201248754 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種具有破片檢測之晶圓輸送設備，尤其是一種用於晶 圓承載裝置間之晶圓輸送設備，而該晶圓輸送設備更能夠將其搬運之晶圓 進行破片檢測以及破片排除。 【先前技術】 太陽能電池目前主要材質主要為>5夕以及如神化鎵（GaAs )、蹄化録 (CdTe)、鍺…等元素或化合物，以提高將太陽能轉為電能或熱能的轉換效 率。基於不同的應用考量會採用不同的元素或化合物，例如：民生消費性 產品通常是利用非晶矽太陽能電池板；太空中使用的是砷化鎵太陽電池； 若是用在沙漠、海洋等以發電為目的等大型電賴使舒晶⑪太陽電池。 此外，應用於民生消費性產品的太陽能電池板，也會因為不同的電子 產品，而輸出不同大小的電壓。同時，也會測量太陽能電池板的電性功能、 基板正背面的缺陷、瑕疵、破片程度等。 在形成太陽能電池前一般稱之為太陽能晶圓，太陽能晶圓片會進行相 關測試與分類，無論是機台間之搬移或因出貨需求，都會將太陽能晶圓疊 層置放’而目前常見的晶圓承載裝置主要有兩種不同設計，—種為晶圓片 E (cassette) ’具有卿、底部及左右側壁並且在兩搬上形成有複數凸 緣’而晶酬從上述頂部、底部及左右触所共同圍繞出的側向出入口進 出而另種BB圓承載裝置為晶圓片盒（邮㈣加），是一種上方形成有— 個頂端汲放口的承載裝置。 由於兩種晶圓承載裝置所移載晶圓之方式有很大差異，屬於兩種不同 201248754 承載裝置，因此在實際㈣者的設廠過程中，往往會取其所需而自行组合 運用’而峨㈣自酬版轉議也树出現的，但 因晶圓在運送的過程中’很議為碰撞而產生輕微之結構贼，即使以 肉眼檢視也無法輕易發現問題之所在，但待完成所有製造處理流程時，將 會因晶圓表面破⑽情況，而導致實際電路受到不定程度受損的影響； 因此，若是_於自統檢測過程巾或是抑承魏置之間設置特定 需求之破片檢測’並分階段性排除表面有破裂情況之晶圓，如此將能夠有 效地避免多餘的製程與製程後之檢測項目，以節省更多的製造成本與人力 成本’應為一最佳解決方案。 【發明内容】 本發明之目的即在於提供—種具有破片檢測之晶輯送設備，係能夠 於承載裝置輸人、輸丨之搬運過程巾進行破#檢測，以排除有破裂情況之 晶圓。 可達成上述發明目的之一種具有破片檢測之晶圓輸送設備，係用於檢 t 測自晶圓承載裝置輸出之晶圓，而該晶圓輸送設備係包括了__組用於搬運 晶圓之没取裝置、至少—組用於運送晶圓之晶uj輸送裝置、複數個破片檢 測器及一組晶圓移轉裝置’其中該破片檢測器係設置於輸送帶兩側下方， 用以能夠檢測被搬運於該輸送帶上之晶圓，並判斷晶圓是否有破裂的情況 發生’而後再經由該晶圓移轉裝置之晶圓汲取器汲取該晶圓輸送裝置上檢 測後之晶圓，並藉由進行橫向或是縱向移動，以將該晶圓轉移分配於該晶 圓移轉裝置之複數組輸出轨道上。 201248754 更具體的說，所述沒取裝置係移動於該晶圓承載裝置及晶圓輸送設備 位置之間。 更具體的說，所述晶圓輸送裝置係包含有一輸送帶及一驅動機構，而 該晶圓移轉裝置係設置於該晶圓輸送裝置之輸送帶另一端，另外該晶圓移 轉裝置係包含至少一個晶圓汲取器、至少一組橫向移動轨道、至少一組縱 向移動轨道及複數組輸出轨道，其中該晶圓汲取器能夠被搬運於該橫向移 動軌道及該縱向移動執道上。 更具體的說，該晶圓輸送設備係能夠添加設置複數個與該晶圓輸送裝 置相連接之破片排除裝置，而該破片排除裝置係包含有一輸送帶、一驅動 機構、一連接於輸送帶下方之汽缸，其中該汽缸能透過該驅動機構改變該 輸送帶之位置狀態，另外’該晶圓輸送裝置之輸送帶一端係能夠與該破片 排除裝置之輸送帶相連接，故該驅動機構㈣驅減輸送帶，以使該晶圓 能夠於該輸送帶上被搬運。 更具體的說，所述破片排除裝置之輸送帶上係設置至少一個感測器， 用以驅動該汽缸進行伸縮改變該輸送帶為水平狀態或是下擺狀態。 更具體的說，所述破片檢測器上係具有至少一個光接受端及至少一個 光發射端’該光發射端_以照射該晶圓表面，並反射回該紐受端接收， 以判斷晶圓是否有破裂的情況發生。 更具體的說’所述晶圓承裁裝置係為晶圓片g、晶圓片盒等等能夠承 載晶圓之容器。 更具體的說，所述破片排除裝置之輸送帶下方係能夠添加設置一廢料 容器，用以容置晶圓表面具有破裂之晶圓片。 201248754 【實施方式】 有關於本發明之前述及其他技術内容、特點與功效，在以下配合參考 圖式之較佳實施例的詳細說明中，將可清楚的呈現。 請參閱圖一、圖二及圖三，為本發明一種具有破片檢測之晶圓輸送設 備之第一實施架構示意圖、破片檢測立體示意圖及破片檢測側視圖，而該 晶圓輸送設備係用於檢測自晶圓承載裝置！輸出之晶圓3，由圖中可知該 具有破片檢測之晶圓輸送設備係包含： 一組汲取裝置21，係移動於該晶圓承載裝置丨及晶圓輸送設備位置之 間，該汲取裝置21係用於搬運晶圓3 ; 至少一組晶圓輸送裝置22，係包含有一輸送帶221及一驅動機構222， 該驅動機構222能夠驅動該輸送帶221，以使該晶圓3能夠於該輸送帶221 上被搬運； 複數個破片檢測器23 ’係設置於該輸送帶221兩側下方，用以檢測被 搬運於該輸送帶221上之晶圓3，並判斷晶圓3是否有破裂的情況發生； 一組晶圓移轉裝置24 ’係設置於該輸送帶221另一端，該晶圓移轉裝 置24係包含至少一個晶圓汲取器241、至少一組橫向移動軌道242、至少 一組縱向移動轨道243及複數組輸出軌道244,其中該晶圓汲取器241能夠 移動於該橫向移動軌道242及該縱向移動執道243上； 因此，當汲取裝置21將一晶圓3搬運於該晶圓輸送裝置22之輸送帶 221上時，該晶圓輸送裝置22之驅動機構222係能夠驅動該輸送帶221移 動，以將該晶圓3於遠輸送帶221上被搬運移動，同時當該晶圓3移動至 該破片檢測器23之區域時’該破片檢測器23會判斷該晶圓3是否有破裂 6 201248754 的情況發生；最後，該晶圓移轉裝置24之晶圓汲取器241係會汲取該晶圓 輸送裝置22上之晶圓3，而該晶圓汲取器241係能夠透過該橫向移動執道 242及縱向移動執道243來進行橫向或是縱向移動，並再將該晶圓轉移分配 於該複數組輸出軌道244上，以進行後續之製程處理。 值得一提的是，如圖三所示，該破片檢測器23上係具有至少一個光接 受端231及至少一個光發射端232,該光發射端232係用以照射該晶圓3表 面，並反射回該光接受端231接收，以判斷晶圓3是否有破裂的情況發生。 值得一提的是，該晶圓承載裝置1係為晶圓片匣、晶圓片盒等等能夠 承載晶圓之容器。 請參閱圖二、圖三、圖四、圖五、圖六A及圖六B,為本發明一種具 有破片檢測之晶圓輸送設備之破片檢測立體示意圖、破片檢測側視圖、第 二實施架構示意圖及破片排除實施例圖，而該晶圓輸送設備係用於檢測自 晶圓承載裝置1輸出之晶圓3，由圖中可知，該具有破片檢測之晶圓輸送設 備係包含： 一組汲取裝置21，係移動於該晶圓承載裝置1及晶圓輸送設備位置之 間，該汲取裝置21係用於搬運晶圓3 ; 複數個破片排除裝置25，係包含有一輸送帶25卜一驅動機構252、 -連接於輸送帶251下方之汽缸253，其中該汽缸253能透過該驅動機構 252改變該輸送帶251之位置狀態； 複數組晶圓輸送裝置22，係包含有一輸送帶⑵及一驅動機構功， 其中該晶圓輸送裝置22之輸送帶221係與該破片排除裝置25之輸送帶251 -端相連接’ 該驅動機構ns能夠驅動該輸送帶221，以使該晶圓3能夠 201248754 於該輸送帶221上被搬運； 複數個破片檢測器23，係設置於該輸送帶兩側下方，因此該破片檢測 器23所設置之位置係能夠位於該晶圓輸送裝置22之輸送帶221兩側下方 或疋該破片排除裝置25之輸送帶251兩側下方；本實施中將破片檢測器η 設置於該晶圓輸送裝置22之輸送帶221兩侧下方； -組晶圓移轉裝置24，係設置於該破片排除裝置25之輸送帶25ι另 -端’而該晶圓移轉裝置24係包含至少一個晶圓沒取器加、至少一組橫 向移動軌道242、至少-組縱向移動執道243及複數組輸出軌道244，其中 該晶該取器241能夠被搬運於該橫向軸軌道242及該縱向移動軌道如 上； 因此，當汲取裝置21將-晶圓3搬運於該晶圓輸送裝置22之輸送帶 221上時，該晶圓輸送裝置22之驅動機構过係能夠驅動該輸送帶22ι移 動，以將該晶圓3於該輸送帶221上被搬運移動，同時當該晶圓3移動至 該破片檢測器23之區域時’該破片檢測器23係會判斷該晶圓3是否有破 裂的情況發生，而當有破裂之晶圓3通過該破片排除裝置25時（如圖六八 及圖六B所示）’該破片排除裝置25之汽缸253係能透過該驅動機構拉 向内收縮’並導致與該汽紅253連接之輸送帶251呈現下擺狀態，因此該 輸送帶251所搬運之晶圓3會直接被排除； 若該破片檢測H 23判_晶圓3是正常時，該晶圓3能夠正常通過該 破片排除裝置25，並再由該晶圓移轉裝置24之娜及取器心及取該晶圓 3’而该晶圓>及取器241係能夠透過該橫向移動軌道242先縱向移動軌道243 來進仃橫向或是縱向移動’並再將該晶圓轉移分配於該複數組輸出軌道244 8 201248754 上，以進行後續之製程處理。 值得一提的是，該破片排除裝置25之輸送帶251上係設置至少一個感 測器254,用以驅動該汽缸253進行伸縮改變該輸送帶251為水平狀態或是 下擺狀態。 值得-提的是，如®三所示，該破>;檢測n 23上係具有至少—個光接 受端231及至少-個光發射端232，該光發射端232係用以照射該晶圓3表 面，並反射回該光接受端231接收，以判斷晶圓3是否有破裂的情況發生。 值知提的疋，该晶圓承載裝置！係為晶圓片g、晶圓片盒等等能夠 承載晶圓之容器。 值得提的疋亥破片排除裝置25之輸送帶251下方係能夠添加設置 一廢料容器（圖中未示）’用以容置晶圓表面具有破裂之晶圓片。 本發明所提供之-種具有破#制之晶圓輸送設備與其他習用技術 相互比較時，更具備下列優點： 1.本發明能夠於不同承載裝置之間進行破片檢測，因此能夠於承載 裝置輸入、輸出之搬運過程進行破片檢測，以排除有破裂情況之 晶圓。 2.本發明能夠將能夠有效地避免多餘的製程與製程後之檢測項 目’以節省更多㈣造成本與人力成本。 藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明 :精Γ㈣非以上稍财馳佳具財關麵本發•範鳴加以 所欲申1反地#目^希望脑蓋各種改變及具辦性的於本發明 所欲申凊之專利範_範脅内。 201248754 【圖式簡單說明】 圖-為本發明-種具有破^{檢⑼&晶®輸送設備之第—實施架構示意 圖； 圖二為本發明-種具有破片檢滅之晶圓輸送設備之破片檢測立體示意 圖； 圖三為本發明一種具有破片檢測之晶圓輸送設備之破片檢測側視圖； 圖四為本發明一種具有破片檢測之晶圓輸送設備之第二實施架構示意 圖及； 圖五為本發明一種具有破片檢測之晶圓輸送設備之破片排除立體示意 圖； 圖六A為本發明一種具有破片檢測之晶圓輸送設備之破片排除實施例 圖；以及 圆六B為本發明一種具有破片檢測之晶圓輸送設備之破片排除實施例 圖。 【主要元件符號說明】 1 晶圓承載裝置 21 汲取裝置 22 晶圓輸送裝置 221 輸送帶 222 驅動機構 23 破片檢測器 201248754 231 光接受端 232 光發射端 24 晶圓移轉裝置 241 晶圓 >及取益 242 橫向移動執道 243 縱向移動執道 244 輸出軌道 25 破片排除裝置 251 輸送帶 252 驅動機構 253 汽缸 254 感測器201248754 VI. Description of the Invention: [Technical Field] The present invention relates to a wafer transfer apparatus having fragment detection, and more particularly to a wafer transfer apparatus for use between a wafer carrier, and the wafer transfer apparatus is further The wafers that can be transported can be subjected to fragment detection and fragmentation. [Prior Art] The main materials of solar cells are mainly the elements and compounds such as GaAs, CdTe, 锗, etc., to improve the conversion efficiency of converting solar energy into electric energy or heat. Different elements or compounds will be used based on different application considerations. For example, people's live consumer products usually use amorphous germanium solar panels; space is used in gallium arsenide solar cells; if used in deserts, oceans, etc. The purpose of the large-scale electric Lai makes Shujing 11 solar cells. In addition, solar panels used in consumer products for people's livelihood will also output different voltages for different electronic products. At the same time, the electrical function of the solar panel, the defects on the front and back of the substrate, the flaws, the degree of fragmentation, and the like are also measured. Before the formation of solar cells, they are generally called solar wafers. Solar wafers will be tested and classified. Whether it is moving between machines or shipping requirements, solar wafers will be stacked. The wafer carrier device has two main designs, namely, the wafer E (cassette) has a clear, bottom and left and right side walls and a plurality of flanges are formed on the two movements, and the crystals are paid from the top and bottom. The BB round carrying device is a wafer cassette (mail (four) plus), which is a carrying device with a top venting opening formed above. Because the two wafer carrier devices have different ways of transferring wafers, they belong to two different 201248754 carrier devices. Therefore, in the actual (four) installation process, they often take their own needs and use them together.峨 (4) The self-reward version of the transfer has also appeared, but because the wafer is in the process of transportation, it is very difficult to find a structural thief. Even if it is visually inspected, it is not easy to find the problem, but all the manufacturing is to be completed. When the process is processed, the actual surface of the wafer will be affected by the degree of damage due to the broken surface of the wafer (10). Therefore, if it is a self-contained inspection process or a set of fragments that are set to meet the specific requirements, 'And phase-by-stage exclusion of wafers with rupture on the surface, which will effectively avoid redundant process and post-process inspection projects, to save more manufacturing costs and labor costs' should be an optimal solution. SUMMARY OF THE INVENTION An object of the present invention is to provide a crystal transfer apparatus having a chip detection, which is capable of performing a break detection on a carrying process of a load carrying device for loading and unloading, to eliminate a wafer having a crack. A wafer transfer apparatus with fragment detection capable of achieving the above object is used for detecting a wafer outputted from a wafer carrier, and the wafer transfer apparatus includes a group for transporting a wafer. No device, at least - a group of crystal transfer devices for transporting wafers, a plurality of fragment detectors, and a set of wafer transfer devices, wherein the fragment detectors are disposed below both sides of the conveyor belt for detecting The wafer being conveyed on the conveyor belt and determining whether the wafer is broken or not, and then drawing the wafer after the wafer conveyance device is detected by the wafer picker of the wafer transfer device, and The wafer transfer is distributed to the complex array output track of the wafer transfer device by lateral or longitudinal movement. More specifically, the no-fetch device is moved between the wafer carrier and the wafer transfer device location. More specifically, the wafer transport device includes a conveyor belt and a driving mechanism, and the wafer transfer device is disposed at the other end of the conveyor belt of the wafer transport device, and the wafer transfer device is further The method includes at least one wafer picker, at least one set of laterally moving tracks, at least one set of longitudinally moving tracks, and a plurality of array output tracks, wherein the wafer picker can be carried on the lateral moving track and the longitudinal moving track. More specifically, the wafer transfer apparatus is capable of adding a plurality of chip removing devices connected to the wafer transfer device, and the chip removing device includes a conveyor belt, a driving mechanism, and a connection under the conveyor belt. a cylinder in which the cylinder can change the position of the conveyor belt through the driving mechanism, and the end of the conveyor belt of the wafer conveying device can be connected to the conveyor belt of the fragment removing device, so the driving mechanism (4) is driven down. A conveyor belt to enable the wafer to be carried on the conveyor belt. More specifically, at least one sensor is disposed on the conveyor belt of the fragment removing device for driving the cylinder to expand and contract to change the conveyor belt to a horizontal state or a hem state. More specifically, the fragment detector has at least one light receiving end and at least one light emitting end 'the light emitting end _ illuminating the surface of the wafer and reflecting back to the receiving end of the receiving end to determine the wafer Is there a rupture? More specifically, the wafer carrying device is a wafer g, a wafer cassette, or the like that can carry a wafer. More specifically, under the conveyor belt of the fragment removing device, a waste container can be added to accommodate a wafer having a crack on the surface of the wafer. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are schematic diagrams of a first implementation architecture of a wafer transport device with fragment detection, a stereo view of the fragment detection and a side view of the fragment detection, and the wafer transport equipment is used for detecting Self-wafer carrier! The wafer 3 is outputted. As can be seen from the figure, the wafer transfer apparatus having the chip detection includes: a set of picking devices 21 moving between the wafer carrier device and the position of the wafer transfer device, the picking device 21 For transporting the wafer 3; at least one set of wafer transporting device 22 includes a conveyor belt 221 and a driving mechanism 222, the driving mechanism 222 can drive the conveyor belt 221 to enable the wafer 3 to be transported The belt 221 is transported; a plurality of fragment detectors 23' are disposed on both sides of the conveyor belt 221 for detecting the wafer 3 carried on the conveyor belt 221 and determining whether the wafer 3 is broken. Occurring; a set of wafer transfer device 24' is disposed at the other end of the conveyor belt 221, the wafer transfer device 24 includes at least one wafer picker 241, at least one set of laterally moving tracks 242, at least one set of longitudinal a moving track 243 and a complex array output track 244, wherein the wafer picker 241 is movable on the lateral moving track 242 and the longitudinal moving track 243; therefore, when the picking device 21 carries a wafer 3 on the wafer Conveyor When the conveyor belt 221 is on the belt 221, the driving mechanism 222 of the wafer conveyance device 22 can drive the conveyor belt 221 to move, and the wafer 3 is moved and transported on the far conveyor belt 221 while the wafer 3 is moved. When the area of the fragment detector 23 is reached, the fragment detector 23 determines whether the wafer 3 has a crack 6 201248754. Finally, the wafer picker 241 of the wafer transfer device 24 captures the crystal. The wafer 3 on the circular transport device 22, and the wafer picker 241 can be moved laterally or vertically through the lateral movement 242 and the longitudinal movement 243, and the wafer is transferred to the wafer The complex array is output on track 244 for subsequent processing. It is to be noted that, as shown in FIG. 3, the fragment detector 23 has at least one light receiving end 231 and at least one light emitting end 232 for illuminating the surface of the wafer 3, and The reflection is received back to the light receiving end 231 to determine whether or not the wafer 3 is broken. It is worth mentioning that the wafer carrier device 1 is a wafer cassette, a wafer cassette, or the like that can carry a wafer. Please refer to FIG. 2 , FIG. 3 , FIG. 4 , FIG. 5 , FIG. 6A and FIG. 6B , which are schematic diagrams of fragment detection of a wafer conveying device with fragment detection, a side view of fragment detection, and a schematic diagram of a second implementation structure. And the fragment excluding the embodiment diagram, and the wafer transfer apparatus is used for detecting the wafer 3 outputted from the wafer carrier device 1. As can be seen from the figure, the wafer transfer apparatus with fragment detection includes: a set of pick-up devices 21, moving between the wafer carrier device 1 and the position of the wafer transfer device, the picking device 21 is for carrying the wafer 3; the plurality of chip removing devices 25, comprising a conveyor belt 25 and a driving mechanism 252 - a cylinder 253 connected to the lower side of the conveyor belt 251, wherein the cylinder 253 can change the position of the conveyor belt 251 through the driving mechanism 252; the multi-array wafer conveying device 22 includes a conveyor belt (2) and a driving mechanism The conveyor belt 221 of the wafer transport device 22 is connected to the end of the conveyor belt 251 - of the fragment removing device 25. The driving mechanism ns can drive the conveyor belt 221 to enable the wafer 3 to be 2 01248754 is transported on the conveyor belt 221; a plurality of fragment detectors 23 are disposed on both sides of the conveyor belt, so that the position of the fragment detector 23 can be located on the conveyor belt 221 of the wafer conveyance device 22. The two sides of the conveyor belt 251 are disposed below the two sides of the conveyor belt 251. The conveyor belt 25 is disposed at the other end of the conveyor strip 25 of the fragment removing device 25, and the wafer transfer device 24 includes at least one wafer picker plus, at least one set of lateral moving rails 242, and at least a group of longitudinal movements. a track 243 and a complex array output track 244, wherein the crystal picker 241 can be carried on the lateral axis track 242 and the longitudinally moving track as above; therefore, when the picking device 21 transports the wafer 3 to the wafer transfer device When the conveyor belt 221 is 22, the driving mechanism of the wafer transfer device 22 can drive the conveyor belt 22 to move, so that the wafer 3 is transported on the conveyor belt 221 while the wafer 3 moves. To the fragment When the area of the detector 23 is 'the fragment detector 23 determines whether the wafer 3 is broken or not, and when the broken wafer 3 passes through the fragment removing device 25 (see Fig. 68 and Fig. 6B) The cylinder 253 of the fragment removing device 25 can be drawn inwardly through the driving mechanism and causes the conveyor belt 251 connected to the steam red 253 to assume a sway state, so the wafer 3 carried by the conveyor belt 251 Will be directly excluded; if the fragment detection H 23 judges that the wafer 3 is normal, the wafer 3 can pass the fragment removal device 25 normally, and then the wafer transfer device 24 and the device Taking the wafer 3' and the wafer> and the extractor 241 can move the track 243 longitudinally through the laterally moving track 242 to move laterally or vertically, and then transfer the wafer to the complex array. Output track 244 8 201248754 for subsequent processing. It is worth mentioning that at least one sensor 254 is disposed on the conveyor belt 251 of the fragment removing device 25 for driving the cylinder 253 to expand and contract to change the conveyor belt 251 to a horizontal state or a hem state. It is worth mentioning that, as shown in FIG. 3, the breaking has a light receiving end 231 and at least one light emitting end 232, and the light emitting end 232 is used to illuminate the crystal. The surface of the circle 3 is reflected back to the light receiving end 231 to be judged to determine whether or not the wafer 3 is broken. The value of the know, the wafer carrier! It is a wafer g, a wafer cassette, or the like that can carry a wafer. It is worth mentioning that under the conveyor belt 251 of the 破海片片除装置25, a waste container (not shown) can be added to accommodate the wafer having a crack on the surface of the wafer. The wafer conveying apparatus provided by the invention has the following advantages when compared with other conventional technologies: 1. The invention can perform fragment detection between different carrying devices, and thus can be input on the carrying device. The output handling process performs fragment detection to exclude wafers with cracks. 2. The present invention is capable of effectively avoiding redundant process and post-process inspection items to save more (four) cost and labor costs. Through the detailed description of the above preferred embodiments, it is desirable to describe the present invention more clearly: (4) Non-above, a little more than a good money, good fortune, this is the face of the hair. • Fan Ming, who wants to apply for the anti-land #目^希望脑Covering various changes and tangibles in the patent paradigm of the invention to be applied for. 201248754 [Simplified illustration of the drawings] Fig. - is a schematic diagram of a first embodiment of the present invention having a broken (9) & crystal delivery device; and Fig. 2 is a fragment of a wafer transfer device having a fragment detection FIG. 3 is a side view of a fragment detection of a wafer conveyance apparatus having fragment detection according to the present invention; FIG. 4 is a schematic view showing a second implementation structure of a wafer conveyance apparatus having fragment detection according to the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 6A is a perspective view of a fragment removal embodiment of a wafer conveyance device having a fragment detection according to the present invention; and a circular six B is a fragment detection method of the present invention. A fragmentation of the wafer transport equipment is excluded from the embodiment. [Main component symbol description] 1 wafer carrier 21 capture device 22 wafer transfer device 221 conveyor belt 222 drive mechanism 23 fragment detector 201248754 231 light receiving end 232 light emitting end 24 wafer transfer device 241 wafer > Benefit 242 Transverse movement 243 Longitudinal movement 244 Output track 25 Fragment elimination device 251 Conveyor belt 252 Drive mechanism 253 Cylinder 254 Sensor