TW499827B - Epoxy resin composition, adhesive film and pre-preg thereby, multilayer printed circuit board using same and its producing method - Google Patents
Epoxy resin composition, adhesive film and pre-preg thereby, multilayer printed circuit board using same and its producing method Download PDFInfo
- Publication number
- TW499827B TW499827B TW89121131A TW89121131A TW499827B TW 499827 B TW499827 B TW 499827B TW 89121131 A TW89121131 A TW 89121131A TW 89121131 A TW89121131 A TW 89121131A TW 499827 B TW499827 B TW 499827B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin composition
- patent application
- scope
- laminated
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
- Y10T428/249941—Fiber is on the surface of a polymeric matrix having no embedded portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2971—Impregnation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Epoxy Resins (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29150399 | 1999-10-13 | ||
JP2000302070A JP4423779B2 (ja) | 1999-10-13 | 2000-10-02 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW499827B true TW499827B (en) | 2002-08-21 |
Family
ID=26558567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW89121131A TW499827B (en) | 1999-10-13 | 2000-10-09 | Epoxy resin composition, adhesive film and pre-preg thereby, multilayer printed circuit board using same and its producing method |
Country Status (7)
Country | Link |
---|---|
US (2) | US6403221B1 (fr) |
EP (1) | EP1092739B1 (fr) |
JP (1) | JP4423779B2 (fr) |
KR (1) | KR100663050B1 (fr) |
CN (1) | CN1131883C (fr) |
DE (1) | DE60000958T2 (fr) |
TW (1) | TW499827B (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI458777B (zh) * | 2004-03-29 | 2014-11-01 | Sumitomo Bakelite Co | 樹脂組成物,附有樹脂之金屬箔,附有基材之絕緣片材及多層印刷佈線板 |
TWI696660B (zh) * | 2017-06-08 | 2020-06-21 | 日商松下知識產權經營股份有限公司 | 樹脂組成物、預浸體、覆金屬積層板、印刷配線板及覆金屬積層板之製造方法 |
Families Citing this family (108)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1009206A3 (fr) * | 1998-12-02 | 2003-01-15 | Ajinomoto Co., Inc. | Méthode de laminage à vide d'un film adhésif |
US6447915B1 (en) * | 1999-03-11 | 2002-09-10 | Sumitomo Bakelite Company Limited | Interlaminar insulating adhesive for multilayer printed circuit board |
JP2000294921A (ja) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | プリンス基板及びその製造方法 |
JP4423779B2 (ja) * | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
KR100721697B1 (ko) * | 1999-12-13 | 2007-05-28 | 다우 글로벌 테크놀로지스 인크. | 난연성 인 원소 함유 에폭시 수지 조성물 |
JPWO2003009655A1 (ja) * | 2001-07-18 | 2004-11-11 | 味の素株式会社 | 回路基板用フィルム |
JP2003055534A (ja) * | 2001-08-14 | 2003-02-26 | Nippon Oil Corp | 複合材料用樹脂組成物、複合材料用中間材および複合材料 |
EP1457515A4 (fr) * | 2001-08-31 | 2004-11-24 | Sumitomo Bakelite Co | Composition de resine, preimpregne, feuille laminee, et boitier de semi-conducteur |
JP4880841B2 (ja) * | 2001-09-19 | 2012-02-22 | 太陽ホールディングス株式会社 | 粗化面形成用樹脂組成物を用いた多層プリント配線板 |
AU2002355051A1 (en) * | 2001-11-30 | 2003-06-10 | Ajinomoto Co., Inc. | Method of laminating circuit board and method of forming insulation layer, multilayer printed wiring board and production method therefor and adhesion film for multilayer printed wiring board |
JP3888254B2 (ja) * | 2002-07-29 | 2007-02-28 | 富士電機ホールディングス株式会社 | 多層プリント配線板 |
TW200415197A (en) * | 2002-10-03 | 2004-08-16 | Nippon Kayaku Kk | Epoxy resin composition for optical semiconductor package |
KR20040042315A (ko) * | 2002-11-14 | 2004-05-20 | 삼성전기주식회사 | 절연층의 두께 편차가 감소된 절연필름, 그 제조방법 및이를 이용한 다층 인쇄회로기판 |
FR2848016B1 (fr) * | 2002-11-29 | 2005-01-28 | Nexans | Cable ignifuge |
JP4503239B2 (ja) * | 2003-05-07 | 2010-07-14 | 京セラケミカル株式会社 | 難燃性接着剤組成物、フレキシブル銅張積層板、カバーレイおよび接着フィルム |
TWI335347B (en) * | 2003-05-27 | 2011-01-01 | Ajinomoto Kk | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
JP4725704B2 (ja) * | 2003-05-27 | 2011-07-13 | 味の素株式会社 | 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ |
TW200516126A (en) * | 2003-06-23 | 2005-05-16 | Toray Industries | Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition |
TWI262041B (en) * | 2003-11-14 | 2006-09-11 | Hitachi Chemical Co Ltd | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
US20050186434A1 (en) * | 2004-01-28 | 2005-08-25 | Ajinomoto Co., Inc. | Thermosetting resin composition, adhesive film and multilayer printed wiring board using same |
TW200602427A (en) * | 2004-03-30 | 2006-01-16 | Taiyo Ink Mfg Co Ltd | Thermosetting resin composition and multilayered printed wiring board comprising the same |
JP5055683B2 (ja) * | 2004-03-30 | 2012-10-24 | 住友ベークライト株式会社 | 絶縁シート、基材付き絶縁シート、及び多層プリント配線板 |
KR100970194B1 (ko) | 2004-06-02 | 2010-07-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 제조방법 |
US8288773B2 (en) * | 2004-08-23 | 2012-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Wireless chip and manufacturing method thereof |
JP4654647B2 (ja) * | 2004-09-30 | 2011-03-23 | 味の素株式会社 | 回路基板用金属付きポリアミドイミドフィルム及びその製造方法 |
JP4697226B2 (ja) * | 2005-03-23 | 2011-06-08 | 株式会社村田製作所 | 複合誘電体シートおよびその製造方法ならびに積層型電子部品 |
EP1647576A1 (fr) * | 2005-04-01 | 2006-04-19 | Huntsman Advanced Materials (Switzerland) GmbH | Composition comprenant une résine epoxyde et de benzoxazine |
JPWO2007034679A1 (ja) * | 2005-09-22 | 2009-03-19 | 東邦テナックス株式会社 | 放射線硬化用樹脂組成物及びプリプレグ |
EP1930359A1 (fr) * | 2005-09-29 | 2008-06-11 | Asahi Kasei Chemicals Corporation | Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy |
TWI410442B (zh) | 2005-11-29 | 2013-10-01 | Ajinomoto Kk | A resin composition for an insulating layer of a multilayer printed circuit board |
JP2009518208A (ja) * | 2005-12-06 | 2009-05-07 | イソラ−ユーエスエイ・コーポレーシヨン | 高速および高周波の印刷回路基板用積層板 |
JP5148292B2 (ja) * | 2006-02-03 | 2013-02-20 | 旭化成イーマテリアルズ株式会社 | マイクロカプセル型エポキシ樹脂用硬化剤、マスタ−バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品 |
US7658988B2 (en) * | 2006-04-03 | 2010-02-09 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from filled epoxy compositions |
KR101386373B1 (ko) * | 2006-10-06 | 2014-04-16 | 스미토모 베이클리트 컴퍼니 리미티드 | 수지 조성물, 기재부착 절연 시트, 프리프레그, 다층 프린트 배선판 및 반도체 장치 |
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EP2001047A1 (fr) * | 2007-06-07 | 2008-12-10 | Semiconductor Energy Laboratory Co, Ltd. | Dispositif semi-conducteur |
CN101104727B (zh) * | 2007-06-12 | 2010-04-14 | 广东生益科技股份有限公司 | 一种无卤素树脂组合物及其高密度互连用涂树脂铜箔 |
JP2009007424A (ja) * | 2007-06-27 | 2009-01-15 | Shin Etsu Chem Co Ltd | 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム |
CN101346037B (zh) * | 2007-07-11 | 2010-06-02 | 巨擘科技股份有限公司 | 多层基板及其制造方法 |
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2000
- 2000-10-02 JP JP2000302070A patent/JP4423779B2/ja not_active Expired - Lifetime
- 2000-10-09 TW TW89121131A patent/TW499827B/zh not_active IP Right Cessation
- 2000-10-11 US US09/684,671 patent/US6403221B1/en not_active Expired - Lifetime
- 2000-10-12 CN CN00130490A patent/CN1131883C/zh not_active Expired - Lifetime
- 2000-10-12 KR KR1020000060085A patent/KR100663050B1/ko active IP Right Grant
- 2000-10-12 DE DE2000600958 patent/DE60000958T2/de not_active Expired - Lifetime
- 2000-10-12 EP EP20000308974 patent/EP1092739B1/fr not_active Expired - Lifetime
-
2002
- 2002-06-10 US US10/164,403 patent/US6805958B2/en not_active Expired - Lifetime
Cited By (2)
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TWI458777B (zh) * | 2004-03-29 | 2014-11-01 | Sumitomo Bakelite Co | 樹脂組成物,附有樹脂之金屬箔,附有基材之絕緣片材及多層印刷佈線板 |
TWI696660B (zh) * | 2017-06-08 | 2020-06-21 | 日商松下知識產權經營股份有限公司 | 樹脂組成物、預浸體、覆金屬積層板、印刷配線板及覆金屬積層板之製造方法 |
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US20020187353A1 (en) | 2002-12-12 |
JP4423779B2 (ja) | 2010-03-03 |
DE60000958D1 (de) | 2003-01-23 |
EP1092739A1 (fr) | 2001-04-18 |
CN1131883C (zh) | 2003-12-24 |
DE60000958T2 (de) | 2003-10-09 |
KR20010050996A (ko) | 2001-06-25 |
US6805958B2 (en) | 2004-10-19 |
EP1092739B1 (fr) | 2002-12-11 |
JP2001181375A (ja) | 2001-07-03 |
US6403221B1 (en) | 2002-06-11 |
KR100663050B1 (ko) | 2007-01-02 |
CN1293218A (zh) | 2001-05-02 |
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