TW270216B - - Google Patents
Info
- Publication number
- TW270216B TW270216B TW084101427A TW84101427A TW270216B TW 270216 B TW270216 B TW 270216B TW 084101427 A TW084101427 A TW 084101427A TW 84101427 A TW84101427 A TW 84101427A TW 270216 B TW270216 B TW 270216B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/126,807 US4316757A (en) | 1980-03-03 | 1980-03-03 | Method and apparatus for wax mounting of thin wafers for polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW270216B true TW270216B (zh) | 1996-02-11 |
Family
ID=22426787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084101427A TW270216B (zh) | 1980-03-03 | 1995-02-16 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4316757A (zh) |
| JP (1) | JPS571656A (zh) |
| KR (1) | KR850001056B1 (zh) |
| DE (1) | DE3107995A1 (zh) |
| GB (1) | GB2079532B (zh) |
| IT (1) | IT1194026B (zh) |
| TW (1) | TW270216B (zh) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4463927A (en) * | 1983-02-24 | 1984-08-07 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for sectioning demountable semiconductor samples |
| NL8702493A (nl) * | 1986-10-31 | 1988-05-16 | Seiko Epson Corp | Optisch opnamemedium en werkwijze voor het vervaardigen daarvan. |
| US4818323A (en) * | 1987-06-26 | 1989-04-04 | Motorola Inc. | Method of making a void free wafer via vacuum lamination |
| JPH07264B2 (ja) * | 1987-08-10 | 1995-01-11 | 住友電気工業株式会社 | 半導体ウエハの貼付方法および装置 |
| US5078820A (en) * | 1988-03-25 | 1992-01-07 | Somar Corporation | Method and apparatus for pressure sticking a thin film to a base plate |
| US5160560A (en) * | 1988-06-02 | 1992-11-03 | Hughes Aircraft Company | Method of producing optically flat surfaces on processed silicon wafers |
| US5217563A (en) * | 1988-12-01 | 1993-06-08 | Bayer Aktiengesellschaft | Apparatus for producing a deep-drawn formed plastic piece |
| JP2648638B2 (ja) * | 1990-11-30 | 1997-09-03 | 三菱マテリアル株式会社 | ウェーハの接着方法およびその装置 |
| US5205082A (en) * | 1991-12-20 | 1993-04-27 | Cybeq Systems, Inc. | Wafer polisher head having floating retainer ring |
| US5273615A (en) * | 1992-04-06 | 1993-12-28 | Motorola, Inc. | Apparatus and method for handling fragile semiconductor wafers |
| US5256599A (en) * | 1992-06-01 | 1993-10-26 | Motorola, Inc. | Semiconductor wafer wax mounting and thinning process |
| US5476566A (en) * | 1992-09-02 | 1995-12-19 | Motorola, Inc. | Method for thinning a semiconductor wafer |
| JPH06131705A (ja) * | 1992-10-16 | 1994-05-13 | Hitachi Ltd | 光ディスク貼り合わせ装置 |
| JPH0737768A (ja) * | 1992-11-26 | 1995-02-07 | Sumitomo Electric Ind Ltd | 半導体ウェハの補強方法及び補強された半導体ウェハ |
| US5300175A (en) * | 1993-01-04 | 1994-04-05 | Motorola, Inc. | Method for mounting a wafer to a submount |
| US5534053A (en) * | 1993-01-12 | 1996-07-09 | Rodel, Inc. | Composition for reducing or eliminating static charge in adhesive film |
| US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
| US5556493A (en) * | 1995-01-13 | 1996-09-17 | Libbey-Owens-Ford Co. | Mounting an optical moisture sensor on a windshield using a vacuum chamber device |
| US5605487A (en) * | 1994-05-13 | 1997-02-25 | Memc Electric Materials, Inc. | Semiconductor wafer polishing appartus and method |
| JP3055401B2 (ja) * | 1994-08-29 | 2000-06-26 | 信越半導体株式会社 | ワークの平面研削方法及び装置 |
| DE19616073A1 (de) * | 1996-04-23 | 1997-10-30 | Teves Gmbh Alfred | Vorrichtung zum blasenfreien Fixieren von zu klebenden Komponenten |
| US5972780A (en) * | 1996-08-22 | 1999-10-26 | Nippon Telegraph Telephone Corporation | Thin film forming apparatus and method |
| US5716258A (en) * | 1996-11-26 | 1998-02-10 | Metcalf; Robert L. | Semiconductor wafer polishing machine and method |
| US6244946B1 (en) | 1997-04-08 | 2001-06-12 | Lam Research Corporation | Polishing head with removable subcarrier |
| US6425812B1 (en) | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
| US5975998A (en) * | 1997-09-26 | 1999-11-02 | Memc Electronic Materials , Inc. | Wafer processing apparatus |
| US6336845B1 (en) | 1997-11-12 | 2002-01-08 | Lam Research Corporation | Method and apparatus for polishing semiconductor wafers |
| US5948699A (en) * | 1997-11-21 | 1999-09-07 | Sibond, L.L.C. | Wafer backing insert for free mount semiconductor polishing apparatus and process |
| DE19816150A1 (de) * | 1998-04-09 | 1999-10-21 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zur Herstellung einer partikelfreien Klebeverbindung |
| US6222145B1 (en) * | 1998-10-29 | 2001-04-24 | International Business Machines Corporation | Mechanical strength die sorting |
| JP3537688B2 (ja) * | 1998-11-24 | 2004-06-14 | 富士通株式会社 | 磁気ヘッドの加工方法 |
| US6231428B1 (en) | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| US6431959B1 (en) | 1999-12-20 | 2002-08-13 | Lam Research Corporation | System and method of defect optimization for chemical mechanical planarization of polysilicon |
| US6479386B1 (en) * | 2000-02-16 | 2002-11-12 | Memc Electronic Materials, Inc. | Process for reducing surface variations for polished wafer |
| US6666756B1 (en) | 2000-03-31 | 2003-12-23 | Lam Research Corporation | Wafer carrier head assembly |
| DE10048881A1 (de) * | 2000-09-29 | 2002-03-07 | Infineon Technologies Ag | Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers |
| DE10054159A1 (de) * | 2000-11-02 | 2002-05-16 | Wacker Siltronic Halbleitermat | Verfahren zur Montage von Halbleiterscheiben |
| JP3883929B2 (ja) * | 2001-09-25 | 2007-02-21 | 大日本スクリーン製造株式会社 | 薄膜形成装置および薄膜形成方法 |
| FR2831148B1 (fr) | 2001-10-22 | 2004-01-02 | Gemplus Card Int | Procede et dispositif de manipulation d'un wafer |
| JP4565804B2 (ja) * | 2002-06-03 | 2010-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
| DE10242402A1 (de) * | 2002-09-12 | 2004-04-01 | Süss MicroTec Laboratory Equipment GmbH | Vorrichtung und Verfahren für das Verbinden von Objekten |
| JP2005150235A (ja) * | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | 半導体表面保護シート及び方法 |
| DE102005051346B4 (de) * | 2005-10-25 | 2011-02-10 | Thallner, Erich, Dipl.-Ing. | Träger für einen Wafer, Kombination aus einem Träger und einem Wafer sowie Verfahren zur Handhabung des Trägers |
| US20080029977A1 (en) * | 2006-08-03 | 2008-02-07 | Prime View International Co., Ltd. | Chuck for a photoresist spin coater |
| DE102007042694A1 (de) * | 2007-09-07 | 2009-03-12 | Magna Electronics Europe Gmbh & Co.Kg | Sensormodul |
| JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
| DE102009052744B4 (de) * | 2009-11-11 | 2013-08-29 | Siltronic Ag | Verfahren zur Politur einer Halbleiterscheibe |
| JP5545640B2 (ja) * | 2010-05-11 | 2014-07-09 | 株式会社ディスコ | 研削方法 |
| CN104332432B (zh) * | 2014-10-15 | 2017-09-01 | 江西德义半导体科技有限公司 | 一种贴蜡装置及其加工方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1577469A1 (de) | 1966-05-24 | 1970-05-06 | Siemens Ag | Verfahren zum Herstellen von Halbleiterscheiben gleichmaessiger Dicke durch mechanische Oberflaechenbearbeitung |
| US3475867A (en) * | 1966-12-20 | 1969-11-04 | Monsanto Co | Processing of semiconductor wafers |
| DE1652170B2 (de) * | 1967-03-03 | 1975-05-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum gleichzeitigen stirnseitigen Abarbeiten gleichdicker Werkstoffschichten an mehreren unterschiedlich dicken Halbleiterscheiben |
| US3492763A (en) * | 1967-09-18 | 1970-02-03 | Monsanto Co | Method and apparatus for mounting semiconductor slices |
| US3681171A (en) * | 1968-08-23 | 1972-08-01 | Hitachi Ltd | Apparatus for producing a multilayer printed circuit plate assembly |
| US3970494A (en) * | 1975-04-18 | 1976-07-20 | Western Electric Co., Inc. | Method for adhering one surface to another |
| US4067764A (en) * | 1977-03-15 | 1978-01-10 | Sierracin Corporation | Method of manufacture of solar cell panel |
| DE2712521A1 (de) * | 1977-03-22 | 1978-09-28 | Wacker Chemitronic | Verfahren zum aufkitten von scheiben |
| JPS6035250B2 (ja) * | 1978-06-19 | 1985-08-13 | 松下電器産業株式会社 | 可撓性フイルムの接着方法 |
-
1980
- 1980-03-03 US US06/126,807 patent/US4316757A/en not_active Expired - Lifetime
-
1981
- 1981-03-02 JP JP2850981A patent/JPS571656A/ja active Pending
- 1981-03-02 IT IT20086/81A patent/IT1194026B/it active
- 1981-03-02 GB GB8106524A patent/GB2079532B/en not_active Expired
- 1981-03-03 DE DE19813107995 patent/DE3107995A1/de not_active Ceased
- 1981-03-04 KR KR1019810000701A patent/KR850001056B1/ko active
-
1995
- 1995-02-16 TW TW084101427A patent/TW270216B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| GB2079532A (en) | 1982-01-20 |
| KR830005721A (ko) | 1983-09-09 |
| KR850001056B1 (ko) | 1985-07-25 |
| IT1194026B (it) | 1988-08-31 |
| IT8120086A0 (it) | 1981-03-02 |
| GB2079532B (en) | 1984-02-22 |
| JPS571656A (en) | 1982-01-06 |
| US4316757A (en) | 1982-02-23 |
| DE3107995A1 (de) | 1982-01-28 |