TWI395629B - Laser processing method and device - Google Patents
Laser processing method and device Download PDFInfo
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- 238000007796 conventional method Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
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- Optics & Photonics (AREA)
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Description
本發明係關於一種使用雷射光束對被加工材施以加工之方法及實施其方法之裝置。
以往,當藉由雷射光束之照射,例如切斷或熔接被加工物、或僅除去被加工物表面之既定層時,有時會有如進行預熱加工與正式加工、除去第1層與除去第2層分般,分成複數個階段照射強度或波長不同之雷射光束的情形。
此種情形,為提高加工效率,專利文獻1揭示有一種例如將照射與加工層對應之雷射光束之雷射振盪器僅對應加工層數並排而加工的技術。
專利文獻1:日本特開平8-10970號公報
又,專利文獻2揭示一種例如將照射不同波長之雷射光束之複數個雷射振盪器配置成該雷射光束可照射於同軸上,藉由各雷射光束之導通(ON)/斷開(OFF)控制,對被加工物照射不同波長之雷射光束的技術。
專利文獻2:日本特開2002-270994號公報
然而,電子電路基板之圖案化等中,使基板側或雷射光束之照射側例如朝X-Y方向移動,藉此進行雷射加工。
當以此種電子電路基板之圖案化,分成複數個階段照射該強度或波長不同之雷射光束時,專利文獻1或專利文獻2之技術中,會有以下的問題。
首先,專利文獻1之技術中,隨者僅對應加工層數並排之雷射振盪器的數量分,必須使基板或雷射光束之照射側朝X方向與Y方向多餘地移動,會導致加工效率降低,生產性降低等問題。
又,專利文獻1之技術中,由於決定自僅對應加工層數並排之各雷射振盪器照射之各雷射光光束的相對照射位置,因此當使基板側或雷射光束之照射側朝相反方向移動時,亦會有無法加工的問題。
另一方面,專利文獻2之技術中,由於不同波長之雷射光束照射於同軸上,因此無法對複數層連續加工。是以,與採用專利文獻1之技術時相同,會導致加工效率降低,生產性降低等問題。
本發明欲解決的問題點在於,當以電子電路基板之圖案化,分成複數個階段照射強度或波長不同之雷射光束時,採用習知技術時,會導致加工效率降低,生產性降低之點。
本發明之雷射加工方法,係當以電子電路基板之圖案化,分成複數個階段照射強度或波長不同之雷射光束時,為了能高效率地進行加工,將用以加工被加工物之波長與強度之至少一者不同的複數個雷射光束,依照該不同之波長、強度之順序,照射於被加工物據以進行加工,其最主要的特徵在於:一邊使該雷射光束與被加工物相對移動一邊將該雷射光束照射於被加工物時,視該等之相對移動方向,變更雷射光束之照射位置,以將該複數個雷射光束依照該順序照射於被加工物。
又,本發明之雷射加工裝置,係實施上述本發明之雷射加工方法,其最主要的特徵在於,具備:複數個雷射振盪器,係照射波長與強度之至少一者不同之雷射光束;載台裝置,係為了使該各雷射光束與被加工物相對移動,而使該任一者移動;以及光學系統,係將自該複數個雷射振盪器照射之各雷射光束導引至被加工物之既定位置;該光學系統,為了以各雷射光束以該不同波長、強度之順序照射於被加工物之既定位置,藉由可動裝置構成為可移動,而能視該各雷射光束與被加工物之相對移動方向,以各雷射光束進行被加工物之加工。
本發明中,當使各雷射光束與被加工物相對移動時,使各雷射光束移動時,除了使照射各雷射光束之雷射振盪器與光學裝置移動之情形外,亦可為固定雷射振盪器,僅使光學裝置移動之情形。
本發明中,當以電子電路基板之圖案化,分成複數個階段照射強度或波長不同之雷射光束時,各雷射光束與被加工物並不限於朝相對方向移動,可不進行多餘的移動,高效率進行雷射加工。
以下,使用第1圖~第3圖詳細說明用以實施本發明之最佳形態。
第1圖係顯示本發明之雷射加工裝置之一例的基本構成圖,第2圖係當第1圖所示之本發明之雷射加工裝置,往與第1圖相反方向移動時的說明圖,第3圖係顯示本發明雷射加工裝置之另一例的概略基本構成圖。
第1圖係顯示當除去形成於基板等之被加工物1表面之第1與第2金屬層1a,1b時之本發明雷射加工裝置之一例的圖。
此第1圖中,2a,2b係例如第1與第2YAG雷射振盪器(以下,僅稱為雷射振盪器),其中,第1雷射振盪器2a照射適於除去該第1金屬層1a之波長或強度的雷射光束3a。又,第2雷射振盪器2b照射適於除去該第2金屬層1b之波長或強度的雷射光束3b。
自該第1與第2雷射振盪器2a,2b照射之第1與第2雷射光束3a,3b,係分別透過第1與第2光學系統4a,4b照射至裝載在載台裝置5上例如朝紙面左方移動的該被加工物1表面,除去第1、第2金屬層1a,1b。
第1圖中,該第1光學系統4a係由第1光束成形光學系統4aa及第1反射鏡4ab構成,又,該第2光學系統4b係由第2光束成形光學系統4ba、第2反射鏡4bb、及聚光透鏡4c構成。然而,並不限於如第1圖所示之使用相同聚光透鏡4c者。
然而,本發明中,被加工物1雖能藉由載台裝置5朝紙面右方移動,但此時,第1、第2光學系統4a,4b在保持第1圖之配置狀態下,與專利文獻1之技術相同,無法適當進行被加工物1之第1、第2金屬層1a,1b的除去。
因此,本發明中,例如可為下述構成,即藉由可動機構6變更該第1光學系統4a之第1反射鏡4ab的角度位置,以使第1雷射光束3a能照射至第2雷射光束3b之第1圖之紙面左側及紙面右側。
藉由此種構成,當被加工物1朝與第1圖相反側之紙面右方移動時,如第2圖所示,能在第1雷射光束3a照射至第1金屬層1a除去第1金屬層1a後,以第2雷射光束3b照射第2金屬層1b。
使用上述構成之本發明雷射加工裝置,除去形成於被加工物1表面之第1、第2金屬層1a,1b,係以下述方式進行。
首先,如第1圖所示,當被加工物1朝紙面左方移動時,以第1雷射光束3a照射至紙面左側,第2雷射光束3b照射至第1雷射光束3a之紙面右側之方式設定第1反射鏡4ab之位置。
在此種狀態下,控制裝置8驅動載台裝置5,一邊使被加工物1朝紙面右側移動一邊從第1雷射振盪器2a與第2雷射振盪器2b照射第1、第2雷射光束3a,3b,以除去第1、第2金屬層1a,1b。
又,當偵測器7檢測出被加工物1到達反向地點時,依據來自偵測器7之訊號,控制裝置8對第1、第2雷射振盪器2a,2b發出指令,暫時停止第1、第2雷射光束3a,3b之照射。
其次,控制裝置8對可動機構6發出指令,使第1反射鏡4ab可動,使第1與第2雷射光束3a,3b之照射位置與第1圖反向。反向後,控制裝置8對第1、第2雷射振盪器2a,2b發出指令,再次開始第1、第2雷射光束3a,3b的照射,且對載台裝置5發出指令,使被加工物1朝第2圖之紙面右方移動。
本發明並不限於上述例子,若在各請求項記載之技術思維的範疇內,當然亦可適當變更實施形態。
例如,第1圖、第2圖之例中,雖使第1反射鏡4ab可動,但亦可使第2反射鏡4bb可動。
又,如第3圖所示,亦可於第1圖或第2圖所示之本發明雷射加工裝置之第1、第2光學系統4a,4b,進一步增加用以分割雷射光束3a,3b的光學元件4d,擴大加工寬度。
再者,第1圖或第2圖之例中,當除去被加工物1上之薄膜時,雖先除去第1金屬層1a後再除去第2金屬層1b,但亦可先除去第2金屬層1b後再除去第1金屬層1a。
此外,以上之例,雖說明對被加工物1表面側照射雷射光束以除去薄膜之情形,但當然亦能適用於從背面側照射雷射光束進行薄膜之除去等加工之情形。
本發明不僅能除去薄膜,只要是必須對被加工物照射雷射光束之加工,則亦能適用於微細加工等任何雷射加工。
1...被加工物
1a...第1金屬層
1b...第2金屬層
2a...第1雷射振盪器
2b...第2雷射振盪器
3a...第1雷射光束
3b...第2雷射光束
4a...第1光學系統
4ab...第1反射鏡
4b...第2光學系統
4bb...第2反射鏡
5...載台裝置
6...可動機構
7...偵測器
8...控制裝置
第1圖係顯示本發明雷射加工裝置之一例的基本構成圖。
第2圖係當第1圖所示之本發明之雷射加工裝置,往與第1圖相反方向移動時的說明圖。
第3圖係顯示本發明雷射加工裝置之另一例的概略基本構成圖。
1...被加工物
1a...第1金屬層
1b...第2金屬層
2a...第1雷射振盪器
2b...第2雷射振盪器
3a...第1雷射光束
3b...第2雷射光束
4a...第1光學系統
4aa...第1光束成形光學系統
4ab...第1反射鏡
4b...第2光學系統
4ba...第2光束成形光學系統
4bb...第2反射鏡
4c...聚光透鏡
5...載台裝置
6...可動機構
7...偵測器
8...控制裝置
Claims (2)
- 一種雷射加工方法,係為加工被加工物,將波長與強度之至少一者不同的複數個雷射光束,依照該不同之波長、強度之順序,通過相同透鏡照射於被加工物據以進行除去複數層之加工,其特徵在於:一邊使該雷射光束與被加工物相對移動一邊將該雷射光束照射於被加工物時,藉由以該複數個雷射光束之一者透射過反射另一雷射光束之光學元件後通過該透鏡之外周側、該雷射光束之另一者被該光學元件反射後通過該透鏡之中心之方式變更該雷射光束之一者之照射位置,視該等之相對移動方向將該複數個雷射光束依照該順序照射於被加工物。
- 一種雷射加工裝置,係實施申請專利範圍第1項之雷射加工方法,其特徵在於,具備:複數個雷射振盪器,係照射波長與強度之至少一者不同之雷射光束;載台裝置,係為了使該各雷射光束與被加工物相對移動,而使該任一者移動;以及光學系統,係將自該複數個雷射振盪器照射之各雷射光束通過相同透鏡導引至被加工物之既定位置;該光學系統中之一光學系統,為了以各雷射光束以該不同波長、強度之順序照射於被加工物之既定位置,藉由可動裝置構成為可移動,而能視該各雷射光束與被加工物之相對移動方向,以各雷射光束進行被加工物之加工; 該光學系統中之另一光學系統具有光學元件,該光學元件反射另一雷射光束使其通過該透鏡之中心,使被一光學系統導引之一雷射光束透射過。
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