TWI274428B - Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module - Google Patents

Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module Download PDF

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Publication number
TWI274428B
TWI274428B TW094117784A TW94117784A TWI274428B TW I274428 B TWI274428 B TW I274428B TW 094117784 A TW094117784 A TW 094117784A TW 94117784 A TW94117784 A TW 94117784A TW I274428 B TWI274428 B TW I274428B
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Taiwan
Prior art keywords
heat
heat conducting
light
emitting
stage
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TW094117784A
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Chinese (zh)
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TW200642114A (en
Inventor
Jen-Shyan Chen
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Neobulb Technologies Inc
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Publication of TWI274428B publication Critical patent/TWI274428B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

A light-emitting apparatus includes a heat conducting/dissipating module and at least one semiconductor light-emitting module. The heat conducting/dissipating module includes a heat conducting device and at least one heat-dissipating fin. The heat conducting device has at least one flat part. The at least one heat-dissipating fin is mounted on a circumference of the heat conducting device. The at least one semiconductor light-emitting module includes a carrier, a plurality of exterior electrodes, at least one semiconductor light-emitting die, and at least two conducting wires. The carrier is flatly mounted on the flat part of the heat conducting device. The plurality of exterior electrodes are disposed on the carrier. The at least one semiconductor light-emitting die is mounted on the carrier and electrically connecting to the plurality of exterior electrodes separately. The at least two conducting wires, for connecting a power or grounding, are electrically connecting to the plurality of exterior electrodes.

Description

1274428 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種發光裝置(Light-emitting apparatus)，並且 特別地，本發明之發光裝置整合一導熱/散熱模組(1故 conducting/dissipating module)。 【先前技術】 由於發光二極體(Light emitting diode，LED)具有如省電、而才 震、反應快以及適合量產等許多優點，因此目前以發光二極體為 光源的照明產品曰益廣泛。目前已有數家製造商投入製造不=外 型之高亮度發光二極體套件，這些高亮度發光二極體套件使用較 大的發光驅動晶片（Emitter chip)，但也相應地造成較高的 = 求。雖然能夠產生遠高於傳統發光二極體燈泡亮度之輸出，但二 ，產生大量的熱量，在持續發亮—段時間後，會有結點溫 (Junctum temperature)過高的問題’使得發光二極體本身的發光效 率下降’造成免度無法提升。因此，各種應用高功率 體的產品皆需要外加良好的散熱機制。 請參閱圖-A以及圖-B ’圖―a騎 模組並為獨立元件之發光妒w之千立闰m 〇 政熱 發絲置之剖面圖。如:;_Β輯示圖-Α之 ^^捣Ϊ 基板上具有一凹槽44。複數個晶片42設 置於σ亥凹才曰44上。該某柄46 a _八μ ϊ、丨 分子材料製成，於其上且有材^、一陶紐料或一多 μ > 、吧緣層，亚有一導線層覆蓋該絕緣 f、二It 晶片42。該複數個晶片42所產生的敎， 常為餘片狀達一政熱模組5。該散熱模組5通 书為"、、曰/ί狀之放熱板，呑亥複數個曰 一 材料而傳導，&非古mu 日日片42所產生之熱能經由多層 ===== …、法有效放熱，晶片之散熱效率也無法 1274428 =準確地控制。在高功率之應料 常超過安全範圍。此種散熱模組I :九―極U之〜1皿度 散熱效率也無法被準確地控制，7、速引導減散開’晶片之 非常容易因散熱效率不好而過熱鱗之半導體發光模組 職uesist繼），達到部;^置=封裝階層内即降低熱阻 結點溫度，可有效解決先前技、二^有赠低轉體晶片的 夕路水从里Λ 孜彳丨了中的政熱問題外，並提供高強度 發光模組同時 ‘果，有效降低半導體晶片的 Π ’人/TT π 70則孜;^野中的 之發光效果 【發明内容】 本發明提供一種發光裝詈。柄姑 熱/散熱馳从至少—轉贿日狀發統置包含-導 埶鍵Γίϊίΐίΐί—大體上成她之導歸置與至少—散 定於該導:裳置:一周半; 台、複數個外部電極、至少一束道 ¥體毛先杈、、且已3 一載 載台係平整接合於該導熱裝置之。該 =置=台上。該至少4導=粒 該複數個外部電極伽以外接電源¥線電連接 熱係光;裝置所產生的 熱鰭片’進而由該至少一散熱:片‘熱。坦梢丨至該至少-散 組有ϊ:ί:;供係將導熱/散熱模組與半導體發光模 赵而成為一獨立之具散熱功能的發光裝置，成 為/、放熱效能之發光引擎(Llght engine)。該導熱/散熱模組可= 1274428 由該柱狀之導熱裝罟 效導引，該導埶努罢、以、一半導體發光模組所產生的熱能有 將熱能導引遠“半技術具有較大散熱面積，並且能 能發散至周圍的办今由心*光杈組。之後，各散熱鰭片立即將熱 技術，根據本發升散熱效率。因此，相較於先前 熱襄置之平整端ΐίϋ置透過將半導體發光模組整平接合導 於需要高效率之料二絲技術㈣合應用BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting apparatus, and in particular, a light-emitting device of the present invention integrates a heat conduction/dissipation module (1) conducting/dissipating module ). [Prior Art] Since the light emitting diode (LED) has many advantages such as power saving, vibration, fast response, and mass production, the lighting products using the light emitting diode as a light source are widely used. . Several manufacturers have invested in high-brightness LED packages that do not have a shape. These high-brightness LED packages use a larger emitter chip, but also cause a higher = begging. Although it can produce an output much higher than the brightness of a conventional light-emitting diode bulb, secondly, it generates a large amount of heat, and after a continuous period of time, there will be a problem that the junction temperature is too high. The luminous efficiency of the polar body itself is reduced, and the degree of freedom cannot be improved. Therefore, various products that use high-power bodies require a good heat dissipation mechanism. Please refer to Figure-A and Figure-B'''''''''''''''''' Such as:; _ Β Β Α Α ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ A plurality of wafers 42 are placed on the yoke. The handle is made of 46 a _ 八 μ ϊ, 丨 molecular material, on which the material ^, a ceramic material or a plurality of μ >, the edge layer, a layer of wire covering the insulation f, two It Wafer 42. The turns generated by the plurality of wafers 42 are often in the form of a residual sheet to form a thermal module 5. The heat-dissipating module 5 is a heat-dissipating plate of ", 曰/ί, which is transmitted by a plurality of materials, and the heat generated by the non-ancient mu day 42 is passed through multiple layers ===== ..., the method is effective heat release, the heat dissipation efficiency of the chip can not be 1274428 = accurately controlled. The high power requirements often exceed the safe range. This type of heat dissipation module I: 9-pole U ~ 1 degree of heat dissipation efficiency can not be accurately controlled, 7, speed guide to reduce the spread of the 'wafer is very easy due to poor heat dissipation and superheated scale semiconductor light module Uesist (continued), reach the part; ^ set = reduce the thermal resistance junction temperature within the encapsulation level, can effectively solve the previous technology, two ^ have a low-turning wafer, the eve of the water from the Λ Λ 的 的 政In addition to the problem, the high-intensity light-emitting module is provided at the same time, and the effect of the semiconductor wafer is effectively reduced. The human/TT π 70 is the light-emitting effect of the field. [Invention] The present invention provides a light-emitting device. The handle is hot/heat-dissipating from at least—the bribery day is set to contain - guide key Γ ϊ ϊ ϊ ΐ 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上 大体上The external electrode, at least one bundle of body hairs, and the three carrier platforms are smoothly joined to the heat conducting device. The = set = on the stage. The at least 4 conductors = particles of the plurality of external electrodes are externally connected to the power source. The wires are electrically connected to the heat source light; the heat fins generated by the device are further caused by the at least one heat dissipation: the sheet is 'hot.坦 丨 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到Engine). The heat conduction/heat dissipation module can be controlled by the columnar heat conduction device, and the heat energy generated by the semiconductor light emitting module can guide the heat energy far away. The heat dissipation area can be dissipated to the surrounding area of the heart*. After that, each heat sink fin will immediately heat the heat according to the heat dissipation efficiency of the present invention. Therefore, compared with the flat end of the previous heat sink, 平ίϋ Through the flat-bonding of the semiconductor light-emitting module to the high-efficiency material two-wire technology (four) application

光模整t現有之照日狀備中之二極體發 更佳的散成一獨立式元件，並且能有效導熱且具有 詳述及所^式“點與精神可以藉由以下的發明 【實施方式】 提供—種具有高散熱效率高功率之發絲置，以防止 =方/ ^一極體晶片因結點(P_N junction)溫度過高而降低其發 率及壽命。並且，本發明之發光裝置為一種系統^裝 (SyStem*package)結構，整合一階封裝(First_ievd卿㈣狀 導^發光模組以及二階組裝(Sec〇nd七vd assembly)之高效率之散 熱模組，成為一具散熱功能之獨立整合發光元件。 請參閱圖^及圖三，圖二為根據本發明之發光裝置之外觀視 圖。圖三係繪示沿圖二中L_L線之剖面圖。根據本發明之發光裝 置1包含一導熱/散熱模組10以及一半導體發光模組 (Semiconductor light-emitting module)20。 如圖二及圖三所示，該導熱/散熱模組1〇包含一大體上成柱 狀之導熱裝置(Heat conducting device) 12與至少一散熱鰭片（Heat-dissipating fm)14〇該導熱裝置12具有至少一平坦部位於其之一 端或周圍上。於一具體實施例中，該導熱裝置12係一熱導管 (Heat pipe)、熱導柱(Heat column)或由一高導熱係數之材料，例如 1274428 銅二鋁Ϊ所成形之柱體，並且該柱體之長度超過其至少一平坦部 寬度的兩倍，而該至少—平坦部係在此類柱狀結構之導^ f衣作過程中加工處理而成。該至少-散熱鰭片14翻定於^ =熱裝置12之周圍，用以提高散熱效率。該至少一缺 中之每-散熱鰭片14上皆具有至少—孔洞142，該等孔洞H4 以作為散逸通道，使受該至少一散熱鰭片14 ，空氣散逸，進而增加該發光裝置i之散熱效 線牙過该等孔洞142以隱藏導線。 ’The optical mode is better than the existing one, and the diode is better dispersed into a free-standing component, and can be effectively thermally conductive and has a detailed description and a "point and spirit" can be achieved by the following invention. Providing a hairline having high heat dissipation efficiency and high power to prevent the square/^ pole wafer from lowering its rate and life due to excessive temperature of the node (P_N junction). Moreover, the light-emitting device of the present invention is A system (SyStem*package) structure, which integrates a first-order package (First_ievd (four)-shaped light-emitting module and a second-order assembly (Sec〇nd seven vd assembly) high-efficiency heat-dissipating module to become a heat-dissipating function Please refer to FIG. 3 and FIG. 3, FIG. 2 is an external view of a light-emitting device according to the present invention, and FIG. 3 is a cross-sectional view taken along line L_L of FIG. 2. The light-emitting device 1 according to the present invention comprises a The heat conduction/heat dissipation module 10 and a semiconductor light-emitting module 20. As shown in FIG. 2 and FIG. 3, the heat conduction/heat dissipation module 1 includes a substantially columnar heat conduction device (Heat). Conducting device) 1 2 and at least one heat-dissipating fin 14 having at least one flat portion at one or the periphery thereof. In one embodiment, the heat conducting device 12 is a heat pipe (Heat pipe) a heat column or a column formed of a material having a high thermal conductivity, such as 1274428 copper aluminum crucible, and the length of the cylinder exceeds twice the width of at least one flat portion thereof, and the The flat portion is processed during the process of guiding the columnar structure. The at least fin 14 is turned around the heat device 12 to improve heat dissipation efficiency. Each of the heat-dissipating fins 14 has at least a hole 142, and the holes H4 serve as a dissipating passage, so that the air is dissipated by the at least one heat-dissipating fin 14, thereby increasing the heat-dissipating effect of the light-emitting device i. Pass through the holes 142 to hide the wires.

’圖四鱗示根據本發明之—較佳具體實施例之 ▲ 見圖。如圖四以及圖五所示，該至少—半導體發光 、、、、2〇匕3 —載台（Camer)22、複數個外部電極（Exteri〇r e ectrode)24 ^ ^(Semiconductor light-emitting ^e)26與至少兩導線((：〇11(111(：如§以1^)28。該載台22係由一高分 材料、一金屬材料或一陶瓷材料所製成，且固定於該導熱裝置 99 fff、r平坦部上，並與該至少一平坦部平整接合。該載台 ，、有複數個通孔23，用以隱藏該至少兩導線28。該載台22 上進一步包含一支撐架(H〇lder)21，該支撐架21係位於該載台22 方且套設於該導熱裝置12，該載台22可以螺絲透過其上之 =文，通孔23鎖於該支撐架21上，增加接合壓力以降低接合界 面之熱阻係數。 遠至少一半導體發光晶粒26係固定於該載台22上並且分別 至該複數個外部電極24。該至少兩導線⑽電連接該減 電極24。該至少兩導線28可穿過該等散熱韓片 14上之至 夕一孔洞142以外接電源或接地。 於—貫關巾’ §彡至少—半導體發賴組進-步包含一封裝 tiae㈣e matenalWxtl駐少-半導體發光晶粒。該至 二半導體發光模組包含-光學模組，該光學模組細定於該載 口上以使該至少-半導體發光晶粒所發出的光線聚焦。 ,1274428 請再參閱圖三，如圖三所示，當該發光裝置丨 命 時，該至少-半導體發光晶粒26於發光時所產生的 ^ 熱裝置12自其本身的該至少—平坦部導引至該至少 Μ ’巧由該至少-散熱鰭片14散熱。由於根據本發。= 至>、-半導體發光晶粒透過載台22與該導熱/散熱模纟且12 ^ -平坦部緊密接合，而與外接之電源或控倾組之間 1 距離’可避免電源或控魏路模組直接受_至少導^ ^ 晶粒26所產生的熱能影響。 干令媸叙先Figure 4 is a view of a preferred embodiment of the invention in accordance with the present invention. As shown in FIG. 4 and FIG. 5, the at least—semiconductor light-emitting, 、, 2〇匕3-stage (Camer) 22, and a plurality of external electrodes (Exteri〇re ectrode) 24 ^ ^ (Semiconductor light-emitting ^e And 26 and at least two wires ((: 〇 11 (111: § 1)) 28. The stage 22 is made of a high-division material, a metal material or a ceramic material, and is fixed to the heat conduction The device 99 fff, r flat portion and is smoothly engaged with the at least one flat portion. The carrier has a plurality of through holes 23 for concealing the at least two wires 28. The carrier 22 further includes a support frame (H〇lder) 21, the support frame 21 is located on the stage 22 and sleeved on the heat conducting device 12, the stage 22 can be screwed through the text, and the through hole 23 is locked on the support frame 21. The bonding pressure is increased to reduce the thermal resistance coefficient of the bonding interface. At least one semiconductor light emitting die 26 is fixed on the stage 22 and respectively to the plurality of external electrodes 24. The at least two wires (10) are electrically connected to the reducing electrode 24 The at least two wires 28 can pass through the external power supply of the heat sink Korean film 14 to the outer hole 142 Or grounding. _ 关 关 ' ' § 彡 彡 彡 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia tia Finely defined on the carrier to focus the light emitted by the at least semiconductor light-emitting die. 1274428 Please refer to FIG. 3 again, as shown in FIG. 3, when the light-emitting device is killed, the at least-semiconductor light-emitting die The heat generating device 12, which is generated when the light is emitted, is guided from the at least flat portion of the light to the at least one of the heat dissipating fins 14. Since it is according to the present invention, the semiconductor is discharged. The light-emitting dies are closely coupled to the heat-dissipating/dissipating die and the 12^-flat portion through the stage 22, and the distance between the external power source or the tilting group can be prevented from being directly affected by the power supply or the control system module. ^ The thermal energy generated by the grain 26 is affected.

如圖三所示，本發明之發光裝置進一步包含一嵌 以便利組裝。該嵌合構件30套設於該載台22上，且豆苒呈^3ϋ 彈性體(Res&nt body)。舉例來說，當使用者欲將該之發絲有1 =於:牆壁上或-天花板上之—孔洞時，使用者可先將兩彈性 體/刀射曲成與該導熱裝置12平行，再將發光裝置丨嵌^ ，天花板上之孔洞。當發光裝置丨嵌進孔洞時，兩彈性體g 彈力而欲回復原綠態，使得發光裝置丨可以與孔洞互相嵌^。 請參閱圖五、圖六及圖七’圖五、圖六及圖七係繪示根據本 么明之發光裝置之各種實施方式。由以上各圖可得知，本發明之 發光裝置並不侷限導歸置以及載台之形態， ^ 之需要而做改善。應用 於一實施例中，本發明之發光裝置中之該至少一半導體笋光 j，包含至少一發光二極體(Light emitting di〇de，LED)晶粒或丄少 1射二極體(Laser diode)晶粒。該半導體發光晶粒可能為一藍光 一極體晶粒或是包含至少一紅光二極體晶粒、至少一藍光二極體 晶粒以及至少一綠光二極體晶粒；控制該等紅光二極體晶粒、藍 光一極體晶粒以及綠光二極體晶粒，使得該等不同顏色的發光二 極體晶粒以不同的發光比例可組成各種不同顏色的光線。 本發明所提供的發光裝置係將導熱/散熱模組與半導體發光模 9 1274428 置有ί:日為-二立之具高效散熱功能的發光裝 平整端面，令ζϊί置將+導體發光模組平整接合於導熱裝置之 有效降低半導裝置其大體呈柱狀之結構將熱引導開，而能 之導熱結點溫度。該導熱/散熱模組可藉由該柱狀 該導熱裝置不‘較‘前且2產生的熱能有效導引， 能發散至ί圍散熱鰭片能立即將導熱裝置傳導之熱 °解决了因過熱造成半導體發光晶粒效率下降的問題。 合導的發光裝置透過將半導體發光模組平整接 引塞=衣Α、’正端面，透過導熱裝置其大體呈柱狀之結構將熱 ί 濟加以限制。相反地，其目的是希望能涵蓋各種改變 及，、相雜的安排於本發賴欲帽之專概目的範脅内。 10 1274428 【圖式簡單說明】 圖一 A係繪示現有的包含一散熱模組並為獨立元件之發光裝 置之示意圖 圖一 B係繪示現有的包含一散熱模組並為獨立元件之發光裝 置之剖面圖 圖二係繪示根據本發明之發光裝置之外觀視圖。As shown in Figure 3, the illumination device of the present invention further includes an inset to facilitate assembly. The fitting member 30 is sleeved on the stage 22, and the soybean meal is a Res&nt body. For example, when the user wants to have the hairline 1 = on the wall or on the ceiling - the user can first align the two elastomers/knife into parallel with the heat conducting device 12, and then Embed the light-emitting device into the hole in the ceiling. When the illuminating device is inserted into the hole, the two elastic bodies g are elastic and want to return to the original green state, so that the illuminating device 丨 can be embedded with the hole. Please refer to FIG. 5, FIG. 6 and FIG. 7 'FIG. 5, FIG. 6 and FIG. 7 show various embodiments of the light-emitting device according to the present invention. As can be seen from the above figures, the illuminating device of the present invention is not limited to the orientation of the homing and the shape of the stage, and is improved as needed. In one embodiment, the at least one semiconductor light-emitting device j of the light-emitting device of the present invention comprises at least one light-emitting diode (LED) die or a reduced one-shot diode (Laser) Diode) Grain. The semiconductor light-emitting die may be a blue light-emitting body die or include at least one red light-emitting diode die, at least one blue light-emitting diode die, and at least one green photodiode die; controlling the red light The diode grains, the blue light-emitting diode grains, and the green light-emitting diode grains enable the light-emitting diode crystal grains of different colors to form light of various colors at different light-emitting ratios. The light-emitting device provided by the invention has the heat-dissipating/heat-dissipating module and the semiconductor light-emitting module 9 1274428; the illuminating flat end surface of the high-efficiency heat-dissipating function of the day-and-two-right device enables the +-conductor light-emitting module to be flattened An effective lowering of the semiconducting device bonded to the heat conducting device has a generally columnar structure that conducts heat and can thermally conduct the junction temperature. The heat conduction/heat dissipation module can be effectively guided by the heat energy generated by the columnar heat-conducting device not being 'before' and 2, and can be dissipated to the heat-dissipating fins to immediately transfer the heat of the heat-conducting device to solve the overheating A problem that causes a decrease in the efficiency of semiconductor light-emitting crystallization. The illuminating device of the illuminating device limits the heat by splicing the semiconductor illuminating module to the sash, the front end, and the columnar structure of the heat conducting device. On the contrary, the purpose is to cover various changes and, and the various arrangements are within the scope of the general purpose of this slogan. 10 1274428 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic view showing a conventional light-emitting device including a heat-dissipating module and being a separate component. FIG. B is a schematic diagram showing a conventional light-emitting device including a heat-dissipating module and being a separate component. 2 is a perspective view showing a light-emitting device according to the present invention.

圖三係繪示沿圖二中L-L線之剖面圖，顯示根據本發明之發 光裝置。 圖四係繪示根據本發明之一較佳具體實施例之發光裝置的頂 視圖。 圖五、圖六及圖七係繪示根據本發明之發光裝置之各種實施 方式。Figure 3 is a cross-sectional view taken along line L-L of Figure 2, showing the light-emitting device according to the present invention. Figure 4 is a top plan view of a light emitting device in accordance with a preferred embodiment of the present invention. Figures 5, 6, and 7 illustrate various embodiments of a light emitting device in accordance with the present invention.

【主要元件符號說明】 4:半導體發光模組 44 :凹槽 5:散熱模組 10 :導熱/散熱模組 20 :半導體發光模組 22 :載台 24 :外部電極 42 :發光二極體 46 :基板 1 :發光裝置 12 :導熱裝置 14 :散熱鰭片 142 :孔洞 26 :半導體發光晶粒 1274428 21 :支撐架 28 :導線 30 :嵌合構件 23 :通孔[Main component symbol description] 4: Semiconductor light-emitting module 44: recess 5: heat-dissipating module 10: heat-dissipating/heat-dissipating module 20: semiconductor light-emitting module 22: stage 24: external electrode 42: light-emitting diode 46: Substrate 1: illuminating device 12: heat conducting device 14: heat radiating fin 142: hole 26: semiconductor light emitting die 1274428 21: support frame 28: wire 30: fitting member 23: through hole

1212

Claims (1)

1274428 - 十、申請專利範圍： 1、 一種發光裝置(Light-emitting apparatus)，包含： 一導熱/散熱模組(Heat conducting/dissipating module)，包含： 一大體上成柱狀之導熱裝置(Heat conducting device)，該導 熱裝置具有至少一平坦部；以及 至少一散熱韓片（Heat-dissipating fm)，該至少一散熱籍片係 固定於該導熱裝置之一周圍上；以及 i 至少一半導體發光模組(Semiconductor light-emitting module)， 包含： 一載台(Carrier)，該載台係以其之一底部平整接合該導熱裝 置之至少一平坦部； 複數個外部電極(Exteri〇r electr〇(je)，該複數個外部電極係 設置於該載台上； 半導體發光晶粒(Semiconductor light-emitting die)， f至f 一半導體發光晶粒係固定於該載台上並且分別電連 接至該複數個外部電極；以及 至〉、兩導線(Conducting wire)， 該至少兩導線電連接該複數 個外部電極。1274428 - X. Patent application scope: 1. A light-emitting device comprising: a heat conducting/dissipating module comprising: a substantially columnar heat conducting device (Heat conducting The heat conducting device has at least one flat portion; and at least one heat-dissipating fm, the at least one heat radiating film is fixed around one of the heat conducting devices; and i at least one semiconductor light emitting module (Semiconductor light-emitting module), comprising: a carrier that is flattened at one of the bottom portions to engage at least one flat portion of the heat conducting device; a plurality of external electrodes (Exteri〇r electr〇(je) The plurality of external electrodes are disposed on the stage; a semiconductor light-emitting die, a f to f-semiconductor light-emitting die is fixed on the stage and electrically connected to the plurality of external portions, respectively An electrode; and to > a conducting wire, the at least two wires electrically connecting the plurality of external electrodes. 金屬材料或一陶瓷材料所製成。 ，其中該載台係由一多分Made of metal material or a ceramic material. Where the stage is multi-pointed 其中該至少一半導體發 13 1274428 一光學模組，該光學模組係固定於該載台上以使該至少一半 導體發光晶粒所發出的光線聚焦。 4、 如申請專利範圍第1項所述之發光裝置，其中該導熱裝置為一熱 導管(Heat pipe)或熱導柱(Heat column)。 5、 如申請專利範圍第1項所述之發光裝置，其中該導熱裝置係一高 導熱係數之材料所成形之柱體，並且該柱體之長度超過其至少 一平坦部之最大寬度的兩倍。 6、 如申請專利範圍第1項所述之發光裝置，其中該至少一平坦部係 位於該導熱裝置之一端。 7、如申請專利範圍第1項所述之發光裝置，其中該至少一平坦部係 位於該導熱裝置之周圍上。 8、 如申請專利範圍第1項所述之發光裝置，其中該至少一半導體發 光曰曰粒包含至少一發光一極體(Ligj^ em批[ng di〇de，LED)晶粒或 至少一雷射二極體(Laser diode)晶粒。 9、 如申請專利範圍第1項所述之發光裝置，其中該至少一半導體發 光晶粒包含一藍光二極體晶粒。 10、 如申睛專利範圍第丨項所述之發光装置，其中該至少一半導體發 光曰a粒包含至少一紅光一極體晶粒、至少一藍光二極體晶粒以 及至少一綠光二極體晶粒。 11、如申凊專利範圍第1項所述之發光裝置，其中進一步包含一嵌合 構件(Embedding assembly)，該嵌合構件係套設於該載台上用以 組裝該發光裝置。 12、如申請專利翻第丨賴述之發光裝置，該載台上具有複數個通 孔，用以隱藏該至少兩導線。 14 1274428 ^ 13、如申請專利範圍第1項所述之發光裝置，其中進一步包含一支樓 架(Holder)，該支撐架係位於該載台之下方且套設於該導熱裝 置，該載台上具有複數個通孔，用以將該載台鎖於該支撐架 14、如申請專利範圍第1項所述之發光裝置，其中該至少一散熱鰭片 中之每一散熱鰭片上皆具有至少一孔洞，使得該至少兩導線可 穿過該等孔洞，以外接一電源或接地。 15The at least one semiconductor chip 13 1274428 is an optical module, and the optical module is fixed on the stage to focus the light emitted by the at least half of the conductor illuminating crystal grains. 4. The illuminating device of claim 1, wherein the heat conducting device is a heat pipe or a heat column. 5. The illuminating device of claim 1, wherein the heat conducting device is a cylinder formed by a material having a high thermal conductivity, and the length of the cylinder exceeds twice the maximum width of at least one flat portion thereof. . 6. The illuminating device of claim 1, wherein the at least one flat portion is located at one end of the heat conducting device. 7. The illuminating device of claim 1, wherein the at least one flat portion is located around the heat conducting device. 8. The illuminating device of claim 1, wherein the at least one semiconductor luminescent particle comprises at least one illuminating monopole (Lig) or at least one ray Laser diode grains. 9. The illuminating device of claim 1, wherein the at least one semiconductor luminescent crystal grain comprises a blue LED dies. 10. The illuminating device of claim 2, wherein the at least one semiconductor luminescent a particle comprises at least one red photodiode, at least one blue dipole grain, and at least one green photodiode Body grain. The illuminating device of claim 1, further comprising an embedding assembly, the fitting member being sleeved on the stage for assembling the illuminating device. 12. If the illuminating device of the patent application is turned over, the stage has a plurality of through holes for hiding the at least two wires. The illuminating device of claim 1, further comprising a hoist, the support frame being located below the stage and sleeved on the heat conducting device, the stage The light-emitting device of the first aspect of the invention, wherein the heat-dissipating fins of the at least one heat-dissipating fin have at least one of the heat-dissipating fins A hole allows the at least two wires to pass through the holes and is externally connected to a power source or a ground. 15
TW094117784A 2005-05-31 2005-05-31 Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module TWI274428B (en)

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