TWI428418B - 光罩保護用黏著膠帶 - Google Patents

光罩保護用黏著膠帶 Download PDF

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Publication number
TWI428418B
TWI428418B TW097109575A TW97109575A TWI428418B TW I428418 B TWI428418 B TW I428418B TW 097109575 A TW097109575 A TW 097109575A TW 97109575 A TW97109575 A TW 97109575A TW I428418 B TWI428418 B TW I428418B
Authority
TW
Taiwan
Prior art keywords
adhesive tape
layer
surface layer
melamine
decane
Prior art date
Application number
TW097109575A
Other languages
English (en)
Chinese (zh)
Other versions
TW200902669A (en
Inventor
Hiroshi Tada
Nobuto Kamiya
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200902669A publication Critical patent/TW200902669A/zh
Application granted granted Critical
Publication of TWI428418B publication Critical patent/TWI428418B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/48—Protective coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW097109575A 2007-03-23 2008-03-19 光罩保護用黏著膠帶 TWI428418B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007077636 2007-03-23
JP2007104866 2007-04-12
JP2007314880 2007-12-05
PCT/JP2008/054708 WO2008117677A1 (ja) 2007-03-23 2008-03-14 フォトマスク保護用粘着テープ

Publications (2)

Publication Number Publication Date
TW200902669A TW200902669A (en) 2009-01-16
TWI428418B true TWI428418B (zh) 2014-03-01

Family

ID=39788413

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097109575A TWI428418B (zh) 2007-03-23 2008-03-19 光罩保護用黏著膠帶

Country Status (5)

Country Link
JP (1) JPWO2008117677A1 (ja)
KR (1) KR101448327B1 (ja)
CN (1) CN101589340B (ja)
TW (1) TWI428418B (ja)
WO (1) WO2008117677A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568829B (zh) * 2015-05-15 2017-02-01 Micro Lithography Inc A composition for resisting ultraviolet radiation in a mask and its application

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4448897B2 (ja) * 2007-10-19 2010-04-14 積水化学工業株式会社 フォトマスク保護用粘着テープ
JP5570732B2 (ja) * 2009-01-22 2014-08-13 積水化学工業株式会社 帯電防止型フォトマスク保護用粘着フィルム
TWI468733B (zh) * 2010-01-22 2015-01-11 Lg Chemical Ltd 用於光可定向層中定向處理之感壓黏膜
WO2011090355A2 (ko) 2010-01-22 2011-07-28 (주)Lg화학 광배향막 배향 처리용 점착 필름
JP2011153226A (ja) * 2010-01-27 2011-08-11 Sekisui Chem Co Ltd フォトレジスト付着防止テープ
KR102032601B1 (ko) * 2013-10-15 2019-10-15 아사히 가세이 가부시키가이샤 펠리클, 펠리클 부착 포토마스크 및 반도체 소자의 제조 방법
CN106404860A (zh) * 2016-08-30 2017-02-15 济南大学 一种氮化碳修饰三维石墨电极的制备方法及电致化学发光传感应用
KR102117873B1 (ko) 2018-07-02 2020-06-02 도레이첨단소재 주식회사 노광 공정용 점착보호필름

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3022117B2 (ja) * 1993-12-14 2000-03-15 大日精化工業株式会社 一液硬化可能なポリシロキサン樹脂化合物
JP2002072453A (ja) * 2000-08-31 2002-03-12 Asahi Glass Co Ltd 膜面保護層を有するフォトマスクおよびその製造方法
JP4891500B2 (ja) * 2001-09-20 2012-03-07 株式会社きもと 表面保護フィルム
JP4444643B2 (ja) * 2003-12-18 2010-03-31 株式会社きもと 表面保護膜およびこれを用いた表面保護フィルム
JP4376610B2 (ja) * 2003-12-18 2009-12-02 株式会社きもと 表面保護膜およびこれを用いた表面保護フィルム
JP4444647B2 (ja) * 2003-12-24 2010-03-31 株式会社きもと 表面保護膜および表面保護フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568829B (zh) * 2015-05-15 2017-02-01 Micro Lithography Inc A composition for resisting ultraviolet radiation in a mask and its application

Also Published As

Publication number Publication date
KR101448327B1 (ko) 2014-10-07
WO2008117677A1 (ja) 2008-10-02
CN101589340A (zh) 2009-11-25
JPWO2008117677A1 (ja) 2010-07-15
TW200902669A (en) 2009-01-16
KR20090122906A (ko) 2009-12-01
CN101589340B (zh) 2012-03-28

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