TWI258059B - Substrate processing method and substrate processing apparatus - Google Patents

Substrate processing method and substrate processing apparatus Download PDF

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Publication number
TWI258059B
TWI258059B TW91137198A TW91137198A TWI258059B TW I258059 B TWI258059 B TW I258059B TW 91137198 A TW91137198 A TW 91137198A TW 91137198 A TW91137198 A TW 91137198A TW I258059 B TWI258059 B TW I258059B
Authority
TW
Taiwan
Prior art keywords
substrate
processing
film
resist
substrate processing
Prior art date
Application number
TW91137198A
Other languages
English (en)
Chinese (zh)
Other versions
TW200301849A (en
Inventor
Shuji Iwanaga
Kyoshige Katayama
Masahide Tadokoro
Michio Tanaka
Ryouichi Uemura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200301849A publication Critical patent/TW200301849A/zh
Application granted granted Critical
Publication of TWI258059B publication Critical patent/TWI258059B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW91137198A 2001-12-25 2002-12-24 Substrate processing method and substrate processing apparatus TWI258059B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001391286 2001-12-25
JP2002001394 2002-01-08

Publications (2)

Publication Number Publication Date
TW200301849A TW200301849A (en) 2003-07-16
TWI258059B true TWI258059B (en) 2006-07-11

Family

ID=26625241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91137198A TWI258059B (en) 2001-12-25 2002-12-24 Substrate processing method and substrate processing apparatus

Country Status (3)

Country Link
AU (1) AU2002357620A1 (fr)
TW (1) TWI258059B (fr)
WO (1) WO2003056610A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448848B (zh) * 2009-12-28 2014-08-11 Hitachi Int Electric Inc 基板處理裝置、基板處理裝置的異常顯示方法及搬運控制方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6611652B2 (ja) * 2016-03-30 2019-11-27 東京エレクトロン株式会社 基板処理装置の管理方法、及び基板処理システム
JP2021132183A (ja) * 2020-02-21 2021-09-09 東京エレクトロン株式会社 情報処理装置、情報処理方法及びコンピュータ読み取り可能な記録媒体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0315849A (ja) * 1989-06-14 1991-01-24 Hitachi Ltd パターン形成方法
JPH08111370A (ja) * 1994-10-12 1996-04-30 Mitsubishi Electric Corp 微細レジストパターンの形成方法およびポストエキスポージャーベーク装置
US6221787B1 (en) * 1998-04-20 2001-04-24 Tokyo Electron Limited Apparatus and method of forming resist film
JP2000252179A (ja) * 1999-03-04 2000-09-14 Hitachi Ltd 半導体製造プロセス安定化支援システム
US6368975B1 (en) * 1999-07-07 2002-04-09 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448848B (zh) * 2009-12-28 2014-08-11 Hitachi Int Electric Inc 基板處理裝置、基板處理裝置的異常顯示方法及搬運控制方法

Also Published As

Publication number Publication date
AU2002357620A1 (en) 2003-07-15
TW200301849A (en) 2003-07-16
WO2003056610A1 (fr) 2003-07-10

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