411739 A7 __ B7 五、發明説明（I ) 發明領域： 本發明係有關於一種積體電路之基板，特別是指一 種具有高散熱效率之BGA基板結構及製程。 發明背景： 請參聞圖一所示，其係習知技術之積體電路封裝元 件10。包括一基板20、一晶片30、一封膠40以及複數個 錫球50，該晶片30係結合於基板20之一側面，其另一側 面係與複數個錫球50相耦合，此外，晶片30與基板20之 間係利用封膠40加以保護》 經濟部中失標準局員工消費合作社印裳 (請先閲攻背面之注意事吁再填寫本頁) 請參閱圈二所示，其係習知技術之散熱型基板20, 包括一基材201、一銅板材202、一絕緣層203、一第一電 路層204、一第二電路層205以及複數個導電栓206和導熱 栓207。該基材201之第一側面2011係舆一銅板材202相结 合，該第二電路層205係設於基板201之第二側面2012， 該第二電路層205表面更具有複數個錫球墊2051，該第二 電路層205表面係以一防焊漆22加以保護，並使得第二電 路層205表面之錫球墊2051暴露於外界；該絕緣層203係 結合於銅板材202之上，又該絕緣層203表面佈設有第一 電路層204，其上具有複數個打線墊2041，該第一電路層 204係利用一層防焊漆21加以保護，並使得打線墊2041暴 露於外界以便與晶片30之電路佈局相耦合；上述複數個 導電栓206以及導熱栓207係貫穿該基板20，其中第一、 第二電路層204、205之間係利用複數個導電栓206相連 結，但是為了避免發生短路現象，導電栓206與銅板材 -------2--- 本紙張尺度適用中國國家標準（CNS ) A4規格（公釐） 經濟部中央標準局貝工消费合作杜印装 411739 A7 _______B7 五、發明説明（>) 202之間係利用絕緣樹脂208加以阻隔；又上述導熱栓2〇7 係連接於晶片30與第二電路層205之間，其中晶片30所產 生之熱量係藉由導熱栓207、銅板材202及踢球50傳遞至 外界。 雖然習知技術具有複數個導熱栓207以及一銅板材 202，使晶片30的熱量可以經由導熱栓207和銅板材202傳 送至外界，然而其散熱效果仍然不是很好，究其原因， 主要是因為習知技術基板20舆晶片30之間係藉由複數個 導熱栓207將熱傳遞至銅板材202再排放至外界，導電栓 207與晶片30係為點接觸，可供晶片30將熱傳導至外界之 截面積不大，相對地散熱效果也會減少，此外，以習知 技術之基板20在對晶片30進行封裝後所獲得之封裝元 件，其厚度較大，市場的競爭力較差。 發明目的： 本發明之主要目的在於提供一種具有高散熱效率之 BGA基板結構，以該基板對晶片進行封裝所獲得之封裝 元件可以將晶片產生的熱量順利地被排放至外界，以提 高晶片的可靠度。 本發明之另一目的在於提供一種BGA基板結構’以 該基板對晶片進行封裝所獲得之封裝元件具有厚度更薄 之優點，以提高市場的競爭力。 本發明之BGA基板結構包括一基材、一銅板材(或導 熱材）、一絕緣層、一第一電路層、一第二電路層、複數 個導電栓以及複數個導熱栓。 本紙張尺度適用中國國家標準（CNS) μ現格（2〗(ά297公釐） ---------种衣----；--1Τ------^ (免先閣讀#-面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 ^11739 A7 ________B7 五、發明説明（)） 該基材具有第一側面和第二侧面，其中在該基板之第 二側面設有一第二電路層；該銅板材係結合於基材之第 一側面’其主要用途係做為基板之散熱板；該絕緣層係 結合於銅板材之上，其中該絕緣層在其中間處形成有一 矩形開口槽，該開口槽可將晶片容納於其中，並使晶片 結合於銅板材之上；又該絕緣層表面設有一第一電路 層；上述複數個導電拴係貫穿絕緣層、銅板材以及基材 並使第一電路層和第二電路層導通，其中該導電栓在貫 穿銅板材時’導電栓與銅板材之間並不直接接觸，而是 以絕緣樹脂膠加以阻隔以避免發生短路現象；上述複數 個導熱栓係貫穿基材並連接於銅板材和第二電路層之 間。 本發明之BGA基板結構在封裝時，晶片係容置於絕緣 層之開口槽内部並結合於銅板材之上，由於晶片與銅板 材之間係為直接面接觸，晶片與銅板材之間可供熱量傳 導的面積較習知技術大，熱量可以藉由銅板材和導熱板 傳遞至外界，其散熱效果將較習知技術更佳。 本發明所提供之基板在絕緣層中間設有一矩形開口 槽’晶片係容置於該矩形開口槽之中並結合於銅板材之 上’而習知技術係將晶片直接結合於絕緣層之上，故以 本發明之基板進行封裝所獲得之封裝元件較習知技術減 少一層絕緣層之厚度’因此可以獲得較薄之封裝元件。 為了使貴審查委員對本發明之目的、特徵及功效， 有更進一步的瞭解與認同’茲配合圖式詳加說明如后： 本紙張尺度適财關家辟（CNS) Α·_ (21G4X297公釐） ---------择----一--1T------1 *- (疼先閱讀#面之注意事項再填寫本頁) A7 B7 經濟部中央標準局員工消費合作社印製 411739 五、發明説明（★) 圖式之簡單說明： 圖一係習知技術之積體電路封裝元件之示意圖 圖二係習知技術之基板示意圖。 圖三係本發明BGA基板結構示意圖。 圖四A〜四F係本發明BGA基板製程示意圖。 圖式中之圖號說明： 10〜積體電路封裝元件 20~基板 201〜基材 2011-第一側面 2012〜第二側面 202~銅板材 203~絕緣層 204«第一電路層 2041〜打線墊 205~第二電路層 2051~錫球墊 206~導電栓 2〇7~導熱栓 208~絕緣樹脂 21〜防焊漆 22~防焊漆 30~晶片 40〜封膠 50~錫球 60〜基板 61~基材 611~第一侧面 612〜第二側面 62~銅板材 63~絕緣層 631〜開口槽 64~導電栓 65~導熱栓 66~第一電路層 66a~面銅 661~打線墊 67~第二電路層 68~防焊漆 68a~面銅 69〜防焊漆 本紙張尺度適用中國國家標準（CNS ) A4規格（2151X 297公釐） 411739 A7 ___B7 _ 五、發明説明（ί ) 詳細說明： 請參聞圖三所示，本發明BGA基板60結構包括：一 基材61、一銅板材62(或導熱材）、一絕緣層63、複數個導 電栓64以及複數個導熱栓65。 該基材61係為一絕緣之平板材，具有第一側面611 和第二側面612，在該基材61之第二側面612佈設有第二 電路層67，其中該第二電路層67表面具有複數個鍍上鎳 金材質之錫球墊671，且該第二電路層67係利用一防焊漆 68加以保護，並使得第二電路層67表面之錫球墊671暴露 於外界，以便使錫球可以順利地焊於其上； 該銅板材62係結合於基材61之第一側面611上，其 主要目的係做為散熱板，以便將晶片30所產生之熱量傳 導至外界； 經濟部中夬標準局貝工消費合作社印製 (請先^之注意事項再与寫本頁) 該絕緣層63在其中間具有一方形開口槽631，該絕 緣層63之一側面係結合於銅板材62上，其另一側面佈設 有第一電路層66，其中該第一電路層66表面具有複數個 鍍上鎳金材質之打線墊661，且該第一電路層66表面係利 用一防焊漆69加以保護，但是其上之複數個打線墊661係 暴露於外界以便舆晶片30之電路佈局耦合； 上述複數個導電栓64係貫穿基材61、銅板材62以及 絕緣層63，並使第一、第二電路層66、67成互相導通之 狀態，又為了避免導電栓64舆銅板材62之間因為接觸而 發生短路現象，該銅板材62在導電栓64貫穿之處係形成 孔徑較導電栓64為大之面孔，且該圓孔内部填充有絕緣 本紙張尺度適用中國國家標準（CNS ) Α4规格（2&Χ297公釐） 經濟部中夬橾隼局負工消費合作杜印製 ^ 421730 A7 A7 B7 五、發明説明（b) 樹脂膠以避免銅板材62和導電栓64接觸而造成短路。 上述複數個導熱栓65係貫穿基材61並使第二電路層 67和銅板材62之間成導通狀態》 本發明之BGA基板60在進行晶片30封裝時，係將晶 片30容置於絕緣層63之矩形開口槽631中並使晶片30結合 於銅板材62之上。其中在晶片30舆基板60之铜板材62兩 者之間係為直接面接觸，因此本發明之基板6〇可供晶片 30傳導熱量之截面積較習知技術為大，散熱效果也較習 知技術為佳，又由於本發明之基板60在絕緣層63中間設 有一方形開口槽631，晶片30係容置於開口槽631之中並 結合於銅板材62之上，與習知技術將晶片30結合於絕緣 層203相較，以本發明所獲得的封裝元件將較習知技術減 少一層絕緣層203之厚度，因此厚度較薄，市場的競爭力 較高。 以上所述係為本發明之BGA基板在結構部分之詳細 說明，其製程部分將由下列說明加以詳述，其中目前在 市場上已有複合基材和背膝銅箔(Resin Coated Copper)的 產品開發出來，該複合基材係由一絕緣材質之基材和一 層厚度較厚之銅板材以及一層厚度較薄之面铜複合而 成，其中該銅板材和面銅係分別設於基材之兩側面；該 背膠銅箔係將一層面銅設置於絕緣層(例如膠片）之一側表 面上。本發明之BGA基板在製程部分係引用現有的複合 基材和背膠銅箔做為BGA基板之製程材料’以加速BGA 基板的製造速率。 玉紙張尺度適用中國國家標準（CNS) A4規格（2ldx297公釐） I I I ! I ^ J J— ^ I H — …·备 (梦AN諺背面之注^^項再填寫本頁) 411739 A7 B7 五、發明説明（q ) 請參閱圖四A~®F所示，本發明之BGA基板60其製程 包括下列步驟： (a) 提供一複合基材，該複合基材係由一基材61和一層厚 度較厚之銅板材62以及一層厚度較薄之面銅67a複合而 成，其中該銅板材62和面銅67a係分別設於基材之兩側 面； (b) 對上述銅板材62進行蝕刻以形成複數個圓孔，其中上 述圓孔之深度係到達基材61表面； (c) 將中間具有矩形開口槽631之背膠銅箔壓合於銅板材62 之上，其中該背膠銅箔係包括一絕緣層63和一面銅 66a，並利用該絕緣層63壓合於銅板材62表面，在壓合 過程中絕緣層63之樹脂膠可以將銅板材62之圓孔填 滿； 經濟部中央標準局員工消費合作社印製 (請戎閱讀背面之注意事項再填寫本頁) (d) 設置複數個導電栓64以及複數個導熱栓65，其中該導 電栓64係貫穿基材61、銅板材62之圓孔以及絕緣層 63，該導熱栓65係貫穿基材61，且該導電栓64之直徑 係較銅板材62之圓孔孔徑為小，因此導電栓64與銅板 材62之間並不直接接觸，因此不會有短路之問題產 生； ⑹用蝕刻形成線路之方法分別在面銅66a、67a表面形成 第一電路層66和第二電路層67，其中第一、第二電路 層66、67之間係利用複數個導電栓64導通，而導熱栓 65係連接於第二電路層67與銅板材62之間； (f)將一層防焊漆69覆蓋於第一電路層66之上並使其上之 本紙張尺度適用中國國家標準（CNS ) A4規格（21也297公釐） 經濟部中央標準局負工消費合作社印裝 411739 五、發明説明（疒） 打線墊661曝露於外界，再將一層防焊漆68複蓋於第二 電路層67之上並使其上之複數個錫球墊671暴露於外 界。 其中步驟(c)係先對銅板材62進行表面粗化之後再進 行壓合，步驊(d)之導電栓64與導熱栓65的設置係以鐄孔 方式在預定之位置鑽出貫穿孔，再以電鍍方式將銅鍍在 貫穿孔壁及其外層表面，又步驊(f)在利用防焊漆進行電 路層之覆蓋時，並同時對導電栓64與導熱栓65進行塞 孔。此外，第一電路層66之打線墊661和第二電路層67之 錫球墊671係以鍍上鎳金之方式所完成。 综上所述，本發明之BGA基板60在結構及製程上舆 習知技術相較具有下列之優點： (a) 本發明之基板60在絕緣層63中央設有一矩形開口槽 631，晶片30係容置於其中並結合於銅板材62之上，而 習知技術係結合於樹脂層203之上，因此本發明可獲得 較薄之封裝元件。 (b) 本發明係將晶片30直接結合於基扳60之銅板材62之 上，該基板60可供晶片30傳導熱量之截面積遠較習知 技術大，因此散熱效果更佳》 (c) 本發明之基板60在製程上係應用現有之複合基材和背 膠銅箔直接壓合而成，因此基板60的製造速率大幅提 昇。 當然，以上所述僅為本發明BGA基板結構及製程之 一較佳實施例，並非用α限制本發明之實施範圍，任何 本紙張尺度適用中國國家標準（CNS ) Α4说格（2巧><297公釐） ----------^------ΐτ------^ (锖先Ϊ5讀背面之注意事項袅ik寫本頁) 411739 a? B7 五、發明説明（q ) 熟習該項技藝者在不違背本發明之精神所做之修改，均 應屬於本發明之範圍，因此本發明之保護範圍當以下列 所述之申請專利範圍做為依據。 ----------^----.— 'U------^ (請先'M讀背面之注意事項苒执寫本頁) 經濟部中央標準局員工消費合作社印策 本紙張尺度適用中國國家橾準（CNS ) A4说格（2〖QX297公釐）411739 A7 __ B7 V. Description of the Invention (I) Field of the Invention: The present invention relates to a substrate for an integrated circuit, and particularly to a BGA substrate structure and manufacturing process with high heat dissipation efficiency. BACKGROUND OF THE INVENTION: Please refer to FIG. 1, which is an integrated circuit package element 10 of a conventional technology. It includes a substrate 20, a wafer 30, a glue 40, and a plurality of solder balls 50. The wafer 30 is coupled to one side of the substrate 20, and the other side thereof is coupled to the plurality of solder balls 50. In addition, the wafer 30 It is protected by the sealant 40 between the substrate and the substrate 20. "Ink Chang, Consumer Consumption Cooperative of Employees of the Bureau of Standards and Loss of Standards, Ministry of Economic Affairs (please read the cautions on the back of the attack, and then fill out this page). The heat-dissipating substrate 20 of the technology includes a substrate 201, a copper plate 202, an insulating layer 203, a first circuit layer 204, a second circuit layer 205, and a plurality of conductive pins 206 and thermal pins 207. The first side 2011 of the substrate 201 is combined with a copper plate 202, the second circuit layer 205 is provided on the second side 2012 of the substrate 201, and the surface of the second circuit layer 205 has a plurality of solder ball pads 2051. The surface of the second circuit layer 205 is protected by a solder resist 22, and the solder ball pad 2051 on the surface of the second circuit layer 205 is exposed to the outside; the insulating layer 203 is bonded to the copper plate 202, and A first circuit layer 204 is disposed on the surface of the insulating layer 203 and has a plurality of wire bonding pads 2041 thereon. The first circuit layer 204 is protected by a layer of solder resist 21 and the wire bonding pads 2041 are exposed to the outside to communicate with the wafer 30. The circuit layout is coupled; the plurality of conductive pins 206 and the thermal pins 207 pass through the substrate 20, wherein the first and second circuit layers 204 and 205 are connected by a plurality of conductive pins 206, but in order to avoid a short circuit phenomenon , Conductive bolt 206 and copper plate ------- 2 --- This paper size is applicable to Chinese National Standard (CNS) A4 (mm). The Central Bureau of Standards of the Ministry of Economic Affairs, Shellfish Consumer Cooperative Du printed 411739 A7 _______B7 5 Invention description >) 202 is insulated by insulating resin 208; the above-mentioned thermal conductive plug 207 is connected between the wafer 30 and the second circuit layer 205, wherein the heat generated by the wafer 30 is through the thermal conductive plug 207, copper The board 202 and the kick ball 50 are transmitted to the outside world. Although the conventional technology has a plurality of thermally conductive pins 207 and a copper plate 202, so that the heat of the wafer 30 can be transmitted to the outside via the thermally conductive pins 207 and the copper plate 202, the heat dissipation effect is still not good. The reason is mainly due to the It is known that the substrate 20 and the wafer 30 transfer heat to the copper plate 202 through a plurality of thermally conductive plugs 207 and then discharge the heat to the outside. The conductive plugs 207 and the wafer 30 are in point contact for the chip 30 to conduct heat to the outside. The area is small, and the heat dissipation effect will be relatively reduced. In addition, the packaged components obtained by packaging the wafer 30 with the conventional substrate 20 have a larger thickness and are less competitive in the market. Object of the invention: The main object of the present invention is to provide a BGA substrate structure with high heat dissipation efficiency. The packaged components obtained by packaging the wafer with the substrate can smoothly discharge the heat generated by the wafer to the outside, so as to improve the reliability of the wafer. degree. Another object of the present invention is to provide a BGA substrate structure. The package element obtained by packaging the wafer with the substrate has the advantage of being thinner, so as to improve the competitiveness of the market. The BGA substrate structure of the present invention includes a substrate, a copper plate (or a thermal conductive material), an insulating layer, a first circuit layer, a second circuit layer, a plurality of conductive bolts, and a plurality of thermally conductive bolts. This paper size applies the Chinese National Standard (CNS) μ Appearance (2〗 (ά297mm) --------- Seeds --------- 1T ------ ^ (Free first格 读 # -Notes on the side, please fill out this page) Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs ^ 11739 A7 ________B7 V. Description of the invention ()) The substrate has a first side and a second side, where the substrate The second side is provided with a second circuit layer; the copper plate is bonded to the first side of the substrate; its main use is as a heat sink for the substrate; the insulating layer is bonded to the copper plate, where the insulating layer A rectangular open slot is formed at the middle of the slot, the open slot can accommodate the wafer therein, and the wafer is bonded to the copper plate; the surface of the insulating layer is provided with a first circuit layer; the above-mentioned plurality of conductive tethers penetrate the insulation Layer, copper plate and substrate and make the first circuit layer and the second circuit layer conductive, wherein the conductive plug does not directly contact the conductive plug and the copper plate when it penetrates the copper plate, but is blocked by an insulating resin glue. To avoid short circuit; Throughout the substrate and is connected between the copper sheet and the second circuit layer. When the BGA substrate structure of the present invention is packaged, the wafer is housed inside the open slot of the insulating layer and is bonded to the copper plate. Since the wafer and the copper plate are in direct surface contact, the wafer and the copper plate are available for The area of heat conduction is larger than the conventional technology. The heat can be transferred to the outside through the copper plate and the heat conducting plate, and its heat dissipation effect will be better than the conventional technology. The substrate provided by the present invention is provided with a rectangular opening groove in the middle of the insulating layer. 'The wafer is accommodated in the rectangular opening groove and bonded to the copper plate.' The conventional technology is to directly bond the wafer to the insulating layer. Therefore, the packaged component obtained by packaging with the substrate of the present invention reduces the thickness of an insulating layer compared with the conventional technology, and thus a thinner packaged component can be obtained. In order for your reviewers to have a better understanding and approval of the purpose, features and effects of the present invention, I will explain it in detail with the drawings as follows: This paper size is suitable for financial affairs (CNS) Α · _ (21G4X297mm) ) --------- Choose ---- One--1T ------ 1 *-(Pain first read the notes on #face before filling out this page) A7 B7 Staff of Central Standards Bureau, Ministry of Economic Affairs Printed by a consumer cooperative 411739 V. Description of the invention (★) A brief description of the drawing: Figure 1 is a schematic diagram of a conventional integrated circuit package component. Figure 2 is a schematic diagram of a substrate of the conventional technology. FIG. 3 is a schematic structural diagram of a BGA substrate according to the present invention. FIGS. 4A to 4F are schematic diagrams of the manufacturing process of the BGA substrate of the present invention. Explanation of drawing numbers in the drawings: 10 ~ Integrated circuit packaging components 20 ~ Substrate 201 ~ Substrate 2011-First side 2012 ~ Second side 202 ~ Cu plate 203 ~ Insulation layer 204 «First circuit layer 2041 ~ Wire pad 205 ~ Second circuit layer 2051 ~ Ball pad 206 ~ Conductive plug 207 ~ Conductive plug 208 ~ Insulating resin 21 ~ Solder varnish 22 ~ Solder varnish 30 ~ Chip 40 ~ Seal 50 ~ Ball 60 ~ Substrate 61 ~ Substrate 611 ~ First side 612 ~ Second side 62 ~ Copper plate 63 ~ Insulation layer 631 ~ Opening slot 64 ~ Conductive plug 65 ~ Thermally conductive plug 66 ~ First circuit layer 66a ~ Surface copper 661 ~ Wire pad 67 ~ Second circuit layer 68 ~ solderproof paint 68a ~ copper 69 ~ solderproof paint The paper size is applicable to Chinese National Standard (CNS) A4 specification (2151X 297 mm) 411739 A7 ___B7 _ V. Description of the invention (ί) Details: Please As shown in FIG. 3, the structure of the BGA substrate 60 of the present invention includes a substrate 61, a copper plate 62 (or a thermally conductive material), an insulating layer 63, a plurality of conductive pins 64, and a plurality of thermal pins 65. The substrate 61 is an insulating flat material, and has a first side surface 611 and a second side surface 612. A second circuit layer 67 is disposed on the second side surface 612 of the substrate 61. The surface of the second circuit layer 67 has A plurality of nickel-gold-plated solder ball pads 671, and the second circuit layer 67 is protected by a solder resist 68, and the solder ball pads 671 on the surface of the second circuit layer 67 are exposed to the outside in order to make tin The ball can be smoothly soldered to it; the copper plate 62 is bonded to the first side 611 of the substrate 61, and its main purpose is to serve as a heat sink to conduct the heat generated by the chip 30 to the outside; in the Ministry of Economic Affairs印 Printed by the Standard Bureau Shellfish Consumer Cooperative (please note ^ before writing this page) The insulating layer 63 has a square opening slot 631 in the middle, and one side of the insulating layer 63 is bonded to the copper plate 62 A first circuit layer 66 is arranged on the other side of the first circuit layer 66. The surface of the first circuit layer 66 has a plurality of wire pads 661 plated with nickel gold, and the surface of the first circuit layer 66 is coated with a solder resist 69. Protection, but the multiple wire pads 661 on it are violent To the outside to facilitate the coupling of the circuit layout of the chip 30; the plurality of conductive pins 64 penetrate the substrate 61, the copper plate 62, and the insulating layer 63, and make the first and second circuit layers 66 and 67 in a conductive state with each other, and In order to avoid the short circuit between the conductive plug 64 and the copper plate 62 due to contact, the copper plate 62 forms a face with a larger diameter than the conductive plug 64 at the place where the conductive plug 64 penetrates, and the inside of the round hole is filled with an insulating substrate. Paper size applies Chinese National Standard (CNS) A4 specification (2 & × 297 mm) Printed by Duozhuan Consumer Cooperative, Ministry of Economic Affairs ^ 421730 A7 A7 B7 V. Description of the invention (b) Resin glue to avoid copper sheet 62 is in contact with the conductive plug 64 to cause a short circuit. The plurality of thermally conductive plugs 65 penetrate the base material 61 and make a conductive state between the second circuit layer 67 and the copper plate 62. When the BGA substrate 60 of the present invention is packaged with the wafer 30, the wafer 30 is accommodated in the insulating layer 63. The rectangular opening groove 631 allows the wafer 30 to be bonded to the copper plate 62. Among them, the copper plate 62 of the wafer 30 and the substrate 60 are in direct surface contact. Therefore, the cross-sectional area of the substrate 60 for conducting heat of the wafer 30 of the present invention is larger than the conventional technology, and the heat dissipation effect is also more conventional. The technology is better, and because the substrate 60 of the present invention is provided with a square opening groove 631 in the middle of the insulating layer 63, the wafer 30 is accommodated in the opening groove 631 and combined with the copper plate 62, and the conventional technology uses the wafer 30 Compared with the insulating layer 203, the package element obtained by the present invention will reduce the thickness of an insulating layer 203 compared with the conventional technology, so the thickness is thinner and the market competitiveness is higher. The above is a detailed description of the structural part of the BGA substrate of the present invention, and the process part will be described in detail by the following description. Among them, there are currently product developments of composite substrates and Resin Coated Copper on the market. The composite substrate is composed of a substrate of insulating material, a layer of thicker copper plate, and a layer of thinner copper. The copper plate and the copper are respectively located on the two sides of the substrate. ; The adhesive-backed copper foil is provided with a layer of copper on one side surface of an insulating layer (such as a film). In the process part of the BGA substrate of the present invention, the existing composite substrate and the adhesive-backed copper foil are used as the process material of the BGA substrate to accelerate the manufacturing rate of the BGA substrate. Jade paper scales are in accordance with Chinese National Standard (CNS) A4 (2ldx297 mm) III! I ^ JJ— ^ IH —… · Prepared (Note ^^ on the back of the dream AN proverb, fill this page again) 411739 A7 B7 V. Invention Explanation (q) Please refer to FIG. 4A ~ F. The manufacturing process of the BGA substrate 60 of the present invention includes the following steps: (a) A composite substrate is provided. The composite substrate is composed of a substrate 61 and a layer having a relatively thick thickness. A thick copper plate 62 and a thin layer of copper 67a are compounded, wherein the copper plate 62 and the copper 67a are respectively provided on both sides of the substrate; (b) the above copper plate 62 is etched to form a plurality Round holes, wherein the depth of the above-mentioned round holes reaches the surface of the substrate 61; (c) pressing the adhesive-backed copper foil having a rectangular opening groove 631 in the middle onto the copper plate 62, wherein the adhesive-backed copper foil includes a The insulating layer 63 and one side of copper 66a are pressed against the surface of the copper plate 62 with the insulating layer 63. During the lamination process, the resin glue of the insulating layer 63 can fill the round holes of the copper plate 62; employees of the Central Standards Bureau of the Ministry of Economic Affairs Printed by Consumer Cooperatives (Please read the notes on the back and fill in this page) (d) A plurality of conductive plugs 64 are provided, and a plurality of thermally conductive plugs 65 are provided. The conductive plugs 64 pass through the substrate 61, the circular holes of the copper plate 62, and the insulating layer 63. The thermally conductive plugs 65 pass through the substrate 61, and the conductive plugs 64. The diameter is smaller than the round hole diameter of the copper plate 62, so the conductive plug 64 and the copper plate 62 are not in direct contact, so there will be no short circuit. ⑹ The method of forming a line by etching is on the copper 66a. A first circuit layer 66 and a second circuit layer 67 are formed on the surfaces of 67a and 67a. The first and second circuit layers 66 and 67 are electrically connected by a plurality of conductive pins 64, and the thermally conductive pins 65 are connected to the second circuit layer 67. And copper plate 62; (f) Cover a layer of solder resist 69 on the first circuit layer 66 and make the paper size on it conform to the Chinese National Standard (CNS) A4 specification (21 also 297 mm) Economy Printed by the Central Bureau of Standards, Consumer Cooperatives 411739 V. Description of the Invention (疒) The wire pad 661 is exposed to the outside, and then a layer of solder resist 68 is covered on the second circuit layer 67 and a plurality of tins is placed on it. The ball pad 671 is exposed to the outside world. In step (c), the surface of the copper plate 62 is roughened before pressing, and the conductive bolts 64 and 65 in step d) are drilled through holes at predetermined positions in a countersink manner. Copper is then plated on the wall of the through hole and its outer layer surface by electroplating, and step (f) when the circuit layer is covered with solder resist paint, and the conductive plug 64 and the thermal plug 65 are plugged at the same time. In addition, the wiring pad 661 of the first circuit layer 66 and the solder ball pad 671 of the second circuit layer 67 are completed by nickel-gold plating. To sum up, the BGA substrate 60 of the present invention has the following advantages in terms of structure and manufacturing process compared with the conventional technology: (a) The substrate 60 of the present invention is provided with a rectangular opening groove 631 in the center of the insulating layer 63, and the wafer 30 is It is accommodated therein and bonded to the copper plate 62, and the conventional technology is bonded to the resin layer 203, so the present invention can obtain a thinner package component. (b) The present invention is to directly bond the wafer 30 to the copper plate 62 of the base plate 60. The cross-sectional area of the substrate 60 for conducting heat of the wafer 30 is much larger than the conventional technology, so the heat dissipation effect is better "(c) The substrate 60 of the present invention is directly laminated by using the existing composite substrate and the adhesive-backed copper foil in the manufacturing process, so the manufacturing rate of the substrate 60 is greatly increased. Of course, the above is only one of the preferred embodiments of the BGA substrate structure and manufacturing process of the present invention, and does not limit the implementation scope of the present invention with α. Any paper size is applicable to the Chinese National Standard (CNS) A4. (2) > < 297 mm) ---------- ^ ------ ΐτ ------ ^ (锖 First read 5 notes on the back side 背面 ik write this page) 411739 a? B7 V. Description of the invention (q) Modifications made by those skilled in the art without departing from the spirit of the invention shall all fall within the scope of the invention. Therefore, the scope of protection of the invention shall be based on the scope of patent application described below. . ---------- ^ ----.— 'U ------ ^ (please read the notes on the back first and write this page) Staff Cooperatives of Central Standards Bureau, Ministry of Economic Affairs The printed paper size is applicable to China National Standards (CNS) A4 standard (2 〖QX297mm）