TW376555B - A power source device for a sputtering apparatus - Google Patents
A power source device for a sputtering apparatusInfo
- Publication number
- TW376555B TW376555B TW087102433A TW87102433A TW376555B TW 376555 B TW376555 B TW 376555B TW 087102433 A TW087102433 A TW 087102433A TW 87102433 A TW87102433 A TW 87102433A TW 376555 B TW376555 B TW 376555B
- Authority
- TW
- Taiwan
- Prior art keywords
- electric arc
- reverse voltage
- arc discharge
- externally
- added externally
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Disintegrating Or Milling (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Dc-Dc Converters (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3624897 | 1997-02-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW376555B true TW376555B (en) | 1999-12-11 |
Family
ID=12464484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087102433A TW376555B (en) | 1997-02-20 | 1998-02-20 | A power source device for a sputtering apparatus |
Country Status (8)
Country | Link |
---|---|
US (1) | US6416638B1 (zh) |
EP (1) | EP1013792B1 (zh) |
KR (1) | KR100314883B1 (zh) |
CN (1) | CN1203208C (zh) |
AT (1) | ATE468420T1 (zh) |
DE (1) | DE69841671D1 (zh) |
TW (1) | TW376555B (zh) |
WO (1) | WO1998037257A1 (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19937859C2 (de) * | 1999-08-13 | 2003-06-18 | Huettinger Elektronik Gmbh | Elektrische Versorgungseinheit für Plasmaanlagen |
JP4272522B2 (ja) * | 2001-09-28 | 2009-06-03 | 芝浦メカトロニクス株式会社 | スパッタリング用電源装置 |
WO2003103348A1 (ja) * | 2002-05-31 | 2003-12-11 | 芝浦メカトロニクス株式会社 | 放電用電源、スパッタリング用電源及びスパッタリング装置 |
US6967305B2 (en) * | 2003-08-18 | 2005-11-22 | Mks Instruments, Inc. | Control of plasma transitions in sputter processing systems |
DE102004015090A1 (de) | 2004-03-25 | 2005-11-03 | Hüttinger Elektronik Gmbh + Co. Kg | Bogenentladungserkennungseinrichtung |
US7305311B2 (en) * | 2005-04-22 | 2007-12-04 | Advanced Energy Industries, Inc. | Arc detection and handling in radio frequency power applications |
US20060283702A1 (en) * | 2005-06-21 | 2006-12-21 | Applied Materials, Inc. | Random pulsed DC power supply |
US20070048451A1 (en) * | 2005-08-26 | 2007-03-01 | Applied Materials, Inc. | Substrate movement and process chamber scheduling |
US7432184B2 (en) * | 2005-08-26 | 2008-10-07 | Applied Materials, Inc. | Integrated PVD system using designated PVD chambers |
ES2321309T3 (es) * | 2005-12-22 | 2009-06-04 | Huttinger Elektronik Gmbh + Co. Kg | Procedimiento y dispositivo para deteccion de un arco. |
ATE448562T1 (de) * | 2006-11-23 | 2009-11-15 | Huettinger Elektronik Gmbh | Verfahren zum erkennen einer bogenentladung in einem plasmaprozess und bogenentladungserkennungsvorrichtung |
US7795817B2 (en) * | 2006-11-24 | 2010-09-14 | Huettinger Elektronik Gmbh + Co. Kg | Controlled plasma power supply |
EP1928009B1 (de) * | 2006-11-28 | 2013-04-10 | HÜTTINGER Elektronik GmbH + Co. KG | Bogenentladungs-Erkennungseinrichtung, Plasma-Leistungsversorgung und Verfahren zum Erkennen von Bogenentladungen |
DE502006009308D1 (de) * | 2006-12-14 | 2011-05-26 | Huettinger Elektronik Gmbh | Bogenentladungs-Erkennungseinrichtung, Plasma-Leistungsversorgung und Verfahren zum Erkennen von Bogenentladungen |
US8217299B2 (en) * | 2007-02-22 | 2012-07-10 | Advanced Energy Industries, Inc. | Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch |
DE102007011230A1 (de) * | 2007-03-06 | 2008-09-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Magnetronplasmaanlage |
EP1978542B1 (de) | 2007-03-08 | 2010-12-29 | HÜTTINGER Elektronik GmbH + Co. KG | Verfahren und Vorrichtung zum Unterdrücken von Bogenentladungen beim Betreiben eines Plasmaprozesses |
EP1995818A1 (en) | 2007-05-12 | 2008-11-26 | Huettinger Electronic Sp. z o. o | Circuit and method for reducing electrical energy stored in a lead inductance for fast extinction of plasma arcs |
ATE547804T1 (de) * | 2007-12-24 | 2012-03-15 | Huettinger Electronic Sp Z O O | Stromänderungsbegrenzungsvorrichtung |
US9613784B2 (en) * | 2008-07-17 | 2017-04-04 | Mks Instruments, Inc. | Sputtering system and method including an arc detection |
US8044594B2 (en) * | 2008-07-31 | 2011-10-25 | Advanced Energy Industries, Inc. | Power supply ignition system and method |
US20110236591A1 (en) * | 2008-11-28 | 2011-09-29 | General Plasma Inc. | Bipolar rectifier power supply |
US8395078B2 (en) | 2008-12-05 | 2013-03-12 | Advanced Energy Industries, Inc | Arc recovery with over-voltage protection for plasma-chamber power supplies |
EP2219205B1 (en) * | 2009-02-17 | 2014-06-04 | Solvix GmbH | A power supply device for plasma processing |
DE102010031568B4 (de) | 2010-07-20 | 2014-12-11 | TRUMPF Hüttinger GmbH + Co. KG | Arclöschanordnung und Verfahren zum Löschen von Arcs |
CN103069928B (zh) * | 2010-08-18 | 2015-03-25 | 株式会社爱发科 | 直流电源装置 |
US8552665B2 (en) | 2010-08-20 | 2013-10-08 | Advanced Energy Industries, Inc. | Proactive arc management of a plasma load |
US20160215386A1 (en) * | 2013-09-09 | 2016-07-28 | Itn Energy Systems, Inc. | Modulation of reverse voltage limited waveforms in sputtering deposition chambers |
US10483089B2 (en) | 2014-02-28 | 2019-11-19 | Eagle Harbor Technologies, Inc. | High voltage resistive output stage circuit |
CN109792146B (zh) * | 2016-09-30 | 2019-11-26 | 株式会社爱发科 | 电源装置 |
US11302518B2 (en) | 2018-07-27 | 2022-04-12 | Eagle Harbor Technologies, Inc. | Efficient energy recovery in a nanosecond pulser circuit |
JP7320608B2 (ja) * | 2019-01-08 | 2023-08-03 | イーグル ハーバー テクノロジーズ,インク. | ナノ秒パルサー回路での効率的なエネルギー回収 |
US20230130106A1 (en) * | 2021-10-27 | 2023-04-27 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4201645A (en) * | 1978-06-26 | 1980-05-06 | Robert J. Ferran | Closed-loop sputtering system and method of operating same |
JPH02194831A (ja) | 1989-01-23 | 1990-08-01 | Ishikawajima Harima Heavy Ind Co Ltd | 直流放電用電源 |
US5241152A (en) * | 1990-03-23 | 1993-08-31 | Anderson Glen L | Circuit for detecting and diverting an electrical arc in a glow discharge apparatus |
DE9109503U1 (de) * | 1991-07-31 | 1991-10-17 | Magtron Magneto Elektronische Geraete Gmbh, 7583 Ottersweier | Schaltungsanordnung für ein Stromversorgungsgerät für Geräte und Anlagen der Plasma- und Oberflächentechnik |
DE4202425C2 (de) * | 1992-01-29 | 1997-07-17 | Leybold Ag | Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
JPH05311418A (ja) | 1992-05-12 | 1993-11-22 | Shibaura Eng Works Co Ltd | アーク放電防止回路 |
US5718813A (en) | 1992-12-30 | 1998-02-17 | Advanced Energy Industries, Inc. | Enhanced reactive DC sputtering system |
US5427669A (en) * | 1992-12-30 | 1995-06-27 | Advanced Energy Industries, Inc. | Thin film DC plasma processing system |
SG46607A1 (en) * | 1993-07-28 | 1998-02-20 | Asahi Glass Co Ltd | Method of an apparatus for sputtering |
JP3191135B2 (ja) | 1994-02-23 | 2001-07-23 | 日本電子工業株式会社 | 直流グロー放電処理装置におけるアーク遮断方法及び装置 |
US5651865A (en) | 1994-06-17 | 1997-07-29 | Eni | Preferential sputtering of insulators from conductive targets |
US5584972A (en) * | 1995-02-01 | 1996-12-17 | Sony Corporation | Plasma noise and arcing suppressor apparatus and method for sputter deposition |
US5576939A (en) | 1995-05-05 | 1996-11-19 | Drummond; Geoffrey N. | Enhanced thin film DC plasma power supply |
US5584974A (en) | 1995-10-20 | 1996-12-17 | Eni | Arc control and switching element protection for pulsed dc cathode sputtering power supply |
US5682067A (en) * | 1996-06-21 | 1997-10-28 | Sierra Applied Sciences, Inc. | Circuit for reversing polarity on electrodes |
JP2835323B2 (ja) | 1997-02-20 | 1998-12-14 | 芝浦メカトロニクス株式会社 | スパッタリング装置用電源装置 |
-
1998
- 1998-02-19 WO PCT/JP1998/000693 patent/WO1998037257A1/ja active IP Right Grant
- 1998-02-19 CN CNB988027194A patent/CN1203208C/zh not_active Expired - Lifetime
- 1998-02-19 US US09/355,492 patent/US6416638B1/en not_active Expired - Lifetime
- 1998-02-19 AT AT98904391T patent/ATE468420T1/de active
- 1998-02-19 EP EP98904391A patent/EP1013792B1/en not_active Expired - Lifetime
- 1998-02-19 DE DE69841671T patent/DE69841671D1/de not_active Expired - Lifetime
- 1998-02-20 TW TW087102433A patent/TW376555B/zh not_active IP Right Cessation
-
1999
- 1999-08-17 KR KR1019997007437A patent/KR100314883B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE468420T1 (de) | 2010-06-15 |
EP1013792B1 (en) | 2010-05-19 |
KR20000071147A (ko) | 2000-11-25 |
CN1203208C (zh) | 2005-05-25 |
WO1998037257A1 (fr) | 1998-08-27 |
EP1013792A1 (en) | 2000-06-28 |
US6416638B1 (en) | 2002-07-09 |
DE69841671D1 (de) | 2010-07-01 |
KR100314883B1 (ko) | 2001-11-23 |
EP1013792A4 (en) | 2006-02-15 |
CN1248299A (zh) | 2000-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |