TWI390660B - 用於半導體晶圓對準之方法與設備 - Google Patents
用於半導體晶圓對準之方法與設備 Download PDFInfo
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Description
本發明係關於機器視覺。本發明可應用於(例如)半導體晶圓製造期間之晶圓對準。
半導體晶片製造為使矽或其他晶圓經受由模組化晶圓處理單元或"系統"所進行之一系列處理步驟的多級製程。彼等單元(其中每一單元通常執行一或多個專用處理步驟)沿工廠或"fab"之地面而排列。藉由輸送機、機器人等等而在單元當中及之間傳送晶圓。
在可藉由處理系統來處理晶圓之前,必須建立晶圓之位置及對準。此保證相對於晶圓所固有之特徵(例如,方向定向之結晶結構)與相對於已經(或待)由其他單元執行於晶圓上之處理來適當地引導由單元所執行之微影及/或其他步驟。
在大多數現今之模組化晶圓製造系統中,藉由旋轉晶圓且使用線性相機來尋找晶圓之對準指示器(例如,沿圓形晶圓之周邊的凹口或"平口"(flat))的機械預對準器來執行晶圓之初始對準。一旦其尋找到凹口(或平口),預對準器即旋轉上面放置有晶圓之夾盤及平臺,以便將晶圓定向至已知角度,且進而使晶圓為在單元內之處理做好準備。可在單一晶圓之處理期間及/或在單一晶圓轉移至fab中之另一單元之前重複地使用預對準器。
有關現今之預對準器之一問題在於:其為昂貴且緩慢的。其可能花費高達$20,000且通常需要高達五秒來執行對準。由於預對準期間所耗費之每一額外秒可能使fab花費數千美元或更多,所以需要減少彼等時間以及預對準器自身之成本。另一問題在於:其可能為不精確的及/或需要接觸每一晶圓之背面。由於現今之預對準器旋轉機械夾盤上之晶圓,所以其僅可能達到與旋轉夾盤之機械容許度所允許之精確度一樣的精確度。
本發明之一目的係提供用於機器視覺之改良方法與設備。
一相關目的係提供可應用於半導體晶圓製造之此等方法與設備。
其他目的係提供可應用於晶圓對準之此等方法與設備。
本發明之另外其他目的係提供可用於晶圓製造系統中之此等方法與設備。
本發明之另外其他目的係提供快速地操作之此等方法與設備。
本發明之另外其他目的係提供可以低成本來實施之此等方法與設備。
本發明之其他目的係提供改良預對準器之精確度以便處理每一連續代之半導體製造技術之較小容許度的此等方法與設備。
本發明之另外其他目的係提供促進避免接觸正被處理之晶圓之背面且因此藉由減少污染來改良產率的預對準器之使用的此等方法與設備。
本發明之另外其他目的係提供可與現存及未來晶圓製造製程及裝備一起使用之此等方法與設備。
前述內容係在由在一些態樣中提供一種晶圓對準系統之本發明所達到之目的當中,該晶圓對準系統包含一影像擷取裝置、一照明源、一可旋轉晶圓平臺及一影像處理器,該影像處理器包括用於在該平臺之複數個旋轉角度中之每一旋轉角度下將該平臺上之物品(諸如,晶圓)之影像中之座標映射至"世界"參考框架的功能性。
本發明之相關態樣提供一種如上文所述之晶圓對準系統,其中平臺將物品(例如,晶圓)固持於具有隨平臺旋轉而進動之法線的平面上。
本發明之其他相關態樣提供此等系統,其中平臺安置於夾盤上且旋轉地耦接至夾盤,其旋轉軸線不垂直於平臺之固持平面。因此,平臺隨夾盤旋轉而旋轉,且平臺之固持平面的法線在該旋轉的過程中進動。
在其他態樣中,本發明提供此等系統,其中世界參考框架係獨立於由平臺(例如)在其各種旋轉角度下所界定之一或多個參考框架。在本發明之其他相關態樣中,世界參考框架為平面的。
根據本發明之其他態樣,映射功能性包含一離散函數,其對於平臺之兩個或兩個以上離散角度中之每一離散角度而將平臺上之物品(例如,晶圓)之影像中的座標映射至世界參考框架。在本發明之其他態樣中,映射功能性包含一連續函數,其將平臺上之物品(例如,晶圓)之影像中的座標映射至世界參考框架作為平臺之角度的連續函數。
在其他態樣中,本發明提供一種如上文所述之系統,其中照明源對平臺上之物品(例如,晶圓)提供背光。在相關態樣中,該源在平行於平臺之固持平面之法線的角度下提供該背光。在本發明之另外其他相關態樣中,該源安置於平臺之固持平面中。在本發明之另外其他相關態樣中,該源包含一安置於物品(例如,晶圓)與平臺之間的平面源。根據本發明之其他相關態樣,該源包含一電致發光光源。
本發明之其他態樣提供一種如上文所述之系統,其中影像擷取裝置經配置以在單一視場中擷取整個物品(例如,晶圓)之影像--或至少擷取其一足夠部分之影像,以使能夠判定物品(或其特徵)之位置及/或定向。
本發明之另外其他態樣提供一種如上文所述之系統,其中影像處理器包含用於將安置於平臺上之物品之位置及定向中之至少一者判定為影像中所示之一或多個特徵之函數的功能性(例如,在影像擷取裝置之參考框架中及/或在世界參考框架中)。
本發明之其他態樣提供用於上文所述之系統之晶圓對準並行操作的方法。此等態樣包括(例如):擷取平臺上之物品(例如,晶圓)之影像;在影像擷取裝置之參考框架中判定物品(或其上之特徵)之位置及定向中之任一者;及將該位置及/或定向轉換至世界參考框架。經如此轉換之位置及/或定向可(例如)由機器人手臂(或其他方式)用以定位物品以用於進一步處理或檢測。
本發明之此等及其他態樣在圖式及以下描述中為明顯的。
圖1描繪一包括複數個晶圓處理單元或系統12-16之晶圓製造設施10。設施10可為晶圓"fab"、鑄造廠、實驗室或此項技術中已知之類型的任一其他製造設施。晶圓處理系統12-16亦為此項技術中已知用以在晶圓上執行諸如微影等等之處理步驟之類型。該等單元中之一或多者可經調適成包括如以下及本文中別處所述的根據本發明之晶圓預對準子系統。
在所說明之實施例中,該等單元12-16沿設施10之地面而排列,但在其他實施例中,其可以其他方式被安置(例如,安置於單一設施之獨立處理區域中、分散於遠端設施當中,等等)。藉由均如此項技術中已知之完全自動化、半自動化或非自動化機構(諸如,輸送機(未圖示)、機器人手臂18、手工勞動(未圖示),等等)而在單元12-16當中及之間傳送晶圓。在手臂18之末端效應器中展示了一個此晶圓20。
每一系統12-16包括執行各別系統之晶圓處理步驟的一或多個子系統。相對於系統12而展示四個此等子系統22-28。此等子系統包括根據本發明之一晶圓對準子系統22,以及此項技術中已知用於微影或其他晶圓處理步驟之類型的三個其他子系統。可在系統12內提供機器人手臂29或另一輸送工具(未圖示)以用於在子系統當中及之間(例如)以此項技術中已知之習知方式來移動晶圓。亦可提供一局部控制器32以用於以此項技術中已知之習知方式(適應於本文中之教示)來控制系統12內之操作,以及用於(例如)經由以此項技術中已知之習知方式(再次,適應於本文中之教示)來控制總系統操作(包括手臂或輸送工具18之操作)的系統控制器34而與其他系統協調操作。應瞭解,可在系統12中使用更多或更少數目之子系統及/或輸送工具,且可類似地組態其他系統14-16。
晶圓對準子系統(或"預對準器")22判定各別系統12中之晶圓30之位置及/或對準(較佳為此兩者)。此保證(例如)相對於晶圓30所固有之特徵(例如,方向定向之結晶結構)與相對於已經(或待)由其他系統14-16執行於晶圓30上之處理來適當地引導由系統12所執行之微影及/或其他步驟。
更特定言之,預對準器22判定晶圓20之中心及/或其他特徵之定位。該其他特徵可為(例如)晶圓之特徵"平口"或"凹口"。又,其可為對準標記或蝕刻或另外延伸於(例如)晶圓之表面上之其他圖案。此外,預對準器22判定晶圓之定向。按照慣例,在所說明之實施例中,此表示晶圓平口或凹口之旋轉角度,但其他實施例可利用其他特徵用於此定向判定。
一旦其判定晶圓30之定位及/或定向,預對準器22即將該位置及/或定向傳達至所說明之設施10之控制器32或其他組件,使得晶圓可被手臂或其他輸送工具18、29移動且進一步在系統12內、在一或多個其他系統14-16內或總體上在設施10內被處理。預對準器22傳達為系統12-16所共有之"世界"參考框架(FoR)系統36中的定位及/或定向資訊,但在其他實施例中,其可能僅為各別系統12所共有、為一或多個其他系統14-16所共有,及/或總體上為設施10所共有。為此,如以下及本文中別處所進一步論述,預對準器22將自由其相機40擷取之影像所鑑別之資訊自該相機之FoR轉換至世界FoR。
圖2A描繪圖1之晶圓對準子系統(或預對準器)22的其他細節。子系統22包括均如圖所示而配置之影像擷取裝置(或相機)40、照明源42、晶圓夾盤44及平臺46以及影像處理器48。亦如圖所示,一框架50或其他結構元件相對於夾盤及平臺44-46而對相機40提供剛性支撐。儘管存在圖式中所示之特定組態,但熟習此項技術者應瞭解,可以按照本文中之教示之其他方式來配置元件42-50。
相機40包含用於此項技術中之類型的習知影像擷取裝置。較佳地,其經定位及組態以在單一視場(FoV)41中獲取完整晶圓30之影像,因此無需擷取多個不同影像來鑑別晶圓之位置及/或定位。所說明之預對準器之益處在於:相機40可具有(例如)在晶圓30之表面上具有解析至650微米(或更佳)之影像像素之相對較低的解析度,而仍允許晶圓定位及位置之解析度為20微米(或更佳)。較佳相機40為可自本文中之受讓人獲得的In-Sight。
源42照明晶圓30之用於位置及/或定向判定的特徵。在所說明之實施例中,源42對晶圓30作背光照明,以便在相機40所擷取且影像處理器48所處理用於位置及/或定向判定之影像中強調晶圓30之周邊。較佳地,如在所說明之實施例中,此背光由安置於(例如)與平臺46相同之水平面處且恰在晶圓30下方之提供均勻照明的低輪廓元件提供。較佳地,此係藉由直徑略小於晶圓直徑之圓形平臺及內徑大於平臺內徑且外徑大於晶圓外徑之圓形背光來完成。此元件42可以2005年9月14日申請之標題為"Method and Apparatus for Backlighting a Wafer during Alignment"的同在申請中之共同讓渡的美國專利申請案第11/162,540號中所述之照明源的方式來製造,該案之教示以引用的方式併入本文中。
平臺46固持晶圓30以用於藉由相機40之成像及藉由夾盤44之旋轉。為此,平臺界定在裏面藉由摩擦力、吸力或其他方式而固持有晶圓30之虛平面52。在所說明之實施例中,該平面52整體垂直於界定相機40之FoV 41之錐形的軸線,但在其他實施例中,可以其他方式來定向平面與相機。此外,平面52整體--但(如下文所述)並非完全--垂直於以此項技術中已知之方式而在上面安置有其(平面52)且與其旋轉地耦接之夾盤44的旋轉軸線53。如圖所示,夾盤自身以此項技術中已知之方式而安置於電腦控制馬達54上且旋轉地耦接至電腦控制馬達54。
參看圖2B,所說明之預對準器之益處在於:由平臺46所界定之固持平面52無需垂直於夾盤之旋轉軸線53(且因此,夾盤及46可為此項技術中已知之較不昂貴的種類)。實際上,在所說明之實施例中,在不垂直於軸線53之非垂直角(亦即,非90°角度)α下安置固持平面52,其中α係在0-0.5度之間,且較佳不大於1.5度。結果,固持平面52之法線56隨夾盤44旋轉而進動。作為另一結果,由平面52所建立之參考框架隨平臺46之旋轉角度ω而變化。或者,換言之,世界參考框架係獨立於--但(如下文所述)可映射至--由旋轉平臺在其各種角度下所建立之參考框架。
返回參看圖2A,儘管獨立於系統12之其他組件來展示夾盤及平臺44-46,但在某些實施例中,夾盤及平臺44-46形成機器人手臂29(且特定言之,其末端效應器)之一部分,或系統12或設施10之其他組件之一部分。
影像處理器48包含此項技術中已知之類型的通用或專用數位資料處理器,其用於分析由相機40所產生之影像,(例如)以識別該等影像中之特徵之座標且在該等影像上執行變換。為此,影像處理器48包括中央處理單元(未圖示)、記憶體(未圖示)及輸入/輸出介面(未圖示),其均為用以執行(例如)儲存於記憶體中之軟體的習知類型。在所說明之實施例中,該軟體使影像處理器48執行下列功能:1.(例如)以此項技術中已知之習知方式來觸發相機40且捕獲平臺46上之晶圓30之影像。此功能性由圖式中之擷取模組60來表示。
2.(例如)以此項技術中已知之習知方式(見(例如)System for Finding the Orientation of a Wafer之美國專利5,825,913,該專利之教示以引用的方式併入本文中)來分析如此所捕獲之影像,以識別相機之FoR(且特定言之,所捕獲影像之FoR)中晶圓30之中心之定位及/或晶圓30之其他特徵(諸如,如上文所述之晶圓之特徵平口、凹口或其他)之定位。此功能性由圖式中之分析模組62來表示。
3.將自影像之FoR中之座標如此所判定的定位映射至如下文所述之世界FoR中之座標。此功能性由圖式中之映射模組64來表示。
4.自所映射定位判定晶圓之定向。如上文所述,一旦判定所映射定位,即可以此項技術中已知之習知方式來判定定向。此功能性由圖式中之定向模組66來表示。
5.將所映射定位及自其所判定之定向發送至控制器32及/或34,使得晶圓30可如上文所述被進一步移動或處理。
當然,應瞭解,可將模組60-66之功能性組合於較少模組中及/或分配於較大數目當中,實際上,包括分配至預對準器22或系統12或其他之組件當中。
關於模組64,預對準器22使用使由模組60所擷取之晶圓影像之FoR中之座標與世界FoR中之座標有關的映射函數來映射由模組62所判定之定位。映射函數(其可為連續的或離散的)如以下所表達來將該關係式定義為電腦控制夾盤及平臺44、46之角旋轉的函數:[x,y] FoR(world)
=f
([x,y] FoR(image)
,ω platform
) 等式1其中,[x,y] FoR(world)
為世界參考框架中之座標;[x,y] FoR(image)
為影像參考框架中之座標;ω platform
為夾盤及平臺44、46之旋轉角度。
熟習此項技術者自上文應瞭解,因為由平臺46所建立之固持平面52不垂直於軸線53,所以等式1之函數f隨ω而變化。在所說明之實施例中,該函數f
藉由下列步驟而(例如)在系統12、預對準器22之裝配或安裝期間被實驗地判定:1.在已知旋轉角度ω下置放夾盤及平臺44-46;2.在平臺46上置放一具有一或多個參考標記之校正卡或板(例如,總尺寸類似於矽晶圓30),該或該等參考標記之定位在世界FoR中為已知的(例如,如藉由自世界FoR中之已知參考點獨立地量測校正卡/板及/或其附屬參考標記之定位所判定);3.藉由相機40來成像如此所標記之校正卡或板;4.比較影像中所示之參考標記之座標(亦即,影像FoR座標)與相應世界FoR座標;5.自此比較之結果建構離散查找表及/或連續數學函數(例如,藉由二次擬合),該函數以上述等式1之方式而用於給定旋轉角度ω;6.對於夾盤及平臺44-46之至少一其他旋轉角度(且較佳地,對於許多其他旋轉角度)而重複步驟1-5。
當然,步驟1-6僅表示一用以建立函數f
之方式。熟習此項技術者應瞭解,可鑒於本文中之教示而以其他方式來建構函數。
以上描述了滿足前文所述之目的之方法與設備。此包括改良預對準器精確度,以便處理現今及連續代之半導體製造技術之較小且愈來愈小的容許度。熟習此項技術者應瞭解,所說明之實施例僅為本發明之實例,且併有對本發明之修改之其他實施例屬於本發明之範疇。因此,例如,應瞭解,可藉由避免接觸製程中之晶圓之背面且進而最小化污染風險的邊緣夾緊旋轉台來利用根據本發明之預對準器。
10...晶圓製造設施
12、14、16...晶圓處理單元或系統
18...機器人手臂
20...晶圓
22、24、26、28...子系統
29...機器人手臂
30...晶圓
32...局部控制器
34...系統控制器
36..."世界"參考框架(FoR)系統
40...影像擷取裝置/相機
41...視場(FoV)
42...照明源
44...晶圓夾盤
46...平臺
48...影像處理器
50...框架
52...虛平面
53...旋轉軸線
54...電腦控制馬達
56...法線
60...擷取模組
62...分析模組
64...映射模組
66...定向模組
圖1描繪本發明被實踐之類型的晶圓製造設施;及圖2A及圖2B描繪用於圖1之晶圓處理系統中之類型的晶圓對準子系統(或預對準器)之其他細節。
10...晶圓製造設施
12、14、16...晶圓處理單元或系統
18...機器人手臂
20...晶圓
22、24、26、28...子系統
29...機器人手臂
30...晶圓
32...局部控制器
34...系統控制器
36..."世界"參考框架(FoR)系統
Claims (21)
- 一種晶圓對準系統,包含:A.一可旋轉平臺;B.一影像擷取裝置,其具有一包括該可旋轉平臺上之一晶圓之至少一部分的視場;C.一照明源,其照明在該可旋轉平臺上之該晶圓之該至少一部分;D.一影像處理器,其耦接至該影像擷取裝置且處理一在一第一參考框架中展示該晶圓之一或多個特徵的影像,該影像處理器在一第二參考框架中自該影像判定該晶圓或其一部分之一位置及一定向的至少一者;及E.該影像處理器,包括一映射元件,其在該平臺之複數個旋轉角度中之每一旋轉角度下,將該第一參考框架中之座標映射至該第二參考框架中之座標;F.其中該映射元件將在該可旋轉平臺上的該晶圓之該影像中的座標映射至第二參考框架,作為該平臺的旋轉角度的一函數。
- 如請求項1之晶圓對準系統,其中該平臺將該晶圓固持於一具有一隨該平臺旋轉而進動之法線之平面上。
- 如請求項2之晶圓對準系統,其中該平臺安置於一夾盤上且旋轉地耦接至該夾盤,該夾盤之旋轉軸線不垂直於該平臺之該固持平面。
- 如請求項3之晶圓對準系統,其中該平臺隨該夾盤旋轉而旋轉,且該平臺之固持平面之該法線隨該旋轉的過程 中進動。
- 如請求項1之晶圓對準系統,其中該第二參考框架係獨立於由該平臺在其一或多個旋轉角度下所界定之一或多個第三參考框架。
- 如請求項1之晶圓對準系統,其中該第二參考框架為一平面。
- 如請求項1之晶圓對準系統,其中該映射元件包含一離散函數,該離散函數對於該平臺之兩個或兩個以上離散角度中之每一離散角度而將該平臺上之該晶圓之一影像中的座標映射至該第二參考框架。
- 如請求項1之晶圓對準系統,其中該映射元件包含一連續函數,該連續函數將該平臺上之該晶圓之一影像中的座標映射至該第二參考框架,作為該平臺之該角度的一連續函數。
- 如請求項1之晶圓對準系統,其中該照明源對該平臺上之該晶圓提供背光。
- 如請求項9之晶圓對準系統,其中該照明源在一平行於該平臺之該固持平面之該法線的角度下提供該背光。
- 如請求項9之晶圓對準系統,其中該照明源安置於該平臺之該固持平面中。
- 如請求項11之晶圓對準系統,其中該照明源包含一安置於該晶圓與該平臺之間的平面照明源。
- 如請求項9之晶圓對準系統,其中該照明源包含一電致發光光源。
- 如請求項1之晶圓對準系統,其中該影像擷取裝置經配置以在一單一視場中擷取該整個晶圓之一影像。
- 如請求項1之晶圓對準系統,其中該影像處理器進一步包含:在該第一參考框架及該第二參考框架中之任一者中,將該晶圓或其一部分之該位置及定向的至少一者判定為該影像中所示之一或多個特徵之一函數的功能性。
- 一種晶圓對準方法,包含:A.擷取一安置於一可旋轉平臺上之晶圓之一影像,該影像在一第一參考框架中展示該晶圓之一或多個特徵;B.處理該影像以在一第二參考框架中自該影像判定該晶圓或其一部分之一位置及定向的至少一者;C.該處理步驟包括藉由使用一在該平臺之複數個旋轉角度中之每一旋轉角度下,將該第一參考框架中之座標映射至該第二參考框架中之座標的映射元件,來判定該位置及定向的該至少一者;D.將位於該可旋轉平臺上的該晶圓之該影像中的座標映射至該第二參考框架,作為該平臺的旋轉角度的一函數,及E.使用步驟(B)中所判定之該位置及定向的該至少一者來定位該晶圓以用於處理及檢測中之任一者。
- 如請求項16之方法,其中該平臺將該晶圓固持於一具有一隨該平臺旋轉而進動之法線之平面上。
- 如請求項16之方法,其中該第二參考框架係獨立於由該平臺在其一或多個旋轉角度下所界定之一或多個第三參 考框架。
- 如請求項16之方法,包含在步驟(A)中之該影像之擷取期間背光照明該晶圓。
- 如請求項19之方法,包含在該晶圓與該平臺之間安置一照明源。
- 如請求項19之方法,包含利用一平面電致發光光源而背光照明該晶圓。
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2006
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2007
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US8162584B2 (en) | 2012-04-24 |
US20080050006A1 (en) | 2008-02-28 |
TW200832597A (en) | 2008-08-01 |
WO2008024476A2 (en) | 2008-02-28 |
WO2008024476A3 (en) | 2008-11-13 |
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