TWI399634B - 用於伺服器專壓冷卻系統的冷卻列封裝 - Google Patents
用於伺服器專壓冷卻系統的冷卻列封裝 Download PDFInfo
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- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
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Description
本發明一般係關於數據中心之冷卻系統。
網際網路服務(如:網頁電子郵件、網頁搜尋、網頁位址主控以及網路影音分享)的快速成長使得數據中心內的伺服器對其計算與儲存功率之需求高度提升。當伺服器的性能提升時,伺服器的功率消耗也會增加,即使已致力於低功率積體電路設計。舉例而言,最廣泛使用之伺服器處理器的其中一種,AMD的Opteron處理器係以高達95瓦之功率運作,Intel的Xeon伺服器處理器則於110與165瓦之間運作;然而,處理器僅為伺服器的一部分,伺服器中的其他部分(例如:冷卻風扇與儲存裝置)也消耗額外的功率。
伺服器一般係放置在數據中心的機架中,而機架有多種不同的實體配置方式;一種典型的機架配置包括了固定軌,而多個設備單元(例如:伺服器葉片)則固定於其上並垂直堆疊於機架內。一種最廣為使用的19-英吋機架係用於固定如1U或2U伺服器的設備之標率化系統,在此類型之機架上的機架單元一般為1.75英吋高及19英吋寬。可以裝設於一機架單元中的伺服器一般稱為1U伺服器;在數據中心中,標準機架通常與伺服器、儲存裝置、切換器及/或電信設備緊密共居。
數據中心機房內應維持於使伺服器得以可靠操作之可用溫度與濕度,該伺服器一般具有引入空氣通過底架以供冷卻之用之冷卻風扇。與由Opteron或Xeon處理
器提供功率之伺服器緊密堆疊之機架的功率消耗係介於7,000與15,000瓦之間。因此,伺服器機架會產生非常集中的熱負荷。機架中之伺服器所散出的熱量會被排至數據中心室,由緊密共居之機架所共同產生的熱氣會對機架中設備的性能與可靠性產生不良的影響,這是因為其仰賴用於冷卻之周圍空氣。因此,在高效數據中心的設計上,加熱、通風及空氣調節(HVAC)系統常是一個重要的部分。
一般數據中心消耗10至40百萬瓦的功率,大部分的能量消耗係分配於伺服器與HVAC系統之間的運作。HVAC系統估計約為數據中心使用功率的25至40%之間。對於消耗40百萬瓦功率之數據中心而言,HVAC系統係消耗10至16百萬瓦之功率。利用降低能量使用之有效冷卻系統與方法可明顯節省成本,舉例而言,使HVAC系統的功率消耗量從數據中心所使用之25%降低至10%可節省約6百萬瓦的功率消耗,其足以供應數千戶住宅使用。
在數據中心室中,伺服器機架一般係配置成列,並具有交錯於其間的冷熱通道。所有的伺服器都裝設在機架上以達到一種前對後之氣流態樣,其從位於機架前方之冷卻列引入調節空氣,並透過機架後方的熱列將熱排出。通常會使用高起的地板設計來完成地板下空氣分佈系統,其中冷卻空氣係透過沿著冷卻列之高起地板的通風口而供應。
數據中心之有效冷卻的一項重要因素在於管理數據中心內部的氣流與循環。電腦室空調(CRAC)單元透過包含機架間通風口之地磚而供應冷空氣;除了伺服
器之外,CRAC單元也同時消耗大量功率。一個CRAC單元具有多達三部5馬力的馬達,且需要多達150部CRAC單元來冷卻一數據中心。CRAC單元於數據中心中共同消耗了大量功率。舉例而言,在具有熱冷列配置之一數據中心室中,來自熱列的熱空氣係自熱列移出並循環至CRAC單元。CRAC單元冷卻空氣,該CRAC單元的馬達所啟動之風扇將冷卻空氣供應至高起地板所限定之地板下空間。驅動冷卻空氣進入地板下空間所產生的壓力使得冷卻空氣向上通過地板通風口,並將其供應至伺服器機架所面對的冷卻管道。為達成足夠的氣流速率,可安裝數百部強力CRAC單元遍布於一般數據中心室中。然而,由於CRAC單元一般是裝設在數據中心室的角落,這對其有效提升氣流速率之能力有不利影響。建造高起地板的成本一般也較高,且由於空氣於數據中心內部的移動效率不佳,因而其冷卻效率一般較低。此外,在設計及建造數據中心時需要小心計畫地板通風口的位置,以避免供應空氣之短路。而在移除地磚以固定熱點時也會對系統產生問題。
本發明提供了與有效冷卻數據中心有關的系統及方法。在一特定具體實施例中,本發明提供了一冷卻列封裝結構,其包括配置以介接一或多個伺服器機架之至少一伺服器機架埠,以及連接至該冷卻列封裝結構之頂部表面的冷卻模組;該等伺服器機架埠係配置以接合該等伺服器機架,使得該等伺服器機架的前表面與該冷卻列封裝結構所限定之內部空間介接。在部分具體實施例
中,伺服器機架埠與伺服器機架係透過夾鉗及/或密封襯墊而緊密連接,以減少空氣滲入及滲出該冷卻列封裝結構。
本發明的一些具體實施例利用裝設於機架上的伺服器的冷卻風扇,從冷卻列封裝結構引入來自伺服器機架前表面之冷空氣,並從伺服器機架的背側排出熱空氣。本發明之一些具體實施例中,不需要高起地板以及將冷卻空氣強引至地板下空間的風扇與其他設備;裝設在冷卻列封裝結構頂部之冷卻模組係經由裝設在冷卻模組內部之冷卻線圈而對熱空氣進行冷卻。在一些具體實施例中,可於線圈內使用冷卻水來與冷卻模組中的熱空氣進行熱交換。
在本發明一具體實施例中,系統與方法係關於對數據中心伺服器冷卻室中熱空氣進行冷卻、而不將外部空氣引入其中。伺服器風扇所排出的熱空氣進入位於冷卻列封裝結構頂部之冷卻模組,該熱空氣係由該冷卻模組內以水為基礎之冷卻線圈予以冷卻,而經冷卻之空氣則透過重力以及在冷卻列封裝結構之內部空間內的較低氣壓而進入冷卻列封裝結構。伺服器風扇從連接至冷卻列封裝結構的伺服器機架埠引入冷空氣以冷卻伺服器,並從伺服器機架背側排出熱空氣。
在本發明的其他具體實施例中,系統與方法係涉及混合外部冷卻空氣來冷卻伺服器。在一具體實施例中,數據中心中的頂篷阻尼器係由一溫度控制單元加以控制,並於外部溫度到達特定臨界值時開啟。外部空氣進入數據中心並通過裝設於冷卻列封裝結構頂部的冷卻模組。伺服器風扇從冷卻列封裝結構引入冷空氣,熱空
氣係藉由頂篷排氣扇而排至外部。在一些具體實施例中,為了控制數據中心伺服器冷卻室中空氣的濕度,特別是在外部空氣無法符合伺服器與其他設備之操作需求時,可使用增濕器來調節外部空氣。然而近年來,伺服器設備製造者已因技術的進展而明顯放寬了濕度要求。
以下實施方式與伴隨圖式有助於進一步瞭解本發明各種具體實施例之本質與優勢。
以下示例性具體實施例及其態樣係結合設備、方法及系統加以描述與說明,然其僅用於說明示例之用,並不限制其範疇。
第一圖說明了一示例性冷卻模組100與一示例性冷卻列封裝結構106。該冷卻列封裝結構106可具有一框架、平板、門以及伺服器機架埠。伺服器機架埠係位於該冷卻列封裝結構106上之開口,其可連接至伺服器機架;冷卻列封裝結構106可由多種材料製成,例如鋼材、複合材料、或碳材,其產生一外殼,該外殼限定了包括至少一伺服器機架埠之一內部空間,該機架埠使機架固定單元得以與該內部空間介接。在一些具體實施例中,冷卻列封裝結構106可直接固定至地板表面,在冷卻空氣之數據中心冷卻室中無需高起地板。
冷卻模組100可位於冷卻列封裝結構106的頂部並連接至冷卻列封裝結構106的頂部表面。冷卻模組100包括一或多個冷卻線圈102,通過冷卻線圈102內部之液體係用以對通過冷卻模組100、相對較熱之空氣進行
熱交換,藉以冷卻空氣。在一具體實施例中,冷卻模組100更包括一外殼,而冷卻線圈102即置於其內;冷卻模組外殼可具有一或多個開口104,空氣透過該等開口進入外殼。在一些具體實施例中,開口104可包括空氣過濾器。冷卻模組外殼可具有一或多個開口,其連接至冷卻列封裝結構106的頂部表面,冷空氣係通過這些開口流出冷卻模組,並進入冷卻列封裝結構所限定之內部空間。
在一些具體實施例中,係於冷卻線圈102內部使用水來作為熱交換器。水幫浦、水冷卻設備、以及相關之配管(圖中未示)將冷卻水供應至冷卻線圈102。在其他具體實施例中,可於冷卻線圈102內部使用其他類型的液體(例如:水-乙二醇溶液、蒸汽或冷媒)來作為熱交換器。
在一些具體實施例中,冷卻線圈102可為S型線路之管道系統;在其他具體實施例中,冷卻線圈102可為其他形狀如直線線路之管道系統。根據冷卻列封裝結構106的大小、冷卻需求、氣流速度以及冷卻線圈102的物理特性,可改變冷卻模組100中冷卻線圈的數量。在一具體實施例中,係於冷卻模組100中使用兩個冷卻線圈。
由於冷空氣一般比熱空氣重,因此由冷卻線圈102所冷卻之冷空氣一般會向下移動而進入位於冷卻模組100下方並與其連接之冷卻列封裝結構106所限定的內部空間。冷卻列封裝結構106包括了限定一內部空間之外殼,該外殼包括至少一伺服器機架埠110,其係配置以與複數伺服器機架介接。伺服器機架埠110係配置以
與伺服器機架埠介接,使得伺服器機架之一前表面係與冷卻列封裝結構106的內部空間相交。在一具體實施例中,可將六個標準伺服器機架連接至一伺服器機架埠110。而在另一具體實施例中,將十二個標準伺服器機架連接於伺服器機架埠110。在一些具體實施例中,可透過一或多個夾鉗112來將伺服器機架與伺服器機架埠110連接在一起。在其他具體實施例中,伺服器機架與伺服器機架埠110可彼此相鄰放置。在一些其他具體實施例中,可使用如襯墊之密封材料來緊密連接伺服器機架埠110與伺服器機架。伺服器係裝設在機架中以達成前對後之氣流型態,其可從位於前方之冷卻列封裝結構106將調節空氣引入,並排熱於機架後方外。
在一具體實施例中,冷卻列封裝結構106可包括一個以上的伺服器機架埠110;伺服器機架埠110可接合伺服器機架,使得伺服器的前表面或裝設在伺服器中的其他裝置得以與冷卻列封裝結構106所限定之內部空間介接。這種配置達成了前對後之氣流態樣,其中伺服器的冷卻風扇或其他機架固定單元可從內部空間引出空氣,並將由處理器及其他組件所加熱之空氣排出背板外,如第四圖所示。在一些具體實施例中,伺服器機架與冷卻列封裝結構實質上是密封的,在冷卻列封裝結構106的內部空間內的調節冷空氣係由伺服器風扇引入伺服器內以冷卻伺服器。在其他具體實施例中,伺服器機架與冷卻列封裝結構106係彼此相鄰放置,而使冷卻列封裝結構106的內部空間內的調節冷空氣可由伺服器內部的伺服器風扇引至伺服器。相對較熱的空氣係循環至位於冷卻列封裝結構106頂部的冷卻模組100,並與冷
卻線圈102進行熱交換;來自冷卻模組100的冷空氣則沒入冷卻列封裝結構106,並被伺服器內部的伺服器風扇引至伺服器後方。在一些具體實施例中,伺服器機架係鮮少與伺服器及其他設備共居。由於伺服器與其他設備係垂直堆疊於機架內,空缺會對於冷卻到封裝結構的內部空間產生開放間隙,因而冷空氣會從冷卻列封裝結構106滲出,而熱空氣則循環回到內部空間,冷卻效率因此而降低。為了避免空氣漏滲,係藉由固定至伺服器機架之平板來阻隔間隙,其可避免空氣漏出並經由間隙進入冷卻列封裝結構。
在一具體實施例中,冷卻列封裝結構106可於其底部進一步包括穩定度控制單元114;穩定度控制單元114係包括在自然災害(如地震)時可用於抗震之組件。在一些具體實施例中,穩定度控制單元114具有捲動裝置,其可被快速釋放以輕易移動冷卻列封裝結構106。在使用穩定度控制單元114時,冷卻列封裝結構106會自地面高起,因此,冷空氣會滲出,而熱空氣從冷卻列封裝結構106的底側進入。為了避免空氣滲漏,在一具體實施例中,可用密封底部表面之平板包圍冷卻列封裝結構106的底側,而穩定度控制單元114即安裝於該平板上。
在一具體實施例中,可於冷卻列封裝結構106的外殼上裝設一或多個門108;門108可以被開啟及關閉,使得數據中心人員可以進入冷卻列封裝結構以進行各種工作(例如:進行伺服器維護)。可將門108隔離,以避免冷空氣滲出冷卻列封裝結構106。
冷卻列封裝結構106的大小可根據伺服器機架所需
數量、伺服器的冷卻需求等加以彈性調整。在一具體實施例中,可有六至十二個標準伺服器機架連接至冷卻列封裝結構106的各別伺服器機架埠110。而另有六至十二個標準伺服器機架連接至冷卻列封裝結構之對側的伺服器機架埠。相對的伺服器機架埠之間的距離係4英呎,冷卻列封裝結構106的高度係12英呎,而深度為12英呎。
第二圖說明了一示例性冷卻模組200、一冷卻列封裝結構206、以及整合伺服器機架208與210。此例之系統係與第一圖所示者相似,除了伺服器機架係該系統之整合部分外。在此具體實施例中,由於伺服器機架係冷卻列封裝結構206的一部分,故不再需要冷卻列封裝結構206與伺服器機架208、210之間的連接與密封。伺服器係裝設至整合伺服器機架208與210中,以達成前對後氣流態樣。整合伺服器機架208與210的前表面係與冷卻列封裝結構206的內部空間相交。在伺服器內部的伺服器風扇從冷卻列封裝結構206引入冷空氣以冷卻伺服器,並從伺服器機架後方吹出相對較熱的空氣。熱空氣接著透過一或多個開口204而被循環至冷卻模組200,並與一或多個冷卻線圈202進行熱交換。冷卻模組200係位於冷卻列封裝結構206的頂部,且經由在冷卻列封裝結構206頂側之開口而連接至冷卻列封裝結構206的頂部表面與冷卻模組200的底側。冷空氣一般會向下移動,特別是在伺服器風扇從在冷卻列封裝結構206之內部空間中產生較低氣壓之冷卻列封裝結構引入冷空氣時。
第三圖說明了一種示例性冷卻模組300、冷卻列封
裝結構302、伺服器機架304以及置於伺服器機架上之一示例性伺服器306。此例之系統係與第二圖所示者相似。調節之冷空氣經由置於冷卻列封裝結構302頂部的冷卻模組300而進入冷卻列封裝結構302中。伺服器306內的伺服器風扇從冷卻列封裝結構302的內部空間引入調節之冷空氣,並冷卻伺服器306。
第四圖說明了一種示例性冷卻模組400、冷卻線圈402、伺服器404以及在伺服器404內部的伺服器風扇406。來自冷卻模組400與冷卻線圈402的調節冷空氣係藉由伺服器風扇406而引入,並通過伺服器404以冷卻伺服器。然後相對較熱的空氣藉由伺服器風扇406而被吹出伺服器404。
如上所述,第一圖與第二圖所示之冷卻系統可於數據中心伺服器冷卻室所限定之內部空間中運作,以從內部空間引入空氣並提供冷卻空氣至冷卻列封裝結構106的內部。然而,在某些實施方式中,冷卻系統係可結合含有氣流控制器之數據中心冷卻室而運作,其可使用外部空氣。第五圖說明了一種示例性數據中心伺服器冷卻室500,其具有一或多個頂篷排氣風扇516、控制外部進氣口之頂篷阻尼器514、混合腔室518、以及控制循環空氣進入混合腔室518中之阻尼器512。冷卻模組502包括一或多個冷卻線圈504,並連接至混合腔室518。冷卻列封裝結構506的頂部表面係連接至冷卻模組502。在冷卻列封裝模組506之外殼上的伺服器機架埠508係連接至伺服器機架510。伺服器可裝設在伺服器機架中以達成前對後氣流態樣。伺服器機架的前表面與冷卻列封裝結構506的內部空間相交。在伺服器內部的
伺服器風扇從冷卻列封裝結構506引入冷空氣,以冷卻伺服器並將熱空氣從伺服器機架排出。
伺服器冷卻室500可以兩種模式運作:在一種模式中,無外部空氣被引入伺服器冷卻室500,從伺服器排出的熱空氣係被循環回到混合腔室518與冷卻模組502。在另一種模式中,係引入外部冷空氣於伺服器冷卻室500中。頂篷阻尼器514係開啟,而在混合腔室上的阻尼器512則為關閉;外部的冷空氣會通過冷卻模組502並進入冷卻列封裝結構506中。
在一具體實施例中,係關閉頂篷阻尼器514並開啟在混合腔室上的阻尼器512。伺服器釋出的部分熱空氣係經一或多個頂篷排氣風扇516排出伺服器冷卻室500外部,而部分的熱空氣則經由開啟的阻尼器512進入混合腔室518中。在混合腔室內部的熱空氣係被引至冷卻模組502,並與冷卻線圈504進行熱交換。冷空氣接著透過重力以及在冷卻列封裝結構506之內部空間內的較低氣壓而進入冷卻列封裝結構506。
在另一具體實施例中,頂篷阻尼器512係開啟而在混合腔室上的阻尼器512係關閉。外部冷卻空氣經由開啟的阻尼器514進入混合腔室518中,通過冷卻模組504,並沒入冷卻列封裝結構506的內部空間。
在一些具體實施例中,阻尼器512與514的開啟與關閉可由溫度控制單元加以控制,當外部溫度達一適當程度,溫度控制單元會開啟頂篷阻尼器514,以使外部空氣進入室內,並關閉在混合腔室上的阻尼器512,以避免伺服器排出的熱空氣進入混合腔室中。當外部溫度對於伺服器冷卻室500而言太熱時,溫度控制單元會關
閉頂篷阻尼器514以避免將外部熱空氣引入室內,並開啟阻尼器512以使熱空氣從伺服器背部排至混合腔室。利用外部的自然冷空氣可大幅降低數據中心的功率消耗,這是因為其無須對經過冷卻模組100而循環之液體進行冷卻。在一些具體實施例中,阻尼器512及514的開啟與關閉、以及頂篷排氣風扇516的運作皆由一電子裝置予以控制,例如藉由可監控伺服器冷卻室內外溫度並操作阻尼器與風扇之溫度控制單元,以達成對該室之最佳冷卻效率。
可根據數據中心的位置來調整外部冷空氣的濕度;當外部冷空氣的濕度為低時,外部空氣必需加以調節以使濕度程度符合足供伺服器可靠操作之需求。雖然伺服器製造者已明顯放寬對伺服器設備可靠操作之濕度需求,但對於數據中心中的設備之性能及可靠度而言,數據中心伺服器冷卻室之周圍氣體的適當濕度仍為重要。在一些具體實施例中,可於混合腔室518中裝設一或多個增濕器,以對通過混合腔室的空氣濕度進行調即。
第六圖說明了另一種示例性數據中心伺服器冷卻室600,其具有一或多個頂篷排氣風扇616、控制外部進氣之頂篷阻尼器614、混合腔室602、以及控制熱空氣循環進入混合腔室602之阻尼器612;在此一具體實施例中,冷卻線圈604係裝設於混合腔室602內部。混合腔室602係經由一連接外殼618而連接至冷卻列封裝結構606。冷卻列封裝結構606上的伺服器機架埠610係連接至伺服器機架608。伺服器係裝設於伺服器機架中以達成前對後氣流態樣。伺服器機架608的前表面係
與冷卻列封裝結構606的內部空間相交。在伺服器內部的伺服器風扇從冷卻列封裝結構606引入冷空氣以冷卻伺服器,並將熱空氣從伺服器機架的背部排出。
在此具體實施例中,伺服器冷卻室可根據外部溫度而有兩種氣流模式;在一模式中,外部冷空氣係經由開啟的頂篷阻尼器614而被引入混合腔室602中,並由冷卻線圈604加以調節。在一些具體實施例中,增濕器可被裝設於混合腔室602中以增加外部空氣的濕度。經調節之冷空氣透過重力以及在冷卻列封裝結構606之內部空間內的較低氣壓而進入冷卻列封裝結構606。裝設在機架上之伺服器的伺服器風扇從冷卻列封裝結構606引入冷空氣以對伺服器進行冷卻。當外部空氣為熱且不適於冷卻之用時,系統會以另一模式運作,藉以關閉頂篷阻尼器以避免外部熱空氣進入混合腔室602。然而阻尼器602係為開啟,伺服器冷卻室內的熱空氣即通過阻尼器612而進入混合腔室中,並與冷卻線圈604進行熱交換。在一些具體實施例中,電子裝置監控伺服器冷卻室600內外的溫度,並可根據內部與外部的溫度而開啟或關閉阻尼器612與614以及頂篷排氣風扇616;同一電子裝置可進一步監控伺服器冷卻室內外的濕度程度,並控制裝設於混合腔室602內之增濕器。
第七圖說明了一種與第六圖所示之數據中心伺服器冷卻室相似的伺服器冷卻室700。然而該伺服器冷卻室700包括多個冷卻模組702與多個冷卻列封裝結構706、一或多個頂篷排氣風扇720、一或多個頂篷阻尼器718、具有一或多個阻尼器724之一或多個混合腔室716、以及多個伺服器機架710。多個冷卻模組702係更
由外殼722而連接至混合腔室716。在冷卻列封裝結構706的外殼上的伺服器機架埠708係連接伺服器710。該系統以第四圖所述之兩種模式運作。來自混合腔室的空氣在進入各冷卻列封裝結構706前,係藉由每一個冷卻模組的冷卻線圈704而加以冷卻。
第八圖說明了一種伺服器冷卻室800,其具有一混合腔室802與多個冷卻列封裝結構806。冷卻線圈804係裝設於混合腔室802內。此系統係以如第六圖所示之兩種模式運作:一或多個頂篷阻尼器818可根據外部空氣的溫度而被開啟或關閉。一或多個阻尼器816係開啟或關閉以控制伺服器冷卻室800內部的熱空氣循環。每一個冷卻列封裝結構806的頂部表面係經由外殼822而連接至混合腔室802。來自混合腔室的空氣在經由外殼822進入各別的冷卻列封裝結構806之前係由冷卻線圈804加以冷卻。然而,與第七圖所示之伺服器冷卻室不同的是,在各冷卻列封裝結構806的頂部並不裝設各別的冷卻模組。在冷卻列封裝結構806的外殼上之伺服器機架埠808係連接至伺服器機架810。伺服器係裝設於伺服器機架810內以達成前對後氣流態樣。在伺服器內部的伺服器風扇係從每一個各別的冷卻列封裝結構806引入冷空氣以冷卻伺服器,並從伺服器機架背部將熱空氣排出。
第九圖說明了另一種伺服器冷卻室900,其具有多個冷卻模組902與多個冷卻列封裝結構906、一或多個頂篷排氣風扇920、一或多個頂篷阻尼器918、具有阻尼器914之一或多個混合腔室916、以及多個伺服器機架910。系統係以如第八圖所示之兩種模式運作。然而
不同於第八圖所示之伺服器冷卻室的是,除了各冷卻模組902中的冷卻線圈904之外,也同時在混合腔室916裝設一或多個冷卻線圈924。冷卻模組透過外殼922而連接至一混合腔室916,來自混合腔室之空氣係由混合腔室916中的冷卻線圈924進行冷卻,且在進入每一個各別的冷卻列封裝結構906之前,再進一步由每一個冷卻模組902進行冷卻。
本發明已參照特定具體實施例而加以解釋。舉例而言,在已參照特定組件與組態來說明本發明之具體實施例時,本領域技術人士將可得知亦可使用組件與組態的不同結合。對於該領域中具通常知識之人士而言,顯然可知其他的具體實施例,因此本發明不應由其予以限制,而應為如後附申請專利範圍所指定者。
100‧‧‧冷卻模組
102‧‧‧冷卻線圈
104‧‧‧開口
106‧‧‧冷卻列封裝結構
108‧‧‧門
110‧‧‧伺服器機架埠
112‧‧‧夾鉗
114‧‧‧穩定度控制單元
200‧‧‧冷卻模組
202‧‧‧冷卻線圈
204‧‧‧開口
206‧‧‧冷卻列封裝結構
208‧‧‧整合伺服器機架
210‧‧‧整合伺服器機架
300‧‧‧冷卻模組
302‧‧‧冷卻列封裝結構
304‧‧‧伺服器機架
306‧‧‧伺服器
400‧‧‧冷卻模組
402‧‧‧冷卻線圈
404‧‧‧伺服器
406‧‧‧伺服器風扇
500‧‧‧數據中心伺服器冷卻室
502‧‧‧冷卻模組
504‧‧‧冷卻線圈
506‧‧‧冷卻列封裝結構
508‧‧‧伺服器機架埠
510‧‧‧伺服器機架
512‧‧‧阻尼器
514‧‧‧頂篷阻尼器
516‧‧‧頂篷排氣風扇
518‧‧‧混合腔室
600‧‧‧數據中心伺服器冷卻室
602‧‧‧混合腔室
604‧‧‧冷卻線圈
608‧‧‧伺服器機架
606‧‧‧冷卻列封裝結構
610‧‧‧伺服器機架埠
612‧‧‧阻尼器
614‧‧‧阻尼器
616‧‧‧頂篷排氣風扇
618‧‧‧連接外殼
700‧‧‧伺服器冷卻室
702‧‧‧冷卻模組
704‧‧‧冷卻線圈
706‧‧‧冷卻列封裝結構
708‧‧‧伺服器機架埠
710‧‧‧伺服器機架
716‧‧‧氵昆合腔室
718‧‧‧頂篷阻尼器
720‧‧‧頂篷排氣風扇
722‧‧‧外殼
724‧‧‧阻尼器
800‧‧‧伺服器冷卻室
802‧‧‧混合腔室
804‧‧‧冷卻線圈
806‧‧‧冷卻列封裝結構
808‧‧‧伺服器機架埠
810‧‧‧伺服器機架
816‧‧‧阻尼器
818‧‧‧頂篷阻尼器
822‧‧‧外殼
900‧‧‧伺服器冷卻室
902‧‧‧冷卻模組
904‧‧‧冷卻線圈
906‧‧‧冷卻列封裝結構
910‧‧‧伺服器機架
914‧‧‧阻尼器
916‧‧‧混合腔室
918‧‧‧頂篷阻尼器
920‧‧‧頂篷排氣風扇
922‧‧‧外殼
924‧‧‧冷卻線圈
第一圖係說明一示例性冷卻列封裝結構與一示例性冷卻模組之圖式;第二圖係說明具有整合伺服器機架之一示例性冷卻列封裝結構與一示例性冷卻模組之圖式;第三圖係說明具有整合伺服器機架之一示例性冷卻列封裝結構、置於該等伺服器機架其中之一上之一示例性伺服器與一示例性冷卻模組之圖式;第四圖係說明具有可引出由一示例性冷卻模組調節的冷空氣之伺服器風扇之一示例性伺服器的圖式;第五圖係說明一示例性數據中心伺服器冷卻室之圖式,該冷卻室具有一冷卻列封裝結構、一冷卻模組、最高處上之排氣風扇以及具有可控制室內與室外空氣
循環之阻尼器的混合腔室;第六圖係說明具有與一混合腔室整合之冷卻模組的示例性數據中心伺服器冷卻室之圖式;第七圖係說明一示例性數據中心伺服器冷卻室之圖式,其具有多個冷卻列封裝結構與多個冷卻模組、最高處上之排氣風扇以及具有可控制室內與室外空氣循環之阻尼器的混合腔室;第八圖係說明具有多個冷卻列封裝結構以及與一具有阻尼器的混合腔室整合之冷卻模組的示例性數據中心伺服器冷卻室;第九圖係說明一示例性數據中心伺服器冷卻室之圖式,其具有多個冷卻列封裝結構與多個冷卻模組、最高處上之排氣風扇以及具有與冷卻模組整合之阻尼器的混合腔室。
100‧‧‧冷卻模組
102‧‧‧線圈
104‧‧‧開口
106‧‧‧冷卻列封裝結構
108‧‧‧門
110‧‧‧伺服器機架埠
112‧‧‧夾鉗
114‧‧‧穩定度控制單元
Claims (26)
- 一種伺服器冷卻裝置,包括:一外殼,其限定一內部空間且包括至少一伺服器機架埠,該伺服器機架埠係配置以接合一機架,使得裝設於該機架內之一或多個機架固定單元與該內部空間介接;一冷卻模組,其操作以從該外殼之一頂部表面供應冷卻空氣至該外殼所限定之該內部空間;以及一門,係使得人員得以進入該外殼之該內部空間。
- 如申請專利範圍第1項之冷卻裝置,其中該至少一伺服器機架埠係配置以與一伺服器機架之一外部周圍實質相符。
- 如申請專利範圍第1項之冷卻裝置,其中該伺服器機架埠在安裝至該等伺服器機架時係可實質密封。
- 如申請專利範圍第1項之冷卻裝置,其中該至少一伺服器機架埠包括一襯墊,其係配置以將一伺服器機架實質密封於一對應的伺服器機架埠中。
- 如申請專利範圍第1項之冷卻裝置,其中該冷卻模組更包括:一或多個整合線圈,用以冷卻該冷卻模組內的周圍空氣;一或多個整合阻尼器,用以調整進出該冷卻模組的空氣流量;一控制單元,其係操作以控制該等整合阻尼器之運作。
- 如申請專利範圍第5項之冷卻裝置,其中在該等整合 線圈內部使用液體以冷卻周圍空氣。
- 如申請專利範圍第6項之冷卻裝置,其中該等整合阻尼器係由一溫度控制單元加以控制。
- 如申請專利範圍第1項之冷卻裝置,其中該伺服器機架埠包括一或多個機架,且其上放置一或多個伺服器。
- 一種伺服器冷卻室,包括:一或多個開口,在該伺服器冷卻室內部與外部的空氣係藉此進行交換;一或多個伺服器機架,其上放置一或多個伺服器;一或多個冷卻裝置,其安裝至該一或多個伺服器機架並安裝至一或多個進氣口,各冷卻裝置包括:一外殼,其包括至少一伺服器機架埠,配置以與一或多個伺服器機架介接,該外殼限定一內部空間;一冷卻模組,其操作以從該外殼之一頂部表面供應冷卻空氣至該外殼所限定之該內部空間;以及其中該冷卻模組包括一冷卻單元,其係操作以冷卻供應至該內部空間的空氣。
- 如申請專利範圍第9項之伺服器冷卻室,其中該至少一伺服器機架埠係配置以與該一或多個伺服器機架介接,使得該一或多個伺服器機架之一前表面與該內部空間相交。
- 如申請專利範圍第9項之伺服器冷卻室,其中該進氣口包括與一溫度控制單元相應之至少一阻尼器。
- 如申請專利範圍第9項之伺服器冷卻室,其中該一或 多個伺服器中每一個伺服器包括一或多個冷卻風扇,其係操作以從該冷卻裝置引出冷空氣。
- 如申請專利範圍第9項之伺服器冷卻室,其中該至少一伺服器機架埠係配置以與一伺服器機架之一外部周圍實質相符。
- 如申請專利範圍第13項之伺服器冷卻室,其中該等伺服器機架與該等伺服器機架埠間之安裝是實質密封的。
- 如申請專利範圍第14項之伺服器冷卻室,其中該至少一伺服器機架埠包括一襯墊,其係配置以將一伺服器機架實質密封於一對應的伺服器機架埠中。
- 如申請專利範圍第9項之伺服器冷卻室,其中該冷卻模組更包括:一或多個整合線圈,用以冷卻該冷卻模組內的周圍空氣;一或多個整合阻尼器,用以調整進出該冷卻模組的空氣流量;一控制單元,其係操作以控制該等整合阻尼器之運作。
- 如申請專利範圍第16項之伺服器冷卻室,其中在該等整合線圈內部係使用液體以冷卻周圍空氣。
- 如申請專利範圍第16項之伺服器冷卻室,其中該等整合阻尼器係由一溫度控制單元加以控制。
- 如申請專利範圍第9項之伺服器冷卻室,其中該一或多個進氣口中每一個進氣口係與複數之該等冷卻裝置連接。
- 一種伺服器冷卻方法,包括: 實質上封裝具有至少一側向部分之一內部空間,該內部空間係由至少一伺服器機架之前表面所限定,其中該至少一伺服器機架包括固定於其中的一或多個伺服器;以及從所限定之空間的頂部引入一冷空氣源,其中固定於該伺服器機架中的該一或多個伺服器包括一冷卻風扇,該冷卻風扇係操作以從該內部空間自該冷空氣源引入經冷卻之空氣。
- 如申請專利範圍第20項之方法,其中該伺服器機架係安裝至所限定之空間。
- 如申請專利範圍第21項之方法,其中該伺服器機架與所限定之空間之間的安裝是實質密封的。
- 如申請專利範圍第22項之方法,其中係使用一或多個襯墊來實質密封該安裝。
- 如申請專利範圍第20項之方法,其中該冷空氣源更包括:一或多個整合線圈,用以冷卻該冷卻模組內的周圍空氣;一或多個整合阻尼器,用以調整進出該冷卻模組的空氣流量;用於控制該等整合阻尼器之裝置。
- 如申請專利範圍第24項之方法,其中在該等整合線圈內部係使用液體以冷卻周圍空氣。
- 如申請專利範圍第24項之方法,其中該等整合阻尼器係由一溫度控制單元加以控制。
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