TWI259543B - Processing device - Google Patents
Processing device Download PDFInfo
- Publication number
- TWI259543B TWI259543B TW094101507A TW94101507A TWI259543B TW I259543 B TWI259543 B TW I259543B TW 094101507 A TW094101507 A TW 094101507A TW 94101507 A TW94101507 A TW 94101507A TW I259543 B TWI259543 B TW I259543B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- nozzle
- liquid
- general
- fine
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract description 22
- 239000007788 liquid Substances 0.000 abstract description 14
- 238000006073 displacement reaction Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 18
- 239000010419 fine particle Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000012488 sample solution Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000002493 microarray Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 206010011469 Crying Diseases 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H3/00—Storage means or arrangements for workshops facilitating access to, or handling of, work tools or instruments
- B25H3/02—Boxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/02—Burettes; Pipettes
- B01L3/0241—Drop counters; Drop formers
- B01L3/0268—Drop counters; Drop formers using pulse dispensing or spraying, eg. inkjet type, piezo actuated ejection of droplets from capillaries
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L13/00—Implements for cleaning floors, carpets, furniture, walls, or wall coverings
- A47L13/10—Scrubbing; Scouring; Cleaning; Polishing
- A47L13/50—Auxiliary implements
- A47L13/58—Wringers for scouring pads, mops, or the like, combined with buckets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00277—Apparatus
- B01J2219/00351—Means for dispensing and evacuation of reagents
- B01J2219/0036—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00277—Apparatus
- B01J2219/00351—Means for dispensing and evacuation of reagents
- B01J2219/00378—Piezoelectric or ink jet dispensers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00583—Features relative to the processes being carried out
- B01J2219/00603—Making arrays on substantially continuous surfaces
- B01J2219/00659—Two-dimensional arrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00718—Type of compounds synthesised
- B01J2219/0072—Organic compounds
- B01J2219/00722—Nucleotides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2400/00—Moving or stopping fluids
- B01L2400/02—Drop detachment mechanisms of single droplets from nozzles or pins
- B01L2400/027—Drop detachment mechanisms of single droplets from nozzles or pins electrostatic forces between substrate and tip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2400/00—Moving or stopping fluids
- B01L2400/04—Moving fluids with specific forces or mechanical means
- B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
- B01L2400/0433—Moving fluids with specific forces or mechanical means specific forces vibrational forces
- B01L2400/0439—Moving fluids with specific forces or mechanical means specific forces vibrational forces ultrasonic vibrations, vibrating piezo elements
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- C—CHEMISTRY; METALLURGY
- C40—COMBINATORIAL TECHNOLOGY
- C40B—COMBINATORIAL CHEMISTRY; LIBRARIES, e.g. CHEMICAL LIBRARIES
- C40B40/00—Libraries per se, e.g. arrays, mixtures
- C40B40/04—Libraries containing only organic compounds
- C40B40/06—Libraries containing nucleotides or polynucleotides, or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C40—COMBINATORIAL TECHNOLOGY
- C40B—COMBINATORIAL CHEMISTRY; LIBRARIES, e.g. CHEMICAL LIBRARIES
- C40B60/00—Apparatus specially adapted for use in combinatorial chemistry or with libraries
- C40B60/14—Apparatus specially adapted for use in combinatorial chemistry or with libraries for creating libraries
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
- G01N2035/1027—General features of the devices
- G01N2035/1034—Transferring microquantities of liquid
- G01N2035/1041—Ink-jet like dispensers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
- G01N35/1009—Characterised by arrangements for controlling the aspiration or dispense of liquids
- G01N35/1016—Control of the volume dispensed or introduced
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
- Spray Control Apparatus (AREA)
- Coating Apparatus (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Electron Tubes For Measurement (AREA)
- Nozzles (AREA)
Description
1259543 年/月&修^更正; 明專利範圍第6項之處理裝置,其中,尚具備有: 知、、☆ 2式移位感應器,係以非接觸方式檢測出前述微 机-噴射部與前述基板間的間隔的移位, 而根據前述非接觸式移位感應器之移位訊號使 、二鍊+軸·動邛產生作動,藉此以微幅調整前述微細 /现-贺射部與前述基板間的間隔。 H請專利範圍第7項之處理裝置,其中,前述非接 :式移位感應器係具備有:投光部,使雷射光朝前述 =投射;以及正反射式雷射移料,接收由該基板 反射之雷射反射光的受光部。 9·如申請專利範圍第7項之處縣置,其中,前述非接 式移位感應器係連續檢測出不包含藉由前述微細 流體喷射部將前述滴液供給至前述基板之供給位 置,且未供給有前述滴液之未供給區域。 10. 如申請專利範圍第7項之處理裝置,其中,前述非接 觸式移位感應器,係於藉由前述微細流體喷射部將前 述滴液供給至前述基板前檢測出包含前述滴液之供 給位置的附近後,即停止檢測。 11. 如申請專利範圍第9項之處理裝置,其中,尚具備有 位置調整機構,用以調整前述非接觸式移位感應器之 檢測位置,俾檢測出前述微細流體喷射部供給前述滴 液之供給位置附近的任意位置。 12.如申請專利範圍第10項之處理裝置,其中,尚且 有位置調整機構,用以調整前述非接觸式移位感應哭 之檢測位置’俾檢測出前述微細流體喷射部供給前^ 316563(更正版) 3 月輕/更」 1259543 滴液之供給位置附近的任意位置 13. 如申請專利範圍第1項或第2項之處理裂置,其中, 2具備有校準基板,用以調整前述一般流體噴射部與 刖述微細流體噴射部之相對位置。 14. 如申請專利範圍第!項或第2項之處理裂置,立中, 前述一般流體噴射部與前述微細流體噴射部係將全 屬微粒子之膠體溶液作為前述處理液朝前述基板噴 出。 、 15. 如申請專利範圍第!項或第2項之處理裝置,盆中, 前述:般流體喷射部與前述微細流體喷射部係將導 電I"生回为子之可溶性衍生物作為前述處理液朝 基板喷出。 16. 如申請專利範圍第14項之處理裝置,其中,前述基 板可搭載積體電路零件,藉由自前述微細流體喷射 噴出前述微細粒徑之前诚_理为沾、齒、广 股贺射4 < &〈則迷處理液的滴液,而在前述基 板上形成前述積體電路零件之周邊等具有微細寬度 的微細圖案,同時藉由自前述一般流體喷射部喷出前 述一般粒徑之前述處理液的滴液,而在前述基板上形 成具有較前述微細寬度更寬之一般寬度的一般圖案。 17·如申請專利範圍第!項或第2項之處理裝置,苴/中, f述處理液係導電性溶液,而前述基板係多層基板, =由彳之則述一般流體噴射部將前述一般粒徑之前述 V電性溶液之滴液噴出,形成於前述多層基板上,且 ^行具有一般徑之貫通孔之填洞的同時,藉由從前述 U、、、田〃IL體喷射部將前述微細粒徑之前述導電性之溶 316563(更正版) 4 1259543 液^滴液喷出,形成於前述多層板上,且進行呈有小 於前述一般徑之微細徑之貫通孔之填洞。、 l8t申請專利範圍第1項或第2項之處理裝置,i中, 精由從前述-般流體喷射部將前述一般粒徑之滴液 '出,而將-般徑之銲錫凸塊形成在前述基板上,並 且错由從前述微細流體噴射部將前述微細粒徑之滴 ,嘴出,而將小於前述一般徑之微細徑之銲錫 成在前述基板上。 19.如申請專利範圍第i項或第2項之處理裝置中 f述處理液係DNA溶液,藉由自前述-般流體喷射 Μ出W述-般粒徑之DNA溶液而在前述基板上形 成排列有複數個一般徑之點的DNA微陣列,同時藉 由自前述微細流體喷射部噴出前述微細粒徑之dna曰 溶液而在前述基板上形成排列有複數個較前述一般 徑細小之微細徑之點的DNA微陣列。 如申請專利範圍第丨項或第2項之處理裳置中, 前述處理液係化學試料溶液,#由自前述一般流體喷 射部喷出前述一般粒徑之化學試料溶液而在前述基、 板上形成排列有複數個一般徑之點的微陣列,並藉由 自前述微細流體喷射部喷出前述微細粒徑之化學試 料溶液而形成排列有複數個較前述一般徑細小之微 細徑之點的微陣列重疊形成於所形成之各個前述一 般徑的點上,藉此使前述一般粒徑之化學試料溶液與 前述微細粒徑之化學試料溶液產生化學反應。 316563(更正版) 5
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004083961A JP4748503B2 (ja) | 2004-03-23 | 2004-03-23 | 処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200532820A TW200532820A (en) | 2005-10-01 |
TWI259543B true TWI259543B (en) | 2006-08-01 |
Family
ID=34858388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094101507A TWI259543B (en) | 2004-03-23 | 2005-01-19 | Processing device |
Country Status (6)
Country | Link |
---|---|
US (1) | US7527692B2 (zh) |
EP (1) | EP1579926B1 (zh) |
JP (1) | JP4748503B2 (zh) |
KR (1) | KR100666409B1 (zh) |
CN (1) | CN100350556C (zh) |
TW (1) | TWI259543B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4372101B2 (ja) * | 2003-08-08 | 2009-11-25 | コニカミノルタホールディングス株式会社 | 液体吐出装置、液体吐出方法及び回路基板の配線パターン形成方法 |
JP4489524B2 (ja) * | 2004-07-23 | 2010-06-23 | 株式会社ルネサステクノロジ | 半導体装置の製造方法およびペースト塗布装置 |
JP4400541B2 (ja) * | 2005-10-04 | 2010-01-20 | セイコーエプソン株式会社 | パターン形成方法及び液滴吐出装置 |
FR2904872B1 (fr) * | 2006-08-09 | 2008-10-10 | Neuroservice Sarl | Appareil pour la mesure des variations de potentiel membranaire extracellulaire au moyen de microelectrodes |
JP5084236B2 (ja) * | 2006-11-30 | 2012-11-28 | 東京エレクトロン株式会社 | デバイス製造装置およびデバイス製造方法 |
US7576000B2 (en) * | 2006-12-22 | 2009-08-18 | Palo Alto Research Center Incorporated | Molded dielectric layer in print-patterned electronic circuits |
TWI516312B (zh) | 2007-05-18 | 2016-01-11 | Musashi Engineering Inc | Method and apparatus for discharging liquid material |
US8073798B2 (en) * | 2007-05-24 | 2011-12-06 | Palo Alto Research Center Incorporated | Dynamic domain abstraction through meta-analysis |
CN101396689B (zh) * | 2007-09-29 | 2011-03-02 | 比亚迪股份有限公司 | 一种三维涂胶***和方法 |
US9017610B2 (en) * | 2008-04-25 | 2015-04-28 | Roche Diagnostics Hematology, Inc. | Method of determining a complete blood count and a white blood cell differential count |
US9602777B2 (en) | 2008-04-25 | 2017-03-21 | Roche Diagnostics Hematology, Inc. | Systems and methods for analyzing body fluids |
JP5413826B2 (ja) * | 2009-02-17 | 2014-02-12 | 株式会社マイクロジェット | 吐出装置 |
JP5544462B2 (ja) * | 2009-04-15 | 2014-07-09 | 株式会社マイクロジェット | 吐出装置 |
US9561514B2 (en) | 2010-12-07 | 2017-02-07 | University Of Florida Research Foundation, Inc. | Spraying system and methods of use thereof |
KR101398759B1 (ko) * | 2011-03-01 | 2014-05-27 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 노즐, 기판처리장치, 및 기판처리방법 |
KR101803008B1 (ko) * | 2011-05-04 | 2017-11-30 | 삼성디스플레이 주식회사 | 기판 처리 장치 및 그 동작 방법 |
JP6106170B2 (ja) * | 2011-07-22 | 2017-03-29 | ロッシュ ダイアグノスティクス ヘマトロジー インコーポレイテッド | 試料塗布装置の感知および位置決め |
EP2872869B1 (en) * | 2012-07-13 | 2020-05-27 | Roche Diagnostics Hematology, Inc. | Controlled dispensing of samples onto substrates |
CN103464334A (zh) * | 2013-09-27 | 2013-12-25 | 如皋市易达电子有限责任公司 | 粘胶机 |
AU2015206277A1 (en) * | 2014-01-17 | 2016-08-11 | William Eugene Campbell | Methods and systems for slide processing |
EP3020550B1 (de) * | 2014-11-13 | 2018-03-07 | multec GmbH | Druckkopf und extruderdüse für 3d-druck |
US10759188B2 (en) * | 2017-04-24 | 2020-09-01 | Xerox Corporation | System for providing multiple surface treatments to three-dimensional objects prior to printing |
WO2020154242A1 (en) | 2019-01-21 | 2020-07-30 | Nordson Corporation | System and method for dispenser control |
JP7426198B2 (ja) * | 2019-04-17 | 2024-02-01 | 株式会社ジャノメ | 塗布装置 |
JP6883876B2 (ja) * | 2019-07-12 | 2021-06-09 | 株式会社ワークス | 電子部品接着用ノズル |
JP7451972B2 (ja) | 2019-11-29 | 2024-03-19 | 株式会社リコー | 液吐出ユニット、液吐出装置および液吐出方法 |
US20230014003A1 (en) * | 2019-12-20 | 2023-01-19 | Hewlett-Packard Development Company, L.P. | Integrated fluid ejection and imaging |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4746935A (en) * | 1985-11-22 | 1988-05-24 | Hewlett-Packard Company | Multitone ink jet printer and method of operation |
US5412410A (en) * | 1993-01-04 | 1995-05-02 | Xerox Corporation | Ink jet printhead for continuous tone and text printing |
JPH11285661A (ja) | 1998-04-02 | 1999-10-19 | Toray Ind Inc | 塗装装置および塗装方法 |
JP2000006423A (ja) * | 1998-06-19 | 2000-01-11 | Sony Corp | インクジェット記録用ヘッドの製造方法 |
JP2000089019A (ja) * | 1998-09-10 | 2000-03-31 | Canon Inc | カラーフィルタとその製造方法、該カラーフィルタを用いた液晶素子 |
US6474573B1 (en) * | 1998-12-31 | 2002-11-05 | Charge Injection Technologies, Inc. | Electrostatic atomizers |
TWI264963B (en) * | 2001-03-29 | 2006-10-21 | Hitachi Ltd | Organic EL display and production device of color filter |
US20030029379A1 (en) * | 2001-07-11 | 2003-02-13 | Fuji Photo Film Co., Ltd. | Electrostatic coating device and electrostatic coating method |
EP1453600A1 (en) * | 2001-08-10 | 2004-09-08 | Oxford Genome Sciences (UK) Limited | Liquid delivery apparatus and method |
JP3808741B2 (ja) | 2001-10-01 | 2006-08-16 | 東京エレクトロン株式会社 | 処理装置 |
JP4612255B2 (ja) * | 2001-10-19 | 2011-01-12 | セイコーエプソン株式会社 | ヘッドユニットおよび電子機器、並びに液晶表示装置の製造方法、有機el装置の製造方法、電子放出装置の製造方法、pdp装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機elの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
JP3975272B2 (ja) * | 2002-02-21 | 2007-09-12 | 独立行政法人産業技術総合研究所 | 超微細流体ジェット装置 |
JP2003318133A (ja) * | 2002-04-22 | 2003-11-07 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、半導体チップの実装構造、半導体装置、発光装置、電気光学装置、電子機器、並びに非接触型カード媒体 |
US6905645B2 (en) * | 2002-07-03 | 2005-06-14 | Therics, Inc. | Apparatus, systems and methods for use in three-dimensional printing |
US7823535B2 (en) * | 2002-09-27 | 2010-11-02 | Shimadzu Corporation | Liquid portioning method and device |
KR100700176B1 (ko) * | 2002-12-18 | 2007-03-27 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널의 디스펜서 및 이를 이용한 노즐과 기판의갭 제어방법 |
JP4311050B2 (ja) * | 2003-03-18 | 2009-08-12 | セイコーエプソン株式会社 | 機能液滴吐出ヘッドの駆動制御方法および機能液滴吐出装置 |
US7393081B2 (en) * | 2003-06-30 | 2008-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Droplet jetting device and method of manufacturing pattern |
-
2004
- 2004-03-23 JP JP2004083961A patent/JP4748503B2/ja not_active Expired - Lifetime
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2005
- 2005-01-19 TW TW094101507A patent/TWI259543B/zh not_active IP Right Cessation
- 2005-03-01 CN CNB2005100517606A patent/CN100350556C/zh not_active Expired - Fee Related
- 2005-03-09 KR KR1020050019431A patent/KR100666409B1/ko active IP Right Grant
- 2005-03-17 EP EP05005890A patent/EP1579926B1/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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JP2005274177A (ja) | 2005-10-06 |
KR20060043551A (ko) | 2006-05-15 |
US20050212837A1 (en) | 2005-09-29 |
CN100350556C (zh) | 2007-11-21 |
US7527692B2 (en) | 2009-05-05 |
EP1579926A2 (en) | 2005-09-28 |
CN1674217A (zh) | 2005-09-28 |
EP1579926B1 (en) | 2012-02-01 |
TW200532820A (en) | 2005-10-01 |
EP1579926A3 (en) | 2009-06-03 |
KR100666409B1 (ko) | 2007-01-10 |
JP4748503B2 (ja) | 2011-08-17 |
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