TW222313B - Electroplating method - Google Patents
Electroplating methodInfo
- Publication number
- TW222313B TW222313B TW082107277A TW82107277A TW222313B TW 222313 B TW222313 B TW 222313B TW 082107277 A TW082107277 A TW 082107277A TW 82107277 A TW82107277 A TW 82107277A TW 222313 B TW222313 B TW 222313B
- Authority
- TW
- Taiwan
- Prior art keywords
- electroplating method
- layer
- electroplating
- ofnonconductor
- graphiteparticle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3240393 | 1993-01-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW222313B true TW222313B (en) | 1994-04-11 |
Family
ID=12357996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082107277A TW222313B (en) | 1993-01-29 | 1993-09-06 | Electroplating method |
Country Status (5)
Country | Link |
---|---|
CN (1) | CN1093892C (zh) |
DE (1) | DE4402413C2 (zh) |
GB (1) | GB2274853B (zh) |
SG (1) | SG52489A1 (zh) |
TW (1) | TW222313B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07268682A (ja) * | 1994-03-28 | 1995-10-17 | Mec Kk | 非導電体表面に電気メッキする方法 |
JP3481379B2 (ja) * | 1995-08-23 | 2003-12-22 | メック株式会社 | 電気めっき法 |
GB2338715B (en) * | 1998-06-24 | 2003-03-19 | Hang Fung Jewellery Co Ltd | A method of depositing a metal on an article |
US6375731B1 (en) * | 2000-01-06 | 2002-04-23 | Electrochemicals Inc. | Conditioning of through holes and glass |
CN105231604A (zh) * | 2014-05-27 | 2016-01-13 | 中色金银贸易中心有限公司 | 一种金质饰品 |
CN114351197B (zh) * | 2021-11-30 | 2023-04-28 | 武汉格智新材料有限公司 | 石墨暗影金属化助剂及其制备方法和应用 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB476042A (en) * | 1936-03-27 | 1937-11-29 | Albert Henry Stuart | Improvements in and relating to coating compositions and the coating of surfaces |
US3163588A (en) * | 1955-02-14 | 1964-12-29 | Technograph Printed Electronic | Method of interconnecting pathway patterns of printed circuit products |
US3099608A (en) * | 1959-12-30 | 1963-07-30 | Ibm | Method of electroplating on a dielectric base |
US4581301A (en) * | 1984-04-10 | 1986-04-08 | Michaelson Henry W | Additive adhesive based process for the manufacture of printed circuit boards |
US4619741A (en) * | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
US4964959A (en) * | 1990-04-12 | 1990-10-23 | Olin Hunt Specialty Products Inc. | Process for preparing a nonconductive substrate for electroplating |
WO1992019092A1 (de) * | 1991-04-22 | 1992-10-29 | Atotech Deutschland Gmbh | Verfahren zur selektiven beschichtung von nichtleitern mit kohlenstoff-partikeln und die verwendung von kupferhaltigen lösungen im verfahren |
US5139642A (en) * | 1991-05-01 | 1992-08-18 | Olin Corporation | Process for preparing a nonconductive substrate for electroplating |
JP3118103B2 (ja) * | 1992-12-21 | 2000-12-18 | 矢崎総業株式会社 | 電気回路用導電部材、電気回路体及びその製造方法 |
US5476580A (en) * | 1993-05-17 | 1995-12-19 | Electrochemicals Inc. | Processes for preparing a non-conductive substrate for electroplating |
-
1993
- 1993-09-06 TW TW082107277A patent/TW222313B/zh active
-
1994
- 1994-01-21 SG SG1996005161A patent/SG52489A1/en unknown
- 1994-01-21 GB GB9401134A patent/GB2274853B/en not_active Expired - Fee Related
- 1994-01-24 CN CN94100873A patent/CN1093892C/zh not_active Expired - Fee Related
- 1994-01-27 DE DE4402413A patent/DE4402413C2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1093892C (zh) | 2002-11-06 |
GB2274853A (en) | 1994-08-10 |
DE4402413C2 (de) | 1998-08-06 |
SG52489A1 (en) | 1998-09-28 |
DE4402413A1 (de) | 1994-08-04 |
CN1092118A (zh) | 1994-09-14 |
GB9401134D0 (en) | 1994-03-16 |
GB2274853B (en) | 1996-05-15 |
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