1289428 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱模組，特別係一種適用於筆記本 電腦等可携式電子產品之散熱模組。 【先前技術】 §剷，隨著電腦產業之迅速發展，微處理晶片等發熱 電子元件產生之熱量愈來愈多，為將這些多餘之熱量有效 政發，習知之方法係在發熱電子元件之表面貼設一散熱 器’在熱管和散熱風扇的輔助下將發熱電子元件產生之熱 罝强制散去。為將上述散熱器、熱管和散熱風扇固定，通 书需要額外之扣具等固定元件，所需元件較多，這就勢必 要求增大散熱模組在機殼内所佔之空間。然而，市場上之 可携式電子產品，如筆記本電腦等，一般都趨向於做成輕、 薄、短、小，以方便携帶及使用，習知之散熱模組顯然難 以滿足這種要求。 【發明内容】 有鑒於此，有必要提供一種所需元件較少且佔用空間 較少之散熱模組。 該散熱模組用於散發電子元件產生之熱量，其包括一 政熱器、一機殼、一集熱座、一散熱風扇及一熱管，該熱 管一端與該集熱座連接，另一端與該散熱器連接，其中， 該散熱器藉由壓鑄嵌入成型結合於該機殼上。 與習知技術相比，上述散熱模組直接將散熱器固定在 1289428 少外使用扣具’减少零件使用量，具有伯用 【實施方式】 m ^ ，、两个如5欣熱模組第一實施例之立體分解 】30 = 組Γ包括一散熱器1〇、-機殼2。、-集熱 、政熱風扇40及-熱管5〇 •其中，該機般1289428 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module suitable for a portable electronic product such as a notebook computer. [Prior Art] § Shovel, with the rapid development of the computer industry, the heat generated by the heat-generating electronic components such as micro-processing wafers is increasing. In order to effectively superimpose these excess heat, the conventional method is on the surface of the heat-generating electronic components. A heat sink is attached to 'enforce the heat generated by the heat-generating electronic components with the aid of the heat pipe and the heat-dissipating fan. In order to fix the above heat sink, heat pipe and cooling fan, the book requires additional fixing components such as fasteners, and many components are required, which inevitably requires an increase in the space occupied by the heat dissipation module in the casing. However, portable electronic products such as notebook computers in the market generally tend to be light, thin, short, and small, so as to be convenient to carry and use, and conventional heat dissipation modules are obviously difficult to meet such requirements. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipation module that requires fewer components and takes up less space. The heat dissipation module is configured to dissipate heat generated by the electronic component, and includes a thermal heater, a casing, a heat collecting block, a cooling fan and a heat pipe, wherein one end of the heat pipe is connected to the heat collecting block, and the other end is connected to the heat collecting block A heat sink connection, wherein the heat sink is bonded to the casing by die casting. Compared with the prior art, the above-mentioned heat dissipation module directly fixes the heat sink to 1289428, and uses the buckle to reduce the amount of parts used, and has the utility model [embodiment] m ^ , and two such as 5 Xin thermal module first Stereoscopic decomposition of the embodiment] 30 = The group Γ includes a heat sink 1 -, - the casing 2. , - heat collection, political heat fan 40 and - heat pipe 5 〇 • Among them, the machine
===…們一該散熱器 該集熱座30包括-上接觸面32及一下接觸面如，該 接觸面32用於同-發熱電子元件(圖未示)接觸，該下接 面34用於同機殼2〇接觸。該下接觸面34上設有一容置 曰36該集熱座3〇之四角處向外凸伸設有四個固定臂％。 :該散熱風扇40包括-出風口 42，且該散熱風扇奶與 該集熱座30相連接並位於集熱座％之一侧。 、該熱管5〇大致呈L型結構，其具有一蒸發端52及一 冷凝端54。 請參照圖1及圖2，該散熱器10位於接近機殼2〇之 〜侧邊處，該集熱座30之每一固定臂38分別藉由一螺釘 60固定至該機殼20上並使該集熱座30之下接觸面34與 該機殼20接觸，該散熱風扇40在該機殼20内定位並與該 散熱器10相鄰，且該散熱風扇40之出風口 42正對該散熱 器10，以便於對該散熱器10進行强制散熱。該熱管5〇之 蒸發端52收容於集熱座30之容置槽36内，該熱管5〇之 冷凝端54平貼於散熱器10之上表面。當然，該冷凝端54 7 1289428 亦可採用穿設該散熱器10之散熱鰭片之方式與散熱器10 結合。 在製造及組裝過程中，該散熱器10藉由壓鑄嵌入成型 (Insert Mold)之方式與機殼20直接結合。成型時，將已成 型之散熱器10安裝至壓鑄模具内，合模後注入液態之鎂合 金(以鎂合金為例），使散熱器10之底部與液態之鎂合金接 觸’待冷卻後，由該鎮合金形成之機殼20與該散熱器1〇 之底部接合在一起，使該散熱器10 —體嵌入機殼2〇内， 與機设20緊密結合。藉由壓鎢嵌入成型，該散熱器與 機设20之間具有製程簡單、結合緊密、熱阻較低以及無需 使用扣具等元件進行固定之優點。 為减少熱管50與散熱器1〇之接觸熱阻，可在熱管5〇 與散熱器10之間塗布導熱膏或藉由錫膏將該熱管5〇與散 熱器10焊接在一起。同理，為減少集熱座3〇與機殼2〇間 之接觸熱阻，亦可在集熱座30與機殼20之間塗布導熱膏。 在使用該政熱模組100時，該集熱座3〇將發熱電子元 件產生之熱量吸收並同時傳遞給機殼2〇及熱管5〇。機殼 20直接將熱量散去，而熱管5〇則將熱量從蒸發端52傳遞 至冷凝端54，冷凝端54將熱量傳遞給散熱器1〇，並經過 散熱器10進一步傳遞至機殼2〇。由於機殼2〇之表面積很 大，有利於散熱模組100迅速散熱。同時，該散熱風扇40 產生之氣流對散熱器10進行强制散熱，直接將傳遞至散熱 器10之熱I散發至機殼20之外部，有利於提高散熱模組 100之整體散熱效率。 1289428===... The heat sink 30 includes an upper contact surface 32 and a lower contact surface, for example, the contact surface 32 is for contact with a heat-generating electronic component (not shown), and the lower contact surface 34 is used. In contact with the casing 2〇. The lower contact surface 34 is provided with a receiving 曰 36. The four corners of the heat collecting seat 3 are outwardly projecting with four fixing arms. The cooling fan 40 includes an air outlet 42, and the cooling fan milk is connected to the heat collecting seat 30 and is located on one side of the heat collecting seat. The heat pipe 5 is substantially L-shaped and has an evaporation end 52 and a condensation end 54. Referring to FIG. 1 and FIG. 2, the heat sink 10 is located near the side of the casing 2, and each fixed arm 38 of the heat collecting block 30 is fixed to the casing 20 by a screw 60 and The lower surface of the heat collecting block 30 is in contact with the casing 20, and the heat dissipating fan 40 is positioned in the casing 20 adjacent to the heat sink 10, and the air outlet 42 of the heat dissipating fan 40 is radiating The device 10 is configured to perform forced heat dissipation on the heat sink 10. The evaporation end 52 of the heat pipe 5 is received in the receiving groove 36 of the heat collecting block 30. The condensation end 54 of the heat pipe 5 is flat on the upper surface of the heat sink 10. Of course, the condensation end 54 7 1289428 can also be combined with the heat sink 10 by means of the heat dissipation fins of the heat sink 10. In the manufacturing and assembly process, the heat sink 10 is directly bonded to the casing 20 by means of a die cast molding. During molding, the formed heat sink 10 is mounted into a die-casting mold, and after filling the mold, a liquid magnesium alloy (for example, a magnesium alloy) is injected to bring the bottom of the heat sink 10 into contact with the liquid magnesium alloy. The casing 20 formed by the alloy is joined to the bottom of the heat sink 1 so that the heat sink 10 is integrally embedded in the casing 2 and tightly coupled with the machine 20. By tungsten embedding, the heat sink and the machine 20 have the advantages of simple process, tight combination, low thermal resistance and no need to use components such as clips for fixing. In order to reduce the thermal contact resistance between the heat pipe 50 and the heat sink 1, a heat conductive paste may be applied between the heat pipe 5's and the heat sink 10 or the heat pipe 5'' may be welded to the heat sink 10 by solder paste. Similarly, in order to reduce the contact thermal resistance between the collector block 3 and the casing 2, a thermal paste may be applied between the collector block 30 and the casing 20. When the thermal module 100 is used, the heat collecting block 3 absorbing the heat generated by the heat generating electronic component and transmitting it to the casing 2 and the heat pipe 5〇 at the same time. The casing 20 directly dissipates heat, and the heat pipe 5 turns heat from the evaporation end 52 to the condensation end 54, and the condensation end 54 transfers heat to the radiator 1 and is further transmitted to the casing through the radiator 10. . Since the surface area of the casing 2 is large, it is advantageous for the heat dissipation module 100 to dissipate heat rapidly. At the same time, the airflow generated by the cooling fan 40 forcibly dissipates heat from the heat sink 10, and directly radiates the heat I transmitted to the heat sink 10 to the outside of the casing 20, which is beneficial to improving the overall heat dissipation efficiency of the heat dissipation module 100. 1289428
同時與散熱風扇40連接固定。 由以上敘述可知，由於該集熱座3〇及該散熱器⑽分 顺該機殼20接觸，將發熱電子元件產生之熱量傳遞至機 殼20，同時，散熱風扇4〇將散熱器1〇上之熱量直接散發 • 職殼20之外’使得該散熱模組100具有散熱效率較高之At the same time, it is fixedly connected to the cooling fan 40. As can be seen from the above description, since the heat collecting block 3〇 and the heat sink (10) are in contact with the casing 20, the heat generated by the heat generating electronic component is transmitted to the casing 20, and at the same time, the heat radiating fan 4 The heat is directly dissipated and the outside of the housing 20 makes the heat dissipation module 100 more efficient in heat dissipation.
優點。而該散熱器1〇及該集熱座30 t可藉由壓禱嵌入成 具有佔用空間較少之優點。 【圖式簡單說明】 圖1爲本發明散熱模組第一實施例之立體分解圖。 圖2爲圖1所示散熱模組之立體組合圖。 圖3爲本發明散熱模組第二實施例之立體圖。 【主要元件符號說明】 散熱模組 機殼 上接觸面 容置槽 散熱風扇 熱管 冷凝端 !〇〇 散熱器 20 集熱座 32 下接觸面 36 固定臂 40 出風口 50 蒸發端 54 螺釘 10 30 34 38 42 52 60advantage. The heat sink 1 and the heat collecting block 30 t can be embedded by the prayer to have the advantage of having less space. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipation module of the present invention. 2 is a perspective assembled view of the heat dissipation module shown in FIG. 1. 3 is a perspective view of a second embodiment of a heat dissipation module of the present invention. [Main component symbol description] Heat sink module housing contact surface receiving slot cooling fan heat pipe condensation end! 〇〇 Radiator 20 collector block 32 lower contact surface 36 fixed arm 40 air outlet 50 evaporation end 54 screw 10 30 34 38 42 52 60