TWI389825B - Package for storing micro solder balls - Google Patents
Package for storing micro solder balls Download PDFInfo
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- TWI389825B TWI389825B TW098140781A TW98140781A TWI389825B TW I389825 B TWI389825 B TW I389825B TW 098140781 A TW098140781 A TW 098140781A TW 98140781 A TW98140781 A TW 98140781A TW I389825 B TWI389825 B TW I389825B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
- B65D77/04—Articles or materials enclosed in two or more containers disposed one within another
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
- B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
- B65D81/2007—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas under vacuum
- B65D81/2023—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas under vacuum in a flexible container
- B65D81/203—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas under vacuum in a flexible container with one or several rigid inserts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D33/00—Details of, or accessories for, sacks or bags
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
- B65D77/04—Articles or materials enclosed in two or more containers disposed one within another
- B65D77/0406—Rigid containers in preformed flexible containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
- B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
- B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
- B65D81/268—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants the absorber being enclosed in a small pack, e.g. bag, included in the package
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Food Science & Technology (AREA)
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Description
本發明係關於一種適於保存銲錫球、尤其微小銲錫球之保存用密封盒及保存方法。The present invention relates to a sealed sealing case and a storage method suitable for storing solder balls, particularly small solder balls.
近年來，隨著電子機器之小型化，用於電子機器之電子零件亦已變得極為小型，而且成為具備多數功能之多功能零件。以多功能零件而言，係有BGA(Ball Grid Array，球格柵陣列)或CSP(Chip Scale Package，晶片級封裝)等，且在此等多功能零件設置有多數個電極。將多功能零件安裝於印刷基板之際，係焊接電極與印刷基板之觸點(land)。In recent years, with the miniaturization of electronic equipment, electronic components used in electronic equipment have become extremely small, and they have become multifunctional parts having many functions. In terms of multifunctional parts, there are BGA (Ball Grid Array) or CSP (Chip Scale Package), and a plurality of electrodes are provided in such multifunctional parts. When the multi-functional component is mounted on the printed substrate, the land of the welding electrode and the printed substrate is a land.
此外，在如QFP(Quad Flat Package，方型扁平式封裝)或SOIC(Small Outline Integrated Circuits，小型塑封積體電路)之電子零件中，係於內部設置有具有多數個電極之裸晶片(bare chip)，而該電極係與電子零件之基板焊接。Further, in an electronic component such as a QFP (Quad Flat Package) or a SOIC (Small Outline Integrated Circuits), a bare chip having a plurality of electrodes is disposed inside (bare chip) And the electrode is soldered to the substrate of the electronic component.
進行如上所述之焊接之際，要對於多個設置部位、或極小之電極個別供給銲錫，極為耗費勞力時間。再者，無法對各個微小的銲錫部正確地供給銲錫。因此，在關於多功能零件或裸晶片之焊接中，係預先將銲錫附著於電極而先形成銲錫凸塊(bump)，在焊接時藉由使該銲錫凸塊熔融而進行焊接。一般而言，銲錫凸塊之形成係使用銲錫球。When soldering as described above, it is extremely labor-intensive to supply solder to a plurality of installation portions or extremely small electrodes. Furthermore, it is impossible to accurately supply the solder to each of the minute solder portions. Therefore, in the soldering of the multi-function component or the bare wafer, the solder is attached to the electrode in advance to form a solder bump, and the solder bump is melted at the time of soldering to perform soldering. In general, solder bumps are formed using solder balls.
此銲錫凸塊之形成，係利用使用銲錫膏(solder paste)之方法、及使用銲錫球之方法等。以往大多係利用使用成本低廉之銲錫膏之方法。然而，由於所要形成之凸塊已要求要微小到30至200μm、以及由銲錫球所形成之凸塊較能確保安裝的高度，雖然在成本上較為高價，惟仍廣泛利用使用與凸塊高度相同直徑之銲錫球之方法。尤其對BGA或CSP之外部端子用之電極及零件內部之裸晶片接合用之電極而言，確保安裝的高度極其重要，因此銲錫球的使用無法或缺。The solder bump is formed by a method using a solder paste and a method of using a solder ball. In the past, the method of using a low-cost solder paste has been used. However, since the bumps to be formed have been required to be as small as 30 to 200 μm, and the bumps formed by the solder balls are more secure in mounting height, although they are relatively expensive in cost, they are still widely used and have the same height as the bumps. The method of solder balls in diameter. In particular, for the electrodes for external terminals of BGA or CSP and the electrodes for bonding bare wafers inside the parts, it is extremely important to ensure the height of mounting, so the use of solder balls is indispensable.
將銲錫球搭載於多數個電極之際，係將銲錫球投入於形成有具有直徑較銲錫球稍小之孔的板架(pallet)上並加以搖擺，藉此使銲錫球以整列狀態座落於板架之孔。然後，在銲錫球搭載頭搭載銲錫球。因此，若銲錫球之長寬比(aspect)較大，且粒徑有誤差，則將無法搭載於電極。為了確保嚴密的銲錫量、及確保安裝的高度，重要的是每個銲錫球的粒徑均無誤差。When the solder ball is mounted on a plurality of electrodes, the solder ball is placed on a pallet having a hole having a diameter smaller than that of the solder ball, and is rocked, thereby allowing the solder ball to be placed in a whole column. The hole in the plate. Then, a solder ball is mounted on the solder ball mounting head. Therefore, if the aspect ratio of the solder ball is large and the particle diameter is inaccurate, it cannot be mounted on the electrode. In order to ensure a tight soldering amount and to ensure the height of the mounting, it is important that there is no error in the particle size of each solder ball.
作為本發明對象之銲錫球，係為用於安裝之球狀銲錫，且在前述搭載方法中所使用，因此需滿足以下等條件：(1)銲錫球之真球率為0.95以上、粒徑固定且無扭曲、(2)表面無雜質(contamination)、(3)表面少凹凸且平滑、(4)表面之氧化膜不厚、(5)合金組成之成分固定。The solder ball to be used in the present invention is a spherical solder for mounting, and is used in the above-described mounting method. Therefore, the following conditions are required: (1) The true spherical rate of the solder ball is 0.95 or more, and the particle diameter is fixed. There is no distortion, (2) no contamination on the surface, (3) less unevenness and smoothness on the surface, (4) the oxide film on the surface is not thick, and (5) the composition of the alloy composition is fixed.
因此，保存銲錫球之容器，亦需使用不會對銲錫球之粒徑造成影響者。不僅需防止銲錫球因為來自外部之撞擊所產生之變形，亦需防止銲錫球在容器內移動而互相摩擦，表面破損所產生之銲錫粉氧化發黑而產生所謂黑化之現象。為了防止黑化，已知有藉由具有內方突出體之蓋將有底筒狀之容器本體之開口部密封，而將銲錫球所移動之空隙縮小者(專利文獻1)。Therefore, the container for storing the solder ball also needs to be used without affecting the particle size of the solder ball. It is not only necessary to prevent deformation of the solder balls due to impact from the outside, but also to prevent the solder balls from moving in the container and rubbing against each other, and the solder powder generated by the surface damage is blackened and blackdened. In order to prevent the blackening, it is known that the opening of the container body having the bottomed cylindrical shape is sealed by the cover having the inner protruding body, and the gap in which the solder ball is moved is reduced (Patent Document 1).
此外，隨著銲錫球變微小，銲錫球之表面積相對於銲錫全量之比例會增加，因此銲錫球之表面容易氧化而產生黃變。黃變係由於銲錫球曝露於大氣中，且因為銲錫球中之Sn被大氣中的氧所氧化而引起。由於Sn之氧化膜為黃色，因此氧化膜變厚時，銲錫球整體看起來變色成黃色。In addition, as the solder ball becomes smaller, the surface area of the solder ball increases with respect to the total amount of the solder, so that the surface of the solder ball is easily oxidized to cause yellowing. The yellowing is caused by the solder ball being exposed to the atmosphere and because the Sn in the solder ball is oxidized by oxygen in the atmosphere. Since the oxide film of Sn is yellow, when the oxide film is thick, the entire solder ball looks discolored to yellow.
在BGA安裝等之銲錫球搭載中，由於係在板架上整齊排列銲錫球且予以批次搭載，因此在搭載銲錫球後，需確認在圖像識別裝置是否有銲錫球。此時，若銲錫球產生黃變，會有在圖像識別裝置產生錯誤之情形。若在圖像識別裝置產生錯誤，則生產線停止，而對生產力帶來重大障礙。In the solder ball mounting such as the BGA mounting, since the solder balls are arranged neatly on the rack and are mounted in batches, it is necessary to confirm whether or not the solder balls are present in the image recognition device after the solder balls are mounted. At this time, if the solder ball is yellowed, there is a case where an error occurs in the image recognition device. If an error occurs in the image recognition device, the production line is stopped, which poses a major obstacle to productivity.
再者，若銲錫球之表面由氧化膜所覆蓋，則於熔融銲錫球時，該氧化膜不會破損而仍保持球形狀之狀態下直接殘留於電極上，或氧化膜附著於電極上，而阻礙熔融之銲錫之潤濕，招致焊接不良。Further, when the surface of the solder ball is covered with the oxide film, when the solder ball is melted, the oxide film remains on the electrode without being damaged and remains in a spherical shape, or the oxide film adheres to the electrode. It hinders the wetting of the molten solder, resulting in poor soldering.
因此，乃提案幾種用以防止Sn主成分之無鉛銲錫球之氧化、黃變之容器(專利文獻2至5)。Therefore, several containers for preventing oxidation and yellowing of lead-free solder balls of the main component of Sn have been proposed (Patent Documents 2 to 5).
為了防止銲錫球之黃變，在簡便的方法中具有效果者，係一種在無透氣性之疊層薄膜(laminate sheet)或鋁薄膜充填銲錫球並於脫氣之後進行密封之方法(專利文獻2)。其中亦可同時密封脫氧劑或吸濕劑或緩衝材料。In order to prevent the yellowing of the solder ball, it is effective in a simple method, and is a method of filling a solder ball without a gas permeable laminate sheet or an aluminum film and sealing it after degassing (Patent Document 2) ). It is also possible to simultaneously seal the deoxidizer or the moisture absorbent or the buffer material.
已知有一種在具有氧阻障性及導電性之銲錫球保存用容器之內部，製作收容脫氧劑之空間，且在該空間內收容脫氧劑，藉此以防止銲錫球之氧化之方法(專利文獻3)。There is known a method for preventing oxidation of a solder ball by installing a space for accommodating a deoxidizer in a container for holding a solder ball having oxygen barrier properties and conductivity, and preventing oxidation of the solder ball. Document 3).
此外，亦已知有一種不在容器內收容脫氧劑，而是使容器之樹脂材料含有防止氧化成分之方法、或將含有防止氧化成分之構件與銲錫球一起收容於容器內之方法(專利文獻4)。Further, a method of accommodating a deoxidizing agent in a container, a method of preventing a oxidizing component in a resin material of a container, or a method of accommodating a member containing an oxidizing component together with a solder ball in a container is known (Patent Document 4) ).
又已知有一種為了防止銲錫球之氧化，以封印(seal)方式將容器本體之外蓋予以溶接者(專利文獻5)。依據此，一旦將封印剝除開封，則氧就流入而開始氧化，因此在開封之後就需用完。由於開封後之未使用銲錫球會氧化，因此無法使用。結果，可防止因為氧化膜所造成之焊接不良。There is also known a method in which the outer cover of the container body is sealed by a seal in order to prevent oxidation of the solder ball (Patent Document 5). According to this, once the seal is stripped and unsealed, oxygen flows in and begins to oxidize, so it needs to be used after opening. Since the unused solder balls after oxidation are oxidized, they cannot be used. As a result, poor soldering due to the oxide film can be prevented.
又已知有一種雖非銲錫球之保存容器，但為一種用以保存由銅或銲錫等易於氧化之金屬所作成之線(wire)、帶(ribbon)之金屬配線材料之包裝方法(專利文獻6)。依據此方法，金屬配線材料被捲成捲軸(spool)而收納於塑膠盒內，且將此金屬配線材料與脫氧劑一同以疊層薄膜予以封入。There is also known a storage container for a solder ball which is not a solder ball, but is a packaging method for a metal wiring material for wire or ribbon made of a metal which is easily oxidized such as copper or solder (Patent Document) 6). According to this method, the metal wiring material is wound into a spool and housed in a plastic case, and the metal wiring material is sealed with a deoxidizer as a laminated film.
[專利文獻1]日本特開2000-335633號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-335633
[專利文獻2]日本特開2003-312744號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2003-312744
[專利文獻3]日本特開平11-105940號公報[Patent Document 3] Japanese Patent Laid-Open No. Hei 11-105940
[專利文獻4]日本特開2007-230613號公報[Patent Document 4] Japanese Patent Laid-Open Publication No. 2007-230613
[專利文獻5]日本特開2008-37487號公報[Patent Document 5] Japanese Patent Laid-Open Publication No. 2008-37487
[專利文獻6]日本特開平3-289415號公報[Patent Document 6] Japanese Patent Laid-Open No. Hei 3-289415
然而，在上述之習知銲錫球保存方式中會有幾個問題。However, there are several problems in the conventional solder ball preservation method described above.
在以具有內方突出體之蓋將有底筒狀之容器本體之開口部予以密封之容器中，雖可防止因為銲錫球彼此摩擦所產生之黑化，惟未採取防止氧化對策，因此會有銲錫球氧化而黃變之可能。In the container in which the opening of the container body having the bottomed cylindrical shape is sealed by the cover having the inner protruding body, it is possible to prevent blackening caused by the friction of the solder balls, but the countermeasure against oxidation is not taken. The solder ball is oxidized and yellowed.
在為了防止銲錫球之黃變而將銲錫球充填於疊層薄膜或鋁薄膜之袋並於脫氣之後進行密封之方法中，在容易受到來自外部之撞擊之環境下，會有撞擊直接傳遞至銲錫球，而引起變形、扭曲之問題。將脫氧劑或吸濕劑或緩衝材料同時密封時，將該等取出時，會有微小銲錫球飛散之虞。In a method of filling a solder ball in a bag of a laminated film or an aluminum film in order to prevent yellowing of the solder ball and sealing it after degassing, in an environment susceptible to impact from the outside, an impact is directly transmitted to Solder balls cause deformation and distortion. When the deoxidizer or the moisture absorbent or the buffer material is simultaneously sealed, when the material is taken out, a minute solder ball may be scattered.
在具有氧阻障性及導電性之銲錫球保存用容器之內部，製作收容脫氧劑之空間，且於該空間收容脫氧劑，藉此以防止銲錫球之氧化之方法，並無防止球表面之變色之效果。此係由於脫氧劑之主成分之Fe在容器中之水分離子化而與Sn反應而使球表面變色之故。變色係招致圖像識別裝置之錯誤。此外，在容器內要準備用以收容脫氧劑之空間，因此容器整體變大，造成作業時處理的不便。In a container for holding a solder ball having oxygen barrier properties and conductivity, a space for accommodating a deoxidizing agent is formed, and a deoxidizing agent is accommodated in the space, thereby preventing oxidation of the solder ball, and the surface of the ball is not prevented. The effect of discoloration. This is because the Fe of the main component of the deoxidizer ionizes in the container and reacts with Sn to cause discoloration of the surface of the sphere. The color change causes an error in the image recognition device. Further, a space for accommodating the deoxidizer is prepared in the container, so that the entire container becomes large, which causes inconvenience in handling during work.
並非在容器內收容脫氧劑，而是使容器之樹脂材料含有防止氧化成分之方法、或是使含有防止氧化成分之構件與銲錫球一起收容於容器內之方法，會有容器之製造成本較高之問題。It is not a method of accommodating a deoxidizing agent in a container, but a method of preventing a oxidizing component in a resin material of a container, or a method of accommodating a member containing an oxidizing component in a container together with a solder ball, and the manufacturing cost of the container is high. The problem.
在容器及捆包資材中雖係使用各種素材，惟只要是每日消耗之銲錫球之容器是回收困難之素材，則會有環境負荷變高之問題。Although various materials are used in the container and the packaging materials, as long as the container of the solder ball consumed daily is a material that is difficult to recover, there is a problem that the environmental load becomes high.
以封印將容器本體之外蓋溶接之方法，其前提係一開封就要使用完畢，因此封印無法二度黏接。因此，無法一次使用完畢時，會有所剩之銲錫球造成浪費之問題。此外，並未充分採取防止氧化手段。The method of sealing the outer cover of the container body by sealing is premised on being opened once, so that the seal cannot be bonded twice. Therefore, when the use is not completed at one time, there is a problem that the remaining solder balls cause waste. In addition, the prevention of oxidation has not been fully taken.
依據將金屬配線材料捲成捲軸並收納於塑膠盒內，且將此金屬配線材料與脫氧劑一同以疊層薄膜封入之包裝方法，盒外部之脫氧劑不會對盒內部之材料發揮有效作用。即使將脫氧劑取代成吸濕劑亦可謂相同。According to the packaging method in which the metal wiring material is wound into a reel and housed in a plastic case, and the metal wiring material is sealed with a deoxidizing agent as a laminated film, the deoxidizing agent outside the cartridge does not exert an effective effect on the material inside the cartridge. Even if the deoxidizer is replaced by a moisture absorbent, the same is true.
因此本發明係為了防止微小銲錫球之氧化及變形之「劣化」，而提供一種可解決習知技術之數個問題之微小銲錫球之保存用密封盒及保存方法。Therefore, in order to prevent "deterioration" of oxidation and deformation of minute solder balls, the present invention provides a sealed box for storing small solder balls and a storage method which can solve several problems of the prior art.
為了解決上述問題，依據本發明，係提供一種微小銲錫球之保存方法，係包含：在由透氣性材料構成之容器充填微小銲錫球之階段；準備應配置於前述容器外部之脫氧乾燥劑之階段；及將前述容器及前述脫氧乾燥劑收納於非透氣性之袋構件內，且密封為氣密狀態之階段。In order to solve the above problems, according to the present invention, there is provided a method for preserving a micro solder ball, comprising: a stage of filling a micro solder ball in a container made of a gas permeable material; and preparing a stage of deoxidizing desiccant disposed outside the container; And storing the container and the deoxidizing desiccant in a non-breathable bag member and sealing the airtight state.
亦可復包含在將前述容器及前述脫氧乾燥劑收納於前述袋構件內之後，於將該袋構件密封為氣密狀態之前，將該袋構件內進行脫氣之階段。Further, after the container and the deoxidizing desiccant are housed in the bag member, the bag member may be deaerated before being sealed in an airtight state.
依據本發明，亦提供一種微小銲錫球之保存用密封盒，係具備：容器，收容有微小銲錫球；脫氧乾燥劑，配置於該容器之外部；及非透氣性之袋構件，收容前述容器及前述脫氧乾燥劑並密封為氣密狀態；前述容器係由透氣性材料所構成。According to the present invention, a sealed box for storing a small solder ball is provided, comprising: a container containing a small solder ball; a deoxidizing desiccant disposed outside the container; and a non-breathable bag member for housing the container and The deoxidizing desiccant is sealed in an airtight state; the container is made of a gas permeable material.
前述袋構件之內部亦可予以脫氣。The inside of the bag member can also be degassed.
前述容器係具備複數個，亦可復具備用以固定維持複數個前述容器間之相對位置之保持構件。The plurality of containers may be provided in plurality, or may have a holding member for fixing and maintaining a relative position between the plurality of containers.
前述保持構件係可作成用以覆蓋複數個前述容器之周圍。The retaining member can be formed to cover the periphery of a plurality of the aforementioned containers.
前述保持構件亦可具有用以緩和來自外部之撞擊之膨出部。The holding member may also have a bulging portion for mitigating an impact from the outside.
當前述脫氧乾燥劑配置於前述保持構件之外部時，前述保持構件係作成具有透氣性者。When the deoxidizing desiccant is disposed outside the holding member, the holding member is made to have gas permeability.
亦可將前述保持構件作成由透氣性材料所構成者。The holding member may be formed of a gas permeable material.
亦可將前述保持構件作成具有透氣口者。The aforementioned holding member may also be made to have a gas vent.
前述保持構件係可具有使前述脫氧乾燥劑座落於適當處之凹部。The aforementioned holding member may have a recess in which the aforementioned deoxidizing desiccant is seated at a proper place.
亦可將前述保持構件作成用以連結複數個前述容器間之連結構件，而該連結構件係可作成可用手斷裂之構造。The holding member may be formed to connect a plurality of connecting members between the containers, and the connecting member may be configured to be broken by a hand.
前述容器係可作成具有自立性之構件。The aforementioned container can be made into a member having self-standing properties.
前述容器係可作成具有容器本體、及覆蓋該容器本體之開口部之蓋構件。The container may be formed as a container body having a container body and an opening covering the container body.
前述容器係可由透明或半透明之樹脂所製作。The aforementioned container may be made of a transparent or translucent resin.
前述容器係可作成具有導電性者。The aforementioned container can be made electrically conductive.
前述保持構件亦可由透明或半透明之樹脂所製作。The holding member may also be made of a transparent or translucent resin.
前述容器係以由適於回收之聚對苯二甲酸乙二酯(polyethylene terephthalate)所製作為較佳。The above container is preferably made of polyethylene terephthalate suitable for recycling.
前述保持構件亦為以由適於回收之聚對苯二甲酸乙二酯所製作為較佳。The holding member is also preferably made of polyethylene terephthalate suitable for recycling.
使用於本發明之微小銲錫球之保存方法且由透氣性材料所構成之容器係可作成具有用於充填微小銲錫球之容器本體、內蓋構件、及外蓋構件；前述內蓋構件係作成在間隙嵌入狀態下嵌合於前述容器本體之前述開口部之尺寸；前述外蓋構件及前述容器本體係作成在前述外蓋構件安裝於前述容器本體之前述開口部時，以成為於前述內蓋構件與前述容器本體之間不形成容許微小銲錫球通過之間隙之狀態之方式保持前述內蓋構件。The container for use in the method for preserving the micro solder balls of the present invention and comprising a gas permeable material can be formed into a container body, an inner cover member, and an outer cover member for filling the micro solder balls; the inner cover member is formed in The outer cover member and the container system are formed to be the inner cover member when the outer cover member is attached to the opening of the container body in a state in which the gap is fitted; The inner lid member is held in such a manner that a gap between the container bodies and the passage of the minute solder balls is not formed.
依據本發明，由於以透氣性材料構成收容微小銲錫球之容器，且將配置於此容器外部之脫氧乾燥劑與容器一同收納於袋構件內並密封為氣密狀態，因此脫氧乾燥劑之效果可涵蓋容器內部之銲錫球整體。所謂脫氧乾燥劑係具有脫氧功能，而且亦吸收水分，藉此而防止對象物因為氧與水分所導致之氧化者。因此，脫氧乾燥劑之效果有助於防止微小銲錫球表面之氧化、黃變。若僅是脫氧劑，屬於脫氧劑之主成分之Fe會在容器中之水分離子化而與Sn反應，成為銲錫球之氧化之原因，惟若為脫氧乾燥劑則會因為其吸濕效果而去除離子化之水分，因此可防止因氧所導致之氧化、因水分所導致之氧化、及兩方原因所導致之氧化。According to the present invention, since the container for accommodating the minute solder balls is formed of a gas permeable material, and the deoxidizing desiccant disposed outside the container is housed in the bag member together with the container and sealed in an airtight state, the effect of the deoxidizing desiccant can be Covers the entire solder ball inside the container. The deoxidizing desiccant has a deoxidizing function and also absorbs moisture, thereby preventing oxidation of the object due to oxygen and moisture. Therefore, the effect of the deoxidizing desiccant helps to prevent oxidation and yellowing of the surface of the tiny solder ball. If it is only a deoxidizer, the Fe which is the main component of the deoxidizer will ionize in the container and react with Sn to become the cause of oxidation of the solder ball. However, if it is a deoxidizing desiccant, it will be removed due to its moisture absorption effect. Ionized moisture prevents oxidation due to oxygen, oxidation due to moisture, and oxidation caused by both causes.
以構成容器之透氣性材料而言，係可藉由具有某程度強度，且具有優異加工性之素材，例如PET(Polyethylene Terephthalate，聚對苯二甲酸乙二酯)等樹脂材料廉價地製作。此外，藉由使用此種本發明之保存方法，即可防止因為球之保存容器及保存容器之保持構件落下或疊起造成銲錫球之變形。再者，就以PET素材作成球之保存容器及/或保存容器之保持構件而言，由於PET劑具有較其他素材，例如PP(polypropylen，聚丙烯)、PS(polystyrene，聚苯乙烯)更容易、豐富且可再利用作為纖維或再度樹脂成形品之手段，因此環境負荷較其他素材小。在如微小銲錫球之消耗材料之保存容器之使用中，以環境負荷較小且可再利用於各種用途之觀點來看，係以使用PET素材為較理想。The gas permeable material constituting the container can be produced at a low cost by a material having a certain strength and excellent workability, for example, a resin material such as PET (Polyethylene Terephthalate). Further, by using the preservation method of the present invention, it is possible to prevent deformation of the solder ball due to dropping or stacking of the holding container of the ball and the holding member of the storage container. Furthermore, in the case of a PET container as a storage container for a ball and/or a holding member for a storage container, the PET agent is easier to use than other materials such as PP (polypropylen, polypropylene), PS (polystyrene, polystyrene). It is rich and reusable as a means of fiber or re-resin molded product, so the environmental load is smaller than other materials. In the use of a storage container for a consumable material such as a micro solder ball, it is preferable to use a PET material from the viewpoint of a small environmental load and being reusable for various uses.
由於未使用脫氧劑，因此不會有因為Fe所引起之變色。Since no deoxidizer is used, there is no discoloration due to Fe.
由於脫氧乾燥劑係配置於容器外，因此容器本身可作成小型，而便於處理。而且，亦無以往在從容器內取出吸濕劑時銲錫球飛散之虞。Since the deoxidizing desiccant is disposed outside the container, the container itself can be made small and easy to handle. Moreover, there is no such thing as a solder ball scattering when the moisture absorbent is taken out from the container.
在銲錫球用剩時，係在袋構件封入新的脫氧乾燥劑之後，將袋構件之開口部以熱壓著等方式確實地再度密封，藉此而可充分保持良好的保存狀態。而於再密封時可利用密封帶等。When the solder ball is left in use, the opening of the bag member is surely resealed by heat pressing or the like after the bag member is sealed with a new deoxidizing desiccant, whereby a good storage state can be sufficiently maintained. A sealing tape or the like can be used for resealing.
本發明之其他效果係由以下記載可明瞭。Other effects of the present invention will be apparent from the following description.
使用圖式說明本發明之實施形態。Embodiments of the present invention will be described using the drawings.
第1圖係為顯示本發明之微小銲錫球之保存用密封盒之一形態之縱剖面圖。第2圖係為顯示封入前之密封盒之狀態之斜視圖。大體而言，在密封盒1中，充填有微小銲錫球之由透氣性材料所構成之容器2、及配置於該容器2外部之脫氧乾燥劑3係收容於非透氣性之袋構件4內，而該袋構件4係密封為氣密狀態。在圖示實施形態中，複數個容器2係藉由保持構件5覆蓋其周圍。Fig. 1 is a longitudinal sectional view showing one embodiment of a sealed casing for storing a minute solder ball of the present invention. Fig. 2 is a perspective view showing the state of the sealed box before sealing. In general, in the sealed case 1, a container 2 made of a gas permeable material filled with a minute solder ball, and a deoxidizing desiccant 3 disposed outside the container 2 are housed in a bag member 4 which is not permeable to air. The bag member 4 is sealed in an airtight state. In the illustrated embodiment, a plurality of containers 2 are covered by the holding member 5 around them.
在將容器2及脫氧乾燥劑3收納於袋構件4內之後，於將袋構件4密封為氣密狀態之前，將袋構件4內進行脫氣亦可。另外，袋構件4內亦可藉由氮或氬等作成惰性氣體環境。After the container 2 and the deoxidizing desiccant 3 are housed in the bag member 4, the bag member 4 may be deaerated before being sealed in an airtight state. Further, the bag member 4 may be made into an inert gas atmosphere by nitrogen or argon or the like.
第3圖係為容器2之縱剖面圖、第4圖係為容器2之分解斜視圖。容器2係具有：用以收容微小銲錫球6(直徑約70μm)之容器本體7；及用以覆蓋該容器本體7之開口部8之蓋構件9。容器本體7與蓋構件9係在各錐形(taper)部嵌合。為了使蓋構件9不會不慎脫落，嵌合雖作成緊密，惟為了可由手容易地卸除，亦可在蓋構件9設置把手部10。內部殘存有未使用之微小銲錫球6時，藉由蓋構件9再度將開口部8關閉。Fig. 3 is a longitudinal sectional view of the container 2, and Fig. 4 is an exploded perspective view of the container 2. The container 2 has a container body 7 for accommodating a minute solder ball 6 (having a diameter of about 70 μm), and a cover member 9 for covering the opening portion 8 of the container body 7. The container body 7 and the lid member 9 are fitted to each taper portion. In order to prevent the cover member 9 from being inadvertently detached, the fitting is made tight, but the handle portion 10 may be provided in the cover member 9 so as to be easily detachable by the hand. When the unused minute solder balls 6 remain inside, the opening portion 8 is closed again by the cover member 9.
本發明之一特徵為：脫氧乾燥劑3配置於容器2之外部，而收容微小銲錫球6之容器2係由透氣性材料所構成。以透氣性材料而言，係可列舉使用例如PET等樹脂材料者。此等樹脂材料係可對容器2賦予可承受某程度撞擊之強度，此外，亦具有優異加工性。之所以非單純在容器2設置透氣口，而是將容器2之材質作成透氣性材料，係為了使來自外部之脫氧乾燥劑3之效果，涵蓋至容器2內之微小銲錫球6整體。複數個位置之透氣口之效果，係較藉由透氣性材料之全面性微小多孔所達成的效果低，而此，會有招致微小銲錫球6之洩漏之虞。One of the features of the present invention is that the deoxidizing desiccant 3 is disposed outside the container 2, and the container 2 accommodating the minute solder balls 6 is made of a gas permeable material. Examples of the gas permeable material include those using a resin material such as PET. These resin materials impart strength to the container 2 that can withstand a certain degree of impact, and also have excellent processability. The reason why the vent port is not simply provided in the container 2 is to make the material of the container 2 a gas permeable material, so that the effect of the deoxidizing desiccant 3 from the outside is included in the entire small solder ball 6 in the container 2. The effect of the venting ports at a plurality of positions is lower than that achieved by the comprehensive microporousness of the gas permeable material, and this may cause leakage of the tiny solder balls 6.
容器2係以由透明或半透明之樹脂材料製作，以可目視確認內部是否有微小銲錫球6為較佳。The container 2 is made of a transparent or translucent resin material, and it is preferable to visually confirm whether or not there is a minute solder ball 6 inside.
關於此而言，由於保持構件5亦以透明或半透明之樹脂材料所製作，因此可從保持構件5外部目視確認容器2內是否有微小銲錫球6。In this regard, since the holding member 5 is also made of a transparent or translucent resin material, it is possible to visually check whether or not the solder balls 6 are present in the container 2 from the outside of the holding member 5.
再者，將容器2內之微小銲錫球6移至板架內時，為了防止微小銲錫球6因為靜電而附著於容器本體7或蓋構件9，結果導致飛散，容器2係以具有導電性者為較佳。為了此目的，係可將容器2以導電性物質予以塗覆。Further, when the minute solder balls 6 in the container 2 are moved into the rack, the small solder balls 6 are prevented from adhering to the container body 7 or the lid member 9 due to static electricity, resulting in scattering, and the container 2 is electrically conductive. It is better. For this purpose, the container 2 can be coated with a conductive substance.
容器2之形態係有各種變形例。將容器2內之微小銲錫球6移至板架上時，為了方便起見，亦可作成在蓋構件9之一部分(例如中央)形成銲錫球取出用之較小開口部，且將該開口部以較小之其他蓋構件予以覆蓋。The form of the container 2 is variously modified. When the minute solder ball 6 in the container 2 is moved to the plate holder, for the sake of convenience, a small opening portion for taking out the solder ball may be formed in a portion (for example, the center) of the cover member 9, and the opening portion may be formed. Cover with a smaller cover member.
以容器2之其他形態而言，如第7圖所示，係有一種具有用於充填微小銲錫球之容器本體2a、內蓋構件2b及外蓋構件2c者。內蓋構件2b係作成在與容器本體2a之開口部之間形成有例如50μm至200μm之空隙(clearance)之間隙嵌入狀態下與容器本體2a之開口部嵌合之尺寸。因此內蓋構件2b在容器本體2a進行安裝及卸除時，實質上不會受到摩擦阻力。In other aspects of the container 2, as shown in Fig. 7, there is provided a container body 2a, an inner lid member 2b, and an outer lid member 2c for filling a minute solder ball. The inner lid member 2b is formed to be fitted to the opening of the container body 2a in a state in which a gap of 50 μm to 200 μm is formed between the opening of the container body 2a. Therefore, the inner lid member 2b is substantially not subjected to frictional resistance when the container body 2a is attached and detached.
另一方面，外蓋構件2c係作成牢固地安裝於容器本體2a而不致不慎脫落之形態。因此，亦可在外蓋構件2c之垂直凸緣(flange)2d，形成用以與容器本體2a之水平凸緣2e卡合之突起2f。On the other hand, the outer lid member 2c is formed in a form that is firmly attached to the container body 2a without being inadvertently peeled off. Therefore, a projection 2f for engaging with the horizontal flange 2e of the container body 2a can be formed in the vertical flange 2d of the outer cover member 2c.
將外蓋構件2c安裝於容器本體2a時，外蓋構件2c與容器2係以在內蓋構件2b與容器本體2a之間不形成容許微小銲錫球通過之間隙之狀態之方式保持內蓋構件2b。具體而言，亦可作成將外蓋構件2c安裝於容器本體2a時，使內蓋構件2b挾持於外蓋構件2c與容器本體2a之肩部2g之間。此時，內蓋構件2b之底面周緣與容器本體2a之肩部2g上面之間，係可為密接狀態，或亦可為形成有不容許微小銲錫球通過之尺寸之空隙。When the outer lid member 2c is attached to the container body 2a, the outer lid member 2c and the container 2 hold the inner lid member 2b such that the gap between the inner lid member 2b and the container body 2a does not allow the passage of the minute solder balls. . Specifically, when the outer lid member 2c is attached to the container body 2a, the inner lid member 2b may be held between the outer lid member 2c and the shoulder portion 2g of the container body 2a. At this time, the peripheral edge of the bottom surface of the inner lid member 2b and the upper surface of the shoulder portion 2g of the container body 2a may be in a close contact state, or may be formed with a gap which does not allow the passage of the minute solder balls.
以保持內蓋構件2b之其他態樣(未圖示)而言，亦可作成在外蓋構件2c與容器本體2a之水平凸緣2e之間挾持內蓋構件2b之水平凸緣2h。In order to maintain the other aspect (not shown) of the inner lid member 2b, the horizontal flange 2h of the inner lid member 2b may be held between the outer lid member 2c and the horizontal flange 2e of the container body 2a.
第7圖之容器之優點係為：由於具有內蓋構件2b，因此容器本體2a內之微小銲錫球不會有因為卸除外蓋構件2c時之撞擊而飛散至外部之危險性。此外，由於內蓋構件2b係在容器本體2a之開口部嵌入間隙，因此在卸除時不會產生撞擊。因此，即使將內蓋構件2b卸除時，亦無微小銲錫球飛散至外部之危險性。The advantage of the container of Fig. 7 is that since the inner lid member 2b is provided, the minute solder balls in the container body 2a are not likely to be scattered to the outside due to the impact when the cover member 2c is removed. Further, since the inner lid member 2b is fitted into the gap at the opening of the container body 2a, no impact is generated at the time of removal. Therefore, even when the inner lid member 2b is removed, there is no risk that the minute solder balls will fly to the outside.
容器本體2a內之微小銲錫球通常一次就全部用完。然而，亦有可能為了下一次的備用而在容器本體2a內留下微小銲錫球。此種情形下，為了不使微小銲錫球殘留於容器本體2a之肩部2g，亦可將肩部2g傾斜地形成於內側。The tiny solder balls in the container body 2a are usually used up all at once. However, it is also possible to leave a minute solder ball in the container body 2a for the next spare. In this case, in order to prevent the minute solder balls from remaining on the shoulder portion 2g of the container body 2a, the shoulder portion 2g may be formed obliquely inside.
此外，圖示之容器2雖係由容器本體與蓋構件所構成，惟亦可作成一體物之容器。一體物之容器係在從取入口將微小銲錫球6收容於容器內之後，以溶接等手段封鎖該取入口而形成。在取出微小銲錫球時，例如將形成於容器之一部分之脆弱部撕開而形成取出用之開口。Further, although the container 2 shown in the drawing is constituted by the container body and the lid member, it may be a container of the unitary body. The container of the integrated body is formed by accommodating the micro solder ball 6 in the container from the inlet, and then sealing the inlet by means of welding or the like. When the minute solder ball is taken out, for example, the fragile portion formed in one portion of the container is torn open to form an opening for taking out.
再者，圖示之容器2係作成具有自立性之構件，藉此雖可承受某程度之撞擊，惟在接受來自外部之撞擊之可能性較低之環境中使用時，亦可不要求容器要有自立性。此時，亦可將容器作成具有可撓性之袋狀構件。Furthermore, the container 2 shown is made of a self-standing member, so that it can withstand a certain degree of impact, but it is not required to have a container when it is used in an environment where the possibility of impact from the outside is low. Self-reliance. At this time, the container may be formed into a flexible bag member.
再度將第1圖及第2圖與第5圖合併參照。在圖示實施形態中，複數個容器2係藉由保持構件5覆蓋周圍整體，而且，固定維持彼此之相對位置。具體而言，保持構件5係由可展開及摺疊之樹脂構件所構成，而於下側板構件11係形成有用以收容容器2之收容部12。在收容部12之下部，係形成有用以緩和來自外部之撞擊之緩衝用膨出部13。此情形之來自外部之撞擊係指因掉落所造成之撞擊。為了緩和其他種類之撞擊，可在適當處設置相同之膨出部。The first picture and the second picture and the fifth picture are combined and referenced again. In the illustrated embodiment, the plurality of containers 2 cover the entire periphery by the holding member 5, and are fixedly held at their relative positions. Specifically, the holding member 5 is composed of a resin member that can be unfolded and folded, and the lower side plate member 11 is formed with a housing portion 12 for accommodating the container 2. A buffer bulging portion 13 for mitigating impact from the outside is formed in the lower portion of the accommodating portion 12. The impact from the outside in this case refers to the impact caused by the drop. In order to alleviate other types of impact, the same bulge can be provided where appropriate.
在保持構件5之上側板構件14，係形成有用以緊壓置入於收容部12內之容器2之蓋構件9的下方突出部15。下方突出部15係於上側板構件14摺疊而與下側板構件11重疊時，穩定保持收容部12內之容器2。分別設於下側板構件11及上側板構件14之孔16及突起17係藉由彼此共同作用，而可將雙方之板構件11、14保持為摺疊狀態。On the upper side plate member 14 of the holding member 5, a lower protruding portion 15 for pressing the lid member 9 of the container 2 placed in the accommodating portion 12 is formed. When the upper side plate member 14 is folded and overlaps with the lower side plate member 11, the lower protruding portion 15 stably holds the container 2 in the accommodating portion 12. The holes 16 and the projections 17 provided in the lower side plate member 11 and the upper side plate member 14 are mutually cooperative, and the both plate members 11, 14 can be held in a folded state.
在上側板構件14之中央係形成凹部18，用以使脫氧乾燥劑3之包裝盒(pack)座落。在下側板構件11之中央，係形成有用以接受在形成凹部18時所產生之下方突起之凹部19。A recess 18 is formed in the center of the upper side plate member 14 for seating the pack of the deoxidizing desiccant 3. In the center of the lower side plate member 11, a recess 19 for receiving the lower projection which is generated when the recess 18 is formed is formed.
脫氧乾燥劑3雖可配置於保持構件5之內部，惟如圖示實施形態所示配置於保持構件5之外部時，必須使覆蓋容器2周圍整體之保持構件5亦具有透氣性。此係為了使脫氧乾燥劑3之效果達到容器2，甚至達到容器2內部之微小銲錫球6。為了使保持構件5保持透氣性，可藉由透氣性材料製作保持構件5本身，亦可在保持構件5形成至少一個透氣口。此種透氣口亦可設置於由透氣性材料所構成之保持構件5。Although the deoxidizing desiccant 3 can be disposed inside the holding member 5, when it is disposed outside the holding member 5 as shown in the illustrated embodiment, it is necessary to make the holding member 5 covering the entire periphery of the container 2 also have gas permeability. This is to achieve the effect of the deoxidizing desiccant 3 to reach the container 2, even to the tiny solder balls 6 inside the container 2. In order to maintain the gas retaining property of the holding member 5, the holding member 5 itself may be made of a gas permeable material, or at least one gas vent may be formed in the holding member 5. Such a vent may also be provided in the holding member 5 composed of a gas permeable material.
在將微小銲錫球充填於容器2內，且將容器2收納於保持構件5之收容部12，並關閉下側板構件11及上側板構件14之後，在凹部18放置脫氧乾燥劑3。將容器2、保持構件5及脫氧乾燥劑3置入於袋構件4之中。袋構件4係為非透氣性之構件。使用於袋構件4之薄膜係作成為氧穿透率及水蒸氣穿透率極低者。關於氧穿透率係以在溫度23℃、溼度0%、氣壓1MPa之環境下，一天穿透每1m2 之薄膜之氧量為10ml以下為佳。關於水蒸氣穿透率係以在溫度40℃、相對濕度90%之環境下，一天穿透每1m2 之薄膜之氧量為1克(gram)以下為佳。袋構件4係可由例如鋁薄膜材料所製作。或者亦可藉由以鋁等塗覆於透氣性材料而賦予非透氣性。After the small solder balls are filled in the container 2, the container 2 is housed in the accommodating portion 12 of the holding member 5, and the lower side plate member 11 and the upper side plate member 14 are closed, the deoxidizing desiccant 3 is placed in the recess 18. The container 2, the holding member 5, and the deoxidizing desiccant 3 are placed in the bag member 4. The bag member 4 is a member that is non-breathable. The film used for the bag member 4 is made to have an extremely low oxygen permeability and water vapor transmission rate. The oxygen permeability is preferably 10 ml or less per 1 m 2 of the film per day under an environment of a temperature of 23 ° C, a humidity of 0%, and a pressure of 1 MPa. The water vapor transmission rate is preferably 1 g or less per 1 m 2 of the film per day under an environment of a temperature of 40 ° C and a relative humidity of 90%. The bag member 4 can be made of, for example, an aluminum film material. Alternatively, the gas permeability may be imparted by coating the gas permeable material with aluminum or the like.
此外，脫氧乾燥劑係具有脫氧功能，而且藉由吸收水分，以防止因為氧與水分所導致對象物之氧化者。再者，以脫氧乾燥劑而言，係例如可使用市售品之RP劑(三菱氣體化學股份有限公司製品之商品名)。Further, the deoxidizing desiccant has a deoxidizing function and absorbs moisture to prevent oxidation of the object due to oxygen and moisture. Further, as the deoxidizing desiccant, for example, a commercially available RP agent (trade name of a product of Mitsubishi Gas Chemical Co., Ltd.) can be used.
亦可在將容器2及脫氧乾燥劑3收納於袋構件4內之後，於將該袋構件密封為氣密狀態之前，將袋構件4內進行脫氣。After the container 2 and the deoxidizing desiccant 3 are housed in the bag member 4, the bag member 4 may be deaerated before the bag member is sealed in an airtight state.
在圖示實施形態中，保持構件5雖係保持4個容器2，惟亦可作成由保持構件5保持5個以上或3個以下之容器2。保持構件5所保持之容器2之數量較多時，亦可增加脫氧乾燥劑3之數量。In the illustrated embodiment, the holding member 5 holds the four containers 2, but the container 2 may be held by the holding member 5 in five or more or three or less containers. When the number of the containers 2 held by the holding member 5 is large, the amount of the deoxidizing desiccant 3 can also be increased.
使用銲錫球之際，係撕開袋構件4之一部分，將保持構件5取出，再打開取出容器2。將容器2之蓋構件9卸除而將其中的微小銲錫球6供給至板架上。不使用之容器2係在收容於保持構件5內之狀態下與未使用之新的脫氧乾燥劑3一同放回袋構件4內。袋構件4之撕開的部分係以熱壓著等方式進行確實的密封，並予以封閉以使外氣不致侵入。一個容器2內之銲錫球未完全用完時，以蓋構件9關閉該容器2，並放回保持構件5以收納於袋構件4內，且將袋構件4再度密封。When the solder ball is used, one portion of the bag member 4 is torn open, the holding member 5 is taken out, and the take-out container 2 is opened. The cover member 9 of the container 2 is removed to supply the minute solder balls 6 therein to the plate holder. The container 2 that is not used is placed in the bag member 4 together with the unused new deoxidizing desiccant 3 in a state of being housed in the holding member 5. The torn portion of the bag member 4 is reliably sealed by heat pressing or the like, and is closed so that the outside air does not intrude. When the solder ball in one of the containers 2 is not completely used up, the container 2 is closed by the cover member 9, and the holding member 5 is returned to be housed in the bag member 4, and the bag member 4 is again sealed.
第6圖係顯示其他實施形態之保持構件。此保持構件係作為連結容器2間之連結構件20，形成為從容器本體朝側方延伸。連結構件20之中央部係作成脆弱部21，使用者可視需要以手將脆弱部21斷裂。連結構件20對於落下等撞擊雖無保護容器2內之銲錫球之功能，惟對於振動等之撞擊，係可藉由固定維持複數個容器2之相對位置，而阻止各個容器2大幅搖擺。Fig. 6 shows a holding member of another embodiment. This holding member is formed as a connecting member 20 that connects the containers 2 and is formed to extend laterally from the container body. The central portion of the connecting member 20 is formed as a fragile portion 21, and the user can break the fragile portion 21 by hand as needed. The connecting member 20 does not function as a solder ball in the protective container 2 for dropping or the like, but it is possible to prevent the respective containers 2 from swinging largely by maintaining the relative positions of the plurality of containers 2 by the vibration or the like.
為了驗證本案發明之效果，茲檢討如下表所示。以第1圖及第2圖所示本發明之實施態樣為實施例1，將直徑70μm之微小銲錫球充填至PET容器(容量40cc)之容量的80%，且將此PET容器以PET托盤(tray)(保持構件)予以保持，與RP劑(脫氧乾燥劑)一同以鋁塗覆袋(袋構件)覆蓋。In order to verify the effect of the invention, the following table is reviewed. According to the embodiment of the present invention shown in Figs. 1 and 2, a small solder ball having a diameter of 70 μm is filled to 80% of the capacity of a PET container (capacity: 40 cc), and the PET container is placed on a PET tray. (tray) (holding member) is held together with an RP agent (deoxidizing desiccant) covered with an aluminum coating bag (bag member).
實施例2係為實施例1中未以保持構件保持容器之例。Embodiment 2 is an example in which the container is not held by the holding member in Embodiment 1.
比較例1係在實施例1中取代RP劑而封入脫氧劑者。Comparative Example 1 is a one in which the RP agent was replaced in Example 1 and the deoxidizer was sealed.
比較例2係在實施例1中不以保持構件保持，且未以鋁塗覆袋覆蓋者。Comparative Example 2 was not held by the holding member in Example 1, and was not covered with an aluminum coated bag.
比較例3係在玻璃瓶充填微小銲錫球，並將RP劑一併封入而予以加栓者。In Comparative Example 3, a small solder ball was filled in a glass bottle, and the RP agent was sealed together and attached.
比較例4係在鋁塗覆袋充填微小銲錫球，並將RP劑一併封入而予以封閉者。In Comparative Example 4, a small solder ball was filled in an aluminum coating bag, and the RP agent was sealed together to be closed.
在以上比較例中，係充填相對於各容器或包裝容量佔80%比例的微小銲錫球。所充填之微小銲錫球係與實施例相同設為直徑70μm之銲錫球。In the above comparative example, a minute solder ball which is 80% of the ratio of each container or package capacity is filled. The micro solder balls filled in the same manner as in the examples were set as solder balls having a diameter of 70 μm.
黃變之實驗方法係實施如下。在設定為溫度30℃、濕度70%之恆溫恆濕槽置入各實施例、比較例，經30天(720小時)後取出，以分光測色儀測量微小銲錫球表面之黃度。裝置係使用柯尼卡美樂達(Konica Minolta)公司製之分光測色儀CM-3500d。The experimental method of yellowing is implemented as follows. The constant temperature and humidity chambers set to a temperature of 30 ° C and a humidity of 70% were placed in each of the examples and comparative examples, and taken out after 30 days (720 hours), and the yellowness of the surface of the minute solder balls was measured by a spectrophotometer. The device used a spectrophotometer CM-3500d manufactured by Konica Minolta.
氧化膜之實驗方法係為與黃變之實驗方法相同之方法，係藉由歐傑(Auger)電子分光法測量各實施例、比較例中之微小銲錫球表面之氧化膜之厚度。裝置係使用ULVAC‧PHI公司製PHI-700。The experimental method of the oxide film is the same as the experimental method of the yellowing, and the thickness of the oxide film on the surface of the minute solder ball in each of the examples and the comparative examples was measured by Auger electron spectroscopy. The device was a PHI-700 manufactured by ULVAC‧PHI.
銲錫球之扭曲率係在進行各實施例、比較例之包裝後，將微小銲錫球置入任意的瓦楞紙箱。接著在各瓦楞紙箱上載放100kg之重量體，以CNC圖像測量系統測量銲錫球之真球率。裝置係使用三豐(MITUTOYO)公司製之ULTRA QUICK VISION、ULTRA QV350-PRO。The distortion rate of the solder balls was placed in an arbitrary corrugated cardboard box after the packaging of each of the examples and the comparative examples was carried out. Next, a weight of 100 kg was placed on each corrugated box, and the true ball rate of the solder ball was measured by a CNC image measuring system. The device used ULTRA QUICK VISION and ULTRA QV350-PRO manufactured by MITUTOYO.
靜電實驗係使微小銲錫球產生靜電，進行測試在開封時鋁塗覆袋或栓之任意部位1平方毫米內有幾個微小銲錫球附著。The electrostatic experiment caused static electricity to be generated by the tiny solder balls. Several small solder balls were attached within 1 square millimeter of any part of the aluminum coating bag or plug at the time of opening.
落下實驗係將充填有銲錫球之包裝20個捆包於瓦楞紙箱。捆包後保持上下不變，從高度50公分位置落下2次。落下後進行開箱，評估容器破損等之狀態。In the drop test, 20 packages filled with solder balls were bundled in a corrugated box. After the bale, it stays up and down and falls 2 times from the height of 50 cm. After the drop, the case is unpacked, and the state of the container is damaged.
以上實施例、比較例驗證之結果，藉由本案發明之方法，由比較實施例1、2與比較例1、2之比較得知，可抑制微小銲錫球之氧化、黃變，甚且亦防止因為來自外部壓力所造成微小銲錫球之變形，並且由實施例1、2與比較例3、4之比較得知，可獲得防止微小銲錫球因為靜電附著於包裝材料所引起微小銲錫球之變形、逸散之優異效果。As a result of the verification of the above examples and comparative examples, it was found by comparison between Comparative Examples 1 and 2 and Comparative Examples 1 and 2 by the method of the present invention that oxidation and yellowing of minute solder balls can be suppressed and even prevented. Because of the deformation of the tiny solder balls caused by the external pressure, and by comparison between Examples 1 and 2 and Comparative Examples 3 and 4, it is possible to prevent deformation of the tiny solder balls caused by the adhesion of the tiny solder balls to the packaging material due to static electricity. Excellent effect of escape.
1‧‧‧密封盒1‧‧‧ Sealing box
2‧‧‧容器2‧‧‧ Container
2a‧‧‧容器本體2a‧‧‧Container body
2b‧‧‧內蓋構件2b‧‧‧ inner cover member
2c‧‧‧外蓋構件2c‧‧‧ Cover member
2d‧‧‧外蓋構件之垂直凸緣2d‧‧‧ vertical flange of the cover member
2e‧‧‧容器本體之水平凸緣2e‧‧‧ horizontal flange of the container body
2f‧‧‧突起2f‧‧‧ prominence
2g‧‧‧容器本體之肩部2g‧‧‧ Shoulder of the container body
2h‧‧‧內蓋構件之水平凸緣2h‧‧‧ horizontal flange of inner cover member
3‧‧‧脫氧乾燥劑3‧‧‧Deoxidizing desiccant
4‧‧‧袋構件4‧‧‧ bag components
5‧‧‧保持構件5‧‧‧Retaining components
6‧‧‧微小銲錫球6‧‧‧Small solder balls
7‧‧‧容器本體7‧‧‧ container body
8‧‧‧開口部8‧‧‧ openings
9‧‧‧蓋構件9‧‧‧Caps
10‧‧‧把手部10‧‧‧Hands
11‧‧‧下側板構件11‧‧‧lower plate member
12‧‧‧收容部12‧‧‧ Housing Department
13‧‧‧緩衝用膨出部13‧‧‧buffering bulging
14‧‧‧上側板構件14‧‧‧Upper plate member
15‧‧‧下方突出部15‧‧‧ below the protrusion
16‧‧‧孔16‧‧‧ hole
17‧‧‧突起17‧‧‧ Protrusion
18、19‧‧‧凹部18, 19‧‧ ‧ recess
20‧‧‧連結構件20‧‧‧Connected components
21‧‧‧脆弱部21‧‧‧ Fragile Department
第1圖係為顯示本發明之微小銲錫球之保存用密封盒之一形態的縱剖面圖。Fig. 1 is a longitudinal cross-sectional view showing one embodiment of a sealed case for storing tiny solder balls of the present invention.
第2圖係為顯示封入前之本發明之密封盒之狀態之斜視圖。Fig. 2 is a perspective view showing the state of the sealed casing of the present invention before being sealed.
第3圖係為容器之剖面圖。Figure 3 is a cross-sectional view of the container.
第4圖係為容器之斜視圖。Figure 4 is a perspective view of the container.
第5圖係為收納於保持構件內之狀態之容器之斷片剖面圖。Fig. 5 is a cross-sectional view showing a fragment of a container housed in a holding member.
第6圖係為與容器一同顯示其他形態之保持構件之平面圖。Figure 6 is a plan view showing the holding member of the other form together with the container.
第7圖係為其他形態之容器之縱剖面圖。Figure 7 is a longitudinal sectional view of a container of another form.
1．．．密封盒1. . . Sealed box
2．．．容器2. . . container
3．．．脫氧乾燥劑3. . . Deoxidizing desiccant
4．．．袋構件4. . . Bag member
5．．．保持構件5. . . Holding member
11．．．下側板構件11. . . Lower side member
13．．．緩衝用膨出部13. . . Buffering bulge
14．．．上側板構件14. . . Upper side member
15．．．下方突出部15. . . Lower projection
18、19．．．凹部18, 19. . . Concave
Claims (14)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008306492 | 2008-12-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201026565A TW201026565A (en) | 2010-07-16 |
| TWI389825B true TWI389825B (en) | 2013-03-21 |
Family
ID=42233044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098140781A TWI389825B (en) | 2008-12-01 | 2009-11-30 | Package for storing micro solder balls |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US8434614B2 (en) |
| EP (1) | EP2354035B8 (en) |
| JP (1) | JP4868267B2 (en) |
| KR (1) | KR101129009B1 (en) |
| CN (1) | CN102245482B (en) |
| MY (1) | MY165840A (en) |
| PL (1) | PL2354035T3 (en) |
| PT (1) | PT2354035E (en) |
| SG (1) | SG171880A1 (en) |
| TW (1) | TWI389825B (en) |
| WO (1) | WO2010064385A1 (en) |
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| KR101972924B1 (en) | 2011-11-11 | 2019-08-23 | 삼성전자주식회사 | Method and apparatus for designating enire area using partial area touch in a portable equipment |
| CN102731906A (en) * | 2012-05-30 | 2012-10-17 | 上海新华锦焊接材料科技有限公司 | Antistatic solder-ball bottle for solder balls |
| WO2016111179A1 (en) * | 2015-01-09 | 2016-07-14 | 千住金属工業株式会社 | Solder ball container and package for storing solder ball |
| CN105501631B (en) * | 2015-12-31 | 2019-02-15 | 苏州奥特科然医疗科技有限公司 | A kind of packing container and its application |
| CN205615843U (en) * | 2016-04-22 | 2016-10-05 | 宁波高新区远创科技有限公司 | A packaging structure for welding powder |
| JP6418475B2 (en) * | 2016-07-08 | 2018-11-07 | 千住金属工業株式会社 | Container and package |
| US11325750B2 (en) | 2018-03-01 | 2022-05-10 | Pak Products, LLC | Container for storing personal care item |
| CN108357788B (en) * | 2018-03-29 | 2024-04-16 | 山东威高骨科材料股份有限公司 | Packing box of bone prosthesis and packing method of bone prosthesis |
| WO2020227565A1 (en) * | 2019-05-08 | 2020-11-12 | Kate Westad | Container for storing personal care item |
| EP3862290A1 (en) * | 2020-02-07 | 2021-08-11 | Packing Kungsör AB | Secure transport container |
| USD1010454S1 (en) | 2021-09-03 | 2024-01-09 | Graham Packaging Company, L.P. | Container |
| USD1003725S1 (en) | 2021-09-03 | 2023-11-07 | Graham Packaging Company, L.P. | Container |
| CN113955311B (en) * | 2021-10-29 | 2022-11-01 | 山东省农业科学院 | Peanut seed long-term storage bag and use method |
| DE102022133751B3 (en) * | 2022-12-16 | 2024-03-21 | Huhtamaki Flexible Packaging Germany Gmbh & Co. Kg | Collective packaging with a high barrier, containing a plurality of individual packaging with a low barrier |
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- 2009-11-26 PL PL09830156T patent/PL2354035T3/en unknown
- 2009-11-26 PT PT98301567T patent/PT2354035E/en unknown
- 2009-11-26 CN CN2009801482282A patent/CN102245482B/en active Active
- 2009-11-26 KR KR1020117012860A patent/KR101129009B1/en active IP Right Grant
- 2009-11-26 SG SG2011039625A patent/SG171880A1/en unknown
- 2009-11-26 US US13/123,585 patent/US8434614B2/en active Active
- 2009-11-26 EP EP09830156.7A patent/EP2354035B8/en active Active
- 2009-11-26 WO PCT/JP2009/006383 patent/WO2010064385A1/en active Application Filing
- 2009-11-26 MY MYPI2011002474A patent/MY165840A/en unknown
- 2009-11-26 JP JP2010541210A patent/JP4868267B2/en active Active
- 2009-11-30 TW TW098140781A patent/TWI389825B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201026565A (en) | 2010-07-16 |
| EP2354035A4 (en) | 2012-05-09 |
| EP2354035B8 (en) | 2013-07-10 |
| EP2354035A1 (en) | 2011-08-10 |
| US20110198253A1 (en) | 2011-08-18 |
| MY165840A (en) | 2018-05-17 |
| US8434614B2 (en) | 2013-05-07 |
| SG171880A1 (en) | 2011-07-28 |
| CN102245482B (en) | 2012-09-26 |
| KR20110081353A (en) | 2011-07-13 |
| KR101129009B1 (en) | 2012-03-27 |
| PT2354035E (en) | 2013-08-22 |
| JPWO2010064385A1 (en) | 2012-05-10 |
| CN102245482A (en) | 2011-11-16 |
| PL2354035T3 (en) | 2013-09-30 |
| EP2354035B1 (en) | 2013-05-29 |
| JP4868267B2 (en) | 2012-02-01 |
| WO2010064385A1 (en) | 2010-06-10 |
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