201005487 九、發明說明： 【發明所屬之技術領域】 • 本發明涉及—種固^裝置，特別係指使用該固定 • 纟置固疋散熱體至發熱電子元件上的散熱裝置。 【先前技術】 -般電子元件（特㈣巾央處判）運行時產生 大量的熱，而使其本身及系統溫度升高，過高的溫度 ❹ ㈣致其運行性能的下降。為此，業界通常在電子元 件上安裝散熱器，排出其所產生的大量熱量，為確保 散熱器與電子元件能夠緊密接觸而傳熱充分，通常需 借助固定裝置將散熱器辅助扣合。 而 然而，隨著電腦產業的快速發展，電腦薇商考量 系統的小型化、散熱問題的改善及噪音的降低等多方 面的因素，對習知系統進行不斷的改進而提出諸多不 $架構及尺寸㈣統，使得電子元件在電路板上的水 平佈置及高度等改變很大。但是，習知散熱器往往只 能搭配特定的固定裝置鎖固於電路板上，當電路板上 的電子兀件的佈置及尺寸改變而又因考量電容、板卡 等的干涉其上的固定孔位改變時，使得其位置與固定 裝置上的鎖合孔不相對應，固定裝置無法適用於變化 後的系統。 因此，如何提供一種能夠適用於多種不同電腦系 統架構的固定襞置成為業界需解決的重要問題之一。 201005487 【發明内容】 有鑒於此’有必要提供一種能很好定位至發熱電子元 件上的固定裝置及使用·定裝置的散熱裝置。 ▲ -種固定H置’包括—顏及設於座體上的一彈片， 彈片i括與座體相結合的—結合部及由該結合部的兩端 分別延伸形成的兩個鎖合部，該座體上設有—凸柱，該凸 柱包括與座體連接的—頸部及位於朗部頂端的一頭部，201005487 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a type of fixing device, and more particularly to a heat dissipating device that uses the fixing device to fix a heat sink to a heat-generating electronic component. [Prior Art] - The general electronic component (special (four) towel judgment) generates a large amount of heat during operation, and causes itself and the system temperature to rise, and the excessive temperature ❹ (4) causes a decrease in its running performance. For this reason, the industry usually installs a heat sink on an electronic component to discharge a large amount of heat generated by the heat sink. In order to ensure that the heat sink and the electronic component can be in close contact and heat transfer is sufficient, the heat sink is usually assisted by a fixing device. However, with the rapid development of the computer industry, the computer Wei business considers the miniaturization of the system, the improvement of the heat dissipation problem and the reduction of noise, etc., and the continuous improvement of the conventional system raises many structures and sizes. (4) The system makes the horizontal arrangement and height of the electronic components on the circuit board greatly changed. However, conventional heat sinks can only be locked to a circuit board with a specific fixing device. When the arrangement and size of the electronic components on the circuit board are changed, the fixing holes on the capacitors, boards, etc. are considered. When the position is changed, its position does not correspond to the locking hole on the fixing device, and the fixing device cannot be applied to the changed system. Therefore, how to provide a fixed device that can be applied to many different computer system architectures has become one of the important issues to be solved in the industry. 201005487 SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink that can be positioned well on a heat-generating electronic component and a heat sink that uses the device. ▲ - a fixed H set 'including - a face and a shrapnel on the seat body, the shrapnel i includes a joint with the seat body and two locking portions formed by the two ends of the joint portion respectively, The base body is provided with a protruding post, the protruding post includes a neck connected to the seat body and a head at the top end of the ram.
CT邛上„又有一固定孔，該彈片藉由該固定孔而鬆動地 套置於該頦部上，該固^孔的孔徑小於該頭部的最大外徑。 種政熱裝置，包括一座體及設於該座體上的一彈 片"亥彈片包括與座體相結合的一結合部及由該結合部的 兩^刀別延伸形成的兩個鎖合部，該座體上設有一凸柱， 該凸柱包括設於座體上的—騎及位於該頸部頂端的一頭 部’该結合部上設有一固定孔’該彈片藉由該固定孔而鬆 動地套置於該頸部上，顧定孔的孔徑小於該頭部的最大 夕卜細。The CT file has a fixing hole, and the elastic piece is loosely sleeved on the crotch portion by the fixing hole, and the hole diameter of the fixing hole is smaller than the maximum outer diameter of the head. The seed thermal device includes a body And a shrapnel disposed on the base body includes a joint portion combined with the seat body and two lock portions formed by the two cutters extending from the joint portion, and the base body is provided with a convex portion a post, the stud includes a ride on the seat and a head on the top of the neck. The joint is provided with a fixing hole. The elastic piece is loosely sleeved on the neck by the fixing hole. Above, the aperture of the Guding hole is smaller than the maximum size of the head.
知技術相比，將散熱裝置固定至發熱電子元件 上時’由於該散熱裝置的彈片鬆動地套置於該頸部 上〜適應於不同位置開孔的電路板，從而使散熱體可 固定於多種不同架構的電腦系統的電路板上 熱裝置的通用性。 α欢 【實施方式】 之散熱裝 下面參照圖示，結合實施例詳細說明本發明 置。 χ 201005487 如圖1及圖2所示為本發明散熱裝置的一個較佳實施 例°亥政熱裝置包括一熱管1〇、一散熱器2〇以及藉由一彈 片30將熱管1〇固定至電路板4〇上的一座體5〇。 ❹ 鲁 該熱管10為扁平熱管，大致呈L型，其包括一蒸發端 12及冷凝端14，該蒸發端12與電路板4〇上的一發熱電 子、凡件60接觸，並吸收其熱量傳至冷凝端14。該熱管卬 的冷凝端14與散熱器2〇相連#，用於將傳導至冷凝端以 的…、里進步散發出去。該散熱器2〇由複數平行相間排列 ^鰭片22組成，該散熱器2〇於一侧設有一槽狀的收容部 圖未標）’該收容部將該熱管1〇的冷凝端14收容其内。 該座體50由導熱性能好的金屬材料製成的板狀結構， Z為-散熱體對發熱電子元件6〇進行散熱。該座體5〇 心端向上凹進形成一凹槽52，該凹槽52用於將熱管坨 果讀端12收谷其内’為增加熱管1〇與座體％的熱傳效 % ’二者之間可以藉由錫焊或導齡相接觸。該座體％貼 :於發熱電子元件60上並使熱管1〇的蒸發端12與發熱電 ^件60相鋪’使熱㈣與座體5Q共同吸收並散發發 了電子το件6G的熱董。该座體5G的頂端與凹槽52對應向 士凸出形成-凸台54 ’該座體5〇於凸台54的兩側的部分 向上延伸形成複數的導熱柱56,該導熱柱56進一步將傳導 至座體50上的熱量散發。請同時參考圖3，該凸台54向上 延伸形成〜凸柱58，該凸柱58包括與座體％相連接的一 頌部5謎及位於該頸部頂端的_頭部撕。在本實施 例中，該頭部582藉由設於凸柱58頂端的一擴孔剔使之 201005487 向外擴大變形而形成’該頭部582呈橢圓形，且該頭部582 的最大外徑大於該頭部580的外禮。該凸枉58可由座體 一體形成’亦可為螺釘或鉚釘等固定部件設置在座體5〇上 形成，該頭部582亦可為圓形或其他形狀。 該彈片30包括與座體50相結合的一結合部32及用於 將座體50鎖固於發熱電子元件6〇上的二鎖合部34。該彈 片30呈細長狀，該鎖合部34由該結合部32的兩端先向下 再向外彎折延伸形成’使該結合部32相對於該二鎖合部34 向上凸出設置。該結合部32對應跨設於凸台54上，二錢 合部34分別位於凸台54的兩侧。該結合部32上對應凸检 58設有一固定孔320’藉由該固定孔32〇使該彈片3〇套置 於凸柱58的頸部580上。該固定孔32〇的孔徑大於該頭部 580的外徑且小於該頭部582的外徑，可使該彈片3〇活動 的套置於頸部580上而不會從頭部582脫下。該鎖合部34 的末端各設有一裝配孔340，藉由一螺釘80穿過該裝配孔 340與電路板40上的鎖固孔42將彈片30固定在電路板4〇 上，並使座體50的底端與發熱電子元件60相接觸。由於 該彈片30可相對於座體50旋轉，避免彈片30與座體5〇 鎖死的狀況，減小座體50上連接點對結合部32的結人應 力，防止彈片30的結合部32發生變形而影響散熱裝 發熱電子元件60的接觸。此外，這種設置的散熱裝置通過 旋轉彈片30，使其自由端部可相對座體50位置變化，可方 便地實現裝配孔340與電路板40上的鎖固孔42的對齊， 便於組裝’適應於不同位置開孔的電路板40，從而提升散 201005487 熱裝置的通用性。 丄介吁’該發熱電 管10的蒸發端12傳導 ^的熱量-方面通過熱 向外散發，另-方面直接通m14 ’再通過散熱器20 熱柱56散發。 妾通過座體5G及設於其上的導Compared with the known technology, when the heat sink is fixed to the heat-generating electronic component, the spring of the heat sink is loosely placed on the neck, and the circuit board is adapted to be opened at different positions, so that the heat sink can be fixed to various types. The versatility of thermal devices on circuit boards of computer systems of different architectures. [Embodiment] Heat Dissipating Apparatus Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. χ 201005487 As shown in FIG. 1 and FIG. 2, a preferred embodiment of the heat sink of the present invention comprises a heat pipe 1〇, a heat sink 2〇, and a heat pipe 1〇 fixed to the circuit by a spring piece 30. The body on the board 4 is 5 inches. The heat pipe 10 is a flat heat pipe, which is substantially L-shaped, and includes an evaporation end 12 and a condensation end 14, and the evaporation end 12 is in contact with a heat-generating electron on the circuit board 4, and contacts the member 60, and absorbs the heat transfer. To the condensation end 14. The condensation end 14 of the heat pipe 〇 is connected to the heat sink 2〇, and is used to conduct the conduction to the condensation end. The heat sink 2 is composed of a plurality of parallel-arranged fins 22, and the heat sink 2 is provided with a groove-shaped receiving portion on one side (not shown). The receiving portion houses the condensation end 14 of the heat pipe 1〇. Inside. The base 50 is made of a plate-like structure made of a metal material having good heat conductivity, and Z is a heat sink for dissipating heat from the heat-generating electronic component 6 . The base end of the base body 5 is recessed upward to form a groove 52 for collecting the heat pipe hazelnut reading end 12 therein to increase the heat transfer efficiency of the heat pipe 1〇 and the seat body % 2 They can be contacted by soldering or lead age. The body is affixed to the heat-generating electronic component 60 and the evaporation end 12 of the heat pipe 1〇 is interposed with the heat-generating component 60. The heat (4) and the seat body 5Q are absorbed together and the heat is generated. . The top end of the base 5G and the recess 52 are correspondingly formed to protrude into a convex portion 54. The portion of the base 5 that extends on both sides of the boss 54 extends upward to form a plurality of heat conducting columns 56, and the heat conducting column 56 further The heat conducted to the body 50 is dissipated. Referring to FIG. 3 at the same time, the boss 54 extends upward to form a stud 58 which includes a crotch portion 5 which is connected to the seat body % and a head tear at the top end of the neck portion. In this embodiment, the head 582 is deformed outwardly by a reaming provided at the top end of the stud 58 to form an 'elliptic shape, and the maximum outer diameter of the head 582. Greater than the outer ritual of the head 580. The tongue 58 may be integrally formed by the seat body. A fixing member such as a screw or a rivet may be formed on the seat body 5, and the head portion 582 may also be circular or other shape. The elastic piece 30 includes a joint portion 32 coupled to the base body 50 and a second lock portion 34 for locking the base body 50 to the heat-generating electronic component 6''. The elastic piece 30 has an elongated shape, and the locking portion 34 is bent downwardly and outwardly from the two ends of the joint portion 32 to form the engaging portion 32 so as to protrude upward relative to the two locking portions 34. The joint portion 32 is correspondingly spanned on the boss 54, and the two joint portions 34 are respectively located on both sides of the boss 54. The corresponding convex portion 58 of the joint portion 32 is provided with a fixing hole 320'. The elastic piece 3 is sleeved on the neck portion 580 of the boss 58 by the fixing hole 32. The fixing hole 32 has a hole diameter larger than the outer diameter of the head 580 and smaller than the outer diameter of the head 582, so that the elastic piece 3〇 can be placed on the neck 580 without being removed from the head 582. Each of the ends of the latching portion 34 is provided with a mounting hole 340. The screw 30 is fixed to the circuit board 4 by a screw 80 passing through the mounting hole 340 and the locking hole 42 of the circuit board 40, and the base body is fixed. The bottom end of the 50 is in contact with the heat generating electronic component 60. Since the elastic piece 30 is rotatable relative to the base body 50, the state in which the elastic piece 30 and the seat body 5 are locked is prevented, and the joint stress of the joint portion 32 on the seat body 50 is reduced, and the joint portion 32 of the elastic piece 30 is prevented from occurring. The deformation affects the contact of the heat-dissipating heat-generating electronic component 60. In addition, the heat dissipating device of the arrangement can change the position of the free end portion relative to the seat body 50 by rotating the elastic piece 30, so that the alignment of the mounting hole 340 and the locking hole 42 on the circuit board 40 can be conveniently realized, and the assembly can be easily adapted. The circuit board 40 is opened at different positions to enhance the versatility of the 201005487 thermal device. The heat of the evaporation end 12 of the heating pipe 10 is radiated outward by heat, and the other side is directly passed through the m14' and then radiated through the heat column 56 of the radiator 20.妾 Passing through the seat 5G and the guide provided thereon
專利所^本發明符合發明專利之要件，爰依法提出 °月 卩上所4者僅為本發明之較佳實施例，舉凡 本案技藝之人士 ’在纽本發㈣神所作之等欵 ’變化’皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明散熱模組一實施例的分解圖。 圖2為圖1的倒置立體組合圖。 圖3為圖1中設有彈片的座體的側面剖視圖。 【主要元件符號說明】 熱管 10 蒸發端 12 冷凝端 14 散熱器 20 鰭片 22 彈片 30 結合部 32 鎖合部 34 電路板 40 鎖固孔 42 座體 50 凹槽 52 凸台 54 導熱柱 56 凸柱 58 發熱電子元件 60 螺釘 80 固定孔 320 裝配孔 340 頸部 580 頭部 582 擴孔 584Patent The present invention conforms to the requirements of the invention patent, and is only a preferred embodiment of the present invention. The person skilled in the art of the present invention is the 'change' made by God in New Zealand (4). All should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded view of an embodiment of a heat dissipation module of the present invention. FIG. 2 is an inverted perspective combination view of FIG. 1. FIG. Figure 3 is a side cross-sectional view of the seat body of Figure 1 provided with shrapnel. [Main component symbol description] Heat pipe 10 Evaporation end 12 Condensing end 14 Heat sink 20 Fin 22 Spring piece 30 Joint part 32 Locking part 34 Circuit board 40 Locking hole 42 Seat 50 Groove 52 Boss 54 Heat-conducting column 56 Stud 58 Heated electronic components 60 Screws 80 Fixing holes 320 Mounting holes 340 Neck 580 Head 582 Reaming 584