GB2274853B - Process for electroplating a through-hole inner wall of a printed wiring board - Google Patents

Process for electroplating a through-hole inner wall of a printed wiring board

Info

Publication number
GB2274853B
GB2274853B GB9401134A GB9401134A GB2274853B GB 2274853 B GB2274853 B GB 2274853B GB 9401134 A GB9401134 A GB 9401134A GB 9401134 A GB9401134 A GB 9401134A GB 2274853 B GB2274853 B GB 2274853B
Authority
GB
United Kingdom
Prior art keywords
electroplating
wall
wiring board
printed wiring
hole inner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9401134A
Other versions
GB2274853A (en
GB9401134D0 (en
Inventor
Yoshihiro Sakamoto
Sachiko Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC Co Ltd
Original Assignee
MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC Co Ltd filed Critical MEC Co Ltd
Publication of GB9401134D0 publication Critical patent/GB9401134D0/en
Publication of GB2274853A publication Critical patent/GB2274853A/en
Application granted granted Critical
Publication of GB2274853B publication Critical patent/GB2274853B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
GB9401134A 1993-01-29 1994-01-21 Process for electroplating a through-hole inner wall of a printed wiring board Expired - Fee Related GB2274853B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3240393 1993-01-29

Publications (3)

Publication Number Publication Date
GB9401134D0 GB9401134D0 (en) 1994-03-16
GB2274853A GB2274853A (en) 1994-08-10
GB2274853B true GB2274853B (en) 1996-05-15

Family

ID=12357996

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9401134A Expired - Fee Related GB2274853B (en) 1993-01-29 1994-01-21 Process for electroplating a through-hole inner wall of a printed wiring board

Country Status (5)

Country Link
CN (1) CN1093892C (en)
DE (1) DE4402413C2 (en)
GB (1) GB2274853B (en)
SG (1) SG52489A1 (en)
TW (1) TW222313B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07268682A (en) * 1994-03-28 1995-10-17 Mec Kk Method for electroplating surface of electric nonconductor
JP3481379B2 (en) * 1995-08-23 2003-12-22 メック株式会社 Electroplating method
GB2338715B (en) * 1998-06-24 2003-03-19 Hang Fung Jewellery Co Ltd A method of depositing a metal on an article
US6375731B1 (en) * 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass
CN105231604A (en) * 2014-05-27 2016-01-13 中色金银贸易中心有限公司 Gold jewelry
CN114351197B (en) * 2021-11-30 2023-04-28 武汉格智新材料有限公司 Graphite shadow metallization auxiliary agent and preparation method and application thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB476042A (en) * 1936-03-27 1937-11-29 Albert Henry Stuart Improvements in and relating to coating compositions and the coating of surfaces
US3163588A (en) * 1955-02-14 1964-12-29 Technograph Printed Electronic Method of interconnecting pathway patterns of printed circuit products
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
EP0200398A2 (en) * 1985-04-11 1986-11-05 Olin Hunt Sub Iii Corp. Process for preparing a non-conductive substrate for electroplating
GB2273940A (en) * 1992-12-21 1994-07-06 Yazaki Corp Moulded carbon fibre-plastics body plated with metal to form electrical conductor e.g. PCB
WO1994026958A1 (en) * 1993-05-17 1994-11-24 Electrochemicals, Inc. Carbon compositions and processes for preparing a non-conductive substrate for electroplating

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US4964959A (en) * 1990-04-12 1990-10-23 Olin Hunt Specialty Products Inc. Process for preparing a nonconductive substrate for electroplating
WO1992019092A1 (en) * 1991-04-22 1992-10-29 Atotech Deutschland Gmbh Method for selectively coating non-conductors with carbon particles and use of copper containing solutions therein
US5139642A (en) * 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB476042A (en) * 1936-03-27 1937-11-29 Albert Henry Stuart Improvements in and relating to coating compositions and the coating of surfaces
US3163588A (en) * 1955-02-14 1964-12-29 Technograph Printed Electronic Method of interconnecting pathway patterns of printed circuit products
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
EP0200398A2 (en) * 1985-04-11 1986-11-05 Olin Hunt Sub Iii Corp. Process for preparing a non-conductive substrate for electroplating
GB2273940A (en) * 1992-12-21 1994-07-06 Yazaki Corp Moulded carbon fibre-plastics body plated with metal to form electrical conductor e.g. PCB
WO1994026958A1 (en) * 1993-05-17 1994-11-24 Electrochemicals, Inc. Carbon compositions and processes for preparing a non-conductive substrate for electroplating

Also Published As

Publication number Publication date
CN1093892C (en) 2002-11-06
GB2274853A (en) 1994-08-10
DE4402413C2 (en) 1998-08-06
SG52489A1 (en) 1998-09-28
TW222313B (en) 1994-04-11
DE4402413A1 (en) 1994-08-04
CN1092118A (en) 1994-09-14
GB9401134D0 (en) 1994-03-16

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040121