TWM254653U - Novel tilted heat sink structure of composite type - Google Patents

Novel tilted heat sink structure of composite type Download PDF

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Publication number
TWM254653U
TWM254653U TW93204650U TW93204650U TWM254653U TW M254653 U TWM254653 U TW M254653U TW 93204650 U TW93204650 U TW 93204650U TW 93204650 U TW93204650 U TW 93204650U TW M254653 U TWM254653 U TW M254653U
Authority
TW
Taiwan
Prior art keywords
heat
base
fins
slope
scope
Prior art date
Application number
TW93204650U
Other languages
Chinese (zh)
Inventor
Yung-Bin Guo
Original Assignee
Chia Cherne Industry Co Ltd
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Filing date
Publication date
Application filed by Chia Cherne Industry Co Ltd filed Critical Chia Cherne Industry Co Ltd
Priority to TW93204650U priority Critical patent/TWM254653U/en
Priority to GB0412614A priority patent/GB2412499A/en
Priority to DE200420009233 priority patent/DE202004009233U1/en
Publication of TWM254653U publication Critical patent/TWM254653U/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink comprises a base 20, e.g. of copper, with inclined sides on which are mounted a heat-dissipating section 10, e.g. of aluminium, with fins 11 formed by skiving. The heat sink may be used in conjunction with a fan 30. In an alternative embodiment (Fig 7A) the base may be omitted.

Description

M254653 3、創作說明（1) 【新型所屬之技術領域] 結構」 力之導 可從熱 斜度之 使提供 具產業 本創作係關於一種「複合式具斜度散熱器新賴 ，係提供一預形具斜度之散熱鰭片及底座，並施以 設與鰭片底座接觸對應可具有一超高傳導或熱導能 熱基座，同設於該導熱基座組設於熱源上，使熱^ 源端藉由導熱基座迅速傳遞至另一端，再傳至具呈 散熱鰭片末端，可據以快速吹拂並提升散熱效能， 一可多樣式形狀且散熱效果極佳之散熱片結構，念 利用性與經濟組設之功效者。 汽 【先前技術】M254653 3. Creation instructions (1) [Technical field to which the new type belongs] Structure "The guide of the force can provide the industry from the heat slope. This creation is about a" composite type radiator with slope, "which provides a preliminary An inclined heat dissipation fin and base are provided, and the device can have an ultra-high conduction or thermal conduction heat base corresponding to the contact with the fin base, and the heat conduction base is arranged on a heat source to make heat ^ The source end is quickly transferred to the other end through the thermal conductive base, and then to the end of the fin with heat dissipation, which can quickly blow and improve the heat dissipation performance. A heat sink structure with multiple shapes and excellent heat dissipation effects. Exploitability and economic organization. Steam [Previous Technology]

按，現代化科技產品應用非常普遍，尤豆 訊及通信等產業應用更為廣泛，由於科技產品中2腦、 精密電子元件，因此其運作穩定性 /、有許 散ί 效果尤其重要者。 非吊重要特別是 目前常見可安裝於各種電子元件上具 之散，”、裝置，其係於座體突伸有散埶 1 ‘、、、欵果 龙設有風扇裝置，以將散熱片之熱量以上方 效。 义攻熱之功 所欲解決之技術問題） 内容】 ⑷古々制^作者發現，前述之散熱器其多係採鋁擠型或创 制=^衣成或採散熱鰭片與座體採分別製作後再作黏1者 ” 鋁擠型散熱片其製成之散熱片間隙有一定距離，According to the press, the application of modern technology products is very common, and the industries such as Youdou Telecom and Communication are more widely used. Due to the high-precision electronic components in technology products, their stable operation and effective effects are particularly important. The non-hanging is particularly important, and it can be installed on various electronic components. The device is attached to the base body and has a fan 1 '. The fan unit is equipped with a fan device to connect the heat sink. The effect is based on the heat. The technical problem to be solved by the right to attack the heat) Content] The ancient foundry system ^ The author found that the aforementioned radiators are mostly aluminum extruded or created = ^ clothing into or using cooling fins and The base body is made separately and then glued one. "The aluminum extruded heat sink has a certain gap between the heat sinks.

M254653 g、創作說明（2) 無法縮小，因 面積無法有效 達間隙小且排 刨削型散熱片 各設以特殊形 如第八圖，為 號「減少風扇 型製作並藉散 错以減少風扇 座外側斜度變 計亦有所限制 此相對其排 提升，而另 列數多更密 除需搭配風 狀搭配者， 本申請人申 壓降之雙側 熱基座呈一 所產生壓降 化除會影響 者，其加工 列之散 採刨削 集之優 扇裝置 才能發 請已獲 斜散片 内高外者，但 風量吹 成本為 熱片數亦 方式製成 點’然而 ，且該散 揮特殊作 得專利新 基座結構 受限，造成散熱 之散熱片其雖可 上述之鋁擠型或 熱效率提升仍需 用者。而其中， 型第091200384 」，其採一體成 低呈斜度狀散熱鰭片體， 其採一體成型加工其因基 拂效率且其鰭片體形狀設 較高者。 (解決問題之技術手段） 本創作有鑑於此，乃憑恃著長期對於散熱器結構之研 究及融會貫通之構思，而創作出一種複合式具斜度刨削式 散熱器新穎結構，其主要係利用除以一刨削方式製成上方 突伸排列有數散熱鰭片其下延伸基座外侧並設成斜度底座 者，另設一導熱基座其一端係設與鰭片底座設成對應接設 組合狀，而設使另端沿可設於熱源上，藉由該導熱基座良 好之導熱特性，可將熱量從熱源端迅速傳遞至另一端，再 傳至散熱片末端，並藉鰭片底座為一呈向外傾斜者，可使 風扇壓降不致降低，或使風量可有採非垂直狀之進風夾角 ’防止與基座反彈風量阻礙進風散熱，故具有效提升散熱 欵能，由於本創作之散熱片本身良好散熱功能，其可搭配M254653 g, creation instructions (2) can not be reduced, because the area can not effectively reach the gap is small and the planing type heat sinks are each set with a special shape like the eighth figure, named "reducing fan type production and borrowing errors to reduce fan seats There is also a limitation on the outside slope change meter, which is relatively higher than its row, and the other rows are more dense. In addition to those that need to be matched with the wind, the applicant's application of pressure drop on the two-sided thermal base shows a pressure drop. For those who will influence, the superior fan device of the scattered mining planing set can only send those who have obtained the high and low of the oblique scattered sheet, but the cost of air volume is also made in the way of the number of hot sheets. However, the scattered The special patented new base has a limited structure, which causes the heat sink to be used even though it can be extruded with aluminum as described above or the thermal efficiency can be improved. Among them, the model No. 091200384 ", which is integrated into a low-inclined heat dissipation The fin body is formed by one-piece processing, and its fin body efficiency is higher, and its fin body shape is set higher. (Technical means to solve the problem) In view of this, this creation is based on the long-term research and integration of the radiator structure, and created a novel structure with a sloped planing type radiator. A planing method is used to make a plurality of heat sinking fins protruding above the bottom, extending the outside of the base and setting it as an inclined base, and setting up a heat conductive base whose one end is connected to the fin base in a corresponding combination. The other edge can be set on the heat source. With the good thermal conductivity of the heat conduction base, heat can be quickly transferred from the heat source end to the other end, and then to the end of the heat sink, and the fin base is used as a Those that are inclined outward can prevent the pressure drop of the fan from being reduced, or the air volume can adopt a non-vertical air intake angle 'to prevent the air volume bounced from the base to hinder the air intake and heat dissipation, so it can effectively improve the heat dissipation performance. The heat sink itself has good heat dissipation function, which can be used with

第6頁 、創作說明（3) 於本身上方設 於奉身上万說一風屬裝置，或係可藉由*** 置’使空氣對級’可據以提升散熱效能，辟由身之風屬裝 組合’可提供一具多樣式形狀且具極佳散熱功此之機構 成快速之散熱片結構，確具實用性與創新功效^ ’同時製 (對照先前技術之功效） 茲由以上說明得知’ 如下之若千功^ · 1 、令鰭片座與導熱 以預設形狀成裂’並呈斜 基座分別製作可有效^制 形速度並矸搭配異質高導 散熱速率及易於加工特性 2、 提升散熱效能： 熱片新穎結構設计’ 5亥熱 熱量迅速由熱源端傳遞至 提升整體散熱效能4 ° 3、 複合組合使散熱 複合式切削散熱片其導熱 陽花散設狀，其形狀可同 片排列，使散熱面積擴大 者。 4、 生產加工容易且 ，其係可將金肩紹材或鋼 本創作相較先前技術， 基座可採複合式組合： 度分佈者，其因具斜度 風扇之最佳進風斜度之 熱之導熱基座，可同時 者。 由於本創作可摺彎組合 4體係形成類似熱管結 另一端並由散熱片散發 吹拂面積可加大：由於 5座係可呈不同形狀鰭 日了具有較小之間隙與較 ’可據以提升風量對流 :速·由於本創作之切 利用現有加工機具， 確可達 鰭片係3 採與導ή 胃&及4 有效提$Page 6, Creative Instructions (3) It is set on the body above the body, and it can be used as a wind device, or it can be installed by the system to make the air level, which can improve the cooling performance, and the wind is installed on the body. The combination 'can provide a multi-style shape with excellent heat dissipation function. This machine constitutes a fast heat sink structure, which is indeed practical and innovative. ^' Simultaneous (compared to the effect of the previous technology) is informed by the above description ' As follows: 1. Make the fin base and heat conduction crack in a predetermined shape and make it with a slanted base. The formation speed can be effectively formed, combined with a heterogeneous high-conductivity heat dissipation rate and easy processing characteristics. 2. Improve Cooling efficiency: The new structure design of the heat sink '5H heat is quickly transferred from the heat source end to improve the overall heat dissipation efficiency 4 ° 3. The composite combination enables the heat dissipation of the composite cutting heat sink, which has a thermally conductive male heat dissipation shape, and its shape can be the same Arranged so that the heat dissipation area is enlarged. 4. It is easy to produce and process. Compared with the previous technology, it can be made of gold shoulder or steel. Compared with the previous technology, the base can adopt a composite combination. For the degree distribution, it is because of the best air inlet slope of the fan. Thermally conductive bases can be both. As this creation can bend the 4 system to form a similar heat pipe junction at the other end, and the blown area can be increased by the heat sink: Because the 5 seat system can have different shapes of fins, it has a smaller gap and can increase air volume Convection: Speed · Because of the use of existing processing equipment in this creation, it can indeed reach the fin series 3 Mining and Guide Price Stomach & 4 Effectively $

到 本創作採 片體如太 多之散熱 散熱功致 削散熱片 除以刨削 M254653 四、創作說明（4) 方式迅速一體加工成形該預設片數之鰭片者，另再使導熱 基座可以採與鰭片異質具高傳導銅材質者，而其配合導熱 介質接合兩者複合，其並設呈斜度，當受風壓斜度可更傾 斜配合導熱基座高度者。 5、其散熱片形狀較多 風扇或於散熱器片以外加風 改變加上與熱導基座採一側 及傳導者。 樣化，本創作可分別配合系統 扇設置者，其可藉該鰭片形狀 上結合可得一較佳散熱分佈 【實施方式】 請參閱第 式具斜度散熱 散熱鰭片1 1 要改良在於： 一圖及一 A〜 器新賴結構A 之底座1 〇與 B圖所示，係 其構成主要包 導熱基座2 0 為本創作複合 括一突伸有數 所組成，其主In this creative work, if there are too many heat-dissipating and heat-dissipating heat-cutting fins divided by planing M254653 4. Creation instructions (4) Method to quickly and integrally process the fins with the preset number, and then make the heat conductive base It can be made of a material with high conductivity copper that is heterogeneous with fins, and it is combined with a thermally conductive medium to combine the two. It is set to be inclined. When the wind pressure is inclined, it can be more inclined to match the height of the thermal conductive base. 5. The shape of the heat sink is more. The fan or the wind is added outside the heat sink. Change the side with the heat conduction base and the conductor. For the prototype, this creation can be individually matched with the system fan setter, which can be combined with the shape of the fins to obtain a better heat dissipation distribution. [Embodiment] Please refer to the first type of heat dissipation fins with inclined heat dissipation 1 1 To be improved: A picture and a picture of the base A of the structure A and the structure A and B of the structure A are shown in the figure, which is mainly composed of a thermally conductive base 20, which is composed of a number of protrusions for the creative composition.

至少設一Set at least one

Skivind α制\ U你刊用包丨J削技術（或稱剷削' b k 1 v 1 n g )以製成禎翁古 11 ，A蔣捋说姑 问山度平行排列之金屬散熱鰭片 丄丄，再將散熱鰭片1 Ί M n η 1 s - a, ^ λ, L伸之一體式底座1 0外側端1 〇 1呈向外傾斜狀者，使該散埶絲片]i形成由結 内向外傾斜散設狀，甘 又…·、、、曰片1丄办成由.、、、曰片由Skivind α system \ U package technology 丨 J cutting technology (also known as shovel 'bk 1 v 1 ng) to make 祯 Wengu11, A Jiang said that I would ask about the parallel metal fins arranged in the mountains 丄 丄Then, the heat dissipation fins 1 Ί M n η 1 s-a, ^ λ, L are extended to one of the body bases 10 and the outer end 1 〇1 is inclined outward, so that the scattered fins are formed inward from the knot. Outside inclined scattered, Gan and ......

兩外側端沿21同呈二，並又使一導熱基座體2〇同 熱基座2 0呈對U夕门卜傾斜者，使該縛片底座1 0與導 合 ^ 耵應復合固設結合者； 設與；；：;牛：m請參閱第二圖所示’並使該散熱器 A ’其可於本創作源^1相接，以構成一散熱器結構 月文熱為結構Α上方可設有一風扇裝置The two outer ends are parallel to each other along 21, and a thermally conductive base body 20 and the thermal base 20 are inclined to U Ximenbu, so that the baffle base 10 and the guide ^ should be combined and fixed. Combined; design and ::; cattle: m Please refer to the second picture 'Make this radiator A' which can be connected to this creative source ^ 1 to form a radiator structure. Moonlight heat is the structure A. There can be a fan device above

M254653 拂， 加空 分佈 接設 熱的 導為 時， ，但 能 的溫 般熱源 作結 異質 座呈 一複 採為 由散 其可 度差 3、創作說明（5) 3 0或以糸統風扇直接吹 熱鰭片1 1間隙中，以立曾 之目的者，而按 線所示者）’即該與熱源 遞會呈遞減狀；而按一般 、幅射，固體的傳熱以傳 狀散熱器固體兩端有溫差 熱里正比於溫差及截面積 ’比例常數為導熱係數。 其可由一公式導出可知： △ Q = kA AT At/h k二 Z\Qh/A ΛΤ At △ Q =傳熱的總熱 △ T :散熱器兩側 h :散熱器高（厚） △ t :傳熱時間 藉由上述公式，本創 A圖所示，其係藉由採一 高導熱係數之銅質導熱基 係、數鋼質分別製作後並呈 向外具斜度（或鰭片基座 δ亥導熱基座快速導熱並藉 Μ快速對流散熱者，藉此 工便利者。 俾使風扇產生 氣對流，ii;:量吹入散 C分佈 傳遞愈u其熱傳 主，％ 傳導、對流 ，去經驗顯示 早位時間經散熱器^ 反比於散熱器高度厚 7 散熱器戴面積 構主要解決手段，即如 結合即一設為散熱鋁鳍片 一複式結合或同皆採^傳 式結合’且其皆需具有— 内南外低傾斜者）基度、 熱鰭片上所设風扇或風量 兼顧成本及高傳遞導熱及M254653 Flick, the distribution of the space is set to connect the heat conduction time, but the temperature-like heat source can be used as a heterogeneous base to reproduce the reason for the difference 3, creative instructions (5) 3 0 or traditional fans Directly blow the heat fins in the gap between 1 and 1 for the purpose of Li Zeng, and according to the line) 'that is, the heat transfer with the heat source will decrease; and in general, radiation, solid heat transfer in the form of heat dissipation There is a temperature difference between the solid ends of the device. The thermal constant is proportional to the temperature difference and the cross-sectional area. The proportionality constant is the thermal conductivity. It can be derived from a formula: △ Q = kA AT At / hk two Z \ Qh / A ΔΤ At △ Q = total heat transfer △ T: both sides of the radiator h: height (thickness) of the radiator △ t: transmission The thermal time is calculated by the above formula, as shown in Figure A of this invention. It is made by adopting a high thermal conductivity copper thermal conductive base system and several steels, which are respectively made outwardly inclined (or fin base δ The heat-conducting base conducts heat quickly and uses convection to dissipate heat quickly, so as to facilitate the work. 俾 Make the fan generate air convection, ii ;: The amount of the blown into the C distribution, the more the heat transfer, the conduction, convection, and Experience shows that the time of the radiator at the early position is inversely proportional to the height of the radiator. 7 The main solution of the radiator wear area structure is to use a combination of heat sinking aluminum fins, a double-type combination, or both. All need to have—inner south and outer low tilt) basis, fan or air volume on the thermal fins, taking into account both cost and high transfer heat conduction and

M254653 3、創作說明（6) 而其中， 座2 0係可為 熱基座2 0 ， 具散熱鰭片1 風量不致有壓 者。 又其中， 材或其他熱導 而另其中 作之重點，因 再其中， 二實施例圖， 弧形（扇形狀 具對應形狀與 導熱基座2 0 源4 1上，據 而同理如 第三〜四實施 1 1底座1 0 設後，且設使 上； 故其中如 或散熱器A上 定之定位端沿 再請配合參閱第二〜二A圖所示，該導熱基 熱導性佳之金屬所構成（如銅等），使該導 可將熱量從一端迅速傳遞至另一端，並使該 1之底座1 0内側因設呈一斜度設置使下吹 降產生者，而致減少或降低其吹拂散熱效果 上述之散熱 性佳之材料 該風扇裝置 此不再贅述 請參閱第三 其中該散熱 )散熱鰭片 其散熱鰭片 底面成一平 以提供多樣 上述結構， 例）所示係 與導熱基座 該導熱基座 鰭片1 1與其底座1 0係可為鋁 ，經刨削加工一體成型者。 3 0與相關扣具之組設非為本創 及三A 鰭片1 ，於散 座體接 面以可 外形變 其中又 為可以 2 0分 底端係 圖所示 1亦可 熱片基 設之導 貼抵於 化之散 如第四 複數個 別呈一 呈一平 ，係為 摺彎成 座1 0 熱基座 電子元 熱片結 〜五A 預設形 左右製 面，以 本創 形為 同樣 2 0 件4 構者 圖（ 狀散 作並 搭接 作之第 向外呈 組設有 ，並使 0之熱 〇 分別為 熱鰭片 互相接 於熱源 上述各實施例，其可設使該導熱基座2 0上 可設有一溝槽2 1 0或定位槽或可供扣具固 者0M254653 3. Creation description (6) Among them, the base 20 series can be a thermal base 20, with a cooling fin 1, and the air volume does not cause pressure. In addition, the material or other thermal conductivity is another important point. Because of the two embodiments, the arc shape (the fan shape has a corresponding shape and the heat conduction base 2 0 source 4 1 is the same as the third. ~ Four implementations 1 1 After the base 1 0 is set, and set up; therefore, if the positioning end of the heat sink A or the upper edge of the heat sink A, please refer to the second to second A picture, the metal base with good thermal conductivity Structure (such as copper, etc.), so that the guide can quickly transfer heat from one end to the other, and the inside of the base 1 of the 1 is set to have a slope setting to make the bottom blower drop, thereby reducing or lowering it. Blowing heat dissipation effect The above-mentioned materials with good heat dissipation performance The fan device is not described in detail here, please refer to the third one for the heat dissipation) The heat dissipation fins have a flat bottom surface to provide a variety of the above structures. The heat-conducting base fin 11 and its base 10 can be made of aluminum, and can be integrally formed by planing. The combination of 3 0 and related fasteners is not original and three A fins 1, and the shape of the interface of the loose seat body can be changed. Among them, it can be shown in the figure at the bottom of 20 points. The guide sticks to the scattered form, such as the fourth plural, are individually flat, which are bent to form a base. 10 thermal base electronic element thermal film knot ~ five A preset left and right surface, the same as the original shape 2 0 pieces 4 Constructor diagrams (like scattered and overlapped pieces are arranged outwardly in groups, and the heat of 0 is 0. The heat fins are connected to the heat source each other. In the above embodiments, it can be set to make the heat conductive base A groove 2 1 0 or a positioning groove or a fastener can be provided on the seat 2 0

第10頁 M254653 四、創作說明（7) 故其中， 請參閱附件— 才旲擬不意圖， 別以紅色及綠 ，溫度最高， 為本創作散熱 出本創作散熱 〇 )溫度為最 係數銅質基座 逐遞減至散熱 區域），可藉 一 A為本創作 件一 B為一般 C/W)，可知本 另其中， ，其係可將刨 元件4 〇之敎 /、、、 熱基座2 〇迅 設風扇垂拂及 空氣對流，即 又如第七 以一 I呂質鐽Η ·、、、曰 门 導熱基座2 〇 熱源呈平行狀 由本結構與 戶斤示，其係 不同區域有 色表示，其 最低溫（紫 片結構Α散 片結構其中 向，即可得 其藉原具有 片1 1末端 風扇風量加 經實驗可得 習用結構經 、结構熱阻優 又如第六圖 削式散熱片 源4 1上， 速傳遞至散 主機殼5 0 可迅速將熱 〜八圖所示 與'延伸基座 採一複合對 或採與該鰭 一趣 為散 不同 最高 色） 熱狀 心點 知本 高傳 時， 速對 熱阻 實驗 於習 所示 A組 當其 熱鰭 内本 源產 ，其 散熱器設於熱源上之效果可 熱器置於熱源處之區域溫度 的溫度，最高溫及最低溫分 溫（紅色）處即為近熱源處 係為其他無熱源之構件，即 態之溫度示意圖，可清楚看 處紅色區域（即導熱基座2 散熱器結構可藉一具高導熱 導之導熱功效，其將熱傳遞 該溫度已迅速降低（淺綠色 流可快速散熱者，再由附件 為0.218 Degree C/W ，而附 可知該熱阻為0.267 Degree 用結構。 ’為本創作之應用實施例圖 設於PC主機殼5 0内之電子 熱源41產生的熱量經由導 片1 1 ，並藉由散熱器上所 身系統設置之風扇5 1產生 生熱量快速散熱者。 中第七圖（第五實施例）為 可設為一體，但其與一異質鋼質 應結合者，且鰭片1 1恰設為與 片之具外側端1 〇 1呈斜度之底 %Page 10 M254653 IV. Creation Instructions (7) Therefore, please refer to the attachment-I did n’t intend to do it. Do n’t use red and green, the temperature is the highest. Let this work dissipate heat for this work. 0) The temperature is the most coefficient copper base. The seat is gradually reduced to the heat dissipation area). You can borrow one A as the original and one B as the general C / W). You can see that the other is, which can be used to plan the element 4 〇 / ,, and the thermal base 2 〇 Quickly set up the fan and air convection, that is, as in the seventh, the heat conduction base of the door is a parallel shape. The heat source is parallel, which is shown by the structure and the household weight. It is colored in different areas. Its lowest temperature (purple sheet structure A, scattered sheet structure, which can be obtained by borrowing the original fan 1 1 end fan air flow plus experiments can be used to obtain the conventional structure, the structural thermal resistance is excellent, as shown in the sixth figure cut type heat sink source On the 41st, the speed is transferred to the bulk main case 50. The heat can be quickly transferred as shown in Figure 8 and the 'extended base adopts a composite pair or the fin has a different color than the fun.) During high transmission, the speed versus thermal resistance experiment is shown in Xi Group A. The heat sink is originally produced in the heat fin. The effect of the radiator on the heat source can be the temperature of the area where the heater is placed at the heat source. The highest temperature and the lowest temperature (red) are near the heat source and are other heat sources. The component, that is, the temperature schematic diagram of the state, can clearly see the red area (that is, the heat conduction base 2 heat sink structure can borrow a high thermal conductivity heat conduction effect, which can quickly reduce the heat transfer temperature (light green flow can quickly dissipate heat) In addition, the attachment is 0.218 Degree C / W, and it is known that the thermal resistance is 0.267 Degree. The structure of the application example of this creation is shown in FIG. The guide piece 1 1 and the heat generated by the fan 5 1 installed on the radiator system generate heat quickly and dissipate heat. The seventh picture (the fifth embodiment) in the figure can be set as one body, but it is compatible with a heterogeneous steel. Combined, and the fins 1 1 are just set at the bottom of the slope with the outer end 1 〇1 of the fins%

M254653 四、創作說明（8) 座1 0呈一 外加風扇或 者；同理， 實施例，該 工製成平行 組設結合狀 0同為一者 具或固定元 以一風扇3 錯由以 1其係由刨 有更多排列 複合高傳導 熱源4 1處 製作有效提 能’使整體 綜上所 」，係提供 該底座外側 散熱片底座 可為同質或 底座使熱源 鰭片，其可 以使空氣快 上下平 系統風 如第七 複合散 熱源之 者，即 ;而該 件固定 0模擬 上構件 削方式 之散熱 之導熱 迅速傳 升加工 結構極 述，本 一複合 端係呈 另端便 異質金 熱量經 藉由其 速對流 行或由 扇可從 A圖（ 熱器A 鰭片底 使設於 散熱器 於熱源 於該散 形成’ 製成， 片與間 基座2 遞至散 品質及 真實用 創作之 式可預 一由内 複合設 屬者’ 由南傳 本身所 ，達到 上由下 該散熱 $力實 可採複 座後再 熱源上 A上同 上者（ 熱器A 由於本 不僅成 隙’使 0快速 熱鳍片 成形速 性與創 「複合 設形狀 向外傾 有一導 藉由高 導導熱 設之風 散熱效 具間隙設置接設者，而其 器一側邊進行吹拂或對流 七圖另一 鐘削）加 施例）所示為第 數個以Skiving( 施以組合，即形 之導熱基座與鰭 設有溝槽或定位 圖中未示），而 側邊吹拂示意圖 創作之散熱器A 形快速、樣式多 該散熱面積增加 且良好之傳導， 1 1末端，而且 度及兼具考量最 新功效者。 式具斜度散熱器 之散熱鰭片及底 斜者’且設使異 熱基座，使該導 導熱基座及較大 基座得以迅速傳 扇裝置或透過系 果，以提供一可 成一對應 片基座1 處可供扣 第八圖為 〇 之鰭片1 變，且具 ，其並藉 使熱量從 其採分別 佳散熱效 新穎結構 座，並設 於鰭片端 熱基座係 斜度鳍片 遞至敢熱 統風屬， 快速成形M254653 Fourth, creation instructions (8) Block 10 is an additional fan or; similarly, in the embodiment, the work is made in parallel to form a combination of 0 with the same one or a fixed element with a fan 3 with the wrong cause 1 It is made of more arrayed composite high-conduction heat sources at 4 places to effectively raise the energy to 'make the overall synthesis.' It is provided that the outer heat sink base of the base can be homogeneous or the base makes the heat source fins, which can make the air go up and down quickly. The flat system wind is like the seventh composite heat sink, that is, while the fixed 0 simulates the heat dissipation of the upper component cutting method, and the heat transfer is quickly transferred. By its speed on the popular or by the fan can be made from the A picture (heater A fin bottom so that the heat sink is formed by the heat source from the fan's formation, the film and the base 2 are transferred to the fan's quality and real creative style It can be pre-designed by the internal compounder 'by the Nanchuan itself to reach the top and bottom. The heat dissipation can be recovered, and then the heat source A is the same as the above. Hot fin forming Quickness and innovation "The composite design has a shape that tilts outwards with a high-conductivity heat-conducting wind-radiating effect. The clearance setting device is connected to the device, and one side of the device is blown or convected. Another figure is cut.) ) Shows the number one Skiving heat sink (combined, that is, the shape of the heat-conducting base and the fins are grooved or not shown in the positioning diagram), and the side-blowing schematic diagram of the radiator A-shaped is fast and styled. The heat dissipation area is increased and the conduction is good, 1 1 end, and it has the latest effects. Considering the heat sink fins and the bottom slope of the heat sink with a slope, and a different heat base is set to make the heat conduction base. The base and the larger base can quickly pass the fan device or pass through the fruit to provide a base that can be turned into a corresponding piece. The fin 1 which can be buckled in the eighth figure is changed and provided with heat. It adopts a new structure seat with good heat dissipation, and it is set on the end of the fin. The heat base system is inclined and the fins are transferred to the genre of the thermal system and quickly formed.

第12頁 M254653 四、創作說明（9) 且可多樣式成形之散熱器結構，俾使整體確具產業實用性 與創新效益，且其構成結構又未曾見於書刊或公開使用， 誠符合新型專利申請要件，懇請 鈞局明鑑，早日准予專 利，至為感禱。 需陳明者，以上所述乃是本創作之具體實施立即所運 用之技術原理，若依本創作之構想所作之改變，其所產生 之功能作用仍未超出說明書及圖示所涵蓋之精神時，均應 在本創作之範圍内，合予陳明。Page 12 M254653 IV. Creative Note (9) The radiator structure that can be formed in various styles, so that the overall industry has practicality and innovation benefits, and its structure has never been seen in books or public use, which is in line with the new patent application I urge the Bureau to make a clear reference and grant the patent as soon as possible. For those who need to know, the above are the technical principles that are immediately applied to the specific implementation of this creation. If the changes made according to the concept of this creation have not exceeded the spirit covered by the description and illustrations , Should all be merged with Chen Ming within the scope of this creation.

第13頁 M254653 圖式簡單說明 第一圖：係為本創作之立體組合示意圖。 第一 A--B圖：係為本創作分別製作組合示意圖。 第二圖：係為本創作外加風扇熱源分佈傳遞模擬示意圖。 第二A圖：係本創作模擬風扇吹襲示意圖。 第三〜三A圖：為本創作第二實施例組合及剖面示意圖。 第四〜四A圖：為本創作第三實施例組合及剖面示意圖。 第五〜五A圖：為本創作第四實施例組合及剖面示意圖。 第六圖：係為本創作之應用PC機殼内實施例圖。 第七〜七A圖：係本創作第五及六實施例組合及剖面示意 圖。 第八圖··係本創作第五實施例加風扇模擬示意圖。 附件一：係為本創作散熱片置於熱源處之區域溫度模擬示 意圖。 附件二 :係為本創作結構與一 般散熱器實驗數據。 (圖號說明） A · • · · 散熱器 10· • · 底座 1 0 1· · •底座外側端 11· 參·· 散熱鰭片 2 0· • · · 導熱基座 2 1 0 · · ·溝槽 3 0· • 參· 風扇 4 0· • · · 電子元件 4 1 · · · ·熱源 5 0· • •癱 P C主機殼 5 1 · · · ·系統風扇Page 13 M254653 Schematic description of the first picture: This is a three-dimensional composition diagram of this creation. The first picture A--B: is a schematic diagram of the composition for this creation. The second picture: This is a schematic diagram of the simulation of the distribution and transfer of the heat source of the fan plus the fan. Figure A: This is a schematic diagram of the fan simulation of this creation. Figures 3 ~ 3A: Schematic diagram of the composition and cross section of the second embodiment of this creation. Figures 4 to 4A: Schematic illustrations of the composition and cross section of the third embodiment of this creation. Figures 5 ~ 5A: Schematic diagram of the composition and section of the fourth embodiment of this creation. The sixth figure: the embodiment of the application PC case for this creation. Figures 7 to 7A: Schematic illustrations of the combinations and sections of the fifth and sixth embodiments of the present invention. The eighth figure is a schematic diagram of a fan plus a fifth embodiment of the present invention. Attachment 1: The temperature simulation of the area where the heat sink is placed at the heat source is shown here. Attachment II: This is the structure of the creation and the experimental data of the general radiator. (Illustration of drawing number) A · · · · Radiator 10 · · · · Base 1 0 1 · · · Outer end of the base 11 · Reference · · Radiating fins 2 0 · · · · Heat conducting base 2 1 0 · · · Groove Slot 3 0 · • Reference · Fan 4 0 · · · · Electronic components 4 1 · · · · Heat source 5 0 · • • Paralyzed PC main case 5 1 · · · · System fan

第14頁Page 14

Claims (1)

M254653 五、申請專利範圍 種 要構成 子元件 利用包U 隔排列 底座外 之導熱 後並同 藉 座體得 用使風 一多樣 之散熱2 熱器新 材或銅 成型者3 熱器新 或不同 座形狀 包括一 熱源處 削加工 之一體 側端設 基座與 設於熱 此使# 迅速傳 扇風奠 形狀具* 器結構 、依據 穎結構 質或其 〇 、依據 穎結構 金屬複 或以利 旅合 突伸 ，以 (Sk 式散 成具 該異 源上 熱》原 遞至 吹拂 斜度 ，使 申請 ，其 他南 式f斜度散熱器新穎結構，該散熱器主 有複數散熱片之底座體，將其組設於電 達散熱效果者，其主要特徵在於：其係 1 v 1 ng )將一金屬材加工成具複數呈間 熱鰭片及其延伸底座，並將具散熱鰭片 有由内向外斜度，並再設一與熱源接設 於鰭片端之底座端面呈一複合對應組合 9 之熱量透過與熱源接觸之高傳導特性基 散熱鰭片，並透過較佳鰭片基座斜度效 得以達迅速傳遞散熱之功效者，以提供 可分別製作、散熱能力佳，且成型快速 整體深具創新實用性者。 專利範圍第1項所述之複合式具斜度散 中，該散熱鰭片與其底座係可直接由艇 導熱性佳之材料’並設經刨削加工一體 申請專利範圍第1項所述之複合式具斜度散 ，其中，該導熱基座與鰭片可設為同質金屬 合者，以利於配合散熱鰭片預設形狀或其底 於散熱風扇風量吹拂之錯片基座斜度變化者 4、依據申請專利範園第1或3項所述之複合式具斜 度刨削式散熱器新穎結構，其中，設該散熱鰭片之延伸底M254653 5. Scope of patent application: To form sub-elements, use the package U to arrange the heat conduction outside the base and use it with the base to make the wind diversify. 2 Heater new material or copper molder. 3 Heater new or different. The shape of the seat includes a base that is cut at a heat source and a base at the side of the body. The shape of the structure is based on the structure of the structure, based on the quality of the structure or the metal structure, or based on the structure of the structure. Combined with the extension, the (Sk-type disperse into the heat from the heterogeneous heat source) to the original inclination, so that the application, other southern-type f-inclined radiator novel structure, the radiator mainly has a base body with a plurality of fins, Those who set it up for Dingda's cooling effect are mainly characterized in that it is 1 v 1 ng) a metal material is processed into a plurality of interstitial thermal fins and its extension base, and the cooling fins have an inward direction The external slope, and a base end surface connected to the heat source at the end of the fin is in a composite corresponding combination. The heat is transmitted through the high-conductivity characteristic base heat-dissipating fin in contact with the heat source, and through a better fin base slope effect. Reached Those who quickly transfer the effects of heat dissipation to provide those who can be separately manufactured, have good heat dissipation ability, and have a fast molding process, which is highly innovative and practical as a whole. The composite type with a slope in the first scope of the patent scope, the heat dissipation fin and its base can be directly made of a material with good thermal conductivity of the boat, and the planing process is applied to apply the composite type in the first scope of the patent scope. There is a slope dispersion, wherein the heat conducting base and the fins can be made of a homogeneous metal, which is beneficial to match the preset shape of the heat dissipation fins or the bottom of the wrong piece of the heat dissipation fan. According to the novel structure of the compound-type sloped planing type radiator described in item 1 or 3 of the patent application park, the extended bottom of the heat dissipation fin is provided M254653 五、申請專利範圍 座外側端斜度為呈一内高外低者。 5、依據申請專利範圍第丄或3項所述之複合式具斜 度散熱器新穎結構，其中，該複合之鰭片斑導執座體組合 可設為係以左右兩端分別成型以呈對應組合或以一具雙外 斜之導熱基座並設與一具向外傾斜鰭片對應形狀組合或採 兩結合導熱基座頂端面可設有供扣具固定之溝槽或定位處 或使散熱器固定之定位端沿者。 6、 依據申請專利範圍第1項所述之複合式具斜度散 熱器新穎結構，其中，以複數鰭片與延伸基座可設為一體 成型’但其可設與一異質導熱基座採一複合對應結合者， 且該鰭片可設為與熱源呈平行狀或採與該鰭片之具外侧端 呈斜度之延伸底座呈一上下平行或由上、下具間隙設置接 設者；藉此其外加風扇或系統風扇可從該散熱器一側邊進 行吹拂或對流者。 7、 依據申請專利範圍第6項所述之複合式具斜度散 熱器新穎結構，其中，該複合散熱器可採複數個以 Ski vi ng(鏟削）加工成一具平行於熱源或以上、下設置具 間隙之鰭片及其具斜外側端延伸底座後再施以組合，即形 成一對應組設結合狀者，即使該設於熱源上之導熱基座與 鱗片基座同為一者。 8、 依據申請專利範圍第6項所f之複合式具斜度散 熱器新穎結構，其中，該散熱器上同"又有溝槽或定位處可 供扣具或固定元件固定於熱源上者。、 9、 依據申請專利範圍第1或3或6項所述之複合式M254653 5. Scope of patent application The slope of the outer end of the seat is one that is high inside and low outside. 5. According to the novel structure of the compound radiator with a slope as described in item 丄 or 3 of the scope of the patent application, the composite fin spot guide holder combination can be set to be respectively formed at the left and right ends to correspond. Combined or combined with a double-inclined heat-conducting base and a shape corresponding to an outwardly-inclined fin. Combination or use of two combined heat-conducting bases. The top surface of the heat-conducting base can be provided with a groove or a positioning place for fixing the fastener or can dissipate heat. Fix the positioning edge of the person. 6. According to the novel structure of the compound heat sink with a slope as described in item 1 of the scope of the patent application, in which a plurality of fins and an extension base can be integrated into one shape, but it can be provided with a heterogeneous heat conduction base. Composite corresponding couplers, and the fins can be set to be parallel to the heat source or to be extended from the extended base of the fins with a slope at the outer end of the fins to be parallel to the top or bottom or to be connected by upper and lower gaps; This additional fan or system fan can blow or convect from one side of the heat sink. 7. According to the novel structure of the compound radiator with a slope as described in item 6 of the scope of the patent application, the compound radiator can be processed by Ski vi ng (shovel) into a parallel to the heat source or above, below After the fins with gaps and the bases with the oblique outer end extensions are set and then combined, a corresponding group is formed, even if the heat conducting base and the scale base on the heat source are the same. 8. According to the novel structure of the compound radiator with a slope according to item 6 of the scope of the patent application, the radiator has the same " grooves or positioning places where the fasteners or fixing elements can be fixed on the heat source. . 9 、 According to the compound formula described in item 1 or 3 or 6 of the scope of patent application M254653M254653 第17頁Page 17
TW93204650U 2004-03-26 2004-03-26 Novel tilted heat sink structure of composite type TWM254653U (en)

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TW93204650U TWM254653U (en) 2004-03-26 2004-03-26 Novel tilted heat sink structure of composite type
GB0412614A GB2412499A (en) 2004-03-26 2004-06-07 Heat sink
DE200420009233 DE202004009233U1 (en) 2004-03-26 2004-06-14 Heatsink with sloping surfaces

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TWI578671B (en) * 2014-01-10 2017-04-11 技嘉科技股份有限公司 Heat sink with heat pipe and manufacturing method thereof
TWI635385B (en) * 2012-11-09 2018-09-11 技嘉科技股份有限公司 Heat sink and method of manufacturing thereof

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TWI635385B (en) * 2012-11-09 2018-09-11 技嘉科技股份有限公司 Heat sink and method of manufacturing thereof
TWI578671B (en) * 2014-01-10 2017-04-11 技嘉科技股份有限公司 Heat sink with heat pipe and manufacturing method thereof
TWI556088B (en) * 2014-12-31 2016-11-01 Giga Byte Tech Co Ltd Radiator structure

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