TW548730B - Substrate treatment apparatus and substrate treatment method using the same - Google Patents

Substrate treatment apparatus and substrate treatment method using the same Download PDF

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Publication number
TW548730B
TW548730B TW090131707A TW90131707A TW548730B TW 548730 B TW548730 B TW 548730B TW 090131707 A TW090131707 A TW 090131707A TW 90131707 A TW90131707 A TW 90131707A TW 548730 B TW548730 B TW 548730B
Authority
TW
Taiwan
Prior art keywords
substrate
suction
liquid
opening
processed
Prior art date
Application number
TW090131707A
Other languages
English (en)
Chinese (zh)
Inventor
Hideaki Sakurai
Masamitsu Itoh
Shinichi Ito
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW548730B publication Critical patent/TW548730B/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03DAPPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D5/00Liquid processing apparatus in which no immersion is effected; Washing apparatus in which no immersion is effected
    • G03D5/003Liquid processing apparatus in which no immersion is effected; Washing apparatus in which no immersion is effected film surface only souching the liquid

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
TW090131707A 2000-12-21 2001-12-20 Substrate treatment apparatus and substrate treatment method using the same TW548730B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000388357 2000-12-21
JP2001304016A JP4189141B2 (ja) 2000-12-21 2001-09-28 基板処理装置及びこれを用いた基板処理方法

Publications (1)

Publication Number Publication Date
TW548730B true TW548730B (en) 2003-08-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW090131707A TW548730B (en) 2000-12-21 2001-12-20 Substrate treatment apparatus and substrate treatment method using the same

Country Status (5)

Country Link
US (1) US6550990B2 (ja)
JP (1) JP4189141B2 (ja)
KR (1) KR100492431B1 (ja)
CN (1) CN1199242C (ja)
TW (1) TW548730B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7918940B2 (en) 2005-02-07 2011-04-05 Semes Co., Ltd. Apparatus for processing substrate

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EP2960059B1 (en) 2014-06-25 2018-10-24 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US11267012B2 (en) * 2014-06-25 2022-03-08 Universal Display Corporation Spatial control of vapor condensation using convection
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7918940B2 (en) 2005-02-07 2011-04-05 Semes Co., Ltd. Apparatus for processing substrate

Also Published As

Publication number Publication date
KR20020050712A (ko) 2002-06-27
JP4189141B2 (ja) 2008-12-03
US6550990B2 (en) 2003-04-22
JP2002252167A (ja) 2002-09-06
US20020081118A1 (en) 2002-06-27
KR100492431B1 (ko) 2005-05-31
CN1199242C (zh) 2005-04-27
CN1366333A (zh) 2002-08-28

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