US20120037348A1 - Heat sink structure - Google Patents

Heat sink structure Download PDF

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Publication number
US20120037348A1
US20120037348A1 US12/856,193 US85619310A US2012037348A1 US 20120037348 A1 US20120037348 A1 US 20120037348A1 US 85619310 A US85619310 A US 85619310A US 2012037348 A1 US2012037348 A1 US 2012037348A1
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United States
Prior art keywords
heat dissipating
heat
sink structure
fins
dissipating fins
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US12/856,193
Inventor
Su Hua CHU
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Individual
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Individual
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Publication date
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Priority to US12/856,193 priority Critical patent/US20120037348A1/en
Publication of US20120037348A1 publication Critical patent/US20120037348A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink structure and, more particularly, to a heat sink structure with enhanced heat dissipation effect.
  • An electronic product typically has a heat source in the form of a central processing unit, a chip, and so on. If the heat generated by the heat source during operation of the electronic product is not effectively dissipated, the electronic product may overheat and be damaged as a result.
  • Conventional heat dissipation devices include fans, heat dissipating fins, heat pipes, and combinations thereof.
  • the heat dissipation structure 9 includes a plurality of heat dissipating fins 91 which are arranged in a stack, spaced apart from one another, and penetrated by a plurality of heat pipes 92 .
  • the heat dissipating fins 91 and the heat pipes 92 provide heat dissipation from a heat source.
  • the aforesaid heat dissipation structure 9 is applicable only to heat sources which generate relatively low heat.
  • the heat dissipation effect of such a structure on a heat source of very high heat is insufficient and needs improvement.
  • the present invention provides a heat sink structure which includes a plurality of heat dissipating fins and a plurality of heat dissipating elements.
  • the heat dissipating fins are arranged in a stack and spaced apart from one another by a distance, wherein at least one of the heat dissipating fins is coated with a heat dissipating material.
  • the heat dissipating elements pass through the heat dissipating fins.
  • the heat dissipation effect of the heat sink structure is enhanced.
  • the heat dissipating elements are heat pipes, and the heat dissipating material is a thermal compound or other coating materials capable of heat dissipation.
  • each heat dissipating fin has a serrated edge to increase the area for heat dissipation.
  • FIG. 1 is a perspective view of a conventional heat dissipation structure
  • FIG. 2 is a perspective view of a preferred embodiment of the present invention.
  • FIG. 2 shows a heat sink structure according to a preferred embodiment of the present invention.
  • a heat sink structure 1 includes a plurality of heat dissipating fins 2 and a plurality of heat dissipating elements 3 .
  • the heat dissipating fins 2 in the drawing are stacked together and spaced apart from one another by a distance.
  • each of the heat dissipating fins 2 is coated with a heat dissipating material 21 .
  • the heat dissipating material 21 may be coated on only one of the heat dissipating fins 2 or on certain ones of the heat dissipating fins 2 as needed.
  • the heat dissipating elements 3 in FIG. 2 pass through the heat dissipating fins 2 and are each coated with the heat dissipating material 21 .
  • the heat dissipating material 21 may be coated on only one of the heat dissipating elements 3 or on certain ones of the heat dissipating elements 3 as desired.
  • the heat dissipating elements 3 are heat pipes or the like and can be made of various materials such as ceramic. In addition to heat conduction, the heat dissipating elements 3 serve the purpose of supporting the heat dissipating fins 2 .
  • the heat dissipating material 21 in the present embodiment is a thermal compound.
  • the heat dissipating material 21 may also be other coating materials capable of heat dissipation, i.e., materials which have good thermal conductivity and, once applied, increase not only the area for heat dissipation but also heat transfer efficiency so as to produce the desired heat dissipation and cooling effect.
  • each heat dissipating fin 2 in the present embodiment has a serrated edge 22 in order to increase the area for heat dissipation.
  • the present embodiment further includes a plurality of heat dissipating fins 4 .
  • the heat dissipating fins 4 are arranged in a stack, spaced apart from one another by a distance, and each coated with another heat dissipating material 41 . Meanwhile, the heat dissipating elements 3 pass through the heat dissipating fins 4 as well as the heat dissipating fins 2 to form a modular heat dissipation structure.
  • the heat dissipating elements 3 passing through the heat dissipating fins 4 are each coated with the heat dissipating material 41 .
  • the heat dissipating material 41 may be coated on only one of the heat dissipating elements 3 or on certain ones of the heat dissipating elements 3 according to practical needs.
  • the portions of the heat dissipating elements 3 that pass through the heat dissipating fins 2 are coated with the heat dissipating material 21 while the portions of the heat dissipating elements 3 that pass through the heat dissipating fins 4 are coated with the heat dissipating material 41 .
  • the heat dissipating material 41 is also a thermal compound.
  • the heat dissipating material 41 may be other coating materials capable of heat dissipation, i.e., materials which have good thermal conductivity and, once applied, increase not only the area for heat dissipation but also heat transfer efficiency so as to produce the desired heat dissipation and cooling effect.
  • each heat dissipating fin 4 has a serrated edge 42 for increasing the area for heat dissipation.
  • the heat dissipating material 21 coated on each (or at least one) of the heat dissipating fins 2 and the heat dissipating material 41 coated on each (or at least one) of the heat dissipating fins 4 enhance heat dissipation.

Abstract

A heat sink structure includes a plurality of heat dissipating fins and a plurality of heat dissipating elements. The heat dissipating fins are arranged in a stack and spaced apart from one another by a distance, wherein at least one of the heat dissipating fins is coated with a heat dissipating material. The heat dissipating elements pass through the heat dissipating fins. By coating at least one of the heat dissipating fins with the heat dissipating material, the heat dissipation effect of the heat sink structure is enhanced.

Description

    BACKGROUND OF THE INVENTION
  • 1. Technical Field
  • The present invention relates to a heat sink structure and, more particularly, to a heat sink structure with enhanced heat dissipation effect.
  • 2. Description of Related Art
  • An electronic product typically has a heat source in the form of a central processing unit, a chip, and so on. If the heat generated by the heat source during operation of the electronic product is not effectively dissipated, the electronic product may overheat and be damaged as a result.
  • Conventional heat dissipation devices include fans, heat dissipating fins, heat pipes, and combinations thereof.
  • Referring to FIG. 1 for a perspective view of a conventional heat dissipation structure 9, the heat dissipation structure 9 includes a plurality of heat dissipating fins 91 which are arranged in a stack, spaced apart from one another, and penetrated by a plurality of heat pipes 92. The heat dissipating fins 91 and the heat pipes 92 provide heat dissipation from a heat source.
  • However, the aforesaid heat dissipation structure 9 is applicable only to heat sources which generate relatively low heat. The heat dissipation effect of such a structure on a heat source of very high heat is insufficient and needs improvement.
    • BRIEF SUMMARY OF THE INVENTION
  • The present invention provides a heat sink structure which includes a plurality of heat dissipating fins and a plurality of heat dissipating elements.
  • The heat dissipating fins are arranged in a stack and spaced apart from one another by a distance, wherein at least one of the heat dissipating fins is coated with a heat dissipating material. The heat dissipating elements pass through the heat dissipating fins.
  • By coating at least one of the heat dissipating fins with the heat dissipating material, the heat dissipation effect of the heat sink structure is enhanced.
  • Preferably, the heat dissipating elements are heat pipes, and the heat dissipating material is a thermal compound or other coating materials capable of heat dissipation.
  • Preferably, each heat dissipating fin has a serrated edge to increase the area for heat dissipation.
    • BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
  • A detailed description of further features and advantages of the present invention is given below with reference to the accompanying drawings, in which:
  • FIG. 1 is a perspective view of a conventional heat dissipation structure; and
  • FIG. 2 is a perspective view of a preferred embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 2 shows a heat sink structure according to a preferred embodiment of the present invention.
  • As shown in FIG. 2, a heat sink structure 1 includes a plurality of heat dissipating fins 2 and a plurality of heat dissipating elements 3.
  • The heat dissipating fins 2 in the drawing are stacked together and spaced apart from one another by a distance. In addition, each of the heat dissipating fins 2 is coated with a heat dissipating material 21. However, it is understood that the heat dissipating material 21 may be coated on only one of the heat dissipating fins 2 or on certain ones of the heat dissipating fins 2 as needed.
  • The heat dissipating elements 3 in FIG. 2 pass through the heat dissipating fins 2 and are each coated with the heat dissipating material 21. However, it is understood that the heat dissipating material 21 may be coated on only one of the heat dissipating elements 3 or on certain ones of the heat dissipating elements 3 as desired.
  • In the present embodiment, the heat dissipating elements 3 are heat pipes or the like and can be made of various materials such as ceramic. In addition to heat conduction, the heat dissipating elements 3 serve the purpose of supporting the heat dissipating fins 2.
  • The heat dissipating material 21 in the present embodiment is a thermal compound. However, it is understood that the heat dissipating material 21 may also be other coating materials capable of heat dissipation, i.e., materials which have good thermal conductivity and, once applied, increase not only the area for heat dissipation but also heat transfer efficiency so as to produce the desired heat dissipation and cooling effect.
  • Besides, each heat dissipating fin 2 in the present embodiment has a serrated edge 22 in order to increase the area for heat dissipation.
  • As shown in FIG. 2, the present embodiment further includes a plurality of heat dissipating fins 4. Like the heat dissipating fins 3, the heat dissipating fins 4 are arranged in a stack, spaced apart from one another by a distance, and each coated with another heat dissipating material 41. Meanwhile, the heat dissipating elements 3 pass through the heat dissipating fins 4 as well as the heat dissipating fins 2 to form a modular heat dissipation structure.
  • Also, it is feasible to coat only one of the heat dissipating fins 4 or certain ones of the heat dissipating fins 4 with the heat dissipating material 41 as needed.
  • In addition, the heat dissipating elements 3 passing through the heat dissipating fins 4 are each coated with the heat dissipating material 41. However, it is understood that the heat dissipating material 41 may be coated on only one of the heat dissipating elements 3 or on certain ones of the heat dissipating elements 3 according to practical needs. In other words, the portions of the heat dissipating elements 3 that pass through the heat dissipating fins 2 are coated with the heat dissipating material 21 while the portions of the heat dissipating elements 3 that pass through the heat dissipating fins 4 are coated with the heat dissipating material 41.
  • In the present embodiment, the heat dissipating material 41 is also a thermal compound. However, it is understood that the heat dissipating material 41 may be other coating materials capable of heat dissipation, i.e., materials which have good thermal conductivity and, once applied, increase not only the area for heat dissipation but also heat transfer efficiency so as to produce the desired heat dissipation and cooling effect.
  • Besides, each heat dissipating fin 4 has a serrated edge 42 for increasing the area for heat dissipation.
  • When the heat sink structure 1 is used to dissipate heat from a heat source (not shown), the heat dissipating material 21 coated on each (or at least one) of the heat dissipating fins 2 and the heat dissipating material 41 coated on each (or at least one) of the heat dissipating fins 4 enhance heat dissipation.

Claims (8)

What is claimed is:
1. A heat sink structure, comprising:
a plurality of heat dissipating fins arranged in a stack and spaced apart from one another by a distance, wherein at least one of the heat dissipating fins is coated with a heat dissipating material; and
a plurality of heat dissipating elements passing through the heat dissipating fins.
2. The heat sink structure of claim 1, wherein the heat dissipating elements are heat pipes.
3. The heat sink structure of claim 1, wherein at least one of the heat dissipating elements is coated with the heat dissipating material.
4. The heat sink structure of claim 1, wherein the heat dissipating material is a thermal compound.
5. The heat sink structure of claim 1, wherein each said heat dissipating fin has a serrated edge.
6. The heat sink structure of claim 1, further comprising a plurality of second heat dissipating fins arranged in a stack and spaced apart from one another by a distance, wherein at least one of the second heat dissipating fins is coated with a second heat dissipating material, and wherein the heat dissipating elements pass through the second heat dissipating fins as well as the heat dissipating fins.
7. The heat sink structure of claim 6, wherein the second heat dissipating material is a thermal compound.
8. The heat sink structure of claim 6, wherein each said second heat dissipating fin has a serrated edge.
US12/856,193 2010-08-13 2010-08-13 Heat sink structure Abandoned US20120037348A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/856,193 US20120037348A1 (en) 2010-08-13 2010-08-13 Heat sink structure

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Application Number Priority Date Filing Date Title
US12/856,193 US20120037348A1 (en) 2010-08-13 2010-08-13 Heat sink structure

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US6483707B1 (en) * 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US20040035561A1 (en) * 2002-08-23 2004-02-26 Cheol-Soo Ko Heat exchanger
US20040035554A1 (en) * 2000-01-14 2004-02-26 Matsushita Electric Industrial Co., Ltd. Heatsink, method of manufacturing the same and cooling apparatus using the same
US20050099774A1 (en) * 2003-11-06 2005-05-12 Kyu Sop Song Semiconductor chip cooling module with fin-fan-fin configuration
US20060060330A1 (en) * 2002-05-15 2006-03-23 Siu Wing M Vapor augmented heatsink with multi-wick structure
US7215544B2 (en) * 2004-04-30 2007-05-08 Lg Electronics Inc. Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article
US20070107883A1 (en) * 2005-11-15 2007-05-17 Chen Shyh M Colored and textured heat dissipating device
US7443679B2 (en) * 2006-12-15 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device having a fin also functioning as a fan holder
US7633756B2 (en) * 2007-12-19 2009-12-15 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with fan holder

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040035554A1 (en) * 2000-01-14 2004-02-26 Matsushita Electric Industrial Co., Ltd. Heatsink, method of manufacturing the same and cooling apparatus using the same
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US6483707B1 (en) * 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US20060060330A1 (en) * 2002-05-15 2006-03-23 Siu Wing M Vapor augmented heatsink with multi-wick structure
US20040035561A1 (en) * 2002-08-23 2004-02-26 Cheol-Soo Ko Heat exchanger
US20050099774A1 (en) * 2003-11-06 2005-05-12 Kyu Sop Song Semiconductor chip cooling module with fin-fan-fin configuration
US7215544B2 (en) * 2004-04-30 2007-05-08 Lg Electronics Inc. Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article
US20070107883A1 (en) * 2005-11-15 2007-05-17 Chen Shyh M Colored and textured heat dissipating device
US7443679B2 (en) * 2006-12-15 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device having a fin also functioning as a fan holder
US7633756B2 (en) * 2007-12-19 2009-12-15 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with fan holder

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