TWM553422U - Vertical probe card and probe head for wafer test - Google Patents
Vertical probe card and probe head for wafer test Download PDFInfo
- Publication number
- TWM553422U TWM553422U TW106212205U TW106212205U TWM553422U TW M553422 U TWM553422 U TW M553422U TW 106212205 U TW106212205 U TW 106212205U TW 106212205 U TW106212205 U TW 106212205U TW M553422 U TWM553422 U TW M553422U
- Authority
- TW
- Taiwan
- Prior art keywords
- openings
- plate
- adjacent
- downloading
- distance
- Prior art date
Links
Description
本揭示是關於一種探針頭，特別是關於一種用於晶圓量測之垂直式探針卡及其探針頭。 The present disclosure relates to a probe head, and more particularly to a vertical probe card for wafer measurement and a probe head thereof.
近年來，隨著電子產品朝向精密與多功能化發展，應用在電子產品內的積體電路之晶片結構也趨於複雜。在晶片的製造中通常係採用批次性的大量生產，因此為了確保晶片的電氣品質，在將晶片進行封裝前會先進行晶片級量測。在現行的晶片製程中，一般係採用探針卡(Probe card)來測試晶片。並且根據探針的型態可分為懸臂式探針卡(cantilever probe card)與垂直式探針卡(vertical probe card)。在使用上，藉由將探針卡的探針電性接觸晶片的接觸墊，再經探針卡的電路板將電氣訊號連接到測試機(Tester)，使測試機傳送測試訊號到晶片或接收來自晶片的輸出訊號，進而達到量測晶片的電氣特性之功效，並且使用者可進一步根據量測的結果將不良晶片剔除，以進行後續的封裝處理。 In recent years, as electronic products have advanced toward precision and multi-functionality, the wafer structure of integrated circuits applied in electronic products has also become complicated. In the manufacture of wafers, batch mass production is usually used. Therefore, in order to ensure the electrical quality of the wafer, wafer level measurement is performed before the wafer is packaged. In the current wafer process, a probe card is generally used to test the wafer. And according to the type of the probe, it can be divided into a cantilever probe card and a vertical probe card. In use, the test signal is transmitted to the chip or received by electrically connecting the probe of the probe card to the contact pad of the wafer and then connecting the electrical signal to the tester via the circuit board of the probe card. The output signal from the wafer is used to measure the electrical characteristics of the wafer, and the user can further reject the defective wafer according to the measurement result for subsequent packaging processing.
請參照第1圖，其顯示一種習知之用於垂直式探針卡之探針頭10之結構示意圖。探針頭10是以裝配的方式製作而成，主要包含上載板11(upper die)、下載板12(lower die)、間隔板13、和複數個探針14。上載 板11和下載板12上形成有複數個微小的開孔110和120，以及間隔板13為中空的結構，其中該中空的結構的位置對應於上載板11和下載板12之開孔110和120的位置。藉由將上載板11和下載板12分別鎖附在間隔板13上，並且將每一探針14係貫穿通過上載板11和下載板12之對應的開孔，進而完成探針頭10之組裝。在使用上，探針14之靠近上載板11之一端是用於與垂直式探針卡之測試載板15電性接觸，以及探針14之靠近下載板12之一端是用於與待測晶圓W電性接觸。 Referring to Figure 1, there is shown a schematic view of a conventional probe head 10 for a vertical probe card. The probe head 10 is fabricated in an assembled manner and mainly includes an upper die 11, a lower die, a spacer 13, and a plurality of probes 14. upload The board 11 and the downloading board 12 are formed with a plurality of minute openings 110 and 120, and the partitioning plate 13 has a hollow structure, wherein the position of the hollow structure corresponds to the openings 110 and 120 of the loading board 11 and the downloading board 12. s position. The assembly of the probe head 10 is completed by respectively attaching the uploading plate 11 and the downloading plate 12 to the partitioning plate 13, and passing each probe 14 through the corresponding opening of the loading plate 11 and the downloading plate 12. . In use, one end of the probe 14 adjacent to the uploading plate 11 is for electrical contact with the test carrier 15 of the vertical probe card, and one end of the probe 14 adjacent to the downloading plate 12 is for use with the crystal to be tested. Round W electrical contact.
如第1圖所示，在習知的探針頭10中，上載板11和下載板12之相鄰兩開孔之間的間距P1會保持相同。然而，隨著電子產品朝向小型化發展，間距P1的大小勢必會隨之微縮，使得開孔與開孔之間的間隔壁的厚度越來越薄。並且，由於加工上的限制，當間距P1小於100微米時，容易發生間隔壁破裂的問題，導致相鄰的探針會彼此接觸進而造成短路。再者，由於組裝上的需求，上載板11之開孔的孔徑通常會比下載板12之開孔的孔徑還大，因此，上載板11在製作上的難度又更高，也具有較高的破孔風險。 As shown in Fig. 1, in the conventional probe head 10, the pitch P1 between the adjacent openings of the loading plate 11 and the downloading plate 12 will remain the same. However, as electronic products are moving toward miniaturization, the size of the pitch P1 is bound to shrink, so that the thickness of the partition wall between the opening and the opening is getting thinner and thinner. Moreover, due to processing limitations, when the pitch P1 is less than 100 μm, the problem of the partition wall rupture easily occurs, causing adjacent probes to contact each other to cause a short circuit. Moreover, due to the assembly requirements, the aperture of the opening of the loading plate 11 is generally larger than the aperture of the opening of the downloading board 12. Therefore, the loading board 11 is more difficult to manufacture and has a higher Risk of breaking holes.
有鑑於此，有必要提供一種用於晶圓量測之垂直式探針卡與探針頭，以解決習知技術所存在的問題。 In view of this, it is necessary to provide a vertical probe card and probe head for wafer measurement to solve the problems of the prior art.
為解決上述技術問題，本揭示之目的在於提供一種用於晶圓量測之垂直式探針卡與探針頭，藉由增加探針頭之上載板的間距，以避免發生破孔而導致探針接觸而短路的問題。 In order to solve the above technical problem, the purpose of the present disclosure is to provide a vertical probe card and a probe head for wafer measurement, which can be prevented by causing a hole to be broken by increasing the spacing of the loading plates of the probe head. The problem of short circuit by needle contact.
為達成上述目的，本揭示提供一種用於晶圓量測之探針頭，包含：一上載板，包含複數個第一開孔；一下載板，包含複數個第二開孔； 以及複數個探針，其中每一探針組裝在彼此對應的其中之一該第一開孔和其中之一該第二開孔中，以及其中該上載板之相鄰的兩個第一開孔之間距不同於該下載板之相鄰的兩個第二開孔之間距。 In order to achieve the above object, the present disclosure provides a probe head for wafer measurement, comprising: an uploading plate comprising a plurality of first openings; and a downloading plate comprising a plurality of second openings; And a plurality of probes, wherein each probe is assembled in one of the first openings and one of the second openings corresponding to each other, and wherein the first two openings of the loading plate are adjacent The distance between the two adjacent openings is different from the distance between the two adjacent openings of the downloading board.
於本揭示其中之一較佳實施例中，該上載板之相鄰的兩個第一開孔之間距大於該下載板之相鄰的兩個第二開孔之間距。 In a preferred embodiment of the present disclosure, the distance between two adjacent first openings of the loading plate is greater than the distance between two adjacent second openings of the downloading plate.
於本揭示其中之一較佳實施例中，該下載板之相鄰的兩個第二開孔之間距小於100微米。 In a preferred embodiment of the present disclosure, the distance between two adjacent second openings of the downloading plate is less than 100 microns.
於本揭示其中之一較佳實施例中，該探針頭還包含一間隔板，設置在該上載板和該下載板之間，用於使該上載板和該下載板互相間隔一距離。 In a preferred embodiment of the present disclosure, the probe head further includes a spacer disposed between the uploading plate and the downloading plate for spacing the loading plate and the downloading plate from each other by a distance.
本揭示還提供一種用於晶圓量測之垂直式探針卡，包含：一電路板；一測試載板，嵌入在該電路板上，包含複數個上接觸墊；一探針頭，包含：一上載板，包含複數個第一開孔；一下載板，包含複數個第二開孔；以及複數個探針，其中每一探針組裝在彼此對應的其中之一該第一開孔和其中之一該第二開孔中；以及一定位治具，組裝在該電路板上，用於將該探針頭定位在該電路板上，使得該探針頭之該複數個探針之一端與該測試載板上之對應的上接觸墊電性接觸，其中該上載板之相鄰的兩個第一開孔之間距不同於該下載板之相鄰的兩個第二開孔之間距。 The present disclosure also provides a vertical probe card for wafer measurement, comprising: a circuit board; a test carrier board embedded on the circuit board, comprising a plurality of upper contact pads; and a probe head comprising: An uploading plate comprising a plurality of first openings; a downloading plate comprising a plurality of second openings; and a plurality of probes, wherein each of the probes is assembled in one of the first openings and the one of the first openings One of the second openings; and a positioning fixture assembled on the circuit board for positioning the probe head on the circuit board such that one end of the plurality of probes of the probe head Corresponding upper contact pads of the test carrier are electrically contacted, wherein a distance between two adjacent first openings of the uploading plate is different from a distance between two adjacent second openings of the downloading plate.
於本揭示其中之一較佳實施例中，該探針頭之該複數個探針之靠近該上載板之一端與該測試載板電性接觸，以及該探針頭之該複數個探針之靠近該下載板之一端與一待測晶圓電性接觸。 In a preferred embodiment of the present disclosure, the plurality of probes of the probe head are in electrical contact with the test carrier near one end of the uploading plate, and the plurality of probes of the probe head One end of the download board is in electrical contact with a wafer to be tested.
於本揭示其中之一較佳實施例中，該測試載板之相鄰的兩個 上接觸墊之間距大於該下載板之相鄰的兩個第二開孔之間距。 In one of the preferred embodiments of the present disclosure, two adjacent test boards are The distance between the upper contact pads is greater than the distance between the two adjacent second openings of the downloading plate.
相較於習知技術，本揭示藉由將下載板之開孔的間距設置為符合待測晶片之下接觸墊的間距，並且將下載板之開孔的間距設置為大於下載板之開孔的間距，以降低上、下載板之開孔破孔的風險，進而可避免相鄰的探針會彼此接觸進而造成短路的問題。 Compared with the prior art, the present disclosure sets the spacing of the openings of the downloading board to match the spacing of the contact pads under the wafer to be tested, and sets the spacing of the openings of the downloading board to be larger than the opening of the downloading board. The spacing is used to reduce the risk of holes in the upper and lower downloading plates, thereby avoiding the problem that adjacent probes will contact each other and cause a short circuit.
1‧‧‧垂直式探針卡 1‧‧‧Vertical probe card
10、20‧‧‧探針頭 10, 20‧‧‧ probe head
11、21‧‧‧上載板 11, 21‧‧‧ upload board
210‧‧‧第一開孔 210‧‧‧First opening
12、22‧‧‧下載板 12, 22‧‧‧ download board
220‧‧‧第二開孔 220‧‧‧Second opening
13、23‧‧‧間隔板 13, 23‧‧‧ spacer
14、24‧‧‧探針 14, 24 ‧ ‧ probe
30‧‧‧定位治具 30‧‧‧ positioning fixture
40‧‧‧電路板 40‧‧‧ boards
15、50‧‧‧測試載板 15, 50‧‧‧ test carrier
501‧‧‧上接觸墊 501‧‧‧Upper contact pad
60‧‧‧機框支撐件 60‧‧‧frame support
110、120‧‧‧開孔 110, 120‧‧‧ openings
W‧‧‧待測晶圓 W‧‧‧ wafer under test
P‧‧‧下接觸墊 P‧‧‧ lower contact pad
P1、P2、P3、P4‧‧‧間距 P1, P2, P3, P4‧‧‧ spacing
第1圖顯示一種習知之用於垂直式探針卡之探針頭之結構示意圖；第2圖顯示根據本揭示較佳實施例之垂直式探針卡之零件***示意圖；以及第3圖顯示第2圖之探針卡之結構示意圖。 1 is a schematic view showing the structure of a conventional probe head for a vertical probe card; FIG. 2 is a schematic view showing the explosion of a part of a vertical probe card according to a preferred embodiment of the present disclosure; and FIG. 3 is a view 2 is a schematic diagram of the structure of the probe card.
為了讓本揭示之上述及其他目的、特徵、優點能更明顯易懂，下文將特舉本揭示較佳實施例，並配合所附圖式，作詳細說明如下。 The above and other objects, features, and advantages of the present invention will become more apparent and understood.
請參照第2圖和第3圖，其第2圖顯示根據本揭示較佳實施例之垂直式探針卡1之零件***示意圖，以及第3圖顯示第2圖之探針卡之結構示意圖。垂直式探針卡1主要由探針頭20(Probe Head)、定位治具30、電路板40(PCB)、測試載板50(substrate)及配合之機框支撐件60組合而成，其中測試載板50是嵌入在電路板40上，以及定位治具30是組裝在電路板40上，並且是用於將探針頭20固定且定位在電路板40上。 Please refer to FIG. 2 and FIG. 3, FIG. 2 is a schematic view showing the explosion of the parts of the vertical probe card 1 according to the preferred embodiment of the present disclosure, and FIG. 3 is a schematic view showing the structure of the probe card of FIG. The vertical probe card 1 is mainly composed of a probe head 20, a positioning fixture 30, a circuit board 40 (PCB), a test carrier 50 (substrate) and a matching frame support 60, wherein the test is performed. The carrier 50 is embedded on the circuit board 40, and the positioning fixture 30 is assembled on the circuit board 40 and is used to secure and position the probe head 20 on the circuit board 40.
如第3圖所示，探針頭20包含上載板21(upper die)、下載板22(lower die)、間隔板23、和複數個探針24。上載板21形成有複數個微小 的第一開孔210，以及下載板22上形成有複數個微小的第二開孔220。間隔板23為中空的結構，設置在上載板21和下載板22之間，用於使上載板21和下載板22互相間隔一距離。間隔板23之該中空的結構的位置對應於上載板21和下載板22之第一開孔210和220的位置。在組裝時，先將上載板21和下載板22分別固定在間隔板23上，接著將每一探針24組裝且貫穿通過彼此對應的其中之一第一開孔210和其中之一第二開孔220中，進而完成探針頭20之組裝。 As shown in FIG. 3, the probe head 20 includes an upper die 21, a lower die 22, a spacer 23, and a plurality of probes 24. The uploading plate 21 is formed with a plurality of tiny The first opening 210 and the downloading plate 22 are formed with a plurality of minute second openings 220. The partitioning plate 23 has a hollow structure and is disposed between the loading plate 21 and the downloading plate 22 for spacing the loading plate 21 and the downloading plate 22 from each other by a distance. The position of the hollow structure of the spacer 23 corresponds to the positions of the first openings 210 and 220 of the loading plate 21 and the downloading plate 22. When assembling, the uploading plate 21 and the downloading plate 22 are respectively fixed on the partitioning plate 23, and then each of the probes 24 is assembled and passed through one of the first openings 210 and one of the second openings 210 corresponding to each other. In the hole 220, the assembly of the probe head 20 is completed.
如第3圖所示，測試載板50上設置有複數個上接觸墊501，以及待測晶圓W上同樣設置有複數個下接觸墊P。在使用上，每一探針24之靠近上載板21之一端係與垂直式探針卡1之測試載板50上之對應的上接觸墊501電性接觸，以及靠近下載板22之一端係與待測晶圓W上之對應的下接觸墊P電性接觸。 As shown in FIG. 3, a plurality of upper contact pads 501 are disposed on the test carrier 50, and a plurality of lower contact pads P are also disposed on the wafer W to be tested. In use, one end of each probe 24 adjacent to the loading plate 21 is in electrical contact with a corresponding upper contact pad 501 on the test carrier 50 of the vertical probe card 1, and is adjacent to one end of the download plate 22. The corresponding lower contact pads P on the wafer W to be tested are electrically contacted.
如第3圖所示，上載板21之相鄰的第一開孔210的間距P2設置為符合測試載板50之相鄰的上接觸墊501的間距P4，並且下載板22之相鄰的第二開孔220的間距P3設置為符合待測晶片W之下接觸墊P的間距，其中上載板21之相鄰的第一開孔210的間距P2以及測試載板50之相鄰的上接觸墊501的間距P4皆不同於下載板22之相鄰的第二開孔220的間距P3。更明確地說，上載板21之相鄰的第一開孔210的間距P1和測試載板50之相鄰的上接觸墊501的間距P4皆大於下載板22之相鄰的第二開孔220的間距P2。因此，對於具有相對較大孔徑的第一開孔210而言，將兩相鄰的第一開孔210的間距P1拉大，可有效地降低製造上的難度。應當理解的是，此種設計的探針頭20特別適合應用在製造下載板22之相鄰的第二開孔220的間距P2小於100 微米的產品。 As shown in FIG. 3, the pitch P2 of the adjacent first opening holes 210 of the loading plate 21 is set to match the pitch P4 of the adjacent upper contact pads 501 of the test carrier 50, and the adjacent ones of the downloading plates 22 are provided. The pitch P3 of the two openings 220 is set to match the pitch of the contact pads P under the wafer W to be tested, wherein the pitch P2 of the adjacent first openings 210 of the uploading plate 21 and the adjacent upper contact pads of the test carrier 50 The pitch P4 of 501 is different from the pitch P3 of the adjacent second opening 220 of the downloading board 22. More specifically, the pitch P1 of the adjacent first opening 210 of the loading plate 21 and the pitch P4 of the adjacent upper contact pad 501 of the test carrier 50 are both larger than the adjacent second opening 220 of the downloading board 22. The pitch is P2. Therefore, for the first opening 210 having a relatively large aperture, the pitch P1 of the two adjacent first openings 210 is enlarged, which can effectively reduce the manufacturing difficulty. It should be understood that the probe head 20 of such a design is particularly suitable for use in the spacing P2 of the adjacent second opening 220 of the manufacturing download plate 22 that is less than 100. Micron products.
再者，在本揭示之垂直式探針卡1中，由於將上載板21之相鄰的第一開孔210的間距P1增加(例如下載板22之相鄰的第二開孔220的間距P2為100微米，上載板21之相鄰的第一開孔210的間距P1增加為大於100微米)，使得測試載板50之相鄰的上接觸墊501的間距P4也得以相應地增加，因此可一併降低測試載板50的製造難度，進而提升測試載板50的製造良率。 Furthermore, in the vertical probe card 1 of the present disclosure, since the pitch P1 of the adjacent first openings 210 of the loading plate 21 is increased (for example, the pitch P2 of the adjacent second openings 220 of the downloading plate 22) The distance P1 of the adjacent first openings 210 of the loading plate 21 is increased to 100 μm or more, so that the pitch P4 of the adjacent upper contact pads 501 of the test carrier 50 is correspondingly increased, so that Together, the manufacturing difficulty of the test carrier 50 is reduced, thereby improving the manufacturing yield of the test carrier 50.
綜上所述，本揭示藉由將下載板之開孔的間距設置為符合待測晶片之下接觸墊的間距，並且將下載板之開孔的間距設置為大於下載板之開孔的間距，以降低上、下載板之開孔破孔的風險，進而可避免相鄰的探針會彼此接觸進而造成短路的問題。 In summary, the present disclosure sets the spacing of the openings of the downloading board to match the spacing of the contact pads under the wafer to be tested, and sets the spacing of the openings of the downloading board to be larger than the spacing of the openings of the downloading board. In order to reduce the risk of holes in the opening and downloading plates, it is possible to avoid the problem that adjacent probes will contact each other and cause a short circuit.
雖然本揭示已用較佳實施例揭露如上，然其並非用以限定本揭示，本揭示所屬技術領域中具有通常知識者，在不脫離本揭示之精神和範圍內，當可作各種之更動與潤飾，因此本揭示之保護範圍當視後附之申請專利範圍所界定者為準。 The present disclosure has been disclosed in the above preferred embodiments, and is not intended to limit the scope of the disclosure, and the present invention may be practiced without departing from the spirit and scope of the disclosure. Retouching, therefore, the scope of protection of this disclosure is subject to the definition of the scope of the patent application.
20‧‧‧探針頭 20‧‧‧Probe head
21‧‧‧上載板 21‧‧‧ Upload board
210‧‧‧第一開孔 210‧‧‧First opening
22‧‧‧下載板 22‧‧‧Download Board
220‧‧‧第二開孔 220‧‧‧Second opening
23‧‧‧間隔板 23‧‧‧ Spacer
24‧‧‧探針 24‧‧‧ probe
50‧‧‧測試載板 50‧‧‧ test carrier
501‧‧‧上接觸墊 501‧‧‧Upper contact pad
W‧‧‧待測晶圓 W‧‧‧ wafer under test
P‧‧‧下接觸墊 P‧‧‧ lower contact pad
P2、P3、P4‧‧‧間距 P2, P3, P4‧‧‧ spacing
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106212205U TWM553422U (en) | 2017-08-17 | 2017-08-17 | Vertical probe card and probe head for wafer test |
| CN201721413460.2U CN207301134U (en) | 2017-08-17 | 2017-10-30 | Vertical probe card and probe head for chip measurement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106212205U TWM553422U (en) | 2017-08-17 | 2017-08-17 | Vertical probe card and probe head for wafer test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM553422U true TWM553422U (en) | 2017-12-21 |
Family
ID=61229431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106212205U TWM553422U (en) | 2017-08-17 | 2017-08-17 | Vertical probe card and probe head for wafer test |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207301134U (en) |
| TW (1) | TWM553422U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111474391B (en) * | 2019-01-23 | 2022-11-01 | 台湾中华精测科技股份有限公司 | High-speed probe card device and rectangular probe thereof |
| US11209479B2 (en) | 2019-10-29 | 2021-12-28 | International Business Machines Corporation | Stressing integrated circuits using a radiation source |
-
2017
- 2017-08-17 TW TW106212205U patent/TWM553422U/en not_active IP Right Cessation
- 2017-10-30 CN CN201721413460.2U patent/CN207301134U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN207301134U (en) | 2018-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10184956B2 (en) | Probe card | |
| JP4862017B2 (en) | Relay board, manufacturing method thereof, probe card | |
| TW201350882A (en) | Test apparatus and test method | |
| TWI620936B (en) | Testing probe card for integrated circuit | |
| JP4343256B1 (en) | Manufacturing method of semiconductor device | |
| KR20050106581A (en) | Structure of flip chip semiconductor package for testing a bump and method of fabricating the same | |
| TWM553422U (en) | Vertical probe card and probe head for wafer test | |
| TWI694262B (en) | Testing apparatus and testing method | |
| KR101120405B1 (en) | Probe block assembly | |
| TWI598596B (en) | Testing probe card for integrated circuit | |
| JP2015064382A (en) | Probe card for integrated circuit with structure having reinforced electric contact of probe | |
| JP4944982B2 (en) | Semiconductor wafer inspection method and semiconductor device manufacturing method | |
| TW201913101A (en) | Vertical probe card and probe head for wafer test | |
| JP2011038930A (en) | Probe card and test method of device to be inspected | |
| KR101416477B1 (en) | Probe card | |
| KR102276512B1 (en) | Jig for electric inspection and method of manufacturing the same | |
| JP4492976B2 (en) | Semiconductor device | |
| JP4877465B2 (en) | Semiconductor device, semiconductor device inspection method, semiconductor wafer | |
| KR20170047777A (en) | Interface board and method of manufacturing the interface board | |
| TWI487922B (en) | Testing apparatus for semiconductor component and method of testing a semiconductor component | |
| KR101452366B1 (en) | Fabrication method of connector for electrical connection | |
| TWI467180B (en) | Probe card | |
| JP2013250224A (en) | Probe card and method for manufacturing the same | |
| JP2002190506A (en) | Probe card | |
| US20140264335A1 (en) | Package substrate and method for testing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |