TW442554B - Multi-functional electrically and thermally conductive adhesive tape - Google Patents

Multi-functional electrically and thermally conductive adhesive tape Download PDF

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Publication number
TW442554B
TW442554B TW088108165A TW88108165A TW442554B TW 442554 B TW442554 B TW 442554B TW 088108165 A TW088108165 A TW 088108165A TW 88108165 A TW88108165 A TW 88108165A TW 442554 B TW442554 B TW 442554B
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Taiwan
Prior art keywords
conductive
adhesive layer
substrate
tape
item
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TW088108165A
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Chinese (zh)
Inventor
Chi-Shiang Lin
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Four Pillars Entpr Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28Metal sheet
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/10Presence of inorganic materials
    • C09J2400/16Metal
    • C09J2400/163Metal in the substrate

Abstract

A multi-functional electrically and thermally conductive adhesive tape is described. The adhesive tape at least has the following structures: a complex structure or a single structure having a plurality of protuberant holes or concavities extended from one side of the complex structure or the single structure. Adhesive material is coated on both sides or a single side of the complex structure or the single structure, wherein the adhesive layer is an electrically and thermally conductive layer or an electrically non-conductive layer. The electrically non-conductive adhesive layer, depending on the practical application, can be chosen from any kind of adhesive material. The electrically conductive adhesive layer can be chosen from any kind of adhesive material doped with electrically and thermally conductive dopants.

Description

4370twff/005 A7 4370twff/005 A7 經濟部智慧財產局員工消費合作杜印製 B7 五、發明說明(ί ) 本發明是有關於一種膠帶之結構及其製造方法’ 11特 別是有關於一種具有優異導電或優越導熱性膠帶之結構及 其製造方法。 當電子裝置的尺、i越來越小時’其電路的密度與精密 度的需求也會隨之越來越高,隨之而來的各元件或設備間 彼此受電磁波干擾、靜電破壞、各電器用品間使用相容等 問題與及磁電防護解決的對策A法顯得更加的重耍’本創 意發明之導電導熱膠帶爲·同時具有黏著性與優越之導電 與導熱特性妆兼Μ宵電磁防護功能特性。其中之導電導通 黏著接合性比傳統的連接器係籍使用鎖螺絲、鉚釘或焊接 的方式來連接有更人的方便性與進步性。 傳統的導電或導熱膠帶大多以有機高分子材料摻合導 熱成導道介質並做成單面或雙面具有黏著特性之膠帶,請 參照第1障1,此導電或導熱膠帶10結構上包含有導電或 導熱物質12位於…鋁金屬層11之一側或兩側以連結熱源 與散熱裝置,如散熱風扇。然rfii,此習知技藝產品中之導 電或導熱物質12,其成分結構中之接合黏著材料,典型上 常使用矽利康(silicone)膠等高分子材料,而此類高分子材 料(polymers)常於摻合導熱或導窀介質後其本身材質於結 構特性上爲…具有連續結構相’雖本身Μ有較耐高溫的使 丨特性,似山於其本身物質特性多爲a有低熱傳導係數與 絕緣特性,Yl·:和導電與導熱性粉末介質摻合後其整體在導 電或導熱物性上均遠比純金屬材料來的差很多。 本發明提出.導熱導電滕帶,此膠帶包括卜·列結構: 4 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----^--I I I ! 裝--------訂-------— _ 線 (請先閲讀背面之注意事項再填寫本頁) 五 經濟部智慧財產局員工消費合作社印製 442 5 5 4 437〇t.wff/00 5 A7 B7 發明說明(y) -複合結構或者單…基材結構,具有多數個不規則排列之 突狀結構或凹槽,這些突狀結構或凹槽係突出或凹陷於此 複合結構成單…基材結構之·側。此外,此複合結構或單 一基材結構之·側或者兩側塗怖有黏膠,而爲方便操作使 用,可於有黏膠層之外側貼含一離型紙或離型膜或於單一 基材結構塗佈黏膠層後之另…側塗佈或貼合-離型功能 的離型物,如離型劑成離型膠帶等。結構上形成這些突狀 結構或凹槽的方法,可藉由使用具表面非分佈均勻且具高 硬度之鑽石壓輪、鑽石平台輾壓機、尖突狀輪或其他類似 的輾壓機台輾壓而成,本發明建議使用鑽石壓輪,其鑽石 顆粒尖突結構高度大小、分佈密度與操作製造範圍應用極 廣轧方便,其施工條件端祝最後使用產品物性品質需求而 f—L-t 疋。 此處爭-層桩材結構材料者可以是單·的塑膠膜或單 一的金屬箔暦,时複合結構之組合可以是塑膠層/金屬層、 金屬層/塑膠層/金屬層、金屬層/金屬層/塑膠層、或塑膠層 /金觴屑/塑膠層等,其中之金屬層可以是單一種類金屬、 合金或多暦式金屬複合箔,端視所需物性需求而定,所需 物性例如耐磨、抗氣化、良導熱或良導電性等,材質種類 如銅箔、鋁箔、銅銀合金或鍍銀、鍍錫、鍍錫鉛、鍍鉻、 鍍鎳、鍍金之銅箔等成不同上述金屬箔之組合等,此處可 以就實際導電或導熱特性等條件需求而決定所需使用之材 料組合或闲冇兼有之。此處該金靥層若爲/避免環境中所 導致之氣化现象,則可於易被氣化之金屬層之外側做進-- 5 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ------------- 裝-----訂---------線 (諳先閱讀背面之注意事項再填寫本頁) 442554 4370twif/005 A7 B7 五、發明說明(令) (請先閱讀背面之注意事項再填寫本頁) 步具抗氣化或鈍化表面暦的處理,例如藉電鍍或氣相金屬 蒸鍍上·層ί4右較高氣化電位的抗氧化金屬材料,實例如 鍍錫鉛之銅箔,此處該錫鉛層亦可同時提供高導熱與低電 阻阻抗特性,應ffl氣相金屬蒸鍍屮常使用鋁金屬,另一方 ifu也可使用塗佈_ ·有機材料以隔絕大自然中氧氣的滲透與 氣化反應,例如塗佈環氧樹脂等。 黏膠層叫爲一單純黏膠或者爲導電導熱性黏膠。其 中,-K要黏膠層的材質,則常視實際應用場的需求而定, 可爲任何的膠系,例如爲亞克力膠、矽膠、橡膠、熱融膠、 環氣樹脂等,且其適用之溫度範圍極廣。而此處導電性的 黏膠層之材質組合,黏膠上可爲上述之膠系之任一種,視 導電特性需求「M摻雜Μ有導電性之介質。導電性介質的種 類則可爲粉末導電碳粉、金屬粉、金屬氧化物粉粒、U導 電表面加丨:處理之無機粉末、導電表面加.「:有機粉粒、碳 纖維粉末等、或者是這些導電介質的混合體。另一方面於 導熱膠方_,一般而旨,凡具導電性之導電膠其本身亦具 #極佳之導熱性,但芯不希望有導電特性時,則可以使用 具低比熱之導熱介質替代,如氧化鋁、二氧化鈦粉末等。 本發明之導電導熱膠帶之優點包括: 經濟部智慧財產局員工消費合作社印製 (a) 本導遒膠帶吋於膠帶之·側同時提供黏旖功能與金 _接觸導通特忭,由於該突狀結構爲一任意分佈,II分佈 密度由密十:稀均極易控制與製造’ ϋ非常適用於不规則被 貼物表面,其伏貼密合性極佳。 (b) "J當作電磁 Γ·擾(Electromagnetic Interference; ΕΜ1) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4425 5 4 4370twff/005 A7 B7 五、發明說明(f·) 遮蔽ffl膠帶’其突狀結構具有類似蜂槽狀結構,此提供-垂直電磁波前進/;向的遮蔽作用,且由於金屬連續相的極 低阻抗’而使其本身對電磁防蔽效果遠優於習知的塗佈導 電介質摻合膠之膠帶方式。 (C)可應|丨;|於易伴生靜電環境之靜電消散導通用,如於 潔淨室(Clean Room)之靜谱消散安全地板或映像管背面線 圈附近之靜電消散卨接導通至接地基座用途上。 (d) 可作爲顯像螢幕或微波爐其面玻璃窗的直接靜電導 通放甫膠帶。 (e) 適常選擇金屬層材質之導熱或導電特性,前者如鍍 錫銅箔U乜卨導熱係數,吋作爲導熱連接膠帶,後者如鍍 銀或鍍金銅箔貝.有低電阳.係數,可作爲導通連接器,以作 爲接地與導電連接之用,目_本發明膠帶Μ有高密度突狀表 凼結構,非常適合具有不規則物件表面之貼合連接導通。 (f) 谱腦與各種電氣設備上的元件或配件若需要求有靜 電消散、接地、導通或同時具有導通與黏著時,則可使用 本發明之導電膠帶,若導電膠帶需與被黏著導通物表_結 成一體,則可籍由放電加.Π,使突狀結構材料與被貼著物 金屬表面熔焊成一體,例如鍍錫銅箔導電膠帶。 (g) 本發明之導電導熱雙_膠帶,由於利用膠帶中之金 屬相直接與被貼物接觸,K導熱效率遠遠優於傳統使用之 導熱膏塗佈於鋁箔_側,後者導熱膏中人多使用具導熱性 與低比熱之粉未材料,例如氧化鋁或二氣化鈦粉末摻混於 較絕緣性A分/·材料中例如矽力康,由於·般高分/·材料 7 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝-----訂.!-----線 經濟部智慧財產局員工消費合作社印製 442554 4 3 7 0 t w f f / 0 0 5 A7 B7 五、發明說明(f) 均爲熱不良導體與絕緣物,其熱傳導熱係數約在2x1 0_ 4(cal/cm2/cm/s/°C),此値遠遠低於金屬熱良導體、銅 '錫、 金、銀的熱傳導熱係數’由0.9至1.5(cal/cm2/cm/s/°C)範 園內,可兒其導熱效率相差可達千倍以.匕。 (h) 以觉孔性甚材,單一塑膠膜或金屬/塑膠膜複合膜, 兩側塗佈導電性膠,例如一側使用壓克力導電感壓膠,而 Μ-·側塗佈高架橋度的環氧樹脂導電膠,如此使兩側膠層 具有消散靜電特性之表面阻抗値(Rs)介於10°〜1011歐姆/平 方(Ω/i...)與體積阻抗(Rv)介於l〇n〜l〇9歐姆•公分(Qcm), 而垂[3薄膜方向之體積附抗(Rv)則可以藉改變膠層厚度、 基材厚度與單位被冁向積内贫透之總積而得所需之電性 値,其體積阻抗値(Rv)介於10°〜1〇9歐姆•公分(Qcm) ’ --般而Η體積阻抗(R V)與被輾壓基材單位间積上突穿之總面 積成反比關係,此處石使用蒸鍍鋁金屬之塑膠膜爲被輾壓 成穿孔性基材,則丨天丨結構上有一中間導電金屬層而使整體 之導甫途徑的縮短,可以大副降低沿平行或垂直基材表面 之表面與體積阻抗値,因而可以人幅減少導電介質的使用 Μ與成本即可達到所欲得到電性之導電膠帶。 (i) 本發明之導道導熱膠帶因最外黏著表向上具有尖突 狀獨立岛狀金屬結構,當與被貼合表面接合後則具有拋錨 防滑(anchor and anti-slip)固定的特性。 (J)本發明之導電導熱膠帶具有類似布類表面特性’不 容易起皺折現象,也因此較無因受應力集屮所形成之裂痕 現象。 Η 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之沒意事項再填寫本頁) -----11 訂—— II---- 經濟部智慧財產局員工消費合作社印製 ΊΑ,· 4 5 3 4 5 ο ο / f f w4370twff / 005 A7 4370twff / 005 A7 Consumer Cooperation of Intellectual Property Bureau of the Ministry of Economic Affairs, Du printed B7. V. INTRODUCTION TO THE INVENTION The invention relates to the structure of a tape and its manufacturing method. Or the structure of superior thermal conductive tape and its manufacturing method. As the ruler and i of electronic devices become smaller and smaller, the requirements for the density and precision of their circuits will also become higher and higher. As a result, the components or equipment will be affected by electromagnetic interference, electrostatic damage, and electrical appliances. The use of compatibility issues between products and the countermeasures of magnetic and electrical protection A method is more important. The conductive thermal tape of the present invention has both adhesiveness and superior conductive and thermal properties. Makeup and electromagnetic shielding function. . Among them, the conductive conduction and adhesive jointability are more convenient and more advanced than the traditional connector systems that use locking screws, rivets or welding to connect. Conventional conductive or thermally conductive tapes are mostly mixed with organic polymer materials to form a conductive medium and made of single or double-sided adhesive tapes. Please refer to the first barrier 1. This conductive or thermally conductive tape 10 includes structurally A conductive or thermally conductive substance 12 is located on one or both sides of the aluminum metal layer 11 to connect a heat source and a heat sink, such as a heat sink fan. Of course, rfii, a conductive or thermally conductive substance 12 in this conventional technology product, is a bonding material in its component structure. Typically, polymer materials such as silicon gel are often used, and such polymers are often used. After blending thermal or conductive media, its material is structurally ... it has a continuous structural phase. Although it has a high temperature resistance, its physical properties are mostly a. It has a low thermal conductivity and Insulation characteristics, Yl ·: When mixed with conductive and thermally conductive powder media, its overall conductivity or thermal conductivity is far worse than that of pure metal materials. The present invention proposes a thermally conductive tape, which includes a bu-line structure: 4 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----- ^-III! Pack- ------ Order --------- _ line (please read the notes on the back before filling this page) 5 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 442 5 5 4 437〇t.wff / 00 5 A7 B7 Description of the invention (y)-a composite structure or a single ... substrate structure with a plurality of irregularly arranged protruding structures or grooves, these protruding structures or grooves are protruding or recessed in the composite structure to form Single ... the side of the substrate structure. In addition, the composite structure or single substrate structure is coated with adhesive on one or both sides. For easy operation, a release paper or release film can be attached on the outside of the adhesive layer or on a single substrate. After the structure is coated with the adhesive layer, the other ... side release or release-type release function, such as release agent into release tape. The method of forming these protruding structures or grooves on the structure can be achieved by using diamond rollers, diamond platform rollers, spike wheels or other similar rollers with non-uniform surface distribution and high hardness. Compressed, the present invention proposes the use of diamond rollers, whose diamond particle spike structure height size, distribution density, and operation and manufacturing range are extremely easy to apply. The construction conditions are based on f-Lt 疋. Here, the layer-pile structure material can be a single plastic film or a single metal foil. The combination of the composite structure can be a plastic layer / metal layer, a metal layer / plastic layer / metal layer, a metal layer / metal. Layer / plastic layer, or plastic layer / gold chip / plastic layer, etc., where the metal layer can be a single type of metal, alloy or multi-metal composite foil, depending on the required physical properties, such as the required physical properties Grinding, anti-gasification, good thermal conductivity or good electrical conductivity, etc., such as copper foil, aluminum foil, copper-silver alloy or silver-plated, tin-plated, tin-lead, chrome-plated, nickel-plated, gold-plated copper foil, etc. The combination of foils, etc., can be determined here depending on the actual conductive or thermal characteristics and other conditions, the combination of materials to be used or both. Here, if the gold layer is / avoids the gasification phenomenon caused by the environment, it can be done on the outside of the metal layer that is easily gasified-5 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------- Install -------- Order --------- Line (谙 Read the precautions on the back before filling this page) 442554 4370twif / 005 A7 B7 V. Description of the Invention (Order) (Please read the precautions on the back before filling in this page) Treatment of anti-gasification or passivation surface of step equipment, for example, by electroplating or vapor-phase metal evaporation. Anti-oxidation metal materials with higher vaporization potential, such as tin-lead copper foil, where the tin-lead layer can also provide high thermal conductivity and low resistance resistance at the same time , The other ifu can also use coating _ · organic materials to isolate oxygen penetration and gasification reactions in nature, such as coating epoxy resin. The adhesive layer is called a simple adhesive or a conductive thermal adhesive. Among them, -K requires the material of the adhesive layer, which usually depends on the needs of the actual application field. It can be any glue system, such as acrylic glue, silicone glue, rubber, hot-melt adhesive, and epoxy resin. The temperature range is extremely wide. Here, the material composition of the conductive adhesive layer can be any of the above-mentioned adhesive systems on the adhesive, depending on the requirements of the conductive characteristics "M doped M has a conductive medium. The type of conductive medium can be powder Conductive carbon powder, metal powder, metal oxide particles, U conductive surface plus: treated inorganic powder, conductive surface plus "": organic powder, carbon fiber powder, etc., or a mixture of these conductive media. On the other hand In the heat-conducting glue side, generally, all conductive glues with conductivity also have # excellent thermal conductivity, but when the core does not want to have conductive properties, you can use a low-specific heat conductive medium instead, such as oxidation Aluminum, titanium dioxide powder, etc. The advantages of the conductive heat conductive tape of the present invention include: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (a) This guide tape is provided on the side of the tape while providing adhesion and gold Alas, because the protruding structure is an arbitrary distribution, the distribution density of II is densely and densely: It is very easy to control and manufacture. Ϋ It is very suitable for the surface of irregular adherends, and its adhesion is very good. (B) & qu ot; J is regarded as Electromagnetic Interference (ΕΜ1) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 4425 5 4 4370twff / 005 A7 B7 V. Description of the invention (f ·) The masking ffl tape's protruding structure has a honeycomb-like structure, which provides-the shielding effect of the vertical electromagnetic wave forward / direction, and because of the extremely low impedance of the continuous metal phase, it makes it much better than electromagnetic shielding The conventional tape method for coating conductive medium with adhesive. (C) Can be used | 丨; | Generally used for static dissipative conduction in the environment easily associated with static electricity, such as the static spectrum dissipating safety floor or image in the clean room The static dissipation near the coil on the back of the tube is connected to the ground base. (D) Can be used as a direct electrostatic conduction release tape for the display screen or the glass window of the microwave oven. (E) The thermal conductivity of the metal layer material is usually selected. Or conductive properties, the former such as tin-plated copper foil U 乜 卨 thermal conductivity, inch as a thermally conductive connection tape, the latter such as silver-plated or gold-plated copper foil shell. Has a low electrical anode. The coefficient can be used as a conductive connector for grounding and conductivity even For the purpose, the tape M of the present invention has a high-density protruding surface structure, which is very suitable for the connection and connection of irregular objects. (F) Spectrum brain and various electrical equipment components or accessories if required When static electricity dissipates, grounds, conducts, or has both continuity and adhesion, the conductive tape of the present invention can be used. If the conductive tape needs to be integrated with the surface of the adhered conductive material, it can be added by discharge to make the protruding structure. The material is welded and integrated with the metal surface of the object to be adhered, such as a tinned copper foil conductive tape. (G) The conductive and thermally conductive double-adhesive tape of the present invention, because the metal phase in the tape is used to directly contact the object, the K thermal conductivity is It is far superior to the traditional thermal conductive paste applied on the aluminum foil side. In the latter thermal conductive paste, most people use powder materials with thermal conductivity and low specific heat, such as alumina or titanium dioxide powder mixed with more insulating A Points / · Materials such as Silicon, because of high scores / · Material 7 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page ) Install ----- order.----- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 442554 4 3 7 0 twff / 0 0 5 A7 B7 V. Description of the invention (f) Both are thermally poor conductors and insulators, and their heat transfer coefficients are about 2x1 0_ 4 (cal / cm2 / cm / s / ° C), which is far lower than the thermal conductivity of a good thermal conductor of metal, copper 'tin, gold, and silver' from 0.9 to 1.5 (cal / cm2 / cm / s / ° C) In Fan Yuan, the difference in thermal conductivity can reach thousands of times. (h) Porous material, single plastic film or metal / plastic film composite film, coated with conductive adhesive on both sides, such as acrylic conductive pressure sensitive adhesive on one side, and viaduct on M- · side The epoxy resin conductive adhesive, so that the two sides of the adhesive layer has a static dissipative surface resistance 値 (Rs) between 10 ° ~ 1011 ohm / square (Ω / i ...) and volume resistance (Rv) between l 〇n ~ 109 ohm · cm (Qcm), and the volume-dependent reactance (Rv) in the direction of the film can be changed by changing the thickness of the adhesive layer, the thickness of the substrate, and the total volume of the unit. Obtain the required electrical properties, and its volume impedance (Rv) is between 10 ° ~ 109 ohms · cm (Qcm) '-in general, the product of the volume impedance (RV) and the unit of the rolled substrate The total area of the penetration is inversely proportional. Here, the stone uses a plastic film of vapor-deposited aluminum metal to be rolled into a perforated substrate. Then, there is an intermediate conductive metal layer on the structure, which shortens the overall conduction path. Can greatly reduce the surface and volume impedance along the surface of the parallel or vertical substrate, thus reducing the use of conductive media and cost Can be achieved to obtain the desired properties of the electrically conductive tape. (i) The thermal conductive tape of the present invention has a sharp-shaped independent island-like metal structure due to the outermost adhesion surface, and has the characteristics of anchor and anti-slip fixation when joined to the surface to be bonded. (J) The conductive and thermally conductive tape of the present invention has a cloth-like surface characteristic 'and is not prone to wrinkling, and therefore, it is less likely to be cracked due to stress accumulation. Η This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please read the unintentional matter on the back before filling this page) ----- 11 Order ---- II ---- Economy Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau ΊΑ, · 4 5 3 4 5 ο ο / ffw

7 7 A B 五、發明說明(6) (k) 本發明之導電導熱膠帶同時具有振動與聲音阻尼 (Dampmg)、減抑與消散作用,其中之黏膠層巾之高分子 材料Μ有黏彈特性(viscoelasHdty)能將外界輸入之機械能 阻尼轉化爲熱能,並藉鄰接金屬肩的高熱傳導功能迅速散 掉此熱能,此處之金屬曆在結構上屬一強制件阻尼結構層 (constrained damping layer) η」有效提高其整體的阻能的效 率。 (l) 本發明製造膠帶的方法,遠比傳統習知的方法貝有 製程較簡單、精細與精密度高、輾壓輪無耗損'產能卨與 製造成本低。 爲讓本發明之上述目的'特徵、和優點能更明顯易懂’ 下文特舉些較佳實施例,並配合所附圖式,作詳細說明 如下: _式之簡m說明: 第1 I颜繪示習知之…種雙面矽力康導熱膠八中間複合 鋁箔之膠黏)i之剖面不意圖; 第2A节2C |M丨係繪不依照本發明實施例—的一種導 電導熱膠帶的製造流程剖闻圖; 第3圖係繪不於導電導熱膠帶的製造步驟中形成突起 狀凹槽與金屬尖突島狀結構之示意圖; 第4A至4C圖係繪示依照本發明實施例二之導電導 熱膠帶的製造流程剖面鬨; 第5 _係繪示於導電導熱膠帶的製造步驟中形成突起 狀叫槽與金屬尖突岛狀結構之示意丨劁; 本紙張尺度適用中國國家標準(CNS)A4規格(2]0 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝------丨訂---------線 經濟部智慧財產局員工消費合作社印製 4370twff/00. A7 B7 五、發明說明(7) 第6 _係繪示本發明實施例三之兩個導電膠帶相汉貼 合之不意圖; 笫7圖係繪示本發明實施例之彎曲貼合導電膠帶之 7丨''意圖; 第8圖係繪示於本發明實施例四之…種具有母插座之 導龜黏貼片之示怠圖,以及 第9圖係繪尔於本發明實施例四之一種具有母插座之 導電黏貼片之不意圖。 圖示標記說明: 10 :導审或導熱膠帶 π :鋁金屬層 12 :導谱或導熱物質 31、32、33 :膠帶 200 ' 300 :基材 202、302 :開孔 204、 206、304、306 :黏膠層 205、 208、305、307 :離型層 210、 310 :突起狀凹槽 211、 311 :金屬尖突島狀結構 301 :金屬層 TD : 1虎膠帶表面方向 MD:平行膠帶表1¾丨或機械加丄方向 實施例· 第2A至2C圖係繪示依照本發明-較佳實施例的… 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) ----------- --------訂.!---- (諳先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 “2554 4 3 7 0 t w f f / 0 0 5 A7 _ B7 五、發明說明(y) 種導甫或導熱膠帶的製造流程剖面圖。 請參照第2A圖,提供一基材200,此基材可爲塑膠 薄膜,例如聚内'稀(Polypropylene ; PP)、聚乙稀對苯二 Φ 酸酯(Polyethy丨ene Terephthalate ; PET)、聚乙稀 (Po丨yethylene : PE)、聚乙二醇對萘二甲酸酯(polyethylene naphthalate ; PEN)、聚亞醯胺(Polyimide;PI)、聚氯乙嫌 (Polyvinykhlonde ; PVC)薄膜或K他材質Λ此外,依據木 發明之力法,此基材之材質亦可爲金屬涪(metal foil.),例 如銅箔(copper foil)、鋁箔(aluminum foil)、單面或雙面電 敏銀銅 ΡΤ 金(alloy)、鍍銀(silver; Ag)、鍍錫鉛(solder plated)、鍍絡(chromium)、鍍鎳(nickel)、鍍金(gold)之銅 箔等或+丨nJ上述金屬箔之組合等。其中,圖中標號TD代 表垂ΪΓ基材面方A(Transverse Direction),丨可標號MD代 .表个·ί」_遙材圆或機械加工方向(Machine Direction)。 請參照第2B圖,接著,塗佈一膠層204於.基材200 的一側,膠厨材質則以最佳應用爲主,可以是純膠系、導 電膠或導熱膠,膠層204曝露出之另…側則貼冇一離型層 2〇5,該離型層205可爲離型紙或離型膜。然後接著進行 輾壓的製稈,此處以使用鑽石輪、鑽石平台輾壓機、尖突 狀輪或其他的輾壓機台來輾壓基材,輾壓方向山.基材200 側向膠層204的方向壓,並且穿破基材,藉以在基材200 上形成複數個開孔202,使基材成爲透孔性基材。此時, 基材200 .其中…側表圆的形狀爲具有複數個內凹狀區域, lil] Μ外·側衣丨A!的形狀則爲貝.有複數個突起狀區域,基本 本紙張尺度適用中國國家標準(CNS)A4規格(210 χ 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裒------ 訂---------線 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 2554 4 3 7 0 t w f f / Ο Ο 5 A7 _____B7 五、發明說明(/) h這些內四狀區域與突起狀區域係相互對應的兩兩成接通 狀態,而幽>」相乜接通的內ρη狀區域與突起狀區域則構成 開孔202。因爲,這些冁壓機台具有不規則排列的突狀物, 所以可在基材卜.形成不規則排列之開孔202。此外,開孔 202的深度與Π徑大小則依據所需情況來調整輾壓條件, 例如調整輾壓機台之突狀物的尺、t大小與輾壓壓力大小。 然而,本發明之輾壓步驟並不侷限於穿透基材200, 本發明之輾壓步驟中也可以不穿透基材200,僅在基材200 屮形複成數個不規則排列之突起狀吲槽210,如第3圖所 小。從基材200其屮·側表面來看,此突起狀凹槽210係 現叩陷狀,似是A從法材200另一側表幽來看,則此突 起狀FI槽210係4現尖突狀結構。卡:於,突起狀F丨槽210 的深度與寬度大小,則可依據所需情況來調整輾壓條件。 K本發明之輾壓步驟係不穿透基材200,僅形成突起狀凹 槽210,輾壓步驟中因爲穿透和不穿透基材之製程係相似, 故此實施例僅以穿透基材200作例子,若只欲製成單面性 黏著導電導熱膠帶,則至此步驟產品即可應用。 請參照第2C圖,然而本發明也可以分別上膠在此基 材200之幽側炎面以製成雙面導電或導熱膠帶(如第2C圖 所不此處於製程卜_則需塗佈Μ ·膠層206覆蓋U冇m 陷狀區域之基材200表面,然後可貼合一屑離型層208於 膠層208炎丨(4|,以構成雙凼膠帶。 本發明之導竜膠帶結構,因爲中間基材200形成有穿 透開孔2〇2或突起狀丨|||槽210,|大|此導亀黏膠層垂1自:方向 ------------ ^--------訂 --------I (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 經濟部智慧財產局員工消費合作社印製 4370twff/005 A7 _B7__ 五、發明說明(p) 之體積阻抗(Rv. ·π))將小_等於牛行於基材平面或機械方向之 體積阻抗,故具有異力'向導電性。此處對穿透性塑 膠薄膜榣材僅適塗佈導電膠以製備成異方向性雙面導甫 膠帶,目/兩方向TD與MD之體積阻抗(Rv)量測値與基材 h單位面積之總穿孔面積大小與導電粉末介質之岡體含量 多少成反比,但與導亀膠肩厚度成正比。 値得注意的·點是,若本發明中的基材200爲金靥材 質,則黏膠層可爲非導電性黏膠層或導電性黏膠層。尤其 是,丫f:塗佈第·層黏膠層204並輾壓後,從黏著層204膠 |Αί側衣_來看,此基材200,所形成的尖突狀結構係穿透 較軟的膠層204後呈獨立的金屬尖突島狀結構2]l(1S〇lated eland),而膠相則呈▲連續相結構且環繞於分閧獨立的金 屬尖突島狀結構211中,而此處膠層204外表面同時具有 獨立分離的金屬與連續黏膠兩相之結構,在應用上則同時 提供了黏著與電流導通的功能特性。至於,金屬尖突島狀 結構211突起狀高度與密度,則可以依據所需情況來調整 輾壓輪上尖突之卨度、密度與輾壓壓力條件。至此本發明 之輾壓製秤巾當壓突基材,並突穿膠層204結構,此發明 結構組Γΐ物即坩當作導電膠帶。而让此導電膠帶除時 Μβ黏莕與導電導通功能外,並有電磁遮蔽功能。當 然其中,芯坫材200的兩側衣面均上膠,則第二側面之膠 靥206 扮演'•空氣附絕介觭,可防止金屣基材的被氧化, 假如基材200材質爲単·絕緣塑膠薄膜,則兩側黏膠層之 材質均需爲導甫性黏膠層,,A柯雙面導電膠帶特性。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) --------;--- ------^—1 訂·! — <請先閱讀背面之注意事項再填寫本頁) 44255 4 4370twff/005 A7 B7 五、發明說明(// ) 此處導遒性的黏膠層之物性,如體積阻抗(Rw MD) -·般 可介於1 (T1〜1 OWcm間,而垂直方向(TD)之體積阴.抗(Rv. TD) 介於 ΙΟ1 〜10yQcm。 其中,影響垂直力向之體積阻抗(RvTI))係和K列因素 有關: (a) 欲摻雜導電性介質之體積阻抗(Rv)。 (b) 施加於垂[ft方向之正向單位面積所受壓力大小。 (c) 單位面積h被輾壓孔穿透面積大小。 (d) 導電黏膠層與基材之厚度。 (e) 導電介質與膠體相對之固含量" ⑴黏膠種類。 實施例二 第4A .至4C圖係繪示依照本發明實施例:之導電或 導熱膠帶的製造流程剖_圖。 請參照笫4A圖,提供·一基材300,此基材可爲喟膠 薄膜,例如聚丙烯(PP)、聚乙烯對苯一·甲酸酯(PET)、聚 乙烯(PE)、聚乙:醇對萘.:中酸酯(PEN)、聚醯亞胺膜 (PI)、聚氯乙烯(PVC)薄膜或其他材質。然後,複合一金屬 層30〗覆蓋基材300之…表囪,而構成一複合膜結構。其 屮,該金屬屑301之材質可以足金屬蒸鍍膜例如蒸鍍鋁膜 或爲.貼合成熱壓合之金屬箔,此金屬箔nj爲銅箔、鋁箔、 單闹或雙ιίι丨電鍍銀銅合金、鍍銀、鍍錫鉛 '鍍鉻、鍍鎳、 鍍金之銅箔等或同上述金屬箔之組合等。本發明建議使 闬表Ifl丨蒸鍍丨:·賭鋁金巋的PET某材或將鍍錫銅箔之銅面 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐〉 (請先閲讀背面之注意事項再填寫本頁) 裝------.--訂---I---I 1^. 經濟部智慧財產局員工消費合作社印製 Λ 4255 4 4370twff/O05 A7 B7 五、發明說明(/〇 貼合於PET基材卜:。其中,阊屮標號TD代表垂直複合膜 平面方向’而標號MD代表平行複合膜平_或機械加工方 向。 請參照第4B _ ’接著,塗佈-膠層;304於複合膜結 構的金屬面外側’膠層材質的選擇,則以最佳實際應用爲 可以是純膠系、導電膠成導熱膠,建議使用純膠系即 可,而純膠系可爲任何的膠系,例如爲亞克力膠、矽膠、 橡膠、熱融滕、環氣樹酯等。之後,於膠層304另·-側則 貼有一離型層305,該離型層305可以爲離型紙或離型膜。 然後接著進行輾壓的動作,例如使用鑽石壓輪、鑽石平台 輾壓機、尖突狀輪或其他的輾壓機台來輾壓,輾壓方向由 基材側向媵㈣304的方向壓,收目_輾壓時穿壓基材300、 金屬層30〗、與膠層304,並在金屬層301與基材300上 形成複數個尖突狀開孔302,而形成一透孔性結構320。 此時,基材300其中一側表面的形狀爲具有複數個F1狀區 域,而另外-側表面的形狀則爲具有複數個內突起狀區 域,基本上适些內凹狀區域與突起狀區域係相互對應的兩 兩成接通狀態,iflT兩兩相互接通的内凹狀區域與突起狀區 域則構成尖突狀開孔302。沐丨爲’這些輾壓機台具乜不規 則排列的突狀物’所以可在基材L形成不規則排列之開 孔。此外,尖突狀開孔302的深度與门徑大小則依據所需 情況來調整輾壓條件,例如調整輾壓機台壓輪之突狀物的 尺、I人小與壓力大小° 然「ίι] ’本發明之輾壓步驟並小限於结透金屬層與基 15 丨本紙張尺度適用帽國家標準(CNS)A4規格(210 X 2S7公发) <請先閲讀背面之注意事項再填寫本頁) --------訂-------1 經濟部智慧財產局員工消費合作社印製 A7 4 3 7 0 t w ± f / 〇 C' 5 五、發明說明(/)) 材,木發明之輾壓步驟中也可以不穿透金屬層與基材,僅 於基材與金屬屑屮形成數侗不規則排列之尖突狀凹槽 Ή0(如第5 |M丨所不)。從黏著屑表面來看,此尖突狀凹槽結 構係穿透較軟的膠層304後呈獨立的金屬尖突鳥狀結構 311,而膠相則4 ·連續相結構且環繞於分開獨立的金屬 尖突島狀結構311,而此處膠層304外表面同時Μ有獨立 分離的金屬與連續黏膠兩相之結構在應用上則同時提供了 黏著與電流導通的功能特性。令於,金屬尖突島狀結構311 突起狀結構尚度與密度,則可以依據所需情況來調整輾壓 輪上尖突之高度、密度與輾壓壓力條件。至此本發明之輾 兩步驟,有壓突越材300與金屬層301,並突穿膠層304 結構,此發明結構組泠即可當作導電膠帶,[Mil此導電膠 帶除時具有黏著與導道導通功能外,並且具有電磁遮 蔽功能。當然其巾,基材300的兩側表面均可上膠,例如 上·層膠層306於基材300第二側面卜:,此外可貼上一層 離型層307於膠層306之表面。則第二側面之膠層306可 扮演一空氣附絕介ΙΜ,可防止金屬層301的被氧化,此處 若使用聚Μ乙烯(PVC)^膠膜貼合至第:::膠面側或直接以 聚氯乙烯(PVC)膠帶取代第:膠層,則可成爲一極佳之產 品,此爲一側[ill具冇絕緣特性11 Μ —側面具有導電黏著特 性之導電絕緣膠帶。此處實施例僅以穿透金屬層與基材作 例。 Η施例三 請參照第6圖,以類似實施例一中使用金屬層之基材 (請先閱讀背面之注意事項再填寫本頁) 裝i I ---訂---------線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用令國國家標準(CNS)A4規格(210 X 297公釐) 7 0 t w £ f / υ 〇 , Α7 7 0 t w £ f / υ 〇 , Α7 經濟部智慧財產局員工消費合作社印製 Β7 五、發明說明(// ) 2〇〇 ’建議使用鍍錫之銅箔,並於…側塗佈一膠層204,膠 iff 2〇4材料的選用則端視產品最佳之應用場合爲主,hJ以 Μ純膠系、導電膠或導熱膠,建議使用純膠系即可,而純 膠系可爲仟何的膠系,例如爲亞克力膠、矽膠、橡膠、熱 融膠、環氣樹_等。實務上,於膠層204之另-側則貼含 有·離型層205,該離型層205可以爲離型紙或離型膜。 然後,接著進行輾壓的動作,例如使用鑽77輪、鑽石平台 輾壓機、尖突狀輪或其他的輾壓機台來輾壓,輾壓時,其 冁壓方向則山基材·側向膠層的方向輾壓,並目.輾壓時形 成延伸壓突金屬基材200層Μ壓穿膠層204,結果在金屬 湛材200外觀上形成複數個尖突狀結構》因爲,這些辗懕 機台具苻不規則排列的突狀物,所以可在金屬基材200上 形成不規則排列之尖突狀凹槽結構210。此外,可依據所 需情況藉輾壓條件來調控尖突狀凹槽結構210的高度與大 小,例如調整輾壓機台壓輪之突狀物的尺、I大小、密度與 輾壓壓力大小。 此處,從黏膠層204膠的外側表面看,此尖突狀叩槽 結構210穿透較軟的膠層後41獨立的金屬尖突島狀結構 2丨1相,丨其餘之膠層面則爲-連續相且環繞於分開獨立 的金屬尖突島狀結構211,此處膠層204外側表面同時U 打獨.1/1分離的+金屬尖突與連繪黏膠兩相之結構’在應用h 則Η時提供Γ黏箸性與電流導通的功能特性。乇於,金屬 尖突岛狀結構2Ϊ1的突起狀之結構高度與分佈密度,則可 以依據所需情況來調整輾壓輪上尖突之卨度、分佈密度與 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ------------ --------^ i I ----- I (請先閱讀背面之注意事項再填寫本頁) 4370twff/005 A7 4370twff/005 A7 經濟部智慧財產局員工消費合作社印製 B7 五、發明說明(β) 輾壓壓力條件。7 7 AB V. Description of the invention (6) (k) The conductive and thermally conductive tape of the present invention has both vibration and sound damping (Dampmg), damping and dissipation effects. The polymer material M of the adhesive layer towel has viscoelastic properties. (ViscoelasHdty) can convert externally input mechanical energy damping into thermal energy, and quickly dissipate this thermal energy by the high heat conduction function of the adjacent metal shoulder. The metal here is a constrained damping layer in the structure. η "effectively improves the efficiency of its overall resistance. (l) The method for manufacturing the adhesive tape of the present invention is far simpler than the conventional methods. The manufacturing process is simpler, finer and more precise, and the rolling wheels are non-destructive, and the production capacity and manufacturing cost are lower. In order to make the above-mentioned object of the present invention 'characteristics and advantages more obvious and easy to understand', some preferred embodiments are given below, and in conjunction with the accompanying drawings, detailed descriptions are as follows: Illustrate the known ... a kind of double-sided silicon Li Kang thermal adhesive eight intermediate composite aluminum foil) i) the cross-section is not intended; Section 2A 2C | Process flow chart; Figure 3 is a schematic diagram showing the formation of protruding grooves and metal spiked island structures in the manufacturing steps of the conductive thermal tape; Figures 4A to 4C are diagrams showing the electrical conductivity according to the second embodiment of the present invention Section 5 of the manufacturing process of thermally conductive tape; Figure 5 _ shows the schematic diagram of the formation of protruding called grooves and metal spikes in the manufacturing steps of conductive thermally conductive tape 丨 胶带; This paper standard applies to China National Standard (CNS) A4 Specifications (2) 0 X 297 mm) (Please read the precautions on the back before filling out this page) Loading -------- 丨 Ordering -------- Employee Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed 4370twff / 00. A7 B7 V. Description of Invention (7) Section 6 _ Department of Drawing The third embodiment of the invention does not intend to attach the two conductive tapes; 笫 7 is a drawing showing the intention of the curved and adhered conductive tape according to the embodiment of the invention; FIG. 8 is a drawing showing the implementation of the invention Example 4: A drawing of a guide turtle sticker with a female socket, and FIG. 9 is a schematic diagram of a conductive sticker with a female socket in Embodiment 4 of the present invention. Description of pictographs: 10: Guide or thermal conductive tape π: Aluminum metal layer 12: Guide or thermal conductive material 31, 32, 33: Tape 200 '300: Base material 202, 302: Opening holes 204, 206, 304, 306 : Adhesive layers 205, 208, 305, 307: Release layers 210, 310: Protruding grooves 211, 311: Metal spiked island structure 301: Metal layer TD: 1 Tiger tape surface direction MD: Parallel tape Table 1¾丨 Or mechanical direction examples · Figures 2A to 2C are drawings according to the present invention-the preferred embodiment ... This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) ---- ------- -------- Order.! ---- (谙 Please read the precautions on the back before filling this page) Printed by “2554 4 3 7 0 twff / 0 0 5 A7 _ B7” printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (y) Guide A cross-sectional view of the manufacturing process of thermally conductive tape. Please refer to Figure 2A. A substrate 200 is provided. This substrate can be a plastic film, such as polypropylene (PP), polyethylene terephthalate. (Polyethy 丨 ene Terephthalate; PET), Polyethylene (Po 丨 yethylene: PE), Polyethylene naphthalate (PEN), Polyimide (PI), Polyvinyl chloride (Polyvinykhlonde; PVC) film or other materials Λ In addition, according to the method of wood invention, the material of this substrate can also be metal foil (metal foil.), Such as copper foil (copper foil), aluminum foil (aluminum foil) , Single-sided or double-sided electro-sensitive silver copper PT gold (alloy), silver (silver; Ag), tin plated (solder plated), plating (chromium), nickel (nickel), gold (gold) copper Foil, etc. or + 丨 nJ combination of the above-mentioned metal foils, etc., where the symbol TD in the figure represents the vertical substrate surface A (Transverse Direction), 丨 can be labeled MD on behalf of the table. Ί ”_ remote wood circle or machine direction (Machine Direction). Please refer to FIG. 2B. Next, apply an adhesive layer 204 to one side of the substrate 200. The material of the adhesive kitchen is mainly for the best application. It can be pure adhesive, conductive adhesive or thermal conductive adhesive. The adhesive layer 204 is exposed. On the other side, a release layer 205 is attached. The release layer 205 may be a release paper or a release film. Then, the stalk is rolled. Here, the substrate is rolled using a diamond wheel, a diamond platform rolling machine, a spiked wheel or other rolling machine, and the rolling direction is mountain. Substrate 200 lateral adhesive layer By pressing in the direction of 204 and breaking through the substrate, a plurality of openings 202 are formed in the substrate 200 to make the substrate a porous substrate. At this time, the substrate 200 has a shape of a side surface circle having a plurality of concave areas, and a shape of the outer and side garments A! Is a shell. There are a plurality of protruding areas, which is basically a paper size Applicable to China National Standard (CNS) A4 specification (210 x 297 mm) (Please read the precautions on the back before filling out this page) 裒 ------ Order -------- Wisdom of the Ministry of Economics Printed by the Consumer Cooperative of the Property Bureau Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 2554 4 3 7 0 twff / Ο Ο 5 A7 _____B7 V. Description of the invention (/) h These inner four-shaped areas correspond to the protruding areas The connection state is two by two, and the inner ρn-like region and the protrusion-like region that are turned on in the same manner form an opening 202. Because these presses have irregularly arranged protrusions, irregularly arranged openings 202 can be formed in the substrate. In addition, the depth and diameter of the opening 202 are adjusted according to the required conditions, such as adjusting the size of the protrusions of the rolling machine, the size of t, and the pressure of rolling. However, the rolling step of the present invention is not limited to penetrating the substrate 200, and the rolling step of the present invention may not penetrate the substrate 200, and only the substrate 200 is shaped into a plurality of irregularly arranged protrusions. The indium tank 210 is as small as shown in FIG. 3. Judging from the side surface of the substrate 200, the protruding groove 210 is now depressed, and it seems that A is viewed from the other side of the legal material 200, and the protruding FI groove 210 is 4 sharp. Protruding structure. Card: For the depth and width of the protruding F 丨 groove 210, the rolling conditions can be adjusted according to the needs. K The rolling step of the present invention does not penetrate the substrate 200, and only forms a protrusion-shaped groove 210. In the rolling step, because the processes of penetrating and not penetrating the substrate are similar, this embodiment only uses penetrating the substrate. As an example, if you only want to make single-sided adhesive conductive thermal tape, the product can be applied to this step. Please refer to FIG. 2C. However, the present invention can also be glued on the flank side of the substrate 200 to make a double-sided conductive or thermally conductive tape (as shown in FIG. 2C) The adhesive layer 206 covers the surface of the substrate 200 in the U 冇 m recessed area, and then a chip release layer 208 can be attached to the adhesive layer 208 (4 |) to form a double tape. The structure of the guide tape of the present invention Because the intermediate substrate 200 is formed with a penetrating opening 202 or a protrusion shape |||| The groove 210, | large | this guide adhesive layer hangs from 1 to ------------ -^ -------- Order -------- I (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297) (%) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4370twff / 005 A7 _B7__ V. Description of the invention (p) The volume impedance (Rv. · Π)) will be small _ equal to the volume impedance of the cow on the substrate plane or mechanical direction Therefore, it has different force's direction conductivity. Here, only the conductive adhesive is applied to the penetrating plastic film material to prepare a double-directional double-sided tape, and the volume impedance of the TD and MD in both directions (Rv )Measure The size of the total perforated area per unit area of the substrate h is inversely proportional to the amount of the conductive powder medium, but it is proportional to the thickness of the rubber shoulder. It should be noted that if the substrate 200 in the present invention is For the material of gold, the adhesive layer can be a non-conductive adhesive layer or a conductive adhesive layer. In particular, after coating the first adhesive layer 204 and rolling it, the adhesive layer 204 is glued | Αί Looking at the side garments, the spiky structure formed by this substrate 200 is an independent metal spiky island-like structure after penetrating the softer gel layer 204. [1S〇lated eland), and the gel phase It has a ▲ continuous phase structure and surrounds the separate metal spiked island structure 211. Here, the outer surface of the adhesive layer 204 has both a separate metal and continuous viscous structure, and it is applied simultaneously. Provides the functional characteristics of adhesion and current conduction. As for the protruding height and density of the metal spiked island structure 211, the degree, density, and rolling pressure conditions of the spikes on the rolling wheel can be adjusted according to the needs. So far, the roll-pressed scale towel of the present invention acts as a substrate and penetrates through the adhesive layer 204. The structure group of this invention, namely the crucible, is used as a conductive tape. In addition to the function of Mβ adhesion and conductive conduction, this conductive tape also has an electromagnetic shielding function. Of course, both sides of the core material 200 are coated on the upper surface. Adhesive, the second adhesive 206 acts as “• air with insulation”, which can prevent the oxidation of the metal substrate. If the substrate 200 is made of 単 · insulating plastic film, the material of the adhesive layers on both sides must be Adhesive adhesive layer, A Ke double-sided conductive tape characteristics. This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) --------; --- --- --- ^ — 1 Order ·! — ≪ Please read the notes on the back before filling this page) 44255 4 4370twff / 005 A7 B7 V. Description of the invention (//) The properties of the adhesive layer here For example, the volume impedance (Rw MD)-can be between 1 (T1 ~ 1 OWcm), and the volume (Vv. TD) in the vertical direction (TD) is between 101 ~ 10yQcm. Among them, the volume impedance (RvTI) that affects the vertical force direction is related to the factors in column K: (a) The volume impedance (Rv) of the conductive medium to be doped. (b) The amount of pressure applied to the unit area in the forward direction in the vertical [ft] direction. (c) The unit area h is penetrated by the rolling hole. (d) The thickness of the conductive adhesive layer and the substrate. (e) Relative solid content of conductive medium and colloid " ⑴Viscose type. Embodiment 2 Figures 4A. To 4C are cross-sectional views illustrating a manufacturing process of a conductive or thermally conductive tape according to an embodiment of the present invention. Please refer to Figure 4A to provide a base material 300. This base material can be a rubber film, such as polypropylene (PP), polyethylene terephthalate (PET), polyethylene (PE), polyethylene. : Alcohol to naphthalene .: Medium acid ester (PEN), polyimide film (PI), polyvinyl chloride (PVC) film or other materials. Then, a composite metal layer 30 covers the surface of the substrate 300 to form a composite film structure. In other words, the material of the metal chip 301 can be a metal vapor-deposited film such as a vapor-deposited aluminum film or a metal foil laminated with a thermocompression bonding. The metal foil nj is a copper foil, an aluminum foil, a single or double-plated silver copper. Alloy, silver-plated, tin-lead-plated 'chrome-plated, nickel-plated, gold-plated copper foil, etc., or a combination with the above-mentioned metal foil, etc. The present invention proposes to make the surface Ifl 丨 evaporation 丨: · PET of aluminum or gold tin or the copper surface of tinned copper foil. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm> ( Please read the precautions on the back before filling out this page.) --------.-- Order --- I --- I 1 ^. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Λ 4255 4 4370twff / O05 A7 B7 V. Description of the invention (/ 〇 Laminated on PET substrates. Among them, the TD symbol TD stands for the plane direction of the vertical composite film 'and the symbol MD stands for the plane of the parallel composite film _ or machining direction. Please refer to Section 4B _ 'Next, coating-adhesive layer; 304 is on the outside of the metal surface of the composite film structure.' For the selection of the material of the adhesive layer, the best practical application can be pure rubber-based, conductive adhesive into thermal conductive adhesive, it is recommended to use pure rubber-based Yes, and the pure rubber system can be any rubber system, such as acrylic, silicone, rubber, hot melt, epoxy resin, etc. After that, a release layer 305 is attached to the other side of the rubber layer 304, The release layer 305 may be a release paper or a release film, and then a rolling action is performed, such as using a diamond roller. Diamond platform rolling machine, spiked wheel or other rolling machine table to roll, the rolling direction is from the substrate side to the direction of 媵 ㈣ 304, watch_rolling through the substrate 300, metal layer 30 And the adhesive layer 304, and a plurality of spiky openings 302 are formed on the metal layer 301 and the substrate 300 to form a porous structure 320. At this time, the shape of one surface of the substrate 300 has A plurality of F1-shaped regions, and the shape of the other side surface has a plurality of inner protruding regions, which are basically suitable for the indented regions and the protruding regions to correspond to each other in a paired state, iflT pairwise each other The connected concave areas and protruding areas form spiky openings 302. This is 'these rolling machines have irregularly arranged protrusions', so irregular arrangements can be formed on the substrate L. In addition, the depth and door diameter of the spiky opening 302 are adjusted according to the required conditions, such as adjusting the ruler of the protrusion of the roller of the rolling machine, the size of the person and the pressure ° However, the "rolling step" of the present invention is not limited to the penetration of the metal layer and the substrate 15 丨Paper size is applicable to National Cap (CNS) A4 specification (210 X 2S7) < Please read the precautions on the back before filling this page) -------- Order --------- 1 Economy A7 4 3 7 0 tw ± f / 〇C '5 printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau. V. Invention Description (/)) In the rolling step of the wood invention, the metal layer and the substrate may not be penetrated. Only when the substrate and metal shavings form a number of irregularly arranged spiky grooves Ή0 (as in No. 5 | M 丨). From the surface of the adhesive chip, this spiked groove structure penetrates more After the soft glue layer 304, there is an independent metal spike structure 311, and the glue phase is 4. The continuous phase structure surrounds the separate metal spike structure 311, where the outer surface of the glue layer 304 is simultaneously M The structure with two separate phases of metal and continuous adhesive provides both adhesion and current conduction in application. Therefore, the metal spiked island structure 311 can be used to adjust the height, density and rolling pressure conditions of the spikes on the rolling wheel according to the needs. So far, the two steps of the present invention have a structure of pressing over the material 300 and the metal layer 301 and penetrating through the adhesive layer 304 structure. The structure of this invention can be used as a conductive tape. [Mil This conductive tape has adhesion and conductivity when it is removed In addition to the channel conduction function, it also has an electromagnetic shielding function. Of course, on both sides of the towel, the substrate 300 can be glued. For example, the upper and lower adhesive layers 306 can be glued on the second side of the substrate 300. In addition, a release layer 307 can be pasted on the surface of the glue layer 306. Then, the adhesive layer 306 on the second side can act as an air-adhesive insulation 1M, which can prevent the metal layer 301 from being oxidized. Here, if polymethylethylene (PVC) ^ adhesive film is used to attach to the side of the ::: rubber surface or Directly replacing the first: adhesive layer with polyvinyl chloride (PVC) tape can become an excellent product. This is one side [ill with 冇 insulation properties 11 Μ — conductive insulation tape with conductive adhesive properties on the side. The embodiments here only take the example of penetrating the metal layer and the substrate. ΗExample 3 Please refer to Figure 6 for a substrate using a metal layer similar to Example 1 (please read the precautions on the back before filling this page) -Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the paper size is applicable to the national standard (CNS) A4 (210 X 297 mm) 7 0 tw £ f / υ 〇, Α7 7 0 tw £ f / υ 〇 , Α7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs B7 V. Description of the Invention (//) 200 ′ It is recommended to use tinned copper foil, and apply an adhesive layer 204 on the side of the material FF 204 The selection depends on the best application of the product. HJ uses MU pure rubber, conductive or thermal adhesive. It is recommended to use pure rubber, and pure rubber can be any glue, such as acrylic. Rubber, silicone, rubber, hot-melt adhesive, ring tree, etc. In practice, a release layer 205 is attached to the other side of the adhesive layer 204. The release layer 205 may be a release paper or a release film. Then, the rolling operation is performed, for example, using a 77-drill drill, a diamond platform rolling machine, a spiked wheel, or another rolling machine table. When rolling, the pressing direction is on the base material. Rolling in the direction of the glue layer, and the purpose is to form a stretched metal substrate 200 layer M when pressed through the glue layer 204, as a result, a plurality of spike-like structures are formed on the appearance of the metal 200. Because these rollers The machine tool has irregularly arranged protrusions, so that irregularly arranged spiked groove structures 210 can be formed on the metal substrate 200. In addition, the height and size of the spike-shaped groove structure 210 can be adjusted by rolling conditions according to the required situation, such as adjusting the size, I size, density, and rolling pressure of the protrusions of the roller of the rolling machine. Here, when viewed from the outer surface of the adhesive layer 204, the spiky groove structure 210 penetrates the softer glue layer and 41 independent metal spiked island structures are 2 and 1 phase, and the rest of the glue layers are It is a continuous phase and surrounds a separate and independent metal spike structure 211, where the outer surface of the glue layer 204 is simultaneously U-shaped. 1/1 The structure of the two phases of + metal spike and continuous painting adhesive The application of h then provides the functional characteristics of Γ viscosity and current conduction. For example, the height and distribution density of the protruding structure of the metal spiked island structure 2Ϊ1 can be adjusted according to the needs, the density of the spikes on the rolling wheel, the distribution density and the paper size are applicable to Chinese national standards (CNS ) A4 size (210 X 297 mm) ------------ -------- ^ i I ----- I (Please read the precautions on the back before filling in this Page) 4370twff / 005 A7 4370twff / 005 A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, B7 V. Description of the invention (β) Rolling pressure conditions.

接箸,於被輾壓IL成凹狀之基材裸露面側靖佈一導熱 膠或導電膠,此處膠系可爲任何的膠系,例如爲亞克力膠、 砂膠、橡膠、熱融膠、環氧樹酯等,此處建議使用耐候性 佳之亞克力膠,而導熱與導電介質可爲氧化鋁與金屬鎳 粉,此處之該層突佈量厚度以越薄越佳D 然後將上述兩側均有膠層塗佈之複合層30膠帶藉由 該極薄的導熱膠或導電膠屑206貼合至另一僅有上膠11輾 丨悲過Z導電膠帶3 1之另一裸露基材面黏著壓合,时形成 --結構k對稱之具有雙面黏著與導電導熱之膠帶32。 請參照第7圖,此處若欲有更佳之導電導通效果,實 務應用上,則nj'將導熱膠或導電膠206以全面或部分斑馬 對稱上膠後’冉以對稱力·式,向導熱膠或導電膠206內側 對折,而形成一類似h述之雙面黏著與導電導熱之膠帶 33 ’此處因雙面導電導熱膠帶33結構中有一邊緣具有連 續的金屬相’所以會有較佳的導電導通與導熱效果,結構 [:Μ時也提供厂.較強的機械抗變形結構,本實施例在電 子業界屮可以應用於當電子元件需要熱傳導黏著與配件間 接地或黏接導通,例如電腦中央處理器之導熱與散熱應 II.卜 實施例叫 以類似實施例-·1丨1使用金屬之基材200,建議使用錫 和銅或錫鉛和銅之複合金屬箔,並於一側塗佈一膠層204, 膠Μ材料的選用則端視歲品最佳之應用場合爲屮,可以是 本紙張尺度適用111國國家標準(CNS)A4規格(210 X 297公釐) ! ^---------訂--------線 (請先閱讀背面之注意事項再填寫本頁) 五、發明說明(Μ ) 純膠系、導電膠或導熱膠,建議使用純膠系即可,而純膠 系可爲任何的膠系,例如爲亞克力膠、矽膠、橡膠、熱融 (請先閲讀背面之注意事項再填寫本頁> 膠、環氣樹酯等。之後,實務上,於膠層204之另一側則 貼合冇·離型層2〇5,該離型層2〇5可以爲離型紙成離型 膜。然後,接著進行輾Μ的動作,例如使用鑽石輪、鑽石 /卜台輾壓機、尖突狀輪或其他的輾壓機台來輾壓,輾壓時, 其輾壓/;向則由基材·側向膠層的方向輾壓,並且輾壓時 形成延伸壓突金屬基材200層且壓穿膠層,結果办:金屬基 材200外觀上形成複數個尖突狀結構。因爲,這些輾壓機 台Μ彳丨不規則排列的突狀物,所以可在金屬基材200上形 成不規則排列之尖突狀凹槽結構210。此外,可依據所需 情況籍輾Μ條件來調控尖突狀凹槽結構2 1 0的卨度與人 小,例如調整輾Μ機台颸輪之突狀物的尺、t大小、密度與 輾壓壓力大小n 此處,從膠層204之膠丨Μ側表面來看,此金屬尖突狀 F1槽結構210穿透較軟的膠層204後Μ獨立的金屬尖突岛 狀結構211,时其餘膠層204之交函則爲·連續相且環繞 經濟部智慧財產局員工消費合作社印製 在分閧獨立(isolated island)的金屬尖突島狀結構2ΓΙ相四 问,此處此‘表面丨π]時具有金屬與黏膠闲ffl之表面結構在 應)1.丨上則同時提供/黏莕與金屬接觸導熱的功能特件π令 於,金屬尖突岛狀結構211的突起狀結構之高度與分佈密 度,則可以依據所溢情況來調整辗壓輪上尖突之高度、分 佈密度與輾壓壓力條件。 接著,wj將此-導電膠帶嶄型成片狀之導電黏貼片 本紙張尺度適用令國國家標準(CNS)A4規格(210 X 297公釐) 437〇twff/0' A7 B7 五、發明說明(y) 400,於此..·導遥黏貼片400之裸露金屬面側以放電加工 方式銲著或導逍膠(未繪示)固定黏著一具有公插頭4 0 4 (如 第9圖所小)或母插唑406(如第8圖所示)的金屬連器上之 結合片402,於導電黏貼片400之金屬側面上,此公插頭 404或母插座406 以足垂直(如第8與9圖所示)或平行(未 繪+示出)導窗黏貼片400。然後再於金屬連器卜.之結合片402 上方貼合一絕緣膠帶或塗佈·絕緣漆(未繪示)’此處實務 應用上,可以不用放電加X力式銲合金屬連器,可以直接 以Ιίι]積大於結合片402面積之絕緣膠帶將金屬連器上之結 合)V 420上方貼合至導窀黏貼片400的金屬背面即可達到 導通、連接與固定的作用,此處爲求較高產品品質,如介 電阻阻抗現象,建議還是採W固定銲接。而兩個分別J4. 有公插頭404與母插座406之金屬連器,彼此可以藉由-導線作-長距離導電導逋之應用,實務上極具有操作方便 性,此·實施例可以在電子設備接地、元件間導體導通、 靜電接地消散導通等諸多應用,甚至應用在醫療設備中之 監控儀器.L之電流信號探測接頭上。 實施例7: ί. 以類似Η施例·中使用金屬之基材200,建議使用鋦 和銅或錫鉛和銅之複合金鯆箔,、1於··側飱佈…膠層204, 膠層材料的選用則端ιΐΜ產品最佳之應用場合爲主,可以足 純膠系、導電膠成導熱膠,建議使用純膠系即可,而純膝 系w爲任何的膠系,例如爲亞克力膠、矽膠、橡膠、熱融 膠、環氣樹酯等。之後,實務上,於膠層204之Μ·.側則 2 0 本紙張尺度適用中國國家標準(CNS)A4規格(2i0 X 297公釐) ~ (請先閱讀背面之注意事項再填寫本頁) 裝---訂---------線 經濟部智慧財產局員工消費合作社印製 4 3 7 0 t v/ f f / Ο Ο 5 A7 4 3 7 0 t v/ f f / Ο Ο 5 A7 經濟部智慧財產局員工消費合作社印製 五、發明說明(β) 貼合冇·離咽層205,該離型層205可以爲離型紙或離职 膜。然後,接著使W鑽石輪、鑽石平台辗壓機、尖突狀輪 或其他的iL壓機台來輾壓,本實施例中,就實際需求,此 時只做選擇性區域的輾壓,例如以條狀間格或问心圓間隔 區域方式等。輾壓時,其輾壓方向則由基材一側向膠層的 方向輾壓,姐乩輾壓時形成延伸壓突金屬基材200層11JM 穿膠層,結果在金屬基材200外觀上形成複數個尖突狀結 構。因爲,运些輾壓機台具有不規則排列的突狀物,所以 可在金屬基材200上形成不規則排列之尖突狀凹槽結構 210。此外1 w丨依據所需情況藉輾壓條件來調控尖突狀FI 槽結構210的高度與大小,例如調整輾壓機台壓輪之突狀 物的尺寸大小、密度與輾壓壓力大小。 此處,從膠曆204之膠幽側表面來看,有被輾壓到之 區域,有類似上述實施例子四中所述,金屬尖突狀凹槽結 構210穿透較軟的膠層204後呈獨立的金屬尖突島狀結構 211,而其餘膠層204之膠面則爲一連續相且環繞在分開 獨立(isolated island)的金屬尖突島狀結構211相四周,至 於沒有被輾壓到之區域,則山膠層提供·完全黏著特忭, 此-一未被輾壓區域之膠層同時提供側面阻絕空氣進人與接 觸金屬厨,進·少氣化內部金屬層表面,如此之外表面同 時具冇金屬與黏膠兩相之表面紿構在應用上除/问時提供 丫黏茗與金屬接觸導電的功能特性,加強與提高黏莕能力 足本結構的特件。午於,金屬尖突島狀結構211的突起狀 結構之咼度與分佈密度,則可以依據所需情況來調整輾壓 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ------------ 裝---訂---------線 C請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 4370t.wff/0 0 5 A7 五、發明說明() 輪上尖突之A度、分佈密度與輾壓壓力條件。 上述之較高黏著特性之導電膠帶,於應用需耍上,亦 可以於有輾壓成未輾壓區內有部分區域,保留部分未做膠 層荦佈之裸露區域,而此區域可作爲後續之焊接與導通連 結地方之(此應用之結構未圖不),由此可知,本發明之 導電導熱膠帶可依據實際應用場所,如導電或導熱係數、 黏著度、電磁波遮蔽能力大小、選擇性區域導電或導熱、 選擇性區域裸露錦接等來設ΰ卜其最終之導窜導熱膠帶組合 糸ΰ:構。 綜上所述,本發明之導谱膠帶之優點包栝: (a)本導電膠帶可於膠帶之-側同時提供黏著功能與金 屬接觸導通特性,由於該突狀結構爲一仟意分佈,且分佈 密度由密至稀均椒Μ控制與製造,且非常適用於不規則被 貼物表面,其伏貼密合性極佳。 (b)可當作電磁+擾遮蔽用膠帶,其突狀結構具冇類似蜂槽 狀提供垂卨電磁波前進力向的遮蔽作用,且由於金屬連續 相的梅低阻抗,时使其本身對電磁防蔽效果遠優於習知的 塗佈導電介質摻合膠之膠帶。 (c) 可應丨1]於易伴/丨〔靜電環境之靜電消散,如潔淨室之 靜電消散安令地板或映像管背而線圈附近之靜電消散直接 導通至接地芘座用途上。 (d) 可作爲顯像螢幕或微波爐jt面玻璃窗的齒接靜窀導 通放電膠帶用。 (e) 適當選擇金屬層材質之導熱或導電特性,前者如鍍 22 本紙張尺度適用中國國家標準(CNS〉A4規格mo X 297公釐) --------「---- i------訂----l!i. (請先閱讀背面之沒意事項再填寫本頁) 4370 t. wff/00 5 A7 五、發明說明(>< ) 錫銅箱^彳芍熱係數,可作爲導熱連接膠帶,後者如鍍 銀或鍍金銅箔a有低電阻係數,可作爲導通連接器,以作 α接地與導窀迚接之用,H.本發明膠帶W打卨密度突狀表 面結構常適合具有不規則物件表面之貼合連接導通。 (f) 甫腦與各種電氣設備上的元件或配件若需要求有靜 電消散、接地、導通或同時見有導通與黏著時,則可使用 本發明之導嵬膠帶,若導電膠帶需與被黏著導通物表面形 成-體’則町藉由放遒加工,使突狀結構材料與被貼著物 金屬表面熔焊成一體,例如鍍錫銅箔導電膠帶。 (g) 本發明之導電導熱雙面膠帶,由於利用膠帶中之金 屬相直接與被貼物接觸,其導熱效率遠遠優於傅統使用之 導熱膏雒佈於鋁箔兩側,後者導熱膏屮大多使用具導熱性 與低比熱之粉末材料,例如氧化鋁或二氧化鈦粉末再摻混 於較絕緣性益分子材料中例如矽力康,由於一般高分了·材 料均爲熱不良導體與絕緣物,其熱傳導熱係數約在2x10-4(Cal/Cm2/cm/S/°C),此値遠遠低於金屬熱良導體、銅、錫、 金、銀的熱傳導熱係數,由0.9至1.5(cal/cm2/cm/s/°C)範 圍内,可見其熱傳導效率相差可達千倍以上。 (h) 以穿孔性基材,單一塑膠膜或金屬/塑膠膜複合膜, 兩側塗佈導電性膠,例如·側使用壓克力導電感壓膠,而 另…側塗佈益架橋度的環氧樹脂導電膠,如此使兩側膠層 貝-冇消散靜ΐϋ特性之表面阻抗値(RS)介於1〇()〜10n歐姆/平 方(Ω/ )與體桢m抗(Rv)介於10°〜109歐姆•公分(Dcm), !:ilJ垂舟薄膜方丨㈠之體積阳抗(Rv)則可以藉改變膠層厚 2 3 本紙張尺度適用中國國家標準(CNS)A4規格(21CU 297公釐) (請先閱婧背面之注意事項再填寫本頁) --------訂------I--線 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作杜印製 44255 4 ^ 3 7 〇 t V7 f f / 0 0 5 A7 _ B7 五、發明說明(y/) 度、遙材厚度與甲.位面積內穿透之總面積而得所需之電性 値,其體積阻抗値(Rv)介於丨0°〜〗〇9歐姆•公分(Ocm) ’ -般[ίΰ Γί體積町抗(Rv)與呀位面積上突贫之總面積成反比 關係,此處若使用蒸鍍鋁金屬之塑膠膜爲被輾壓成穿孔性 基材,則W結構上有一中間導電金屬層而使整體之導電途 徑的縮短,可以大副降低沿平行或垂直基材表面之表面與 體稍附抗値,WifnuJ以大幅減少導電介質的使用量即可達 到所欲得到電性之導電膠帶。 ⑴本發明之導電導熱膠帶因最外黏著表面上具有尖突 狀獨立島狀金屬結構,當與被貼合表面接合後則具有拋錨 防滑固定的特性。 (J)本發明之導電導熱膠帶具有類似布類表面特性,不 容易起皺折現象,也因此較無因受應力集中所形成之裂痕 現象。 (k) 本發明之導電導熱膠帶同時具有振動與聲择阻尼 (Damping) '減抑與消散作用,其中之黏膠層中之高分ΓΗ 料 Μ 有黏 彈特性 (viscoelasHchy)能 將外界 輸入之 機械能 阻尼轉化爲熱能,並藉鄰接金屬層的高熱傳導功能迅速散 掉此熱能,此處之金屬層办:結構丨:屬一強制性阻尼結構層 (constrained damping layer) uj有效提高其整體的阻能的效 (l) 本發明製造膠帶的方法,遠比傳統習知的方法具打 製程較簡單、精細與精密度高、輾壓輪無耗損、產能高與 製造成木低。 24 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公楚) ---------It — . ill----訂-------I (請先閱讀背面之注$項再填寫本頁) 4 3 70twft/'0 A7 B7 五、發明說明 雖然本發明已以由上述較佳實施例揭露,然其並非用 以限定本發明,仟何熟習此技藝者,在不脫離本發明之精 神和範圍內,當HJ作各種之更動與潤飾,因此本發明之保 護範圍當視後附之屮請專利範圍所界定者爲準。 -----:—.---- 裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 25 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)Then, a thermally conductive adhesive or conductive adhesive is placed on the exposed side of the substrate that is rolled into a concave shape by IL. Here, the adhesive can be any adhesive, such as acrylic, sand, rubber, and hot melt adhesive. , Epoxy resin, etc. It is recommended to use acrylic adhesive with good weather resistance, and the thermal and conductive medium can be alumina and metal nickel powder. Here, the thinner the thickness of the layer, the better. D The composite layer 30 tape coated with an adhesive layer on both sides is bonded to another bare substrate 11 with only the glue 11 roll through the extremely thin thermally conductive adhesive or conductive adhesive 206. Another bare substrate that passes the Z conductive tape 3 1 When the surface is adhered and pressed, the structure k is symmetrical and has a double-sided adhesive and conductive and thermally conductive adhesive tape 32. Please refer to Figure 7. If you want better conductive effect here, in practice, nj 'will apply the thermal or conductive adhesive 206 in full or partial zebra symmetry, and then use the symmetrical force to guide the heat. The inside of the adhesive or conductive adhesive 206 is folded in half to form a double-sided adhesive and conductive heat-conducting tape 33 similar to the one described in the above. 'There is a continuous metal phase at the edge of the structure of the double-sided conductive heat-conductive tape 33', so it will be better. Electrical conduction and thermal conduction effect, structure [: M is also provided in the factory. Strong mechanical anti-deformation structure, this embodiment can not be applied in the electronics industry when electronic components require thermal conduction adhesion and indirect or adhesive conduction of accessories, such as computers The heat conduction and heat dissipation of the central processor should be II. The embodiment is called a similar embodiment- · 1 丨 1 using a metal substrate 200. It is recommended to use tin and copper or tin-lead and copper composite metal foil, and apply one on one side. Adhesive layer 204, the choice of rubber M material depends on the best application of the year-old products is 屮, this paper size can be applied to 111 national standards (CNS) A4 specifications (210 X 297 mm)! ^ ---- ----- Order -------- Line ( Please read the notes on the back before filling this page.) 5. Description of the invention (M) Pure rubber, conductive or thermal adhesive, it is recommended to use pure rubber, and pure rubber can be any glue, such as Acrylic, Silicone, Rubber, Hot Melt (Please read the precautions on the back before filling in this page > Glue, Resin, etc .. After that, in practice, attach it on the other side of the adhesive layer 204. The release layer 205 can be a release film from a release paper. Then, a rolling operation is performed, such as using a diamond wheel, a diamond / bubble roller, a spiked wheel, or other The rolling machine is used for rolling. When rolling, its rolling / rolling is from the substrate and the side to the rubber layer, and when rolling, it forms 200 layers of extended and protruding metal substrate and presses through the rubber. Layer, the result is: a plurality of spiky structures are formed on the appearance of the metal substrate 200. Because these rolling machines are irregularly arranged, it is possible to form irregularly arranged structures on the metal substrate 200. Spike-shaped groove structure 210. In addition, the spiky-shaped groove knot can be adjusted according to the required conditions and conditions. The degree of 2 1 0 is small, for example, adjusting the scale, t size, density, and rolling pressure of the protrusions of the rollers of the roller mill machine. Here, from the side of the adhesive layer 204 of the adhesive layer 204 This metal spike-like F1 slot structure 210 penetrates the softer glue layer 204 and is independent of the metal spike-like island structure 211. When the remaining glue layer 204 passes, it is a continuous phase and surrounds the Intellectual Property Bureau of the Ministry of Economic Affairs. Employee consumer cooperatives printed isolated metal island-shaped island structures 2ΓΙ in four questions. Here, the surface of metal surface and viscous surface ffl should be used when this' surface 丨 π] is 1.) The upper part also provides / adheres to the function of heat conduction by contacting with metal. The height and distribution density of the protruding structure of the metal spiked island structure 211 can be adjusted according to the overflow condition. Height, distribution density and rolling pressure conditions. Next, wj made this conductive tape into a sheet-shaped conductive adhesive sheet. The paper size is applicable to the national standard (CNS) A4 specification (210 X 297 mm) 437〇twff / 0 'A7 B7 V. Description of the invention ( y) 400, here .. · The exposed metal surface side of the guide telescoping patch 400 is welded by electric discharge welding or conductive adhesive (not shown) to fix and adhere a male plug 4 0 4 (as shown in Figure 9). ) Or female azole 406 (as shown in Figure 8) on the metal piece of the connector 402, on the metal side of the conductive adhesive sheet 400, the male plug 404 or the female socket 406 is vertical (as shown in Figure 8 and (Shown in FIG. 9) or a parallel (not shown + shown) guide window sticker 400. Then attach an insulating tape or coating · insulating varnish (not shown) on the bonding piece 402 of the metal connector. 'In practical applications, you can weld the metal connector without X-force welding. Directly connect the metal connector with an insulating tape with an area larger than the area of the bonding sheet 402) V 420 can be bonded to the metal back of the guide pad 400 to achieve conduction, connection and fixation. For higher product quality, such as dielectric resistance, it is recommended to use W fixed welding. The two J4. Metal connectors with a male plug 404 and a female socket 406 can be applied to each other by using-wires as long-distance conductive conductors, which are extremely convenient in practice. This embodiment can be used in electronics Many applications such as equipment grounding, conductor conduction between components, static ground dissipation and conduction, etc., are even used in current signal detection connectors of monitoring instruments in medical equipment. Example 7: In a similar example, the base material 200 using metal is recommended, and it is recommended to use a composite gold foil with rhenium and copper or tin-lead and copper, 1 on the side cloth ... glue layer 204, glue layer material The selection is based on the best application of the product, which can be pure glue and conductive glue into thermal conductive glue. It is recommended to use pure glue. Pure knee is any kind of glue, such as acrylic glue, Silicone, rubber, hot-melt adhesive, epoxy resin, etc. After that, in practice, on the M ·. Side of the adhesive layer 204, this paper size is applicable to the Chinese National Standard (CNS) A4 specification (2i0 X 297 mm) ~ (Please read the precautions on the back before filling this page) Packing --- Ordering --------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 3 7 0 tv / ff / Ο Ο 5 A7 4 3 7 0 tv / ff / Ο Ο 5 A7 Economy Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau. 5. Description of the invention (β) Fitting 冇 · pharyngeal layer 205, the release layer 205 can be a release paper or a release film. Then, a W diamond wheel, a diamond platform rolling machine, a spiked wheel or other iL pressing table is used for rolling. In this embodiment, according to actual requirements, only selective area rolling is performed at this time, for example In the form of a stripe-like grid or an interval space of a center circle, etc. During rolling, the rolling direction is rolled from the side of the substrate to the adhesive layer. When the sister is rolled, an extended and protruding metal substrate 200 layer 11JM penetrating layer is formed. As a result, the appearance of the metal substrate 200 is formed. Plural spiky structures. Because these rolling machines have irregularly arranged protrusions, irregularly arranged spiky groove structures 210 can be formed on the metal substrate 200. In addition, the height and size of the spiky FI groove structure 210 are adjusted by rolling conditions according to the required conditions, such as adjusting the size, density, and rolling pressure of the protrusions of the rollers of the rolling machine. Here, from the glide side surface of the rubber calendar 204, there are areas to be rolled, similar to those described in the fourth embodiment, after the metal spike-shaped groove structure 210 penetrates the softer glue layer 204 It is an independent metal spiky island structure 211, and the adhesive surface of the remaining adhesive layer 204 is a continuous phase and surrounds the phases of the isolated metal spiky island structure 211, so as not to be rolled to In the area, the rubber layer provides full adhesion characteristics. This-an unrolled area of the rubber layer at the same time provides side barriers to prevent air from entering and contacting the metal kitchen. In addition, it vaporizes the internal metal layer surface. The surface has both a metal and a viscose surface structure. It is a special feature of the original structure that provides the functional characteristics of the contact between the metal and the metal when it is applied / removed. At noon, the degree and distribution density of the protruding structure of the metal spiked island structure 211 can be adjusted according to the needs. The size of this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). ------------ Install --- Order --------- Line C Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4370t.wff / 0 0 5 A7 V. Description of the invention () A degree, distribution density and rolling pressure conditions of the spikes on the wheel. The above-mentioned conductive adhesive tape with higher adhesive properties can be used in applications, and it can also be partially rolled in the unrolled area, and some of the bare area without the adhesive layer can be reserved, and this area can be used as a follow-up Where the welding and conduction are connected (the structure of this application is not shown), it can be known that the conductive thermal tape of the present invention can be based on the actual application site, such as conductivity or thermal conductivity, adhesion, electromagnetic wave shielding capacity, selective area Conductive or thermally conductive, selective area bare joints, etc. to set its final conductive thermal conductive tape combination. To sum up, the advantages of the spectral guiding tape of the present invention include: (a) The conductive tape can simultaneously provide the adhesive function and metal contact conduction characteristics on the-side of the tape. Because the protruding structure is intentionally distributed, and The distribution density is controlled and manufactured from dense to thin uniform pepper M, and it is very suitable for the surface of irregular to-be-adhered objects. (b) It can be used as an electromagnetic + disturbance shielding tape. Its protruding structure has a shielding effect similar to a honeycomb shape to provide vertical electromagnetic wave forward force, and because of the low impedance of the continuous metal phase, it makes it itself resistant to electromagnetic waves. The shielding effect is much better than the conventional adhesive tape coated with conductive medium. (c) It can be applied to the static electricity dissipating in the environment of static electricity, such as the static electricity dissipating in the clean room or the back of the image tube, and the static electricity dissipating near the coil can be directly conducted to the ground socket. (d) Can be used as a toothed static conduction discharge tape for a display screen or a jt-side glass window of a microwave oven. (e) Appropriate selection of the thermal or electrical properties of the metal layer material. For example, the former is coated with 22 paper. The Chinese standard (CNS> A4 size mo X 297 mm) is applicable. -------- 「---- i ------ Order ---- l! I. (Please read the unintentional matter on the back before filling in this page) 4370 t. Wff / 00 5 A7 V. Description of the invention (> <) Tin copper box ^ Thermal coefficient can be used as a thermally conductive connection tape. The latter, such as silver-plated or gold-plated copper foil a, has a low resistivity and can be used as a conductive connector for α ground and conductive connection. H. The tape of the present invention W The burp density protruding surface structure is often suitable for the connection of continuity with irregular object surfaces. (F) If the brain and components or accessories on various electrical equipment need to dissipate static electricity, ground, conduct or see continuity and When adhering, the conductive tape of the present invention can be used. If the conductive tape needs to form a body with the surface of the conductive material to be adhered, then the processing structure is fused to weld the protruding structure material to the surface of the metal of the adhered material. Integrated, such as tinned copper foil conductive tape. (G) The conductive and thermally conductive double-sided tape of the present invention The metal phase is in direct contact with the object. Its thermal conductivity is far better than the thermal conductive paste used by Fu Tong on both sides of aluminum foil. The latter thermal conductive paste mostly uses powder materials with thermal conductivity and low specific heat, such as alumina or titanium dioxide. The powder is then blended into a more insulating pro-molecule material such as Silicon. Because the materials are generally high in temperature, the materials are thermally poor conductors and insulators, and their thermal conductivity is about 2x10-4 (Cal / Cm2 / cm / S / ° C), which is much lower than the thermal conductivity of good thermal conductors of metal, copper, tin, gold, and silver. From 0.9 to 1.5 (cal / cm2 / cm / s / ° C), the thermal conductivity can be seen. The efficiency difference can be more than a thousand times. (H) With a perforated substrate, a single plastic film or a metal / plastic film composite film, apply conductive adhesive on both sides, for example, use acrylic conductive pressure-sensitive adhesive on the side, and … Coating epoxy conductive adhesive on the side, so that the surface impedance 値 (RS) of the shell- 胶 dissipation characteristics on both sides of the adhesive layer (RS) is between 10 () ~ 10n ohm / square (Ω /) and The body impedance (Rv) is between 10 ° and 109 ohms • cm (Dcm), and the volume positive impedance of the illuminating film square (垂: Rv), you can change the thickness of the adhesive layer 2 3 This paper size applies the Chinese National Standard (CNS) A4 specification (21CU 297 mm) (Please read the precautions on the back of Jing before filling this page) ------- -Order ------ I--Line Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Employee Co-operation Du printed 44255 4 ^ 3 7 〇t V7 ff / 0 0 5 A7 _ B7 5 、 Explanation of the invention (y /) degree, thickness of the remote material and the total area of penetration in the area of A. The required electrical property 値 is obtained, and its volume impedance 値 (Rv) is between 丨 0 ° ~ 〖〇09 ohm • Cm (Ocm) '-general [ίΰ Γί volume resistance (Rv) is inversely proportional to the total area of sudden poverty on the area, if the plastic film of aluminum metal is used as a perforated substrate , Then the W structure has an intermediate conductive metal layer to shorten the overall conductive path, which can greatly reduce the surface and body along the surface of the parallel or vertical substrate slightly attached to resist, WifnuJ can greatly reduce the amount of conductive medium used To achieve the desired electrical conductive tape.因 The conductive heat-conducting tape of the present invention has an independent island-like metal structure with a sharp protrusion on the outermost adhesive surface, and has the characteristics of anchoring, non-slip and fixed when joined to the surface to be bonded. (J) The conductive and thermally conductive tape of the present invention has a cloth-like surface characteristic, is not prone to wrinkling, and is therefore less likely to be cracked due to stress concentration. (k) The conductive and thermally conductive adhesive tape of the present invention has both vibration and acoustic selective damping (reducing and dissipating effects). The high score in the adhesive layer ΓΗ Material M has viscoelasHchy which can input the outside world. The mechanical energy damping is converted into thermal energy, and this thermal energy is quickly dissipated by the high heat conduction function of the adjacent metal layer. The metal layer here: Structure 丨: It is a constrained damping layer. Uj effectively improves its overall Energy blocking effect (l) The method for manufacturing the adhesive tape of the present invention is far simpler than traditional methods, and has a simpler manufacturing process, higher precision and precision, no loss of rolling wheels, higher productivity and lower manufacturing costs. 24 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 Gongchu) --------- It —. Ill ---- Order ------ I (please first Read the note on the back of the page and fill in this page) 4 3 70twft / '0 A7 B7 V. Description of the Invention Although the present invention has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention. In addition, without departing from the spirit and scope of the present invention, when HJ makes various modifications and retouching, the protection scope of the present invention shall be determined by the scope of the appended patent scope. -----: —.---- Install -------- Order --------- Line (Please read the notes on the back before filling this page) Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Employee Consumer Cooperatives 25 This paper is sized for China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

¥ 备5 4本 口 4 /TO t f2 /002 第~Wr〇8165號專利範圍修正本 A8 BB C8 D8 ;89. 7. 修正日期89/7/5 、由结氪各1益m ° 1.一種多功能導電導熱膠帶,包括下列結構: 一基材; 一第一膠層,位於該基材之一第二側,其中 該基材具有複數個不規則狀排列之突起狀凹槽,該 些突起狀凹槽於該基材之一第一側係呈現凹陷狀,且該 些突起狀凹槽相對於該基材之該第二側係呈現突起狀, 該些突起狀結構係穿透該第一膠層後呈獨立的複數個尖 突島狀結構,而該第一膠層則呈一連續相結構且環繞獨 立的該些尖突島狀結構,藉以使得該導熱導電膠帶能夠 同時提供黏著與電流導通或導熱的功能。 2. 如申請專利範圍第1項所述之導電導熱膠帶,其 中更包括具有一第一離型層位於該基材之該第二側,且 覆蓋該第一膠層。 3. 如申請專利範圍第2項所述之導電導熱膠帶,其 中更包括具有一第二膠層位於該基材之該第一側。 4. 如申請專利範圍第3項所述之導電導熱膠帶,其 中更包括具有一第二離型層位於該基材之該第一側,且 覆蓋該第二膠層。 5. 如申請專利範圍第1項所述之導電導熱膠帶 其 (請先閱讀背面之主意事項再填寫本頁) -------:--訂· I I---;----_ 經濟部智慧財產局員工消费合作社印製 中該基材爲一導電基材。 6.如申請專利範圍第5項所述之導電導 中該第一膠層爲一導電膠層。 丨 7.如申請專利範圍第5項所述之導電導熱膠帶; 第一膠層爲一非導電膠層。 i 帶,其 其中該 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公爱) 8888 ABCD 4370twf2/002 六、申請專利範圍 8. 如申請專利範圍第1項所述之導電導熱膠帶,其中 該基材爲一非導電基材。 9. 如申請專利範圍第8項所述之導電導熱膠帶,其中 該第一膠層爲一導電膠層。 10. —種導電導熱膠帶,包括下列結構: 一基材; 一膠層,位於該基材之一第二側,其中 該基材具有複數個不規則狀排列之突起狀開孔,該些 突起狀開孔相對於該基材之一第一側係呈現凹陷狀,且該 些突起狀開孔於該基材之該第二側係呈現突起狀,該些突 起狀開孔係穿透該膠層後呈獨立的複數個尖突島狀結構, 而該膠層其餘之面則呈一連續相結構且環繞獨立的該些尖 突島狀結構,藉以使得該導熱導電膠帶能夠同時提供黏著 與電流導通的功能。 11. 如申請專利範圍第10項所述之導電導熱膠帶,其 中更包括具有一第一離型層位於該基材之該第二側,且覆 蓋該第一膠層。 12. 如申請專利範圍第11項所述之導電導熱膠帶,其 中更包括具有一第二膠層位於該基材之該第一側。 13. 如申請專利範圍第12項所述之導電導熱膠帶,艽 中更包括具有一第二離型層位於該基材之該第一側,且覆 蓋該第二膠層。 14. 如申請專利範圍第10項所述之導電導熱膠帶,其 中該基材爲一導電基材。 (請先閱讀背面之注意事項再填寫本頁) -------1, — 訂.:----------- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4370twf2/002 A8 B8 C8 D8 六、申請專利範圍 15. 如申請專利範圍第14項所述之導電導熱膠帶,其 中該第一膠層爲一導電膠層。 16. 如申請專利範圍第14項所述之導電導熱膠帶,其 中該第一膠層爲一非導電膠層。 17. 如申請專利範圍第10項所述之導電導熱膠帶,其 中該基材爲一非導電基材。 18. 如申請專利範圍第17項所述之導電導熱膠帶,其 中該第一膠層爲一導熱膠層。 19. 一種導電導熱膠帶,包括下列結構: 一'基材; 一金屬層,位於該基材之一第二側上; 一第一膠層,位於該金屬層上,且位於該基材之該第 二側上,其中 該金屬層與該基材具有複數個不規則狀排列之突起狀 凹槽,該些突起狀凹槽於該基材之一第一側係呈現凹陷 狀,且該些突起狀凹槽於該基材之該第二側係呈現突起 狀,該些突起狀凹槽係穿透該膠層後呈獨立的複數個尖突 島狀結構,而該第一膠層則呈一連續相結構且環繞獨立的 該些尖突島狀結構,藉以使得該導熱導電膠帶能夠同時提 供黏著與電流導通的功能。 20. 如申請專利範圍第19項所述之導電導熱膠帶,其 中更包括具有一第一離型層位於該基材之該第二側,且覆 蓋該第一膠層。 21. 如申請專利範圍第20項所述之導電導熱膠帶,其 -------I----d------- 訂'------------線‘ (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 私紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) Λ4255A 4370twf2/002 A8 B8 C8 Π8 六 經濟部智慧財產局員工消費合作社印製 申請專利範圍 中更包括具有一第二膠層位於該基材之該第一側。 22. 如申請專利範圍第21項所述之導電導熱膠帶,其 中更包括具有一第二離型層位於該基材之該第一側,且覆 蓋該第二膠層。 23. 如申請專利範圍第19項所述之導電導熱膠帶,其 中該第一膠層爲一導電膠層。 24. 如申請專利範圍第19項所述之導電導熱膠帶,其 中該第一膠層爲一非導電膠層。 25. —種導電導熱膠帶,包括下列結構: 一基材; 一金屬層,位於該基材之一第二側; 一第一膠層,位於該金屬層上,且位於該基材之該第 二側,其中 該金屬層與該基材具有複數個不規則狀排列之突起狀 開孔,該些突起狀開孔於該基材之一第一側係呈現凹陷 狀,且該些突起狀開孔於該基材之該第二側係呈現突起 狀,該些突起狀開孔係穿透該第一膠層後呈獨立的複數個 尖突島狀結構,而該膠層則呈一連續相結構且環繞獨立的 該些尖突島狀結構,藉以使得該導熱導電膠帶能夠同時提 供黏著與電流導通的功能。 26. 如申請專利範圍第25項所述之導電導熱膠帶,其 中更包括具有一第二膠層位於該基材之該第一側。 27. 如申請專利範圍第26項所述之導電導熱膠帶,其 中更包括具有一第二離型層位於該基材之該第一側,且覆 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國囤家標準(CNS)A4規格(210 X 297公釐) A 3 4 5. 5 8888 ABCD 六、申請專利範圍 蓋該第二膠層。 28. 如申請專利範圍第25項所述之導電導熱膠帶,其 中該第一膠層爲一導電膠層。 29. 如申請專利範圍第25項所述之導電導熱膠帶,其 中該第一膠層爲一非導電膠層。 30. —種導電導熱膠帶,包括下列結構: 一第一膠層; 一第一基材與一第二基材,分別位於該第一膠層之一 第一側與一第二側; 一第二膠層,位於該第一膠層之該第一側且覆蓋該第 一基材;以及 一第三膠層,位於該第一膠層之該第二側且覆蓋該第 二基材,其中 該第一基材具有複數個不規則狀排列之第一突狀物, 該些第一突狀物係穿透該第二膠層後呈獨立的複數個第一 尖突島狀結構,而該第二膠層則呈一連續相結構且環繞獨 立的該些第一尖突島狀結構;以及 該第二基材具有複數個不規則狀排列之第二突狀物, 該些第二突狀物係穿透該第三膠層後呈獨立的複數個第二 尖突島狀結構,而該第三膠層則呈一連續相結構且環繞獨 立的該些第二尖突島狀結構。 31. 如申請專利範圍第30項所述之導電導熱膠帶,其 中該第一基材與第二基材爲導電材質。 32. 如申請專利範圍第31項所述之導電導熱膠帶,其 (請先閱讀背面之注意事項再填寫本頁) ^ --------訂--------i . 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用t國國家標準(CNS)A4規格(210 X 297公釐) 4370twf2/002 A8 B8 C8 D8 六、申請專利範圍 中該第一膠層、第二膠層與第三膠層爲導電膠。 33. 如申請專利範圍第31項所述之導電導熱膠帶,其 中該第一膠層、第二膠層與第三膠層爲非導電膠。 34. 如申請專利範圍第31項所述之導電導熱膠帶,其 中該第一膠層、第二膠層與第三膠層爲爲導熱膠。 35. 如申請專利範圍第30項所述之導電導熱膠帶,其 中更包括具有一第一離型層與第二離型層分別覆蓋該第二 膠層與第三膠層。 36. —種導電導熱膠帶,係由一第一膠帶與一第二膠帶 貼合而成,其中: 該第一膠帶包括一第一基材以及一第一膠層與第二膠 層分別位於該第一基材之兩側,該第一基材具有複數個不 規則狀排列之第一突狀物,該些第一突狀物係穿透該第一 膠層後呈獨立的複數個第一尖突島狀結構,而該第一膠層 則呈一連續相結構且環繞獨立的該些第一尖突島狀結構; 該第二膠帶包括一第二基材以及一第三膠層位於該第 二基材之一側,該基材具有複數個不規則狀排列之第二突 狀物,該些第二突狀物係穿透該第三膠層後呈獨立的複數 個第二尖突島狀結構,而該第三膠層則呈一連續相結構且 環繞獨立的該些第二尖突島狀結構;以及 該第一基材之該第二膠層係位在該第二基材之另一側 上。 37. 如申請專利範圍第36項所述之導電導熱膠帶,其 中該第一基材與第二基材爲導電材質。 {請先閱讀背面之注意事項再填寫本頁) · I I I I I ^--訂· I----J---I . 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A·!規格(210 X 297公t ) 4370twf2/002 AS B8 C8 D8 六、申請專利範- 38·如申請專利範圍第37項所述之導電導熱膠帶,其 中該第一膠層、第二膠層與第三膠層爲導電膠。 39.如申請專利範圍第37項所述之導電導熱膠帶,其 中該第一膠層、第二膠層與第三膠層爲非導電膠。 40-如申請專利範圍第37項所述之導電導熱膠帶,其 中該第一膠層與第二膠層爲非導電膠,且第三膠層爲導電 膠。 41. 如申請專利範圍第37項所述之導電導熱膠帶,其 中該第一膠層與第二膠層爲非導電膠,且第三膠層爲導熱 膠。 42. 如申請專利範圍第36項所述之導電導熱膠帶,其 中更包括具有一第一離型層與第二離型層分別覆蓋該第一 膠層與第三膠層。 43. —種導電導熱膠帶,係由單一之一膠帶彎曲貼合而 成’故該導電導熱膠帶之一端係呈現連接狀態,其中該膠 帶包括一基材以及一第一膠層與第二膠層分別位於該基材 之兩側’其中該基材具有複數個不規則狀排列之突狀物, 該些突狀物係穿透該第一膠層後呈獨立的複數個尖突島狀 結構’而該第一膠層則呈一連續相結構且環繞獨立的該些 尖突島狀結構。 44. 如申請專利範圍第43項所述之導電導熱膠帶,其 中該基材爲導電材質。 45. 如申請專利範圍第44項所述之導電導熱膠帶,其 中該第一膠層與第二膠層爲導電膠。 (諳先閱讀背面之注意事項再填寫本頁) ^--------„--訂 Γ----^---- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) d42554 4370twf2/002 A8 B8 C8 D8 六 經濟部智慧財產局員工消費合作社印製 申請專利範圍 46. 如申請專利範圍第44項所述之導電導熱膠帶,其 中該第一膠層與第二膠層爲非導電膠。 47. 如申請專利範圍第43項所述之導電導熱膠帶,其 中更包括具有一離型層覆蓋該第一膠層。 48. —種導電黏貼片,包括下列結構: 一金屬基材; 一結合片,固定於該金屬基材之一第一側,該結合片 具有一連接頭且該連接頭係電性連接該金屬基材;以及 一膠層,覆蓋該金屬基材之一第二側,其中 該金屬基材具有複數個不規則狀排列之突狀物,該些 突狀物係突出於該金屬基材之該第二側,且係穿透該膠層 後呈獨立的複數個尖突島狀結構,而該膠層則呈一連續相 結構且環繞獨立的該些尖突島狀結構,藉以使得該導電黏 貼片能夠同時提供黏著與電流導通的功能。 49. 如申請專利範圍第48項所述之導電導熱膠帶,其 中該膠層爲導電膠。 50. 如申請專利範圍第48項所述之導電導熱膠帶,其 中該膠層爲非導電膠。 51. 如申請專利範圍第48項所述之導電導熱膠帶,其 中該連接頭爲公插頭。 52. 如申請專利範圍第48項所述之導電導熱膠帶,其 中該連接頭爲母插座。 53. —種導電導熱膠帶之製造方法,係由單一之一膠帶 彎曲貼合而成,故該導電導熱膠帶之一端係呈現連接狀 <請先閱讀背面之ji意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公t ) c: R a 8 888 ABCD 4370twf2/002 、巾誚·專利範圍 態,該導電導熱膠帶的製造方法包括: (請先閱讀背面之注意事項再填寫本頁) 提供一膠帶,該膠帶包括一基材以及一第一膠層分別 位於該基材之一側,其中該基材具有複數個不規則狀排列 之突狀物,該些突狀物係穿透該第一膠層後呈獨立的複數 個尖突島狀結構,而該第一膠層則呈一連續相結構且環繞 獨立的該些尖突島狀結構。 塗佈一第二膠層覆蓋該基材之另一側: 彎曲該膠帶,藉以使得該第二膠層可貼合該膠帶。 54. 如申請專利範圍第53項所述之導電導熱膠帶之製 造方法,其中塗佈該第二膠層的步驟中,更包括覆蓋部分 的該基材表面,且該膠帶彎曲之後覆蓋有該第二膠層之該 基材表面係對應於未覆蓋有該第二膠層之該基材表面。 55. 如申請專利範圍第53項所述之導電導熱膠帶之製 造方法,其中塗佈該第二膠層的步驟中,更包括覆蓋該基 材的全部表面。 56. —種導電導熱膠帶之製造方法,包括: 提供一金屬基材: 形成一膠層覆蓋該金屬基材之一側; 提供一離型層覆蓋該膠層之一另一側;以及 經濟部智慧財產局員工消費合作社印製 進行一選擇性區域輾壓步驟,從該金屬基材之一另一 側朝覆蓋有該膠層之該金屬基材之該一側,選擇性區域輾 壓該金屬基材,並在該選擇性區域金屬基材上形成獨立的 複數個尖突島狀結構。 57. 如申請專利範圍第56項所述之導電導熱膠帶之製 本紙張尺度適用中國國家標準(CNS)A4規格(210x 297公釐) 六、申請專利範圍 造方法,其中該膠層係覆蓋該金屬基材之一部份區域,且 曝露出該金屬基材之一另一部份區域,以及該選擇性區域 輾壓步驟更包括使獨立的該些尖突島狀結構穿透該膠層, 藉以使得該區域膠層呈一連續相結構且環繞獨立的該些尖 突島狀結構,而且該金屬基材之該另一部份未覆蓋區域可 作爲焊接與導通連結之用。 58.如申請專利範圍第56項所述之導電導熱膠帶之製 造方法,其中該選擇性區域輾壓步驟更包括使獨立的該些 尖突島狀結構穿透部分的該膠層,藉以使得該膠層呈一連 續相結構且環繞獨立的該些尖突島狀結構。 (請先閲讀背面之注音?事項再填寫本頁) r衣_____ 訂··----.----線- 經,部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210x 297公釐)¥ Prepare 5 4 books 4 / TO t f2 / 002 No. ~ Wr〇8165 Patent scope revision A8 BB C8 D8; 89. 7. Date of revision 89/7/5, each 1 m from the conclusion. ° 1. A multifunctional conductive thermal tape includes the following structures: a substrate; a first adhesive layer located on a second side of the substrate, wherein the substrate has a plurality of irregularly arranged protruding grooves, and The protruding grooves are concave on a first side of the substrate, and the protruding grooves are protruding relative to the second side of the substrate. The protruding structures penetrate the first After an adhesive layer, there are independent spiky island-like structures, and the first adhesive layer has a continuous phase structure and surrounds the independent spiky island-like structures, so that the thermally conductive tape can simultaneously provide adhesion and adhesion. The function of current conduction or heat conduction. 2. The conductive and thermally conductive tape according to item 1 of the patent application scope, further comprising a first release layer on the second side of the substrate and covering the first adhesive layer. 3. The conductive thermal tape as described in item 2 of the patent application scope, further comprising a second adhesive layer on the first side of the substrate. 4. The conductive thermal tape described in item 3 of the scope of patent application, further comprising a second release layer located on the first side of the substrate and covering the second adhesive layer. 5. The conductive thermal tape as described in item 1 of the scope of patent application (please read the idea on the back before filling out this page) -------: --Order · I I ---; --- -_ The substrate is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as a conductive substrate. 6. The conductive layer according to item 5 of the patent application scope is a conductive layer.丨 7. The conductive thermal tape described in item 5 of the scope of patent application; the first adhesive layer is a non-conductive adhesive layer. i belt, in which the size of this paper is applicable to Chinese National Standard (CNS) A4 (210 x 297 public love) 8888 ABCD 4370twf2 / 002 6. Application scope of patent 8. Conductive thermal tape as described in item 1 of the scope of patent application Wherein the substrate is a non-conductive substrate. 9. The conductive and thermally conductive tape according to item 8 of the scope of patent application, wherein the first adhesive layer is a conductive adhesive layer. 10. A conductive thermal tape including the following structure: a substrate; an adhesive layer located on a second side of the substrate, wherein the substrate has a plurality of irregularly arranged protruding openings, and the protrusions The openings are recessed with respect to a first side of the substrate, and the protrusions are protruding from the second side of the substrate. The protrusions penetrate the glue. After the layer, there are independent spiky island-like structures, and the remaining surface of the adhesive layer has a continuous phase structure and surrounds the independent spiky island-like structures, so that the thermally conductive tape can provide adhesion and current at the same time. Continuity function. 11. The conductive thermal tape described in item 10 of the scope of patent application, further comprising a first release layer located on the second side of the substrate and covering the first adhesive layer. 12. The conductive and thermally conductive tape according to item 11 of the patent application scope, further comprising a second adhesive layer on the first side of the substrate. 13. The conductive and thermally conductive tape according to item 12 of the scope of the patent application, further comprising a second release layer on the first side of the substrate and covering the second adhesive layer. 14. The conductive thermal tape as described in item 10 of the scope of patent application, wherein the substrate is a conductive substrate. (Please read the notes on the back before filling out this page) ------- 1, — Order.:----------- Printed paper size by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 4370twf2 / 002 A8 B8 C8 D8 VI. Application for patent scope 15. The conductive thermal tape described in item 14 of the scope of patent application, where the first adhesive layer It is a conductive adhesive layer. 16. The conductive and thermally conductive tape according to item 14 of the scope of patent application, wherein the first adhesive layer is a non-conductive adhesive layer. 17. The conductive and thermally conductive tape according to item 10 of the patent application scope, wherein the substrate is a non-conductive substrate. 18. The conductive and thermally conductive adhesive tape according to item 17 of the scope of patent application, wherein the first adhesive layer is a thermally conductive adhesive layer. 19. A conductive and thermally conductive tape, comprising the following structures: a substrate; a metal layer on a second side of the substrate; a first adhesive layer on the metal layer and on the substrate On the second side, the metal layer and the substrate have a plurality of irregularly arranged protruding grooves. The protruding grooves are concave on one of the first sides of the substrate, and the protrusions The concave grooves are protruding on the second side of the substrate. The protruding grooves are independent of a plurality of pointed island structures after penetrating the adhesive layer, and the first adhesive layer is a The continuous phase structure surrounds the independent pointed island structures, so that the thermally conductive tape can simultaneously provide the functions of adhesion and current conduction. 20. The conductive and thermally conductive adhesive tape according to item 19 of the scope of patent application, further comprising a first release layer located on the second side of the substrate and covering the first adhesive layer. 21. According to the conductive thermal tape described in item 20 of the scope of patent application, its ------------------------- order '----------- -Line '(Please read the precautions on the back before filling this page) The standard for printing private paper printed by employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies to the Chinese National Standard (CNS) A4 (210x297 mm) Λ4255A 4370twf2 / 002 A8 B8 C8 Π8 The scope of patent application for printing by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs includes a second adhesive layer on the first side of the substrate. 22. The conductive and thermally conductive tape according to item 21 of the patent application scope, further comprising a second release layer located on the first side of the substrate and covering the second adhesive layer. 23. The conductive and thermally conductive tape according to item 19 of the scope of patent application, wherein the first adhesive layer is a conductive adhesive layer. 24. The conductive and thermally conductive tape according to item 19 of the scope of patent application, wherein the first adhesive layer is a non-conductive adhesive layer. 25. A conductive thermal tape comprising the following structure: a substrate; a metal layer on a second side of the substrate; a first adhesive layer on the metal layer and on the first portion of the substrate Two sides, wherein the metal layer and the substrate have a plurality of irregularly arranged protruding openings, and the protruding openings are concave on one of the first sides of the substrate, and the protruding openings The holes on the second side of the substrate are protruding, and the protruding openings are independent of a plurality of pointed island structures after penetrating the first glue layer, and the glue layer has a continuous phase. The structure and surrounds the independent spiky island-like structures, so that the thermally conductive tape can simultaneously provide the functions of adhesion and current conduction. 26. The conductive and thermally conductive tape according to item 25 of the patent application scope, further comprising a second adhesive layer on the first side of the substrate. 27. The conductive thermal tape described in item 26 of the scope of patent application, which further includes a second release layer located on the first side of the substrate and covered (please read the precautions on the back before filling this page) ) This paper size is in accordance with China Store Standard (CNS) A4 (210 X 297 mm) A 3 4 5. 5 8888 ABCD 6. The scope of patent application covers the second adhesive layer. 28. The conductive and thermally conductive adhesive tape according to item 25 of the scope of patent application, wherein the first adhesive layer is a conductive adhesive layer. 29. The conductive and thermally conductive tape according to item 25 of the scope of patent application, wherein the first adhesive layer is a non-conductive adhesive layer. 30. A conductive thermal tape including the following structure: a first adhesive layer; a first substrate and a second substrate, respectively located on a first side and a second side of the first adhesive layer; a first Two adhesive layers are located on the first side of the first adhesive layer and cover the first substrate; and a third adhesive layer are located on the second side of the first adhesive layer and cover the second substrate, wherein The first substrate has a plurality of irregularly arranged first protrusions, and the first protrusions are independent of a plurality of first sharp island structures after penetrating the second adhesive layer, and the The second adhesive layer has a continuous phase structure and surrounds the first spiky island-like structures; and the second substrate has a plurality of irregularly arranged second protrusions, and the second protrusions After the object penetrates the third glue layer, it has an independent plurality of second spike island structures, and the third glue layer has a continuous phase structure and surrounds the independent second spike island structures. 31. The conductive thermal tape as described in item 30 of the scope of patent application, wherein the first substrate and the second substrate are conductive materials. 32. As for the conductive thermal tape described in item 31 of the scope of patent application, (please read the precautions on the back before filling this page) ^ -------- Order -------- i. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the paper size is applicable to the national standard (CNS) A4 specification (210 X 297 mm) 4370twf2 / 002 A8 B8 C8 D8 6. The first rubber layer, the The second adhesive layer and the third adhesive layer are conductive adhesives. 33. The conductive and thermally conductive adhesive tape according to item 31 of the scope of the patent application, wherein the first adhesive layer, the second adhesive layer, and the third adhesive layer are non-conductive adhesive. 34. The conductive and thermally conductive adhesive tape according to item 31 of the scope of patent application, wherein the first adhesive layer, the second adhesive layer, and the third adhesive layer are thermally conductive adhesives. 35. The conductive thermal tape described in item 30 of the scope of patent application, further comprising a first release layer and a second release layer covering the second adhesive layer and the third adhesive layer, respectively. 36. A conductive and thermally conductive tape formed by bonding a first tape and a second tape, wherein: the first tape includes a first substrate and a first adhesive layer and a second adhesive layer respectively located on the On both sides of the first substrate, the first substrate has a plurality of irregularly arranged first protrusions, and the first protrusions are independent of the plurality of first protrusions after penetrating the first adhesive layer. Spiky island-like structures, and the first adhesive layer has a continuous phase structure and surrounds the independent first spiky island-like structures; the second tape includes a second substrate and a third gel layer is located on the One side of the second substrate, the substrate has a plurality of irregularly arranged second protrusions, and the second protrusions are independent second protrusions after penetrating the third glue layer. An island structure, and the third glue layer has a continuous phase structure and surrounds the independent second spike island structures; and the second glue layer of the first substrate is located on the second substrate On the other side. 37. The conductive and thermally conductive tape according to item 36 of the scope of patent application, wherein the first substrate and the second substrate are conductive materials. {Please read the precautions on the back before filling this page) · IIIII ^-Order · I ---- J --- I. The paper size printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies the Chinese national standard (CNS ) A ·! Specifications (210 X 297 Gt) 4370twf2 / 002 AS B8 C8 D8 VI. Patent Application-38 · The conductive thermal tape described in item 37 of the scope of patent application, wherein the first adhesive layer, the second The adhesive layer and the third adhesive layer are conductive adhesives. 39. The conductive and thermally conductive adhesive tape according to item 37 of the scope of the patent application, wherein the first adhesive layer, the second adhesive layer, and the third adhesive layer are non-conductive adhesive. 40- The conductive and thermally conductive adhesive tape according to item 37 of the scope of patent application, wherein the first adhesive layer and the second adhesive layer are non-conductive adhesives, and the third adhesive layer is a conductive adhesive. 41. The conductive and thermally conductive adhesive tape according to item 37 of the scope of the patent application, wherein the first adhesive layer and the second adhesive layer are non-conductive adhesives, and the third adhesive layer is a thermal conductive adhesive. 42. The conductive and thermally conductive tape according to item 36 of the patent application scope, further comprising a first release layer and a second release layer covering the first adhesive layer and the third adhesive layer, respectively. 43. A conductive heat conductive tape, which is formed by bending and bonding a single tape, so one end of the conductive heat conductive tape is in a connected state, wherein the tape includes a substrate and a first adhesive layer and a second adhesive layer Respectively located on two sides of the substrate 'wherein the substrate has a plurality of irregularly arranged protrusions, and the protrusions are independent of a plurality of pointed island structures after penetrating the first adhesive layer' The first glue layer has a continuous phase structure and surrounds the independent spiky island-like structures. 44. The conductive thermal tape described in item 43 of the scope of patent application, wherein the substrate is a conductive material. 45. The conductive and thermally conductive tape according to item 44 of the scope of patent application, wherein the first adhesive layer and the second adhesive layer are conductive adhesive. (谙 Please read the precautions on the back before filling in this page) ^ -------- „-Order Γ ---- ^ ---- The paper printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is applicable to this paper China National Standard (CNS) A4 specification (210 X 297 mm) d42554 4370twf2 / 002 A8 B8 C8 D8 Six employees of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a patent application scope 46. Electrical conductivity as described in item 44 of the scope of patent application The thermally conductive tape, wherein the first adhesive layer and the second adhesive layer are non-conductive adhesives. 47. The conductive thermally conductive adhesive tape according to item 43 of the patent application scope, further comprising a release layer covering the first adhesive layer. 48. A conductive adhesive sheet comprising the following structure: a metal substrate; a bonding sheet fixed on a first side of the metal substrate, the bonding sheet having a connector and the connector is electrically connected to the metal substrate And a glue layer covering a second side of the metal substrate, wherein the metal substrate has a plurality of irregularly arranged protrusions, the protrusions protruding from the first side of the metal substrate Two sides, and it is independent after penetrating the glue layer A plurality of spiked island-like structures, and the adhesive layer has a continuous phase structure and surrounds the independent spiked island-like structures, so that the conductive adhesive sheet can provide the function of adhesion and current conduction at the same time. 49. Such as The conductive and thermally conductive tape according to item 48 of the patent application, wherein the adhesive layer is conductive adhesive. 50. The conductive and thermally conductive tape according to item 48 of the patent application, wherein the adhesive layer is non-conductive adhesive. 51. If applying The conductive thermal tape described in item 48 of the patent, wherein the connector is a male plug. 52. The conductive thermal tape described in item 48 of the application, wherein the connector is a female socket. The manufacturing method of the tape is made by bending and bonding a single tape. Therefore, one end of the conductive tape is connected. ≪ Please read the notice on the back before filling this page.) This paper standard applies to Chinese national standards. (CNS) A4 specification (210 X 297 metric t) c: R a 8 888 ABCD 4370twf2 / 002, towel and patent scope, the manufacturing method of this conductive thermal tape includes: (Please read the back first Note: Please fill in this page again.) Provide an adhesive tape. The adhesive tape includes a substrate and a first adhesive layer on one side of the substrate. The substrate has a plurality of irregularly arranged protrusions. The protrusions have independent spiky island-like structures after penetrating the first glue layer, and the first glue layer has a continuous phase structure and surrounds the independent spike-like island structures. The second adhesive layer covers the other side of the substrate: the tape is bent so that the second adhesive layer can fit the tape. 54. The method for manufacturing a conductive and thermally conductive tape as described in item 53 of the patent application scope, wherein In the step of coating the second adhesive layer, it further includes a covering part of the surface of the substrate, and the surface of the substrate covered with the second adhesive layer after the tape is bent corresponds to the surface of the substrate not covered with the second adhesive layer. The substrate surface. 55. The method for manufacturing a conductive thermal tape as described in item 53 of the scope of patent application, wherein the step of coating the second adhesive layer further includes covering the entire surface of the substrate. 56. A method for manufacturing a conductive thermal tape, comprising: providing a metal substrate: forming an adhesive layer to cover one side of the metal substrate; providing a release layer to cover one side of the adhesive layer; and the Ministry of Economic Affairs The Intellectual Property Bureau employee consumer cooperative prints a selective area rolling step, from the other side of the metal substrate to the side of the metal substrate covered with the adhesive layer, the area is selectively rolled. A substrate, and an independent plurality of spiked island-like structures are formed on the selective region metal substrate. 57. The paper size of the conductive thermal tape as described in item 56 of the scope of the patent application is applicable to the Chinese National Standard (CNS) A4 specification (210x297 mm). 6. The method of applying for the patent scope, wherein the adhesive layer covers the metal. A part of the substrate, and another part of the metal substrate is exposed, and the selective area rolling step further includes passing the spiky island-like structures through the adhesive layer, thereby The adhesive layer in the region has a continuous phase structure and surrounds the individual spike-shaped island structures, and the uncovered area of the other part of the metal substrate can be used for welding and conducting connection. 58. The method for manufacturing a conductive thermally conductive tape according to item 56 of the scope of the patent application, wherein the selective area rolling step further includes making the spiky island-like structures penetrate the adhesive layer of the part independently, so that the The glue layer has a continuous phase structure and surrounds the individual pointed island structures. (Please read the phonetic on the back? Matters before you fill out this page) r Clothing _____ Order ·· ----.---- Line-Economic, Ministry of Intellectual Property Bureau Employees' Cooperatives Printed on this paper Standards apply Chinese national standards (CNS) A4 size (210x 297 mm)
TW088108165A 1999-04-05 1999-05-19 Multi-functional electrically and thermally conductive adhesive tape TW442554B (en)

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CN103360976B (en) * 2006-04-26 2016-08-03 日立化成株式会社 Splicing tape and use its solar module
KR100774440B1 (en) * 2007-01-17 2007-11-08 조인셋 주식회사 Conductive pressure sensitive adhesive tape
CN102118916B (en) * 2009-12-30 2013-10-09 昆山雅森电子材料科技有限公司 Heat-conducting covering film
CN102286254A (en) * 2011-05-06 2011-12-21 广州方邦电子有限公司 High-peeling-strength conductive adhesive film with through holes and preparation method thereof
CN103031074A (en) * 2011-09-29 2013-04-10 黄伟 Pressure-sensitive adhesive tape for heat conductivity and processing method
JP2013116929A (en) * 2011-12-01 2013-06-13 Nitto Denko Corp Conductive adhesive sheet, method for producing the same, collector electrode, and solar cell module
CN103072324A (en) * 2012-12-28 2013-05-01 深圳创怡兴实业有限公司 Electrostatic flocked product with stable impedance values
CN103331245B (en) * 2013-05-14 2015-04-08 京东方科技集团股份有限公司 Heat conduction glue film, fabrication method thereof, and OLED panel
US9669426B2 (en) 2013-05-14 2017-06-06 Boe Hyundai Lcd Inc. Heat conductive adhesive film, method for manufacturing the same and OLED panel
CN105419671B (en) * 2016-01-04 2019-01-04 京东方科技集团股份有限公司 A kind of adhesive tape and preparation method thereof, display device
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CN107316972A (en) * 2017-07-26 2017-11-03 苏长敏 Conductive tab and flame-retardant conductive tab component applied to lithium ion battery
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US4859189A (en) * 1987-09-25 1989-08-22 Minnesota Mining And Manufacturing Company Multipurpose socket

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WO2000059715A1 (en) 2000-10-12

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