M313953M313953
f I 八、新型說明： - 【新型所屬之技術領域】 - 本創作係提供一種散熱模組之扣具，尤指可調整懸臂伸縮長 度及固粒置之扣具，以可配合各種電子產品上預設之定位部， 具有組裝簡易、快速、使用限制少之目的。 【先前技術】 按，現今科技資訊快速發展，而個人電腦、電子筆記本及筆 • έ己型電腦由於運算功能強、速度快，因此被普遍運用於各個行業f I VIII, new description: - [New technical field] - This creation provides a kind of fastener for the heat dissipation module, especially the buckle that can adjust the length of the cantilever and the solid grain to match the various electronic products. The preset positioning unit has the purpose of simple assembly, fast, and limited use. [Prior Art] Press, today's technology information is developing rapidly, and personal computers, electronic notebooks, and pens are widely used in various industries due to their powerful computing functions and fast speed.
，而網路時代的來臨更造成電腦的普及化，其中電腦内之CPU (中央處)、晶牌運作時會產生熱能之發熱元件與熱源， 且速度越快所產生的熱能越高，為避免因高熱燒毀“，而縮短 晶片的使用壽命，因此在各個發熱源上均設有散熱片，使晶片產 生之…、肖b傳導至政熱片上，再以風扇所產生之冷空氣吹送至散熱 片之表面間隙中進行散熱；如公告第M2 8 〇 〇 9 9號『散熱器 鲁之扣具結構改良』之新型專利案，係於民國9 4年7月2 6日提 出新型專利申請，申請案號第9 4 2 1 2 6 3 7號，且公告於民 國94年11月1日之專利公報，請參閱第十二圖所示，其扣具 A係包括一銷體A 1、一帽蓋A 2、二折片A 3、-底鉤部A4 及一彈性元件A5，_MA2底面係連接於該賴AlJl端， 該一折片A 3係固設於帽蓋a 2外緣，該底鉤部A 4係連接於該 銷體A 1下端，轉性元件A 5係套設於闕體a 1上，該彈性 凡件A 5上端頂抵於該帽蓋a 2底面，且柳扣具a i以銷體A 5 M313953 » 1穿過散熱器B之第一孔槽b1，再鎖入電路板◦之第二孔槽◦ 1，以將散熱為B鎖固於電子發熱元件◦2上方，以達到輔助散 ★ 熱的功能；然該扣具A於實際使用時，仍存在諸多缺失與不便， 如： (1) 電路板C因製造商不同，其預設的第二孔槽c1位置亦會 不同，因此必須以特定配合的散熱器B，才能組裝於電路 板C上，若第一槽孔B1的孔位無法對稱之散熱器b，即 t 無法使用在此電路板上C，以致使用限制多且相當不方便 〇 (2) 扣具A係以二支，分別穿過散熱器b二側之第一孔槽B工 後’再穿入第二孔槽C1以形成定位，但二側之扣具A若 兀全扣緊，則使散熱器B二侧受壓中央形成彎曲狀，並無 法平貼於電子發熱元件C 2上，也直接影響散熱效果；但 若扣具A扣持略鬆，則易使散熱器6因外力影響而偏位、 翹起，也無法完全平貼於電子發熱元件c 2表面，更直接 影響散熱效果。 (3) 扣具A使用時必須在散熱器b、電路板c上分別設有第一 孔槽B1、第二孔槽C1，否則扣具八即無法將散熱. 緊扣於電路板C上。 是以，如何解決習用散熱器的扣具使用之問題，即為從事此 行業之相關廠商所亟欲研究改善之方向所在者。 【新型内容】 6 M313953 故，創作人有鑑於上叙_麵失，乃觀摘請料，經 由二方雜及考量，並峨事於此行㈣積之多年經驗，經由不 斷試作及修改，始設物t射婦扣錢定位置之散熱模組之 扣具的創作專利誕生者。 本創作之主要目的乃在_扣具係侧基板固設於散熱模組 底部’且散麵組底雜貼於發熱源上，而基板二側分別設有可 _位移之㈣，即可藉«臂旋動調整，以供活_所設之固 疋部’對位於電子產品上所預設之定位部，俾將散織組穩固定 位於發熱源上’制扣具可做調整，㈣合各觀子產品上預設 不同位置之定位部，具有組賴易、快速、使舰制少之目的°。 本創作之次要目的乃在於該扣具二側所設之懸f，其活動側 之固定部可設有圓孔供卡龍穿人’在穿職路板上預設的定位 孔以形成卡做位；亦可在岐部設錢扣體，以触扣體扣持 於電路板上之環扣。 、 【實施方式】 為達成上述目的及功效，本創作所採用之技術手段及其構造 ’兹緣圖就本創作之較佳實施例詳加說明其特徵與功能如下，俾 利完全瞭解。 請參閱第-、二、三、四、五圖所示，係為本創作之立體外 觀圖、立體分解圖、組裝方式立體分解圖、侧視剖面圖、散熱模 組立體分解圖，由圖中所示可以清楚看出，本創作為包括基板工 、複數懸臂2及散熱模組3等構件所組成，其中： M313953 該基板1為於中央處具有通孔i!，並於通孔工工二側分別 X有累孔12 ’各螺孔12上並凸設有限位轴體121，且各螺 •孔12為可供穿設盤形彈片12 3之螺桿i 2 2予以鎖固。。 該複數懸臂2係於-側設有軸孔2丄，且遠離軸孔2 i的另 侧為彎折成梯肩狀之蚊部2 2，並於固定部2 2設有圓孔2 2 1 ’即利用圓孔2 2!可供卡持體2 3穿入，而卡持體2 3頂部 係設有止擒帽體2 3 i，且止撞帽體2 3 i直徑係大於圓孔U • 1孔仏’並於止擔帽體2 31下方延設有扣持桿2 3 2 ’且扣持 才干2 3 2外緣則設有呈鏤空狀之彈性部2 3 3。 、 該散熱模組3設有散熱塊3 i，並於散熱塊3工設有定位螺 孔311，該螺孔311為可供_體3 i i i鎖人，且散熱塊 31固設有複數往上方延伸之熱管3 i 2，並於各熱管3丄2頂 砂別設有鎖_桿3 i 3，而以各熱管3丨2分财入散熱片 1且3 2之各插孔3 21内，再利用複數螺帽3 2 2，分別鎖固於 ，熱管312頂部之鎖固螺桿3!3，俾將散熱片組3 2鎖設於 散熱塊31上，而相對於散熱塊3工之定位螺孔3工丄位置，則 在散熱片組3 2上設有穿孔3 2 3。 上述各構件於絲時，係以基板1於通孔1 1二侧之螺孔i 2，分別供懸臂2之軸孔2!對位，且以軸孔2工卡制在限位軸 體121 ’而供懸臂2可在限位軸體i 21上活動旋轉，再利用 累才于1 2 2穿過盤形彈片1 2 3、袖孔2 1後鎖入螺孔1 2，俾 藉盤形彈片12 3抵屢在懸臂2上，以使懸臂2可於基板丄二側 8 M313953 活動旋移，再將基板i與二㈣2 —同置放於賴獅3之散熱 塊31上方’並使基板1之通孔工丄對位於散熱塊3工之定位螺 孔311且當散熱塊31之各熱管312，分別套入散熱片組 3 2之各插孔3 21後’即可利用鎖固體3工工工穿入散熱片組 3 2之穿孔3 2 3 ’並穿過基板χ之通孔工丄鎖入底座之定位螺 孔311,即組裝成本創作散熱模組之扣具。 再明參閱第六、七、八圖所示’係為本創作之賊收縮方式 1俯視圖、懸臂伸張方式俯視圖、較佳實施例之立體外觀圖，由圖 中可以清楚看出’本創作為_散熱塊3 i抵貼於電子產品^之 發熱源41上，再將基板丄二側之懸臂2旋轉、調整至以固定部 2 2對位於電子產品4之定位部4 2，並賴定部2 2之圓孔2 21 ’對位於定位部4 2之定位孔4 2工，且藉由卡持體2 3穿 過懸臂2之圓孔2 21後’再穿過定位孔4 2丄，並利用卡持體 2 3以止擋帽體2 3!抵壓於懸臂2之固定部2 2，而卡持體2 3之扣持桿2 3 2、彈性部2 3 3則穿過定位孔4 2工後，卡持 在定位孔4 21底部，以將散熱模組3固設於發熱源4丄上，即 可利用散熱模組3辅助發熱源4 ；[進行散熱。 、而上述之電子產品4 ’因不同廠牌的製造商不同，因此發熱 源（c P U、晶片等）4 i的位置所設之定位部4 2也不同，惟 ，扣具之基板1二侧所設之懸臂2，因可調整、旋動，並使懸臂 2產生向下的抵持力，則可使二懸臂2之固定部2 2調整至對位 於電子產品之定位部4 2，可以不受定位部4 2位朗影塑，則 9 M313953 供扣具的使用不受限制，可適用於不同廠牌的電子產品4。 且基板1係利用二側之懸臂2，分別固設於電子產品4之定 位u卩4 2而一懸臂2為將基板1向下抵壓，使基板1再抵壓於 散熱模組3之散熱塊31上，可使散熱塊31完全貼合於發熱源 41上，不致翹起或鬆動偏位。 請參閱第九、十、十一圖所示，係為本創作另一實施例之立 體外觀圖、另一實施例基板與懸臂之立體外觀圖、另一實施例局 > 部放大圖，由圖中可以清楚看出，本創作之基板丄於二側所設之 懸臂2，該懸臂2於活動側之固定部22可設有谈扣體222， 則相對於嵌扣體2 2 2於電子產品4發熱源41周邊之定位部4 2，為設有複數環扣4 2 2，以可利用基板1將散熱模組3之散 熱塊31抵壓於發熱源41上，並藉由二側懸臂2以嵌扣體2 2 2，分別卡扣於定位部4 2之各環扣4 2 2，俾將散熱片組3 2 固設於發熱源41上，而電子產品4上可不必設置孔洞，可減少 ► 加工作業的麻煩；並且藉由基板1二側之懸臂2，以嵌扣體2 2 2卡扣於環扣4 2 2上’而使懸臂2在基板1二侧形成向下抵持 力，抵壓基板1使其底部完全抵貼於發熱源41上。 是以，以上所述僅為本創作之較佳實施例而已，非因此侷限 本創作之專利範圍，本創作散熱模組之扣具，為利用基板1二側 分別設有懸臂2，並將基板1鎖固於散熱模組3之散熱塊3丄上 ，而散熱塊31上連設有複數熱管312及散熱片組3 2，即可 利用基板1將散熱塊31抵貼於電子產品4之發熱源41上，再 M313953 ，^懸f 2之_ 2 2定位於發熱源4谢之定位部4 2 達到熱模組3快速裝設於發熱源4 i之目的，並 於^顺設 2可旋動、調整，_猶_ 2驗 。卩4 2，俾可達到散熱模組3使用限制少、組錢易、快 涵蓋目Γ故舉凡可達成前述效果之結構、裝置皆應受本創作所 之The advent of the Internet era has led to the popularization of computers. The CPU (central) and the crystal card in the computer generate heat-generating components and heat sources during operation, and the faster the speed, the higher the heat energy generated. Because of the high heat burnout, the life of the wafer is shortened. Therefore, heat sinks are provided on each heat source to cause the wafer to be generated, and the b is transmitted to the political heat sheet, and then the cold air generated by the fan is blown to the heat sink. The heat dissipation in the surface gap; as in the announcement of the new patent case of the M2 8 〇〇9 9 "Radiator Lu's buckle structure improvement", the new patent application was filed on July 26, 1949, the application No. 9 4 2 1 2 6 3 7 and published in the Patent Gazette of November 1, 1994, please refer to Figure 12, the buckle A includes a pin body A 1 and a cap A 2, a bi-fold A 3, a bottom hook A4 and an elastic element A5, _MA2 are connected to the bottom of the AlJ1 end, and the flap A 3 is fixed to the outer edge of the cap a 2 , the bottom hook The part A 4 is connected to the lower end of the pin body A 1 , and the transducing element A 5 is sleeved on the body a 1 , the elastic part The upper end of A 5 is abutted against the bottom surface of the cap a 2 , and the buckle ai is inserted through the first hole b1 of the heat sink B with the pin body A 5 M313953 » 1 and locked into the second hole of the circuit board ◦ 1. The heat dissipation B is locked above the electronic heating element ◦2 to achieve the function of assisting the heat dissipation; however, when the buckle A is actually used, there are still many defects and inconveniences, such as: (1) Circuit board C The position of the second slot c1 is different depending on the manufacturer. Therefore, the heat sink B with a specific fit must be assembled on the circuit board C. If the hole of the first slot B1 cannot be symmetrical. The heat sink b, that is, t cannot be used on this circuit board C, so that the use limit is too much and it is quite inconvenient. (2) The buckle A system has two branches, respectively passing through the first hole groove B on both sides of the heat sink b. Then, the second hole C1 is inserted into the second hole groove C1 to form a positioning. However, if the two sides of the buckle A are fully fastened, the center of the heat-receiver B is pressed to form a curved shape, and cannot be flattened to the electronic heating element C. 2, also directly affects the heat dissipation effect; but if the buckle A is slightly loose, it will easily cause the radiator 6 to be biased and tilted due to the influence of external force. The method is completely flat on the surface of the electronic heating element c 2, which directly affects the heat dissipation effect. (3) When the buckle A is used, the first hole groove B1 and the second hole groove C1 must be respectively disposed on the heat sink b and the circuit board c. Otherwise, the buckle will not be able to dissipate heat. It is fastened to the circuit board C. Therefore, how to solve the problem of using the fasteners of the conventional radiator, that is, the direction of the relevant manufacturers engaged in this industry [New content] 6 M313953 Therefore, the creator has in view of the above-mentioned _face loss, but the observations and materials, through the two parties and considerations, and the accidents of this line (four) years of experience, through continuous trials and modifications, The birth of the patent for the creation of the fixture for the heat-dissipating module of the position-setting device. The main purpose of this creation is to fix the side substrate of the buckle system to the bottom of the heat dissipation module and the bottom of the surface of the surface of the substrate is attached to the heat source, and the two sides of the substrate are respectively provided with a displacement (four), which can be borrowed « The arm is swivelly adjusted to provide a fixed position for the live part of the electronic product. The fixed positioning part of the electronic product is placed on the heat source. The buckle can be adjusted. (4) Positioning parts of different positions on the watch product have the purpose of grouping, fast, and making the ship less. The secondary purpose of this creation is that the suspension on the two sides of the buckle is provided, and the fixed portion of the movable side can be provided with a circular hole for the card to wear a predetermined positioning hole on the wearing board to form a card. Make a position; you can also set a money button on the crotch to hold the buckle on the circuit board with the buckle body. [Embodiment] In order to achieve the above object and effect, the technical means and structure of the present invention are described in detail in the preferred embodiment of the present invention as follows, and are fully understood. Please refer to the first, second, third, fourth and fifth figures, which are the three-dimensional appearance drawing, the three-dimensional exploded view, the assembled three-dimensional exploded view, the side-viewing sectional view, and the three-dimensional exploded view of the heat dissipation module. As can be clearly seen, the present invention is composed of a substrate worker, a plurality of cantilevers 2, and a heat dissipation module 3, wherein: M313953 The substrate 1 has a through hole i! at the center, and is a through hole worker The side X has a plurality of holes 12', and a limiting shaft body 121 is protruded from each of the screw holes 12, and each of the screw holes 12 is locked by a screw i 2 2 through which the disk-shaped elastic piece 12 3 can be inserted. . The plurality of cantilevers 2 are provided with a shaft hole 2丄 on the side, and the other side away from the shaft hole 2 i is a mosquito portion 22 bent into a shoulder shape, and a circular hole 2 2 1 is provided in the fixing portion 2 2 . 'That is, the round hole 2 2! is used for the holding body 2 3 to penetrate, and the top of the holding body 2 3 is provided with the retaining cap body 2 3 i, and the diameter of the crash cap body 2 3 i is larger than the round hole U • 1 hole 仏 'and a retaining rod 2 3 2 ' is extended below the stop cap 2 31 and the outer edge of the grip 2 2 2 is provided with a hollowed elastic portion 233. The heat dissipation module 3 is provided with a heat dissipation block 3 i, and a positioning screw hole 311 is formed in the heat dissipation block 3 . The screw hole 311 is for the body 3 iii to lock the person, and the heat dissipation block 31 is fixed to the upper part. The heat pipe 3 i 2 is extended, and the lock_rod 3 i 3 is disposed on the top of each heat pipe 3丄2, and the heat pipes 3 and 2 are respectively inserted into the heat sinks 1 and 3 2 of the jacks 3 21 , Then, the plurality of nuts 3 2 2 are respectively locked to the locking screw 3!3 at the top of the heat pipe 312, and the heat sink group 3 2 is locked on the heat dissipation block 31, and the positioning screw is fixed with respect to the heat dissipation block 3. For the hole 3 work position, a perforation 3 2 3 is provided on the heat sink group 3 2 . When the respective members are in the wire, the screw holes i 2 on the two sides of the through hole 1 1 are respectively aligned with the shaft holes 2! of the cantilever 2, and the shaft holes 2 are mechanically clamped on the limiting shaft body 121. 'And the cantilever 2 can be rotatably moved on the limiting shaft body i 21, and then the tired hole is passed through the disk-shaped elastic piece 1 2 3 and the armhole hole 1 1 and then locked into the screw hole 1 2, and the disk shape is borrowed. The elastic piece 12 3 is repeatedly attached to the cantilever 2 so that the cantilever 2 can be rotated on the two sides of the substrate 8 M313953, and the substrate i and the second (four) 2 are placed on the heat dissipation block 31 of the Lai Shi 3 and the substrate is 1 through hole work 丄 locating the screw holes 311 located in the heat sink block 3 and when the heat pipes 312 of the heat sink block 31 are respectively inserted into the jacks 3 21 of the heat sink group 3 2 ' The worker penetrates the perforation 3 2 3 ' of the heat sink group 3 2 and passes through the through hole of the substrate to lock the positioning screw hole 311 of the base, that is, the assembly cost creates a fastener for the heat dissipation module. Referring again to the sixth, seventh, and eighth diagrams, the top view of the thief contraction mode, the top view of the cantilever extension mode, and the three-dimensional appearance of the preferred embodiment are clearly shown in the figure. The heat dissipating block 3 i is attached to the heat source 41 of the electronic product, and then the cantilever 2 on both sides of the substrate is rotated and adjusted to be positioned in the positioning portion 42 of the electronic product 4 by the fixing portion 2 2 , and the positioning portion 2 is The circular hole 2 21 ' is located in the positioning hole 4 of the positioning portion 4 2, and passes through the circular hole 2 21 of the cantilever 2 through the holding body 2 3 and then passes through the positioning hole 4 2丄 and utilizes The retaining body 2 3 is pressed against the fixing portion 2 2 of the cantilever 2 by the stopping cap body 2 3 !, and the latching rod 2 3 2 of the retaining body 2 3 passes through the positioning hole 4 2 After the work, the card is held at the bottom of the positioning hole 4 21 to fix the heat dissipation module 3 on the heat source 4, and the heat source module 4 can be assisted by the heat dissipation module 3; [heat dissipation. The above-mentioned electronic product 4' is different from the manufacturer of the different brands, so the positioning portion 42 of the position of the heat source (c PU, wafer, etc.) 4 i is also different, but the two sides of the substrate 1 of the buckle Because the cantilever 2 is adjusted, rotated, and the cantilever 2 generates a downward resisting force, the fixing portion 2 2 of the second cantilever 2 can be adjusted to be located at the positioning portion 42 of the electronic product. The position of the fasteners is not limited by the position of the positioning unit. The 9 M313953 is applicable to the electronic products of different brands. The substrate 1 is fixed to the positioning of the electronic product 4 by using the cantilever 2 on both sides, and the cantilever 2 is pressed against the substrate 1 to press the substrate 1 against the heat dissipation module 3. On the block 31, the heat dissipating block 31 can be completely attached to the heat source 41 without being tilted or loosened. Please refer to the ninth, tenth, and eleventh drawings for the perspective view of another embodiment of the present invention, the stereoscopic appearance of the substrate and the cantilever of another embodiment, and the enlarged view of another embodiment. It can be clearly seen that the substrate of the present invention is disposed on the cantilever 2 provided on the two sides, and the fixed portion 22 of the cantilever 2 on the movable side can be provided with a buckle body 222, and the electronic body is opposite to the embedded body 2 2 2 . The positioning portion 4 2 around the heat source 41 of the product 4 is provided with a plurality of loops 4 2 2 so that the heat sink block 31 of the heat dissipation module 3 can be pressed against the heat source 41 by the substrate 1 and can be supported by the two sides. 2, the buckle body 2 2 2 is respectively buckled to each of the buckles 4 2 2 of the positioning portion 4 2 , and the heat sink group 3 2 is fixed on the heat source 41, and the electronic product 4 does not need to be provided with holes. The trouble of the processing work can be reduced; and the cantilever 2 is formed on the two sides of the substrate 1 by the cantilever 2 on both sides of the substrate 1 and the snap-fit body 2 2 2 is snapped onto the buckle 4 2 2 The force is pressed against the substrate 1 so that the bottom thereof is completely abutted against the heat source 41. Therefore, the above description is only a preferred embodiment of the present invention, and thus the limitation of the patent scope of the present invention is not limited. The fastener of the heat dissipation module of the present invention is provided with a cantilever 2 on both sides of the substrate 1 and the substrate is provided. 1 is fixed on the heat dissipation block 3 of the heat dissipation module 3, and the heat dissipation block 31 is connected with a plurality of heat pipes 312 and a heat sink group 32, so that the heat dissipation block 31 can be adhered to the heat of the electronic product 4 by using the substrate 1. On the source 41, then M313953, ^ hang f 2 _ 2 2 is positioned in the heat source 4, the positioning part 4 2 reaches the purpose of the thermal module 3 being quickly installed in the heat source 4 i, and is rotated 2 Move, adjust, _ _ _ 2 test.卩 4 2, 俾 can reach the heat-dissipation module 3, the use limit is small, the money is easy, and the cover is good. The structure and device that can achieve the above-mentioned effects are all subject to the creation of the
專利二種簡易修飾及等效結構變化，均應同理包含於本創作 导利乾圍内，合予陳明。 上述本_之賴额之扣無#際使科，材具有下 各項優點，如·· (―)電子產品4因不_商製造，其發熱源4 i周邊之定位部 2彳置也；不同’但基板1二側活動式懸臂2可調整旋 動’即可將懸臂2調整至對位於定位部4 2，而供基板丄 、懸臂2及散熱模組3所組成之扣具，使用時限制少、組The two kinds of simple modifications and equivalent structural changes of the patents should be included in the creation of the guide and the Chen Ming. The above-mentioned _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Different 'but the movable movable cantilever 2 of the two sides of the substrate 1 can be adjusted and rotated' can adjust the cantilever 2 to the positioning device 42, and the buckle for the substrate, the cantilever 2 and the heat dissipation module 3, when used Less restrictions, groups
裝簡易、快速。 (二）基板1為於二側分別設有可調整旋動之懸臂2，而二懸臂 2係固設於電子產品4上，使二側臂2對基板丨產生平均 的下壓力，以使基板i完全抵壓散熱模組3的散熱塊3工 ’而使散熱塊31平貼於發熱源4工，達到良好的散孰功 能0 三）電子產品4於發熱源4 1周邊所設之雜部42，可為定 位孔4 21或環扣4 2 2，則可對應定位部4 2於二懸臂 2之固定部2 2 ’設有圓孔2 2 χ及卡持體2 3、嵌扣體 11 M313953 2 2 2 ’並利用二懸臂2形成向下的抵壓力，可確實供散 • 熱模組3的散熱塊31完全抵貼於發熱源，不會鬆動或翹 . 起，可輔助發熱源41快速散熱。 故’本創作為主要針對散熱模組之扣具利用基板二侧分别設 有懸臂，而可利用懸臂將散熱模組固定於電子產品發熱源上，以 利用基板二側之懸臂可調整旋動，而能對位於電子產品上之定位 邓，可供散熱模組快速固定於發熱源上為主要保護重點，乃僅使 • 散鏡_用基板錢臂雜壓，並具有散熱模組底部完全抵貼 於發熱源，以輔助發熱源快速散熱之優勢，惟，以上所述僅為本 創作之較佳實施例而已，非因此即侷限本創作之專利範圍，故舉 凡運用本創作說明書及圖式内容所為之簡易修飾及等效結構變化 ，均應同理包含於本創作之專利範圍内，合予陳明。 絲上所述，本創作上述散熱模組之扣具於使用時，為確實能 達到其功效及目的，故本創作誠為—實用性優異之創作，為符合 籲新型專利之申請要件，爰依法提出申請，盼審委早日賜准本案 ’以保障創作人之辛苦創作，齡鈞局審委有任何機，請不 吝來函指示，創作人定當竭力配合，實感德便。 12 M313953 【圖式簡單說明】 第一圖係為本創作之立體外觀圖。 第二圖係為本創作之立體分解圖。 第三圖係為本創作之組裝方式立體分解圖。 第四圖係為本創作之側視剖面圖。 第五圖係為本創作之散熱模組立體分解圖。 第六圖係為本創作之懸臂收縮方式俯視圖。 第七圖係為本創作之懸臂伸張方式俯視圖。 第八圖係為本創作較佳實施例之立體外觀圖。 第九圖係為本創作另一實施例之立體外觀圖。 第十圖係為本創作另一實施例基板與懸臂之立體外觀圖。 第十一圖係為本創作之另一實施例局部放大圖。 第十二圖係為習用散熱器扣具之立體外觀圖。 【主要元件符號說明】 1、基板 1 1、通孔 1 2、螺孔 121、限位軸體 12 2、螺桿 12 3、盤形彈片 13 M313953 2、 懸臂 * 2 1、軸孔 - 2 2、固定部 2 2 1、圓孔 2 2 2、嵌扣體 3、 散熱模組 B 31、散熱塊 311、 定位螺孔 3 1 1 1、鎖固體 312、 熱管 313、 鎖固螺桿 4、 電子產品 φ 4 1、發熱源 4 2、定位部 2 3、卡持體 2 31、止擋帽體 2 3 2、扣持桿 2 3 3、彈性部 3 2、散熱片組 3 21、插孔 3 2 2、螺帽 3 2 3、穿孔 4 21、定位孔 4 2 2、環扣 A、扣具 A1、銷體 A4、底鉤部 A2、帽蓋 A5、彈性元件 A3、折片 14 M313953 B、 散熱器 B1、第一孔槽 C、 電路板 C 2、發熱元件 C1、第二孔槽Easy and fast to install. (2) The substrate 1 is provided with adjustable cantilevered arms 2 on both sides, and the second cantilever 2 is fixed on the electronic product 4, so that the two side arms 2 generate an average downward pressure on the substrate to make the substrate i completely resists the heat-dissipating block 3 of the heat-dissipating module 3, and the heat-dissipating block 31 is flatly attached to the heat source 4 to achieve a good diverging function. 0) The electronic product 4 is provided in the periphery of the heat source 4 1 42 can be a positioning hole 4 21 or a buckle 4 2 2, corresponding to the positioning portion 4 2 in the fixed portion 2 2 ' of the second cantilever 2 is provided with a circular hole 2 2 χ and the holding body 2 3, the embedded body 11 M313953 2 2 2 'And use the second cantilever 2 to form a downward pressure, which can be surely supplied and dissipated. The heat-dissipating block 31 of the thermal module 3 is completely abutted against the heat source, and will not be loose or tilted. Fast heat dissipation. Therefore, the clips for the heat dissipation module are respectively provided with cantilever arms on the two sides of the substrate, and the cantilever arms can be used to fix the heat dissipation module on the heat source of the electronic product, so that the cantilever can be adjusted and rotated by using the two sides of the substrate. The positioning of Deng, which is located on the electronic product, can be quickly fixed on the heat source for the heat-dissipation module. The main protection point is only to make the mirror mirror _ use the substrate arm arm miscellaneous pressure, and the bottom of the heat dissipation module is completely abutted. In the case of a heat source, it is advantageous to assist the heat source to rapidly dissipate heat. However, the above description is only a preferred embodiment of the present invention, and thus does not limit the scope of the patent of the creation, so the use of the present specification and the contents of the schema is The simple modification and equivalent structural changes shall be included in the scope of the patent of this creation and shall be combined with Chen Ming. As stated on the silk, the fasteners of the above-mentioned heat-dissipating modules are used to achieve their efficacy and purpose. Therefore, the creation is sincerely-excellent and practical, in order to meet the requirements of the new patent application, To file an application, I hope that the trial committee will grant the case as soon as possible to protect the creators' hard work. The trial committee of the squad has any opportunity. Please do not hesitate to give instructions. The creators will try their best to cooperate and feel good. 12 M313953 [Simple description of the diagram] The first picture is a three-dimensional appearance of the creation. The second picture is a three-dimensional exploded view of the creation. The third picture is an exploded view of the assembly method of the creation. The fourth figure is a side cross-sectional view of the creation. The fifth picture is a three-dimensional exploded view of the heat dissipation module of the creation. The sixth picture is a top view of the cantilever contraction mode of the creation. The seventh picture is a top view of the cantilever extension of the creation. The eighth drawing is a perspective view of the preferred embodiment of the present invention. The ninth drawing is a perspective view of another embodiment of the present creation. The tenth figure is a perspective view of the substrate and the cantilever of another embodiment of the present invention. The eleventh figure is a partial enlarged view of another embodiment of the present creation. The twelfth figure is a three-dimensional appearance of a conventional heat sink clip. [Main component symbol description] 1. Substrate 1 1 , through hole 1 2 , screw hole 121 , limit shaft body 12 2 , screw 12 3 , disk spring 13 M313953 2 , cantilever * 2 1 , shaft hole - 2 2 The fixing portion 2 2 1 , the circular hole 2 2 2 , the ingot body 3 , the heat dissipation module B 31 , the heat dissipation block 311 , the positioning screw hole 3 1 1 1 , the lock solid 312 , the heat pipe 313 , the locking screw 4 , the electronic product φ 4 1. Heat source 4 2. Positioning part 2 3. Holder 2 31, stop cap 2 3 2. Buckle rod 2 3 3, elastic part 3 2. Heat sink set 3 21, jack 3 2 2 , nut 3 2 3 , perforation 4 21 , positioning hole 4 2 2, buckle A, buckle A1, pin body A4, bottom hook A2, cap A5, elastic element A3, flap 14 M313953 B, radiator B1, the first slot C, the circuit board C 2, the heating element C1, the second slot
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