1330508 •.九、發明說明： .【發明所屬之技術領域】 本發明涉及印刷電路板領域，尤其涉及一種印刷電路 板之製作方法。 【先前技術】 印刷電路板係各種電子產品之重要組成部件之一，為 適應電子產品輕、薄、短、小之發展趨勢，印刷電路板亦 鲁不斷向高密度方向發展。參見文獻Takahashi，A. Ooki，N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880 ，IEEE Trans, on Components, Packaging, and Manufacturing Technology，1992，15(4): 418-425。 傳統印刷電路板之製作過程中通常需要經過塗佈光 阻、曝光顯影、蝕刻導電線路、光阻去除以及電鍍處理等 複數個濕製程工序。·於這些濕製程工序中，由於電路板覆 •銅基板表面性能之缺陷，導致覆銅基板表面與各種液態處 理劑之間存在接觸角較大之問題，從而濕製程工序中所用 之各種液態處理劑與覆銅基板表面之間之親合力較差，無 法完全潤濕覆銅基板表面，會影響印刷電路板製作之品質。 以塗佈光阻為例，由於覆銅基板之銅箔表面抗氧化保 護膜或有機污染物之存在會導致液態光阻與覆銅基板之銅 箔表面接觸角較大，液態光阻與覆銅基板之銅箔表面之間 之親合力較差，液態光阻不易潤濕覆銅基板之銅箔表面， 6 1330508 於液悲光阻與覆銅基板之㈣表面之間產生阻層，從而使 -液態光阻無法與覆銅基板之銅箱緊密貼合，進而影響到導 .電線路之製作精度以及印刷電路板製作之品質。又以光阻 曝光顯影為例，當顯影液與光阻表面之接觸角較大時，顯 影液不易潤濕光阻’溶解光阻反應效率較低，甚至影響光 阻顯影圖案之精度，進而影響到導電線路之製作精度以及 印刷電路板製作之品質。再以钱刻導電線路為例，當酸性 餘刻液與覆銅基板之銅謂表面接觸角較大時，酸性茲刻液 ❿不易潤濕覆銅基板之銅荡表面，會造成酸性钱刻液餘刻反 應效率較低，從而影響到印刷電路板導電線路之製作精度 以及印刷電路板製作之品質。 又 【發明内容】 有鑑於此，提供一種印刷電路板之製作方法，以改善 電路板覆銅基板表面之性能，從而減小電路板覆銅基板^ ♦面與各種液態處理劑之間之接觸角，從而提高印刷電路板 製作之品質實屬必要。 以下將以實施例說明一種印刷電路板之製作方法。 該印刷電路板之製作方法，其包括步驟'提供覆銅基 板，並以覆銅基板進行塗佈光阻、對光阻進行曝光顯影、 钱刻覆銅基板之銅馆形成導電線路、去除光阻以及電2處 理複數個濕製私工序，於該一個或複數個濕製程工序之 前’利用常壓電衆對該濕製程工序需要處理:覆銅基板之 表面進行表面處理，以減小覆銅基板之表面與該濕^程工 7 1330508 序各種液態處理劑之間之接觸角。 - 與先前技術相比，該印刷電路板之製作方法於該一個 . 或複數個濕製程工序之前，利用常壓電漿對該濕製程工序 需要處理之覆銅基板之表面進行表面處理，可改善電路板 覆銅基板表面之性能，減小覆銅基板與濕製程工序中各種 液態處理劑之間之接觸角，增強覆銅基板與液態處理劑之 間之親合力，從而提高印刷電路板之品質。 鲁【實.施方式】 下面結合附圖及實施例對本技術方案提供之印刷電路 板之製作方法作進一步說明。該印刷電路板之製作方法包 括以下步驟： 第一，提供覆銅基板10。 所提供之覆銅基板10可為單面覆銅基板，亦可為雙面 覆銅基板，可為柔性基板亦可為硬性基板。本實施例中， 如圖1所示，該覆銅‘基板10為柔性單面覆銅基板，其包括 絕緣基膜11以及設置於絕緣基膜11表面之銅箔12。通常， 銅猪12會經過表面抗氧化處理，因此銅箔12表面具有抗 氧化保護膜。該抗氧化保護膜通常為有機高分子膜，用於 防止銅箔12表面於空氣中被氧化。該抗氧化保護膜之厚度 極薄，通常約為3-20奈米。當然，如果銅箔12表面未作抗 氧化處理，該銅箔12表面就不具有.抗氧化保護膜，但此時 於銅箔12表面可能會存在某些有機污染物。 由於覆銅基板10為柔性單面覆銅基板，本技術方案實 8 1330508 施例提供之印刷電路板之製作方 t〇_之工藝，如圖2所：方=f輪對卷輪(R- 21連續之勾速卷出’卷出之迷度約為㈣米/秒以= 下一個製作工序。該覆銅基板10之寬度 3 以便於後續工序處理。 D笔木， 當然’印刷電純之製作亦可採料 sheeti製作工藝’此時可以片狀形式提供覆銅基板10 y 苐二，利用常壓電漿31對 表面處理。 ^復幻基板10之銅帛12進行 =2所示’由第-卷輪21均速卷出之覆銅基板1〇, 以、..勺為（U〜5米/秒之速度經過常麗電褒發生裝置 面處理，從而對覆銅基板1()之銅箱 乂 該常壓電議裝置3"產生常進行改善。 ,1Λ 吊壓電漿31噴射到覆銅基 板10之銅猪12表面。由常壓電漿發生裝置3 電漿31可包括氮氣（Ν2)，氧氣（ 王（吊壓 氬氣（Α〇或氦氣（He)等），或2 生氣體（例如 ，乂工轧（Αι〇之電漿中之一 ㈣幾種。常歷電漿由於無需特殊之真空環境，而且工作 Μ力接近于常壓狀態’故稱為常壓電漿。由於電裝係 氣壓力中工作，電漿中粒子之間之碰撞自由程报小，所以 常麼電聚中幾乎沒有高能離子存在，不會像真空電浆那樣 對覆銅基板10之㈣12造成損傷。本實施例中，常 聚發生裝置30可產生寬20〜75毫求之帶狀常壓電裝3 射到寬度為20~75毫米覆銅基板1〇之銅箱12表面。、 由於銅㈣表面設置有抗氧化保護膜，因：使用等離 1330508 子發生裝置30產生之常壓電漿31處理覆銅基板10之銅箔 -12表面時，常壓電漿31實際係與覆銅基板10之銅箔12 , 表面之抗氧化保護膜發生作用，以打斷抗氧化保護膜之高 分子鏈結，從而略微增加銅箔12表面之粗糙度，進而降低 銅箔12表面與液體之間之接觸角。如果沒有抗氧化保護 膜，常壓電漿31實際係與銅箔12表面之有機污染物作用， 亦可降低覆銅基材10之銅箔12表面與液體之間之接觸 角。本實施例中，當覆銅基材10以約為0.1〜5米/秒之速度 籲通過常壓電漿發生裝置30時，常壓電漿發生裝置30產生 帶狀常壓電漿31連續喷射到覆銅基板10之銅箔12表面， 對覆銅基板10之銅箔12表面進行處理，經過常壓電漿31 處理過之覆銅基板10之銅猪12表面與液體之間之接觸角 角度大小可降低約70-90度。 第三，於銅箔12表面塗佈光阻。 覆銅基板10經常壓電漿31表面處理之後，進入光阻 塗佈濕製程工序，於該覆銅基板10之銅箔12表面塗佈液 態光阻。由於銅箔12表面經過常壓電漿31處理後，其與 液體之接觸角減小，例如銅箔12表面與液態光阻之接觸角 可從處理前之110.48度降低為處理後之20.87度。故，液 態光阻與銅箔12表面之間之親合力大大增強，使得液態光 阻更容易潤濕覆銅基板10之銅箔12表面，並與銅箔12表 面緊密貼合。當然，本步驟中亦可採用幹膜光阻，由於經 過常壓電漿31處理之後銅箔12表面之粗糙度增加，增強 了幹膜光阻與覆銅基板10表面之間之結合力，使得幹膜光 丄⑽508 阻更容易壓合於覆銅基板10之銅箔12表面緊密貼合。 第四’對光阻進行曝光顯影。 覆銅基板10之銅箔12表面塗佈光阻之後，以約為 0·1〜5米/秒之速度進入光阻之曝光顯影濕製程工序進行製 作。光阻經曝光後，利用顯影液將部分光阻溶解去除，從 而形成圖案化之光阻層。顯影液通常可採用驗液，例如= 度為2%〜5%之碳酸納溶液、氫氧化納溶液或氫氧化卸溶液^ 可於光阻曝光之後進行顯影之前， 電聚對光阻進行表面處理，以打斷光阻表面光阻材料之古 ，子鏈結’從而略微增加絲表面之粗糙度， : =顯影狀以關角，錢得㈣㈣綠表 潤濕接觸，改善圖荦化#阳Mi a 月匕兄刀 反應效率。阻層⑼成精度’提高顯影液之 =五’钱刻覆銅基板1G之_ 12形成導電線路。 覆銅基板10之铜笮本品 後，繼續以約為〇1〜5;:之tr/阻層㈣ 製程工岸。赤/心之速度進入蝕刻導電線路之濕 銅落12沒有被圖案化之光阻層覆蓋之部分，從而二除 12被圖案化之光阻層覆 攸而使侍銅珀 銅兹刻液可為酸性/ 線路。所採用之 注虱化銅溶液。例如，該酸槌备& ^ 包括氣化_2)、鹽酸_)與過 容液 亦可採用其他任何適用之銅㈣液進行处）。虽然’ 優選地，當鋼箱12沒有被圖 11 j面仍存在抗氧化㈣料，可於進㈣料 二:用:屋：漿編12沒有被圖案化之光阻層覆蓋之 二鏈二 =打斷有機污染物或抗氧化保護膜之高 子鏈、'，。以降低銅落12與銅蝕刻液之間之 二刻，12能充分潤濕接觸，改善導電線角路= ;=高勒刻效率。由於常㈣浆係於大氣=精 無高能離子存在二=小’所以常*電漿中幾乎 僅係打斷圖荦化之光;声=:之光阻層造成損傷’而僅 茶化之先阻層表面光阻材料之高分子鏈处 案化之光阻層表面之粗糙度，這樣還會有利 m阻去除液與圖案化之光阻層之間之接觸角。 弟，、，去除光阻。 =刻覆銅基板10之銅荡12形成導電線路之後，進入 光阻去除濕製程工序， 案化之光阻層去除，覆盍於導電線路上之圖 κ X 除使導電線路完全露出。通常可採用朵 阻去除液如鹼液將光阻去除，例如濃产A % Λ Λ 液、氯氧化納溶液或氯氧化鉀溶液，度為2%〜5%石反酸納溶 案化層之前:仍然可利用常壓電漿對圖 光阻去除液：門丁、<理，以降低圖案化之光阻層與顯 光阻觸角’以使得光阻去除液與圖案化之 曰月匕充刀接觸，提高光阻去除之效率。 而後’可繼續通過卷輪對卷輪之 續加工處理步驟，例如文字印副，擇陡地進订後 貼雙面膠等步驟，進一牛、〆強片’電鍍鎳金， 進乂 π成印刷電路板之製作。當然， 12 1330508 於進行任何濕製程工序之前，都可選擇利用常壓電漿對相 "應之表面進行表面處理，以降低液態處理劑盥相施+ _ • 4之接觸角’提高液態處理劑之反應效率，進而提言石1330508 • IX. INSTRUCTIONS: 1. Technical Field of the Invention The present invention relates to the field of printed circuit boards, and more particularly to a method of fabricating a printed circuit board. [Prior Art] Printed circuit boards are one of the important components of various electronic products. In order to adapt to the development trend of light, thin, short and small electronic products, printed circuit boards are also moving toward high density. See also Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans, on Components, Packaging , and Manufacturing Technology, 1992, 15(4): 418-425. Conventional printed circuit boards usually require a plurality of wet processes such as coating photoresist, exposure development, etching conductive lines, photoresist removal, and plating. · In these wet process steps, due to defects in the surface properties of the circuit board and the copper substrate, there is a problem that the contact angle between the surface of the copper-clad substrate and various liquid treatment agents is large, and various liquid treatments used in the wet process are used. The affinity between the agent and the surface of the copper-clad substrate is poor, and the surface of the copper-clad substrate cannot be completely wetted, which may affect the quality of the printed circuit board. Taking the coating photoresist as an example, the presence of an anti-oxidation protective film or an organic contaminant on the surface of the copper foil of the copper-clad substrate causes a large contact angle between the liquid photoresist and the copper foil surface of the copper-clad substrate, liquid photoresist and copper-clad. The affinity between the surface of the copper foil of the substrate is poor, the liquid photoresist is not easy to wet the surface of the copper foil of the copper-clad substrate, and 6 1330508 creates a resist layer between the surface of the liquid-resistant photoresist and the surface of the copper-clad substrate, thereby making a liquid state The photoresist cannot be closely attached to the copper case of the copper-clad substrate, which affects the fabrication precision of the conductive circuit and the quality of the printed circuit board. Taking the photoresist exposure development as an example, when the contact angle between the developer and the photoresist surface is large, the developer does not easily wet the photoresist. The reaction efficiency of the dissolved photoresist is low, and even affects the precision of the photoresist development pattern, thereby affecting To the precision of the production of conductive lines and the quality of printed circuit board production. Taking the electric conductive circuit as an example, when the contact angle between the acidic residual liquid and the copper surface of the copper-clad substrate is large, the acid etching liquid does not easily wet the copper-plated surface of the copper-clad substrate, which may cause acid money engraving. The residual reaction efficiency is low, which affects the fabrication precision of printed circuit board conductive lines and the quality of printed circuit board fabrication. Further, in view of the above, a method for fabricating a printed circuit board is provided to improve the performance of a surface of a copper-clad substrate of a circuit board, thereby reducing a contact angle between a copper-clad substrate of the circuit board and various liquid processing agents. Therefore, it is necessary to improve the quality of printed circuit board production. A method of fabricating a printed circuit board will be described below by way of example. The manufacturing method of the printed circuit board comprises the steps of: providing a copper-clad substrate, coating a photoresist with a copper-clad substrate, exposing and developing the photoresist, forming a conductive line of the copper-plated copper substrate, and removing the photoresist And the electric 2 processes a plurality of wet private processes, before the one or more wet process steps, the process needs to be processed by the normal piezoelectric process: the surface of the copper-clad substrate is surface-treated to reduce the copper-clad substrate The contact angle between the surface and the various liquid treatment agents of the wet process 7 1330508. - Compared with the prior art, the printed circuit board is manufactured by the surface treatment of the surface of the copper-clad substrate to be processed by the wet process using the normal piezoelectric slurry before the one or a plurality of wet process steps, which can be improved The performance of the surface of the copper-clad substrate of the circuit board reduces the contact angle between the copper-clad substrate and various liquid treatment agents in the wet process, and enhances the affinity between the copper-clad substrate and the liquid treatment agent, thereby improving the quality of the printed circuit board. . The method of manufacturing the printed circuit board provided by the technical solution will be further described below with reference to the accompanying drawings and embodiments. The manufacturing method of the printed circuit board comprises the following steps: First, a copper clad substrate 10 is provided. The copper-clad substrate 10 may be a single-sided copper-clad substrate, a double-sided copper-clad substrate, or a flexible substrate or a rigid substrate. In the present embodiment, as shown in FIG. 1, the copper-clad substrate 10 is a flexible single-sided copper-clad substrate comprising an insulating base film 11 and a copper foil 12 disposed on the surface of the insulating base film 11. Usually, the copper pig 12 is subjected to surface oxidation treatment, so that the surface of the copper foil 12 has an oxidation resistant protective film. The anti-oxidation protective film is usually an organic polymer film for preventing the surface of the copper foil 12 from being oxidized in the air. The thickness of the oxidation resistant protective film is extremely thin, usually about 3-20 nm. Of course, if the surface of the copper foil 12 is not subjected to oxidation treatment, the surface of the copper foil 12 does not have an anti-oxidation protective film, but at this time, some organic contaminants may be present on the surface of the copper foil 12. Since the copper-clad substrate 10 is a flexible single-sided copper-clad substrate, the technical solution of the printed circuit board provided by the embodiment of the present invention is as shown in FIG. 2: square=f wheel-to-reel (R- 21 continuous hook speed out of the 'volume of the volume is about (four) m / s to = the next production process. The width of the copper-clad substrate 10 3 for subsequent processing. D pen wood, of course, 'printing pure The production process can also be used to produce the sheeti production process. At this time, the copper-clad substrate 10 y 苐 can be provided in the form of a sheet, and the surface treatment is performed by using the normal piezoelectric slurry 31. ^The copper raft 12 of the phantom substrate 10 is shown as 2 The second-rolling reel 21 is wound up on the copper-clad substrate 1 〇, and the scoop is made up of (U~5 m/s through the surface of the Changli electric discharge device, so that the copper-clad substrate 1) The copper box 乂 the constant piezoelectric device 3" is often improved. 1) The hanging piezoelectric slurry 31 is sprayed onto the surface of the copper pig 12 of the copper-clad substrate 10. The plasma 31 can be included by the normal piezoelectric slurry generating device 3 Ν 2), oxygen (wang (pulling argon (Α〇 or helium (He), etc.), or 2 raw gases (for example, 轧 轧 Α) One (four) several. Regular calendar plasma does not require a special vacuum environment, and the working force is close to the normal pressure state, so it is called normal piezoelectric pulp. Because of the work in the electrical system, the particles in the plasma The collision free path is small, so there is almost no high-energy ion in the electropolymerization, and the damage of the (four) 12 of the copper-clad substrate 10 is not caused like the vacuum plasma. In this embodiment, the constant-concentration device 30 can produce a width of 20~ The strip-shaped constant piezoelectric package of 75 millimeters is applied to the surface of the copper box 12 of the copper-clad substrate having a width of 20 to 75 mm. Since the surface of the copper (four) is provided with an anti-oxidation protective film, it is caused by the use of the plasma 1330508. When the normal piezoelectric slurry 31 produced by the device 30 processes the surface of the copper foil 12 of the copper-clad substrate 10, the normal piezoelectric slurry 31 actually acts on the copper foil 12 of the copper-clad substrate 10, and the surface of the anti-oxidation protective film acts to hit The polymer chain of the anti-oxidation protective film is broken, thereby slightly increasing the roughness of the surface of the copper foil 12, thereby reducing the contact angle between the surface of the copper foil 12 and the liquid. If there is no anti-oxidation protective film, the normal piezoelectric slurry 31 is actually Interaction with organic contaminants on the surface of copper foil 12 The contact angle between the surface of the copper foil 12 of the copper-clad substrate 10 and the liquid can also be lowered. In this embodiment, when the copper-clad substrate 10 is accelerated by a normal piezoelectric slurry at a rate of about 0.1 to 5 m/sec. In the case of the device 30, the normal piezoelectric slurry generating device 30 generates a strip-shaped normal piezoelectric slurry 31 which is continuously sprayed onto the surface of the copper foil 12 of the copper clad substrate 10, and processes the surface of the copper foil 12 of the copper clad substrate 10 through the normal piezoelectric slurry. 31 The contact angle between the surface of the copper pig 12 treated with the copper-clad substrate 10 and the liquid can be reduced by about 70-90 degrees. Third, the photoresist is coated on the surface of the copper foil 12. The copper-clad substrate 10 is often piezoelectric. After the surface treatment of the slurry 31, the film is subjected to a photoresist coating wet process, and a liquid photoresist is applied to the surface of the copper foil 12 of the copper-clad substrate 10. Since the surface of the copper foil 12 is treated by the normal piezoelectric slurry 31, the contact angle with the liquid is reduced. For example, the contact angle of the surface of the copper foil 12 with the liquid photoresist can be lowered from 110.48 degrees before the treatment to 20.87 degrees after the treatment. Therefore, the affinity between the liquid photoresist and the surface of the copper foil 12 is greatly enhanced, so that the liquid photoresist is more likely to wet the surface of the copper foil 12 of the copper clad substrate 10 and closely adhere to the surface of the copper foil 12. Of course, dry film photoresist can also be used in this step. Since the roughness of the surface of the copper foil 12 is increased after the treatment by the normal piezoelectric slurry 31, the bonding force between the dry film photoresist and the surface of the copper clad substrate 10 is enhanced, so that The dry film diaphragm (10) 508 is more easily pressed against the surface of the copper foil 12 of the copper clad substrate 10 to closely adhere. The fourth 'exposure and development of the photoresist. After the surface of the copper foil 12 of the copper clad substrate 10 is coated with a photoresist, it is formed by an exposure developing wet process which enters the photoresist at a speed of about 0·1 to 5 m/sec. After the photoresist is exposed, a portion of the photoresist is dissolved and removed by the developer to form a patterned photoresist layer. The developer can usually be used for a test solution, for example, a sodium carbonate solution having a degree of 2% to 5%, a sodium hydroxide solution or a hydrogenation solution. The surface can be surface treated by electropolymerization before development after photoresist exposure. In order to interrupt the ancient surface of the photoresist surface resistive material, the sub-links 'slightly increase the roughness of the silk surface, : = development shape to the angle of the corner, money to (4) (four) green table wet contact, improve the map 荦化#阳Mi a Yuexi brother knife reaction efficiency. The resist layer (9) is made to have an accuracy of 'improving the developer's = five' money engraved copper substrate 1G _ 12 to form a conductive line. After the copper-clad substrate 10 of the copper-clad substrate 10, the process continues to be about 〜1~5;: tr/resistive layer (four) process bank. The speed of the red/heart enters the portion of the wet copper oxide 12 that is etched into the conductive line and is not covered by the patterned photoresist layer, so that the second photoresist layer is patterned by the patterned photoresist layer, so that the copper copper paste can be Acidity / line. The copper telluride solution used. For example, the acid preparation & ^ including gasification _2), hydrochloric acid _) and the fluent may also be carried out using any other suitable copper (tetra) liquid. Although 'preferably, when the steel box 12 is not still resistant to oxidation (four) material by the surface of Fig. 11, it can be used in (4) material 2: with: house: pulp code 12 is not covered by the patterned photoresist layer. Interrupt the high sub-chain of organic pollutants or antioxidant protective film, ',. In order to reduce the moment between the copper drop 12 and the copper etching solution, 12 can fully wet the contact, and improve the conductive line angle = ; = high efficiency. Because the constant (four) pulp is in the atmosphere = there is no high-energy ion in the presence of two = small 'so often * the plasma is almost only interrupted by the light of the image; the sound =: the photoresist layer causes damage' and only the tea is the first The roughness of the surface of the photoresist layer in the polymer chain of the photoresist layer surface resist material, which also facilitates the contact angle between the m resist removal liquid and the patterned photoresist layer. Brother,,, remove the photoresist. After the copper slab 12 of the copper substrate 10 is formed to form a conductive line, the photoresist is removed from the wet process, and the photoresist layer is removed, and the κ X overlying the conductive line is completely exposed. It is usually possible to remove the photoresist by using a removal solution such as an alkali solution, for example, a concentrated A % Λ 液 solution, a sodium oxychloride solution or a potassium oxychloride solution, before the degree of 2% to 5% of the sulphuric acid solution. : It is still possible to use the normal piezoelectric paste to remove the photoresist: the gantry, <scientific, to reduce the patterned photoresist layer and the visible light-resistance angle 'to make the photoresist removal liquid and the patterning Knife contact improves the efficiency of photoresist removal. Then, you can continue the processing steps of the reel of the reel, such as the text printing, select the double-sided adhesive after the steep order, enter a cow, barely slice 'electroplated nickel gold, enter π into printing The production of the circuit board. Of course, 12 1330508 can choose to use the normal piezoelectric slurry to surface the surface of the phase before the wet process, in order to reduce the contact angle of the liquid treatment agent + phase _ _ 4 to improve the liquid treatment Reaction efficiency of the agent
刷電路板製作之精度及品質。 P 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式^自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 _應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施例提供之覆銅基板之剖視圖。 、圖2係本技術方案實施例提供之印刷電路板之製作方 法之表面處理示意圖。 【主要元件符號說明】 覆鋼基板 . 10 絕緣基膜 11 銅箔 12 第一卷輪 21 常壓電漿發生裝置 30 常壓電漿 31 13The precision and quality of the brush board production. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention is not limited thereto. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a copper clad substrate provided by an embodiment of the present technical solution. FIG. 2 is a schematic diagram showing the surface treatment of the manufacturing method of the printed circuit board provided by the embodiment of the present technical solution. [Description of main component symbols] Steel-coated substrate. 10 Insulation base film 11 Copper foil 12 First reel 21 Normal piezoelectric slurry generator 30 Normal piezoelectric slurry 31 13