TWI396777B - Electrolyte impregnation device and impregnation method - Google Patents
Electrolyte impregnation device and impregnation method Download PDFInfo
- Publication number
- TWI396777B TWI396777B TW095109836A TW95109836A TWI396777B TW I396777 B TWI396777 B TW I396777B TW 095109836 A TW095109836 A TW 095109836A TW 95109836 A TW95109836 A TW 95109836A TW I396777 B TWI396777 B TW I396777B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid level
- electrolytic solution
- adjusting body
- level adjusting
- capacitor element
- Prior art date
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005292228A JP4552826B2 (ja) | 2005-10-05 | 2005-10-05 | 電解液の含浸装置およびその含浸方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200714751A TW200714751A (en) | 2007-04-16 |
TWI396777B true TWI396777B (zh) | 2013-05-21 |
Family
ID=38030341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095109836A TWI396777B (zh) | 2005-10-05 | 2006-03-22 | Electrolyte impregnation device and impregnation method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4552826B2 (ja) |
CN (1) | CN100583330C (ja) |
TW (1) | TWI396777B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011096069A1 (ja) * | 2010-02-05 | 2011-08-11 | トヨタ自動車株式会社 | 非水電解質二次電池 |
CN101916665B (zh) * | 2010-08-18 | 2011-10-05 | 湖南金福达电子有限公司 | 铝电解电容器芯子浸渍方法 |
DE102016125733A1 (de) | 2016-12-27 | 2018-06-28 | Epcos Ag | Hybrid-Polymer-Aluminium-Elektrolytkondensator und Verfahren zur Herstellung eines Kondensators |
CN115692042B (zh) * | 2022-11-15 | 2023-07-28 | 湖南锦络电子股份有限公司 | 一种用于钽电容加工的含浸机 |
CN115938823B (zh) * | 2023-02-14 | 2023-05-09 | 四川中星电子有限责任公司 | 一种电容器赋能设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003217991A (ja) * | 2002-01-25 | 2003-07-31 | Jcc Engineering Co Ltd | 電解コンデンサの電解液真空含浸装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0670950B2 (ja) * | 1989-07-31 | 1994-09-07 | シーケーディ株式会社 | 電解コンデンサ素子の含浸装置 |
JPH0679210A (ja) * | 1992-09-01 | 1994-03-22 | Fujitsu Ten Ltd | ディッピング装置 |
JP2000114124A (ja) * | 1998-10-07 | 2000-04-21 | Jcc Engineering Kk | 電解コンデンサ素子の電解液真空含浸方法及び装置 |
-
2005
- 2005-10-05 JP JP2005292228A patent/JP4552826B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-22 TW TW095109836A patent/TWI396777B/zh not_active IP Right Cessation
- 2006-04-17 CN CN200610073791.6A patent/CN100583330C/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003217991A (ja) * | 2002-01-25 | 2003-07-31 | Jcc Engineering Co Ltd | 電解コンデンサの電解液真空含浸装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200714751A (en) | 2007-04-16 |
JP2007103705A (ja) | 2007-04-19 |
CN100583330C (zh) | 2010-01-20 |
CN1945767A (zh) | 2007-04-11 |
JP4552826B2 (ja) | 2010-09-29 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |