TWI228107B - Plasma resistant quartz glass jig - Google Patents
Plasma resistant quartz glass jig Download PDFInfo
- Publication number
- TWI228107B TWI228107B TW090121039A TW90121039A TWI228107B TW I228107 B TWI228107 B TW I228107B TW 090121039 A TW090121039 A TW 090121039A TW 90121039 A TW90121039 A TW 90121039A TW I228107 B TWI228107 B TW I228107B
- Authority
- TW
- Taiwan
- Prior art keywords
- quartz glass
- plasma
- scope
- patent application
- fixture
- Prior art date
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 99
- 230000003746 surface roughness Effects 0.000 claims abstract description 11
- 239000007789 gas Substances 0.000 claims description 16
- 238000002834 transmittance Methods 0.000 claims description 12
- 238000011049 filling Methods 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 150000003377 silicon compounds Chemical class 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 16
- 238000005530 etching Methods 0.000 abstract description 14
- 230000002159 abnormal effect Effects 0.000 abstract description 10
- 238000001020 plasma etching Methods 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- 230000002079 cooperative effect Effects 0.000 description 5
- 238000003672 processing method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 4
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 3
- 229910052770 Uranium Inorganic materials 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 3
- 238000012993 chemical processing Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000013081 microcrystal Substances 0.000 description 3
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 3
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 2
- 238000001069 Raman spectroscopy Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000005049 silicon tetrachloride Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229940070337 ammonium silicofluoride Drugs 0.000 description 1
- GYQWAOSGJGFWAE-UHFFFAOYSA-N azane tetrafluorosilane Chemical compound N.[Si](F)(F)(F)F GYQWAOSGJGFWAE-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229960002050 hydrofluoric acid Drugs 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011043 treated quartz Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32559—Protection means, e.g. coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
- C03C2201/06—Doped silica-based glasses
- C03C2201/20—Doped silica-based glasses containing non-metals other than boron or halide
- C03C2201/21—Doped silica-based glasses containing non-metals other than boron or halide containing molecular hydrogen
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2203/00—Production processes
- C03C2203/40—Gas-phase processes
- C03C2203/42—Gas-phase processes using silicon halides as starting materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2204/00—Glasses, glazes or enamels with special properties
- C03C2204/08—Glass having a rough surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Surface Treatment Of Glass (AREA)
- Glass Compositions (AREA)
Description
1228107 A7 B7 五、發明説明(1 ) 〔技術領域〕 (請先閱讀背面之注意事項再填寫本頁) 本發生’係關於被使用在發生電漿的裝置內之耐電漿 特性優異的石英玻璃夾具。 〔習知技藝〕 經濟部智慧財產^員工消費合作社印製 近年來’在矽晶片等半導體元件的表面處理,逐漸多 被使用利用電漿之蝕刻處理等。在該電漿鈾刻處理,有一 方面將氟系’氯系等鹵素系腐蝕性氣體導入電漿發生室, ,經由石英玻璃製的微波導入窗,將微波經由石英玻璃製 之微波導入窗導入,而將內在的鹵素系腐蝕氣體電漿化, 將半導元件處理之方法,或將鹵素系腐蝕性氣體及微波導 入釣鐘狀的石英玻璃製鐘罎內,將前述鹵素系腐鈾性氣體 電漿化而處理半導體元件之方法,或將鹵素系腐蝕性氣體 及微波導入釣鐘狀的石英玻璃製鐘罎內,將前述鹵素系腐 蝕性氣體電漿化而處理半導體元件之方法,或者使絕緣薄 膜析出在半導體元件表面的方法等。做爲如此之發生電漿 的裝置主窗材,鐘罎,爲了將裝置密封用的環等之夾具, 由於電特性良好和高純度,多被使用以石英玻璃製作的夾 具。然後,此等夾具之接觸電漿的面,係被粗面化而設法 使蝕刻速度安定化與防止附著物剝離。在前述粗面化,被 使用以陶瓷磨刀石粒,鑽石磨刀石粒,二氧化矽磨刀石粒 等的硏削加工法,使用綠碳粉,二氧化矽粉,陶瓷粉等之 磨刀石的噴砂加工等之削取石英玻璃表面的機械性加工法 ,或使用化學藥品之化學性加工法等。可是,在前述硏削 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -4- 1228107 A7 B7 五、發明説明(2 ) 加工法和機械性加工法,當石英玻璃表面被粗面化的同時 將發生微裂痕,在電漿內發生的自由基將對該微裂痕攻擊 ’只將微裂痕部蝕刻成異常之孔,具有最嚴重時石英玻璃 夾具將從其部份破壞的缺點。更且,以硏削加工法和機械 性加工法所形成之微裂痕,有時將被取入雜質面在半導體 元件的處理時揮發,將半導體污染之問題。 一方面,在化學性加工法,雖然能夠得到無上述硏削 加工法與機械性加工法的問題點之石英玻璃夾具,可是近 年來,已被確認在電漿內,氣體與離子或自由基的發生, 同時也放出異常強之紫外線及電子線,即使以化學性加工 法粗面化,石英玻璃夾具也在石英玻璃爲天然石英玻璃時 ,由於含有很多氣泡,將開放氣泡使之露出在表面,使氣 泡部份劣化,更使粒子發生,增加對半導體元件表面之附 著,有使其電特性,特別係絕緣破壞特性劣化之缺點。 鑑於如此的現狀,本發明人等,經重覆專心硏究結果 ,發現將夾具的石英玻璃表面之表面粗糙度R a做爲5 //m〜〇 . 〇5//m,石英玻璃中的氣泡之含有量,做爲 依D I N的泡等級爲0或1,且表面之微裂痕的個數爲 5〇0個/ c m2以下時,能夠得到無異常之蝕刻和發生粒 子,能良好地製造半導體製品的石英玻璃夾具,更且,由 於氫分子濃度爲5 XI 〇16分子/ cm2以上,前述異常之 由紫外線與電子線的夾具表面之劣化將減少,由粒子對半 導體元件的附著之電特性的降低將減少。而且’發現除了 前述外,由於將石英玻璃之雙折射量設定爲7 〇 n m / 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) w in· _11-", —fl·— an·—·* mammmet§ i^i·— •-" 經濟部智慧財產笱員工消費合作社印製 A7 1228107 _ B7 五、發明説明(3 ) (請先閱讀背面之注意事項再填寫本頁) cm以下,虛擬溫度8 0 0〜1 2 0 0°C之範圍,由異常 的紫外線與電子線之夾具表面的劣化將更少,由此等之不 良影將消失而完成本發明者。亦即, 本發明之目的,係提供在電漿發生裝置使用,異常的 刻與石英玻璃表面之劣化少,且無由取入雜質的半導體元 件之污染的耐電漿蝕刻特性優異之石英玻璃夾具者。 〔發明之槪要〕 達成上述目的之本發明,係被使用在發生電漿的裝置 之石英玻璃夾具,其特徵爲,關於石英玻璃表面之表面粗 糙度Ra爲5//m〜0 · 05//m,玻璃中的氣泡之含有 量爲根據D I N的泡等級係0或1 ,且表面之微裂痕的個 數爲5 0 0個/ c m2以下耐電漿性石英玻璃夾具。 〔圖面之簡單說明〕 第1圖,係將實施例2的被起霜處理之石英玻璃,以 5 % H F飩刻2小時後的表面之1 0 0倍的顯微鏡照片。 經濟部智慧財產笱員工消費合作社印製 第2圖,係將噴砂處理的石英玻璃,以5 % H F蝕刻 2小時後的表面之1 〇 〇倍的顯微鏡照片。 〔發明之詳細說明〕 本發明之石英玻璃夾具,係以天然或合成石英玻璃所 製作的夾具,其將與電漿接觸之內表面,係爲了使蝕刻速 度安定化及防止附著物剝離,表面粗糙度R a在5 μ m〜 ϋ張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) " ' 1228107 A7 B7 五、發明説明(4) (請先閱讀背面之注意事項再填寫本頁) 〇· 〇 5 //m的範圍被粗糙化。前述表面粗糙度R a超過 5 //m時,在電漿內發生的自由基在凹部局部地攻擊,將 進行異常之鈾刻。並且,表面粗糙度Ra未滿〇 · 〇5// m時,由電槳生成的2次生成物(例如粒子等)將成爲容 易從表面剝離,有損害半導體元件的特性之危險性。 並且,本發明的石英玻璃夾具,係氣泡之含有量根據 D I N的泡等級爲0或1 ,雙折射量爲7 0 n m / c m以 下地均質爲理想。含有超過前述範圍之氣泡時,氣泡將由 電槳所發生的自由基與離子被侵蝕而開放,成爲異常孔之 前驅體,由接著的異常強之放射線與電子線使劣化進行, 形成大的孔同時將發生粒子。所謂根據D I N之泡等級爲 0 或 1,係依據 D I N (Deutsher Industrie Norm) 經濟部智慧財產局員工消費合作社印製 5 8 9 2 7,在1 0 0 c m 3存在的泡之總斷面積(c m2 ) 爲等級時爲0〜0 · 0 3,1之時爲0 · 0 3〜0 . 1 0 。並且,石英玻璃的雙折射量超過前述範圍時,在其失真 部份將由異常強之紫外線與電子線,使石英玻璃進行高密 度化,而引起微裂痕之粗大化。爲了有效防止如此由異常 強的紫外線與電子線之石英玻璃的高密度化,以將石英玻 璃之虛擬溫度設定爲8 0 0〜1 2 0 0 t的範圍爲理想。 由設定爲前述範圍之虛擬溫度,石英玻璃之密度將降低而 構造被緩和,即使由異常強的紫外線或電子線之照射也將 不易發生缺陷,能夠防止高密度化。做爲前述根據D I N 的泡等級有0或1及雙折射量之石英玻璃,有將矽化合物 在氣相加水分解所得之合成石英玻璃爲合適之例子。並且 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ' 1228107 A7 B7 五、發明説明(5 ) (請先閲讀背面之注意事項再填寫本頁) ’石英玻璃的虛擬溫度之設定,係由將石英玻璃以8 0 0 〜1 2 0 0 °C加熱所定時間而被進行。虛擬溫度之測定, 係根據雷射拉曼法。 更且,本發明的石英玻璃夾具,係夾具表面之微裂痕 的個數在5 0 0個/ c m2以下爲重要。夾具表面之微裂痕 個數超過前述範圍時,由在電漿內發生的自由基之攻擊, 蝕刻的進行更快,微裂痕將變大,最嚴重之情況石英玻璃 將從其部份破裂。前述微裂痕的個數爲5 0 0個/c m2以 下之石英玻璃夾具,係如在特開平1 0 - 2 7 3 3 3 9號 公報所記載,將石英玻璃夾具浸漬在氟化氫與氟化銨及醋 酸的溶液,把矽氟化銨之微結晶析出的方法,或如特開平 1 1 一 1 0 6 2 2 5號公報所記載,在石英玻璃夾具之表 面形成矽等的薄膜,以氟化氫水溶液蝕刻處理之方法等化 學性處理製成。在根據此化學處理的粗面化時,控制蝕刻 藥液與石英玻璃之反應很重要,特別係合成石英玻璃時, 藥液的溫度管理很重要,以將藥液之溫度控制在2 0 °C 土 2 °C的範圍爲理想。不在前述溫度範圍時,無法使石英玻 經濟部智慧財產苟員工消費合作社印製 璃表面之表面粗糙度Ra成爲5 〜〇 · 〇 5 //m。石 英玻璃表面之微裂痕的個數,係以觀察顯微鏡照片測定。 除了上述外,本發明之石英玻璃夾具,係以氫分子濃 度5 XI 0 16分子/c m3以上爲理想。由具有此氫分子濃 度,將抑制生成E /中心吸收帶,並且將去除石英玻璃網 目構造內之內部失真,減少由電漿內異常強的紫外線與電 子線之切斷S i - 0結合,將抑制石英玻璃的高密度化, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) " -8 - 1228107 Α7 Β7 五、發明説明(6 ) 減少發生大的微裂痕與粒子。前述氫分子濃度,將由製造 石英玻璃時調整火焰中之氫分子量,或將石英玻璃在 1 0 0〜9 0 Ot,常壓或加壓下的氫氣體環境下處理1 〜1 0 0小時而得到’其測定將根據雷射拉曼法。 本發明之石英玻璃夾具,係如上述在其表面被形成微 細的凹凸,而對紫外線之透過率有的作用。透過率小時, 石英玻璃表面將由紫外線而省化。特別係,由與電漿內的 自由基和離子同時發生之異常強的紫外線與電子線,使石 英玻璃之S i - 0結合斷裂而生成缺陷,進行高密度化, 微裂痕變大,更加快蝕刻速度,將形成大的孔。要防止前 述石英玻璃由紫外線之劣化,以使石英玻璃的內部透過率 ,成爲以2 0 0 nm之紫外線透過率爲8 0%以上,表現 透過率爲3 0〜8 5%爲理想。表現透過率超過8 5%, 由表面成爲粗糙而不可能,並且表現透過率未滿3 〇%時 ’將無法防止在石英玻璃表面之緻密化。前述所謂內部透 過率’係指不包含在玻璃外表面的反射損失之透過率,包 含反射損失者稱爲表現透過率。 本發明之石英玻璃夾具,雖然係如上述將以天然或合 成石英玻璃被製作,可是特別係以氣泡的含量少,且能容 易得到均質性高之石英玻璃的合成石英玻璃爲理想。由於 氣泡少且均質性高,將使鈾刻均勻地被進行,而不會引起 異常之蝕刻。 以下,將以具體例詳細說明本發明,可是此等實施例 ’係例示性地顯示者,本發明並不限定於此等。 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇Χ297公釐) (請先閱讀背面之注意事項再填寫本頁) --訂----- 經濟部智慧財產笱員工消費合作社印製 -9- 1228107 A7 B7 五、發明説明(7 ) (請先閱讀背面之注意事項再填寫本頁) 實施例 〔實施例1〕 將根據D I N的氣泡等級爲〇之合成石英玻璃,浸漬 在5 〇 %的氟化氫水溶液約2 4質量%,氟化銨約1 7質 量%,1 0 0%之醋酸水溶液約3 5質量%及水約2 4質 量%的起霧處理液,以析出矽氟化銨之微結晶的化學性處 理’製成表面粗糙度Ra爲〇 · 5//m,Rma X爲2// m之石英玻璃。在該石英玻璃,未存在微裂痕。將此石英 玻璃加工,做爲以輸出1 kw被導入C F4/〇2氣體的電 漿裝置之微波導入窗材。將矽晶片載置在該電漿裝置內, 使之發生電漿,進行矽晶片的蝕刻處理,雖然處理 5 0 〇 〇張的矽晶片,可是並未能確認粒子之異常增加。 〔比較例1〕 經濟部智慧財產局員工消費合作社印製 除了在實施例1使用的化學性處理液,將在D I N之 氣泡等級爲2的天然石英玻璃浸漬以外,以與實施例1相 同之方法進行化學性處理,製成窗材,與實施例1同樣地 進行矽晶片的蝕刻處理,結果在2 0 0 0張;處理被確認 發生異常之粒子。 〔比較例2〕 將根據D I N的氣泡等級爲2之天然石英玻璃的表面 ,以# 1 8 0之S i C粒子噴砂。在所得的石英玻璃之表 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -10- 1228107 δ7 Α7 Β7 五、發明説明(8 ) 面,存在有如照片2的微裂痕10 ’ 000〜 100,0 0 0個/cm3。使用此石英玻璃製作石英玻璃 窗材,與實施例1同樣地進行矽晶片之蝕刻處理,結果從 一開始就發生粒子,而無法進行飩刻處理。 〔實施例2〕 將四氯化矽以氣相加水分解’得到氫分子濃度爲1 5 XI 016分子/cm3,在D IN的氣泡等級爲〇之合成石 英玻璃。接著,用此石英玻璃製成電漿裝置之窗材’浸漬 在5 0 %砂氟化氫水溶液約2 4質量% ’氟化銨約1 7質 量%,1 0 0 %之醋酸水溶液約3 5質量%及水約2 4質 量%的化學性處理液,使之析出矽氟化銨的微結晶,得到 表面粗糙度Ra爲0 · 5//m,Rma X爲2#m之石英 玻璃製窗材。將前述化學性處理的石英玻璃,以5 %之氟 酸蝕刻2小時的照片示如圖1。在前述石英玻璃係如圖1 所示,未存在微裂痕。將所得矽窗材做爲以輸出1 kw被 導入C F 4 /〇2氣體的電漿裝置之微波導入窗材,進行矽 晶片之蝕刻處理。雖然處理1 0 0 0 0張的矽晶片,可是 未能確認粒子的異常增加。 〔比較例3〕 在實施例2除了用氫分子濃度爲3 XI 0 16分子/c m 3的合成石英玻璃以外,與實施例2同樣地製成石英玻璃 製窗材,進行矽晶片之蝕刻處理,結果在5 0 0 0張的矽 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 丨_ ··1 (請先閲讀背面之注意事項再填寫本頁) « m· mjft In* —an ml n.^— In m ml i. 經濟部智慧財產局員工消費合作社印製 -11- 1228107 A7 B7 五、發明説明(9 ) 晶片之處理,被確認粒子的異常增加。 〔實施例3〕 將與實施例2同樣地將四氯化矽以氣相加水分解得到 的合成石英玻璃,以1 〇 〇 〇 t進行均質化處理,得到雙 折射量爲2 0 nm/cm之合成石英玻璃。對該石英玻璃 進行氫塗佈漆處理。接著進行與實施例同樣的化學性處理 ’得到表面粗糙度Ra爲〇 . 5 //m,Rma X爲2 //m 之合成石英玻璃。以此合成石英玻璃製成窗材,以 1 1 0 0 °C加熱2 0小時後徐冷。所得到的石英玻璃製窗 材之虛擬溫度爲1 1 0 〇°C。在使用該石英玻璃製窗材的 ,以輸出1 kw被導入C F4/〇2之氣體的電漿裝置內, 進行矽晶片之蝕刻處理。雖然處理7 0 0 0張之矽晶片, 可是未能確認粒子之增加。 〔比較例4〕 在實施例3,關於未設定均質化及虛擬溫度的石英玻 璃,測定其雙折射量及虛擬溫度,結果雙折射量爲1 2 0 nm/cm,虛擬溫度爲1 3 0 0°C。使用該石英玻璃製 成石英玻璃製窗材,與實施例2同樣地裝備在以輸出1 kw被導入C F4/〇2的氣體之電漿裝置,進行矽晶片的 蝕刻處理。將1 0 0 0張之矽晶片處理,被確認粒子之異 常增加。 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 0Φ — (請先閱讀背面之注意事項再填寫本頁) 訂'· 經濟部智慧財產笱員工消費合作社印製 -12- 1228107 A7 ___B7__一 五、發明説明(1〇) 〔發明之效果〕 本發明之石英玻璃夾具,係表面粗糙度R a爲5 〜〇 · 05//m,氣泡的含量爲根據D IN之泡等級爲〇 或1 ,且表面的微裂痕之個數爲5 0 0個/cm2以下,做 爲電漿將發生的裝置用之夾具使用,也不會使之發生蝕刻 與粒子,能夠良好地製造半導體元件。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -13-
Claims (1)
1228107 公 口 A8 B8 C8 D8 六、申請專利範圍 第90121039號專利申請案 附件2. 中文申請專利範圍修正本 民國91年11月13曰修正 1 . 一種耐電漿性石英玻璃夾具,係使用在發生電漿 的裝置之石英玻璃夾具,其特徵爲:該石英玻璃表面的表 .面粗糙度R a爲5 // m〜〇 . 0 5 // m ’玻璃中的氣泡之 含有量是以根據D I N的泡等級爲0或1 ’且表面之微裂 痕 '的個數爲5 0 〇個/ c m2以下。 2 .如申請專利範圍第1項之耐電漿性石英玻璃夾具 ,其中,石英玻璃之氫分子濃度爲5x 1 〇16分子/ cm2 以上。 3 .如申請專利範圍第1或2項之耐電漿性石英玻璃 夾具,其中,石英玻璃之雙折射量爲7 Ο n m / c m以下 ,虛擬溫度被設定爲8 Ο 〇〜1 2 Ο 0 °C之範圍。 4 .如申請專利範圍第1項之耐電漿性石英玻璃夾具 ,其中,2 0 〇 n m的紫外線之內部透過率爲8 0 %以上 ,且表現透過率爲3 0%〜8 5%。 5 _如申請專利範圍第1 、2、4項中任一項的耐電 漿性石英玻璃夾具,其中,前述石英玻璃爲將矽化合物在 氣相加水分解而獲得之合成石英玻璃。 本紙張尺度適用中國國家標準(CNS ) A4規格(2ΐ〇χ297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂
經濟部智慧財產局員工消費合作社印製
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JP2000259645A JP2002068766A (ja) | 2000-08-29 | 2000-08-29 | 耐プラズマ性石英ガラス治具 |
JP2000259641A JP4453944B2 (ja) | 2000-08-29 | 2000-08-29 | 耐プラズマ性石英ガラス治具 |
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EP (1) | EP1187170B1 (zh) |
KR (1) | KR100449144B1 (zh) |
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EP1566628B1 (en) * | 2002-08-28 | 2007-10-17 | FUJIFILM Corporation | Measuring apparatus |
US7645526B2 (en) * | 2003-09-16 | 2010-01-12 | Shin-Etsu Quartz Products, Ltd. | Member for plasma etching device and method for manufacture thereof |
FR2863817A1 (fr) * | 2003-12-12 | 2005-06-17 | Air Liquide | Tuyere a deflecteur pour torche a l'arc plasma |
WO2007088904A1 (ja) * | 2006-01-31 | 2007-08-09 | Tokyo Electron Limited | マイクロ波プラズマ処理装置 |
US8771532B2 (en) * | 2009-03-31 | 2014-07-08 | Corning Incorporated | Glass having anti-glare surface and method of making |
US20120056101A1 (en) * | 2010-09-03 | 2012-03-08 | Semiconductor Energy Laboratory Co., Ltd. | Ion doping apparatus and ion doping method |
TWI794150B (zh) | 2015-12-18 | 2023-03-01 | 德商何瑞斯廓格拉斯公司 | 自二氧化矽顆粒製備石英玻璃體 |
CN109153593A (zh) | 2015-12-18 | 2019-01-04 | 贺利氏石英玻璃有限两合公司 | 合成石英玻璃粉粒的制备 |
CN108698887B (zh) | 2015-12-18 | 2022-01-21 | 贺利氏石英玻璃有限两合公司 | 由均质石英玻璃制得的玻璃纤维和预成形品 |
TWI812586B (zh) | 2015-12-18 | 2023-08-21 | 德商何瑞斯廓格拉斯公司 | 石英玻璃體、其製備方法與應用、及用於控制烘箱出口處之露點 |
CN108698883A (zh) | 2015-12-18 | 2018-10-23 | 贺利氏石英玻璃有限两合公司 | 石英玻璃制备中的二氧化硅的喷雾造粒 |
KR20180095616A (ko) | 2015-12-18 | 2018-08-27 | 헤래우스 크바르츠글라스 게엠베하 & 컴파니 케이지 | 용융 가열로에서 이슬점 조절을 이용한 실리카 유리체의 제조 |
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US11952303B2 (en) | 2015-12-18 | 2024-04-09 | Heraeus Quarzglas Gmbh & Co. Kg | Increase in silicon content in the preparation of quartz glass |
EP3390290B1 (de) | 2015-12-18 | 2023-03-15 | Heraeus Quarzglas GmbH & Co. KG | Herstellung eines opaken quarzglaskörpers |
TW201731782A (zh) | 2015-12-18 | 2017-09-16 | 何瑞斯廓格拉斯公司 | 在多腔式爐中製備石英玻璃體 |
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JP3473715B2 (ja) * | 1994-09-30 | 2003-12-08 | 信越半導体株式会社 | 石英ガラス製ウェーハボート |
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- 2001-08-17 EP EP01119913A patent/EP1187170B1/en not_active Expired - Lifetime
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US20020046992A1 (en) | 2002-04-25 |
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