TWI419951B - 電磁波遮蔽薄膜與光學功能性薄膜之貼合用黏著劑及含該貼合用黏著劑之顯示面板濾波器元件 - Google Patents
電磁波遮蔽薄膜與光學功能性薄膜之貼合用黏著劑及含該貼合用黏著劑之顯示面板濾波器元件 Download PDFInfo
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- TWI419951B TWI419951B TW96106196A TW96106196A TWI419951B TW I419951 B TWI419951 B TW I419951B TW 96106196 A TW96106196 A TW 96106196A TW 96106196 A TW96106196 A TW 96106196A TW I419951 B TWI419951 B TW I419951B
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- Prior art keywords
- adhesive
- bonding
- acrylate
- meth
- film
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Description
本發明係關於電磁波遮蔽薄膜與光學功能性薄膜之貼合用黏著劑,以及含有上述貼合用黏著劑的顯示面板濾波器元件。本發明的貼合用黏著劑可用於製造例如構成電漿顯示面板等的顯示面板濾波器元件。
一般認為,由電漿顯示器等電磁裝置產生的電磁波,不僅會給其他的電磁裝置帶來不良影響,而且也會給人體帶來不良影響。特別是電漿顯示面板產生30MHz~130MHz頻率的電磁波,有時會對存在於周圍的電腦或利用電腦的機器造成影響,所以迫切希望儘可能使發生的電磁波不洩露到外部。作為遮蔽電磁波的方法,有使用由高導電性材料構成的殼體進行覆蓋的方法,或用導電性網進行被覆的方法,但在像電漿顯示器這樣必須進行觀察的裝置中,要求具有透視性,所以不能採用前面的方法。
因此,在電漿顯示器等中,作為同時具有電磁波遮蔽性和透視性的元件,係使用對在透明基材薄膜上透過接著劑層而層合的金屬箔進行蝕刻形成開口部,並具有網狀金屬箔的電磁波遮蔽片材。在屬於透明基材薄膜與接著劑層與網狀金屬箔的層合體的電磁波遮蔽薄膜中,藉由適當調整金屬箔的層厚或網目開口部的尺寸,即使放出之電磁波的強度是像電漿顯示器那樣的強電磁波水平,也能夠顯示足夠的遮蔽能力,並且兼備不損壞顯示畫面可視性的透明性(例如參照專利文獻1)。
上述電磁波遮蔽薄膜中,從其表面上的網狀金屬箔上賦予黏著劑,貼合各種光學功能性薄膜(例如近紅外線吸收薄膜、紫外光吸收薄膜或防反射薄膜)。這樣的電磁波遮蔽薄膜與光學功能性薄膜的貼合處理,一般是貼合後在0.3~1.5MPa左右的加壓下以及40~80℃左右的加熱下實施熱壓處理。上述熱壓處理中必須藉由加壓使黏著劑完全填充到具有微細凹凸表面結構的網狀金屬箔的開口部內部,並完全排除氣泡(以下有時稱之為“填入性”)。另外,為了防止貼合的電磁波遮蔽薄膜和光學功能性薄膜發生剝離,對上述貼合所用的黏著劑,要求電磁波遮蔽薄膜表面上的網狀金屬箔和光學功能性薄膜的充分黏著力、以及露出於網狀金屬箔開口部的接著劑層與光學功能性薄膜的充分黏著力。
[專利文獻1]日本專利特開2003-188576號公報。
但是,以往用於貼合上述電磁波遮蔽薄膜與各種光學功能性薄膜的黏著劑,具有黏著力不充分,或者即使加壓也不能充分填充到網狀金屬箔開口部的內部,或者在加熱處理時會產生氣泡等缺點。
本發明人發現,在貼合電磁波遮蔽薄膜和光學功能性薄膜的特殊用途之中,藉由把黏著劑的黏彈性參數設定在特定範圍內,可以實現高黏著力。
因此,本發明的課題在於提供在上述電磁波遮蔽薄膜和各種光學功能性薄膜的貼合中顯示充分的黏著力,利用加壓可以充分填充到網狀金屬箔開口部的內部,並且在加熱處理時不會產生氣泡的黏著劑。
上述課題可以利用本發明,由電磁波遮蔽薄膜和光學功能性薄膜的貼合用黏著劑解決,該黏著劑的特徵是70℃的貯存彈性模數為7.00×104
Pa以上。
本發明的上述貼合用黏著劑的較佳態樣的特徵是在23℃的貯存彈性模數為1.00×105
Pa以上。
本發明的上述貼合用黏著劑的另一個較佳態樣中,損耗正切(tan δ)的峰值溫度為-15℃以上。
本發明的上述貼合用黏著劑的另一個較佳態樣中,作為構成成分包含具有(甲基)丙烯酸烷基酯單體的丙烯酸系共聚物,較佳係作為構成成分包含進一步具有含氮乙烯基單體的丙烯酸系共聚物,更佳為丙烯酸系共聚物不含酸成分。
本發明亦關於顯示面板濾波器元件,其特徵是包含:(1)電磁波遮蔽薄膜,其為透明基材薄膜、設置在該透明基材薄膜一表面上的金屬箔用接著劑層以及在該金屬箔用接著劑層表面上形成的網狀金屬箔的層合體;(2)以覆蓋上述電磁波遮蔽薄膜的網狀金屬箔的方式設置的上述貼合用接著劑的層;以及(3)在上述貼合用黏著劑層表面上設置的光學功能性薄膜。
本發明的貼合用黏著劑,係藉由將熱壓處理溫度(70℃)下的貯存彈性模數控製在特定範圍,利用加熱以及加壓充分填充到網狀金屬箔開口部的內部,並且在高溫高濕條件下具有耐久性。
又,本發明的貼合用黏著劑在常溫(23℃)下的貯存彈性模數也高於一般的黏著劑,所以與電磁波遮蔽薄膜的網狀金屬箔側的面具有良好的密合性。
另外,本發明的貼合用黏著劑耐腐蝕性亦優異,所以即使在賦予於電磁波遮蔽薄膜之情況,也不會腐蝕網狀金屬箔。
黏著劑是顯示彈性和黏性兩種行為的黏彈性體。作為數量性表示黏彈性的黏彈性參數,係廣泛採用貯存彈性模數(G’)、損失彈性量(G”)以及損耗正切(tan δ)。貯存彈性模數定義為形變和同相位的彈性應力的比率,與材料儲存彈性能量的能力相關。另外,損失彈性模數是形變和不同相位的比率,相當於材料將應力以熱形式散逸的能力。另外,這些彈性模數之比(G”/G’)係定義為損耗正切,表示材料的黏性成分與彈性成分之比。這些黏彈性參數可以藉由動態黏彈性測定裝置進行測定。
本發明的貼合用黏著劑在70℃的貯存彈性模數為7.00×104
Pa以上,較佳為8.00×104
Pa以上,更佳為9.00×104
Pa以上。另,70℃是電磁波遮蔽薄膜和光學功能性薄膜的熱壓貼合處理的代表溫度。如果70℃的貯存彈性模數(G’)未滿7.00×104
Pa,則在本發明的用途中,有時在高溫高濕條件下的耐久性差。另一方面,對於70℃的貯存彈性模數(G’)的上限沒有特別限定,但是在本發明的用途中,如果貼合用黏著劑太硬,從電磁波遮蔽薄膜表面上的網狀金屬箔的上面賦予貼合用黏著劑,為了使貼合用黏著劑完全填充到具有微細凹凸表面結構的網狀金屬箔的開口部的內部,有時必須提高熱壓處理的壓力。從這一點考慮,作為70℃的貯存彈性模數的上限,較佳為1.00×106
Pa。
又,本發明的貼合用黏著劑在23℃(室溫)的貯存彈性模數(G’)較佳為1.00×105
Pa以上,更佳為1.50×105
Pa以上,最佳為2.00×105
Pa以上。如果23℃(室溫)的貯存彈性模數(G’)未滿1.00×105
Pa,則在本發明的用途中,有時電磁波遮蔽薄膜與光學功能性薄膜的黏著力不足。另一方面,對於在23℃(室溫)的貯存彈性模數(G’)的上限沒有特別限定,但是在本發明的用途中,如果23℃的貯存彈性模數(G’)太高,則貼合適性降低,所以作為23℃的貯存彈性模數上限,較佳為1.00×106
Pa。
本發明貼合用黏著劑的損耗正切(tan δ)的峰值溫度較佳為-15℃以上,更佳為-12℃以上。如果峰值溫度未滿-15℃,則有可能難以得到所需要的黏著力。對於損耗正切(tan δ)的峰值溫度上限沒有特別限定,但是如果損耗正切的峰值溫度太高,則貼合適性降低,所以作為損耗正切的峰值溫度上限,較佳為30℃。
本發明的貼合用黏著劑,在後述實施例中所示的條件下,其黏著力較佳為20~50N/25mm、更佳為22~45N/25mm。
作為本發明貼合用黏著劑的較佳例,可以列舉以(甲基)丙烯酸烷基酯單體為構成成分的丙烯酸系共聚物,特別以(甲基)丙烯酸烷基酯單體以及含氮乙烯基單體作為構成成分的丙烯酸系共聚物為佳。另外,含氮乙烯基單體相對於構成上述丙烯酸系共聚物的全部單體的比率,較佳為0.1~30.0質量%,更佳為3~30質量%,最佳為4~25質量%。另外,以下有時把構成丙烯酸系共聚物的單體混合物稱為「單體混合物」。上述含氮乙烯基單體的使用量如果未滿0.1質量%,則有時黏著力變得太低;如果超過30質量%,則有時填入性變差。
上述的(甲基)丙烯酸烷基酯單體,例如為具有碳原子數1~20(較佳為碳原子數1~12)的烷基酯部分的丙烯酸烷基酯或甲基丙烯酸烷基酯。具體而言可以列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十六烷基酯或(甲基)丙烯酸十八烷基酯等。該等可以單獨使用,也可以組合2種以上使用。
上述(甲基)丙烯酸烷基酯單體(1種或2種以上)在上述單體混合物中可較佳以70~97質量%、更佳以75~95質量%的量使用。如果(甲基)丙烯酸烷基酯單體的量未滿70質量%,則有時填入性會變差;如果超過97質量%,則有時黏著力會變得太低。
作為丙烯酸系共聚物構成成分的上述單體混合物,更佳為含有在分子內具有1個或1個以上交聯性官能基的單體。作為交聯性官能基,例如可以列舉羥基、醯胺基、胺基、羧基或碳-碳不飽和鍵等。羥基、醯胺基、胺基或羧基是與交聯劑反應而進行交聯的官能基,碳-碳不飽和鍵是藉由其等相互之加成反應而進行交聯的官能基。作為分子內具有交聯性官能基的單體例,例如可以列舉(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丁酯、(甲基)丙烯酸4-羥基丁酯等甲基丙烯酸羥基烷基酯;丙烯醯胺、甲基丙烯醯胺、N-甲基丙烯醯胺、N-甲基甲基丙烯醯胺、N-羥甲基丙烯醯胺、N-羥甲基-甲基丙烯醯胺等丙烯醯胺類;(甲基)丙烯酸單甲基胺基乙酯、(甲基)丙烯酸單乙基胺基乙酯、(甲基)丙烯酸單甲基胺基丙酯、(甲基)丙烯酸單乙基胺基丙酯等(甲基)丙烯酸單烷基胺基烷基酯;丙烯酸、甲基丙烯酸、巴豆酸、馬來酸、衣康酸、檸康酸等乙烯性不飽和羧酸等。這些單體既可以單獨使用,也可以組合2種以上使用。作為具有1個或1個以上碳-碳不飽和鍵的基團的例子,可以列舉(甲基)丙烯醯基。從抑製網狀金屬箔腐蝕的觀點考慮,具有交聯性官能基的單體較佳為不含酸成分者,特佳為(甲基)丙烯酸羥基烷基酯。
具有上述交聯性官能基的單體,在上述單體混合物中較佳為以0~10質量%、更佳為以0.2~5質量%的量使用。
作為上述含氮乙烯基單體,可以列舉(甲基)丙烯醯胺、N-第三丁基丙烯醯胺、N-乙烯基吡咯啶酮、N,N-二甲基丙烯醯胺、N,N-二乙基丙烯醯胺、N,N-二甲基胺基丙基丙烯醯胺、N-異丙基丙烯醯胺、N-苯基丙烯醯胺、二甲基胺基丙基丙烯醯胺、N-乙烯基己內醯胺、丙烯醯基啉、丙烯酸二甲基胺基乙酯或丙烯醯基哌啶等。
這些單體之中,均聚物的玻璃轉移溫度(Tg)為80℃以上、進一步為110℃以上的含氮乙烯基單體為佳。這樣的含氮乙烯基單體可以列舉丙烯醯胺(119℃)、甲基丙烯醯胺(171℃)、N-第三丁基丙烯醯胺(135℃)、N,N-二甲基丙烯醯胺(119℃)、N,N-二甲基胺基丙基丙烯醯胺(119℃)、N-異丙基丙烯醯胺(134℃)、N-苯基丙烯醯胺(160℃)、丙烯醯基啉(145℃)、丙烯醯基哌啶(116℃)。特佳為丙烯醯基啉、N,N-二甲基丙烯醯胺。另外,( )內是均聚物的玻璃轉移溫度。
另,含氮乙烯基單體可以是具有上述交聯性官能基的單體。
上述丙烯酸系共聚物視情況可以含有其他單體作為構成成分。作為其他單體,可以列舉如醋酸乙烯酯或苯乙烯等。
上述丙烯酸系共聚物,例如可以由含有(甲基)丙烯酸烷基酯單體以及含氮乙烯基單體的單體混合物,利用溶液聚合或塊狀聚合等任意公知的聚合方法而獲得。重量平均分子量較佳為20萬~180萬左右,更佳為50萬~150萬。
另外,較佳係使用交聯劑使上述丙烯酸系共聚物進行交聯。作為交聯劑,例如可以列舉多異氰酸酯化合物、金屬螯合化合物、環氧化合物等,較佳為多異氰酸酯化合物。作為多異氰酸酯化合物,例如可以列舉伸苄基二異氰酸酯或其氫化物、伸苄基二異氰酸酯與三羥甲基丙烷的加成體、三苯基甲烷三異氰酸酯、亞甲基雙-二-苯基異氰酸酯或其氫化物、六亞甲基二異氰酸酯、六亞甲基二異氫酸酯與三羥甲基丙烷的加成體、苯二甲基二異氰酸酯、二甲苯二異氰酸酯與三羥甲基丙烷的加成體、4,4’-二環己基甲烷二異氰酸酯或如該等之聚合物般在分子內具有2個以上異氰酸酯基的化合物。對於交聯劑的用量沒有特別限定,通常相對於丙烯酸系聚合物100質量份為0.01~10重量份。
本發明的貼合用黏著劑,除了上述丙烯酸系共聚物以外,在不妨礙本發明目的之範圍內亦可配合如石油樹脂、萜烯樹脂、松香樹脂、香豆酮-茚樹脂或酚樹脂等賦予黏著性的樹脂;抗氧化劑、紫外線吸收劑、光穩定劑、軟化劑、防銹劑或矽烷偶合劑或填充劑等適當的添加劑。
此外,可藉由使本發明的貼合用黏著劑含有近紅外線吸收劑、氖光阻斷劑、染料或顏料等,以防止或減輕由電漿顯示器放出的各種光線,例如近紅外線或氖光。
作為近紅外線吸收劑,可以列舉花青素系、硫醇系、金屬錯合物系、偶氮化合物、聚甲炔類、二苯基甲烷系、三苯基甲烷系、苯醌系或dimonium鹽系等色素,配合由電漿顯示器放出的近紫外線波長,通常可以使用2種以上squalium。作為氖光阻斷劑,例如可以使用花青素類、squalium系、甲亞胺(azomethine)系、系或oxonol系的化合物。
本發明的貼合用黏著劑,如前所述是電磁波遮蔽薄膜和光學功能性薄膜的貼合用黏著劑。作為電磁波遮蔽薄膜,可以列舉下述(1)~(3)的層合體:(1)透明基材薄膜;(2)在該透明基材薄膜的一表面上設置的金屬箔用接著劑層;和(3)在該金屬箔用接著劑層表面上形成的網狀金屬箔。作為透明基材薄膜,可以使用丙烯酸樹脂、聚碳酸酯樹脂、聚丙烯樹脂、聚乙烯樹脂、聚苯乙烯樹脂、聚酯樹脂、纖維素系樹脂、聚碸樹脂或聚氯乙烯樹脂等的薄膜。通常較佳係使用機械強度優異、透明性高的聚對苯二甲酸乙二酯樹脂等聚酯樹脂的薄膜。對於透明基材薄膜的厚度沒有特別限定,從具有機械強度並提高對折彎的抵抗性角度考慮,較佳為50 μm~200 μm左右。視需要還可以對透明基材薄膜的一面或兩面實施電暈放電處理、或設置易接著層。
作為形成電磁波遮蔽薄膜的方法,例如可以列舉透過金屬箔用接著劑在透明基材薄膜的一表面上設置金屬箔,並進行蝕刻處理的方法。作為金屬箔,可以使用銅、鐵、鎳或鉻等金屬,或這些金屬的合金,或以這些金屬中的1種以上為主體的合金箔,並沒有特別限定,該等之中,從電磁波遮蔽性高、容易蝕刻、便於操作的角度考慮,較佳係使用銅箔。
金屬箔的厚度較佳為1 μm~100 μm,更佳為5 μm~20 μm。如果金屬箔的厚度未滿1 μm,則電磁波遮蔽性不充分;如果超過100 μm,則不能忽視側面蝕刻的進行,所以藉由蝕刻難以形成預定精度的開口部。另外,金屬箔可以在透明基材薄膜側具有黑化處理形成的黑化層,除了防銹效果以外,還可以賦予防反射性。在黑化層上面作為防銹處理還可以進行鉻酸鹽處理。當不使用預先經過黑化處理的金屬箔時,可以在後面的適當步驟中進行黑化處理。另外,黑化層之形成可以使用著色為黑色之組成物,形成能夠形成抗蝕劑層的感光性樹脂層,在蝕刻結束後,不除去抗蝕劑層而使其殘留形成,也可以藉由賦予黑色系被膜的鍍膜法形成。
透明基材薄膜與金屬箔的層合,當作為透明基材薄膜單獨使用或與其他樹脂薄膜層合使用熱熔黏性高的乙烯-醋酸乙烯酯共聚樹脂或離子聚合物樹脂等熱熔黏性樹脂的薄膜時,可以不設置接著劑層而進行層合,但通常係藉由使用金屬箔用接著劑層的乾式層疊法等進行層合。作為構成金屬箔用接著劑層的金屬箔用接著劑,可以列舉丙烯酸樹脂、聚酯樹脂、聚胺基甲酸酯樹脂、聚乙烯醇樹脂、氯乙烯/醋酸乙烯酯共聚樹脂或乙烯-醋酸乙烯酯共聚樹脂等接著劑,除該等之外,還可以使用熱硬化性樹脂或電離射線硬化性樹脂(紫外線硬化性樹脂、電子射線硬化性樹脂等)。
對這樣得到的層壓體的金屬箔進行蝕刻,集密形成開口部,並形成為網狀,藉此可以得到屬於透明基材薄膜和金屬箔用接著劑層以及網狀金屬箔的層合體之電磁波遮蔽薄膜。
作為本發明貼合用黏著劑的被附著物一方的電磁波遮蔽薄膜的網狀金屬箔,由於必須具有透光性,所以通常使用開口率為65~95%者。開口率係以透光部分(無金屬箔處)相對於網狀金屬箔面積的面積比例表示。另外,網狀金屬箔的厚度較佳為1 μm~100 μm,更佳為5 μm~20 μm。
本發明的貼合用黏著劑可以利用公知的任意方法賦予於上述電磁波遮蔽薄膜的網狀金屬箔載持表面或光學功能性薄膜的表面,藉此可以得到載持有貼合用黏著劑的薄膜。作為賦予貼合用黏著劑的方法,例如有使用公知的塗布方法在剝離片的剝離處理面上設置本發明的貼合用黏著劑層,使該貼合用黏著劑層與上述網狀金屬箔載持表面或光學功能性薄膜表面貼合,從而使貼合用黏著劑層轉印的方法,或者使用公知方法把本發明的貼合用黏著劑塗布在網狀金屬箔載持表面或光學功能性薄膜表面而賦予的方法。作為塗布方法,例如可以列舉輥塗機、刮板塗布機、模頭塗布機、刮刀塗布機、凹版塗布機、或網板印刷等方法。
在上述電磁波遮蔽薄膜的網狀金屬箔載持表面和光學功能性薄膜表面賦予的本發明的貼合用黏著劑,以貼合在光學功能性薄膜和網狀金屬箔表面上的狀態實施熱壓處理。熱壓處理可以藉由公知方法,例如在40~80℃、在0.3~1.5MPa的加壓下實施。本發明貼合用黏著劑較佳係以完全覆蓋網狀金屬箔的厚度進行設置。這樣形成的貼合用黏著劑層的層厚,在進行熱壓處理後較佳為20 μm~100 μm,更佳為20 μm~40 μm。
作為光學功能性薄膜,例如可以列舉吸收近紅外線或紅外線的薄膜、吸收氖光的薄膜、吸收紫外線的薄膜、施加於網狀金屬箔而可以防止或減輕電磁波洩漏的薄膜、防止外部光反射的薄膜或進行色調修正的薄膜。另外,還可以對顯示面板的玻璃面進行保護,或貼合用於防止玻璃碎裂時飛散的薄膜。作為光學功能性薄膜的基材,可以使用聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、聚碳酸酯等薄膜。基材的厚度為20 μm~300 μm左右。
本發明的顯示面板濾波器元件包含:(1)電磁波遮蔽薄膜,其係透明基材薄膜、設置在該透明基材薄膜一表面上的金屬箔用接著劑層以及在該金屬箔用接著劑層表面上形成的網狀金屬箔的層合體;(2)本發明貼合用黏著劑的層,該層設置成覆蓋上述電磁波遮蔽薄膜的網狀金屬箔;以及(3)在上述貼合用黏著劑層表面上設置的光學功能性薄膜。
上述顯示面板濾波器元件,可用作電漿顯示面板等的構成元件。
以下藉由實施例具體說明本發明,但是該等並不用以限定本發明的範圍。
在醋酸乙酯200質量份中添加作為單體成分的丙烯酸正丁酯64.5質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯0.5質量份以及丙烯醯基啉5質量份和作為引發劑的偶氮二異丁腈0.2質量份,在60℃下攪拌17小時,得到重量平均分子量為85萬的丙烯酸酯共聚物溶液。相對於所得共聚物溶液的固體成分100質量份,添加作為交聯劑的二甲苯二異氰酸酯系三官能基加成體[綜研化學(股)製:TD-75]0.5質量份,再用2-丁酮進行稀釋得到濃度為25質量%的溶液,作為貼合用黏著劑溶液。丙烯醯基啉均聚物的玻璃轉移溫度為145℃。
通過刮板塗布把該貼合用黏著劑溶液塗布到剝離薄膜[Lintec(股)製,SP-PET3811]的剝離處理面上,在90℃下乾燥1分鐘,形成厚度為25 μm的貼合用黏著劑層。接著在貼合用黏著劑層上層壓厚度為100 μm的作為光學功能性薄膜基材的聚對苯二甲酸乙二醇酯薄膜[東洋紡織(股)製「cosmoshine A4300」],得到載持有貼合用黏著劑的薄膜。
作為單體成分使用丙烯酸正丁酯59.5質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯0.5質量份以及丙烯醯基啉10質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為85萬。
作為單體成分使用丙烯酸正丁酯54.5質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯0.5質量份以及丙烯醯基啉15質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為85萬。
作為單體成分使用丙烯酸正丁酯49.5質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯0.5質量份以及丙烯醯基啉20質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為85萬。
作為單體成分使用丙烯酸正丁酯64.5質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯0.5質量份以及N,N-二甲基丙烯醯胺5質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。N,N-二甲基丙烯醯胺均聚物的玻璃轉移溫度為119℃。
作為單體成分使用丙烯酸正丁酯59.5質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯0.5質量份以及N,N-二甲基丙烯醯胺10質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。
作為單體成分使用丙烯酸正丁酯54.5質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯0.5質量份以及N,N-二甲基丙烯醯胺15質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。
作為單體成分使用丙烯酸正丁酯49.5質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯0.5質量份以及N,N-二甲基丙烯醯胺20質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。
作為單體成分使用丙烯酸正丁酯59質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯1質量份以及丙烯醯基啉10質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。
作為單體成分使用丙烯酸正丁酯58質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯2質量份以及丙烯醯基啉10質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。
作為單體成分使用丙烯酸正丁酯57質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯3質量份以及丙烯醯基啉10質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。
作為單體成分使用丙烯酸正丁酯54質量份、丙烯酸甲酯30質量份、丙烯酸2-羥基乙酯1質量份以及丙烯醯基啉10質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。
作為單體成分使用丙烯酸正丁酯49.5質量份、丙烯酸甲酯30質量份、甲基丙烯酸甲酯20質量份以及丙烯酸2-羥基乙酯0.5質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為80萬。
作為單體成分使用丙烯酸正丁酯79質量份、丙烯酸甲酯20質量份以及丙烯酸2-羥基乙酯1質量份,除此之外,進行與實施例1相同的操作,得到載持有貼合用黏著劑的薄膜。得到的丙烯酸酯共聚物的重量平均分子量為90萬。
(1)銅網層合薄膜的製造用以下方法製造作為用於以下物性評價的電磁波遮蔽薄膜的銅網層合薄膜。
準備厚度為100 μm的聚對苯二甲酸乙二醇酯薄膜[東洋紡織(股)製「cosmoshine A4100」]和對單面進行黑化處理後厚度為10 μm的銅箔[古河Circuit Foil(股)製,編號:BW-S]。用含有聚胺酯樹脂的金屬箔用接著劑[武田藥品工業(股)製,以Takelac A310(主成分)/Takenate A10(硬化劑)/醋酸乙酯=12/1/21的質量比混合]將上述銅箔黑化處理面相反側的表面和上述聚對苯二甲酸乙二醇酯薄膜貼合,得到聚對苯二甲酸乙二醇酯薄膜/金屬箔用接著劑層/銅箔構成的層合體。
在得到的層合體的銅箔側塗布以酪蛋白為主成分的抗蝕劑溶液,進行乾燥得到感光性樹脂層,使用形成有圖案的遮罩進行紫外線附著曝光,曝光後用水進行顯影,並實施硬化處理,然後在100℃的溫度下進行烘烤,形成抗蝕劑圖案。作為遮罩的圖案,使用間距300 μm、線寬10 μm的圖案。在形成了抗蝕劑圖案的上述層合體上,從抗蝕劑圖案一側,噴射氯化鐵溶液(波美(Baume)度:42,溫度:30℃)進行蝕刻後,進行水洗,然後使用鹼溶液進行抗蝕劑剝離,剝離後進行清洗和乾燥,得到聚對苯二甲酸乙二醇酯薄膜/金屬箔用接著劑層/銅網構成的銅網層合薄膜(電磁波遮蔽薄膜)。銅網的開口率為80%,厚度為10 μm。
(2)與銅網的黏著力的測定方法從載持有貼合用黏著劑的薄膜上切取寬25mm以及長240mm的試樣,剝去剝離薄膜,貼合到作為被附著物的銅網層合薄膜的銅網側,然後用熱壓機(栗原製作所製)在0.5MPa、70℃以及30分鐘的條件下進行加壓。然後在23℃以及相對濕度(Rh)為50%的環境下放置24小時後,用拉伸試驗機(Orientec公司製萬能試驗機),在剝離速度為300mm/min、以及剝離角度為180℃的條件下進行測定。實施例1~12以及比較例1的所有試樣中,在貼合用黏著劑和銅網的介面都引起剝離。
(3)與玻璃的黏著力的測定方法把被附著物換成無鹼玻璃(康寧公司製「1727」),除此之外,與上述第(2)項的「與銅網的黏著力的測定方法」同法進行測定。
(4)貯存彈性模數(G’)以及損失彈性模數(G”)的測定方法從載持厚度為25 μm的貼合用黏著劑層的剝離薄膜將貼合用黏著劑層一層一層層疊在剝離片上,製成直徑為8mm以及厚度為3mm圓柱形的貼合用黏著劑層構成的試驗片,並通過扭力剪切法在下面的條件下進行測定貯存彈性模數(G’)以及損失彈性模數(G”)。
測定裝置:Rheometric公司製 動態黏彈性測定裝置「DYNAMIC ANALYZER RDAII」;頻率:1Hz;溫度:23℃、70℃。
(5)損耗正切(tan δ)的計算方法損耗正切(tan δ)可以用貯存彈性模數(G’)以及損失彈性模數(G”)的值,根據下面的計算(式)進行計算。
損耗正切=損失彈性模數/貯存彈性模數
(6)有無氣泡從載持有貼合用黏著劑的薄膜上切取寬50mm以及長120mm的試樣,剝去剝離薄膜,貼合到銅網層合薄膜的銅網側,然後用熱壓機(栗原製作所製)在0.5MPa、70℃以及30分鐘的條件下進行加壓,然後進行目視觀察,根據以下標準進行評價。
○:沒有觀察到外觀異常;×:在貼合用黏著劑層和銅網的介面上觀察到氣泡。
(7)耐久性能的評價方法從載持有貼合用黏著劑的薄膜上切取寬50mm以及長120mm的試樣,剝去剝離薄膜,貼合到銅網層合薄膜的銅網側,然後用熱壓機(栗原製作所製)在0.9MPa、70℃以及60分鐘的條件下進行加壓。然後在23℃、相對濕度為90%的環境下放置24小時,再於80℃、相對濕度為50%的環境下放置24小時,然後進行目視觀察,根據以下標準進行評價。
◎:沒有觀察到外觀異常;○:沒有觀察到最大直徑在100 μm以上的氣泡;×:觀察到最大直徑在100 μm以上的氣泡。
(8)耐腐蝕性的評價方法從載持有貼合用黏著劑的薄膜上切取寬50mm以及長120mm的試樣,剝去剝離薄膜,貼合到銅網層合薄膜的銅網側,然後用熱壓機(栗原製作所製)在0.5MPa、70℃以及30分鐘的條件(加壓條件1)下,或者在0.9MPa、70℃以及60分鐘的條件(加壓條件2)下進行加壓,得到評價用試樣。然後把評價用試樣在60℃以及相對濕度為90%的環境下放置500小時,使用分光光度計[島津製作所(股)製:MPC3100]測定放置前後在波長700nm處的透過率,計算評價用試樣的透過率變化(△Y)。
如果△Y在1.5%以下,則耐腐蝕性良好。
把上述物性評價的結果如下述表1所示。
本發明的貼合用黏著劑,可以用於製造如構成電漿顯示面板等的顯示面板濾波器元件,以及製造使用該元件的顯示器。
Claims (5)
- 一種貼合用黏著劑,係用於貼合電磁波遮蔽薄膜與光學功能性薄膜,其以40~80℃、藉由0.3~1.5MPa的加壓,貼合至具有厚度為1μm~20μm及開口率65~95%的網狀金屬箔之電磁波遮蔽薄膜之上述網狀金屬箔載持表面;該貼合用黏著劑之特徵為,70℃之貯存彈性模數為7.00×104 Pa~1.00×106 Pa;23℃之貯存彈性模數為1.00×105 Pa以上;構成成分包含丙烯酸系共聚物,該丙烯酸系共聚物具有(甲基)丙烯酸烷基酯單體、(甲基)丙烯酸羥基烷基酯、含氮乙烯單體;上述(甲基)丙烯酸烷基酯單體的比率,相對於用以構成上述丙烯酸系共聚物之單體整體為70~97質量%;上述(甲基)丙烯酸羥基烷基酯的比率,相對於用以構成上述丙烯酸系共聚物之單體整體為0.2~10質量%;及上述含氮乙烯單體的比率,相對於用以構成上述丙烯酸系共聚物之單體整體為0.1~30.0質量%。
- 如申請專利範圍第1項之貼合用黏著劑,其中,損耗正切(tan δ)之峰值溫度為-15℃以上。
- 如申請專利範圍第1項之貼合用黏著劑,其中,丙烯酸系共聚物不含酸成分。
- 一種貼合方法,係使用貼合用黏著劑,在設置成上述貼合用黏著劑覆蓋網狀金屬箔的狀態下,以40~80℃、0.3~1.5MPa的加壓下,將具有厚度為1μm~20μm及開口 率65~95%的網狀金屬箔之電磁波遮蔽薄膜、與光學機能性薄膜進行貼合;該貼合用黏著劑係:70℃之貯存彈性模數為7.00×104 Pa~1.00×106 Pa、23℃之貯存彈性模數為1.00×105 Pa以上;構成成分包含丙烯酸系共聚物,該丙烯酸系共聚物具有(甲基)丙烯酸烷基酯單體、(甲基)丙烯酸羥基烷基酯、含氮乙烯單體;上述(甲基)丙烯酸烷基酯單體的比率,相對於用以構成上述丙烯酸系共聚物之單體整體為70~97質量%;上述(甲基)丙烯酸羥基烷基酯的比率,相對於用以構成上述丙烯酸系共聚物之單體整體為0.2~10質量%;且上述含氮乙烯單體的比率,相對於用以構成上述丙烯酸系共聚物之單體整體為0.1~30.0質量%。
- 一種顯示面板濾波器元件之製造方法,係使用貼合用黏著劑,在設置成上述貼合用黏著劑覆蓋網狀金屬箔的狀態下,以40~80℃、0.3~1.5MPa的加壓下,將具有厚度為1μm~20μm及開口率65~95%的網狀金屬箔之電磁波遮蔽薄膜、與光學機能性薄膜進行貼合;該貼合用黏著劑係:70℃之貯存彈性模數為7.00×104 Pa~1.00×106 Pa、23℃之貯存彈性模數為1.00×105 Pa以上;構成成分包含丙烯酸系共聚物,該丙烯酸系共聚物具有(甲基)丙烯酸烷基酯單體、(甲基)丙烯酸羥基烷基酯、含氮乙烯單體;上述(甲基)丙烯酸烷基酯單體的比率,相對於用以構成 上述丙烯酸系共聚物之單體整體為70~97質量%;上述(甲基)丙烯酸羥基烷基酯的比率,相對於用以構成上述丙烯酸系共聚物之單體整體為0.2~10質量%;且上述含氮乙烯單體的比率,相對於用以構成上述丙烯酸系共聚物之單體整體為0.1~30.0質量%。
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Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4140736B2 (ja) * | 2006-03-15 | 2008-08-27 | 日東電工株式会社 | 粘着型光学フィルム、積層光学フィルムおよび画像表示装置 |
US20090087629A1 (en) | 2007-09-28 | 2009-04-02 | Everaerts Albert I | Indium-tin-oxide compatible optically clear adhesive |
EP2053109A1 (en) * | 2007-10-22 | 2009-04-29 | Nitto Denko Corporation | Pressure-sensitive adhesive composition for optical film, pressure-sensitive adhesive layer for optical film, production method thereof, pressure-sensitive adhesive optical film and image display |
KR101542633B1 (ko) * | 2007-11-07 | 2015-08-06 | 닛폰고세이가가쿠고교 가부시키가이샤 | 점착제, 광학 부재용 점착제, 광학 부재 및 일시 표면 보호용 점착제 |
EP2072552A3 (en) * | 2007-12-20 | 2009-07-29 | Nitto Denko Corporation | Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display |
JP5204612B2 (ja) * | 2007-12-20 | 2013-06-05 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置 |
JP5379409B2 (ja) * | 2008-02-15 | 2013-12-25 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置 |
JP5379410B2 (ja) * | 2008-03-14 | 2013-12-25 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置 |
JP2009258685A (ja) * | 2008-03-28 | 2009-11-05 | Lintec Corp | プラズマディスプレイ用光学積層体 |
JP5407204B2 (ja) * | 2008-07-16 | 2014-02-05 | 王子ホールディングス株式会社 | 粘着剤、両面粘着シート、光学フィルター、及びディスプレイ |
CN102105935B (zh) * | 2008-08-18 | 2012-12-19 | 琳得科株式会社 | 压敏粘合剂、光记录介质制造用片材及光记录介质 |
JP5325582B2 (ja) * | 2009-01-14 | 2013-10-23 | リンテック株式会社 | 粘着剤組成物、粘着シートおよび粘着積層体 |
US9728304B2 (en) * | 2009-07-16 | 2017-08-08 | Pct International, Inc. | Shielding tape with multiple foil layers |
JP2011153190A (ja) * | 2010-01-26 | 2011-08-11 | Nitto Denko Corp | 導電性粘着テープ |
JP5936538B2 (ja) * | 2010-03-10 | 2016-06-22 | 日東電工株式会社 | 光学用粘着シート |
JP5544954B2 (ja) * | 2010-03-18 | 2014-07-09 | サイデン化学株式会社 | 光学用粘着剤組成物 |
JP5572431B2 (ja) * | 2010-03-23 | 2014-08-13 | リンテック株式会社 | 平面板貼合用樹脂積層体及び積層平面板 |
JP5572433B2 (ja) * | 2010-03-24 | 2014-08-13 | リンテック株式会社 | 導電膜表面用粘着剤および導電膜表面用粘着シート |
JP5968587B2 (ja) * | 2010-10-21 | 2016-08-10 | 日東電工株式会社 | 光学用粘着シート、光学フィルムおよび表示装置 |
JP6535924B2 (ja) * | 2014-12-17 | 2019-07-03 | リンテック株式会社 | ウィンドウフィルム |
JP6511314B2 (ja) * | 2015-03-26 | 2019-05-15 | 積水化学工業株式会社 | 粘着テープ |
JP6830753B2 (ja) * | 2015-10-02 | 2021-02-17 | 日東電工株式会社 | 積層体、タッチパネル、積層体形成キット、及び、透明導電性フィルムの屈曲耐性を向上する方法 |
WO2017168192A1 (en) * | 2016-03-29 | 2017-10-05 | Essilor International (Compagnie Generale D'optique) | Functionalized laminated optical element with improved edging resistance |
WO2018057774A1 (en) * | 2016-09-21 | 2018-03-29 | 3M Innovative Properties Company | Protective display film with glass |
CN110121429A (zh) * | 2016-12-29 | 2019-08-13 | 3M创新有限公司 | 装饰片材 |
WO2018231268A1 (en) * | 2017-06-15 | 2018-12-20 | W. L. Gore & Associates, Inc. | Compressible liquid seals with discontinuous adhesives |
JP6506461B1 (ja) * | 2018-02-01 | 2019-04-24 | 積水化学工業株式会社 | 導電性粘着テープ |
TW202106510A (zh) * | 2019-08-02 | 2021-02-16 | 仁寶電腦工業股份有限公司 | 複合材料及其製造方法、電子裝置 |
CN114716933A (zh) * | 2022-04-26 | 2022-07-08 | 深圳市津田电子有限公司 | 一种耐高温胶带及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003336013A (ja) * | 2002-05-22 | 2003-11-28 | Mitsubishi Plastics Ind Ltd | 透明粘着剤、透明粘着シート及び積層体 |
CN1538223A (zh) * | 2003-03-10 | 2004-10-20 | �ն��繤��ʽ���� | 防玻璃破裂层压件和液晶显示器 |
TWI240233B (en) * | 2003-07-30 | 2005-09-21 | Dainippon Printing Co Ltd | Front plate for plasma display and plasma display |
JP2005325250A (ja) * | 2004-05-14 | 2005-11-24 | Nitto Denko Corp | 金属面貼付用感圧性粘着シート類および金属面を有する物品 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2195643B (en) * | 1986-07-21 | 1990-08-15 | Yokohama Rubber Co Ltd | Uv-curable resin compositions |
JPH0819391B2 (ja) * | 1992-11-30 | 1996-02-28 | 日東電工株式会社 | 感圧接着剤とその接着シ―ト類 |
US5905099A (en) * | 1995-11-06 | 1999-05-18 | Minnesota Mining And Manufacturing Company | Heat-activatable adhesive composition |
EP0942060B1 (en) * | 1996-12-04 | 2006-01-11 | Nitto Denko Corporation | Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
JP2000321426A (ja) * | 1999-05-12 | 2000-11-24 | Nitto Denko Corp | 広視野角偏光板及び液晶表示装置 |
US6635690B2 (en) * | 2001-06-19 | 2003-10-21 | 3M Innovative Properties Company | Reactive oligomers |
JP4043778B2 (ja) | 2001-12-19 | 2008-02-06 | 大日本印刷株式会社 | 電磁波遮蔽用シート |
JP3998975B2 (ja) * | 2001-12-28 | 2007-10-31 | 大日本印刷株式会社 | 電磁波遮蔽用シート |
JP2004022784A (ja) * | 2002-06-17 | 2004-01-22 | Nitto Denko Corp | ウエハ加工用粘着シート |
JP4208187B2 (ja) | 2002-10-28 | 2009-01-14 | 日東電工株式会社 | 粘着型光学フィルム、粘着型光学フィルムの製造方法および画像表示装置 |
JP2005089556A (ja) * | 2003-09-16 | 2005-04-07 | Nitto Denko Corp | 膜形成材料層、転写シート、誘電体層形成基板の製造方法、及び誘電体層形成基板 |
JP4527417B2 (ja) | 2004-02-26 | 2010-08-18 | リンテック株式会社 | 感圧接着剤組成物並びにそれを用いた粘着シート及び粘着性光学部材 |
JP4705768B2 (ja) * | 2004-08-23 | 2011-06-22 | リンテック株式会社 | 偏光フイルム用感圧接着剤組成物 |
WO2006090705A1 (ja) * | 2005-02-22 | 2006-08-31 | Asahi Glass Company, Limited | 粘着剤組成物および粘着フィルムならびに光学フィルタ |
-
2006
- 2006-11-13 JP JP2006306241A patent/JP5221027B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-15 KR KR1020070016042A patent/KR101335646B1/ko active IP Right Grant
- 2007-02-16 CN CN2007100789756A patent/CN101024758B/zh active Active
- 2007-02-16 US US11/675,991 patent/US20070196646A1/en not_active Abandoned
- 2007-02-16 TW TW96106196A patent/TWI419951B/zh active
-
2012
- 2012-07-27 US US13/560,588 patent/US8470123B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003336013A (ja) * | 2002-05-22 | 2003-11-28 | Mitsubishi Plastics Ind Ltd | 透明粘着剤、透明粘着シート及び積層体 |
CN1538223A (zh) * | 2003-03-10 | 2004-10-20 | �ն��繤��ʽ���� | 防玻璃破裂层压件和液晶显示器 |
TWI240233B (en) * | 2003-07-30 | 2005-09-21 | Dainippon Printing Co Ltd | Front plate for plasma display and plasma display |
JP2005325250A (ja) * | 2004-05-14 | 2005-11-24 | Nitto Denko Corp | 金属面貼付用感圧性粘着シート類および金属面を有する物品 |
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US8470123B2 (en) | 2013-06-25 |
KR20070082878A (ko) | 2007-08-22 |
TW200736362A (en) | 2007-10-01 |
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