TWI410327B - - Google Patents
Info
- Publication number
- TWI410327B TWI410327B TW099147178A TW99147178A TWI410327B TW I410327 B TWI410327 B TW I410327B TW 099147178 A TW099147178 A TW 099147178A TW 99147178 A TW99147178 A TW 99147178A TW I410327 B TWI410327 B TW I410327B
- Authority
- TW
- Taiwan
- Prior art keywords
- hbn
- graphene
- layers
- layer
- graphene layer
- Prior art date
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 4
- 229910021389 graphene Inorganic materials 0.000 abstract 4
- 229910052582 BN Inorganic materials 0.000 abstract 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1606—Graphene
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H2001/026—Recording materials or recording processes
- G03H2001/0268—Inorganic recording material, e.g. photorefractive crystal [PRC]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/2403—Layers; Shape, structure or physical properties thereof
- G11B7/24035—Recording layers
- G11B7/24044—Recording layers for storing optical interference patterns, e.g. holograms; for storing data in three dimensions, e.g. volume storage
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
- G11B7/244—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising organic materials only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29209810P | 2010-01-04 | 2010-01-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201136769A TW201136769A (en) | 2011-11-01 |
TWI410327B true TWI410327B (zh) | 2013-10-01 |
Family
ID=44224182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099147178A TW201136769A (en) | 2010-01-04 | 2010-12-31 | Graphene and hexagonal boron nitride devices |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110163298A1 (zh) |
CN (1) | CN102184942B (zh) |
TW (1) | TW201136769A (zh) |
Families Citing this family (54)
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US8277936B2 (en) * | 2008-12-22 | 2012-10-02 | E I Du Pont De Nemours And Company | Hexagonal boron nitride compositions characterized by interstitial ferromagnetic layers, process for preparing, and composites thereof with organic polymers |
CN102134469A (zh) * | 2010-01-26 | 2011-07-27 | 宋健民 | 含六方氮化硼的导热绝缘胶 |
GB201004554D0 (en) * | 2010-03-18 | 2010-05-05 | Isis Innovation | Superconducting materials |
US8592291B2 (en) * | 2010-04-07 | 2013-11-26 | Massachusetts Institute Of Technology | Fabrication of large-area hexagonal boron nitride thin films |
CN102385987A (zh) * | 2010-08-31 | 2012-03-21 | 海洋王照明科技股份有限公司 | 一种电容储能器件及其制备方法 |
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GB201104824D0 (en) * | 2011-03-22 | 2011-05-04 | Univ Manchester | Structures and methods relating to graphene |
KR101962870B1 (ko) * | 2011-03-22 | 2019-03-27 | 더 유니버시티 오브 맨체스터 | 트랜지스터 소자 및 제조를 위한 물질들 |
US20130078424A1 (en) * | 2011-07-22 | 2013-03-28 | Guqiao Ding | Hexagonal Boron Nitride Substrate With Monatomic Layer Step, And Preparation Method And Application Thereof |
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KR101878745B1 (ko) | 2011-11-02 | 2018-08-20 | 삼성전자주식회사 | 에어갭을 구비한 그래핀 트랜지스터, 그를 구비한 하이브리드 트랜지스터 및 그 제조방법 |
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US9174413B2 (en) | 2012-06-14 | 2015-11-03 | International Business Machines Corporation | Graphene based structures and methods for shielding electromagnetic radiation |
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CN104058388A (zh) * | 2013-03-18 | 2014-09-24 | 海洋王照明科技股份有限公司 | 氮掺杂石墨烯薄膜及其制备方法与电容器 |
KR102100925B1 (ko) * | 2013-03-22 | 2020-04-14 | 삼성전자주식회사 | 기판 구조체, 상기 기판 구조체를 형성하는 방법, 및 이를 구비하는 전기소자 |
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KR102140148B1 (ko) | 2013-11-29 | 2020-07-31 | 삼성전자주식회사 | 이차원 물질을 포함하는 메모리소자와 그 제조방법 및 동작방법 |
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US10256448B2 (en) | 2014-07-10 | 2019-04-09 | The Board Of Trustees Of The Leland Stanford Junior University | Interfacial engineering for stable lithium metal anodes |
CN104637898B (zh) * | 2014-12-08 | 2019-01-11 | 上海大学 | 集成电路器件的导热复合材料层及电子器件导热结构封装方法 |
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CN107941385B (zh) * | 2017-08-14 | 2023-12-08 | 中北大学 | 一种基于石墨烯压阻结的压力传感器 |
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CN111443504B (zh) * | 2020-03-13 | 2022-02-18 | 西安电子科技大学 | 一种中红外电压可调节滤波器及其制备方法、滤波方法 |
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-
2010
- 2010-11-29 US US12/955,505 patent/US20110163298A1/en not_active Abandoned
- 2010-12-31 TW TW099147178A patent/TW201136769A/zh unknown
- 2010-12-31 CN CN201010617668.2A patent/CN102184942B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1288351A2 (en) * | 2001-08-29 | 2003-03-05 | GSI Creos Corporation | Carbon fiber, electrode material for lithium secondary battery, and lithium secondary battery |
Also Published As
Publication number | Publication date |
---|---|
US20110163298A1 (en) | 2011-07-07 |
TW201136769A (en) | 2011-11-01 |
CN102184942A (zh) | 2011-09-14 |
CN102184942B (zh) | 2013-03-20 |
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