TW492132B - Semiconductor manufacturing apparatus with an improved wafer cassette - Google Patents
Semiconductor manufacturing apparatus with an improved wafer cassette Download PDFInfo
- Publication number
- TW492132B TW492132B TW090103681A TW90103681A TW492132B TW 492132 B TW492132 B TW 492132B TW 090103681 A TW090103681 A TW 090103681A TW 90103681 A TW90103681 A TW 90103681A TW 492132 B TW492132 B TW 492132B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- wafer tray
- tray
- patent application
- adjacent
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000037739A JP2001230312A (ja) | 2000-02-16 | 2000-02-16 | 半導体製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW492132B true TW492132B (en) | 2002-06-21 |
Family
ID=18561586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090103681A TW492132B (en) | 2000-02-16 | 2001-02-16 | Semiconductor manufacturing apparatus with an improved wafer cassette |
Country Status (5)
Country | Link |
---|---|
US (1) | US20020018703A1 (ja) |
JP (1) | JP2001230312A (ja) |
KR (1) | KR20010082688A (ja) |
GB (1) | GB2365623A (ja) |
TW (1) | TW492132B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101930939A (zh) * | 2010-04-23 | 2010-12-29 | 日月光半导体制造股份有限公司 | 半导体封装体匣盒 |
CN114284191A (zh) * | 2022-03-02 | 2022-04-05 | 华芯半导体研究院(北京)有限公司 | 片盒及其承载装置和取放装置、半导体处理设备 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101229132B1 (ko) * | 2003-07-11 | 2013-02-01 | 테크-셈 아크티엔게젤샤프트 | 전자부품들을 제조하는 동안 판형상의 기질들을 저장하고 전달하기 위한 장치 |
KR100908180B1 (ko) * | 2003-08-05 | 2009-07-16 | 주식회사 티이에스 | 스프링을 이용한 웨이퍼 피치 조절장치 |
KR100555620B1 (ko) * | 2003-10-28 | 2006-03-03 | 주식회사 디엠에스 | 기판 운반시스템 및 운반방법 |
FR2896912B1 (fr) * | 2005-12-09 | 2008-11-28 | Alcatel Sa | Enceinte etanche pour le transport et le stockage de substrats semi-conducteurs |
WO2008144670A1 (en) * | 2007-05-18 | 2008-11-27 | Brooks Automation, Inc. | Load lock fast pump vent |
US10541157B2 (en) | 2007-05-18 | 2020-01-21 | Brooks Automation, Inc. | Load lock fast pump vent |
KR100888708B1 (ko) * | 2007-08-21 | 2009-03-16 | 내일시스템주식회사 | 디바이스 트레이 핸들링용 카세트 |
KR100891536B1 (ko) | 2007-10-24 | 2009-04-06 | 주식회사 하이닉스반도체 | 캐리어 기판 분리 모듈 및 이를 갖는 스트립 기판 공급장치 |
DE102010052689A1 (de) * | 2010-11-26 | 2012-05-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Substrathalter für die Oberflächenbehandlung von Substraten und Verwendung des Substrathalters |
US10153187B2 (en) * | 2014-11-11 | 2018-12-11 | Applied Materials, Inc. | Methods and apparatus for transferring a substrate |
JP7321095B2 (ja) * | 2017-10-11 | 2023-08-04 | ローツェ株式会社 | ポッドオープナー |
CN110211909B (zh) * | 2019-07-05 | 2023-08-18 | 常州时创能源股份有限公司 | 一种可承载硅片的硅片花篮 |
JP7213774B2 (ja) * | 2019-08-06 | 2023-01-27 | 三菱電機株式会社 | ウエハ収容容器 |
CN112349639B (zh) * | 2020-10-27 | 2024-06-21 | 北京北方华创微电子装备有限公司 | 晶圆转载装置及半导体工艺设备 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2889657B2 (ja) * | 1990-05-28 | 1999-05-10 | 東京エレクトロン株式会社 | 板状体搬送装置 |
JP3234617B2 (ja) * | 1991-12-16 | 2001-12-04 | 東京エレクトロン株式会社 | 熱処理装置用基板支持具 |
JPH05235147A (ja) * | 1992-02-24 | 1993-09-10 | Dainippon Screen Mfg Co Ltd | 基板移載装置 |
JPH06183512A (ja) * | 1992-12-15 | 1994-07-05 | M C Electron Kk | ピッチ変換装置 |
JPH09260463A (ja) * | 1996-03-19 | 1997-10-03 | Fujitsu Ltd | 板体配列ピッチ変換装置 |
JPH09306980A (ja) * | 1996-05-17 | 1997-11-28 | Asahi Glass Co Ltd | 縦型ウエハボート |
EP1091391A1 (de) * | 1999-10-05 | 2001-04-11 | SICO Produktions- und Handelsges.m.b.H. | Haltevorrichtung für Halbleiterscheiben |
-
2000
- 2000-02-16 JP JP2000037739A patent/JP2001230312A/ja active Pending
-
2001
- 2001-02-16 KR KR1020010007661A patent/KR20010082688A/ko not_active Application Discontinuation
- 2001-02-16 US US09/785,848 patent/US20020018703A1/en not_active Abandoned
- 2001-02-16 GB GB0103869A patent/GB2365623A/en not_active Withdrawn
- 2001-02-16 TW TW090103681A patent/TW492132B/zh active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101930939A (zh) * | 2010-04-23 | 2010-12-29 | 日月光半导体制造股份有限公司 | 半导体封装体匣盒 |
CN114284191A (zh) * | 2022-03-02 | 2022-04-05 | 华芯半导体研究院(北京)有限公司 | 片盒及其承载装置和取放装置、半导体处理设备 |
Also Published As
Publication number | Publication date |
---|---|
GB2365623A (en) | 2002-02-20 |
US20020018703A1 (en) | 2002-02-14 |
GB0103869D0 (en) | 2001-04-04 |
KR20010082688A (ko) | 2001-08-30 |
JP2001230312A (ja) | 2001-08-24 |
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Legal Events
Date | Code | Title | Description |
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GD4A | Issue of patent certificate for granted invention patent |