TWI268967B - Sealing agent, sealing method and printed board treated with said sealing agent - Google Patents

Sealing agent, sealing method and printed board treated with said sealing agent Download PDF

Info

Publication number
TWI268967B
TWI268967B TW094102439A TW94102439A TWI268967B TW I268967 B TWI268967 B TW I268967B TW 094102439 A TW094102439 A TW 094102439A TW 94102439 A TW94102439 A TW 94102439A TW I268967 B TWI268967 B TW I268967B
Authority
TW
Taiwan
Prior art keywords
sealing
treatment agent
sealing agent
salt
sealing treatment
Prior art date
Application number
TW094102439A
Other languages
English (en)
Chinese (zh)
Other versions
TW200526817A (en
Inventor
Takashi Ouchi
Katsuyuki Tsuchida
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of TW200526817A publication Critical patent/TW200526817A/zh
Application granted granted Critical
Publication of TWI268967B publication Critical patent/TWI268967B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
TW094102439A 2004-01-30 2005-01-27 Sealing agent, sealing method and printed board treated with said sealing agent TWI268967B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004023280 2004-01-30

Publications (2)

Publication Number Publication Date
TW200526817A TW200526817A (en) 2005-08-16
TWI268967B true TWI268967B (en) 2006-12-21

Family

ID=34823864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102439A TWI268967B (en) 2004-01-30 2005-01-27 Sealing agent, sealing method and printed board treated with said sealing agent

Country Status (4)

Country Link
JP (1) JP4397376B2 (ja)
CN (1) CN1914359B (ja)
TW (1) TWI268967B (ja)
WO (1) WO2005073435A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7883738B2 (en) * 2007-04-18 2011-02-08 Enthone Inc. Metallic surface enhancement
CN101580951B (zh) * 2008-05-12 2011-03-30 比亚迪股份有限公司 一种提高镀铬产品的耐蚀性的方法
JP5666940B2 (ja) * 2011-02-21 2015-02-12 株式会社大和化成研究所 封孔処理剤溶液及びそれを用いた封孔処理方法
JP6711525B2 (ja) * 2016-03-28 2020-06-17 奥野製薬工業株式会社 アルミニウム合金の陽極酸化皮膜用封孔処理液、濃縮液及び封孔処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215697A (ja) * 1990-01-19 1991-09-20 Meidensha Corp 金属材料の封孔処理方法
JPH05311495A (ja) * 1991-12-25 1993-11-22 Nikko Kinzoku Kk 貴金属めっき材の封孔処理方法
JP3870225B2 (ja) * 2001-10-19 2007-01-17 ユケン工業株式会社 金めっき封孔処理剤と方法

Also Published As

Publication number Publication date
CN1914359B (zh) 2011-12-28
JPWO2005073435A1 (ja) 2007-09-13
CN1914359A (zh) 2007-02-14
TW200526817A (en) 2005-08-16
WO2005073435A1 (ja) 2005-08-11
JP4397376B2 (ja) 2010-01-13

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