TWI465519B - Polysiloxane resin composition for optical semiconductor devices - Google Patents
Polysiloxane resin composition for optical semiconductor devices Download PDFInfo
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- TWI465519B TWI465519B TW098132503A TW98132503A TWI465519B TW I465519 B TWI465519 B TW I465519B TW 098132503 A TW098132503 A TW 098132503A TW 98132503 A TW98132503 A TW 98132503A TW I465519 B TWI465519 B TW I465519B
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- Prior art keywords
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- mass
- parts
- resin composition
- white pigment
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 230000003287 optical effect Effects 0.000 title claims abstract description 20
- -1 Polysiloxane Polymers 0.000 title claims description 23
- 229920001296 polysiloxane Polymers 0.000 title abstract description 9
- 239000012463 white pigment Substances 0.000 claims abstract description 21
- 239000011256 inorganic filler Substances 0.000 claims abstract description 18
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 18
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- 238000009833 condensation Methods 0.000 claims abstract description 14
- 230000005494 condensation Effects 0.000 claims abstract description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 5
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims abstract description 5
- 125000000962 organic group Chemical group 0.000 claims abstract description 5
- 239000004793 Polystyrene Substances 0.000 claims abstract description 4
- 229920002223 polystyrene Polymers 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 31
- 239000002245 particle Substances 0.000 claims description 18
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 229920006324 polyoxymethylene Polymers 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 5
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 229920002098 polyfluorene Polymers 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 34
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000000047 product Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000007789 sealing Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910000420 cerium oxide Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000007062 hydrolysis Effects 0.000 description 5
- 238000006460 hydrolysis reaction Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- DAOVYDBYKGXFOB-UHFFFAOYSA-N tris(2-methylpropoxy)alumane Chemical compound [Al+3].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-] DAOVYDBYKGXFOB-UHFFFAOYSA-N 0.000 description 4
- JDLYKQWJXAQNNS-UHFFFAOYSA-L zinc;dibenzoate Chemical compound [Zn+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 JDLYKQWJXAQNNS-UHFFFAOYSA-L 0.000 description 4
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 3
- XEMRAKSQROQPBR-UHFFFAOYSA-N (trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=CC=C1 XEMRAKSQROQPBR-UHFFFAOYSA-N 0.000 description 2
- ZTEHOZMYMCEYRM-UHFFFAOYSA-N 1-chlorodecane Chemical compound CCCCCCCCCCCl ZTEHOZMYMCEYRM-UHFFFAOYSA-N 0.000 description 2
- NGQTUWCDHLILAX-UHFFFAOYSA-N 2,2-dichloroethylbenzene Chemical compound ClC(Cl)CC1=CC=CC=C1 NGQTUWCDHLILAX-UHFFFAOYSA-N 0.000 description 2
- XYSNGNNDJGSUMY-UHFFFAOYSA-N C(C1CO1)OCCCC(C(OCC)(OCC)C)CCCCCCCC Chemical compound C(C1CO1)OCCCC(C(OCC)(OCC)C)CCCCCCCC XYSNGNNDJGSUMY-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000006750 UV protection Effects 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
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- 239000000460 chlorine Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical group CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000002050 diffraction method Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
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- 238000001914 filtration Methods 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000001782 photodegradation Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 229940098697 zinc laurate Drugs 0.000 description 2
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 2
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- FRGJFERYCDBOQD-UHFFFAOYSA-N 1,1,1,2-tetrachlorodecane Chemical compound CCCCCCCCC(Cl)C(Cl)(Cl)Cl FRGJFERYCDBOQD-UHFFFAOYSA-N 0.000 description 1
- WJMXTYZCTXTFJM-UHFFFAOYSA-N 1,1,1,2-tetraethoxydecane Chemical compound C(C)OC(C(OCC)(OCC)OCC)CCCCCCCC WJMXTYZCTXTFJM-UHFFFAOYSA-N 0.000 description 1
- VJNSCINLGYURMF-UHFFFAOYSA-N 1,1,1-trichloro-2-methyldecane Chemical compound CCCCCCCCC(C)C(Cl)(Cl)Cl VJNSCINLGYURMF-UHFFFAOYSA-N 0.000 description 1
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- JPEWDCTZJFUITH-UHFFFAOYSA-N 1-methoxydecane Chemical compound CCCCCCCCCCOC JPEWDCTZJFUITH-UHFFFAOYSA-N 0.000 description 1
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 description 1
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- WQHMEGBWNFRWDH-UHFFFAOYSA-N 2-methoxy-2-methylundecane Chemical compound CCCCCCCCCC(C)(C)OC WQHMEGBWNFRWDH-UHFFFAOYSA-N 0.000 description 1
- IIEWMRPKJCXTAD-UHFFFAOYSA-N 3-(trimethoxymethyl)undecane Chemical compound C(C)C(C(OC)(OC)OC)CCCCCCCC IIEWMRPKJCXTAD-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- SXPGQGNWEWPWQZ-UHFFFAOYSA-N 4-(triethoxymethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)OCC)CCCCCCCC SXPGQGNWEWPWQZ-UHFFFAOYSA-N 0.000 description 1
- GNPSQUCXOBDIDY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane Chemical compound C(CCCCCCC)C(C(OC)(OC)OC)CCC GNPSQUCXOBDIDY-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RVKBRFNNOKOSTA-UHFFFAOYSA-N C(CC)C(C(Cl)(Cl)Cl)CCCCCCCC Chemical compound C(CC)C(C(Cl)(Cl)Cl)CCCCCCCC RVKBRFNNOKOSTA-UHFFFAOYSA-N 0.000 description 1
- MSVCGIOFAAUXRS-UHFFFAOYSA-J C(CCC)[Sn+2]CCCC.C(CCCCCCCCCCC)(=O)[O-].[Zn+2].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-] Chemical compound C(CCC)[Sn+2]CCCC.C(CCCCCCCCCCC)(=O)[O-].[Zn+2].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-] MSVCGIOFAAUXRS-UHFFFAOYSA-J 0.000 description 1
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 1
- UFUYDYUQFXMKFB-UHFFFAOYSA-N CC(C(Cl)(Cl)C)CCCCCCCC Chemical compound CC(C(Cl)(Cl)C)CCCCCCCC UFUYDYUQFXMKFB-UHFFFAOYSA-N 0.000 description 1
- LNEJJQMNHUGXDW-UHFFFAOYSA-N CC(C(OCC)(OCC)C)CCCCCCCC Chemical compound CC(C(OCC)(OCC)C)CCCCCCCC LNEJJQMNHUGXDW-UHFFFAOYSA-N 0.000 description 1
- PZKBIVOXIFYDRI-UHFFFAOYSA-N CC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound CC(C(OCC)(OCC)OCC)CCCCCCCC PZKBIVOXIFYDRI-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical class N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 description 1
- BAVYZALUXZFZLV-UHFFFAOYSA-O Methylammonium ion Chemical compound [NH3+]C BAVYZALUXZFZLV-UHFFFAOYSA-O 0.000 description 1
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- GWFGDXZQZYMSMJ-UHFFFAOYSA-N Octadecansaeure-heptadecylester Natural products CCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC GWFGDXZQZYMSMJ-UHFFFAOYSA-N 0.000 description 1
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- JEAMYZVYIPYAPD-UHFFFAOYSA-N [Zr].C(C)#N.C(C)#N.C(C)#N.C(C)#N Chemical compound [Zr].C(C)#N.C(C)#N.C(C)#N.C(C)#N JEAMYZVYIPYAPD-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- NUPSHWCALHZGOV-UHFFFAOYSA-N acetic acid n-decyl ester Natural products CCCCCCCCCCOC(C)=O NUPSHWCALHZGOV-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000002009 alkene group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- BCZWPKDRLPGFFZ-UHFFFAOYSA-N azanylidynecerium Chemical compound [Ce]#N BCZWPKDRLPGFFZ-UHFFFAOYSA-N 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- HSVPRYWNEODRGU-UHFFFAOYSA-J butanoate;zirconium(4+) Chemical compound [Zr+4].CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O HSVPRYWNEODRGU-UHFFFAOYSA-J 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- FJDJVBXSSLDNJB-LNTINUHCSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FJDJVBXSSLDNJB-LNTINUHCSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical group CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- GSKJRJASWHSPSN-UHFFFAOYSA-N di(cycloundecen-1-yl)azaniumylideneazanide Chemical compound C=1CCCCCCCCCC=1[N+](=[N-])C1=CCCCCCCCCC1 GSKJRJASWHSPSN-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- UNFUYWDGSFDHCW-UHFFFAOYSA-N monochlorocyclohexane Chemical class ClC1CCCCC1 UNFUYWDGSFDHCW-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- NKBWPOSQERPBFI-UHFFFAOYSA-N octadecyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC NKBWPOSQERPBFI-UHFFFAOYSA-N 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- ANUMBTODEQDFNN-UHFFFAOYSA-N trichloromethylcyclohexane Chemical compound ClC(Cl)(Cl)C1CCCCC1 ANUMBTODEQDFNN-UHFFFAOYSA-N 0.000 description 1
- 229940088594 vitamin Drugs 0.000 description 1
- 229930003231 vitamin Natural products 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- LYSLZRDZOBAUFL-UHFFFAOYSA-L zinc;4-tert-butylbenzoate Chemical compound [Zn+2].CC(C)(C)C1=CC=C(C([O-])=O)C=C1.CC(C)(C)C1=CC=C(C([O-])=O)C=C1 LYSLZRDZOBAUFL-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/52—Encapsulations
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
本發明係關於一種光半導體裝置用聚矽氧樹脂組成物,詳而言之係關於一種聚矽氧樹脂組成物,其係含有:具有矽烷醇基之有機聚矽氧烷、與具有特定長度之直鏈狀二有機聚矽氧烷殘基的有機聚矽氧烷,成型性優異且硬化所造成之半導體裝置的翹曲、及硬化物之光劣化所造成的變色,尤其黃變之問題明顯被降低。
LED(Light Emitting Diode)等之光半導體元件,係可利用來作為各種之指示燈或光源。近年,進行光半導體裝置之高輸出力化及短波長化,使用於光半導體元件之周邊的樹脂材料,會進行光劣化而黃變等,致引起光輸出降低等之問題仍存在。
就光半導體密封用樹脂組成物而言,已知有以環氧樹脂、硬化劑及硬化促進劑作為構成成分之B階段狀光半導體密封用環氧樹脂組成物(專利文獻1)。就環氧樹脂而言,主要可使用雙酚A型環氧樹脂或雙酚F型環氧樹脂,可使用三縮水甘油基異氰酸酯等。但,該組成物係產生上述黃變的問題,尤其,因高溫或長時間之半導體元件的點燈。
就耐熱性、耐光性優異之發光元件用密封材環氧樹脂組成物而言,已知有含三聚異氰酸衍生物環氧樹脂者(專利文獻2)。但,該組成物就耐光性而言亦難謂充分。
含有耐紫外線性優異之重量平均分子量為5×102
以上之有機聚矽氧烷及縮合觸媒的LED元件密封用樹脂組成物(專利文獻3)。但,該組成物係與其使用反射材等之白色顏料的用途,不如適用於要求高透明性之用途。
近年,MAP(Matrix Array Packpage)方式等成型封裝體尺寸為大型化,密封樹脂進行硬化所產生之翹曲變成很大的問題。若翹曲大,產生封裝體之搬送步驟或切割步驟之不佳情形。上述各組成物係在此點中並非可滿足者。
(專利文獻)
(專利文獻1)特開平02-189958號公報
(專利文獻2)特開2005-306952號公報
(專利文獻3)特開2006-77234號公報
因此,本發明係目的在於提供一種因硬化所產生之半導體裝置的翹曲降低,可賦予白色性、耐熱性、耐光性優異之硬化物的光半導體裝置用聚矽氧樹脂組成物。
本發明之光半導體裝置用聚矽氧樹脂組成物,其係含有下述:
(A)以下述平均組成式(1)所示,且重量平均分子量(聚苯乙烯換算)為500~20000的有機聚矽氧烷 100質量份
(CH3
)a
Si(OR1
)b
(OH)c
O(4-a-b-c)/2
(1)
(式中,R1
為碳數1~4之有機基,且a、b、c滿足0.8≦a≦1.5,0≦b≦0.3、0.001≦c≦0.5,及0.801≦a+b+c<2之數目)
(B)白色顏料 3~200質量份
(C)前述白色顏料以外之無機填充劑 400~1000質量份
(D)縮合觸媒 0.01~10質量份
(E)具有以下述式(2)所示之直鏈狀二有機聚矽氧烷殘基的有機聚矽氧烷 2~50質量份
(R2
及R3
係互相獨立選自羥基、碳數1~3之烷基、環己基、乙烯基、苯基及烯丙基之基,m為5~50之整數)。
上述本發明之組成物係藉由(E)具有特定長度之直鏈狀二有機聚矽氧烷殘基的有機聚矽氧烷與具有分枝之(A)有機聚矽氧烷的組合而硬化時不對裝置造成變形,可賦予具備白色性、耐熱性、耐光性之硬化物。
(A)有機聚矽氧烷係具備矽烷醇基,(D)在縮合觸媒的存在下,形成交聯構造。在上述平均組成式(1)中,R1
為碳數1~4之有機基。a、b、c滿足0.8≦a≦1.5,0≦b≦0.3、0.001≦c≦0.5,及0.801≦a+b+c<2之數目。
含表示CH3
之含量的a未達0.8之有機聚矽氧烷的組成物係其硬化物太硬,可產生龜裂等,故不佳,另外,a超過1.5之樹脂係不會進行固形化。宜為0.9≦a≦1.2,更宜為0.9≦a≦1.1。
若OR1
之含量b超過0.3,分子量變小,有時防止龜裂性能變成不充分。宜為0.001≦b≦0.2,更宜為0.01≦b≦0.1。又,OR1
之基係可以紅外線吸收光譜(IR)、鹼龜裂化所產生之醇定量法等定量。
Si原子結合OH基之含量c超過0.5的有機聚矽氧烷係藉加熱硬化時之縮合反應、及/或與(E)成分之縮合反應,為高硬度,但得到缺乏耐龜裂性之硬化物。c未達0.001之有機聚矽氧烷係有融點變高的傾向,於作業性上產生問題。又,若完全沒有與(E)成分之結合生成,於硬化物內未被固定化之結果,有硬化物之硬度低,耐溶劑性差之傾向。宜為0.01≦c≦0.3,更宜為0.05≦c≦0.2。控制c之條件宜使原料之烷氧基的完全縮合率為86~96%,未達86%時,融點變低,若超過96%,有融點變成太高之傾向。
從以上之事,宜為0.911≦a+b+c≦1.8,更宜為1.0≦a+b+c≦1.5。
上述平均組成式(1)中,R1
為同一或異種之碳數1~4的有機基可舉例如甲基、乙基、異丙基、正丁基等之烷基、或乙烯基、烯丙基等之烯基,就原料容易取得之點,宜為甲基及異丙基。
(A)有機聚矽氧烷係依GPC所測定之聚苯乙烯標準換算的重量平均分子量為500~20000,宜為1000~10000,更宜為2000~8000。分子量未達500之有機聚矽氧烷中係很難固形化,在分子量超過20000者係有時黏度變高,流動性會降低。
(A)成分一般係可以Q單元(SiO4/2
)、T單元(CH3
SiO3/2
)、及D單元((CH3
)2
SiO2/2
)之組成表現。以此表述法表示(A)成分時,相對於全矽氧烷單元之總莫耳數,T單元之含有莫耳數的比率為70莫耳%以上,宜為75莫耳%以上,尤宜為80莫耳%以上。該T單元未達70莫耳%時,有時硬度、密著性、概觀等之綜合性均衡會崩壞。又,殘部可為D、Q單元,宜此等為30莫耳%以下。對於融點,係有D、Q單元愈多,融點愈高之傾向。
(A)成分係可形成以下述通式(3)所示之有機聚矽烷的水解縮合物而得到。
(CH3
)n
SiX4-n
(3)
(式中,X為氯等之鹵素原子或碳數1~4之烷氧基,n為1、2或0)
此時,X從得到固體狀之有機聚矽氧烷而言,宜為鹵原子,尤宜為氯原子。
以上述式(3)所示之矽烷化合物可舉例如甲基三氯矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、二甲基二氯矽烷、二甲基甲氧基矽烷、二甲基二乙氧基矽烷、四氯矽烷、四甲氧基矽烷、四乙氧基矽烷等。
具有上述水解性基之矽烷化合物的水解及縮合係只要以一般的方法實施即可,但,宜在例如醋酸、鹽酸、硫酸等之酸觸媒、或氫氧化鈉、氫氧化鉀、氫氧化四甲基銨等之鹼觸媒的存在下實施。例如使用含有氯基之矽烷作為水解性基係以藉加水所產生之鹽酸作為觸媒而可得到目的之適當分子量的水解縮合物。
水解及縮合時所添加的水之量係具有上述水解性基之矽烷化合物中的水解性基(例如氯基時)之合計量每一莫耳,一般為0.9~1.6莫耳,宜為1.0~1.3莫耳。若此添加量滿足0.9~1.6莫耳的範圍,後述之組成物係作業性優,其硬化物係成為強韌性優異者。
具有上述水解性基之矽烷化合物一般宜在醇類、酮類、酯類、溶纖劑類、芳香族化合物類等之有機溶劑中進行水解而使用。具體上宜為例如甲醇、乙醇、異丙醇、異丁醇、正丁醇、2-丁醇等之醇類,芳香族化合物宜為甲苯、二甲苯,組成物之硬化性及硬化物之強韌性優異者,更宜為異丙醇、甲苯倂用系。
此時,水解及縮合之反應溫度宜為10~120℃,更宜為20~100℃。若反應溫度滿足如此之範圍,不進行凝膠化,可得到可使用於如下步驟之固體的水解縮合物。
使用甲基三氯矽烷時,在溶解於甲苯之甲基三氯矽烷中添加水及異丙醇而部分水解(反應溫度-5℃至100℃),其後,添加殘存之氯基的全量被水解之量的水,再反應,俾可得到以下述式(4)所示之融點76℃的固體聚矽氧聚合物。
(CH3
)a
Si(OC3
H7
)b
(OH)c
O(4-a-b-c)/2
(4)
a、b、c如上述。
上述平均組成式(4)之例可舉例如下述式(5)、(6)等。
(CH3
)1.0
Si(OC3
H7
)0.07
(OH)0.13
O1.4
(5)
(CH3
)1.1
Si(OC3
H7
)0.06
(OH)0.12
O1.3
(6)
(B)白色顏料係適於光半導體裝置之反射板等的用途,調配用以使硬化物為白色者。白色顏料(白色著色劑)亦可使二氧化鈦、氧化鋁、氧化鋯、硫化鋅、氧化鋅、氧化鎂等單獨或與二氧化鈦倂用而使用。此等之中,宜為二氧化鈦、氧化鎂、氧化鋁,更宜為二氧化鈦。二氧化鈦之結晶形係金紅石型、鋭鈦礦、板鈦礦型之任一者均無妨,但宜使用金紅石型。
白色顏料宜平均粒徑為0.05~10.0μm,更宜為0.1~5.0μm,最宜為0.1~1.0μm。又,為提高(A)、(E)之樹脂成分或(C)無機填充劑之混合性、分散性,亦可使白色顏料預先以Al、或Si等之氫氧化物等表面處理。又,平均粒徑係可就以雷射光繞射法所產生之粒度分布測定中的質量平均值D50
(或平均徑)而求出。
白色顏料之調配量係相對於(A)成分100質量份,為3~200質量份,宜為5~150質量份,尤宜為10~120質量份。未達3質量份係有時無法得到充分的白色度,硬化物之反射率初期值為70%以上,很難得到在180℃、24hr加熱之劣化測試後的反射率為70%以上之物性。又,若超過200質量份,就提昇機械強度之目的,產生添加之(C)無機填充劑的比率變少之問題。又,此白色顏料之量相對於聚矽氧樹脂組成物全體,宜為1~50質量%,更宜為5~30質量%,最宜為10~30質量%之範圍。
(C)無機填充劑係上述白色顏料以外之填充劑。該填充劑一般可使用於環氧樹脂組成物所調配者。例如可舉例如熔融氧化矽、熔融球狀氧化矽、結晶性氧化矽等之氧化矽類、氮化矽、氮化鋁、氮化硼、三氧化銻等。此等無機填充劑之平均粒徑或形狀係無特別限定,但平均粒徑一般為5~50μm。又,平均粒徑如上述般係可就以雷射光繞射法所產生之粒度分布測定中的質量平均值D50
(或平均徑)而求出。
尤其,宜為熔融氧化矽、熔融球狀氧化矽,從成形性、流動性來看,平均粒徑之上限值為50μm,宜為45μm,平均粒徑之下限值為5μm,宜為7μm,更宜為10μm之熔融氧化矽、熔融球狀氧化矽。又,為得到樹脂組成物之高流動化,係組合平均粒徑為3μm以下之微細領域、4~8μm之中粒徑領域、10~50μm之粗領域者而使用,宜形成上述平均粒徑。尤其使具有狹部之預成型封裝進行成形時或使用來作為底部填充材時係宜使用相對於狹部之厚度,平均粒徑為1/2之無機質填充劑。
上述無機填充劑係為強化樹脂與無機填充劑之結合強度,亦可調配以矽烷偶合劑、鈦酸酯偶合劑等之偶合劑預先進行表面處理者。
如此之偶合劑宜使用例如γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等之環氧基官能性烷氧基矽烷、N-β(胺乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等之胺基官能性烷氧基矽烷、γ-氫硫基丙基三甲氧基矽烷等之氫硫基官能性烷氧基矽烷等。又,有關使用於表面處理之偶合劑的調配量及表面處理方法係無特別限制。
無機填充劑之調配量係相對於(A)成分100質量份,宜為400~1000質量份,尤宜為600~950質量份。未達400質量份時,恐無法得到目的之線膨脹係數,若超過1000質量份,因增黏引起成型的未填充不良或喪失柔軟性,有時產生元件內之剝離等之不良。又,此無機填充劑與白色顏料之合計量宜在聚矽氧樹脂組成物全體之70~93質量%,尤其宜在75~91質量%之範圍內含有。
(D)縮合觸媒係使上述(A)成分硬化之縮合觸媒,可考慮(A)成分之貯存安定性、目的之硬度等而選擇。縮合觸媒係可舉例如氫氧化三甲基苯甲基銨、氫氧化四甲基甲基銨、正己胺、三丁胺、二偶氮雙環十一烯(DBU)、二氰二醯胺等之鹼性化合物類;四異丙基酞酸酯、四丁基鈦酸酯、鈦乙醯基丙酮酸鹽、三異丁氧基鋁、三異丙氧基鋁、鋯四(乙醯基丙酮酸鹽)、鋯四丁酸酯、鈷辛酸酯、鈷乙醯基丙酮酸鹽、鐵乙醯基丙酮酸鹽、錫乙醯基丙酮酸鹽、二丁基錫辛酸酯、二丁基錫月桂酸酯、辛基酸鋅
、安息香酸鋅、對第三丁基安息香酸鋅、月桂酸鋅、硬脂酸鋅、磷酸鋁、三異丁氧基鋁等之含金屬化合物類、鋁三乙醯基丙酮酸酯、鋁雙乙基乙醯基乙酸酯/單乙醯基乙酸酯、二異丙氧基雙(乙基乙醯基乙酸酯)鈦、二異丙氧基雙(乙基乙醯基乙酸酯)鈦等之有機鈦螯化合物等。其中,尤宜為辛基酸鋅、安息香酸鋅、對第三丁基安息香酸鋅、月桂酸鋅、硬脂酸鋅、磷酸鋁、三異丁氧基鋁。其中宜使用安息香酸鋅、三異丁氧基鋁。
硬化觸媒之調配量相對於(A)100質量份,為0.01~10質量份,宜為0.1~6質量份。在該範圍內,硬化性良好,組成物之貯存安定性亦佳。
(E)成分其特徵在於具有以下述式(2)所示之直鏈狀二有機聚矽氧烷殘基。
其中R2
及R3
係互相獨立選自羥基、碳數1~3之烷基、環己基、乙烯基、苯基及烯丙基之基,宜為甲基及苯基。m為5~50,宜為8~40,更宜為10~35之整數。m為未達5時,缺乏硬化物之可撓性(耐龜裂性),可引起裝置之翹曲。另外,m超過50時,有機械強度不足之傾向。
(E)成分係除了以上述(2)所示之D單元(R2
R3
SiO2/2
),亦可含有D單元(R2
SiO)、M單元(R3
SiO1/2
)、T單元(RSiO3/2
)。其等之莫耳比分別為90~24:75~0:50~1,尤其70~28:70~20:10~2(但合計為100)因硬化物特性,佳。此處,R表示羥基、甲基、乙基、丙基、環己基、苯基、乙烯基、烯丙基。(E)成分亦可含有Q單元(SiO2
)。
(E)有機聚矽氧烷成分中之較佳係30莫耳%以上,尤其50莫耳%以上為分子中形成如此之以通式(2)所示之直鏈狀二有機聚矽氧烷構造。
(E)成分之凝膠滲透色層分析(GPC)所得到之聚苯乙烯換算重量平均分子量宜為3000~1000000,更宜為10000~100000。若在於此範圍,該聚合物係固體或半固體狀,因作業性、硬化性等,故適宜。
(E)成分係使成為上述各單元之原料的化合物,在生成聚合物中,組合成所需要之莫耳比,例如,可在酸的存在下進行水解而進行縮合來合成。
此處,RSiO1.5
單元的原料係可例示MeSiCl3
、EtSiCl3
、PhSiCl3
、丙基三氯矽烷、環己基三氯矽烷等之氯矽烷類、此等對應於各別之氯矽烷類的甲氧基矽烷類等之烷氧基矽烷類等。
上述式(2)之R2
R3
SiO單元的原料,可例示
(此處,m=3~48之整數(平均值)、n=0~48之整數(平均值)、且m+n為3~48(平均值))等。
又,M單元、T單元等之原料係可例示Me2
PhSiCl、Me2
ViSiCl、MePhSiCl2
、MeViSiCl2
、Ph2
MeSiCl、Ph2
ViSiCl、PhViSiCl2
等之氯矽烷類、分別對應於此等之氯矽烷的甲氧基矽烷類等之烷氧基矽烷類等。此處,Me表示甲基、Et表示乙基、Ph表示苯基、Vi表示乙烯基。
可使成為此等原料的化合物,以特定之莫耳比組合,例如以如下之反應得到。投入混合苯基甲基二氯矽烷100質量份、苯基三氯矽烷2100質量份、Si數21個的兩末端氯二甲基聚矽氧油2400質量份、甲苯3000質量份,於水11000質量份中滴下混合矽烷,以30~50℃共水解1小時。其後,以50℃熟成1小時後,置入水而進行洗淨,其後,進行共沸脫水、過濾、減壓汽滌。
又,藉上述共水解及縮合進行製造時,可含有具有矽烷醇基之矽氧烷單元。(E)成分之有機聚矽氧烷係一般宜相對於全矽氧烷單元為0.5~10莫耳,宜為1~5莫耳左右含有如此之矽烷醇基的矽氧烷單元。上述含有矽烷醇基的矽氧烷單元可舉例如R(HO)SiO2/2
單元、R(HO)2
SiO1/2
單元、R2
(HO)SiO1/2
單元(R並非羥基)。該有機聚矽氧烷係含有矽烷醇基,故與(A)成分之硬化性聚有機聚矽氧烷反應。
(E)成分之調配量係相對於(A)成分100質量份,宜為2~50質量份,更宜為3~30質量份。若添加量少,連續成形性之提昇效果少,又,無法達成低翹曲性。若添加量很多,有時組成物之黏度會上昇,對成形造成障礙。
於本發明之聚矽氧樹脂組成物中可更進一步依需要而調配各種之添加劑。例如就改善樹脂之性質的目的,在無損本發明之效果的範圍可添加調配γ-氫硫基丙基三甲氧基矽烷等之氫硫基官能性烷氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等之偶合材、晶絲、聚矽氧粉末、熱塑性樹脂、熱塑性彈性體、有機合成橡膠等之添加材、脂肪酸酯、甘油酸酯、硬酯酸鋅、硬酯酸鈣等之內部離型劑、酚系、磷系、或硫系抗氧化劑等。但,本發明之組成物係均不含有抗氧化劑,相較於習知之熱硬化性聚矽氧樹脂組成物,因光所產生之變色性少。
本發明組成物之製造方法係以特定之組成比調配聚矽氧樹脂、白色顏料、無機填充材、硬化觸媒、其他之添加物,再藉混合機等而充分均一地混合後,進行以熱輥、捏合機、押出機等之熔融混合處理,然後冷卻固化,粉碎成適當的大小而形成聚矽氧樹脂組成物之成形材料。本發明之聚矽氧樹脂組成物的硬化物係超過玻璃轉移溫度之線膨脹係數為30ppm/K以下,宜為20ppm/K以下。
所得到之聚矽氧樹脂組成物係可用來作為光半導體裝置,尤其用來作為LED用殼體、光偶合器用之密封材。於圖1中表示光半導體裝置之一例的截面圖。在圖1中LED等之光半導體元件1被黏合於附導線架之樹脂基盤2,進一步,藉黏合線3線黏合於樹脂基盤的導線架(未圖示)。此等之半導體元件之間藉透明密封樹脂4填充。在圖1所示之例中,本發明之聚矽氧樹脂組成物的硬化物係可使用於白色反射板5。6為透鏡。又,於圖2表示光偶合器的一例之截面圖。在圖2中,半導體元件1被黏合於導線架2,進一步,藉黏合線3線黏合於另一導線架2(未圖示)。如與此半導體元件1對向般,受光用之半導體元件1’被黏合於導線架2’上,進一步,藉黏合線3’線黏合於另一導線架2’(未圖示)。此等之半導體元件之間藉透明密封樹脂4填充。藉透明密封樹脂4被覆之半導體元件的周圍係藉本發明之聚矽氧樹脂組成物7密封。
所得到之反射板的波長450nm之光反射率就初期值為70%以上,尤其為80%以上,最宜為85%以上,在180℃ 24小時劣化測試後的反射率亦可達成70%以上,尤其80%以上,最佳85%以上。若反射率未達70%,例如作為LED用半導體元件反射板之耐用時間會變短。
該反射板的最一般之成形方法,係可舉例如轉移成形法或壓縮成形法。轉移成形法中係使用轉移成形機,以成形壓力5~20N/mm2
,以成形溫度120~190℃、成形時間30~500秒,尤其以成形溫度150~185℃、成形時間30~180秒進行。又,在壓縮成形法中係使用壓縮成形機,以成形溫度120~190℃、成形時間30~600秒,尤其以成形溫度130~160℃、成形時間120~300秒進行。進而,即使在任何一種的成形法中,亦可以150~185℃進行後硬化2~20小時。
如此作法所得到之本發明的聚矽氧樹脂組成物係因成形性、耐熱性或耐光性、尤其耐紫外線性優異,不僅適用於白色或藍色,進一步紫外線LED用預成型封裝用,亦最適於作為太陽能電池用之封裝材料。
進一步,在形成導線部或墊片部之矩陣排列型的金屬基板或有機基板上,以只開啟LED元件搭載部份之狀態使用本材料,一次密封之預成型封裝亦在本發明之範圍。又,亦可使用於一般的半導體用密封材或車輛用各種模組等之密封。
以下,表示實施例及比較例,更詳細說明本發明,但本發明係不限定於下述之實施例。
將實施例、比較例所使用之原料表示於以下。
將甲基三氯矽烷100質量份、甲苯200質量份置入於1升的燒瓶中,在冰冷下使水8質量份、異丙醇60質量份之混合液滴下液中。內溫係以-5~0℃花5~20小時滴下,其後進行加熱而以回流溫度攪拌20分鐘。從其冷卻至室溫,以30℃以下、30分鐘滴下水12質量份,攪拌20分鐘。進一步,滴下水25質量份後,以40~45℃攪拌60分鐘。其後,置入水200份而分離有機層。將此有機層洗淨至成為中性,其後,進行共沸脫水、過濾、減壓汽滌,俾得到以下述式(7)所示之無色透明的固體(融點76℃)36.0質量份之熱硬化性有機聚矽氧烷(A)。
(CH3
)1.0
Si(OC3
H7
)0.07
(OH)0.10
O1.4
(7)
白色顏料:二氧化鈦(金紅石型)、平均粒徑0.29μm、R-45M(堺化學工業(股)製)
由熔融球狀氧化矽:平均粒徑45μm、MSR-4500TN((股)龍森製)95質量份、球狀氧化鋁:平均粒徑0.5μm、SO25R((股)Adomatex製)5質量份所構成,平均粒徑為43μm的無機填充劑。
安息香酸鋅(和光純藥工業(股)製)
混合苯基甲基二氯矽烷100g(4.4莫耳%)、苯基三氯矽烷2100g(83.2莫耳%)、Si數21個的兩末端氯二甲基聚矽氧油2400g(12.4莫耳%)、甲苯3000g,滴下於混合在水11000g之上述矽烷中,以30~50℃進行共水解1小時。其後,以50℃熟成1小時後,置入水而洗淨,其後,進行共沸脫水、過濾、減壓汽滌,俾得到在150℃下之熔融黏度5Pa.s、無色透明之有機聚矽氧烷(E)。
調配1,3,5-三(2,3-環氧基丙基)三聚異氰酸酯(TEPIC-S:日產化學(股)製商品名,環氧當量100)45g與甲基六氫酞酸酐(Rikacid MH:新日本理化(股)製商品名)55g(預備調配莫耳比:環氧基/酸酐基=1.4)、以80℃加熱10小時,俾使環氧樹脂與酸酐反應,得到預備反應性生成物。
矽烷偶合劑:KBM 803(倍越化學工業(股)製)
離型劑:硬脂基硬脂酸酯、Rikemal SL-900A(理研Vitamin(股)製)
以表1所示之調配(質量份),調配(A)有機聚矽氧烷、(B)白色顏料、(C)無機填充劑、(D)硬化觸媒、(E)有機聚矽氧烷,以輥混合而製造,冷卻,粉碎而得到白色聚矽氧樹脂組成物。
有關此等之組成物,測定以下之各特性。結果表示於表1中。又,成形係全部以轉移成形機,以成形溫度175℃×成形時間120秒實施。
使用依據EMMI規格之模具,以成形溫度175℃、成形壓力6.9N/mm2
、成形時間120秒之條件進行測定。
使用高化式流動測試器,25kgf之加壓下,使用直徑1mm之噴嘴,溫度175℃測定黏度。
使用依據JIS-K6911規格之模具,以成形溫度175℃、成形壓力6.9N/mm2
、成形時間120秒之條件成形之試驗片以室溫(25℃)測定彎曲強度。
連續成形性
使50×50mm之MAP方式封裝體(Ag電鍍之Cu框)以成形溫度175℃、成形壓力6.9N/mm2
、成形時間120秒之條件連續而成形,進行腔體部之離型性、澆道折斷、毛邊部之附著狀態的觀察。樹脂未從腔體部離型時,澆道折斷時,計數至毛邊部附著之成形數。
使50×50mm之MAP方式封裝體(Cu框)以成形溫度175℃、成形壓力6.9N/mm2
、成形時間120秒之條件以45mm×45mm×0.5mm之樹脂密封,藉翹曲測定裝置而測定所得到之硬化物的翹曲量。
以成形溫度175℃、成形壓力6.9N/mm2
、成形時間90秒之條件使直徑50mm×厚3mm之圓盤(硬化物)成形,成形之後,在180℃放置24小時後,使用SDG(股)製X-rite 8200而測定UV照射(365nm譜峰波長之高壓水銀燈60mW/cm)24小時後的波長450nm之光反射率。
以成形溫度175℃、成形壓力6.9N/mm2
、成形時間120秒之條件使5mm×5mm×15mm之硬化物成形,以180℃後硬化4小時。其後,以理學製TMA 8140C以昇溫速度5℃/分的條件測定線膨脹係數。
如表1所示,(E)成分太少之參考例1及完全不含之比較例1係裝置之翹曲量大。另外,(E)成分太多之參考例2及僅(E)成分之比較例2係流動性差,故成形性差。
比較例3之預備反應生成物(三聚異氰酸酯衍生物環氧樹脂與酸酐之生成物)相較於熱硬化性有機聚矽氧烷,UV照射後之光反射率大幅地降低,耐光性差。
對此,本案實施例中係亦無反射率的降低,又,翹曲亦少。
本發明之樹脂組成物係適用於光半導體元件、尤其反射板。
1及1’...半導體元件
2及2’...導線架
3及3’...黏合線
4...透明密封樹脂
5...白色反射板(聚矽氧樹脂組成物之硬化物)
6...透鏡
7...聚矽氧樹脂組成物之硬化物
圖1係表示使用本發明之聚矽氧樹脂組成物的光半導體裝置之一例的截面圖。
圖2係表示使用本發明之聚矽氧樹脂組成物的光偶合器之一例的截面圖。
Claims (4)
- 一種光半導體裝置用聚矽氧樹脂組成物,其係含有下述:(A)以下述平均組成式(1)所示,且重量平均分子量(聚苯乙烯換算)為500~20000的有機聚矽氧烷100質量份(CH3 )a Si(OR1 )b (OH)c O(4-a-b-c)/2 (1)(式中,R1 為碳數1~4之有機基,且a、b、c滿足0.8≦a≦1.5,0≦b≦0.3、0.001≦c≦0.5,及0.801≦a+b+c<2之數目)(B)白色顏料 3~200質量份(C)前述白色顏料以外之無機填充劑 400~1000質量份(D)縮合觸媒 0.01~10質量份(E)具有以下述式(2)所示之直鏈狀二有機聚矽氧烷殘基的有機聚矽氧烷 2~50質量份
- 如申請專利範圍第1項之聚矽氧樹脂組成物,其中(B)白色顏料為平均粒徑0.05~10.0μm的選自由二氧化鈦、氧化鎂及氧化鋁所構成之群的至少一種,相對於聚矽氧樹脂組成物之質量含有1~50質量%,及,(B)白色顏料與(C)無機填充劑相對於聚矽氧樹脂組成物質量的合計質量%為70~93質量%。
- 一種聚矽氧樹脂組成物,其特徵在於:在申請專利範圍第1或2項之聚矽氧樹脂組成物之硬化物的玻璃轉移溫度以上之線膨脹係數為10~30ppm/K之範圍內。
- 一種光半導體裝置,其係具備如申請專利範圍第1~3項中任一項之聚矽氧樹脂組成物的硬化物。
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EP2174984A1 (en) | 2010-04-14 |
CN101712799B (zh) | 2012-08-29 |
EP2174984B1 (en) | 2011-08-24 |
KR20100036977A (ko) | 2010-04-08 |
ATE521668T1 (de) | 2011-09-15 |
US8022137B2 (en) | 2011-09-20 |
CN101712799A (zh) | 2010-05-26 |
TW201022365A (en) | 2010-06-16 |
JP2010106243A (ja) | 2010-05-13 |
KR101497158B1 (ko) | 2015-02-27 |
US20100081748A1 (en) | 2010-04-01 |
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