CN110223944B - Wafer cleaning machine and wafer cleaning method thereof - Google Patents
Wafer cleaning machine and wafer cleaning method thereof Download PDFInfo
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- CN110223944B CN110223944B CN201910511094.1A CN201910511094A CN110223944B CN 110223944 B CN110223944 B CN 110223944B CN 201910511094 A CN201910511094 A CN 201910511094A CN 110223944 B CN110223944 B CN 110223944B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a wafer cleaning machine and a wafer cleaning method thereof, wherein the wafer cleaning machine comprises: at least two solution tanks for respectively containing solutions; the detection device is arranged between two adjacent solution tanks and is used for carrying out fragment detection on the wafer which is taken out from one solution tank and sent to the other solution tank; the transportation device comprises a mechanical arm, and is used for putting the wafer into the solution tank or taking the wafer out of the solution tank and transporting the wafer into another solution tank. The wafer cleaning machine can timely find the problem of wafer fragments in the process of cleaning wafers, and reduces the influence on other wafers and machines.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer cleaning machine and a wafer cleaning method thereof.
Background
Wafer cleaning is one of the commonly used processes in semiconductor integrated circuit fabrication processes.
For example, after the dry etching process is finished, the wafer needs to be cleaned, and the photoresist, the mask layer, and the etching by-products on the surface of the wafer are removed. Wafer cleaning mainly uses chemical solutions, such as HF, SPM, BOE, etc.
The existing wafer cleaning machine comprises a plurality of solution tanks and a wafer conveying device, wherein wafers sequentially pass through the solution tanks filled with chemical liquid, are cleaned by adopting different cleaning liquids in sequence, and are finally dried.
The wafer state is not detected in the whole wafer cleaning process flow. If a wafer is broken in the cleaning process, the problem of breakage cannot be timely found and detected. The broken wafer may cause contamination of the chemical solution in the solution tank, such as metal or organic contaminants; wafers subsequently entering the solution tank are contaminated, resulting in a reduction in wafer yield. If the wafer is broken obviously, the wafer is found in the process of carrying out position detection (Mapping) on the wafer loading box before the subsequent drying leaves the machine, so that the machine stops working, and under the condition, the affected proportion of the subsequent wafer is relatively low; when the wafer is damaged slightly, the position detection (Mapping) cannot detect that the wafer is broken, so that the wafer passing through the solution tank with the broken wafer is polluted, and the polluted wafer enters other machines to be subjected to semiconductor processing, so that other machines are polluted, and huge loss is caused.
Therefore, how to find out the wafer breakage problem in time in the process of cleaning the wafer is a problem to be solved urgently at present.
Disclosure of Invention
The invention aims to solve the technical problem of providing a wafer cleaning machine and a cleaning method thereof, which can timely find the problem of wafer breakage in the cleaning process.
The invention provides a wafer cleaning machine, comprising: a wafer cleaning machine, comprising: at least two solution tanks for respectively containing solutions; the detection device is arranged between two adjacent solution tanks and is used for carrying out fragment detection on the wafer which is taken out from one solution tank and sent to the other solution tank; the transportation device comprises a mechanical arm, and is used for putting the wafer into the solution tank or taking the wafer out of the solution tank and transporting the wafer into another solution tank.
Optionally, the detection device includes at least one image sensor, and is configured to detect a wafer morphology when the wafer moves above the detection device.
Optionally, the detecting device is configured to detect at least a partial edge profile of the wafer.
Optionally, the method further includes: the wafer cleaning device comprises a bracket and is characterized in that the bracket is used for placing a plurality of wafers to be cleaned, the wafers to be cleaned are arranged in parallel and are perpendicular to the bottom of the bracket, and the bottom of the bracket is hollow.
Optionally, the robot arm clamps the edge of the bracket during wafer transportation, so that the wafer is always vertical to the horizontal plane.
Optionally, the detection device further includes a slide rail, and the image sensor can move along the slide rail to ensure that each wafer can be detected.
Optionally, the slide rail extends along a direction perpendicular to the surface of the wafer.
Optionally, the method further includes: and the alarm device is connected with the detection device and used for giving an alarm and stopping the machine when the detection device detects that the wafer is broken.
In order to solve the above problem, the technical solution of the present invention further provides a wafer cleaning method, including: putting the wafer into a first solution tank containing a solution for cleaning; after the cleaning in the first solution tank is finished, taking out the wafer; carrying out fragment detection on the wafer on a path for conveying the wafer to a second solution tank; and if the wafer is not broken, moving the wafer into a second solution tank containing the solution for cleaning.
Optionally, the wafer edge profile is detected by at least one image sensor.
Optionally, at least a portion of the edge profile of the wafer is detected.
Optionally, a plurality of wafers to be cleaned are placed on the bracket and are placed in the first solution tank, the plurality of wafers to be cleaned are arranged in parallel and are perpendicular to the bottom of the bracket, and the bottom of the bracket is hollow.
Optionally, during the transportation of the wafer, the edge of the bracket is clamped so that the wafer is always perpendicular to the horizontal plane.
Optionally, during the inspection process, the image sensor is moved along the wafer surface direction to ensure that each wafer can be inspected.
Optionally, when the wafer is detected to be broken, an alarm is given and the machine is stopped.
According to the wafer cleaning machine platform, the detection device is arranged between the adjacent solution tanks, so that the wafer can be subjected to fragment detection before being taken out from one solution tank to enter the other solution tank, and the influence of the wafer fragments on the wafer and other machine platforms through which the wafer needs to pass subsequently is reduced.
Drawings
FIG. 1 is a schematic view of a wafer cleaning apparatus according to an embodiment of the present invention;
fig. 2 is a flowchart illustrating a wafer cleaning method according to an embodiment of the invention.
Detailed Description
The following describes in detail a wafer cleaning machine and a wafer cleaning method thereof according to embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a wafer cleaning apparatus according to an embodiment of the invention.
The wafer cleaning machine comprises more than two solution tanks, and in the embodiment, five solution tanks are taken as examples, namely solution tanks 101-105. In other embodiments, the wafer cleaning machine may further include other number of solution tanks according to different cleaning processes.
In this embodiment, the solution tanks for holding chemical solutions are spaced apart, and the solution tank for holding deionized water is disposed between the two solution tanks for holding chemical solutions. Specifically, the solution tank 101 contains a chemical solution HF, the solution tank 102 contains deionized water, the solution tank 103 contains a chemical solution SPM, and the solution tank 104 contains deionized water. The solution tank 105 is used for drying the cleaned wafer and contains isopropyl alcohol.
During the cleaning process, the wafers sequentially enter each solution tank along the arrow direction, and finally enter the solution tank 105 for drying.
The wafer cleaning machine station further comprises a transportation device 200 which comprises a mechanical arm 201 and a moving mechanism 202, wherein the transportation device is used for putting the wafer 203 into a solution tank or taking the wafer 203 out of the solution tank and transporting the wafer into another solution tank. The moving mechanism 202 of the transport apparatus 200 may move horizontally or vertically along the arrangement direction of the solution tanks, and the robot arm 201 of the transport apparatus 200 may also perform operations such as turning the wafer, for example, from being perpendicular to the horizontal plane to being parallel to the horizontal plane.
The wafer cleaning station may include a plurality of transport devices 200 that may simultaneously transfer wafers between the plurality of solution tanks. The wafer cleaning apparatus further includes a wafer loading port for placing a wafer cassette containing a wafer to be cleaned and a wafer unloading port (not shown) for placing an empty wafer cassette. The wafer is picked up from the wafer loading port by the transportation device 200 and then transferred to the solution tank.
The wafer cleaning machine table further comprises a bracket for placing a wafer to be cleaned. The wafers to be cleaned are arranged in parallel and are perpendicular to the bottom of the bracket, the bottom of the bracket is hollow, so that the bottoms of the wafers are exposed, and the cleaning solution is in full contact with the wafers in the cleaning process. Each tray may hold multiple wafers simultaneously, and in one embodiment, the tray may hold 25 wafers simultaneously.
The transportation device 200 picks the wafer from the wafer loading port and places the wafer into the tray, and then holds the entire tray and places the wafer into the first solution tank 101. In order to avoid the contact between the transportation device 200 and the solution in the solution tank 101, a lifting device may be further disposed in the solution tank 101, the transportation device 200 places the carrier on top of the lifting device, and the carrier is lowered by the lifting device, so that the wafer is immersed in the chemical solution for cleaning. Similarly, when the wafer is taken out, the bracket can be lifted by the lifting device, the edge of the bracket is clamped by the transportation device 200, the wafer is moved to the upper part of the other solution tank, and the wafer 203 is kept to be vertical to the horizontal plane all the time in the whole process.
In other embodiments, a tray may be placed in each solution tank, and only the wafer may be transferred from the tray in one solution tank to the tray in another solution tank during the wafer transfer process. The transportation device 200 may have a plurality of robots capable of transferring a plurality of wafers at the same time to improve the wafer transportation efficiency.
The wafer cleaning machine also comprises a detection device 300, wherein the detection device 300 is arranged between two adjacent solution tanks and is used for carrying out fragment detection on a wafer which is taken out from one solution tank and sent to the other solution tank. The chipping includes various defects such as chipping, corner chipping, and breakage of the wafer.
The detection device comprises at least one image sensor 301 for detecting the wafer morphology when the wafer moves above the detection device 300. The image sensor 301 may be an optical image sensor, an ultrasonic image sensor, or other sensor that can inspect the topography of the wafer. In this embodiment, the detection device includes two image sensors 301. In other embodiments, a reasonable number of image sensors 301 may be provided according to the viewing angle and the mounting position of the image sensor 301.
When the transportation device 200 transports the wafer 203, the bottom edge of the wafer 203 faces the detection device 300, so that the detection device 300 can detect at least part of the edge profile of the wafer 203. Since the damaged portion of the wafer is generally located at the edge of the wafer during the cleaning process, when the wafer is taken out from the solution tank 101, the machine worker can directly observe whether the damaged portion of the edge of the wafer is damaged, and the edge of the lower portion of the wafer is detected by the detecting device 300.
In this embodiment, the two pattern sensors 301 are respectively disposed close to the sidewalls of the two adjacent solution tanks, so that the detection range of the detection apparatus 300 can cover more wafer edges.
In other specific embodiments, the detection device 300 may further include a slide rail, along which the image sensor 301 can move to increase the detection range of the detection device 300.
In one embodiment, the inspection apparatus 300 may include a slide rail extending in a direction perpendicular to the surface of the wafer 203. When the transportation device 200 holds the wafer carrier while moving a plurality of wafers 203 disposed in parallel and perpendicular to the horizontal plane, if the number of the wafers 203 is large, the wafers 203 at the edge positions may be at the edge of the detection range of the detection device 300 or beyond the detection range of the detection device 300. The position of the pattern sensor 301 may be moved during the detection process, so that the pattern sensor 301 can scan the wafer 203 piece by piece, thereby improving the detection accuracy.
In other embodiments, the detecting device 300 may include a slide rail disposed perpendicular to the horizontal plane, and the height position of the image sensor 301 is adjusted in the vertical direction to obtain a better detecting effect.
When the wafer 203 is taken out from the solution tank 101 and passes over the inspection device 300 between the solution tanks 101 and 102, a short stop may be performed, for example, 1s to 2s, so that the inspection device 300 can perform the fragment inspection on the wafer 203. After the wafer 203 enters the solution tank 102 for cleaning, the wafer is also subjected to fragment detection by the detection device 300 before entering the solution tank 103, and so on. Each time the wafer 203 is taken out from the solution tank, the wafer breakage detection is carried out, so that the wafer breakage problem can be found in time in the wafer cleaning process, the alarm and the machine halt can be carried out in time, and the pollution caused by the fact that the follow-up wafer enters the solution tank with the broken wafer is avoided.
The wafer cleaning machine station can further comprise an alarm device, the alarm device is connected to each detection device 300, when any detection device 300 detects wafer fragments, the alarm device timely sends out an alarm, and the machine station stops running. Furthermore, the alarm device can also position the solution tank in which the fragment occurs according to the position of the detection device 300 in which the fragment is found, so that the liquid in the solution tank can be conveniently replaced, and the pollution can be removed, thereby facilitating the subsequent cleaning process.
According to the wafer cleaning machine platform, the detection device is arranged between the adjacent solution tanks, so that the wafer can be subjected to fragment detection before being taken out from one solution tank to enter the other solution tank, and the influence of wafer fragments on the machine platform and other wafers is reduced.
The embodiment of the invention also provides a wafer cleaning method, wherein the wafer is generally cleaned by a plurality of solutions in the cleaning process, so that the wafer is required to be transferred in different solution tanks.
Referring to fig. 2, a wafer cleaning method according to an embodiment of the invention includes steps S1-S4.
The solution tank may contain a chemical solution or deionized water for cleaning the wafer. In this embodiment, the wafer cleaning machine for wafer cleaning includes solution tanks 101-105 (refer to FIG. 1). The wafer is used.
The wafer cleaning method will be described with reference to the machine shown in FIG. 1.
Step S1: the wafer 203 is placed in a solution tank 101 containing a solution to be cleaned.
The wafer 203 may be transported by a transport apparatus 200, which transport apparatus 200 may include a robot arm 201 and a moving mechanism 202. The moving mechanism 202 of the transport apparatus 200 may move horizontally or vertically along the arrangement direction of the solution tanks, and the robot arm 201 of the transport apparatus 200 may turn the wafer 203, for example, from vertical to horizontal to parallel to horizontal.
The wafer may be picked from the wafer load port of the tool and transferred into the solution tank 101. The wafer cannot be placed directly in the solution tank 101 and needs to be held in place by a bracket. The transportation device 200 may place the wafer grabbed in the wafer cassette into the tray from the wafer loading port, and then clamp the entire tray to place the wafer into the first solution tank 101.
It is also possible to place a carrier in each solution tank and only transfer the wafer from the carrier in one solution tank to the carrier in the other solution tank during the movement of the wafer. The transportation device 200 may have a plurality of robots capable of transferring a plurality of wafers at the same time to improve the wafer transportation efficiency.
Step S2: after the cleaning in the solution tank 101 is completed, the wafer 203 is taken out.
When taking out the wafer, the edge of the carrier is held by the transportation device 200, and the carrier-connected wafer 203 is taken out from the solution tank 101.
Step S3: on the path of transporting the wafer 203 to the solution tank 102, the wafer 203 is subjected to a breakage detection.
In this embodiment, the wafer 203 is transported to the solution tank 102 through a position above the position between the solution tanks 101 and 102. The wafer 203 may be stopped for a short time at the position, for example, 1s to 2s, so as to perform the fragment detection on the wafer 203 without changing the transportation track of the wafer 203.
The wafer 203 may be subjected to a chipping inspection by the inspection apparatus 300 disposed between the adjacent solution tanks. Specifically, the detection apparatus 300 may include an image sensor 301, and the edge profile of the wafer 203 is detected by the image sensor 301. When the wafer is taken out from the solution tank 101, the machine worker can directly observe whether the upper edge of the wafer 203 is damaged, and the lower edge of the wafer 203 is detected by the detection device 300.
During the detection process, the position of the image sensor 301 may also be moved to cover a larger detection range, so as to ensure that each wafer can be detected. For example, the position of the pattern sensor 301 may be moved in a direction to track the wafer surface during the detection process, so that the pattern sensor 301 can scan the wafer 203 piece by piece, thereby improving the detection accuracy. Alternatively, the height position of the image sensor 301 may be adjusted in the vertical direction to obtain a better detection effect.
Step S4: if the wafer 203 is not broken, the wafer 203 is moved into the solution tank 102 containing the solution for cleaning.
After the cleaning is completed, the wafer 203 is moved to the subsequent solution tank 103 for cleaning. On the way that the wafer is taken out from the solution tank 102 and moved to the solution tank 103, the wafer 203 is continuously subjected to the chipping detection. By analogy, the wafer 203 is taken out from the solution tank every time, fragment detection is carried out, so that the problem of wafer fragment can be found in time in the wafer cleaning process, the machine can be alarmed and suspended in time, and the phenomenon that the follow-up wafer enters the solution tank with the fragment to be polluted is avoided.
If the wafer 203 enters the solution tank 102, when the wafer or wafers taken out from the solution tank 101 are detected to be broken, an alarm can be sent out in time through the alarm device, and the machine station stops running. Furthermore, the solution tank with the fragments can be positioned according to the positions where the fragments are detected, so that the liquid in the solution tank can be conveniently replaced, the pollution can be removed, and the subsequent cleaning process can be conveniently carried out.
According to the wafer cleaning method, the wafer is subjected to fragment detection before the wafer is taken out of one solution tank and enters the other solution tank, so that fragments can be found in time and corresponding measures can be taken, and the influence of the wafer fragments on a machine table and other wafers is reduced.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (11)
1. A wafer cleaning machine, comprising:
at least two solution tanks for respectively containing solutions;
the detection device is arranged between two adjacent solution tanks and used for carrying out fragment detection on the wafer which is taken out from one solution tank and sent to the other solution tank, and comprises at least two image sensors which are respectively close to the side walls of the two adjacent solution tanks;
the conveying device comprises a mechanical arm and is used for putting the wafer into the solution tank or taking the wafer out of the solution tank and conveying the wafer into another solution tank, when the conveying device conveys the wafer, the bottom edge of the wafer faces the detection device, and the image sensor is used for detecting the edge morphology of the lower part of the wafer piece by piece when the wafer moves to the position above the detection device.
2. The wafer cleaning station of claim 1, further comprising: the wafer cleaning device comprises a bracket and is characterized in that the bracket is used for placing a plurality of wafers to be cleaned, the wafers to be cleaned are arranged in parallel and are perpendicular to the bottom of the bracket, and the bottom of the bracket is hollow.
3. The wafer cleaning machine as claimed in claim 2, wherein the robot holds the edge of the bracket during the transportation of the wafer so that the wafer is always vertical to the horizontal plane.
4. The wafer cleaning machine station as claimed in claim 3, wherein the detection device further comprises a slide rail, and the image sensor can move along the slide rail to ensure that each wafer can be detected.
5. The wafer cleaning machine as claimed in claim 4, wherein the slide rail extends along a direction perpendicular to the surface of the wafer.
6. The wafer cleaning station of claim 1, further comprising: and the alarm device is connected with the detection device and used for giving an alarm and stopping the machine when the detection device detects that the wafer is broken.
7. A method of cleaning a wafer, comprising:
putting the wafer into a first solution tank containing a solution for cleaning;
after the cleaning in the first solution tank is finished, taking out the wafer;
carrying out fragment detection on a wafer on a path for conveying the wafer to a second solution tank, wherein the fragment detection is carried out through a detection device arranged between a first solution tank and the second solution tank, the detection device comprises at least two image sensors, the at least two image sensors are respectively close to the side walls of the two adjacent solution tanks, the bottom edge of the wafer faces the detection device when the transportation device conveys the wafer, and the image sensors are used for detecting the edge morphology of the lower part of the wafer piece by piece when the wafer moves above the detection device;
and if the wafer is not broken, moving the wafer into a second solution tank containing the solution for cleaning.
8. The method as claimed in claim 7, wherein a plurality of wafers to be cleaned are placed on a bracket and are placed in the first solution tank, the plurality of wafers to be cleaned are arranged in parallel and are placed perpendicular to the bottom of the bracket, and the bottom of the bracket is hollowed out.
9. The wafer cleaning method of claim 8, wherein during the wafer transportation, the edge of the bracket is clamped so that the wafer is always vertical to the horizontal plane.
10. The wafer cleaning method as claimed in claim 9, wherein the image sensor is moved along the wafer surface during the inspection process to ensure that each wafer can be inspected.
11. The method as claimed in claim 9, wherein when the wafer is broken, an alarm is issued and the machine is stopped.
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| CN201910511094.1A CN110223944B (en) | 2019-06-13 | 2019-06-13 | Wafer cleaning machine and wafer cleaning method thereof |
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| CN110223944B true CN110223944B (en) | 2021-08-31 |
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| CN111785662B (en) * | 2020-07-08 | 2022-09-20 | 华虹半导体(无锡)有限公司 | Wafer detection system and method applied to groove type cleaning machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11176912A (en) * | 1997-12-08 | 1999-07-02 | Mitsubishi Electric Corp | Semiconductor substrate processor and its control |
| US6139591A (en) * | 1998-03-04 | 2000-10-31 | Tokyo Seimitsu Co., Ltd. | Wafer separating and cleaning apparatus and process |
| CN205282449U (en) * | 2016-01-14 | 2016-06-01 | 常州天合光能有限公司 | A lamination detection device for rinse board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100640599B1 (en) * | 2004-11-26 | 2006-11-01 | 삼성전자주식회사 | Apparatus and method for wet treatment of wafer |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11176912A (en) * | 1997-12-08 | 1999-07-02 | Mitsubishi Electric Corp | Semiconductor substrate processor and its control |
| US6139591A (en) * | 1998-03-04 | 2000-10-31 | Tokyo Seimitsu Co., Ltd. | Wafer separating and cleaning apparatus and process |
| CN205282449U (en) * | 2016-01-14 | 2016-06-01 | 常州天合光能有限公司 | A lamination detection device for rinse board |
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