TWI451232B - Fixing equipment and heat dissipation device using same - Google Patents
Fixing equipment and heat dissipation device using same Download PDFInfo
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- TWI451232B TWI451232B TW097127363A TW97127363A TWI451232B TW I451232 B TWI451232 B TW I451232B TW 097127363 A TW097127363 A TW 097127363A TW 97127363 A TW97127363 A TW 97127363A TW I451232 B TWI451232 B TW I451232B
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- hole
- seat body
- heat
- boss
- joint portion
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明涉及一種固定裝置，特別係指使用該固定裝置固定散熱體至發熱電子元件上的散熱裝置。 The invention relates to a fixing device, in particular to a heat dissipating device for fixing a heat sink to a heat-generating electronic component using the fixing device.
一般電子元件(特別係中央處理器)運行時產生大量的熱，而使其本身及系統溫度升高，過高的溫度會導致其運行性能的下降。為此，業界通常在電子元件上安裝散熱器，排出其所產生的大量熱量，為確保散熱器與電子元件能夠緊密接觸而傳熱充分，通常需借助固定裝置將散熱器輔助扣合。 In general, electronic components (especially central processing units) generate a large amount of heat during operation, which increases the temperature of the system itself and the system, and excessive temperature causes a decrease in its running performance. For this reason, the industry usually installs a heat sink on an electronic component to discharge a large amount of heat generated by the heat sink. In order to ensure that the heat sink and the electronic component can be in close contact and heat transfer is sufficient, the heat sink is usually assisted by a fixing device.
然而，隨著電腦產業的快速發展，電腦廠商考量系統的小型化、散熱問題的改善及噪音的降低等多方面的因素，對習知系統進行不斷的改進而提出諸多不同架構及尺寸的系統，使得電子元件在電路板上的水平佈置及高度等改變很大。但是，習知散熱器往往只能搭配特定的固定裝置鎖固於電路板上，當電路板上的電子元件的佈置及尺寸改變而又因考量電容、板卡等的干涉其上的固定孔位改變時，使得其位置與固定裝置上的鎖合孔不相對應，固定裝置無法適用於變化後的系統。 However, with the rapid development of the computer industry, computer manufacturers have considered various factors such as miniaturization of systems, improvement of heat dissipation problems, and reduction of noise, and have continuously improved the conventional systems and proposed systems with different architectures and sizes. The horizontal arrangement and height of the electronic components on the circuit board are greatly changed. However, the conventional heat sink can only be locked to the circuit board with a specific fixing device. When the arrangement and size of the electronic components on the circuit board are changed, the fixed hole position on the capacitor is affected by the interference of the capacitor and the board. When changing, the position does not correspond to the locking hole on the fixing device, and the fixing device cannot be applied to the changed system.
因此，如何提供一種能夠適用於多種不同電腦系統架構的固定裝置成為業界需解決的重要問題之一。 Therefore, how to provide a fixed device that can be applied to a variety of different computer system architectures has become one of the important problems to be solved in the industry.
有鑒於此，有必要提供一種能很好定位至發熱電子元件上的固定裝置及使用該固定裝置的散熱裝置。 In view of the above, it is necessary to provide a fixing device that can be well positioned to a heat-generating electronic component and a heat sink using the same.
一種固定裝置，包括一座體及設於座體上的一彈片，該彈片包括與座體相結合的一結合部及由該結合部的兩端分別延伸形成的兩個鎖合部，該座體上設有一凸柱，該凸柱包括與座體連接的一頸部及位於該頸部頂端的一頭部，該結合部上設有一固定孔，該彈片藉由該固定孔而鬆動地套置於該頸部上，該固定孔的孔徑小於該頭部的最大外徑。 A fixing device includes a body and a elastic piece disposed on the base body, the elastic piece includes a joint portion combined with the seat body, and two locking portions respectively formed by two ends of the joint portion, the seat body A protrusion is arranged on the body, and the protrusion comprises a neck connected to the base and a head on the top of the neck. The joint is provided with a fixing hole, and the elastic piece is loosely sleeved by the fixing hole. On the neck, the aperture of the fixing hole is smaller than the maximum outer diameter of the head.
一種散熱裝置，包括一座體及設於該座體上的一彈片，該彈片包括與座體相結合的一結合部及由該結合部的兩端分別延伸形成的兩個鎖合部，該座體上設有一凸柱，該凸柱包括設於座體上的一頸部及位於該頸部頂端的一頭部，該結合部上設有一固定孔，該彈片藉由該固定孔而鬆動地套置於該頸部上，該固定孔的孔徑小於該頭部的最大外徑。 A heat dissipating device includes a body and a resilient piece disposed on the base body, the elastic piece including a joint portion coupled to the base body and two locking portions respectively formed by two ends of the joint portion, the seat The body is provided with a protruding post, the protruding post includes a neck portion disposed on the seat body and a head portion at the top end of the neck portion, and the connecting portion is provided with a fixing hole, and the elastic piece is loosened by the fixing hole The sleeve is placed on the neck, and the diameter of the fixing hole is smaller than the maximum outer diameter of the head.
與習知技術相比，將散熱裝置固定至發熱電子元件上時，由於該散熱裝置的彈片鬆動地套置於該頸部上，適應於不同位置開孔的電路板，從而使散熱體可固定於多種不同架構的電腦系統的電路板上，提升散熱裝置的通用性。 Compared with the prior art, when the heat dissipating device is fixed to the heat-generating electronic component, the elastic piece of the heat dissipating device is loosely placed on the neck portion, and is adapted to the circuit board with different positions, so that the heat dissipating body can be fixed. Improve the versatility of the heat sink on the circuit board of a variety of computer systems with different architectures.
圖1為本發明散熱模組一實施例的分解圖。 1 is an exploded view of an embodiment of a heat dissipation module of the present invention.
圖2為圖1的倒置立體組合圖。 FIG. 2 is an inverted perspective combination view of FIG. 1. FIG.
圖3為圖1中設有彈片的座體的側面剖視圖。 Figure 3 is a side cross-sectional view of the seat body of Figure 1 provided with shrapnel.
下面參照圖示，結合實施例詳細說明本發明之散熱裝置。 Hereinafter, the heat sink of the present invention will be described in detail with reference to the accompanying drawings.
如圖1及圖2所示為本發明散熱裝置的一個較佳實施例，該散熱裝置包括一熱管10、一散熱器20以及藉由一彈片30將熱管10固定至電路板40上的一座體50。 As shown in FIG. 1 and FIG. 2, a heat dissipating device includes a heat pipe 10, a heat sink 20, and a body for fixing the heat pipe 10 to the circuit board 40 by a resilient piece 30. 50.
該熱管10為扁平熱管，大致呈L型，其包括一蒸發端12及一冷凝端14，該蒸發端12與電路板40上的一發熱電子元件60接觸，並吸收其熱量傳至冷凝端14。該熱管10的冷凝端14與散熱器20相連接，用於將傳導至冷凝端14的熱量進一步散發出去。該散熱器20由複數平行相間排列的鰭片22組成，該散熱器20於一側設有一槽狀的收容部(圖未標)，該收容部將該熱管10的冷凝端14收容其內。 The heat pipe 10 is a flat heat pipe and is substantially L-shaped. The heat pipe 10 includes an evaporation end 12 and a condensation end 14 . The evaporation end 12 is in contact with a heat-generating electronic component 60 on the circuit board 40 and absorbs heat to the condensation end 14 . . The condensing end 14 of the heat pipe 10 is coupled to the heat sink 20 for further dissipating heat conducted to the condensing end 14. The heat sink 20 is composed of a plurality of fins 22 arranged in parallel, and the heat sink 20 is provided with a groove-shaped receiving portion (not shown) on one side, and the receiving portion houses the condensation end 14 of the heat pipe 10 therein.
該座體50由導熱性能好的金屬材料製成的板狀結構，可作為一散熱體對發熱電子元件60進行散熱。該座體50的底端向上凹進形成一凹槽52，該凹槽52用於將熱管10的蒸發端12收容其內，為增加熱管10與座體50的熱傳效果，二者之間可以藉由錫焊或導熱膏相接觸。該座體50貼設於發熱電子元件60上並使熱管10的蒸發端12與發熱電子元件60相接觸，使熱管10與座體50共同吸收並散發發熱電子元件60的熱量。該座體50的頂端與凹槽52對應向上凸出形成一凸台54，該座體50於凸台54的兩側的部分向上延伸形成複數的導熱柱56，該導熱柱56進一步將傳導至座體50上的熱量散發。請同時參考圖3，該凸台54向上延伸形成一凸柱58，該凸柱58包括與座體50相連接的一頸部580以及位於該頸部580頂端的一頭部582。在本實施例中，該頭部582藉由設於凸柱58頂端的一擴孔 584使之向外擴大變形而形成，該頭部582呈橢圓形，且該頭部582的最大外徑大於該頸部580的外徑。該凸柱58可由座體50一體形成，亦可為螺釘或鉚釘等固定部件設置在座體50上形成，該頭部582亦可為圓形或其他形狀。 The base body 50 is made of a plate-like structure made of a metal material having good heat conductivity, and can dissipate the heat-generating electronic component 60 as a heat sink. The bottom end of the base body 50 is recessed upward to form a recess 52 for receiving the evaporation end 12 of the heat pipe 10 therein. To increase the heat transfer effect between the heat pipe 10 and the base 50, It can be contacted by soldering or thermal paste. The base 50 is attached to the heat-generating electronic component 60, and the evaporation end 12 of the heat pipe 10 is in contact with the heat-generating electronic component 60, so that the heat pipe 10 and the base 50 absorb and dissipate heat of the heat-generating electronic component 60. The top end of the base 50 protrudes upwardly from the recess 52 to form a boss 54. The base 50 extends upwardly from the two sides of the boss 54 to form a plurality of heat conducting posts 56. The heat conducting posts 56 are further conducted to The heat on the seat 50 is dissipated. Referring to FIG. 3 at the same time, the boss 54 extends upward to form a stud 58 including a neck 580 connected to the base 50 and a head 582 at the top end of the neck 580. In this embodiment, the head 582 is reamed by a top end of the stud 58 The 584 is formed by expanding outwardly. The head 582 has an elliptical shape, and the maximum outer diameter of the head 582 is greater than the outer diameter of the neck 580. The protrusion 58 may be integrally formed by the base 50, or may be formed on the base 50 by a fixing member such as a screw or a rivet. The head 582 may also be circular or other shape.
該彈片30包括與座體50相結合的一結合部32及用於將座體50鎖固於發熱電子元件60上的二鎖合部34。該彈片30呈細長狀，該鎖合部34由該結合部32的兩端先向下再向外彎折延伸形成，使該結合部32相對於該二鎖合部34向上凸出設置。該結合部32對應跨設於凸台54上，二鎖合部34分別位於凸台54的兩側。該結合部32上對應凸柱58設有一固定孔320，藉由該固定孔320使該彈片30套置於凸柱58的頸部580上。該固定孔320的孔徑大於該頸部580的外徑且小於該頭部582的外徑，可使該彈片30活動的套置於頸部580上而不會從頭部582脫下。該鎖合部34的末端各設有一裝配孔340，藉由一螺釘80穿過該裝配孔340與電路板40上的鎖固孔42將彈片30固定在電路板40上，並使座體50的底端與發熱電子元件60相接觸。由於該彈片30可相對於座體50旋轉，避免彈片30與座體50鎖死的狀況，減小座體50上連接點對結合部32的結合應力，防止彈片30的結合部32發生變形而影響散熱裝置與發熱電子元件60的接觸。此外，這種設置的散熱裝置通過旋轉彈片30，使其自由端部可相對座體50位置變化，可方便地實現裝配孔340與電路板40上的鎖固孔42的對齊，便於組裝，適應於不同位置開孔的電路板40，從而提升散熱裝置的通用性。 The elastic piece 30 includes a joint portion 32 coupled to the base body 50 and two latching portions 34 for locking the base body 50 to the heat-generating electronic component 60. The elastic piece 30 is formed in an elongated shape. The locking portion 34 is formed by bending both ends of the coupling portion 32 downward and outward, so that the coupling portion 32 is convexly protruded relative to the two locking portions 34. The joint portion 32 is correspondingly spanned on the boss 54 , and the two latch portions 34 are respectively located on both sides of the boss 54 . The corresponding protrusions 58 of the joint portion 32 are provided with a fixing hole 320. The elastic piece 30 is sleeved on the neck 580 of the boss 58 by the fixing hole 320. The fixing hole 320 has a larger diameter than the outer diameter of the neck 580 and smaller than the outer diameter of the head 582, so that the elastic piece 30 can be placed on the neck 580 without being removed from the head 582. A locking hole 340 is defined in each end of the locking portion 34. The elastic piece 30 is fixed on the circuit board 40 through a fixing hole 340 and a locking hole 42 in the circuit board 40, and the base 50 is fixed. The bottom end is in contact with the heat generating electronic component 60. Since the elastic piece 30 is rotatable relative to the base body 50, the state in which the elastic piece 30 and the seat body 50 are locked is prevented, the bonding stress of the connection point on the seat body 50 to the joint portion 32 is reduced, and the joint portion 32 of the elastic piece 30 is prevented from being deformed. The contact of the heat sink with the heat generating electronic component 60 is affected. In addition, the heat dissipating device of the arrangement can change the position of the free end portion relative to the seat body 50 by rotating the elastic piece 30, so that the alignment of the mounting hole 340 and the locking hole 42 on the circuit board 40 can be conveniently realized, which is convenient for assembly and adaptation. The circuit board 40 is opened at different positions to improve the versatility of the heat sink.
工作時，該發熱電子元件60產生的熱量一方面通過熱管10的蒸發端12傳導至其冷凝端14，再通過散熱器20向外散發，另一方面直 接通過座體50及設於其上的導熱柱56散發。 In operation, the heat generated by the heat-generating electronic component 60 is conducted on the one hand through the evaporation end 12 of the heat pipe 10 to its condensing end 14, and then radiated outward through the heat sink 20, and on the other hand The heat is transmitted through the base 50 and the heat conducting column 56 provided thereon.
綜上所述，本發明符合發明專利之要件，爰依法提出專利申請。惟以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧熱管 10‧‧‧heat pipe
12‧‧‧蒸發端 12‧‧‧Evaporation end
14‧‧‧冷凝端 14‧‧‧condensing end
20‧‧‧散熱器 20‧‧‧ radiator
22‧‧‧鰭片 22‧‧‧Fins
30‧‧‧彈片 30‧‧‧Shrap
32‧‧‧結合部 32‧‧‧Combination Department
34‧‧‧鎖合部 34‧‧‧Locking Department
40‧‧‧電路板 40‧‧‧ boards
42‧‧‧鎖固孔 42‧‧‧Lock hole
50‧‧‧座體 50‧‧‧
52‧‧‧凹槽 52‧‧‧ Groove
54‧‧‧凸台 54‧‧‧Boss
56‧‧‧導熱柱 56‧‧‧thermal column
60‧‧‧發熱電子元件 60‧‧‧Fever electronic components
80‧‧‧螺釘 80‧‧‧ screws
340‧‧‧裝配孔 340‧‧‧Assembly holes
582‧‧‧頭部 582‧‧‧ head
584‧‧‧擴孔 584‧‧‧ reaming
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097127363A TWI451232B (en) | 2008-07-18 | 2008-07-18 | Fixing equipment and heat dissipation device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097127363A TWI451232B (en) | 2008-07-18 | 2008-07-18 | Fixing equipment and heat dissipation device using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201005487A TW201005487A (en) | 2010-02-01 |
| TWI451232B true TWI451232B (en) | 2014-09-01 |
Family
ID=44826303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097127363A TWI451232B (en) | 2008-07-18 | 2008-07-18 | Fixing equipment and heat dissipation device using same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI451232B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM276267U (en) * | 2005-05-06 | 2005-09-21 | Chaun Choung Technology Corp | Slim contact structure for heat sink module |
| TWM313953U (en) * | 2006-12-11 | 2007-06-11 | Air Wise Technology Inc | Fastener of heat dissipation module |
-
2008
- 2008-07-18 TW TW097127363A patent/TWI451232B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM276267U (en) * | 2005-05-06 | 2005-09-21 | Chaun Choung Technology Corp | Slim contact structure for heat sink module |
| TWM313953U (en) * | 2006-12-11 | 2007-06-11 | Air Wise Technology Inc | Fastener of heat dissipation module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201005487A (en) | 2010-02-01 |
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