TW492132B - Semiconductor manufacturing apparatus with an improved wafer cassette - Google Patents

Semiconductor manufacturing apparatus with an improved wafer cassette Download PDF

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Publication number
TW492132B
TW492132B TW090103681A TW90103681A TW492132B TW 492132 B TW492132 B TW 492132B TW 090103681 A TW090103681 A TW 090103681A TW 90103681 A TW90103681 A TW 90103681A TW 492132 B TW492132 B TW 492132B
Authority
TW
Taiwan
Prior art keywords
wafer
wafer tray
tray
patent application
adjacent
Prior art date
Application number
TW090103681A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Kyouno
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW492132B publication Critical patent/TW492132B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW090103681A 2000-02-16 2001-02-16 Semiconductor manufacturing apparatus with an improved wafer cassette TW492132B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000037739A JP2001230312A (ja) 2000-02-16 2000-02-16 半導体製造装置

Publications (1)

Publication Number Publication Date
TW492132B true TW492132B (en) 2002-06-21

Family

ID=18561586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090103681A TW492132B (en) 2000-02-16 2001-02-16 Semiconductor manufacturing apparatus with an improved wafer cassette

Country Status (5)

Country Link
US (1) US20020018703A1 (ja)
JP (1) JP2001230312A (ja)
KR (1) KR20010082688A (ja)
GB (1) GB2365623A (ja)
TW (1) TW492132B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101930939A (zh) * 2010-04-23 2010-12-29 日月光半导体制造股份有限公司 半导体封装体匣盒
CN114284191A (zh) * 2022-03-02 2022-04-05 华芯半导体研究院(北京)有限公司 片盒及其承载装置和取放装置、半导体处理设备

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101229132B1 (ko) * 2003-07-11 2013-02-01 테크-셈 아크티엔게젤샤프트 전자부품들을 제조하는 동안 판형상의 기질들을 저장하고 전달하기 위한 장치
KR100908180B1 (ko) * 2003-08-05 2009-07-16 주식회사 티이에스 스프링을 이용한 웨이퍼 피치 조절장치
KR100555620B1 (ko) * 2003-10-28 2006-03-03 주식회사 디엠에스 기판 운반시스템 및 운반방법
FR2896912B1 (fr) * 2005-12-09 2008-11-28 Alcatel Sa Enceinte etanche pour le transport et le stockage de substrats semi-conducteurs
WO2008144670A1 (en) * 2007-05-18 2008-11-27 Brooks Automation, Inc. Load lock fast pump vent
US10541157B2 (en) 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
KR100888708B1 (ko) * 2007-08-21 2009-03-16 내일시스템주식회사 디바이스 트레이 핸들링용 카세트
KR100891536B1 (ko) 2007-10-24 2009-04-06 주식회사 하이닉스반도체 캐리어 기판 분리 모듈 및 이를 갖는 스트립 기판 공급장치
DE102010052689A1 (de) * 2010-11-26 2012-05-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Substrathalter für die Oberflächenbehandlung von Substraten und Verwendung des Substrathalters
US10153187B2 (en) * 2014-11-11 2018-12-11 Applied Materials, Inc. Methods and apparatus for transferring a substrate
JP7321095B2 (ja) * 2017-10-11 2023-08-04 ローツェ株式会社 ポッドオープナー
CN110211909B (zh) * 2019-07-05 2023-08-18 常州时创能源股份有限公司 一种可承载硅片的硅片花篮
JP7213774B2 (ja) * 2019-08-06 2023-01-27 三菱電機株式会社 ウエハ収容容器
CN112349639B (zh) * 2020-10-27 2024-06-21 北京北方华创微电子装备有限公司 晶圆转载装置及半导体工艺设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2889657B2 (ja) * 1990-05-28 1999-05-10 東京エレクトロン株式会社 板状体搬送装置
JP3234617B2 (ja) * 1991-12-16 2001-12-04 東京エレクトロン株式会社 熱処理装置用基板支持具
JPH05235147A (ja) * 1992-02-24 1993-09-10 Dainippon Screen Mfg Co Ltd 基板移載装置
JPH06183512A (ja) * 1992-12-15 1994-07-05 M C Electron Kk ピッチ変換装置
JPH09260463A (ja) * 1996-03-19 1997-10-03 Fujitsu Ltd 板体配列ピッチ変換装置
JPH09306980A (ja) * 1996-05-17 1997-11-28 Asahi Glass Co Ltd 縦型ウエハボート
EP1091391A1 (de) * 1999-10-05 2001-04-11 SICO Produktions- und Handelsges.m.b.H. Haltevorrichtung für Halbleiterscheiben

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101930939A (zh) * 2010-04-23 2010-12-29 日月光半导体制造股份有限公司 半导体封装体匣盒
CN114284191A (zh) * 2022-03-02 2022-04-05 华芯半导体研究院(北京)有限公司 片盒及其承载装置和取放装置、半导体处理设备

Also Published As

Publication number Publication date
GB2365623A (en) 2002-02-20
US20020018703A1 (en) 2002-02-14
GB0103869D0 (en) 2001-04-04
KR20010082688A (ko) 2001-08-30
JP2001230312A (ja) 2001-08-24

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