TW548730B - Substrate treatment apparatus and substrate treatment method using the same - Google Patents
Substrate treatment apparatus and substrate treatment method using the same Download PDFInfo
- Publication number
- TW548730B TW548730B TW090131707A TW90131707A TW548730B TW 548730 B TW548730 B TW 548730B TW 090131707 A TW090131707 A TW 090131707A TW 90131707 A TW90131707 A TW 90131707A TW 548730 B TW548730 B TW 548730B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- suction
- liquid
- opening
- processed
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
- G03D5/00—Liquid processing apparatus in which no immersion is effected; Washing apparatus in which no immersion is effected
- G03D5/003—Liquid processing apparatus in which no immersion is effected; Washing apparatus in which no immersion is effected film surface only souching the liquid
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000388357 | 2000-12-21 | ||
JP2001304016A JP4189141B2 (ja) | 2000-12-21 | 2001-09-28 | 基板処理装置及びこれを用いた基板処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW548730B true TW548730B (en) | 2003-08-21 |
Family
ID=26606248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090131707A TW548730B (en) | 2000-12-21 | 2001-12-20 | Substrate treatment apparatus and substrate treatment method using the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US6550990B2 (ja) |
JP (1) | JP4189141B2 (ja) |
KR (1) | KR100492431B1 (ja) |
CN (1) | CN1199242C (ja) |
TW (1) | TW548730B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7918940B2 (en) | 2005-02-07 | 2011-04-05 | Semes Co., Ltd. | Apparatus for processing substrate |
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TWI228755B (en) * | 2000-02-17 | 2005-03-01 | Toshiba Corp | Chemical liquid processing apparatus and the method thereof |
JP3957983B2 (ja) * | 2001-03-01 | 2007-08-15 | 大日本スクリーン製造株式会社 | 基板現像装置 |
JP2003283103A (ja) * | 2002-03-22 | 2003-10-03 | Seiko Epson Corp | パターン形成方法および装置並びにデバイスの製造方法およびデバイス |
KR20030083779A (ko) * | 2002-04-22 | 2003-11-01 | 주식회사 디엠에스 | 액정표시소자용 처리장치 및 처리방법 |
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US7370659B2 (en) * | 2003-08-06 | 2008-05-13 | Micron Technology, Inc. | Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines |
KR20060113684A (ko) * | 2003-10-31 | 2006-11-02 | 가부시키가이샤 에바라 세이사꾸쇼 | 처리액코팅장치 및 처리액코팅방법 |
JP4445315B2 (ja) * | 2004-04-13 | 2010-04-07 | 株式会社東芝 | 基板処理方法 |
US7354869B2 (en) | 2004-04-13 | 2008-04-08 | Kabushiki Kaisha Toshiba | Substrate processing method, substrate processing apparatus, and semiconductor device manufacturing method |
US20050247673A1 (en) * | 2004-05-07 | 2005-11-10 | International Business Machines Corporation | Confinement of fluids on surfaces |
US7616383B2 (en) | 2004-05-18 | 2009-11-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4343050B2 (ja) | 2004-07-15 | 2009-10-14 | 東京エレクトロン株式会社 | 現像処理装置及びその方法 |
JP4271095B2 (ja) * | 2004-07-15 | 2009-06-03 | 東京エレクトロン株式会社 | 基板加熱装置及び基板加熱方法 |
JP4488867B2 (ja) * | 2004-11-05 | 2010-06-23 | 株式会社東芝 | パターン形成方法 |
JP5000124B2 (ja) * | 2004-11-12 | 2012-08-15 | 三星電子株式会社 | 表示装置及びその駆動方法 |
JP4523402B2 (ja) * | 2004-12-28 | 2010-08-11 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
JP4834310B2 (ja) | 2005-01-31 | 2011-12-14 | 株式会社東芝 | パターン形成方法、フォトマスクの製造方法、半導体装置の製造方法およびプログラム |
TW200643517A (en) * | 2005-06-14 | 2006-12-16 | Quanta Display Inc | Photoresist coating method and apparatus |
US7583358B2 (en) * | 2005-07-25 | 2009-09-01 | Micron Technology, Inc. | Systems and methods for retrieving residual liquid during immersion lens photolithography |
US7456928B2 (en) * | 2005-08-29 | 2008-11-25 | Micron Technology, Inc. | Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography |
US7503977B1 (en) * | 2005-09-27 | 2009-03-17 | Lam Research Corporation | Solidifying layer for wafer cleaning |
US8472004B2 (en) * | 2006-01-18 | 2013-06-25 | Micron Technology, Inc. | Immersion photolithography scanner |
JP4810411B2 (ja) * | 2006-11-30 | 2011-11-09 | 東京応化工業株式会社 | 処理装置 |
US7884028B2 (en) * | 2007-04-10 | 2011-02-08 | United Microelectronics Corp. | Method of removing material layer and remnant metal |
JP4910899B2 (ja) * | 2007-06-14 | 2012-04-04 | 東ソー株式会社 | 加工ヘッドおよびこの加工ヘッドを用いた加工方法 |
JP4905263B2 (ja) * | 2007-06-14 | 2012-03-28 | 東ソー株式会社 | 表面加工方法及び表面加工装置 |
US8051863B2 (en) * | 2007-10-18 | 2011-11-08 | Lam Research Corporation | Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus |
KR100895321B1 (ko) * | 2007-11-06 | 2009-05-07 | 세메스 주식회사 | 노즐 시스템 및 이를 포함하는 기판 처리 장치 |
JP2009295840A (ja) * | 2008-06-06 | 2009-12-17 | Toshiba Corp | 基板処理方法及びマスク製造方法 |
JP5175696B2 (ja) | 2008-11-25 | 2013-04-03 | 株式会社東芝 | 現像方法、及びフォトマスクの製造方法 |
JP4700117B2 (ja) * | 2009-02-25 | 2011-06-15 | 東京エレクトロン株式会社 | 現像処理方法 |
US7849554B2 (en) | 2009-04-28 | 2010-12-14 | Lam Research Corporation | Apparatus and system for cleaning substrate |
US9347987B2 (en) * | 2009-11-06 | 2016-05-24 | Intel Corporation | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same |
KR101150022B1 (ko) * | 2010-09-09 | 2012-05-31 | 삼성테크윈 주식회사 | 에칭장치 |
JP5580779B2 (ja) * | 2011-05-10 | 2014-08-27 | 東京エレクトロン株式会社 | 現像処理装置、現像処理方法、プログラム及びコンピュータ記憶媒体 |
EP2528089B1 (en) * | 2011-05-23 | 2014-03-05 | Alchimer | Method for forming a vertical electrical connection in a layered semiconductor structure |
KR102131118B1 (ko) * | 2013-07-04 | 2020-07-08 | 삼성디스플레이 주식회사 | 반도체 패턴 형성용 마스크, 이를 포함하는 반도체 패턴 형성장치, 이를 이용한 반도체 소자의 제조방법 |
JP2015038926A (ja) * | 2013-08-19 | 2015-02-26 | 凸版印刷株式会社 | 基板の薬液処理装置及びこれを用いた基板の薬液処理方法 |
JP6268954B2 (ja) * | 2013-11-12 | 2018-01-31 | 大日本印刷株式会社 | 洗浄方法、洗浄装置及び洗浄装置用プログラム |
US11220737B2 (en) | 2014-06-25 | 2022-01-11 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
EP2960059B1 (en) | 2014-06-25 | 2018-10-24 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
US11267012B2 (en) * | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
JP6215787B2 (ja) * | 2014-07-25 | 2017-10-18 | 東京エレクトロン株式会社 | 現像方法、現像装置、及びコンピュータ読み取り可能な記録媒体 |
JP6316144B2 (ja) * | 2014-09-02 | 2018-04-25 | 株式会社Screenホールディングス | 現像液吐出ノズルおよび現像処理装置 |
KR20180019191A (ko) * | 2015-07-28 | 2018-02-23 | 가부시키가이샤 토아 덴시 | 금속 도체의 에칭에 이용하는 약액 갱신용 노즐 및 에칭 장치 |
KR102600376B1 (ko) * | 2015-08-21 | 2023-11-08 | 텔 에피온 인크 | 하이브리드 보정 프로세싱 시스템 및 방법 |
KR102420015B1 (ko) * | 2015-08-28 | 2022-07-12 | 삼성전자주식회사 | Cs-ald 장치의 샤워헤드 |
US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0736195A (ja) | 1993-07-22 | 1995-02-07 | Dainippon Screen Mfg Co Ltd | 基板現像装置 |
JP3116297B2 (ja) | 1994-08-03 | 2000-12-11 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
JP3318641B2 (ja) * | 1995-07-20 | 2002-08-26 | ソニー株式会社 | 半導体回路製造用現像装置及びその使用方法 |
TW359854B (en) * | 1996-06-21 | 1999-06-01 | Tokyo Electron Ltd | Processing apparatus and processing method |
JP2874659B2 (ja) * | 1996-07-30 | 1999-03-24 | 日本電気株式会社 | 基板表面処理装置 |
JP3278714B2 (ja) * | 1996-08-30 | 2002-04-30 | 東京エレクトロン株式会社 | 塗布膜形成装置 |
JPH1092784A (ja) | 1996-09-10 | 1998-04-10 | Toshiba Microelectron Corp | ウェーハ処理装置およびウェーハ処理方法 |
JP3245813B2 (ja) | 1996-11-27 | 2002-01-15 | 東京エレクトロン株式会社 | 塗布膜形成装置 |
KR100283442B1 (ko) * | 1996-12-26 | 2001-04-02 | 이시다 아키라 | 현상장치및현상방법 |
JP3612196B2 (ja) * | 1997-04-28 | 2005-01-19 | 大日本スクリーン製造株式会社 | 現像装置、現像方法および基板処理装置 |
JP3614283B2 (ja) * | 1997-09-08 | 2005-01-26 | 株式会社荏原製作所 | めっき装置 |
JP3722337B2 (ja) | 1998-05-28 | 2005-11-30 | 忠弘 大見 | ウエット処理装置 |
US6092937A (en) * | 1999-01-08 | 2000-07-25 | Fastar, Ltd. | Linear developer |
US6382849B1 (en) * | 1999-06-09 | 2002-05-07 | Tokyo Electron Limited | Developing method and developing apparatus |
-
2001
- 2001-09-28 JP JP2001304016A patent/JP4189141B2/ja not_active Expired - Lifetime
- 2001-12-20 US US10/022,637 patent/US6550990B2/en not_active Expired - Lifetime
- 2001-12-20 KR KR10-2001-0081489A patent/KR100492431B1/ko active IP Right Grant
- 2001-12-20 TW TW090131707A patent/TW548730B/zh not_active IP Right Cessation
- 2001-12-21 CN CNB01133875XA patent/CN1199242C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7918940B2 (en) | 2005-02-07 | 2011-04-05 | Semes Co., Ltd. | Apparatus for processing substrate |
Also Published As
Publication number | Publication date |
---|---|
KR20020050712A (ko) | 2002-06-27 |
JP4189141B2 (ja) | 2008-12-03 |
US6550990B2 (en) | 2003-04-22 |
JP2002252167A (ja) | 2002-09-06 |
US20020081118A1 (en) | 2002-06-27 |
KR100492431B1 (ko) | 2005-05-31 |
CN1199242C (zh) | 2005-04-27 |
CN1366333A (zh) | 2002-08-28 |
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GD4A | Issue of patent certificate for granted invention patent | ||
MK4A | Expiration of patent term of an invention patent |