TWI446470B - A wafer conveyor with fragment detection - Google Patents
A wafer conveyor with fragment detection Download PDFInfo
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本發明係關於一種具有破片檢測之晶圓輸送設備，尤其是一種用於晶圓承載裝置間之晶圓輸送設備，而該晶圓輸送設備更能夠將其搬運之晶圓進行破片檢測以及破片排除。The invention relates to a wafer conveying device with fragment detection, in particular to a wafer conveying device for a wafer carrier device, and the wafer conveying device is capable of detecting fragments and removing fragments of the wafer to be transported thereof. .
太陽能電池目前主要材質主要為矽以及如砷化鎵(GaAs)、碲化鎘(CdTe)、鍺...等元素或化合物，以提高將太陽能轉為電能或熱能的轉換效率。基於不同的應用考量會採用不同的元素或化合物，例如：民生消費性產品通常是利用非晶矽太陽能電池板；太空中使用的是砷化鎵太陽電池；若是用在沙漠、海洋等以發電為目的等大型電源則使用多晶矽太陽電池。The main materials of solar cells are mainly germanium and elements or compounds such as gallium arsenide (GaAs), cadmium telluride (CdTe), germanium, etc., to improve the conversion efficiency of converting solar energy into electrical energy or heat. Different elements or compounds will be used based on different application considerations. For example, people's live consumer products usually use amorphous germanium solar panels; space is used in gallium arsenide solar cells; if used in deserts, oceans, etc. Large-scale power supplies such as the purpose use polycrystalline silicon solar cells.
此外，應用於民生消費性產品的太陽能電池板，也會因為不同的電子產品，而輸出不同大小的電壓。同時，也會測量太陽能電池板的電性功能、基板正背面的缺陷、瑕疵、破片程度等。In addition, solar panels used in consumer products for people's livelihood will also output different voltages for different electronic products. At the same time, the electrical function of the solar panel, the defects on the front and back of the substrate, the flaws, the degree of fragmentation, and the like are also measured.
在形成太陽能電池前一般稱之為太陽能晶圓，太陽能晶圓片會進行相關測試與分類，無論是機台間之搬移或因出貨需求，都會將太陽能晶圓疊層置放，而目前常見的晶圓承載裝置主要有兩種不同設計，一種為晶圓片匣(cassette)，具有頂部、底部及左右側壁，並且在兩側壁上形成有複數凸緣，而晶圓則從上述頂部、底部及左右側壁所共同圍繞出的側向出入口進出，而另一種晶圓承載裝置為晶圓片盒(magazine)，是一種上方形成有一個頂端汲放口的承載裝置。Before the formation of solar cells, they are generally called solar wafers. Solar wafers will be tested and classified. Whether it is moving between machines or shipping requirements, solar wafers will be stacked. The wafer carrier has two main designs, one is a cassette, having a top, a bottom and left and right side walls, and a plurality of flanges are formed on the two side walls, and the wafer is from the top and bottom. And the lateral entrance and exit around the left and right side walls are in and out, and the other wafer carrying device is a wafer, which is a carrying device formed with a top opening.
由於兩種晶圓承載裝置所移載晶圓之方式有很大差異，屬於兩種不同承載裝置，因此在實際使用者的設廠過程中，往往會取其所需而自行組合運用，而同種或是兩種晶圓承載裝置之間的移動變換也是頻繁出現的，但因晶圓在運送的過程中，很容易因為碰撞而產生輕微之結構瑕疵，即使以肉眼檢視也無法輕易發現問題之所在，但待完成所有製造處理流程時，將會因晶圓表面破裂的情況，而導致實際電路受到不定程度受損的影響；因此，若是能夠於自動化檢測過程中或是不同承載裝置之間設置特定需求之破片檢測，並分階段性排除表面有破裂情況之晶圓，如此將能夠有效地避免多餘的製程與製程後之檢測項目，以節省更多的製造成本與人力成本，應為一最佳解決方案。Since the way in which the wafers are transferred by the two wafer carrier devices is very different, they belong to two different carrier devices. Therefore, in the process of setting up the actual user, they are often used in combination and the same species. Or the movement change between the two wafer carriers is frequent, but because the wafer is in the process of transportation, it is easy to produce a slight structural flaw due to the collision. Even if it is visually inspected, the problem cannot be easily found. However, when all the manufacturing processes are completed, the actual circuit will be affected by the degree of damage due to the cracked surface of the wafer; therefore, if it can be set in the automatic detection process or between different carriers The need for fragment detection, and the elimination of wafers with rupture on the surface, will effectively avoid redundant process and post-process inspection projects, in order to save more manufacturing costs and labor costs, should be the best solution.
本發明之目的即在於提供一種具有破片檢測之晶圓輸送設備，係能夠於承載裝置輸入、輸出之搬運過程中進行破片檢測，以排除有破裂情況之晶圓。SUMMARY OF THE INVENTION It is an object of the present invention to provide a wafer transfer apparatus having chip detection capable of performing chip detection during transport of input and output of a carrier device to eliminate wafers having cracks.
可達成上述發明目的之一種具有破片檢測之晶圓輸送設備，係用於檢測自晶圓承載裝置輸出之晶圓，而該晶圓輸送設備係包括了一組用於搬運晶圓之汲取裝置、至少一組用於運送晶圓之晶圓輸送裝置、複數個破片檢測器及一組晶圓移轉裝置，其中該破片檢測器係設置於輸送帶兩側下方，用以能夠檢測被搬運於該輸送帶上之晶圓，並判斷晶圓是否有破裂的情況發生，而後再經由該晶圓移轉裝置之晶圓汲取器汲取該晶圓輸送裝置上檢測後之晶圓，並藉由進行橫向或是縱向移動，以將該晶圓轉移分配於該晶圓移轉裝置之複數組輸出軌道上。A wafer transfer apparatus with fragment detection for achieving the above object is used for detecting a wafer output from a wafer carrier, and the wafer transfer apparatus includes a set of pick-up devices for transporting a wafer, At least one set of wafer transfer device for transporting wafers, a plurality of fragment detectors, and a set of wafer transfer devices, wherein the fragment detectors are disposed under both sides of the conveyor belt for detecting that the wafer is carried The wafer on the conveyor belt is judged whether the wafer is broken or not, and then the wafer picker on the wafer transfer device is taken through the wafer picker of the wafer transfer device, and the lateral direction is performed by the wafer transfer device. Or moving longitudinally to transfer the wafer transfer to the complex array output track of the wafer transfer device.
更具體的說，所述汲取裝置係移動於該晶圓承載裝置及晶圓輸送設備位置之間。More specifically, the capture device is moved between the wafer carrier and the wafer transport device location.
更具體的說，所述晶圓輸送裝置係包含有一輸送帶及一驅動機構，而該晶圓移轉裝置係設置於該晶圓輸送裝置之輸送帶另一端，另外該晶圓移轉裝置係包含至少一個晶圓汲取器、至少一組橫向移動軌道、至少一組縱向移動軌道及複數組輸出軌道，其中該晶圓汲取器能夠被搬運於該橫向移動軌道及該縱向移動軌道上。More specifically, the wafer transport device includes a conveyor belt and a driving mechanism, and the wafer transfer device is disposed at the other end of the conveyor belt of the wafer transport device, and the wafer transfer device is further The at least one wafer picker, the at least one set of laterally moving tracks, the at least one set of longitudinally moving tracks, and the complex array output track are included, wherein the wafer picker can be carried on the lateral moving track and the longitudinal moving track.
更具體的說，該晶圓輸送設備係能夠添加設置複數個與該晶圓輸送裝置相連接之破片排除裝置，而該破片排除裝置係包含有一輸送帶、一驅動機構、一連接於輸送帶下方之汽缸，其中該汽缸能透過該驅動機構改變該輸送帶之位置狀態；另外，該晶圓輸送裝置之輸送帶一端係能夠與該破片排除裝置之輸送帶相連接，故該驅動機構能夠驅動該輸送帶，以使該晶圓能夠於該輸送帶上被搬運。More specifically, the wafer transfer apparatus is capable of adding a plurality of chip removing devices connected to the wafer transfer device, and the chip removing device includes a conveyor belt, a driving mechanism, and a connection under the conveyor belt. a cylinder in which the cylinder can change the position of the conveyor belt through the driving mechanism; in addition, one end of the conveyor belt of the wafer conveying device can be connected to the conveyor belt of the fragment removing device, so the driving mechanism can drive the A conveyor belt to enable the wafer to be carried on the conveyor belt.
更具體的說，所述破片排除裝置之輸送帶上係設置至少一個感測器，用以驅動該汽缸進行伸縮改變該輸送帶為水平狀態或是下擺狀態。More specifically, at least one sensor is disposed on the conveyor belt of the fragment removing device for driving the cylinder to expand and contract to change the conveyor belt to a horizontal state or a hem state.
更具體的說，所述破片檢測器上係具有至少一個光接受端及至少一個光發射端，該光發射端係用以照射該晶圓表面，並反射回該光接受端接收，以判斷晶圓是否有破裂的情況發生。More specifically, the fragment detector has at least one light receiving end and at least one light emitting end for illuminating the surface of the wafer and reflecting back to the light receiving end for determining the crystal Whether the circle has a crack or not.
更具體的說，所述晶圓承載裝置係為晶圓片匣、晶圓片盒等等能夠承載晶圓之容器。More specifically, the wafer carrier is a wafer cassette, a wafer cassette, or the like that can carry a wafer.
更具體的說，所述破片排除裝置之輸送帶下方係能夠添加設置一廢料容器，用以容置晶圓表面具有破裂之晶圓片。More specifically, under the conveyor belt of the fragment removing device, a waste container can be added to accommodate a wafer having a crack on the surface of the wafer.
有關於本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之較佳實施例的詳細說明中，將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.
請參閱圖一、圖二及圖三，為本發明一種具有破片檢測之晶圓輸送設備之第一實施架構示意圖、破片檢測立體示意圖及破片檢測側視圖，而該晶圓輸送設備係用於檢測自晶圓承載裝置1輸出之晶圓3，由圖中可知，該具有破片檢測之晶圓輸送設備係包含：一組汲取裝置21，係移動於該晶圓承載裝置1及晶圓輸送設備位置之間，該汲取裝置21係用於搬運晶圓3；至少一組晶圓輸送裝置22，係包含有一輸送帶221及一驅動機構222，該驅動機構222能夠驅動該輸送帶221，以使該晶圓3能夠於該輸送帶221上被搬運；複數個破片檢測器23，係設置於該輸送帶221兩側下方，用以檢測被搬運於該輸送帶221上之晶圓3，並判斷晶圓3是否有破裂的情況發生；一組晶圓移轉裝置24，係設置於該輸送帶221另一端，該晶圓移轉裝置24係包含至少一個晶圓汲取器241、至少一組橫向移動軌道242、至少一組縱向移動軌道243及複數組輸出軌道244，其中該晶圓汲取器241能夠移動於該橫向移動軌道242及該縱向移動軌道243上；因此，當汲取裝置21將一晶圓3搬運於該晶圓輸送裝置22之輸送帶221上時，該晶圓輸送裝置22之驅動機構222係能夠驅動該輸送帶221移動，以將該晶圓3於該輸送帶221上被搬運移動，同時當該晶圓3移動至該破片檢測器23之區域時，該破片檢測器23會判斷該晶圓3是否有破裂的情況發生；最後，該晶圓移轉裝置24之晶圓汲取器241係會汲取該晶圓輸送裝置22上之晶圓3，而該晶圓汲取器241係能夠透過該橫向移動軌道242及縱向移動軌道243來進行橫向或是縱向移動，並再將該晶圓轉移分配於該複數組輸出軌道244上，以進行後續之製程處理。Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are schematic diagrams of a first implementation architecture of a wafer transport device with fragment detection, a stereo view of the fragment detection and a side view of the fragment detection, and the wafer transport equipment is used for detecting The wafer 3 outputted from the wafer carrier 1 is as shown in the figure. The wafer transfer device with fragment detection includes: a set of picking devices 21, which are moved to the wafer carrier 1 and the wafer transfer device. The picking device 21 is used for transporting the wafer 3; at least one set of the wafer transporting device 22 includes a conveyor belt 221 and a driving mechanism 222, and the driving mechanism 222 can drive the conveyor belt 221 to The wafer 3 can be transported on the conveyor belt 221; a plurality of fragment detectors 23 are disposed on both sides of the conveyor belt 221 for detecting the wafer 3 carried on the conveyor belt 221 and determining the crystal Whether the circle 3 is broken or not; a set of wafer transfer device 24 is disposed at the other end of the conveyor belt 221, the wafer transfer device 24 includes at least one wafer picker 241, at least one set of lateral movement Track 242, At least one set of longitudinally moving tracks 243 and a plurality of array output tracks 244, wherein the wafer picker 241 is movable on the lateral moving track 242 and the longitudinal moving track 243; therefore, when the picking device 21 carries a wafer 3 When the conveyor belt 221 of the wafer conveyance device 22 is on the conveyor belt 221, the driving mechanism 222 of the wafer conveyance device 22 can drive the conveyor belt 221 to move, and the wafer 3 is transported and moved on the conveyor belt 221, and When the wafer 3 is moved to the area of the fragment detector 23, the fragment detector 23 determines whether the wafer 3 is broken. Finally, the wafer picker 241 of the wafer transfer device 24 is configured. The wafer 3 on the wafer transfer device 22 is captured, and the wafer picker 241 is capable of moving laterally or vertically through the lateral movement track 242 and the longitudinal movement track 243, and then transferring the wafer to the wafer. The complex array is output on track 244 for subsequent processing.
值得一提的是，如圖三所示，該破片檢測器23上係具有至少一個光接受端231及至少一個光發射端232，該光發射端232係用以照射該晶圓3表面，並反射回該光接受端231接收，以判斷晶圓3是否有破裂的情況發生。It is to be noted that, as shown in FIG. 3, the fragment detector 23 has at least one light receiving end 231 and at least one light emitting end 232 for illuminating the surface of the wafer 3, and The reflection is received back to the light receiving end 231 to determine whether or not the wafer 3 is broken.
值得一提的是，該晶圓承載裝置1係為晶圓片匣、晶圓片盒等等能夠承載晶圓之容器。It is worth mentioning that the wafer carrier device 1 is a wafer cassette, a wafer cassette, or the like that can carry a wafer.
請參閱圖二、圖三、圖四、圖五、圖六A及圖六B，為本發明一種具有破片檢測之晶圓輸送設備之破片檢測立體示意圖、破片檢測側視圖、第二實施架構示意圖及破片排除實施例圖，而該晶圓輸送設備係用於檢測自晶圓承載裝置1輸出之晶圓3，由圖中可知，該具有破片檢測之晶圓輸送設備係包含：一組汲取裝置21，係移動於該晶圓承載裝置1及晶圓輸送設備位置之間，該汲取裝置21係用於搬運晶圓3；複數個破片排除裝置25，係包含有一輸送帶251、一驅動機構252、一連接於輸送帶251下方之汽缸253，其中該汽缸253能透過該驅動機構252改變該輸送帶251之位置狀態；複數組晶圓輸送裝置22，係包含有一輸送帶221及一驅動機構222，其中該晶圓輸送裝置22之輸送帶221係與該破片排除裝置25之輸送帶251一端相連接，故該驅動機構222能夠驅動該輸送帶221，以使該晶圓3能夠於該輸送帶221上被搬運；複數個破片檢測器23，係設置於該輸送帶兩側下方，因此該破片檢測器23所設置之位置係能夠位於該晶圓輸送裝置22之輸送帶221兩側下方或是該破片排除裝置25之輸送帶251兩側下方；本實施中將破片檢測器23設置於該晶圓輸送裝置22之輸送帶221兩側下方；一組晶圓移轉裝置24，係設置於該破片排除裝置25之輸送帶251另一端，而該晶圓移轉裝置24係包含至少一個晶圓汲取器241、至少一組橫向移動軌道242、至少一組縱向移動軌道243及複數組輸出軌道244，其中該晶圓汲取器241能夠被搬運於該橫向移動軌道242及該縱向移動軌道243上；因此，當汲取裝置21將一晶圓3搬運於該晶圓輸送裝置22之輸送帶221上時，該晶圓輸送裝置22之驅動機構222係能夠驅動該輸送帶221移動，以將該晶圓3於該輸送帶221上被搬運移動，同時當該晶圓3移動至該破片檢測器23之區域時，該破片檢測器23係會判斷該晶圓3是否有破裂的情況發生，而當有破裂之晶圓3通過該破片排除裝置25時(如圖六A及圖六B所示)，該破片排除裝置25之汽缸253係能透過該驅動機構252向內收縮，並導致與該汽缸253連接之輸送帶251呈現下擺狀態，因此該輸送帶251所搬運之晶圓3會直接被排除；若該破片檢測器23判斷該晶圓3是正常時，該晶圓3能夠正常通過該破片排除裝置25，並再由該晶圓移轉裝置24之晶圓汲取器241汲取該晶圓3，而該晶圓汲取器241係能夠透過該橫向移動軌道242及縱向移動軌道243來進行橫向或是縱向移動，並再將該晶圓轉移分配於該複數組輸出軌道244上，以進行後續之製程處理。Please refer to FIG. 2 , FIG. 3 , FIG. 4 , FIG. 5 , FIG. 6A and FIG. 6B , which are schematic diagrams of fragment detection of a wafer conveying device with fragment detection, a side view of fragment detection, and a schematic diagram of a second implementation structure. And the fragment excluding the embodiment diagram, and the wafer transport apparatus is used for detecting the wafer 3 outputted from the wafer carrier device 1. As can be seen from the figure, the wafer transport apparatus with fragment detection includes: a set of pick-up devices 21, moving between the wafer carrier device 1 and the position of the wafer transfer device, the picking device 21 is for carrying the wafer 3; the plurality of chip removing devices 25, comprising a conveyor belt 251, a driving mechanism 252 A cylinder 253 is disposed below the conveyor belt 251. The cylinder 253 can change the position of the conveyor belt 251 through the driving mechanism 252. The multi-array wafer transport device 22 includes a conveyor belt 221 and a driving mechanism 222. The conveyor belt 221 of the wafer transport device 22 is connected to one end of the conveyor belt 251 of the fragment removing device 25, so the driving mechanism 222 can drive the conveyor belt 221 to enable the wafer 3 to The conveyor belt 221 is transported; a plurality of fragment detectors 23 are disposed on both sides of the conveyor belt, so that the position of the fragment detector 23 can be located on both sides of the conveyor belt 221 of the wafer conveyance device 22. The lower part is below the two sides of the conveyor belt 251 of the fragment removing device 25; in the present embodiment, the fragment detector 23 is disposed below both sides of the conveyor belt 221 of the wafer conveying device 22; a set of wafer transfer devices 24 are The wafer transfer device 24 is disposed at the other end of the transport belt 251 of the fragment removing device 25, and the wafer transfer device 24 includes at least one wafer picker 241, at least one set of lateral moving tracks 242, at least one set of longitudinal moving tracks 243, and a complex array. An output track 244, wherein the wafer picker 241 can be carried on the lateral moving track 242 and the longitudinal moving track 243; therefore, when the picking device 21 transports a wafer 3 to the conveyor of the wafer transfer device 22 At 221, the driving mechanism 222 of the wafer transfer device 22 can drive the conveyor belt 221 to move to move the wafer 3 on the conveyor belt 221 while the wafer 3 moves to the fragment detection. 23 In the region, the fragment detector 23 determines whether the wafer 3 is broken or not, and when the broken wafer 3 passes through the fragment removing device 25 (as shown in FIG. 6A and FIG. 6B), The cylinder 253 of the fragment removing device 25 can be inwardly contracted through the driving mechanism 252, and the conveying belt 251 connected to the cylinder 253 is in a sway state, so that the wafer 3 carried by the conveyor belt 251 is directly eliminated; If the fragment detector 23 determines that the wafer 3 is normal, the wafer 3 can pass through the fragment removal device 25 normally, and the wafer 3 is captured by the wafer picker 241 of the wafer transfer device 24, The wafer picker 241 can be moved laterally or vertically by the lateral movement track 242 and the longitudinal movement track 243, and the wafer is transferred and distributed to the complex array output track 244 for subsequent processing. deal with.
值得一提的是，該破片排除裝置25之輸送帶251上係設置至少一個感測器254，用以驅動該汽缸253進行伸縮改變該輸送帶251為水平狀態或是下擺狀態。It is worth mentioning that at least one sensor 254 is disposed on the conveyor belt 251 of the fragment removing device 25 for driving the cylinder 253 to expand and contract to change the conveyor belt 251 to a horizontal state or a hem state.
值得一提的是，如圖三所示，該破片檢測器23上係具有至少一個光接受端231及至少一個光發射端232，該光發射端232係用以照射該晶圓3表面，並反射回該光接受端231接收，以判斷晶圓3是否有破裂的情況發生。It is to be noted that, as shown in FIG. 3, the fragment detector 23 has at least one light receiving end 231 and at least one light emitting end 232 for illuminating the surface of the wafer 3, and The reflection is received back to the light receiving end 231 to determine whether or not the wafer 3 is broken.
值得一提的是，該晶圓承載裝置1係為晶圓片匣、晶圓片盒等等能夠承載晶圓之容器。It is worth mentioning that the wafer carrier device 1 is a wafer cassette, a wafer cassette, or the like that can carry a wafer.
值得一提的是，該破片排除裝置25之輸送帶251下方係能夠添加設置一廢料容器(圖中未示)，用以容置晶圓表面具有破裂之晶圓片。It is to be noted that a waste container (not shown) can be disposed under the conveyor belt 251 of the fragment removing device 25 for accommodating the wafer having a crack on the surface of the wafer.
本發明所提供之一種具有破片檢測之晶圓輸送設備，與其他習用技術相互比較時，更具備下列優點：The wafer conveying device with fragment detection provided by the invention has the following advantages when compared with other conventional technologies:
1. 本發明能夠於不同承載裝置之間進行破片檢測，因此能夠於承載裝置輸入、輸出之搬運過程進行破片檢測，以排除有破裂情況之晶圓。1. According to the present invention, fragment detection can be performed between different carrier devices, so that fragment detection can be performed during the loading and unloading process of the carrier device to eliminate the wafer with cracking.
2. 本發明能夠將能夠有效地避免多餘的製程與製程後之檢測項目，以節省更多的製造成本與人力成本。2. The invention can effectively avoid redundant process and post-process inspection items, thereby saving more manufacturing cost and labor cost.
藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地，其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.
1．．．晶圓承載裝置1. . . Wafer carrier
21．．．汲取裝置twenty one. . . Pickup device
22．．．晶圓輸送裝置twenty two. . . Wafer transfer device
221．．．輸送帶221. . . conveyor
222．．．驅動機構222. . . Drive mechanism
23．．．破片檢測器twenty three. . . Fragment detector
231．．．光接受端231. . . Light receiving end
232．．．光發射端232. . . Light emitting end
24．．．晶圓移轉裝置twenty four. . . Wafer transfer device
241．．．晶圓汲取器241. . . Wafer picker
242．．．橫向移動軌道242. . . Horizontally moving track
243．．．縱向移動軌道243. . . Longitudinal moving track
244．．．輸出軌道244. . . Output track
25．．．破片排除裝置25. . . Fragment elimination device
251．．．輸送帶251. . . conveyor
252．．．驅動機構252. . . Drive mechanism
253．．．汽缸253. . . cylinder
254．．．感測器254. . . Sensor
3．．．晶圓3. . . Wafer
圖一為本發明一種具有破片檢測之晶圓輸送設備之第一實施架構示意圖；1 is a schematic diagram of a first implementation architecture of a wafer transfer apparatus with fragment detection according to the present invention;
圖二為本發明一種具有破片檢測之晶圓輸送設備之破片檢測立體示意圖；2 is a schematic perspective view of a fragment detection of a wafer conveyance device with fragment detection according to the present invention;
圖三為本發明一種具有破片檢測之晶圓輸送設備之破片檢測側視圖；3 is a side view of a fragment detection of a wafer conveyance device with fragment detection according to the present invention;
圖四為本發明一種具有破片檢測之晶圓輸送設備之第二實施架構示意圖及；4 is a schematic view showing a second implementation structure of a wafer transfer apparatus with fragment detection according to the present invention;
圖五為本發明一種具有破片檢測之晶圓輸送設備之破片排除立體示意圖；FIG. 5 is a perspective view showing the fragmentation of a wafer conveying apparatus with fragment detection according to the present invention; FIG.
圖六A為本發明一種具有破片檢測之晶圓輸送設備之破片排除實施例圖；以及6A is a diagram showing a fragment removal embodiment of a wafer transfer apparatus having fragment detection according to the present invention;
圖六B為本發明一種具有破片檢測之晶圓輸送設備之破片排除實施例圖。FIG. 6B is a diagram showing a fragment elimination embodiment of a wafer transfer apparatus with fragment detection according to the present invention.
1．．．晶圓承載裝置1. . . Wafer carrier
22．．．晶圓輸送裝置twenty two. . . Wafer transfer device
24．．．晶圓移轉裝置twenty four. . . Wafer transfer device
241．．．晶圓汲取器241. . . Wafer picker
242．．．橫向移動軌道242. . . Horizontally moving track
243．．．縱向移動軌道243. . . Longitudinal moving track
244．．．輸出軌道244. . . Output track
Claims (8)
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