TWI315553B - Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device - Google Patents
Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor deviceInfo
- Publication number
- TWI315553B TWI315553B TW095109790A TW95109790A TWI315553B TW I315553 B TWI315553 B TW I315553B TW 095109790 A TW095109790 A TW 095109790A TW 95109790 A TW95109790 A TW 95109790A TW I315553 B TWI315553 B TW I315553B
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- semiconductor device
- fabricating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C35/00—Rigid support of bearing units; Housings, e.g. caps, covers
- F16C35/04—Rigid support of bearing units; Housings, e.g. caps, covers in the case of ball or roller bearings
- F16C35/06—Mounting or dismounting of ball or roller bearings; Fixing them onto shaft or in housing
- F16C35/063—Fixing them on the shaft
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/001—Article feeders for assembling machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005081582A JP2006269496A (ja) | 2005-03-22 | 2005-03-22 | フレキシブルプリント配線基板、および半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200642019A TW200642019A (en) | 2006-12-01 |
TWI315553B true TWI315553B (en) | 2009-10-01 |
Family
ID=37016069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095109790A TWI315553B (en) | 2005-03-22 | 2006-03-22 | Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060213684A1 (zh) |
JP (1) | JP2006269496A (zh) |
KR (1) | KR100819195B1 (zh) |
CN (1) | CN1838859A (zh) |
TW (1) | TWI315553B (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4485460B2 (ja) * | 2004-12-16 | 2010-06-23 | 三井金属鉱業株式会社 | フレキシブルプリント配線板 |
JP4326014B2 (ja) * | 2006-12-15 | 2009-09-02 | 株式会社伸光製作所 | 回路基板とその製造方法 |
JP2008227179A (ja) | 2007-03-13 | 2008-09-25 | Toshiba Mach Co Ltd | プリント基板 |
KR100862870B1 (ko) * | 2007-05-10 | 2008-10-09 | 동부일렉트로닉스 주식회사 | 반도체 소자 및 그 제조방법 |
TWI394499B (zh) * | 2008-05-12 | 2013-04-21 | Au Optronics Corp | 可撓性電路板 |
JP5376653B2 (ja) * | 2009-06-09 | 2013-12-25 | 株式会社フジクラ | フレキシブルプリント基板およびその製造方法 |
JP5051189B2 (ja) * | 2009-07-10 | 2012-10-17 | アイシン・エィ・ダブリュ株式会社 | 電子回路装置 |
JP5325684B2 (ja) | 2009-07-15 | 2013-10-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR101457939B1 (ko) * | 2009-11-02 | 2014-11-10 | 엘지이노텍 주식회사 | 탭 테이프 및 그 제조방법 |
CN102281705A (zh) * | 2011-05-31 | 2011-12-14 | 昆山元崧电子科技有限公司 | Fpc电镀制程底部结构 |
US9035872B2 (en) * | 2012-06-08 | 2015-05-19 | Apple Inc. | Detection system and method between accessory and electronic device |
US8878637B2 (en) | 2012-08-08 | 2014-11-04 | Jared A. Sartee | Accessory device |
CN103402303A (zh) * | 2013-07-23 | 2013-11-20 | 南昌欧菲光电技术有限公司 | 柔性线路板及其制作方法 |
US9474345B2 (en) | 2013-08-13 | 2016-10-25 | Apple Inc. | Magnetic related features of a cover for an electronic device |
CN104319240B (zh) | 2014-10-27 | 2017-06-23 | 京东方科技集团股份有限公司 | 一种柔性基板贴附方法 |
JP6014792B1 (ja) * | 2015-06-24 | 2016-10-25 | 株式会社メイコー | 立体配線基板の製造方法、立体配線基板、立体配線基板用基材 |
WO2017038849A1 (ja) * | 2015-09-04 | 2017-03-09 | 国立研究開発法人科学技術振興機構 | コネクタ基板、センサーシステム及びウェアラブルなセンサーシステム |
CN112771657A (zh) * | 2018-09-25 | 2021-05-07 | 日立金属株式会社 | 挠性印刷电路板、接合体、压力传感器及质量流量控制装置 |
CN114466508B (zh) * | 2022-02-17 | 2023-08-04 | 北京宽叶智能科技有限公司 | 可拉伸电路结构及生产方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5288950A (en) * | 1991-02-15 | 1994-02-22 | Sumitomo Metal Mining Company Limited | Flexible wiring board and method of preparing the same |
JP2927215B2 (ja) * | 1995-08-25 | 1999-07-28 | 住友電装株式会社 | フレキシブル回路基板の製造方法 |
JP3952125B2 (ja) * | 1999-09-14 | 2007-08-01 | セイコーエプソン株式会社 | 複合フレキシブル配線基板、電気光学装置、電子機器 |
JP2001284747A (ja) | 2000-04-04 | 2001-10-12 | Matsushita Electric Ind Co Ltd | フレキシブル配線板 |
JP3554533B2 (ja) * | 2000-10-13 | 2004-08-18 | シャープ株式会社 | チップオンフィルム用テープおよび半導体装置 |
JP2003068804A (ja) * | 2001-08-22 | 2003-03-07 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用基板 |
JP3889700B2 (ja) * | 2002-03-13 | 2007-03-07 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープの製造方法 |
US7173322B2 (en) * | 2002-03-13 | 2007-02-06 | Mitsui Mining & Smelting Co., Ltd. | COF flexible printed wiring board and method of producing the wiring board |
JP3775329B2 (ja) | 2002-03-27 | 2006-05-17 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの製造方法、その製造装置およびその方法に用いられる保護テープ |
JP3726961B2 (ja) * | 2002-06-26 | 2005-12-14 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープ及びその製造方法 |
JP4485460B2 (ja) * | 2004-12-16 | 2010-06-23 | 三井金属鉱業株式会社 | フレキシブルプリント配線板 |
-
2005
- 2005-03-22 JP JP2005081582A patent/JP2006269496A/ja active Pending
-
2006
- 2006-03-20 KR KR1020060025144A patent/KR100819195B1/ko not_active IP Right Cessation
- 2006-03-21 US US11/385,195 patent/US20060213684A1/en not_active Abandoned
- 2006-03-22 TW TW095109790A patent/TWI315553B/zh not_active IP Right Cessation
- 2006-03-22 CN CNA2006100585701A patent/CN1838859A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1838859A (zh) | 2006-09-27 |
JP2006269496A (ja) | 2006-10-05 |
KR100819195B1 (ko) | 2008-04-07 |
TW200642019A (en) | 2006-12-01 |
US20060213684A1 (en) | 2006-09-28 |
KR20060102279A (ko) | 2006-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |