TW221518B - - Google Patents
Info
- Publication number
- TW221518B TW221518B TW081107830A TW81107830A TW221518B TW 221518 B TW221518 B TW 221518B TW 081107830 A TW081107830 A TW 081107830A TW 81107830 A TW81107830 A TW 81107830A TW 221518 B TW221518 B TW 221518B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3254637A JPH0567652A (ja) | 1991-09-05 | 1991-09-05 | プローブ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW221518B true TW221518B (zh) | 1994-03-01 |
Family
ID=17267789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW081107830A TW221518B (zh) | 1991-09-05 | 1992-10-01 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5374888A (zh) |
JP (1) | JPH0567652A (zh) |
KR (1) | KR100187559B1 (zh) |
TW (1) | TW221518B (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100291110B1 (ko) * | 1993-06-19 | 2001-06-01 | 히가시 데쓰로 | 프로우브장치 및 그것을 사용한 피검사체의 검사방법 |
US5561386A (en) * | 1994-02-23 | 1996-10-01 | Fujitsu Limited | Chip tester with improvements in handling efficiency and measurement precision |
DE69529501T2 (de) * | 1994-04-18 | 2003-12-11 | Micron Technology, Inc. | Verfahren und vorrichtung zum automatischen positionieren elektronischer würfel in bauteilverpackungen |
US5498970A (en) * | 1995-02-06 | 1996-03-12 | Minnesota Mining And Manufacturing | Top load socket for ball grid array devices |
US5686843A (en) * | 1995-06-30 | 1997-11-11 | International Business Machines Corporation | Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module |
US5667622A (en) * | 1995-08-25 | 1997-09-16 | Siemens Aktiengesellschaft | In-situ wafer temperature control apparatus for single wafer tools |
TW371347B (en) * | 1995-12-27 | 1999-10-01 | Advantest Corp | Structure of rotary arm and device chuck part of a device handler |
JPH09321102A (ja) * | 1996-05-31 | 1997-12-12 | Tokyo Electron Ltd | 検査装置 |
JPH10163280A (ja) * | 1996-12-02 | 1998-06-19 | Tokyo Electron Ltd | 検査方法及び検査装置 |
US5982166A (en) * | 1997-01-27 | 1999-11-09 | Motorola, Inc. | Method for measuring a characteristic of a semiconductor wafer using cylindrical control |
US6008636A (en) * | 1997-09-30 | 1999-12-28 | Motorola, Inc. | Test system with robot arm for delivering a device under test |
US5982132A (en) * | 1997-10-09 | 1999-11-09 | Electroglas, Inc. | Rotary wafer positioning system and method |
US6001662A (en) * | 1997-12-02 | 1999-12-14 | International Business Machines Corporation | Method and system for providing a reusable configurable self-test controller for manufactured integrated circuits |
US6236902B1 (en) * | 1998-02-24 | 2001-05-22 | Data I/O Corporation | Apparatus and method for retaining a device for processing |
JPH11274252A (ja) * | 1998-03-19 | 1999-10-08 | Mitsubishi Electric Corp | 半導体装置の検査装置及びその検査方法 |
US6246251B1 (en) * | 1998-04-24 | 2001-06-12 | International Rectifier Corp. | Test process and apparatus for testing singulated semiconductor die |
JP2000162275A (ja) * | 1998-12-01 | 2000-06-16 | Fujitsu Ltd | 半導体試験方法及び半導体試験装置 |
JP2002531845A (ja) * | 1998-12-02 | 2002-09-24 | シュランバーガー テクノロジーズ インク. | Icデバイスを反転させる装置および方法 |
US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
JP4495726B2 (ja) * | 2004-06-08 | 2010-07-07 | 株式会社アドバンテスト | イメージセンサ用試験装置 |
ITUD20070239A1 (it) * | 2007-12-18 | 2009-06-19 | Baccini S P A | Dispositivo di collaudo per collaudare piastre per circuiti elettronici e relativo procedimento |
JP4829262B2 (ja) * | 2008-02-20 | 2011-12-07 | アキム株式会社 | 搬送装置 |
KR100979721B1 (ko) * | 2008-12-04 | 2010-09-03 | (주)에이피텍 | 반도체 다이의 검사 및 분류 일체화장치 |
TWI451100B (zh) * | 2009-02-20 | 2014-09-01 | King Yuan Electronics Co Ltd | 翻轉測試模組及其測試系統 |
JP5353818B2 (ja) | 2010-05-26 | 2013-11-27 | コベルコ建機株式会社 | 作業機械 |
US8836354B2 (en) * | 2010-10-21 | 2014-09-16 | Acculogic Corporation | Apparatus for thermal testing of a printed circuit board |
JP5708369B2 (ja) | 2011-08-24 | 2015-04-30 | コベルコ建機株式会社 | 作業機械 |
FR2987695A1 (fr) * | 2012-07-03 | 2013-09-06 | Commissariat Energie Atomique | Dispositif et procede de support individuel de composants |
FR2993096B1 (fr) | 2012-07-03 | 2015-03-27 | Commissariat Energie Atomique | Dispositif et procede de support individuel de composants |
KR101586391B1 (ko) * | 2014-02-25 | 2016-01-18 | 한국영상기술(주) | 시료 이물 검사 및 재배치 장치 |
US9846193B2 (en) * | 2014-05-14 | 2017-12-19 | Asm Technology Singapore Pte Ltd | Semiconductor package testing apparatus |
EP3314272B1 (en) * | 2015-06-24 | 2022-10-05 | Indikel As | Kelvin probe system with a rotating probe face |
JP6596374B2 (ja) * | 2016-03-28 | 2019-10-23 | 東京エレクトロン株式会社 | 基板検査装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4295776A (en) * | 1978-09-25 | 1981-10-20 | Alan Payne | Portable inverter for transferring bulk goods between pallets |
US4571542A (en) * | 1982-06-30 | 1986-02-18 | Japan Synthetic Rubber Co., Ltd. | Method and unit for inspecting printed wiring boards |
US4654955A (en) * | 1982-09-07 | 1987-04-07 | The Valeron Corporation | Tool changer mechanism for machining centers |
-
1991
- 1991-09-05 JP JP3254637A patent/JPH0567652A/ja active Pending
-
1992
- 1992-09-02 US US07/937,790 patent/US5374888A/en not_active Expired - Fee Related
- 1992-09-05 KR KR1019920016222A patent/KR100187559B1/ko not_active IP Right Cessation
- 1992-10-01 TW TW081107830A patent/TW221518B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR100187559B1 (ko) | 1999-06-01 |
JPH0567652A (ja) | 1993-03-19 |
KR930006450A (ko) | 1993-04-21 |
US5374888A (en) | 1994-12-20 |