TWI467180B - Probe card - Google Patents
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- TWI467180B TWI467180B TW101144830A TW101144830A TWI467180B TW I467180 B TWI467180 B TW I467180B TW 101144830 A TW101144830 A TW 101144830A TW 101144830 A TW101144830 A TW 101144830A TW I467180 B TWI467180 B TW I467180B
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Description
本創作是有關於一種檢測裝置，且特別是有關於一種探針卡。This creation relates to a detection device, and in particular to a probe card.
積體電路晶片(integrated circuit chip，IC chip)的電性測試在半導體製程的各階段中都是相當重要的。每一個IC晶片在晶圓與封裝型態都必須接受檢測以確保其電性功能。The electrical testing of an integrated circuit chip (IC chip) is quite important in all stages of the semiconductor process. Each IC wafer must be tested in both wafer and package form to ensure its electrical function.
晶圓測試(wafer test)是使測試機台與探針卡(probe card)構成檢測迴路，將探針卡上的探針直接與晶圓上的銲墊(pad)或凸塊(bump)接觸，以利用探針探測晶圓上的各個晶片，從而引出晶片訊號，並將此晶片訊號資料送往檢測機台作分析與判斷。如此一來，可在封裝步驟之前，事先濾除電性與功能不良的晶片，以避免不良品的增加而提高封裝製造成本。The wafer test is to make the test machine and the probe card form a detection loop, and directly connect the probe on the probe card to a pad or bump on the wafer. The probe is used to detect each wafer on the wafer, thereby extracting the wafer signal, and sending the wafer signal data to the inspection machine for analysis and judgment. In this way, the electrically and functionally defective wafer can be filtered out before the packaging step to avoid an increase in defective products and increase the package manufacturing cost.
傳統的探針卡將探針直接銲接於印刷電路板表面，藉此電性連接探針和銲墊。然而，此種銲接方法在銲接操作上較不便利且困難度較高，而使得探針卡的製作不易。Conventional probe cards solder the probe directly to the surface of the printed circuit board, thereby electrically connecting the probe and the pad. However, such a welding method is inconvenient and difficult in the welding operation, making the production of the probe card difficult.
本發明提供一種探針卡，其在製作上較為簡單。The invention provides a probe card which is relatively simple to manufacture.
本發明提供一種探針卡，包括基板、至少一個銲墊以 及至少一個探針結構。基板具有相對的第一表面與第二表面，且具有貫穿基板的至少一貫穿孔。銲墊配置在基板中。探針結構配置在基板的第一表面上。探針結構包括至少一個探針，探針穿過貫穿孔而在基板的第二表面上與銲墊連接。The invention provides a probe card comprising a substrate and at least one solder pad And at least one probe structure. The substrate has opposing first and second surfaces and has at least a uniform perforation therethrough. The pad is disposed in the substrate. The probe structure is disposed on the first surface of the substrate. The probe structure includes at least one probe that passes through the through hole and is connected to the pad on the second surface of the substrate.
依照本發明的一實施例所述，在上述之探針卡中，貫穿孔可貫穿銲墊。According to an embodiment of the invention, in the probe card described above, the through hole may penetrate the pad.
依照本發明的一實施例所述，在上述之探針卡中，探針與銲墊的連接方式例如是銲接。According to an embodiment of the invention, in the probe card described above, the connection between the probe and the pad is, for example, soldering.
依照本發明的一實施例所述，在上述之探針卡中，探針結構更包括基座。基座配置在基板的第一表面上，且探針可配置在基座上。According to an embodiment of the invention, in the probe card described above, the probe structure further includes a base. The pedestal is disposed on the first surface of the substrate, and the probe is configurable on the pedestal.
依照本發明的一實施例所述，在上述之探針卡中，基座的材料例如是陶瓷。According to an embodiment of the invention, in the probe card described above, the material of the pedestal is, for example, ceramic.
依照本發明的一實施例所述，在上述之探針卡中，探針包括針尖部。針尖部位於基座上方，且針尖部與基座的表面的法線方向的夾角例如是介於0°至10°之間。According to an embodiment of the invention, in the probe card described above, the probe includes a tip portion. The tip portion is located above the base, and the angle between the tip portion and the normal direction of the surface of the base is, for example, between 0° and 10°.
依照本發明的一實施例所述，在上述之探針卡中，探針例如是經由黏著劑而固定於基座上。According to an embodiment of the invention, in the probe card described above, the probe is fixed to the base, for example, via an adhesive.
依照本發明的一實施例所述，上述之探針卡更包括支撐裝置。支撐裝置包括支撐板及至少一個支撐柱。支撐柱配置在支撐板上。支撐板配置在基板的第二表面下方，且支撐柱穿過基板以承載基座。According to an embodiment of the invention, the probe card further includes a supporting device. The support device includes a support plate and at least one support column. The support column is disposed on the support plate. The support plate is disposed below the second surface of the substrate, and the support post passes through the substrate to carry the pedestal.
依照本發明的一實施例所述，在上述之探針卡中，探 針的材料例如是鎢、錸、鈹銅合金、金、銀或鉑。According to an embodiment of the present invention, in the probe card described above, The material of the needle is, for example, tungsten, tantalum, beryllium copper, gold, silver or platinum.
依照本發明的一實施例所述，在上述之探針卡中，基板例如是印刷電路板。According to an embodiment of the invention, in the probe card described above, the substrate is, for example, a printed circuit board.
基於上述，在本發明所提出的探針卡中，由於探針穿過基板的貫穿孔而在基板的第二表面上與銲墊連接，因此使用者可更容易地進行連接操作及調整連接操作時所需的探針長度，以利於連接操作的進行，進而使得探針卡在製作上較為簡單。此外，當探針結構具有多根探針時，由於本發明所提出的探針卡是在第二表面上將探針與銲墊連接，因此可使得各探針的長度趨近於最短及等長，從而提升測試訊號的電性。Based on the above, in the probe card of the present invention, since the probe is connected to the pad on the second surface of the substrate through the through hole of the substrate, the user can more easily perform the connection operation and adjust the connection operation. The length of the probe required to facilitate the connection operation, which makes the probe card easier to manufacture. In addition, when the probe structure has a plurality of probes, since the probe card proposed by the present invention connects the probe to the pad on the second surface, the length of each probe can be made to be the shortest and the like. Long, thus improving the electrical conductivity of the test signal.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1為本發明之第一實施例的探針卡的剖面示意圖。1 is a schematic cross-sectional view of a probe card according to a first embodiment of the present invention.
請參照圖1，探針卡10包括基板100、至少一個銲墊110以及至少一個探針結構120。基板100例如是印刷電路板。基板100具有相對的第一表面102與第二表面104，且具有貫穿基板100的至少一個貫穿孔106。Referring to FIG. 1 , the probe card 10 includes a substrate 100 , at least one pad 110 , and at least one probe structure 120 . The substrate 100 is, for example, a printed circuit board. The substrate 100 has opposing first and second surfaces 102 and 104 and has at least one through hole 106 penetrating the substrate 100.
在本實施例中，貫穿孔106例如是藉由貫穿銲墊110而貫穿基板100，所以使得貫穿孔106及銲墊110可共同使用基板100的同一面積。因此，基板100不需要額外的面積來配置貫穿孔110，因此可進一步地提升基板100的 面積利用率。亦即，在設計基板100上的電路圖案時，本實施例的貫穿孔106的配置方法可使得電路圖案具有更大的設計彈性。In the present embodiment, the through hole 106 penetrates the substrate 100 by the through pad 110, for example, so that the through hole 106 and the pad 110 can use the same area of the substrate 100 in common. Therefore, the substrate 100 does not require an additional area to configure the through holes 110, so the substrate 100 can be further lifted. Area utilization. That is, when the circuit pattern on the substrate 100 is designed, the method of arranging the through holes 106 of the present embodiment can make the circuit pattern have greater design flexibility.
銲墊110配置在基板100中。銲墊110的材料例如是銅或鋁。銲墊110的形成方法例如是電鍍或其他適合的方法。銲墊110可延伸至基板100的第二表面104上，進而使得銲墊110覆蓋基板100的部分第二表面104，然而本發明並不以此為限。在另一實施例中，銲墊110亦可僅形成於基板100中而不覆蓋基板100的表面。在其他實施例中，銲墊110可僅延伸至基板100的第一表面102上，或者銲墊110可同時延伸至基板100的第一表面102及第二表面104上。The pad 110 is disposed in the substrate 100. The material of the pad 110 is, for example, copper or aluminum. The method of forming the pad 110 is, for example, electroplating or other suitable method. The pad 110 may extend onto the second surface 104 of the substrate 100 such that the pad 110 covers a portion of the second surface 104 of the substrate 100, although the invention is not limited thereto. In another embodiment, the pad 110 may also be formed only in the substrate 100 without covering the surface of the substrate 100. In other embodiments, the pads 110 may extend only onto the first surface 102 of the substrate 100, or the pads 110 may extend simultaneously onto the first surface 102 and the second surface 104 of the substrate 100.
探針結構120配置在基板100的第一表面102上。探針結構包括至少一根探針122，探針122穿過貫穿孔106而在基板100的第二表面104上與銲墊110連接。探針122的材料例如是鎢、錸、鈹銅合金、金、銀、鉑或其他適合的材料。當探針結構120具有多根探針122時，探針122可設置成單層結構或多層堆疊結構。在本實施例中，探針122是以設置成單層結構為例進行說明。當設置成單層結構的探針122發生損壞時，可輕易地對探針122進行更換。The probe structure 120 is disposed on the first surface 102 of the substrate 100. The probe structure includes at least one probe 122 that passes through the through hole 106 and is coupled to the pad 110 on the second surface 104 of the substrate 100. The material of the probe 122 is, for example, tungsten, tantalum, beryllium copper alloy, gold, silver, platinum or other suitable material. When the probe structure 120 has a plurality of probes 122, the probes 122 may be arranged in a single layer structure or a multilayer stack structure. In the present embodiment, the probe 122 is described as an example in which a single layer structure is provided. When the probe 122 disposed in a single layer structure is damaged, the probe 122 can be easily replaced.
在本實施例中，探針122與銲墊110的連接方式例如是銲接。舉例來說，可藉由銲料130來進行探針122與銲墊110之間的銲接。銲料130的材料例如是錫、鎳、銀、鉛或其他適合的材料。由於銲墊110與基板100的電路圖 案為電性連接，因此探針結構120可利用探針122連接至銲墊110而與基板100的電路圖案作電性連接，進而形成檢測迴路。In the present embodiment, the connection manner of the probe 122 and the pad 110 is, for example, soldering. For example, soldering between the probe 122 and the pad 110 can be performed by the solder 130. The material of the solder 130 is, for example, tin, nickel, silver, lead or other suitable material. Due to the circuit diagram of the pad 110 and the substrate 100 The electrical connection is made. Therefore, the probe structure 120 can be connected to the pad 110 by using the probe 122 to electrically connect with the circuit pattern of the substrate 100 to form a detection loop.
此外，在進行連接探針122與銲墊110的連接操作(如銲接)時，使用者往往需要操作空間以進行上述的連接操作。然而，因為在基板100的第一表面102上配置有多個探針結構120，探針結構120的存在將減少使用者的操作空間而不利於使用者進行上述連接操作。相較之下，由於在基板100的第二表面104上並沒有配置探針結構120，因此在連接探針122與銲墊110之前，可先將探針122穿過貫穿孔106而露出於第二表面104，進而使得使用者可在第二表面104上進行探針122與銲墊110之間的連接操作。換句話說，若先將探針122穿過貫穿孔106並在基板100的第二表面104上進行探針122與銲墊110之間的連接操作，此種方法可提供使用者更大的操作空間以更容易並更精確地連接探針122與銲墊110。此外，當探針結構120具有多根探針122時，由於上述方法是將探針122穿過貫穿孔106後，再進行探針122與銲墊110之間的連接操作，可使得探針122的長度趨近於最短及等長，從而提升測試訊號的電性。Further, when performing a connection operation (such as soldering) of the connection probe 122 and the pad 110, the user often needs an operation space to perform the above-described connection operation. However, because a plurality of probe structures 120 are disposed on the first surface 102 of the substrate 100, the presence of the probe structure 120 will reduce the user's operating space and would be advantageous for the user to perform the above described connection operations. In contrast, since the probe structure 120 is not disposed on the second surface 104 of the substrate 100, the probe 122 may be first passed through the through hole 106 to be exposed before the probe 122 and the pad 110 are connected. The two surfaces 104, in turn, allow the user to perform a connection operation between the probe 122 and the pad 110 on the second surface 104. In other words, if the probe 122 is first passed through the through hole 106 and the connection between the probe 122 and the pad 110 is performed on the second surface 104 of the substrate 100, this method can provide a greater operation for the user. The space makes it easier and more precise to connect the probe 122 to the pad 110. In addition, when the probe structure 120 has a plurality of probes 122, since the above method is to pass the probe 122 through the through hole 106, the connection operation between the probe 122 and the pad 110 is performed, so that the probe 122 can be made. The length of the test signal is close to the shortest and the same length, thereby improving the electrical conductivity of the test signal.
另外，由於本實施例的探針122是穿過貫穿孔106而在基板100的第二表面104上與銲墊110進行連接，因此本實施例可利用貫穿孔106的設計來使得各探針122之間具有一定的距離，並進一步地防止各探針122互相接觸而 產生電路短路的問題。換句話說，本實施例不需使用絕緣套管即可防止探針122之間產生電路短路的問題，進而可節省使用絕緣套管所花費的成本。In addition, since the probe 122 of the present embodiment is connected to the pad 110 on the second surface 104 of the substrate 100 through the through hole 106, the present embodiment can utilize the design of the through hole 106 to make each probe 122 There is a certain distance between them, and further preventing the probes 122 from contacting each other. A problem that creates a short circuit. In other words, the present embodiment eliminates the problem of short circuit between the probes 122 without using an insulating sleeve, thereby saving the cost of using the insulating sleeve.
在本實施例中，探針結構120更可包括基座124，基座124配置在基板100的第一表面102上，且探針122配置在基座124上。基座124的作用為承載探針122，進而使得在探針卡10的製作過程中或在後續使用探針122以檢測晶片的過程中，探針122不會因為應力作用而變形。基座124的材料例如是陶瓷或其他絕緣材料，因此可避免探針122發生電路短路的問題。探針122例如是經由黏著劑126而固定於基座124上，藉此可避免探針122因為受到應力而產生變形或位移等情形。黏著劑126的材料例如是環氧樹脂。探針122包括針尖部128，針尖部128位於基座124上方，且針尖部128與基座124的表面的法線方向D的夾角α介於0°至10°之間。In the present embodiment, the probe structure 120 further includes a pedestal 124 disposed on the first surface 102 of the substrate 100 and the probe 122 disposed on the pedestal 124. The pedestal 124 functions to carry the probe 122 such that during the fabrication of the probe card 10 or during subsequent use of the probe 122 to detect the wafer, the probe 122 is not deformed by stress. The material of the pedestal 124 is, for example, ceramic or other insulating material, so that the problem of short circuiting of the probe 122 can be avoided. The probe 122 is fixed to the susceptor 124 via an adhesive 126, for example, thereby preventing the probe 122 from being deformed or displaced due to stress. The material of the adhesive 126 is, for example, an epoxy resin. The probe 122 includes a tip portion 128 that is positioned above the pedestal 124 with an angle a between the tip portion 128 and the normal direction D of the surface of the pedestal 124 between 0° and 10°.
此外，探針卡10更包括支撐裝置140。支撐裝置140的材料例如是經淬火處理的鋼。支撐裝置140包括支撐板142及至少一個支撐柱144。支撐柱144配置在支撐板142上。支撐板142與支撐柱144例如為可為一體成形或藉由銲接等方式進行連接以構成支撐裝置140。支撐板142配置140在基板100的第二表面104下方，支撐柱142穿過並突出基板100以承載基座124。在檢測晶片的過程中，基板100可能會因此為溫度變化而產生熱變形，因此基座124有可能因為基板100的熱變形而偏離原來的位置。然 而，藉由支撐裝置140可將基座124固定在一定的位置，並可避免在檢測晶片時探針結構120因為基板100的熱變形而產生位置偏移的問題。In addition, the probe card 10 further includes a support device 140. The material of the support device 140 is, for example, a quenched steel. The support device 140 includes a support plate 142 and at least one support post 144. The support post 144 is disposed on the support plate 142. The support plate 142 and the support post 144 may be integrally formed or joined by welding or the like to constitute the support device 140, for example. The support plate 142 is disposed 140 below the second surface 104 of the substrate 100, and the support post 142 passes through and protrudes from the substrate 100 to carry the pedestal 124. During the process of detecting the wafer, the substrate 100 may be thermally deformed due to temperature changes, and thus the susceptor 124 may deviate from the original position due to thermal deformation of the substrate 100. Of course However, the susceptor 124 can be fixed at a certain position by the supporting device 140, and the problem that the probe structure 120 is displaced due to thermal deformation of the substrate 100 when the wafer is detected can be avoided.
基於上述實施例可知，由於探針122是穿過貫穿孔106而在基板100的第二表面104上與銲墊110連接，因此使用者可更容易地進行連接操作及調整進行連接時所需的探針長度，進而使得探針卡在製作上較為簡單。此外，當探針結構120具有多根探針122時，由於本實施例的探針卡10是在第二表面104上將探針122與銲墊110連接，因此可使得各探針122的長度趨近於最短及等長，從而提升測試訊號的電性。Based on the above embodiment, since the probe 122 is connected to the pad 110 on the second surface 104 of the substrate 100 through the through hole 106, the user can more easily perform the connection operation and adjust the connection required for the connection. The length of the probe makes the probe card simpler to manufacture. In addition, when the probe structure 120 has a plurality of probes 122, since the probe card 10 of the present embodiment connects the probe 122 to the pad 110 on the second surface 104, the length of each probe 122 can be made. Approaching the shortest and equal length, thus improving the electrical conductivity of the test signal.
圖2為本發明之第二實施例的探針卡的剖面示意圖。請參照圖2，圖2的探針卡20與圖1的探針卡10的相異之處在於：探針卡20的貫穿孔206並不直接貫穿銲墊210，而是僅貫穿基板200。換句話說，銲墊210是配置於貫穿孔206周圍，而探針122穿過貫穿孔206後，在基板200的第二表面104上與銲墊210連接。除此之外，在探針卡20與探針卡10中，相同的構件使用相同標號表示，故於此不再贅述。2 is a schematic cross-sectional view of a probe card according to a second embodiment of the present invention. Referring to FIG. 2 , the probe card 20 of FIG. 2 is different from the probe card 10 of FIG. 1 in that the through hole 206 of the probe card 20 does not directly penetrate the pad 210 but only penetrates the substrate 200 . In other words, the pad 210 is disposed around the through hole 206, and the probe 122 is connected to the pad 210 on the second surface 104 of the substrate 200 after passing through the through hole 206. In addition, in the probe card 20 and the probe card 10, the same members are denoted by the same reference numerals and will not be described again.
基於上述實施例可知，由於探針卡20亦是將探針122穿過貫穿孔206而在基板200的第二表面104上與該銲墊連接，因此探針卡20亦具有製作上較為簡單的優點。Based on the above embodiment, since the probe card 20 is also connected to the pad on the second surface 104 of the substrate 200 through the through hole 206, the probe card 20 is also relatively simple to manufacture. advantage.
綜上所述，上述實施例的探針卡至少具有下列特點。上述實施例的探針卡較容易進行探針與銲墊之間的連接操 作，並進而使得探針卡在製作上較為簡單。此外，當上述實施例的探針卡的探針結構具有多根探針時，探針的長度趨近於最短及等長，從而提升測試訊號的電性。In summary, the probe card of the above embodiment has at least the following features. The probe card of the above embodiment is easier to perform the connection between the probe and the pad. This makes it easier to make the probe card in production. In addition, when the probe structure of the probe card of the above embodiment has a plurality of probes, the length of the probe approaches the shortest and the same length, thereby improving the electrical conductivity of the test signal.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
10、20‧‧‧探針卡10, 20‧‧ ‧ probe card
100、200‧‧‧基板100, 200‧‧‧ substrate
102‧‧‧第一表面102‧‧‧ first surface
104‧‧‧第二表面104‧‧‧ second surface
106、206‧‧‧貫穿孔106, 206‧‧‧through holes
110、210‧‧‧銲墊110, 210‧‧‧ solder pads
120‧‧‧探針結構120‧‧‧ probe structure
122‧‧‧探針122‧‧‧Probe
124‧‧‧基座124‧‧‧Base
126‧‧‧黏著劑126‧‧‧Adhesive
128‧‧‧針尖部128‧‧‧Needle
130‧‧‧銲料130‧‧‧ solder
140‧‧‧支撐裝置140‧‧‧Support device
142‧‧‧支撐板142‧‧‧Support board
144‧‧‧支撐柱144‧‧‧Support column
D‧‧‧法線方向D‧‧‧ normal direction
α‧‧‧夾角‧‧‧‧ angle
圖1為本發明之第一實施例的探針卡的剖面示意圖。1 is a schematic cross-sectional view of a probe card according to a first embodiment of the present invention.
圖2為本發明之第二實施例的探針卡的剖面示意圖。2 is a schematic cross-sectional view of a probe card according to a second embodiment of the present invention.
10‧‧‧探針卡10‧‧‧ probe card
100‧‧‧基板100‧‧‧Substrate
102‧‧‧第一表面102‧‧‧ first surface
104‧‧‧第二表面104‧‧‧ second surface
106‧‧‧貫穿孔106‧‧‧through holes
110‧‧‧銲墊110‧‧‧ solder pads
120‧‧‧探針結構120‧‧‧ probe structure
122‧‧‧探針122‧‧‧Probe
124‧‧‧基座124‧‧‧Base
126‧‧‧黏著劑126‧‧‧Adhesive
128‧‧‧針尖部128‧‧‧Needle
130‧‧‧銲料130‧‧‧ solder
140‧‧‧支撐裝置140‧‧‧Support device
142‧‧‧支撐板142‧‧‧Support board
144‧‧‧支撐柱144‧‧‧Support column
D‧‧‧法線方向D‧‧‧ normal direction
α‧‧‧夾角‧‧‧‧ angle
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101144830A TWI467180B (en) | 2012-11-29 | 2012-11-29 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101144830A TWI467180B (en) | 2012-11-29 | 2012-11-29 | Probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201421032A TW201421032A (en) | 2014-06-01 |
| TWI467180B true TWI467180B (en) | 2015-01-01 |
Family
ID=51393363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101144830A TWI467180B (en) | 2012-11-29 | 2012-11-29 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI467180B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4899104A (en) * | 1986-11-18 | 1990-02-06 | Erich Luther | Adapter for a printed circuit board testing device |
| JPH0750321A (en) * | 1993-08-04 | 1995-02-21 | Yokowo Co Ltd | Probe card |
| TW460698B (en) * | 1999-04-16 | 2001-10-21 | Advantest Corp | Probe card and its manufacture |
| JP2006003191A (en) * | 2004-06-17 | 2006-01-05 | Micronics Japan Co Ltd | Electrical connection device |
| TWM392351U (en) * | 2010-04-06 | 2010-11-11 | Mpi Corp | Probe card structure |
| TWI342401B (en) * | 2006-11-30 | 2011-05-21 | Nihon Micronics Kk |
-
2012
- 2012-11-29 TW TW101144830A patent/TWI467180B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4899104A (en) * | 1986-11-18 | 1990-02-06 | Erich Luther | Adapter for a printed circuit board testing device |
| JPH0750321A (en) * | 1993-08-04 | 1995-02-21 | Yokowo Co Ltd | Probe card |
| TW460698B (en) * | 1999-04-16 | 2001-10-21 | Advantest Corp | Probe card and its manufacture |
| JP2006003191A (en) * | 2004-06-17 | 2006-01-05 | Micronics Japan Co Ltd | Electrical connection device |
| TWI342401B (en) * | 2006-11-30 | 2011-05-21 | Nihon Micronics Kk | |
| TWM392351U (en) * | 2010-04-06 | 2010-11-11 | Mpi Corp | Probe card structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201421032A (en) | 2014-06-01 |
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