufactured by Mitsubishi Chemical Corporation, specific gravity 1.2)
9)CR-50(氧化鈦,石原產業公司製造,藉由氯化法所製造之金紅石型氧化鈦)9) CR-50 (titanium oxide, manufactured by Ishihara Sangyo Co., Ltd., rutile-type titanium oxide produced by the chlorination method)
10)R-830(氧化鈦,石原產業公司製造,藉由硫酸法所製造之金紅石型氧化鈦)10) R-830 (titanium oxide, manufactured by Ishihara Sangyo Co., Ltd., rutile-type titanium oxide produced by sulfuric acid method)
11)乙基卡必醇乙酸酯(二乙二醇單***乙酸酯,Daicel Chemical公司製造,偶極矩1 Debye(德拜)以上,比重1.0)11) Ethyl carbitol acetate (diethylene glycol monoethyl ether acetate, manufactured by Daicel Chemical Co., Ltd., dipole moment 1 Debye (above), specific gravity 1.0)
12)Solvesso 150(石腦油,Exxon Mobil公司製造,處於蒸餾性狀之初沸點189℃、處於蒸餾性狀之終沸點210℃)12) Solvesso 150 (naphtha, manufactured by Exxon Mobil, at a boiling point of 189 ° C at the beginning of the distillation trait and 210 ° C at the final boiling point of the distillation trait)
13)Solvesso 100(石腦油,Exxon Mobil公司製造,處於蒸餾性狀之初沸點165℃、處於蒸餾性狀之終沸點174℃)13) Solvesso 100 (naphtha, manufactured by Exxon Mobil, at a boiling point of 165 ° C at the beginning of the distillation, and at a final boiling point of 174 ° C in the form of a distillation)
14)二丙二醇單甲醚(日本乳化劑公司製造);14) Dipropylene glycol monomethyl ether (manufactured by Nippon Emulsifier Co., Ltd.);
15)二丙二醇二甲醚(日本乳化劑公司製造)15) Dipropylene glycol dimethyl ether (manufactured by Japan Emulsifier Co., Ltd.)
16)二乙二醇二***(日本乳化劑公司製造)16) Diethylene glycol diethyl ether (manufactured by Japan Emulsifier)
17)Solvesso 200(石腦油,Exxon Mobil公司製造,處於蒸餾性狀之初沸點230℃、處於蒸餾性狀之終沸點283℃)17) Solvesso 200 (naphtha, manufactured by Exxon Mobil, at a boiling point of 230 ° C at the beginning of the distillation trait and at a final boiling point of 283 ° C in the form of distillation)
18)甲苯(Exxon Mobil公司製造)。18) Toluene (manufactured by Exxon Mobil Co., Ltd.).
調配由合成例1所得之丙烯酸系聚合物1、DPHA(二季戊四醇六丙烯酸酯)5 g、TPO(光自由基產生劑即光聚合起始劑,BASF Japan公司製造)2 g、CR-50(氧化鈦,石原產業公司製造)40 g、及Solvesso 150(石腦油,Exxon Mobil公司製造)25 g,於混合機(練太郎SP-500,Thinky公司製造)中混合3分鐘之後,在三輥研磨機中混合,得到混合物。其後, 使用SP-500,對所得之混合物進行3分鐘消泡處理,藉此得到第一液。The acrylic polymer 1 obtained by the synthesis example 1, 5 g of DPHA (dipentaerythritol hexaacrylate), TPO (photopolymerization initiator which is a photo-radical generator, the BASF Japan company) 2 g, CR-50 ( Titanium oxide, manufactured by Ishihara Sangyo Co., Ltd.) 40 g, and Solvesso 150 (naphtha, manufactured by Exxon Mobil Co., Ltd.) 25 g, mixed in a mixer (Kyotaro SP-500, manufactured by Thinky Co., Ltd.) for 3 minutes, in three rolls Mix in a grinder to obtain a mixture. Thereafter, The resulting mixture was subjected to defoaming treatment for 3 minutes using SP-500, whereby a first liquid was obtained.
調配828(雙酚A型環氧樹脂,三菱化學公司製造)8 g、及乙基卡必醇乙酸酯(二乙二醇單***乙酸酯,Daicel Chemical公司製造)5 g,於混合機(練太郎SP-500,Thinky公司製造)中混合3分鐘之後,在三輥研磨機中混合,得到混合物。其後,使用SP-500,對所得之混合物進行3分鐘消泡處理,藉此得到第二液。828 (bisphenol A type epoxy resin, manufactured by Mitsubishi Chemical Corporation) 8 g, and ethyl carbitol acetate (diethylene glycol monoethyl ether acetate, manufactured by Daicel Chemical Co., Ltd.) 5 g in a mixer (Lintaro SP-500, manufactured by Thinky Co., Ltd.) was mixed for 3 minutes, and then mixed in a three-roll mill to obtain a mixture. Thereafter, the obtained mixture was subjected to defoaming treatment for 3 minutes using SP-500, whereby a second liquid was obtained.
以如上所述之方法,準備含有第一、第二液之二液混合型之感光性組合物。A photosensitive composition containing a two-liquid mixing type of the first and second liquids was prepared by the method described above.
對第一液及第二液中所使用之材料之種類及調配量作如下述表1~8所示之變更,除此以外,以與實施例1相同之方法得到含有第一、第二液之二液混合型之第一、第二液(混合前之感光性組合物)。The first and second liquids were obtained in the same manner as in Example 1 except that the types and the amounts of the materials used in the first liquid and the second liquid were changed as shown in the following Tables 1 to 8. The first and second liquids of the two-liquid mixing type (photosensitive composition before mixing).
將第一液與第二液加入1 L之圓形塑膠容器(近畿容器公司製造,BHS-1200)中,藉由Mesh公司製造之自動油墨攪拌器,製備以50 rpm攪拌10秒而成之光阻材料(混合後之感光性組合物)。將第一液與第二液加入1 L之圓形塑膠容器(近畿容器公司製造,BHS-1200)中,藉由Mesh公司製造之自動油墨攪拌器,製備以50 rpm攪拌20秒而成之光阻材料(混合後之感光性組合物)。將第一液與第二液加入1 L之圓 形塑膠容器(近畿容器公司製造,BHS-1200)中,藉由Mesh公司製造之自動油墨攪拌器,製備以50 rpm攪拌1分鐘而成之光阻材料(混合後之感光性組合物)。進而,將第一液與第二液加入1 L之圓形塑膠容器(近畿容器公司製造,BHS-1200)中,藉由Mesh公司製造之自動油墨攪拌器,製備以50 rpm攪拌5分鐘而成之光阻材料(混合後之感光性組合物)。The first liquid and the second liquid were placed in a 1 L round plastic container (manufactured by Kinki Container Co., Ltd., BHS-1200), and the light was stirred at 50 rpm for 10 seconds by an automatic ink agitator manufactured by Mesh Corporation. Resistive material (photosensitive composition after mixing). The first liquid and the second liquid were placed in a 1 L round plastic container (manufactured by Kinki Container Co., Ltd., BHS-1200), and the light was stirred at 50 rpm for 20 seconds by an automatic ink agitator manufactured by Mesh Corporation. Resistive material (photosensitive composition after mixing). Add the first liquid and the second liquid to the circle of 1 L A plastic container (manufactured by Kinki U.S.A., BHS-1200) was used to prepare a photoresist material (mixed photosensitive composition) which was stirred at 50 rpm for 1 minute by an automatic ink agitator manufactured by Mesh Corporation. Further, the first liquid and the second liquid were placed in a 1 L round plastic container (manufactured by Kinki Container Co., Ltd., BHS-1200), and prepared by stirring at 50 rpm for 5 minutes by an automatic ink agitator manufactured by Mesh Corporation. Photoresist material (photosensitive composition after mixing).
又,準備於表面貼附有銅箔之100×100 mm之FR-4基板。藉由絲網印刷,將剛完成攪拌後之光阻材料塗佈於上述FR-4基板之貼附有銅箔之面,從而形成光阻材料層。以肉眼觀察基板上之光阻材料層之外觀。Further, a 100 × 100 mm FR-4 substrate on which copper foil was attached was prepared. The photoresist material immediately after the completion of the agitation was applied to the surface of the FR-4 substrate to which the copper foil was attached by screen printing to form a photoresist material layer. The appearance of the photoresist layer on the substrate was visually observed.
以下述判定標準判定第一、第二液之混合性。The miscibility of the first and second liquids was determined by the following criteria.
A:於使用攪拌10秒而成之光阻材料、攪拌20秒而成之光阻材料、攪拌1分鐘而成之光阻材料及攪拌5分鐘而成之光阻材料中任一種之情形時,光阻材料層都均勻A: When using a photoresist material obtained by stirring for 10 seconds, a photoresist material obtained by stirring for 20 seconds, a photoresist material obtained by stirring for 1 minute, and a photoresist material obtained by stirring for 5 minutes, Uniform photoresist layer
B:於使用攪拌10秒而成之光阻材料之情形時,在光阻材料層上見到少量條狀之不均,但於使用攪拌20秒而成之光阻材料、攪拌1分鐘而成之光阻材料及攪拌5分鐘而成之光阻材料之情形時,光阻材料層均勻B: When a photoresist material which was stirred for 10 seconds was used, a small amount of stripe unevenness was observed on the photoresist layer, but it was formed by stirring for 20 minutes using a photoresist material which was stirred for 20 seconds. When the photoresist material and the photoresist material which is stirred for 5 minutes, the photoresist layer is uniform
C:於使用攪拌10秒而成之光阻材料及攪拌20秒而成之光阻材料之情形時,在光阻材料層上見到少量條狀之不均,但於使用攪拌1分鐘而成之光阻材料及攪拌5分鐘而成之光阻材料之情形時,光阻材料層均勻C: When a photoresist material which was stirred for 10 seconds and a photoresist material which was stirred for 20 seconds was used, a small amount of unevenness was observed on the photoresist layer, but it was stirred for 1 minute. When the photoresist material and the photoresist material which is stirred for 5 minutes, the photoresist layer is uniform
D:於使用攪拌10秒而成之光阻材料、攪拌20秒而成之光阻材料及攪拌1分鐘而成之光阻材料之情形時,在光阻材料層上見到少量條狀之不均,於使用攪拌5分鐘而成之光阻材料之情形時,光阻材料層均勻D: When using a photoresist material which was stirred for 10 seconds, a photoresist material which was stirred for 20 seconds, and a photoresist material which was stirred for 1 minute, a small amount of strip was observed on the photoresist layer. In the case of using a photoresist material which is stirred for 5 minutes, the photoresist layer is uniform.
E:於使用攪拌10秒而成之光阻材料、攪拌20秒而成之光阻材料、攪拌1分鐘而成之光阻材料及攪拌5分鐘而成之光阻材料中任一種之情形時,均於光阻材料層上見到條狀之不均E: When using a photoresist material obtained by stirring for 10 seconds, a photoresist material obtained by stirring for 20 seconds, a photoresist material obtained by stirring for 1 minute, and a photoresist material obtained by stirring for 5 minutes, Uneven strips are seen on the photoresist layer
將結果示於下述表1~8。下述表1~8中,所調配之液體之類別中之「(1)」表示第一液,「(2)」表示第二液。再者,對上述第一、第二液之混合性進行評價後,藉由使基板上之光阻材料層硬化,可獲得光阻膜。The results are shown in Tables 1 to 8 below. In the following Tables 1 to 8, "(1)" in the category of the liquid to be dispensed indicates the first liquid, and "(2)" indicates the second liquid. Further, after evaluating the miscibility of the first and second liquids, a photoresist film can be obtained by curing the photoresist layer on the substrate.
再者,雖然實施例5、實施例29及實施例33之二液混合性之評價結果均為「A」,但與實施例33相比,實施例5及實施例29於更短之時間內均勻地混合感光性組合物。雖然實施例30、實施例31及實施例34之二液混合性之評價結果均為「A」,但與實施例34相比,實施例30及實施例31於更短之時間內均勻地混合感光性組合物。雖然實施例35、實施例37及實施例39之二液混合性之評價結果均為「A」,但與實施例39相比,實施例35及實施例37於更短之時間內均勻地混合感光性組合物。Further, although the evaluation results of the two liquid mixing properties of Example 5, Example 29, and Example 33 were both "A", Example 5 and Example 29 were shorter than Example 33 in a shorter period of time. The photosensitive composition was uniformly mixed. Although the evaluation results of the two liquid mixing properties of Example 30, Example 31, and Example 34 were both "A", Example 30 and Example 31 were uniformly mixed in a shorter period of time than in Example 34. Photosensitive composition. Although the evaluation results of the two liquid mixing properties of Example 35, Example 37, and Example 39 were both "A", Example 35 and Example 37 were uniformly mixed in a shorter period of time than in Example 39. Photosensitive composition.
1‧‧‧LED裝置1‧‧‧LED device
2‧‧‧基板2‧‧‧Substrate
2a‧‧‧上表面2a‧‧‧Upper surface
3‧‧‧光阻膜3‧‧‧Photoresist film
3a‧‧‧上表面3a‧‧‧Upper surface
4a、4b‧‧‧電極4a, 4b‧‧‧ electrodes
7‧‧‧LED晶片7‧‧‧LED chip
7a‧‧‧下表面7a‧‧‧lower surface
8a、8b‧‧‧端子8a, 8b‧‧‧ terminals
9a、9b‧‧‧焊錫9a, 9b‧‧‧ solder
圖1係模式地表示包含阻焊劑膜之LED裝置之一例的部分切缺正面剖面圖,該阻焊劑膜使用本發明之一實施形態的二液混合型之第一、第二液。Fig. 1 is a partially cutaway front cross-sectional view showing an example of an LED device including a solder resist film using the two-liquid mixing type first and second liquids according to an embodiment of the present invention.
Claims (21)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011028924 | 2011-02-14 | ||
JP2011092713A JP4850313B1 (en) | 2011-02-14 | 2011-04-19 | Two-liquid mixed type first and second liquid and method for producing printed wiring board |
JP2011092714 | 2011-04-19 | ||
JP2011200946 | 2011-09-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201239519A TW201239519A (en) | 2012-10-01 |
TWI506358B true TWI506358B (en) | 2015-11-01 |
Family
ID=46672299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101100839A TWI506358B (en) | 2011-02-14 | 2012-01-09 | And a method for producing the printed circuit board of the first liquid and the second liquid |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101250736B1 (en) |
CN (1) | CN102762627B (en) |
TW (1) | TWI506358B (en) |
WO (1) | WO2012111356A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102625987B1 (en) * | 2015-03-25 | 2024-01-18 | 다이요 홀딩스 가부시키가이샤 | First liquid and second liquid of two-liquid mixing type, and method for manufacturing printed wiring board |
KR20160115718A (en) | 2015-03-25 | 2016-10-06 | 세키스이가가쿠 고교가부시키가이샤 | First liquid and second liquid of two-liquid mixing type, and method for manufacturing printed wiring board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010113245A (en) * | 2008-11-07 | 2010-05-20 | Taiyo Ink Mfg Ltd | Flame-retardant photosetting resin composition, dry film and cured material of the same, and printed wiring board using the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0882930A (en) * | 1994-09-09 | 1996-03-26 | Taiyo Ink Mfg Ltd | Photosetting and thermosetting resin composition |
JP3095658B2 (en) * | 1995-04-24 | 2000-10-10 | 太陽インキ製造株式会社 | Cyanoguanidine derivative and thermosetting or photocurable thermosetting resin composition using the same |
JPH1121327A (en) * | 1997-06-27 | 1999-01-26 | Nikka Chem Co Ltd | Photocurable resin and solder photoresist ink composition containing it |
DE60017470T2 (en) * | 2000-02-14 | 2005-12-29 | Taiyo Ink Mfg. Co. Ltd. | PHOTO- OR HEAT-HARDENING COMPOSITIONS FOR MAKING MATTER FILMS |
JP3954402B2 (en) * | 2002-02-07 | 2007-08-08 | ソニー株式会社 | Photosensitive resin composition |
KR100904348B1 (en) * | 2006-10-24 | 2009-06-23 | 다이요 잉키 세이조 가부시키가이샤 | Photocurable thermosetting resin composition and printed wiring board using same |
TWI357536B (en) * | 2006-10-24 | 2012-02-01 | Taiyo Ink Mfg Co Ltd | Photosetting and thermosetting solder resist ink c |
JP5089426B2 (en) | 2008-02-15 | 2012-12-05 | 電気化学工業株式会社 | Alkali-developable photocurable / thermosetting solder resist composition and metal base circuit board using the same |
KR101727101B1 (en) * | 2008-08-26 | 2017-04-14 | 타무라 카켄 코포레이션 | Photopolymer composition, solder resist composition for print circuit boards and print circuit boards |
TWI408150B (en) * | 2008-10-17 | 2013-09-11 | Taiyo Ink Mfg Co Ltd | A solder resist composition and a printed circuit board using the same |
TW201016777A (en) * | 2008-10-17 | 2010-05-01 | Taiyo Ink Mfg Co Ltd | Curable resin composition and reflective sheet |
JP5117416B2 (en) | 2009-01-21 | 2013-01-16 | 株式会社タムラ製作所 | Photosensitive resin composition, solder resist composition for printed wiring board, and printed wiring board |
-
2012
- 2012-01-05 CN CN201280000309.XA patent/CN102762627B/en active Active
- 2012-01-05 WO PCT/JP2012/050105 patent/WO2012111356A1/en active Application Filing
- 2012-01-05 KR KR1020127016064A patent/KR101250736B1/en active IP Right Grant
- 2012-01-09 TW TW101100839A patent/TWI506358B/en active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010113245A (en) * | 2008-11-07 | 2010-05-20 | Taiyo Ink Mfg Ltd | Flame-retardant photosetting resin composition, dry film and cured material of the same, and printed wiring board using the same |
Also Published As
Publication number | Publication date |
---|---|
WO2012111356A1 (en) | 2012-08-23 |
CN102762627B (en) | 2014-03-26 |
KR101250736B1 (en) | 2013-04-03 |
KR20120109513A (en) | 2012-10-08 |
CN102762627A (en) | 2012-10-31 |
TW201239519A (en) | 2012-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4891434B2 (en) | Photosensitive composition and printed wiring board | |
TWI418936B (en) | Photosensitive compositions and printed circuit boards | |
CN107531815B (en) | Curable composition and method for producing electronic component | |
JP2012212039A (en) | Photosensitive composition and printed wiring board | |
JP2012053254A (en) | Photo-curing and heat-curing composition, solder resist composition and print circuit board | |
TWI363931B (en) | ||
TWI506358B (en) | And a method for producing the printed circuit board of the first liquid and the second liquid | |
JP4991960B1 (en) | Two-liquid mixed type first and second liquid and method for producing printed wiring board | |
JP4850313B1 (en) | Two-liquid mixed type first and second liquid and method for producing printed wiring board | |
JP2011059391A (en) | Photosensitive composition and printed wiring board | |
JP2011248322A (en) | Photosensitive composition, solder resist composition and substrate | |
JP2012168251A (en) | Photosensitive composition and substrate | |
KR102625987B1 (en) | First liquid and second liquid of two-liquid mixing type, and method for manufacturing printed wiring board | |
JP6618829B2 (en) | Two-liquid mixed type first and second liquid and method for producing printed wiring board | |
JP6646641B2 (en) | Non-developable resist curable composition, printed wiring board and method for producing electronic component | |
JP2016184160A (en) | First and second liquids for two-liquid mixing system and method for manufacturing printed wiring board | |
KR101104994B1 (en) | Photosensitive composition and printed wiring board | |
KR20160115718A (en) | First liquid and second liquid of two-liquid mixing type, and method for manufacturing printed wiring board |