TWI367790B - Apparatus and method of generating ultrasonic vibration and apparatus and method of cleaning a wafer using the same - Google Patents
Apparatus and method of generating ultrasonic vibration and apparatus and method of cleaning a wafer using the sameInfo
- Publication number
- TWI367790B TWI367790B TW097135011A TW97135011A TWI367790B TW I367790 B TWI367790 B TW I367790B TW 097135011 A TW097135011 A TW 097135011A TW 97135011 A TW97135011 A TW 97135011A TW I367790 B TWI367790 B TW I367790B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- cleaning
- same
- ultrasonic vibration
- generating ultrasonic
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000004140 cleaning Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/02—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070095008A KR100887226B1 (ko) | 2007-09-19 | 2007-09-19 | 초음파 진동 생성 장치 및 방법 그리고 웨이퍼 세정 장치및 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200918189A TW200918189A (en) | 2009-05-01 |
TWI367790B true TWI367790B (en) | 2012-07-11 |
Family
ID=40453162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097135011A TWI367790B (en) | 2007-09-19 | 2008-09-12 | Apparatus and method of generating ultrasonic vibration and apparatus and method of cleaning a wafer using the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US8402980B2 (zh) |
JP (1) | JP4914413B2 (zh) |
KR (1) | KR100887226B1 (zh) |
CN (1) | CN101391255B (zh) |
TW (1) | TWI367790B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4965485B2 (ja) * | 2008-02-29 | 2012-07-04 | 東京応化工業株式会社 | 処理液浸透ユニットおよび処理装置 |
JP5449953B2 (ja) * | 2009-09-29 | 2014-03-19 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
TWI490931B (zh) * | 2009-10-05 | 2015-07-01 | Tokyo Electron Ltd | 超音波清洗裝置、超音波清洗方法、及記錄有用來執行此超音波清洗方法之電腦程式的記錄媒體 |
US7918309B1 (en) * | 2010-07-07 | 2011-04-05 | Robert Kenneth Vierra | Apparatus for producing a continuous sonic boom |
CN102496591B (zh) * | 2011-12-30 | 2016-04-06 | 上海集成电路研发中心有限公司 | 晶圆的清洗装置及清洗方法 |
TWI721080B (zh) * | 2017-01-09 | 2021-03-11 | 大陸商盛美半導體設備(上海)股份有限公司 | 用來清洗襯底的裝置以及高溫化學溶液供液系統 |
KR102152906B1 (ko) * | 2018-11-20 | 2020-09-09 | 세메스 주식회사 | 본딩 장치 및 본딩 방법 |
CN111092033A (zh) * | 2019-12-24 | 2020-05-01 | 广东工业大学 | 一种超声电化学复合的晶片清洗装置及其清洗方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2730756B2 (ja) * | 1988-04-13 | 1998-03-25 | 日立建機株式会社 | 超音波探触子及びその製造方法 |
US5511296A (en) * | 1994-04-08 | 1996-04-30 | Hewlett Packard Company | Method for making integrated matching layer for ultrasonic transducers |
US5894452A (en) * | 1994-10-21 | 1999-04-13 | The Board Of Trustees Of The Leland Stanford Junior University | Microfabricated ultrasonic immersion transducer |
JPH1154471A (ja) * | 1997-08-05 | 1999-02-26 | Tokyo Electron Ltd | 処理装置及び処理方法 |
JP2000216126A (ja) | 1999-01-22 | 2000-08-04 | Dainippon Screen Mfg Co Ltd | 基板洗浄方法およびその装置 |
US20030062071A1 (en) * | 2001-09-28 | 2003-04-03 | Sorbo Nelson W. | Dense-phase fluid cleaning system utilizing ultrasonic transducers |
KR20040003714A (ko) * | 2002-07-03 | 2004-01-13 | (주)케이.씨.텍 | 웨이퍼 세정 장치 |
US20040009740A1 (en) * | 2002-07-12 | 2004-01-15 | Applied Materials, Inc. | Method and composition for chemical polishing |
KR100551413B1 (ko) * | 2003-08-11 | 2006-02-09 | 동부아남반도체 주식회사 | 양면 메가소닉 세정장치 |
JP4519541B2 (ja) * | 2004-06-24 | 2010-08-04 | 株式会社東芝 | 超音波洗浄装置 |
-
2007
- 2007-09-19 KR KR1020070095008A patent/KR100887226B1/ko active IP Right Grant
-
2008
- 2008-09-12 US US12/209,254 patent/US8402980B2/en active Active
- 2008-09-12 TW TW097135011A patent/TWI367790B/zh active
- 2008-09-18 CN CN2008101490500A patent/CN101391255B/zh active Active
- 2008-09-19 JP JP2008241476A patent/JP4914413B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009076916A (ja) | 2009-04-09 |
CN101391255A (zh) | 2009-03-25 |
US20090071504A1 (en) | 2009-03-19 |
KR100887226B1 (ko) | 2009-03-06 |
JP4914413B2 (ja) | 2012-04-11 |
US8402980B2 (en) | 2013-03-26 |
TW200918189A (en) | 2009-05-01 |
CN101391255B (zh) | 2010-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI367790B (en) | Apparatus and method of generating ultrasonic vibration and apparatus and method of cleaning a wafer using the same | |
EP2285504A4 (en) | METHODS AND APPARATUS FOR ULTRASONIC CLEANING | |
GB2438242B (en) | Enhanced amplitude piezoelectric motor apparatus and method | |
TWI365779B (en) | Microbubble generating apparatus and method | |
IL193152A0 (en) | Apparatus and method for controlling the machininig of workpieces using piezoceramic transducers | |
EP2446956A4 (en) | METHOD FOR GENERATING A FOG AND MICROBULLES USING SUPERFICIAL ACOUSTIC WAVE AND DEVICE FOR GENERATING A FOG AND MICROBULLE | |
IL215225A0 (en) | Apparatus and method for sculpting the surface of a joint | |
LT1825081T (lt) | Bangų generatorius | |
EP2113169A4 (en) | CLEANING DEVICE AND CLEANING METHOD FOR THE DEVICE | |
IL210653A0 (en) | Apparatus and method for sculpting the surface of a joint | |
EP2007175A4 (en) | PLASMA GENERATOR AND METHOD FOR PRODUCING PLASMA THEREFOR | |
EP1825816A4 (en) | ULTRASOUND OBSERVATION APPARATUS | |
GB0709143D0 (en) | Method and apparatus for the use of a breathalyser device | |
EP2001044A4 (en) | PLASMA GENERATION DEVICE AND METHOD FOR PLASMA PROCESSING | |
EP1973228A4 (en) | METHOD FOR MANUFACTURING A SURFACE WAVE COMPARTMENT AND SURFACE WAVE COMPARTMENT | |
EP2177278A4 (en) | SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD | |
EP1990915A4 (en) | ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME | |
EP2224470A4 (en) | METHOD AND APPARATUS FOR CLEANING SILICON WAFER | |
ZA200700018B (en) | Apparatus for cleaning textiles and method of using the same | |
GB0612675D0 (en) | Apparatus for generating relative motion from wave motion | |
EP1864393A4 (en) | APPARATUS AND METHOD FOR GENERATING ACOUSTIC WAVE | |
TWI368265B (en) | Wafer cleaning apparatus and correcting method of the same | |
EP2131235A4 (en) | DEVICE FOR PRODUCING SECOND HIGH-VOLTAGE AND METHOD FOR THE PRODUCTION THEREOF | |
TWI372661B (en) | Cleaning apparatus and cleaning method | |
EP2004546A4 (en) | METHOD AND APPARATUS FOR GENERATING OZONE |