TWI374513B - - Google Patents
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- Publication number
- TWI374513B TWI374513B TW97136281A TW97136281A TWI374513B TW I374513 B TWI374513 B TW I374513B TW 97136281 A TW97136281 A TW 97136281A TW 97136281 A TW97136281 A TW 97136281A TW I374513 B TWI374513 B TW I374513B
- Authority
- TW
- Taiwan
- Prior art keywords
- cover
- semiconductor die
- stage
- semiconductor
- suction opening
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008169897A JP4215818B1 (ja) | 2008-06-30 | 2008-06-30 | 半導体ダイのピックアップ装置及びピックアップ方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201001614A TW201001614A (en) | 2010-01-01 |
TWI374513B true TWI374513B (ja) | 2012-10-11 |
Family
ID=40361329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97136281A TW201001614A (en) | 2008-06-30 | 2008-09-22 | Semiconductor die pickup apparatus and semiconductor die pickup method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4215818B1 (ja) |
TW (1) | TW201001614A (ja) |
WO (1) | WO2010001497A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5284040B2 (ja) * | 2008-11-04 | 2013-09-11 | キヤノンマシナリー株式会社 | チップ剥離方法、チップ剥離装置、および半導体装置製造方法 |
JP5184303B2 (ja) * | 2008-11-04 | 2013-04-17 | キヤノンマシナリー株式会社 | チップ剥離方法、チップ剥離装置、および半導体装置製造方法 |
JP4397429B1 (ja) * | 2009-03-05 | 2010-01-13 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
JP4927979B2 (ja) | 2010-09-28 | 2012-05-09 | 株式会社新川 | 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法 |
KR20140124871A (ko) * | 2011-02-28 | 2014-10-27 | 샌디스크 세미컨덕터 (상하이) 컴퍼니, 리미티드 | 비균일 진공 프로파일 다이 부착 팁 |
JP2013065712A (ja) * | 2011-09-16 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及びボンディング方法 |
JP2013065731A (ja) * | 2011-09-19 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及びボンディング方法 |
KR200468690Y1 (ko) * | 2012-08-31 | 2013-08-29 | 세메스 주식회사 | 다이 이젝팅 장치 |
JP6349496B2 (ja) * | 2014-02-24 | 2018-07-04 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
KR102220346B1 (ko) * | 2019-09-06 | 2021-02-25 | 세메스 주식회사 | 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003224088A (ja) * | 2002-01-29 | 2003-08-08 | Nec Electronics Corp | 半導体チップピックアップ装置 |
JP2003264203A (ja) * | 2002-03-11 | 2003-09-19 | Hitachi Ltd | 半導体装置の製造方法 |
JP4457715B2 (ja) * | 2003-04-10 | 2010-04-28 | パナソニック株式会社 | チップのピックアップ装置およびピックアップ方法 |
JP3999744B2 (ja) * | 2004-01-05 | 2007-10-31 | 芝浦メカトロニクス株式会社 | 半導体チップのピックアップ装置 |
US7240422B2 (en) * | 2004-05-11 | 2007-07-10 | Asm Assembly Automation Ltd. | Apparatus for semiconductor chip detachment |
-
2008
- 2008-06-30 JP JP2008169897A patent/JP4215818B1/ja not_active Expired - Fee Related
- 2008-08-13 WO PCT/JP2008/064516 patent/WO2010001497A1/ja active Application Filing
- 2008-09-22 TW TW97136281A patent/TW201001614A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4215818B1 (ja) | 2009-01-28 |
JP2010010519A (ja) | 2010-01-14 |
WO2010001497A1 (ja) | 2010-01-07 |
TW201001614A (en) | 2010-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |