TWI494954B - 導電玻璃基板及其製作方法 - Google Patents
導電玻璃基板及其製作方法 Download PDFInfo
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- TWI494954B TWI494954B TW102134021A TW102134021A TWI494954B TW I494954 B TWI494954 B TW I494954B TW 102134021 A TW102134021 A TW 102134021A TW 102134021 A TW102134021 A TW 102134021A TW I494954 B TWI494954 B TW I494954B
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- 239000011521 glass Substances 0.000 title claims description 148
- 239000000758 substrate Substances 0.000 title claims description 58
- 238000000034 method Methods 0.000 title claims description 23
- 239000010410 layer Substances 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 27
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 22
- 238000002347 injection Methods 0.000 claims description 21
- 239000007924 injection Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000006060 molten glass Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 2
- 229910052909 inorganic silicate Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 4
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Surface Treatment Of Glass (AREA)
- Laminated Bodies (AREA)
- Micromachines (AREA)
Description
此發明涉及玻璃基板技術,特別係涉及一種導電玻璃基板及其製作方法。
觸控式螢幕設備由於具有“所觸即所得”之優點,加上其堅固耐用、反應速度快、節省空間,使得觸控式螢幕越來越受到大眾之喜愛。目前,於各種電子產品中,特別係於觸控式螢幕領域,於玻璃板上形成導電圖案或網格,以形成導電玻璃基板之技術已經得到廣泛之應用。
製作導電圖案或網格之材質包括導電金屬材質及ITO(氧化銦錫)材質。ITO材質一般用於形成導電圖案,而導電網格一般由導電金屬材質形成。於傳統之導電玻璃基板製作方法中,為了於導電玻璃基板上形成導電網格,需要先於柔性基材上形成導電網格,再將該柔性基材與玻璃板相貼合,以最終製得導電玻璃基板。上述導電玻璃基板製作方法需要大量之使用柔性基材,並且過程較為繁瑣,需要進行製作壓模等工藝,大量耗費人力物力,製作成本較高。
基於此,有必要提供一種製作成本較低之導電玻璃基板。
一種導電玻璃基板,包括:玻璃板,其一表面上開設有凹槽,該凹槽為網格狀;
二氧化矽層,附著於該玻璃板開設該凹槽之表面上;導電格線,與該凹槽之形狀相適配,該導電格線設置於該凹槽內,並藉由該二氧化矽層附著於該玻璃板上。
上述導電玻璃基板中,導電格線可直接設置於玻璃板之凹槽中,與傳統之導電玻璃基板相比,其無需使用柔性基材作為導電格線之承載體,降低製作成本。同時該導電玻璃基板結構較為簡單,進一步減少工序,節省人力物力。
此外,還有必要提供一種用於製作上述導電玻璃基板之導電玻璃基板製作方法。
一種導電玻璃基板製作方法,包括以下步驟:提供一玻璃板,該玻璃板之一表面上開設有凹槽,該凹槽為網格狀;於該玻璃板開設有凹槽之表面上鍍一層二氧化矽;於該玻璃板鍍有二氧化矽層之表面上印刷導電油墨,該導電油墨進入該凹槽中;烘乾該導電油墨,以於該玻璃板上形成導電格線,製得導電玻璃基板。
上述導電玻璃基板製作方法,其工藝較為簡單,節省人力物力,降低製作成本。同時,由上述導電玻璃基板製作方法製作所得之導電玻璃基板無需使用柔性基材作為導電格線之承載體,進一步降低製作成本。
100‧‧‧導電玻璃基板
110‧‧‧玻璃板
112‧‧‧凹槽
130‧‧‧二氧化矽層
150‧‧‧導電格線
S310至S340‧‧‧導電玻璃基板製作方法步驟
S311a至S319a‧‧‧玻璃板製作方法步驟
510‧‧‧原始玻璃板
520‧‧‧保護層
S311b至S313b‧‧‧玻璃板製作方法步驟
800‧‧‧模具
810‧‧‧上模芯
830‧‧‧下模芯
850‧‧‧環狀模腔壁
852‧‧‧注塑口
圖1係此發明較佳實施方式中之導電玻璃基板之結構圖;圖2係圖1所示導電玻璃基板中玻璃板之具體結構圖;圖3係此發明較佳實施方式中之導電玻璃基板製作方法之流程圖;圖4係圖3所示導電玻璃基板製作方法中玻璃板之製作流程圖;
圖5係圖3所示導電玻璃基板製作方法中玻璃板之具體製作示意圖;圖6係圖3所示導電玻璃基板製作方法中玻璃板之另一具體製作示意圖;圖7係另一實施方式之圖3所示導電玻璃基板製作方法中玻璃板之製作流程圖;圖8係製作玻璃板用模具之結構圖。
請參閱圖1,此發明較佳實施方式中之導電玻璃基板100,包括玻璃板110、二氧化矽層130及導電格線150。
請一併參閱圖2,玻璃板110之一表面上開設有凹槽112,凹槽112為網格狀。玻璃板110可為無機矽酸鹽玻璃,亦可為由聚碳酸酯或聚甲基丙烯酸甲酯等材質製成之有機玻璃。
二氧化矽層130附著於玻璃板110開設凹槽112之表面上。導電格線150與凹槽112之形狀相適配。導電格線150設置於凹槽112內,並藉由二氧化矽層130附著於玻璃板110上。二氧化矽層130能增加導電格線150與玻璃板110之間之附著力,使導電格線150於玻璃板110上不容易脫落。
製作導電格線150之材質為金屬、導電高分子、石墨烯、碳納米管及氧化銦錫中之至少一種。具體於本實施方式中,導電格線150由銀材質製成。同時,製作導電格線150之材質中還含有玻璃粉,以進一步加強導電格線150與玻璃板110之間之附著力。
上述導電玻璃基板100中,導電格線150可直接設置於玻璃板110之凹槽112中,與傳統之導電玻璃基板100相比,其無需使用柔性基材作為導電格線150之承載體,降低製作成本。同時該導電玻璃基板100結構較為簡單,進一步減少工序,節省人力物力。
請一併參閱圖3,此發明較佳實施方式中之導電玻璃基板製作方法,用於製作上述導電玻璃基板100,包括以下步驟:
步驟S310,提供一玻璃板,玻璃板之一表面上開設有凹槽,凹槽為網格狀。玻璃板110之一表面上開設有凹槽112,凹槽112為網格狀。請一併參閱圖4,具體的,玻璃板110可由以下步驟製得:步驟S311a,提供一原始玻璃板,原始玻璃板之一表面為平面。請一併參閱圖5,提供一原始玻璃板510,原始玻璃板510之一表面為平面。
步驟S313a,於原始玻璃板之一表面上塗覆光刻膠,光刻膠於原始玻璃板之一表面上形成蝕刻保護層。對原始玻璃板510為表面進行清洗後,於其上塗覆光刻膠,光刻膠於原始玻璃板510之一表面上形成蝕刻保護層520。
步驟S315a,對蝕刻保護層進行曝光及顯影,以去除原始玻璃板之表面所需開設凹槽區域上之蝕刻保護層。請一併參閱圖6,藉由掩範本(圖未示)對蝕刻保護層520進行曝光,曝光後放入顯影液中進行顯影。經過顯影後,原始玻璃板510之表面所需開設凹槽112區域上之蝕刻保護層520被去除。
光刻膠於紫外線之照射下會發生化學反應。具體的,光刻膠於紫外線之照射下,其材質內部難溶於顯影液之大分子分解成易溶於顯影液之小分子。掩膜板上開設與需設之網格狀之凹槽112相一致之窗口。紫外光透過掩範本照射到光刻膠形成之蝕刻保護層520上,部分蝕刻保護層520分解並溶於顯影液,使得所需開設凹槽112區域上之蝕刻保護層520被去除。
可理解,於其它實施方式中,光刻膠亦可於紫外線之照射下固化並難溶於顯影液,而光刻膠未固化部分易溶於顯影液。掩膜板上開設之視窗與原始玻璃板510上無需開槽之部分相對應。紫外光透過掩範本照射到光刻膠形成之蝕刻保護層520上,使部分之蝕刻保護層520固化,未固化之蝕刻保護層520溶解於顯影液中,使得所需開設凹槽112區域上之蝕刻保護層520被去除。
步驟S317a,採用蝕刻液對原始玻璃板之表面進行蝕刻,以
於原始玻璃板之一表面上形成凹槽。可於原始玻璃板510上噴灑上蝕刻液,由於所需開設凹槽112區域上之蝕刻保護層520已被去除,蝕刻液可於原始玻璃板510上蝕刻出網格狀之凹槽112。而原始玻璃板510之表面上無需開槽之區域由於有蝕刻保護層520之保護,不會與蝕刻液發生反應。
於本實施方式中,製作玻璃板110之材質為無機矽酸鹽、聚碳酸酯及聚甲基丙烯酸甲酯中之至少一種。同時,蝕刻液具體為氫氟酸溶液。可理解,蝕刻液還可為其它溶液,只需滿足與玻璃板110發生化學反應並於玻璃板110上蝕刻出所需圖案或網格即可。
步驟S319a,清洗去蝕刻保護層,得到一表面上開設有該凹槽之玻璃板。清洗去蝕刻保護層520,最終得到一表面上開設網格狀凹槽112之玻璃板110。
需要注意的係,請一併參閱圖7,於其它實施方式中,玻璃板110還可由以下步驟製得:步驟S311b,提供一模具,模具具有注塑腔,注塑腔之其中一內表面具有凹槽,模具側壁還開設有注塑口,注塑口與注塑腔相導通。請一併參閱圖8,模具800包括上模芯810、下模芯830及環狀模腔壁850。上模芯810、下模芯830及環狀模腔壁850共同圍成注塑腔,注塑腔與玻璃板110之形狀相適配,注塑腔之一內表面上設有與玻璃板110之表面相對應之凹槽。環狀模腔壁850上還開設注塑口852,注塑口852與注塑腔相導通。
步驟S313b,將熔融狀態之玻璃藉由注塑口注射入注塑腔中,並冷卻得到玻璃板。熔融狀態之玻璃可藉由注塑口852注射入注塑腔中,並進行冷卻,得到一體成型並具有網格狀凹槽112之玻璃板110。具體於本實施方式中,製作玻璃板110之材質包括聚碳酸酯或聚甲基丙烯酸甲酯等有機材質。
步驟S320,於玻璃板開設有凹槽之表面上鍍一層二氧化矽。於玻璃板110開設有凹槽112之表面上鍍一層二氧化矽,以於開設有凹槽112之表面形成二氧化矽層130。
步驟S330,於玻璃板鍍有二氧化矽層之表面上印刷導電油
墨,導電油墨進入凹槽中。具體於本實施方式中,導電油墨為溴化銀溶液,其中含有溴化銀顆粒。於其它實施方式中,導電油墨中還可含有其它金屬所對應之顆粒、導電高分子顆粒、石墨烯顆粒、碳納米管及氧化銦錫顆粒中之至少一種。導電油墨藉由印刷之方式塗覆於玻璃板110鍍有二氧化矽層130之表面上,導電油墨進入凹槽112中。
步驟S340,烘乾導電油墨,以於玻璃板上形成導電格線,製得導電玻璃基板。烘乾導電油墨,即可於凹槽112內形成導電格線150,導電格線150藉由二氧化矽層130附著於玻璃板110上。二氧化矽層130能增加導電格線150與玻璃板110之間之附著力,使導電格線150於玻璃板110上不容易脫落。
為了進一步加強導電格線150與玻璃板110之間之附著力,導電油墨中還含有玻璃粉,使最終製作所得之導電格線150中還含有玻璃粉。
上述導電玻璃基板製作方法,其工藝較為簡單,節省人力物力,降低製作成本。同時,由上述導電玻璃基板製作方法製作所得之導電玻璃基板100無需使用柔性基材作為導電格線150之承載體,進一步降低製作成本。
上述之內容為本發明數種實施方式的概略描述,具相關領域通常知識技術者可以輕易理解,並以該些內容為基礎,修改或設計其他製程及結構,以達到與本發明之實施方式相同的目的或優點。具相關領域通常知識技術者應瞭解該些修改、改變及置換皆未悖離本發明的精神與範疇。
100‧‧‧導電玻璃基板
110‧‧‧玻璃板
130‧‧‧二氧化矽層
150‧‧‧導電格線
Claims (9)
- 一種導電玻璃基板,包括:玻璃板,其一表面上開設有凹槽,該凹槽為網格狀;二氧化矽層,附著於該玻璃板開設該凹槽之表面上;導電格線,與該凹槽之形狀相適配,該導電格線設置於該凹槽內,並藉由該二氧化矽層附著於該玻璃板上。
- 如請求項1中所述之導電玻璃基板,製作該導電格線之材質為金屬、導電高分子、石墨烯、碳納米管及氧化銦錫中之至少一種。
- 如請求項2中所述之導電玻璃基板,製作該導電格線之材質中還含有玻璃粉。
- 一種導電玻璃基板製作方法,包括以下步驟:提供一玻璃板,該玻璃板之一表面上開設有凹槽,該凹槽為網格狀;於該玻璃板開設有凹槽之表面上鍍一層二氧化矽;於該玻璃板鍍有二氧化矽層之表面上印刷導電油墨,該導電油墨進入該凹槽中;烘乾該導電油墨,以於該玻璃板上形成導電格線,製得導電玻璃基板;其中,該玻璃板由以下步驟製得:提供一模具,該模具具有注塑腔,該注塑腔之其中一內表面具有凹槽,該模具側壁還開設有注塑口,該注塑口與該注塑腔相導通;將熔融狀態之玻璃藉由該注塑口注射入該注塑腔中,並冷卻得到該玻璃板。
- 如請求項4中所述之導電玻璃基板製作方法,該導電油墨中含有金屬顆粒、導電高分子顆粒、石墨烯顆粒、碳納米管及氧化銦錫顆粒中之至少一種。
- 如請求項5中所述之導電玻璃基板製作方法,該導電油墨中還含有玻璃粉。
- 如請求項4中所述之導電玻璃基板製作方法,該玻璃板由以下步驟製得:提供一原始玻璃板,該原始玻璃板之一表面為平面; 於該原始玻璃板之一表面上塗覆光刻膠,該光刻膠於該原始玻璃板之一表面上形成蝕刻保護層;對該蝕刻保護層進行曝光及顯影,以去除該原始玻璃板之表面所需開設凹槽區域上之蝕刻保護層;採用蝕刻液對該原始玻璃板之表面進行蝕刻,以於該原始玻璃板之一表面上形成該凹槽;清洗去該蝕刻保護層,得到一表面上開設有該凹槽之該玻璃板。
- 如請求項7中所述之導電玻璃基板製作方法,該蝕刻液為氫氟酸溶液。
- 如請求項4中所述之導電玻璃基板製作方法,製作該玻璃板之材質為無機矽酸鹽、聚碳酸酯及聚甲基丙烯酸甲酯中之至少一種。
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Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014196809A1 (ko) * | 2013-06-04 | 2014-12-11 | 주식회사 잉크테크 | 편광필름의 제조방법 |
DE102014100770A1 (de) * | 2014-01-23 | 2015-07-23 | Osram Opto Semiconductors Gmbh | Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements |
KR20150103977A (ko) * | 2014-03-04 | 2015-09-14 | 엘지이노텍 주식회사 | 터치 윈도우 및 이를 포함하는 디스플레이 장치 |
CN104407729B (zh) * | 2014-10-14 | 2018-01-09 | 业成光电(深圳)有限公司 | 电子装置、触控屏、透明导电膜及透明导电膜的制备方法 |
KR101626518B1 (ko) * | 2014-11-17 | 2016-06-02 | (주)뉴옵틱스 | 터치 패널, 터치 패널의 제조 장치 및 방법 |
CN105093595A (zh) * | 2015-09-24 | 2015-11-25 | 京东方科技集团股份有限公司 | 一种承载体、超薄显示面板的制备方法及显示装置 |
CN105430957A (zh) * | 2015-11-11 | 2016-03-23 | 业成光电(深圳)有限公司 | 强化式盲盖及其制作方法 |
KR102042874B1 (ko) * | 2015-12-23 | 2019-11-08 | 주식회사 엘지화학 | 전도성 기판, 이를 포함하는 터치 패널 및 이를 포함하는 디스플레이 장치 |
KR101974158B1 (ko) * | 2015-12-23 | 2019-04-30 | 주식회사 엘지화학 | 전도성 기판, 이를 포함하는 터치 패널 및 이를 포함하는 디스플레이 장치 |
KR101997657B1 (ko) * | 2015-12-23 | 2019-07-08 | 주식회사 엘지화학 | 전도성 기판, 이를 포함하는 터치 패널 및 이를 포함하는 디스플레이 장치 |
KR102035889B1 (ko) * | 2016-01-07 | 2019-10-23 | 주식회사 엘지화학 | 전도성 기판 및 이를 포함하는 전자 장치 |
CN105513973B (zh) * | 2016-02-19 | 2018-06-08 | 信利光电股份有限公司 | 一种盲孔的制作方法 |
CN107663028A (zh) * | 2016-07-29 | 2018-02-06 | 蓝思科技(长沙)有限公司 | 一种含蚀刻纹路图案的镀膜玻璃板的制备方法及玻璃板 |
JP6832527B2 (ja) * | 2017-03-17 | 2021-02-24 | パナソニックIpマネジメント株式会社 | フィルム構造体 |
CN107450779A (zh) * | 2017-09-15 | 2017-12-08 | 苏州敏柔电子科技有限公司 | 一种基于金属网格的触控ogs及其制作方法 |
CN111197153B (zh) * | 2018-11-16 | 2023-01-10 | 安徽精卓光显技术有限责任公司 | 金属网格的制备方法及金属网格片 |
CN113290987B (zh) * | 2021-03-31 | 2022-11-25 | 深圳烯湾科技有限公司 | 透明发热复合材料及其制备方法和应用 |
CN113264678A (zh) * | 2021-04-02 | 2021-08-17 | 容科培 | 一种新型柔性发电玻璃的加工工艺 |
CN114188446B (zh) * | 2021-11-16 | 2023-12-01 | 湖南创瑾技术研究院有限公司 | 一种导电玻璃及其制备方法和应用 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1408197A (zh) * | 2000-01-04 | 2003-04-02 | 埃尔米克隆股份公司 | 一种电连接元件的制造方法、设备和装置以及电连接元件和半成品 |
CN101094936A (zh) * | 2004-12-03 | 2007-12-26 | 3M创新有限公司 | 使用有图案的形貌和自组装单层的微组装 |
TW201205720A (en) * | 2010-07-23 | 2012-02-01 | Innovation & Amp Infinity Global Corp | A manufacturing method of conductive circuits of a touch panel and the touch panel |
CN102768464A (zh) * | 2011-05-04 | 2012-11-07 | 上海鑫力新材料科技有限公司 | 感光导电银浆及制备方法 |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4070517A (en) * | 1976-07-08 | 1978-01-24 | Beckman Instruments, Inc. | Low fired conductive compositions |
US4270823A (en) * | 1978-09-01 | 1981-06-02 | Burroughs Corporation | Method of forming conductors in slots in a plate |
US4508753A (en) * | 1982-08-19 | 1985-04-02 | Gte Automatic Electric Inc. | Method of producing fine line conductive/resistive patterns on an insulating coating |
JPS60201509A (ja) * | 1984-03-23 | 1985-10-12 | Matsushita Electric Ind Co Ltd | 磁気ヘツドの製造方法 |
US5062891A (en) * | 1987-08-13 | 1991-11-05 | Ceramics Process Systems Corporation | Metallic inks for co-sintering process |
US5378408A (en) * | 1993-07-29 | 1995-01-03 | E. I. Du Pont De Nemours And Company | Lead-free thick film paste composition |
US5637261A (en) * | 1994-11-07 | 1997-06-10 | The Curators Of The University Of Missouri | Aluminum nitride-compatible thick-film binder glass and thick-film paste composition |
JPH11346088A (ja) * | 1998-06-02 | 1999-12-14 | Dainippon Printing Co Ltd | 電磁波遮蔽板の製造方法および電磁波遮蔽板 |
US20030108664A1 (en) * | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
JP4315363B2 (ja) * | 2001-12-03 | 2009-08-19 | 日本板硝子株式会社 | 薄膜形成方法 |
JP2003243499A (ja) * | 2002-02-15 | 2003-08-29 | Sony Corp | 半導体装置及びその製造方法 |
JP3817201B2 (ja) * | 2002-04-19 | 2006-09-06 | Jsr株式会社 | 導電性膜形成用組成物、導電性膜およびその形成法 |
US6988925B2 (en) * | 2002-05-21 | 2006-01-24 | Eikos, Inc. | Method for patterning carbon nanotube coating and carbon nanotube wiring |
KR20050035191A (ko) * | 2002-05-21 | 2005-04-15 | 에이코스 인코포레이티드 | 탄소 나노튜브 코팅의 패턴화 방법 및 탄소 나노튜브 배선 |
US8068186B2 (en) * | 2003-10-15 | 2011-11-29 | 3M Innovative Properties Company | Patterned conductor touch screen having improved optics |
JP2005330172A (ja) * | 2004-05-21 | 2005-12-02 | Nippon Sheet Glass Co Ltd | ガラス板およびその製造方法、低反射性透明ガラス板、低反射性透明導電基板およびその製造方法、ならびに、低反射性透明導電基板を用いた光電変換素子 |
JP4543385B2 (ja) * | 2005-03-15 | 2010-09-15 | 日本電気株式会社 | 液晶表示装置の製造方法 |
KR101039543B1 (ko) * | 2006-09-28 | 2011-06-09 | 후지필름 가부시키가이샤 | 자발광 표시 장치, 자발광 표시 장치의 제조 방법, 투명 도전성 필름, 전계 발광 소자, 태양 전지용 투명 전극 및 전자 페이퍼용 투명 전극 |
WO2008089401A2 (en) * | 2007-01-18 | 2008-07-24 | Arizona Board Of Regents, Acting For And On Behalfof Arizona State University | Flexible transparent electrodes via nanowires and sacrificial conductive layer |
CN101470560B (zh) * | 2007-12-27 | 2012-01-25 | 清华大学 | 触摸屏及显示装置 |
FR2924274B1 (fr) * | 2007-11-22 | 2012-11-30 | Saint Gobain | Substrat porteur d'une electrode, dispositif electroluminescent organique l'incorporant, et sa fabrication |
CN101261379A (zh) * | 2008-02-01 | 2008-09-10 | 信利半导体有限公司 | 电容式触摸屏及包含该触摸屏的触摸显示器件 |
US8550991B2 (en) * | 2009-03-04 | 2013-10-08 | Dong Sik Nam | Touch panel sensor |
CN101497992A (zh) * | 2009-03-18 | 2009-08-05 | 江苏秀强玻璃工艺有限公司 | 用等离子体轰击制备绒面氧化锌透明导电镀膜玻璃的方法 |
WO2010150619A1 (ja) * | 2009-06-24 | 2010-12-29 | コニカミノルタホールディングス株式会社 | 透明電極、該透明電極に用いられる導電性繊維の精製方法、及び有機エレクトロルミネッセンス素子 |
US8460747B2 (en) * | 2010-03-04 | 2013-06-11 | Guardian Industries Corp. | Large-area transparent conductive coatings including alloyed carbon nanotubes and nanowire composites, and methods of making the same |
JP2012083962A (ja) * | 2010-10-12 | 2012-04-26 | Innovation & Infinity Global Corp | タッチパネルの金属回路の製造方法及びそのタッチパネル |
CN102063951B (zh) * | 2010-11-05 | 2013-07-03 | 苏州苏大维格光电科技股份有限公司 | 一种透明导电膜及其制作方法 |
JP2012114041A (ja) * | 2010-11-26 | 2012-06-14 | Asahi Glass Co Ltd | 電波透過部材、調光素子、および調光窓材 |
TWI404996B (zh) * | 2010-12-31 | 2013-08-11 | Au Optronics Corp | 觸控面板的製造方法以及觸控面板 |
CN102222538B (zh) * | 2011-03-11 | 2012-12-05 | 苏州纳格光电科技有限公司 | 图形化的柔性透明导电薄膜及其制法 |
US8661662B1 (en) * | 2012-08-10 | 2014-03-04 | Eastman Kodak Company | Making transparent touch-responsive device with micro-wire electrodes |
CN102722279A (zh) * | 2012-05-09 | 2012-10-10 | 崔铮 | 金属网格导电层及其具备该导电层的触摸面板 |
CN102708946B (zh) * | 2012-05-09 | 2015-01-07 | 南昌欧菲光科技有限公司 | 双面图形化透明导电膜及其制备方法 |
CN203225115U (zh) * | 2012-12-28 | 2013-10-02 | 深圳欧菲光科技股份有限公司 | 触摸屏用透明导电体及触摸屏 |
US9445519B2 (en) * | 2013-01-15 | 2016-09-13 | E I Du Pont De Nemours And Company | Method of manufacturing thick-film electrode |
CN203149521U (zh) * | 2013-03-01 | 2013-08-21 | 南昌欧菲光科技有限公司 | 导电玻璃基板 |
-
2013
- 2013-03-01 CN CN201310066646.5A patent/CN103176650B/zh active Active
- 2013-07-05 KR KR20137029924A patent/KR101491399B1/ko not_active IP Right Cessation
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1408197A (zh) * | 2000-01-04 | 2003-04-02 | 埃尔米克隆股份公司 | 一种电连接元件的制造方法、设备和装置以及电连接元件和半成品 |
CN101094936A (zh) * | 2004-12-03 | 2007-12-26 | 3M创新有限公司 | 使用有图案的形貌和自组装单层的微组装 |
TW201205720A (en) * | 2010-07-23 | 2012-02-01 | Innovation & Amp Infinity Global Corp | A manufacturing method of conductive circuits of a touch panel and the touch panel |
CN102768464A (zh) * | 2011-05-04 | 2012-11-07 | 上海鑫力新材料科技有限公司 | 感光导电银浆及制备方法 |
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CN103176650B (zh) | 2016-09-28 |
WO2014131259A1 (zh) | 2014-09-04 |
JP2015514664A (ja) | 2015-05-21 |
US20140318836A1 (en) | 2014-10-30 |
US9089081B2 (en) | 2015-07-21 |
KR101491399B1 (ko) | 2015-02-06 |
TW201435921A (zh) | 2014-09-16 |
CN103176650A (zh) | 2013-06-26 |
JP5852763B2 (ja) | 2016-02-03 |
KR20140131479A (ko) | 2014-11-13 |
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