TWI369739B - Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus - Google Patents
Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatusInfo
- Publication number
- TWI369739B TWI369739B TW096109491A TW96109491A TWI369739B TW I369739 B TWI369739 B TW I369739B TW 096109491 A TW096109491 A TW 096109491A TW 96109491 A TW96109491 A TW 96109491A TW I369739 B TWI369739 B TW I369739B
- Authority
- TW
- Taiwan
- Prior art keywords
- vertical
- processing apparatus
- type heat
- heat processing
- transfer mechanism
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006076134A JP2007251088A (ja) | 2006-03-20 | 2006-03-20 | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200809976A TW200809976A (en) | 2008-02-16 |
TWI369739B true TWI369739B (en) | 2012-08-01 |
Family
ID=38595016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096109491A TWI369739B (en) | 2006-03-20 | 2007-03-20 | Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US7905700B2 (zh) |
JP (1) | JP2007251088A (zh) |
KR (1) | KR20070095209A (zh) |
CN (1) | CN100573818C (zh) |
TW (1) | TWI369739B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110286822A1 (en) * | 2008-07-11 | 2011-11-24 | Mei, Inc. | Automated document handling system |
JP5131094B2 (ja) | 2008-08-29 | 2013-01-30 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法並びに記憶媒体 |
JP5042950B2 (ja) * | 2008-09-05 | 2012-10-03 | 東京エレクトロン株式会社 | 縦型熱処理装置及び基板支持具 |
JP5456287B2 (ja) | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
US9048274B2 (en) * | 2008-12-08 | 2015-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Portable stocker and method of using same |
JP5757721B2 (ja) * | 2009-12-28 | 2015-07-29 | 株式会社日立国際電気 | 基板処理装置、基板処理装置の異常表示方法、搬送制御方法およびデータ収集プログラム |
JP5318005B2 (ja) * | 2010-03-10 | 2013-10-16 | 株式会社Sokudo | 基板処理装置、ストッカー装置および基板収納容器の搬送方法 |
JP5715904B2 (ja) | 2011-07-29 | 2015-05-13 | 東京エレクトロン株式会社 | 熱処理装置、及びこれに基板を搬送する基板搬送方法 |
US20140064884A1 (en) * | 2012-09-06 | 2014-03-06 | Shenzhen China Star Optoelectronic Technology Co., Ltd. | Oven and Adjustable Baking System |
KR101859441B1 (ko) | 2012-11-30 | 2018-05-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 진동-제어되는 기판 핸들링 로봇, 시스템들, 및 방법들 |
JP6339909B2 (ja) * | 2014-09-17 | 2018-06-06 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
CN107155370B (zh) | 2014-12-26 | 2020-07-31 | 川崎重工业株式会社 | 搬送装置的控制装置 |
CN107851594B (zh) * | 2015-08-28 | 2021-06-22 | 株式会社国际电气 | 基板处理装置以及半导体装置的制造方法 |
US10978322B2 (en) * | 2017-08-30 | 2021-04-13 | Tokyo Electron Limited | Transfer device, substrate processing apparatus, and transfer method |
JP6667576B2 (ja) * | 2017-08-30 | 2020-03-18 | 東京エレクトロン株式会社 | 搬送装置、基板処理装置及び搬送方法 |
SG11202110089XA (en) * | 2019-03-29 | 2021-10-28 | Hirata Spinning | Attachment device |
CN110993550B (zh) * | 2019-12-25 | 2022-12-09 | 北京北方华创微电子装备有限公司 | 半导体热处理设备 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63245388A (ja) * | 1987-03-30 | 1988-10-12 | フアナツク株式会社 | 産業ロボットにおける運動の阻害事態の警報装置 |
US4925312A (en) * | 1988-03-21 | 1990-05-15 | Staubli International Ag | Robot control system having adaptive feedforward torque control for improved accuracy |
US5110248A (en) * | 1989-07-17 | 1992-05-05 | Tokyo Electron Sagami Limited | Vertical heat-treatment apparatus having a wafer transfer mechanism |
JPH10107125A (ja) * | 1996-08-08 | 1998-04-24 | Tokyo Electron Ltd | 搬送装置のインターロック機構 |
US5963449A (en) * | 1996-08-08 | 1999-10-05 | Tokyo Electron Limited | Interlock apparatus for a transfer machine |
JP3570827B2 (ja) * | 1996-09-13 | 2004-09-29 | 東京エレクトロン株式会社 | 処理装置 |
JP3288250B2 (ja) * | 1997-03-25 | 2002-06-04 | ファナック株式会社 | ロボット制御装置 |
JPH1154593A (ja) | 1997-08-06 | 1999-02-26 | Kokusai Electric Co Ltd | 縦型熱処理装置 |
US6060721A (en) * | 1998-05-06 | 2000-05-09 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus for detecting correct positioning of a wafer cassette |
JP2000150612A (ja) * | 1998-11-09 | 2000-05-30 | Sony Corp | ウェーハ搬送装置 |
JP3579278B2 (ja) * | 1999-01-26 | 2004-10-20 | 東京エレクトロン株式会社 | 縦型熱処理装置及びシール装置 |
JP3392779B2 (ja) * | 1999-05-25 | 2003-03-31 | ファナック株式会社 | 作業の異常監視機能を備えたロボット制御装置 |
JP3459973B2 (ja) * | 1999-10-22 | 2003-10-27 | 川崎重工業株式会社 | 駆動制御方法および駆動制御装置 |
JP2001223254A (ja) | 2000-02-10 | 2001-08-17 | Hitachi Ltd | ウエハ搬送装置および半導体製造装置 |
JP4653875B2 (ja) * | 2000-07-27 | 2011-03-16 | 株式会社日立国際電気 | 基板処理装置および半導体装置の製造方法 |
US8983776B2 (en) * | 2002-03-28 | 2015-03-17 | Jason A. Dean | Programmable robotic apparatus |
JP3369165B1 (ja) * | 2002-04-09 | 2003-01-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP2004104011A (ja) * | 2002-09-12 | 2004-04-02 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP3911258B2 (ja) * | 2003-08-18 | 2007-05-09 | 川崎重工業株式会社 | 制御装置による駆動装置の制御方法および制御装置 |
KR100568869B1 (ko) * | 2004-05-17 | 2006-04-10 | 삼성전자주식회사 | 반도체 제조설비의 카세트 포지션 조절장치 및 그 방법 |
JP4486489B2 (ja) * | 2004-12-22 | 2010-06-23 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
JP4382052B2 (ja) * | 2006-03-28 | 2009-12-09 | 川崎重工業株式会社 | 駆動体の制御装置および制御方法 |
-
2006
- 2006-03-20 JP JP2006076134A patent/JP2007251088A/ja active Pending
-
2007
- 2007-03-19 US US11/723,399 patent/US7905700B2/en active Active
- 2007-03-19 CN CNB200710100672XA patent/CN100573818C/zh not_active Expired - Fee Related
- 2007-03-19 KR KR1020070026430A patent/KR20070095209A/ko not_active Application Discontinuation
- 2007-03-20 TW TW096109491A patent/TWI369739B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2007251088A (ja) | 2007-09-27 |
KR20070095209A (ko) | 2007-09-28 |
US20070248439A1 (en) | 2007-10-25 |
US7905700B2 (en) | 2011-03-15 |
CN100573818C (zh) | 2009-12-23 |
TW200809976A (en) | 2008-02-16 |
CN101042995A (zh) | 2007-09-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI369739B (en) | Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus | |
IL198136A0 (en) | Method for heat transfer and device therefor | |
HK1132317A1 (en) | Apparatus and method for heating and/or cooling | |
TWI347650B (en) | Substrate processing apparatus and substrate transferring method | |
TWI370508B (en) | Substrate processing apparatus and substrate processing method | |
TWI348189B (en) | Substrate treatment apparatus and substrate treatment method | |
PL3582399T3 (pl) | Sposób i urządzenie do przetwarzania danych | |
EP2006893A4 (en) | TREATMENT METHOD AND APPARATUS | |
TWI340997B (en) | Substrate treatment apparatus and substrate treatment method | |
TWI366073B (en) | Processing apparatus and device manufacturing method | |
EP2018235A4 (en) | SURFACE TREATMENT DEVICE AND METHOD | |
GB0617771D0 (en) | Slide processing apparatus and method | |
TWI366869B (en) | Substrate treatment method and substrate treatment apparatus | |
TWI367538B (en) | Substrate processing apparatus and substrate processing method | |
EP1995771A4 (en) | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | |
HUE043135T2 (hu) | Fülzúgás kezelésére szolgáló módszerek és készülékek | |
PT2167896T (pt) | Aparelho ajustável de troca de calor e método de uso | |
EP2056686A4 (en) | COOLING DEVICE AND METHOD FOR REDUCING THE RISK OF MALE BARRENESS IN ENVIRONMENTS WITH INCREASED TEMPERATURE | |
EP2033102A4 (en) | METHOD AND APPARATUS FOR REALIZING ARBITRATION | |
GB0722765D0 (en) | Method and apparatus for cleaning of heat transfer structures | |
TWI318292B (en) | Transfer characteristic calculation apparatus, transfer characteristic calculation method, and exposure apparatus | |
EP2016358A4 (en) | USER MODULABLE HEAT EXCHANGER AND METHOD OF USE | |
EP1977182A4 (en) | HEAT EXCHANGER AND USE METHOD | |
TWI346973B (en) | Substrate processing apparatus and substrate processing method | |
GB0808083D0 (en) | An apparatus and method for heat treatment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |